KR100402448B1 - Socket assembly - Google Patents

Abstract

PURPOSE: A socket assembly is provided to easily and freely attach and detach an electrical component without excessive application stress to the electrical component or a PCB(Printed Circuit Board). CONSTITUTION: A socket body(11) has a generally rectangular configuration. A plurality of flat plate-like contact pins(12) are arranged for forming rows in parallel with each other so as to form rows along four sides of the socket body(11), respectively. Each of the flat plate-like contact pins(12) has an arm which extends curved upward from a base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin. A connecting portion for connecting to a PCB(5) is formed on the other end of the base portion. Each slider is supported by base portions and arms of row-forming contact pins. Each slider moves between an open position for accommodating the IC and a pressing position for pressing the IC by an elastic force of the arms and compressing and contacting the terminals of the IC with the contact portions of the contact pins.

Description

Socket Assembly {SOCKET ASSEMBLY}

The present invention relates to an improved socket assembly for receiving electronic or electrical components such as integrated circuit chips or packages (ICs), or chip-on-board modules and the like, and for electrically connecting the electrical components to a printed circuit board. will be.

In general, electronic or electrical components such as integrated circuit chips or packages (ICs) or chip-on-boards and modules are connected by soldering terminals, such as leads or pads, arranged along the sides of the electrical components directly onto the printed circuit board. It is fixed. On the other hand, when mounting on a printed circuit board for testing so that the electrical parts can be easily replaced, or when installing an electrical component on the printed circuit board where the heat at the time of soldering may adversely affect the internal circuit, the electrical component is generally Accepting toploading sockets are used. As disclosed in Japanese Patent Laid-Open Nos. 64-3977 and 2-51882, the conventional representative top rod socket has a substantially rectangular support frame or socket body made of synthetic resin. This socket body has a plurality of contact pins arranged in parallel on each side thereof.

Each contact pin has an external connection for connecting to a conductor pattern on a printed circuit board and a contact for contacting a terminal of an electrical component. The socket body is further provided with a cover or cover for pressing the upper surface of the electrical component mounted on the contact portion of the contact pin and a fixing piece for fixing the cover to the socket body at a position where the cover presses the upper surface of the electrical component. Rows of contact pins are regulated by gaps or ribs arranged in rows parallel to the socket body. In addition, the contact portion of the contact pin penetrates through the base plate portion of the socket body provided on the printed circuit board.

In the above-described conventional socket, in order to give the required contact pressure to the contact part by the cover, the contact parts of all the terminals of the electrical component and all the contact pins on the socket body are pressed at the same time with a very high pressing force, so that the number of contact pins increases. The pressing force of the contact pin is required, which makes it difficult to attach and fix the cover. Therefore, it is difficult to cope with the higher density of terminals in electrical components such as ICs.

In addition, the electrical components are pressurized with a large force from above, which causes excessive stress on the electrical components and the socket body. In addition, if the strength of the socket body or the cover is insufficient, flexibility is caused to them, and as a result, the contact pressure of the contact pin becomes small, which causes a poor contact.

Particularly, in a high temperature environment, the synthetic resin of the socket body causes stress relaxation, thereby increasing flexibility.

In the conventional socket described above, since the contact portion of the terminal of the electrical component and the contact pin is electrically connected by the contact pressure, poor conduction is likely to occur due to the foreign matter or oxide film attached to the terminal or the contact portion. Therefore, when the terminal of an electrical component contacts the contact part of a contact pin, it is preferable to produce what is called a wiping effect, and to remove a foreign material, an oxide film, etc. However, in the above-described conventional socket, a wiping action is unlikely to occur between the electrical component and the contact pin because the electrical component positioned according to the socket body is pressed in its thickness direction due to the cover. Therefore, it is difficult to raise the reliability of the electrical connection between an electrical component and a contact pin.

The top, rod and socket disclosed in US Pat. No. 4,993,955 has a plurality of contact pins arranged in parallel along each side of the support frame or socket body and a cam disposed along each side of the socket body. . Each contact pin has a curved arm portion and a contact portion for contacting the upper surface of the terminal of the IC formed at the free end of the arm portion. In this socket, a contact pin can be operated by a cam for each row. However, since the contact portion of each contact pin is press-contacted to the upper surface of the terminal of the IC by the elasticity of the contact pin, the contact pressure between the contact portion of each contact pin and the terminal of the IC depends on the spring constant of the contact pin. In addition, since the contact pin presses the IC terminal from above, a wiping action is unlikely to occur between the contact portion of the contact pin and the terminal of the IC.

In the above-described conventional socket, partition walls or ribs for regulating the distance between the contact pins arranged in a row are arranged in a line and provided in the socket body. In this case, in order to make the pitch of a contact pin small, it is necessary to use a thin rib. However, when the rib is thinned, its strength is lowered and molding becomes difficult. Therefore, there is a limit in narrowing the pitch of the contact pin.

In the conventional socket described above, the socket body is disposed on the printed circuit board and is narrowed by a part of the contact pin and the printed circuit board. Therefore, the socket body is connected to the printed circuit board in the state where the contact pin is soldered to the printed circuit board. I can't remove it. The contact portion of the contact pin is located above the base plate portion of the socket body, and the electrical component is mounted on the contact portion of the contact pin. Therefore, there is a limit in suppressing the height of the electric component mounted on the printed circuit board through the socket.

The object of the present invention is not to apply excessive stress to an electrical component or a circuit board, and the electrical component can be easily detachably mounted, and furthermore, it is possible to prevent non-uniform electrical connection with the terminals of the electrical component. It is another object of the present invention to provide a socket assembly capable of making sure of electrical connection with a terminal of an electrical component. Another object of the present invention is to cope with narrowing of the terminal pitch of the electrical component. It is another object of the present invention to provide a lightweight and thin socket assembly.

1 shows a first embodiment of a socket assembly of the present invention, (a) is a longitudinal sectional view of a main portion of a socket before inserting an IC chip substrate as an electrical component, and (b) is a socket in which a slider is in a moving state (C) is a longitudinal sectional view of the main part of the socket in the inserted state.

2 is a schematic plan view of the socket body of the first embodiment.

3 (a) and 3 (b) are a side view and a sectional view of the slider of the first embodiment, respectively.

4 is an explanatory view of the operation of the insertion jig (JIG) used in the socket assembly of the first embodiment.

5 is an explanatory view of the operation of the removal jig for use in the socket assembly of the first embodiment.

6 is a diagram for explaining a method of inserting a slider of the first embodiment.

7 is a longitudinal cross-sectional view of a portion of a socket assembly representing a second embodiment of the present invention.

8 is a longitudinal cross-sectional view of a portion of a socket assembly representing a third embodiment of the present invention.

9 is a perspective view of an IC chip mounted on a socket assembly.

Fig. 10 shows a part of the socket assembly according to the fourth embodiment of the present invention, (a) is a longitudinal sectional view in which the IC chip is not mounted, and (b) is a longitudinal sectional view in the state where the IC chip is mounted.

11 is a schematic plan view showing the arrangement of the slider of the fourth embodiment;

12 is a schematic plan view of the socket body of the fourth embodiment.

13 is a plan view showing a state in which an IC chip is mounted in an IC socket according to a fifth embodiment of the present invention.

14 is an enlarged view illustrating main parts of the socket shown in FIG. 13;

Fig. 15 is a partial perspective view of the slider used for the IC socket of Fig. 13 viewed from below.

FIG. 16 shows a slider used for the IC socket of FIG. 13, (a) is a partial front view of the slider, (b) is a partial bottom view of the slider, (c) is a side view of the slider, and (d) is a Sectional view along the A-A line of the slider's dynamics (a).

17A and 17B are cross-sectional views for explaining the operation of the IC socket according to the fifth embodiment, respectively.

18 is a graph schematically showing a change in the spring force of the arm when the slider of the IC socket of the fifth embodiment is moved.

19 is a partial cross-sectional view of an IC socket showing a modification of the slider of the fifth embodiment.

20 is a partial cross-sectional view of an IC socket showing a modification of the attachment structure of the contact pin of the fifth embodiment.

FIG. 21 shows an IC socket according to a sixth embodiment of the present invention which enables the manufacture of an ultra high density IC socket, and (a) is a line B-B in FIG. 22 (a) parallel to the first and second contact pins. (B) is the longitudinal cross-sectional view along C-C of FIG. 22 (a) which contacted the surface of the 1st contact pin similarly, and the 2nd contact pin of the back side is abbreviate | omitted, (c) Is a longitudinal cross-sectional view along the D-D line in FIG. 22 (a) which contacted the surface of a 2nd contact pin similarly, and the 1st contact pin of the back side is abbreviate | omitted.

FIG. 22 is a rib arrangement diagram on the slider of the sixth embodiment, (a) is an explanatory diagram of the relationship between the first and second contact pins, (b) is a rib arrangement diagram on the upper surface, and (c) is a rib arrangement diagram on the lower surface.

23 is a schematic plan view of the socket body of the sixth embodiment.

24 is a side view of the slider of the sixth embodiment.

25 is a longitudinal sectional view of a portion of an IC socket according to a seventh embodiment of the present invention.

26 shows a contact pin of the seventh embodiment, (a) is a side view of the third contact pin, (b) is a side view of the fourth contact pin.

27 is a partial plan view of the socket of the contact pin of the seventh embodiment from above;

28 is a schematic perspective view of the overall configuration of the IC socket of the seventh embodiment.

29 is a schematic plan view of a socket body of an IC socket showing an eighth embodiment of the present invention.

(A), (b), (c) and (d) are a plan view, a front view, a right side view and a bottom view schematically showing the slider of the eighth embodiment, respectively;

31 (a), 31 (b) and 31 (c) are each a longitudinal cross-sectional view for explaining the method of using the IC socket of the eighth embodiment;

32 (a), (b), (c) and (d) are schematic bottom views for explaining the operation of the slider and the contact pin in the IC socket of the eighth embodiment, respectively.

33 is a sectional view showing the main parts of an insertion jig for moving the slider of the eighth embodiment from the open position to the clamp position;

Fig. 34 is a sectional view showing the principal parts of a drawing jig for moving the slider of the eighth embodiment from the clamp position to the open position;

Fig. 35 is a schematic view of essential parts of an IC socket showing a modification in which the direction of the bent portion of the contact pin of the eighth embodiment is changed.

Fig. 36 is a schematic view showing the principal parts of an IC socket showing another modification in which the direction of the bent portion of the contact pin in the eighth embodiment is changed.

37 is a plan view of principal parts showing a modification of the support structure of the contact pin of the eighth embodiment;

38 is a longitudinal sectional view of an essential part of an IC socket showing a ninth embodiment of the present invention similar to the eighth embodiment with the contact pins having a support angle;

39 is a longitudinal sectional view of an essential part of an IC socket according to a tenth embodiment of the present invention similar to the eighth embodiment, wherein the spring means for urging the slider is formed separately from the contact pins;

40 is a longitudinal sectional view of principal parts of an IC socket showing an eleventh embodiment of the present invention similar to the eighth embodiment with a slider drive mechanism;

Fig. 41 shows a part of the IC socket according to the twelfth embodiment of the present invention, (a) is a longitudinal sectional view in the state where no IC chip is mounted, and (b) is a longitudinal sectional view in the state where the IC chip is mounted.

42 is a schematic plan view of the IC socket showing the arrangement of the rotary motion cam of the twelfth embodiment;

43 is a schematic plan view of the socket body of the twelfth embodiment.

44 is a sectional view showing the principal parts of a chip-on-board module mounted on a printed circuit board using a socket according to a thirteenth embodiment of the present invention;

45 is a schematic plan view of the socket shown in FIG. 44;

46 is a sectional view showing the principal parts of a module of a state removed from the socket shown in FIG. 44;

47 is a schematic plan view of the socket shown in FIG. 46;

48 is an enlarged cross sectional view of the main portion of the socket taken along line E-E in FIG. 46;

49 is a sectional view of principal parts of a socket according to a fourteenth embodiment of the present invention;

50 is a sectional view showing the main parts of a socket according to a fifteenth embodiment of the present invention;

FIG. 51 shows the top cover of the socket shown in FIG. 50, (a) is a plan view with the bottom face of the top cover facing upward, (b) is a side view of the top cover;

52 is a schematic plan view showing a relationship between a contact pin and a slider in each row of sockets according to a sixteenth embodiment of the present invention;

53 is a schematic plan view showing a relationship between a contact pin and a slider in each row of sockets according to the seventeenth embodiment of the present invention.

54 is a sectional view showing the principal parts of a socket according to an eighteenth embodiment of the present invention, showing a state where a module is installed on a circuit board;

55 is a sectional view showing the principal parts of the socket according to the eighteenth embodiment, wherein the contact pins of the socket are soldered onto the circuit board;

Fig. 56 is a plan view showing the relationship between the contact pins of the respective rows and the slider when the slider of the eighth embodiment is in the pushing position;

Fig. 57 is a plan view showing the relationship between the contact pins and the sliders in the respective columns when the slider of the eighteenth embodiment is in the open position;

Fig. 58 is a plan view showing a metal plate for manufacturing the contact pins in each column of the eighteenth embodiment.

Fig. 59 is a plan view of an IC socket according to a nineteenth embodiment of the present invention showing a state where an IC package is loaded.

60 is a longitudinal sectional view along the F-F line during the 59th showing the state where the slider is in the press position.

61 is a perspective view of the base plate and the slider cut along the F-F line during the 59th.

Fig. 62 is an explanatory view of essential parts showing the relationship between the jig for IC package loading and the IC socket of the nineteenth embodiment.

63 is a perspective view of the main portion of the jig used when taking out the IC package from the IC socket of the 19th embodiment.

64 is a longitudinal sectional view of a portion of the socket along the F-F line of FIG. 59 showing the state where the slider is in the open position and the IC package is inserted.

FIG. 65 is a longitudinal cross-sectional view taken along the line F-F of FIG. 59 showing a state where contact portions of contact pins are located above the IC package.

FIG. 66 is a longitudinal cross-sectional view taken along line F-F in FIG. 59 showing a state where a contact portion of a contact pin contacts an upper surface of an IC package.

67 is a longitudinal sectional view of a part of a socket showing a modification of the slider of the nineteenth embodiment;

68 is a longitudinal sectional view of a part of a socket showing a modification of the contact pin of the nineteenth embodiment;

69 is a plan view of an IC socket according to a twentieth embodiment of the present invention showing a state in which the cover is removed when the IC package is loaded.

70 is a partial cross-sectional side view of the socket of the twentieth embodiment;

71 is a longitudinal cross-sectional view of a portion of the socket along the line G-G in FIG. 70 with the IC package loaded;

72 is a schematic longitudinal cross-sectional view of a portion of the socket along the H-H line during the seventieth.

73 is a partial perspective view showing the base plate and the working shaft member cut along the line G-G during the 70's.

74 is a longitudinal sectional view of the same as that of 71st with the socket of the twentieth embodiment open;

75 is a longitudinal cross-sectional view similar to the 71st view showing a modification of the contact pins and the base plate of the 20th embodiment;

76 is a longitudinal sectional view showing an IC socket according to a twenty-first embodiment of the present invention, and the sole is open, and FIG. 77 is a longitudinal sectional view of a part of the IC socket in a twenty-first embodiment with the IC package loaded. .

77 is a longitudinal sectional view of a portion of the IC socket of the twenty-first embodiment with the IC package loaded;

According to the present invention, there is provided a socket assembly for receiving an electrical component having a plurality of terminals and electrically connecting the electrical component to a printed circuit board, the socket body having an approximately rectangular outline and at least opposite sides of the socket body. A base portion arranged in parallel along each other, each having an upward contact portion for contacting the terminal of the electrical component at one end and an external connection portion for connecting the printed circuit board at the other end thereof; A plurality of flat contact pins having arms extending upwardly above the base portion, the open positions for receiving the electrical components and being supported by the base portion and the arms of the row of contact pins, respectively; Pressing the electrical component by the elastic force to the terminal of the electrical component to the cone There is provided a socket assembly having a plurality of sliders that are movable between a pressing position for pressing the contact portion of the tact pin. In the socket assembly having the above-described configuration, after mounting the electrical component on the contact portion of the contact pin, the slider is individually contacted by at least the mutually opposite sides of the electrical component by moving the slider from the respective open position to the pressing position. It can pressurize against the contact part of a pin. Therefore, one slider does not need to secure a pressing force that can be brought into contact with the contact pressure between the front end of the electrical component and all the contact pins. It is sufficient to secure a pressing force that can be brought into contact with the contact pressure required. Therefore, the force required for the movement operation of each slider can be reduced, so that the mounting and dismounting work of the electric parts becomes easy. In addition, because of the elasticity of the arm of the contact pins in the heat, the slider presses the electric parts, so even if there is a non-uniformity in the spring of the arm of the contact pin, the contact parts of the contacted contact pins and the terminals of the electric parts have a uniform contact pressure. Contact. Preferably, the slider has an upper surface pressing portion for pressing the upper surface of the electrical component and a side pressing portion for pressing the side surface of the electrical component. In this configuration, since the slider presses the upper and side surfaces of the electrical component in the pressing position, two or more sliders arranged on opposite sides of the socket main body are sequentially moved from the open position to the pressing position, thereby providing respective terminals. It is possible to surely generate a wiping action between and the contact portion of each contact pin. Thus, the electrical connection between the contact pin and the electrical component is assured. More preferably, a plurality of ribs are formed on the upper and lower surfaces of the slider to be slidably fitted between the arms of the row of contact pins and between the base portions, respectively. The socket main body may have jig guide means coupled to both ends of the slider to guide the jig for moving the slider between the open position and the pressurized position in the vertical direction. In this case, preferably, the jig guide means has a guide hole formed at four corners of the socket body and a guide groove hole adjacent to the guide hole and formed along both ends of the row of contact pins, A pin positioned above the guide groove hole is provided, and the jig has a guide pillar inserted into the guide hole and a leg portion inserted into the guide groove hole, and an inward or outward inclined surface is formed at the tip of the leg portion. More preferably, the at least opposite sides of the socket body are formed by forming a plurality of ribs each fitted between the base portions of the row of contact pins. More preferably, at least opposite sides of the socket body are formed with coupling grooves extending along rows of the contact pins, and coupling portions are formed in the base portions of the row of contact pins. . According to the present invention, there is provided a socket assembly for accommodating an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, the socket body having an approximately rectangular outline and at least one of the socket bodies. Base portions arranged in parallel along each of the opposite side edges, each having an upward contact portion for contacting the terminals of the electrical component at one end and an external connection portion for connecting with the printed circuit board at the other end; And a plurality of flat contact pins having arms extending upwardly curved above the base portion, and a plurality of sliders disposed along the at least opposite sides of the socket body, wherein the sliders are arranged in the row. The upper side between the base and the arm of the contact pin It is also moved between an open position for accommodating the electrical component and a pressing position for pressing the upper and side surfaces of the electrical component by the elastic force of the arm to press the terminal of the electrical component to the contact portion of the contact pin. A movable mover, a stator located between the base portion and the arm of the rowed contact pins and fixed to the base portion, and a driver coupled to the mover and the opposing surface of the stator; And a socket assembly rotatable for the driver to move the mover between the open position and the pressurized position. In the socket assembly of the above configuration, by moving the slider driver, the movable member of the slider can be moved to an open position or a pressurized position. Preferably, the stator of the slider has an upper surface pressing portion for pressing the upper surface of the electrical component, and a side pressing portion for pressing the side surface of the electrical component. More preferably, the stator of the slider has an upper surface in sliding contact with the arms of the row of contact pins and a lower surface in sliding contact with the base portion and has an upper surface of the arm of the row of contact pins in row. A plurality of ribs each slidably fitted therebetween are formed in rows. More preferably, both ends of the driver are provided with levers for rotating the drive pinion. More preferably the driver is a pinion that engages a rack formed on opposite surfaces of the mover and the stator. According to the present invention, there is provided a socket assembly for accommodating an electrical component having a plurality of terminals and electrically connecting the electrical component to a printed circuit board, the socket body having an approximately rectangular outline, and the socket body at least opposed to each other. The base portion is arranged in parallel with each other along the side edges, each having an upward contact for contacting the terminal of the electrical component at one end, and having an external connection for connecting to the printed circuit board at the other end And a plurality of flat contact pins having arms extending upwardly bent from the base portion, the open positions for receiving the electrical components supported by the base portion and the arms of the contact pins each formed in rows; And pressurizing the upper and side surfaces of the electric component by the elastic force of the arm to the electric part. A plurality of sliders movable between a pressing position for pressing the terminal of the product and the contact portion of the contact pins, each of the sliders having one end portion pressing the upper and side surfaces of the electrical component and the other end thereof; A socket assembly having a plurality of arm insertion holes for accommodating the distal end portion of the arms of the row of contact pins on the other end side of the slider, the upper surface of the slider covering the arms of the row of contact pins; Is provided. In the socket assembly of the above configuration, the slider is held on the arm so as to cover the upper surface of the arm with the row of contact pins, so that the slider serves as the upper protective cover of the contact pin. In addition, since the slider can be easily slid by directly operating the slider from the top of the arm, a jig or an operating mechanism for sliding the slider from the outside becomes unnecessary. Therefore, the configuration of the socket assembly can be simplified. Preferably, the upper surface of the base portion near the contact portion of the contact pin is provided with a recess for lowering the slider that has reached the vicinity of the pressing position, and the arm of the contact pin has the recess as the slider approaches the recess. The tip thereof is inclined downward toward the contact portion so as to increase the spring force applied to the slider. More preferably, one end of the slider is provided with an ablation portion which abuts on the side and top of the electrical component. More preferably, the slider has an upper layer along the upper surface of the tip of the arm of the contact pin and a lower layer along the lower surface of the arm, and the upper layer of the slider is directed toward the other end of the slider than the lower layer of the slider. It extends long and the said arm insertion hole of the said slider is opened in the cross section of the said lower layer part of the said slider, The arm guide groove which is continuous with each said arm insertion hole is formed in the lower surface of the said upper layer part of the said slider. More preferably, the slider has a sliding contact projecting from the lower surface of the one end thereof, and only the sliding contact of the slider makes sliding contact with the upper surface of the base portion of the contact pin. More preferably, the lower surface of the slider is formed with a guide rib protrudingly slidably coupled between the base portions of the row of contact pins. According to the present invention, there is provided a socket assembly for accommodating an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, comprising: a socket body having a substantially rectangular outline and at least one of the socket bodies; A base disposed in parallel with each other along the sides, each having an upward contact at one end for contacting the terminals of the electrical component and an outer connection at the other end for connecting with the printed circuit board; A plurality of flat contact pins having legs protruding downwardly from a base, wherein the socket main body has slits for inserting the legs of the contact pins formed in rows in two rows in a zigzag arrangement, A first rib for regulating the spacing of the contact pins inserted into the rows of slits; Second ribs for regulating the spacing of the contact pins inserted into the rows of slits formed in the room are alternately arranged in two rows in a zigzag manner, and contact pins inserted into the other row of slits on the first rib There is provided a socket assembly disposed. As described above, the ribs that prevent contact between the contact pins and adjacent contact pins are divided into two groups, and the contact pins and ribs of each group are alternately arranged so that the pitch of the contact pins is 1/2 of the pitch of the ribs. It is possible. Preferably, the first and second ribs are disposed in the vicinity of the contact portion of the rowed contact pins. More preferably, the contact pin has an arm that is bent upwardly extending from the base and a slider is supported on the base and the arm of the row of contact pins to hold the electrical component and the open position The upper and side surfaces of the electrical component can be pressed by the elastic force of the arm to move between the pressing positions for pressing the terminal of the electrical component to the contact portion of the contact pin. The socket assembly may be provided with a pressing cover detachably coupled to the socket body to press the upper surface of the electrical component to press-contact the terminal of the electrical component to the contact portion of the contact pin. According to the present invention, there is provided a socket assembly for accommodating an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, the socket assembly being provided on the socket body and the socket body to provide at least one side of the socket body. A plurality of contact pins arranged in a row in parallel along each other, the contact pins each having a contact portion for contacting the terminal of the electrical component, and disposed along at least one side of the socket body and configured to receive the electrical component; A slider movable between an open position and a pressing position for pressing the upper surface of the electrical component to press the terminal of the electrical component to the contact portion of the contact pin, and disposed along at least one side of the socket body; Spring means for applying a pressing force to the electrical component to the slider, The contact pin has a curved portion protruding to one side thereof, the slider has a pressing portion for pressing the upper surface of the electrical component and a plurality of couplers that can be coupled to the curved portion, the pressing portion of the slider is the upper surface of the electrical component The contact portion of the contact pin passes through the bent portion while the contact pin elastically displaces the contact pin laterally while reaching the top surface of the electrical component from an open position retracted from A socket assembly is provided which allows for sliding movement relative to the terminal of the component. In the socket assembly of the above configuration, the electrical component is mounted on the socket body to bring the terminal of the electrical component into contact with the contact portion of the contact pin, and then the slider is moved from the open position, and the pressing portion thereof is moved by the spring force of the spring means. By press-contacting the upper surface, the electrical component can be sandwiched and fixed between the contact pin and the slider, and the electrical contact portion between the terminal of the electrical component and the contact pin can be electrically contacted at a desired contact pressure. In this case, the vicinity of the end of the electrical component is fixed between the contact pins and the slider, so that undesirable stresses other than the compressive stress in the vertical direction of the electrical component, for example, bending moments or the like, can be prevented from being applied to the electrical components. It is possible to prevent damage to the electrical components due to unstressed stress. Furthermore, a part of each contact pin is provided with a bent portion protruding to one side thereof, and the slider is provided with a plurality of joiners that can engage with the bent portion of the contact pin, and the joiner reaches the upper surface of the electrical component from the open position of the slider. And then move the slider between the contact of the contact pin and the terminal of the electrical component under the desired contact pressure while passing through the bend, since the contact passes through the bend while elastically displacing the contact pin laterally along this top surface. It is possible to produce a wiping action in a direction (left and right directions) approximately perpendicular to the direction. This wiping can be performed reliably with a predetermined stroke irrespective of the magnitude of the positioning tolerance of the electrical component with respect to the socket body. Therefore, a highly reliable electrical connection between the terminal of the electrical component and the contact portion of the contact pin is achieved. Can be realized. Also, when the slider tries to return from the pressurized position to the open position, the bent portion of the contact pin contacts the coupler of the slider and acts as a stopper against its return, so that the electrical component suddenly falls off the socket body. Can be prevented. Preferably, the coupler of the slider is disposed on both sides of the respective contact pins. More preferably, the bent portions of the respective contact pins alternately protrude in opposite directions in the arrangement order of the contact pins. More preferably, each of the contact pins is provided with a support portion extending downward from between the contact portion and the bent portion so that the lower end portion is supported by the socket body. Further, according to the present invention, there is provided a socket assembly for accommodating an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, comprising: a socket body having an approximately rectangular outline, and at least one of the socket bodies. Bases arranged in parallel along the side edges opposite to each other, each having an upward contact at one end for contact with the terminals of the electrical component and at the other end with an external connection for connecting with the printed circuit board. And a plurality of flat contact pins having arms extending upwardly bent from the base portion, each of which is supported by the tip portion of the arms of the row of contact pins formed in the row so as to be substantially horizontal to the position of the standing position. And a rotary motion cam capable of rotating movement between the position and the rotary motion cam when in a standing state. Retracting from the insertion region of the electrical component and pressing the upper and side surfaces of the electrical component by the elastic force of the arm of the contact pin when it is in the horizontal state, thereby forming the terminal of the electrical component. A socket assembly is provided that is adapted to press contact with a contact. Preferably, the rotary motion cam has a standing contact portion in contact with the upper surface of the base portion of the contact pin in the standing state and a horizontal contact portion in contact with the upper surface of the base portion of the contact pin in the substantially horizontal state. The elasticity of the arm of the contact pin is imparted to the slider from the tip of the arm in a direction orthogonal to the contact at the time of standing and the distance from the horizontal contact to the electrical component is from the tip of the arm. Greater than the distance to the electrical components. More preferably, the rotational cam is provided with a projection for rotating the rotary cam operation. According to the present invention, there is also provided a socket assembly for receiving an electrical component having a plurality of terminals and electrically connecting the electrical component to a conductor pattern on a printed circuit board, the socket assembly having an approximately rectangular outline surrounding the electrical component. A support frame and a row arranged in parallel along at least opposite sides of the socket body, each having an upward contact portion for contacting the terminal of the electrical component at one end thereof and at the other end of the printed circuit board; A plurality of flat contact pins having a base portion having an external connection portion for connecting with the conductor pattern and an arm extending upwardly bent above the base portion, the base portion and the arms of the contact pins each having the row; Of the arm and the open position for receiving the electrical component And a plurality of sliders for pressing the upper and side surfaces of the electrical component by the elastic force to move between the pressing position for pressing the terminal of the electrical component to the contact portion of the contact pin, wherein the contact pin includes: And the detachable coupling to the support frame such that the support frame can be detached from the contact pin after the external connection portion of the contact pin is fixed to the conductor pattern of the circuit board by soldering. A socket assembly is provided. In the socket assembly having the above configuration, the contact pin is detachably attached to the support frame such that the support frame can be detached from the contact pin after the external connection portion of the contact pin is fixed by the solder to the conductor pattern of the printed circuit board. Since the mounting height of the contact pin itself with respect to the circuit board becomes small since it is combined, the mounting height with respect to the circuit board of the electric component mounted on the contact pin can be made small. It is also possible to realize a mounting structure of a lightweight electrical component by fixing the external connection portion of the contact pin to the conductor pattern of the circuit board by soldering and then detaching the support frame from the contact pin as necessary. Furthermore, since the contact pins forming the row are soldered to the circuit board while being supported by the support frame, it is possible to prevent the workability of soldering and the positional accuracy of each contact pin relative to the circuit board from being lowered. Preferably, a plurality of ribs are provided in rows and rows on the inner side and the outer side of the support frame, and the row of contact pins are detachably coupled between the ribs adjacent to each other on the inner side and the outer side of the support frame. . More preferably, the support frame is detachably mounted to the upper cover covering the upper surface of the electrical component, or the upper cover covering the upper surface of the electrical component is integrally installed. In this case, the upper cover is provided with ribs for regulating the distance between the arms of the contact pins formed in the row, and an opening for viewing and confirming the contact portion of the contact pins from above. More preferably, each slider is formed with a partition wall for regulating the spacing of the contact pins. In this case, preferably, each slider is formed of a material having poor wettability with respect to solder, and at least a part of the partition wall of each slider is located above the soldering section in the sliding movement region of the contact pin with respect to the partition wall of the slider. It is formed to cover the section to be located. The section located above the solder section in the sliding movement region of the contact pin that slides with the partition wall of the slider may be covered with a material having poor wettability to solder. More preferably, the pitch and the width of at least a part of the external connection portions of the row of contact pins are larger than the pitch and width of the contact portions, respectively. More preferably, each row of contact pins is formed by simultaneous punching and simultaneous bending of one conductive plate. According to the present invention, one end has an external connection terminal, and the other end has a contact portion capable of contacting the terminal of the electrical component when the electrical component is loaded, and between them, a first spring is provided on the external connection terminal side. A plurality of contact pins having a second spring formed on the contact side and mutually insulated from each other on the base plate, and in contacting with the first spring in a detachable position and a loading position of the electrical component, respectively An engaging portion having a regulated first position regulating portion and a second position regulating portion, and moving the contact portion to the detachable position by pushing the second spring in a first direction from its elastic neutral position There is provided a socket assembly having a slide member having an excitation slide. Preferably, the biasing force of the first spring acts in an approximately up and down direction of the loaded electrical component, and the biasing force of the second spring acts in an approximately lateral direction of the electrical component. In addition, when the electrical component is loaded, the contact portion slides in contact with the terminal of the electrical component by pushing the second spring in a second direction from its neutral position. More preferably, the slide member is formed to push the side surface of the electrical component when the electrical component is loaded. More preferably, the slide member is interposed between the external connection terminal and the first spring from the up and down direction so as to be movable laterally by the extension portion and the first spring. More preferably, the electrical component is sandwiched between the contact portion and the elongated portion from the up-down direction at the loading position of the electrical component, and at least one of the contact portion and the tip portion is an electrical conducting terminal with the electrical component. . More preferably, the slide member is provided with joining portions at both ends in a direction orthogonal to its moving direction, and the slide member is moved through the joining portion by an external device. More preferably, the slide member is provided with a plurality of ribs and the row of contact pins are separated from each other by the ribs. In the socket assembly having the above structure, when the slide member is moved outward in the horizontal direction of the socket by using a jig or the like, the engaging portion of the slide member bends the second spring of the contact pin, and the contact portion of the contact pin is retracted laterally to form an electronic component. It allows the acceptance of The slide member is positioned in its position by the force of the first spring of the contact pin. In this state, when the electronic component is installed in the receiving portion and the slide member is moved inward in the horizontal direction, the contact pins return the second spring to the neutral position, and the contact pins press the electronic parts upwards, Contact the terminal. The slide member is held in this state by the first spring. In the final stage of the loading operation of this electrical component, the engaging portion allows the second spring to be pushed back in the same direction from the neutral position, or by allowing the slide member to push the sides of the electrical component, thereby reducing the terminals of the electrical component and the contact pins. It is possible to improve the conductivity in which wiping with the contact is performed. The extension part is provided between the external connection terminal of the contact pin and the electric part is sandwiched between the contact part and the extension part so that the terminal of the electric part is not only provided on the upper surface side thereof, but also provided on the lower surface side. It can also be applied to. Further, according to the present invention, a spring is formed between the contact portion and the external connection terminal which can contact the terminal of the loaded electrical component, and a coupling portion is formed between the contact portion and the spring to be parallel to the base plate. A coupling portion having a plurality of contact pins and an arm at least at one end and engaging with the coupling portion of each of the contact pins is formed on the peripheral surface thereof and is disposed along the parallel direction of the contact pins, and a rotational force is applied by the spring member. And an actuating shaft member to be provided, wherein one of the engaging portion of the contact pin and the engaging portion of the actuating shaft member is in the form of a block and the other is concave, so that the actuating shaft member with respect to the contact pin is removed. Two joins are sequentially made in the rotational direction, and one join is used for the electric component. A socket assembly is provided which contacts and disconnects the contacts and allows the other to slide the contacts against the electrical component upon loading. Preferably, the engaging portion of the working shaft member is concave, and the engaging portion is formed to push the side surface of the electrical component when the electrical component is loaded. More preferably, the contact pin is provided with an extension portion protruding from the external connection terminal and the spring, and the working shaft member is sandwiched between the contact pin and the extension portion. More preferably, the electrical component is sandwiched between the contact portion and the distal end portion at the loading position, and at least one of the contact portion and the distal end portion forms an electrical conduction terminal with the electrical component. More preferably, the spring is composed of a first spring provided on the contact portion side and a second spring provided on the external connection terminal side. More preferably, a plurality of ribs are provided in the working shaft member, and the contact pins are each isolated by the ribs. More preferably, the base plate is provided with means for suppressing rotation of the working shaft member by the spring member at a predetermined angular position. More preferably, a cover member for rotating the actuating shaft member while supporting the force of the spring member through the arm is attached to the base plate so as to be movable up and down. Description of the Preferred Embodiment Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. 1 to 3, the socket assembly (IC socket) 10 according to the first embodiment of the present invention is mounted on the printed circuit board 5 and the leadless IC shown in FIG. It is comprised so that the chip 1 may be accommodated. The IC chip 1 is formed by mounting LSI or the like (not shown) on the upper surface of a rectangular multilayer substrate 2 formed of glass epoxy resin or the like, and protecting and modularizing the resin. A plurality of terminals (pads or lands) 4 are disposed on the bottom surface of the substrate 2 along each side of the substrate 2. The IC socket 10 has a socket body 11 having a substantially rectangular outline as viewed from above, and is parallel to each side of the socket body 11 and arranged at regular intervals in the direction perpendicular to each side. The contact pin 12 is provided. Moreover, the socket main body 11 is provided with the positioning guide 11b located in the row of the contact pin 12 by the same distance, respectively, along the diagonal of a rectangle. The positioning guide 11b has an upper surface of L shape, a curved inner side of the L shape facing the center of the diagonal line, and an upper half of the inner side of the L shape is constituted by an inclined surface inclined outward. The spacing between the lower half vertical surfaces of the inner surface of the L-shape of each positioning guide 11b is slightly larger than that of the substrate 2 of the IC chip 1 mounted on the socket body 11. In the state where the board | substrate 2 was positioned only by the positioning guide 11b, the movement of the degree to which a wiping effect is acquired is possible. Moreover, the guide hole 11c is formed in the position which cross | intersects the row of the contact pin 12 substantially on the diagonal outside the positioning guide 11b, and the row side of the contact pin 12 with respect to this guide hole 11c. Each hole 11d is provided in a position adjacent to each other. The contact pin 12 is U-shaped in the lateral direction, and an upward contact portion 12b is formed at the tip of the lower base portion, and is connected to the contact portion 12b at two locations on the five-side side of the U-shaped recess ( 12c) is addressed. In addition, the outer end portion 12d protrudes outward from the disk-shaped circular portion 12a and the U-shaped foot position downward in a position close to the curved portion of the U-shape, and protrudes inward near the tip of the arm above the U-shape. 12f of sliding parts are formed. The socket main body 11 is provided with a circular portion 12a of the contact pin 12 press-fitted into a slit 11a on which the contact pin 12 should be installed. The resulting contact pins 12 are capable of some inclination on the plane of the contact pins 12 with respect to the socket body 11. For this reason, due to the nonuniformity of the shape of each contact pin 12 by manufacturing error, or the non-uniformity of the press-fit state when the contact pin 12 is press-fitted into the slit 11a of the socket main body 11, respectively, When the position of the height direction of the external connection part 12d of the contact pin 12 of the contact pin 12 was changed, and the socket main body 11 was placed on the circuit board 5, a part of the external connection part 12d became the circuit board 5 The contact pins 12 are inclined by pushing the IC socket to the circuit board even if the electrodes are not connected to the electrode part or the conductor pattern of the circuit board, and all the external connection parts 12d and the conductor pattern of the circuit board 5 are brought into close contact with each other. In addition, since the close contact between the external connection portion 12d and the conductor pattern of the circuit board 5 is maintained even when the push-out of the IC socket is released, the contact pin 12 for the conductor pattern of the circuit board 5 is maintained. Soldering of external connection part 12d It can be ensured. In the horizontally U-shaped space in which the contact pins 12 are formed in a row, a linear slider 13 having a shape similar in cross section to a U-shape is inserted. On both ends of the slider 13, pins 14, which can be positioned above the respective holes 11d of the socket body 11, protrude, and in the middle part, at the same pitch as the row of the contact pins 12, The rib 13c and the upper groove 13d are formed in the upper side, and the rib 13c and the lower groove 13e are formed in the lower side, respectively, and the front end side of the lower groove 13e is the recessed part 12c. It is in a shape that can be joined to the. Moreover, it protrudes in the upper end of the part facing the center side of the socket main body 11, and forms the press part 13b, and the side surface of the board | substrate 2 of the IC chip 1 mounted in the substantially lower side of the press part 13b. The contact part 13a which contact | connects is formed. The bottom face of the upper groove 13d is an inclined surface in which the pressing portion 13b side is lowered when the slider 13 is inserted into the contact pin 12. The insertion jig 16 for inserting the IC chip 1 with respect to the above-described IC socket includes a guide pillar 16a and each hole 11d inserted into the four guide holes 11c of the socket body 11 described above. The leg part 16c inserted in this part is provided, and the front-end | tip of this leg part 16c forms the inwardly tapered part 16b. The disassembly jig 17 is provided with a guide pillar 17a inserted into four guide holes 11c and a leg portion 17c inserted into each hole 11d in the same manner as the insertion jig 16. The tip of 17c) forms an outwardly tapered portion 17b. Then, the method of inserting the contact pins 12 one by one into the slider 13 described above (not in heat because the pins do not open well because all of the contact pins 12 are required to open simultaneously) is shown in FIG. As shown, the lower side of the contact pin 12 has the rod 18 in the recessed part 12c between the recessed part 12c of the front end of the side, the sliding part 12f of the upper side, and the protrusion part of the front end, respectively. In addition, the slider 13 is inserted with these two rods 18 spreading upward and downward. After the slider 13 is inserted into the row of the contact pins 12, it is preferable to set the inclination angle of the bottom face of the upper groove 13d so that the amount of elastic deformation of the contact pins 12 is at least as possible. In this manner, the contact pin 12 does not have to be burdened when the IC socket is not used. Next, the operation of the above-described IC socket will be described. First, when the IC chip 1 is inserted, the portion of the contact pin 12 in the state before insertion is shown in Fig. 1 (a), so that the slider 13 has a recess 12c on the five-side side of the U-shaped space. ) Is located in the state where the tip of the lower part of the slider 13 is inserted, and the contact portion 12b of the contact pin 12 is located only at the place where the substrate 2 of the IC chip 1 is placed. (13) is completely retracted. In this state, when the board | substrate 2 of the IC chip 1 is mounted along the guide 11b for positioning of a corner, the board | substrate 2 of the IC chip 1 has the terminal 4 of the contact part 12b. It is in a state of being placed in contact with the top. Next, as shown in FIG. 4, the insertion jig 16 is inserted into the guide hole 11c of the socket main body 11 and pushed down, thereby pushing down the tapered portion 16b of the leg 16c. ) Presses the pin 14 of the slider 13 inward and shifts the slider 13 to the state of FIG. 1 (c). As shown in FIG. 1 (b), the tip of the lower groove 13e is adjacent to the recessed portion 12c of the contact pin 12, as shown in FIG. In order to carry over the part, it rises once and moves to the upper side of the board | substrate 2 of the IC chip 1. As shown in FIG. In the state where the transfer is completed, as shown in FIG. 1C, the contact portion 13a of the slider 13 presses the side surface of the substrate 2 of the IC chip 1, and the contact portions of the four sliders 13 are shown. By being pressed by 13a, the substrate 2 of the IC chip 1 is fully positioned while the bottom of the upper groove 13d of the slider 13 lifts the sliding portion 12f of the contact pin 12. It is pressed downward by the elastic force of the contact pin 12 through the press part 13b presses the board | substrate 2 of the IC chip 1 from the upper side, and presses the terminal 4 to the contact part of the contact pin 12. In full contact with (12b). In this case, since the pressing point of the board | substrate 2 of the IC chip 1 by the pressing part 13b of the slider 13 moves to the position inside of the contact part 12b of the contact pin 12, the insertion jig 16 Due to the time difference between the sliders 13, which may occur when pressing), even if one pressed state of the substrate 2 of the IC chip 1 occurs, the inclination of the substrate 2 of the IC chip 1 No load is generated and the other slider 13 does not touch the side of the substrate 2 of the IC chip 1 or cause a malfunction. The insertion jig 16 is removed from the socket body 11 after the insertion of the substrate 2 of the IC chip 1 is completed. When disassembling the board | substrate 2 of the IC chip 1, as shown in FIG. 5, the guide pillar 17a of the disassembly jig 17 is inserted into the guide hole 11c of the socket main body 11, and it pushes in When lowered, the taper portion 17b of the leg portion 17c presses the pin 14 of the slider 13 outward and shifts the slider 13 to the state of FIG. 1 (a). In this state, since the board | substrate 2 of the IC chip 1 only rests on the contact part 12b of the contact pin 12, in this state, the board | substrate 2 of the IC chip 1 may be disassembled. After disassembly of the substrate 2 of the IC chip 1, the socket 2 is separated from the socket body 11 in the same manner as the bite of the insertion jig 16. 7 is a longitudinal sectional view of a portion of an IC socket according to a second embodiment of the present invention. In this embodiment, the concave portion 12c is not provided in the contact pin 12, and the hook portion 12e is provided in place of the circular portion 12a, and the socket main body of the external connection portion 12d. The engaging portion 12i is provided on the side of (11). Moreover, the groove part 11e is provided in the cross section of the socket main body 11, and the convex part 11f is provided in the bottom face, respectively. The contact pin 12 presses the hooked portion 12e into the slit 11a installed in the socket main body 11, and the outer connecting portion 12d is the groove portion 11e provided at the end of the socket main body 11. ) Is attached to the socket body 11 by bringing the engaging portion 12i into contact with the bottom face of the socket body 11 while being engaged with the. At this time, the lower end of the contact portion 12b of the contact pin 12 is in contact with the socket main body 11, and the bottom of the socket main body 11 is the circuit board 5 to which the IC socket is attached by the convex upper part 11f. There is a gap between the family. With the above configuration, even if a strong force is applied to the external connection portion 12b of the contact pin 12, the lower end is in contact with the socket main body 11 so that there is no fear of bending downward. When the substrate 2 is placed on the contact portion 12b of the contact pin 12 and the slider 13 is moved, the external connecting portion 12b is bent downward and the pressing portion 13b of the slider 13 is moved. ) Can be prevented from being caught by the side surface of the substrate 2 of the IC chip 1 so that the slider 13 cannot be moved to a predetermined position. Moreover, since the recessed part 12c is not provided in the contact pin 12, when moving the slider 13, it can move with a weaker force than the case shown in FIG. Moreover, since the contact pin 12 is attached to the socket main body 11 by the external connection part 12d, the hooked part 12e, and the engaging part 12i, the position of the height direction of each external connection part 12d becomes uneven. The soldering work of the external connection part 12d to the circuit board 5 becomes easy. 8 is a sectional view showing a contact pin portion of the IC socket according to the third embodiment of the present invention. In this embodiment, the slit 11a is not installed in the socket main body 11, and the leg part 12g is extended from the external connection part 12d of the contact pin 12 to the bottom side of the socket main body 11, The click portion 12h is provided at the tip of the leg portion 12g. And the step part 11g provided with the click part 12h in the bottom face of the socket main body 11, engaging the external connection part 12d to the groove part 11e of the socket main body 11 similarly to the case shown in FIG. Contact pins are attached to the socket body 11. And also in this case, the convex part 11f is provided in the bottom face of the socket main body 11, the lower end of the contact part 12b of the contact pin 12 abuts on the socket main body 11, and the recessed part 12c Is not installed. In the first to third embodiments described above, a thin socket can be manufactured, for example, the width of the substrate 2 of the IC chip 1 is 25 mm and the thickness is 0. 4 to 0. Even in the case of 5 mm, the socket may be 32 mm wide or 3 mm thick. Moreover, the pressing force between the terminal 4 of the board | substrate 2 of the IC chip 1, and the contact part 12b of the contact pin 12 was carried out in the state which sandwiched the slider 13 and the board | substrate 2 of the IC chip 1. It is supported only by the elasticity of the contact pins 12 and does not burden the socket main body 11 made of synthetic resin. Therefore, this socket has high reliability at high temperatures and can be used for burn-in tests. Since the reflow for soldering to the board | substrate 2 of the IC chip 1 can be passed through later, a wasteless production process can be realized. Moreover, even if the number of the contact pins 12 is large, electrical components, such as the board | substrate 2 of the IC chip 1, can be attached easily by an actuator. Further, when the contact portion 13a of the slider 13 contacts the side surface of the substrate 2 of the IC chip 1, the contact portion 12b of the contact pin 12 is connected to the substrate 2 of the IC chip 1. Since it is moved slightly with respect to), the wiping effect is reliably obtained, and no contact failure occurs. Moreover, the board | substrate 2 of the IC chip 1 is mounted on the contact part 12b of the fixed contact pin 12, and is moved upwards by the sliding part 12f of the contact pin 12 via the slider 13. Since the method of pressurizing the board | substrate 2 of the IC chip 1, etc. from this, even the contact pin 12 of a fine pitch, the desired contact pressure is obtained easily. Incidentally, in the above-described embodiment, only an example in which the substrate 2 of the IC chip 1 is mounted is described. However, by changing the size of each element of the socket, the IC package or the chip-on-board module can be supported. In addition, when the lead terminal 13b of the slider 13 and the contact portion 12b of the contact pin 12 are sandwiched with the lead terminal instead of the substrate 2 of the IC chip 1, the lead terminal Protruding IC packages can also be supported. Next, referring to FIGS. 10 to 12, the IC socket 110 according to the fourth embodiment of the present invention includes a socket main body 111 having a substantially rectangular outline, and each side of the socket main body 111. FIG. And a plurality of laterally-shaped U-shaped contact pins 121 arranged in rows in parallel to each other, and a slider 122 inserted into a horizontal U-shaped inner space formed by a row of the contact pins 121. The socket main body 111 is provided with the positioning guide 111a located by the same distance inside the row of the contact pin 121, respectively along the diagonal line. The contact pin 121 is a U-shaped lower side base portion 121a and an inwardly inclined surface 121i provided on the upper surface of the socket center side of the base portion 121a and a contact portion 121b provided upward at its inner end. ), A stepped portion 121c provided above the base portion 121a in the vicinity of the contact portion 121b, and a leg portion 121d which projects below the base portion 121b and is planted in the socket body 111. And an external connecting portion 121e protruding from the outer end of the base portion 121a so as to connect with an external circuit, and an arm extending upwardly curved from the vicinity of the external connecting portion 121e, wherein the arm has an external connecting portion. A curved portion 121f that is curved upward from the vicinity of the vicinity of 121e, a horizontal portion 121g extending inwardly from the tip of the curved portion 121f, and a downward portion at the tip of the horizontal portion 121g. It consists of the installed suppressing part 121h. . The slider in the fourth embodiment is composed of a mover 122, a stator 123, and a driver 124. The stator 123 has a lower surface disposed in contact with the upper side of the leg portion 121d of the contact pin 121, the center side of the socket abuts against the step portion 121c, and the outer side abuts against the inside of the curved portion 121f. It is fixed. Moreover, the rack 123a is formed in the upper surface of the stator 123, and the inward inclined surface 123b is formed in the upper surface of the center side of a socket. The upper surface of the movable element 122 is in contact with the lower surface of the horizontal portion 121g of the contact pin 121, and the tip end portion of the socket center side is burned from the pressing portion 121h of the contact pin 121 to the movable element 122. The inward 1st inclined surface 122d and the downward pressurizing part 122a which reduce pressure and reduce the distance of the contact pin 121 are formed. On the other hand, the rack 122c is formed in the lower surface of the movable body 122, and the 2nd inclined surface 122e of outward is formed in the socket center side of this rack 122c, and this front end side is provided with the guide part 122e, and It is a vertical contact part 122b connected to this. The driver 124 has the pinion 125 which engages with the above-mentioned movable body 122 and the racks 122c and 123a of the stator 123, and protrudes in the same direction at both ends of the pinion 125, respectively. The drive lever 126 is provided, and the mover 122, the stator 123, and the driver 124 are configured to operate in association with each other. Next, the operation of the slider will be described. First, when the driving lever 126 is raised from the approximately horizontal position shown in FIG. 10B to the approximately vertical position shown in FIG. 10A, the pinion 125 rotates counterclockwise in the figure. At this time, the pinion 125 is engaged with the rack 123a of the stator 123 and thus is rotated to the outside (left side in the drawing). With this transmission, the rack 122c of the mover 122 engaged with the pinion 125 moves to the outside (left side in the figure) by a distance twice the transmission distance of the pinion 125. With this movement, the guide part 122e of the mover 122 abuts on the inclined surface 121i of the contact pin 121, after which the mover 122 is pushed upwards and the pressurized pressure of the mover 122 is increased. Pressurized contact by the part 122a to the IC package is released and the IC package can be inserted. In this state, when the IC package is inserted along the positioning guide 111a from above and the drive lever 126 is turned inside the socket, the pinion 125 is rotated clockwise in FIG. The rack 123a of 123 is rotated to the inside of the socket, and the rack 122c of the mover 122 is moved by twice the distance inside the socket. With the movement of the mover 122, the guide portion 122e of the mover 122 abuts on the inclined surface 121i of the compact pin 121, and then the mover 122 of the contact pin 121 It is guided to the inclined surface 121i and gradually moves forward and downward. As a result, the connection part 122b of the movable part 122 pushes the side surface of the board | substrate 2 of the inserted IC package, and positions the board | substrate 2 correctly, and contact pin contacted with the 1st inclined surface 122d. Since the perturbation part 121g of the arm of 121 is pushed upwards, this pressurization part 122a of the tip of the mover 122 is caused by the repulsive force of the arm of the contact pin 121 as this reaction. The upper surface of the substrate 2 of the IC package is pressed, and the electrode on the bottom surface of the substrate 2 acts to completely contact the contact portion 121b of the contact pin 121. In the case of extracting the IC package, an operation opposite to the above description may be performed, and the description is omitted. In addition, even in the case of the friction surface of the serration which is not shown in the engagement part of a stator, a movable part, and a driver, since operation is the same completely, description is abbreviate | omitted. As described above, in the IC socket of the fourth embodiment, the state of the contact pin can be changed only by operating the drive lever, so that special accessories such as insertion jig and extraction jig are unnecessary. In addition, it is possible to move the slider by the same distance over the entire length, and furthermore, because the only sliding member is the slider's mover, it works very lightly. In addition, since the operation of the slider only causes the driving lever to fall or falls, the printed circuit board may be bent or damaged even when mounted on a large printed circuit board or a thin printed circuit board without applying pressure from the socket. There is no. Next, referring to FIGS. 13 to 18, the IC socket 210 according to the fifth embodiment of the present invention has a substantially rectangular socket body 211 made of synthetic resin. In the center of this socket main body 211, the substantially rectangular opening part 211a smaller than the external dimension of the board | substrate 2 of the IC chip 1 is provided. As shown in Figs. 13 and 14, the upper surface of the socket body 211 is coupled to each of the four corner portions of the IC chip 1, and the corners for positioning the IC chip 1 in the socket body are shown. The joining piece 211b is protruded. Incidentally, in order to enable the wiping action described later, each corner engaging piece 211b is configured to position the IC chip 1 to an extent that can allow a slight flow of the IC chip 1. In addition, four corner portions of the socket body 211 are provided with positioning holes 211c for positioning, processing, or fixing the socket body 211 on the printed circuit board 5 (see FIG. 17), respectively. Formed. Arrangement fixing of a plurality of contact pins 220 made of metal on each side of the socket body 211 corresponding to the arrangement of the electrodes or the terminals 4 along the respective sides of the substrate 2 of the IC chip 1. It is. As shown in FIG. 17 (a), each contact pin 220 has a base portion having one end formed with a contact portion 220a in contact with the electrode 4 of the bottom surface of the IC chip 1, and the base portion At the other end, an external connection portion 220b protruding outside of the socket body 211 is formed. The external connection portion 220b of the contact pin 220 is solderable on a conductor pattern (not shown) formed on the printed circuit board 5 outside the socket body 211. A downward protrusion 220c is formed at the base of each contact pin 220. Each of the contact pins 220 is press-fitted into the slit 211d formed on the upper surface of the socket main body 211. It is provided in the upper surface of the socket main body 211. On the one end side of each contact pin 220, a coupling portion 220d engaged with the guide groove 211e formed on the upper surface of the socket body 211 protrudes downward, and the coupling portion 220d is a guide groove. One end 220a of the contact pin 220 is positioned on the socket body 211 by engaging with 211e. As shown in FIG. 13, the IC socket 210 further presses each side of the substrate 2 of the IC chip 1 individually to push the electrode 4 of the IC chip 1 into contact pins for each side. A plurality of sliders 230 (4 in this case) which are pressed against 220 are provided. The slider 230 is made of synthetic resin. 15 to 17, each slider 230 has one end 230a for pressing the substrate 2 of the IC chip 1 and the other end 230b on the opposite side thereof. At one end portion 230a of each slider 230, a cutout portion 230c is formed in contact with the side surface and the upper surface of the substrate 2 of the IC chip 1. Each slider 230 is provided with a plurality of arm insertion holes 230d that are open at the other end 230b side thereof. On the other hand, each contact pin 220 is integrally formed with an arm 221 inserted into the arm insertion hole 230d of the slider 230. The arm 221 holds the slider 230 and at the same time applies the spring force to the slider 230 while opening or retracting the slider 230 from the IC chip 1 (Fig. 17 ( From a)) to the pressing position (FIG. 17B) which presses the upper surface of the board | substrate 2 of the IC chip 1, it guides so that a movement is possible along the upper surface of the contact pin 220. FIG. The contact pin 220 can be easily formed by the punching process of a metal plate. As shown in Figs. 17A and 17B, on the upper surface near the contact portion 220a of each contact pin 220, a slider 230 which reaches the close side of the IC chip 1 is arm 221. The recessed part 220e which falls under the spring force of is formed. And each arm 221 has the other end of this contact pin 220 so that the spring force applied to the slider 230 may increase as the slider 230 approaches the recessed part 220e of the upper surface of the contact pin 220. It extends inclined downward toward the contact part 220a of the contact pin 220 from the upper part in the vicinity. In order to make the arm 221 elastic, the base side of the arm 221 is curved in an arc shape. As shown in FIG. 17A, the slider 230 has an upper layer 230e covering the upper surface of the arm 221 and a lower layer 230f covering the lower surface of the arm 221, and the slider 230 The upper layer portion 230e of the side extends longer than the lower layer portion 230f on the other end portion 230b side of the slider 230. And the arm insertion hole 230d of the slider 230 is open to the cross section of the lower layer part 230f. Moreover, the arm guide groove 230g continuous with the angular pressure insertion hole 230d is formed in the lower surface of the upper layer part 230e of the slider 230. As shown in FIG. In addition, in this embodiment, as can be seen from FIGS. 16A and 16D, five openings of the arm insertion holes 230d are communicated with each other as an example under the upper layer portion 230f. According to such a shape, the intensity | strength of the slider 230 can be ensured, and the intensity | strength of the capital increase (not shown) which forms the arm insertion hole 230d at the time of formation of the slider 230 becomes possible. Moreover, the sliding joint part 230h which contacts and slides on the upper surface of the contact pin 220 is formed in the lower surface of the one end part 230a of the slider 230, and the slider 230 is a sliding joint part 230h. Only the sliding contact with the upper surface of the contact pin 220 is formed. In addition, as shown in FIGS. 15 and 17 (a) and (b), the lower surface of the slider 230 includes guide ribs 230i slidably coupled between the contact pins 220 adjacent to each other. Protruding. In the IC socket 210 having the above configuration, the substrate 2 of the IC chip 1 is mounted on the contact portion 220a of the contact pin 220, and then the arm 221 integral with the contact pin 220 is provided. When the plurality of sliders 230 held on the slides are individually slided, the IC chip when the slider 230 descends along the recessed portion 220e of the upper surface of the contact pin 220 by the spring force of the arm 221. Each side of the board | substrate 2 of (1) is pressurized individually, and the electrode 4 of the IC chip 1 is pressed against the contact part 220a of the contact pin 220 for each side by the pressing force. In this case, it is necessary to ensure a desired contact pressure between the electrode 4 of the IC chip 1 and the contact pin 220, but the respective electrodes 230 of the IC chip 1 are provided by the sliders 230. ) Can be individually pressed against the contact pin 220 for each side, so that the pressing force by each slider 230 can be reduced. Therefore, the slide operation of each slider 230 can be easily performed with light force. In addition, since the pressing force applied to the IC chip 1 is also reduced, it is possible to prevent unnecessary stress from being applied to the IC chip 1 or the socket body 211. In particular, since the IC chip pressurization point by the slider 230 and the IC chip support point by the contact pin 220 are opposite to each other, and only the compressive stress in the thickness direction is substantially generated in the IC chip 1, the IC Unnecessary stress can be prevented from being applied to the internal circuit of the chip 1. Moreover, since each slider 230 can be slid individually to press each side of the board | substrate 2 of the IC chip 1 sequentially, this IC chip (when the IC chip 1 is pressed by the slider 230 is pressed. 1) can be moved in the slide direction of the slider 230 within the gap between the IC chip 1 and the socket body 211. Therefore, a wiping action can be generated between the electrode 4 of the IC chip 1 and the contact portion 220a of the contact pin 220, and the reliability of the electrical connection can be improved. In addition, the slider 230 is held by the arm 221 so as to cover the upper surface of the arm 220 on each side of the socket body 211 so that the slider 230 protects the contact pin 220 or the upper portion of the arm 221. It is useful as a cover. In addition, the jig for sliding the slider 230 by directly operating the slider 230 from the arm 221 can be omitted, and the structure of the IC socket 210 can be simplified, and at the same time, its small size and light weight, in particular, Thinning is possible. Herein, the operation of the arm 221 and the slider 230 will be described in more detail. When the slider 230 held on the arm 221 is in the retracted position, the slider 230 as shown in FIG. Is pressed against the upper surface of the contact pin 220 at the location of the contact portion 230h by the spring force of the arm 221. At this time, the spring of the arm 221 acts on the slider 230 with the upper layer part near the base part of the arm 221 as a point, and the lower surface of the front-end | tip part of the arm 221 as an emphasis point. Next, when the slider 230 is pushed in the direction of the IC chip 1 from the retracted position, the slider 230 moves along the upper surface of the contact pin 220 while elastically deforming the upwardly inclined arm 221 upwards. . Therefore, the spring force of the arm 221 increases as the contact part 230h of the slider 230 approaches the recessed part 220e of the upper surface of the contact pin 220. FIG. 18 shows an aspect in which the spring force of the arm 221 changes as the slider 230 moves. As shown in the figure, when the slider 230 reaches the recess 220e on the upper surface of the contact pin 220 and starts to drop, the spring force of the arm 221 starts to fall from the peak value. However, as shown in FIG. 17B, due to the slight drop of the slider 230, the cutout portion 230c of the one end portion 230a of the slider 230 causes the substrate 2 of the IC chip 1 to rise. The spring force of the arm 221 is constant to a value slightly lowered from the peak value because it is in contact with the upper surface of the c. In this way, the spring force of the arm 221 increases as the slider approaches the concave portion of the upper surface of the contact pin, so when the slider 230 is slid while resisting the spring of the arm 221, the slider 230 is at a minimum. The operating force of can reach the upper surface of the substrate 2 of the IC chip 1. Moreover, in the IC socket 210 of the said structure, when pushing the one side of the board | substrate 2 of the IC chip 1 by sliding the slider 230, the IC chip is carried out by the cutting part 230c of the slider 230. Since the side surface and the upper surface of the board | substrate 2 of (1) can be pressed, it presses two mutually opposing sides of the board | substrate 2 of the IC chip 1 with two sliders 230 sequentially, and, thereby, IC chip 1 It is possible to produce a more effective wiping action at the contact portion between the electrode 4 and the contact pins 220 of the < RTI ID = 0.0 > In addition, since the upper layer portion 230e of the slider 230 covering the upper surface of the arm 221 extends longer than the lower layer portion 230f of the slider 230, the upper portion of the arm 221 can be widely protected. In addition, since each arm insertion hole 230d of the slider 230 is formed to be shorter to open in the cross section of the lower layer portion 230f shorter than the upper layer portion 230e of the slider 230, shaping of the slider 230, in particular, the arm insertion hole 230d ) Can be easily formed. Since the arm guide groove 230g which is continuous with each arm insertion hole 230d is formed in the lower surface of the upper layer part 230e of the slider 230, even if the slider 230 is slid, the slider 230 will be made to the arm 221. The arm 221 adjacent to each other can be stably maintained and can be stably separated by the arm guide groove 230g. When the slider 230 is slid, only the sliding joint 230h of the lower surface of the one end 230a of the slider 230 can be bonded to the upper surface of the contact pin 220, so that the sliding resistance of the slider 230 is increased. The slide operation can be made easy by making it small. In addition, since the slider 230 can be slid to the pressing position while maintaining the contact pins 220 adjacent to each other by the guide ribs 230i of the slider 230, the contact pins 220 are moved due to the movement of the position of the contact pins 220. The poor contact between the electrode 4 of the IC chip 1 and the contact pin 220 can be reliably prevented, and the reliability of the electrical contact between the electrode 4 and the contact pin 220 can be further improved. 19 shows a variation of the slider 230. In the figure, the same components as those in the fifth embodiment are assigned the same reference numerals. In this embodiment, the upper layer portion 230e of the slider 230 extends longer than the slider 230 of the embodiment. On the upper surface of the other end portion 230b of the slider 230, a protrusion 230j having irregularities formed on the surface thereof is formed. Accordingly, when the slider 230 is slid, the slider 230 can be pushed more easily by bringing a fingertip or the like into contact with the protruding portion 230j. 20 shows a modification of the attachment structure of the contact pin 220. In the figure, the same reference numerals are assigned to the same components as those in the fifth embodiment. In this modified example, the guide rib 211f which pinches the external connection part 220b of each contact pin 220 is formed in the outer surface of the socket main body 211. Therefore, the external connection portion 220b of each contact pin 220 can be maintained at a predetermined pitch. 21 to 24 show the IC socket 310 according to the sixth embodiment of the present invention in which an ultra high density arrangement of contact pins is possible. Referring to the drawings, the IC socket 310 of the sixth embodiment has a socket body 311 having a substantially rectangular outline, and each side of the socket body 311 has a first contact pin 312 and a second one. The contact pins 313 are alternately arranged in rows parallel to each other. The socket body 311 includes a positioning guide 311b located inside the row of the first and second contact pins 312 and 313. The first and second contact pins 312 and 313 are horizontally U-shaped and have a lower base portion 312a and 313a, and an upper continuous curved portion 312e and 313e constituting the arm and a horizontal portion 312f, 313f). Upward contact portions 312b and 313b are provided at one end of the base portions 312a and 313a of the first and second contact pins 312 and 313, and socket bodies 311 are provided at the other ends of the base portions 312a and 313a. The outer connection parts 312d and 313d which protrude downward are provided in the outer side of (circle). Moreover, leg parts 312c and 313c which protrude below are provided in the substantially center of the base parts 312a and 313a. In the U-shaped inner space formed by the arrangement of the first and second contact pins 312 and 313, the slider 314 is disposed so as to be slidable in the horizontal direction. A first slit 311c disposed in two rows to fit the leg portions 312c and 313c of the first and second contact pins 312 and 313 into the contact pin arrangement section of the socket body 311, and The socket body of the recessed part 311e includes the first and second contact pins 312 and 313 fitted into the recessed part 311e provided so that the second slit 311d and the contact parts 312b and 313b are fitted. First socket main body ribs 311f and second socket main body ribs 311g, which are alternately arranged so as to be fitted to the outer and inner positions of the 311, respectively, are provided, and the first and second slits 311c and 311d are provided. ) And the first and second socket body ribs 311f and 311g are the same pitch, respectively, and the first and second pitches are arranged in a zigzag shape as a whole by releasing each other with a half pitch shift. The leg part 312c of the 1st contact pin 312 is inserted into the 1st slit 311c, and the lower side of the contact part 312b is the 1st socket body rib 311f of the recessed part 311e of the socket body 311. It is inserted in between, and the front end of the curved part 312e constitutes the oblique upward 1st inclination part 312h, the front end becomes a horizontal part 312f, and its front end is the oblique downward 2nd inclination part It is 312i, and this tip has comprised the downward press part 312g which presses down the upper surface of the slider 314. As shown in FIG. The leg portion 313c of the second contact pin 313 is inserted into the second slit 311d, and the lower side of the contact portion 313b is elongated to extend between the second socket body ribs 311g of the recess 311e. The tip of the curved portion 313e is immediately inserted into the horizontal portion 313f, and the tip of the horizontal portion 313f constitutes a downward pressure suppressing portion 313g. In the slider 314, ribs that maintain the interval of the first and second contact pins 312 and 313 arranged at regular intervals are alternately disposed at the same interval as the rows of the first and second slits 311c and 311d in 312 rows. It is. The first rib 314a arranged at the same pitch as the first or second contact pins 312 and 313 on the upper surface inside the socket, and the third rib 314c arranged at the same pitch on the upper surface of the intermediate portion, and the outside of the socket. The second rib 314b arranged at the same pitch on the upper surface and the fourth rib 314d arranged at the same pitch on the lower surface of the socket are provided. In addition, the front end portion of the inner side of the socket is downward in the longitudinal direction from the downward pressing portion 314e for pressing the IC chip, and the connecting portion 314f for regulating the IC package side position mounted below the pressing portion 314e and the center position. It consists of the pin 315 penetrated by. The first and second ribs 314a and 314b described above have the same pitch as the second contact pin 313, and the third and fourth ribs 314c and 314d have the first contact pins 312 in the same vertical position. ) And are arranged on the vertical plane at the same pitch. In this case, in the positional relationship where the horizontal portion 312f of the first contact pin 312 passes through the upper side with respect to the third rib 314c, the fourth rib 314d does not engage the curved portion 312e portion. Since it is comprised, the 1st contact pin 312 is arrange | positioned in the position which does not contact with the 3rd and 4th rib 314c, 314d at all. Moreover, since the curved part 313e and the horizontal part 313f of the 2nd contact pin 313 are directly connected, the 2nd rib 314b is comprised so that it may be located below this external connection part, and the 1st rib 314a ), The pressure suppressing portion 313g is configured at a position rearward than the pressure suppressing portion 312g of the first contact pin 312, so that no contact occurs. In the case of mounting the IC chip in the above-described IC socket, the sliders 314 are first slid outwardly of the socket by exposing the disassembly jig at both ends of the pin 315 to expose the contact portions 312b and 313b, and the IC is placed thereon. Put chips on it. In this case, if there is a positioning guide 311b separately, it is possible to match the position of each contact part 312b, 313b and the terminal of an IC chip previously by mounting it accordingly. After mounting the IC chip, if the slider 314 is slid toward the center of the socket with a dedicated insertion jig, the pressing portion 314e slides to the position above the contact portions 312b and 313b, and the respective contact pins 312 and 313 In the suppression portions 312g and 313g, the IC chip is pushed from the upper side to the contact portions 312b and 313b, and the contact portion 314f abuts against the side surface of the IC chip, thereby accurately positioning. In the case of extracting the IC chip, an operation opposite to that described above may be performed. 25 to 28 show an IC socket 310 according to the seventh embodiment of the present invention in which ultra-high density arrangement of contact pins similar to the sixth embodiment is possible. In these drawings, the same components as those in the sixth embodiment are denoted by the same reference numerals. Referring to these figures, the third contact pin 315 of the seventh embodiment is a short contact pin, and its leg portion 315c projects downwardly from approximately the center of the base portion 315a, The distal end portion is composed of a portion inserted into the concave portion 311e of the socket body 311, and at its distal end, an upward contact portion 315b is formed at the center portion in the concave portion 311e, and the leg portion of the insertion portion ( On the side of 315c, an insertion portion 315j formed at right angles is formed so as to be inserted between the socket body ribs 311f. At the outer end of the third contact pin 315, an external connection portion 315d is formed that connects to an external circuit outside the socket. The fourth contact pin 316 is a long contact pin, the leg portion 316c of which protrudes downward from the outside of the external connection portion 316d at the center of the base portion 316a, and the tip portion inside the socket is a socket. It consists of a part into which many parts are inserted in the recessed part 311e of the main body 311, and the upper part is formed with the upper contact part 316b, and the lower side of this contact part 316b is between the socket main body ribs 311g. An insertion portion 316j formed at right angles to be inserted is formed. Moreover, the leg part side of an insertion part forms the slope part 316h, and is formed so that the upper part of the socket main body rib 311f may pass. The socket body ribs 311f and 311g described above have a portion inside the socket of the concave portion 311e as shown in FIGS. 311g is located on the extension of the third contact pin 315, and 311f is located below the slope portion 316k of the fourth contact pin 316. One example of the overall configuration of this socket is shown in FIG. In this example, the IC chip is mounted on the contact pins 315 and 316 arranged in the socket body 311, the pressure cover 317 is pushed down from the upper side, and the pressure cover 317 is attached to the socket body 311. By coupling, the downward electrode of the IC chip is pressed against the contact portion of the contact pins 315 and 316. As described above, in the sixth and seventh embodiments of the present invention, at least one set of ribs for maintaining the intervals of the contact pins arranged at regular intervals is arranged at least one left and right on one contact pin in the contact pin arrangement portion, One rib for the contact pins adjacent to each other is placed approximately in the middle position of the set arrangement of the other ribs, and one contact pin adjacent to each other is on the array of ribs for the other contact pin. It is possible to suppress the influence of the rib thickness, which is limited in narrowing the spacing, and to arrange the contact pins at a very high density. In this way, an ultra-dense IC chip, which has not been possible in the past, can be mounted in a state that can be replaced with a printed board or the like. 29 to 34 show an eighth embodiment of the present invention. First, referring to FIGS. 29 to 32, the IC socket denoted by the numeral "410" as a whole has a substantially rectangular frame-shaped socket body 411 made of synthetic resin. The upper surface of the socket main body 411 is coupled to each of the four corner portions of the substrate 2 of the IC chip 1 shown in FIG. 9, for example, to connect the substrate 2 of the IC chip 1 to the socket main body 411. The corner engaging piece 411a for positioning in the protrusion is formed. And in order to enable the wiping action of the front-rear direction mentioned later, each corner coupling piece 411a positions this IC chip 1 to the extent which can allow the slight flow of the board | substrate 2 of the IC chip 1, and is possible. It is supposed to decide. In each of the four corner portions of the socket body 411, positioning holes 411b for positioning, temporarily fixing or fixing the socket body 411 on a printed circuit board (not shown) are formed. This positioning hole 411b can also be used to guide a jig for moving the slider described later. On the upper surface of each side edge part of the socket main body 411, many contact pins 420 are arrange | positioned at regular intervals in the direction orthogonal to the plate | board thickness. Each contact pin 420 has a base portion 421 extending in the inward and outward direction of the side portion of the socket body 411 and an arm 422 constituting a spring means described later, and at one end of the base portion 421 An upward contact portion 421a is formed in contact with the terminal 4 of the IC chip 1 in the vicinity of the inner edge of the side portion of the main body 411 to support the bottom surface of the IC chip 1, and the other end of the base portion 421. The lead terminal or external connection part 421b of surface mount type which extends outward of the frame piece part of the socket main body 411 is formed. This external connection part 421b is connected to the circuit pattern of a printed circuit board (not shown) by soldering etc., for example. The fitting part 421c which protrudes below is formed in the vicinity of the external connection part 421b between the contact part 421a of the base part 421 of the contact pin 420, and the external connection part 421b, and a socket main body The fitting groove 411c for accommodating the fitting portion 421c is formed on the upper surface of the 411. The upper surface of the socket body 411 is provided with ribs 411d and 411e for fitting the base 421 of the contact pin 420 at the inner side (front side) and the outer side (back side) of the fitting groove 411c, respectively. It protrudes and is installed. As can be seen from FIG. 31 (a), since the contact portion 421a of the contact pin 420 forms the free end of the base portion 421 of the contact pin 420, the contact portion 421a of the contact pin 420 The rib 411d of the fitting portion 421c or its front side (inner side) is used as a point to be elastically displaced in the plate thickness direction, that is, in the arrangement direction of the contact pin 420. On each side portion of the IC socket 410, a slider 430 extending along the arrangement direction of the contact pin 420 is provided to be movable along the longitudinal direction of the base portion 421 of the contact pin 420. As shown in FIG. 31 (a), the first stage of the slider 430 is pressurized to be able to contact the upper surface of the substrate 2 and the side contact portion 430a which is in contact with the side surface of the substrate 2 of the IC chip 1. The part 430b is formed. At the other end of the slider 430, a shaft 431 for penetrating the slider 430 in the longitudinal direction is provided integrally, for example, by insert molding or the like, and both ends of the shaft 431 are respectively formed of the slider 430. It protrudes outward from both ends. The slider 430 is held between the base portion 421 of the contact pin 420 and the arm 422, so that the slider 430 is pressed by the pressing portion 430b to mount the mounting area of the IC chip 1. The open position (see FIG. 31 (a)) to open and the pressing portion 430b are pressed against the upper surface of the substrate 2 of the IC chip 1, and one end face 430a is placed on the side of the substrate 2; It is possible to move along the upper surface of the base portion 421 between the abutting clamp positions (see FIG. 31C). The vicinity of the contact portion 421a of the base portion 421 is bent downwardly convex, whereby a recess 421d is formed on the upper surface of the vicinity of the contact portion 421a of the base portion 421. And corresponding to this recessed part 421d, the recessed part 430c is formed in the lower surface of the slider 430. As shown in FIG. Therefore, when the pressing part 430b of the slider 430 approaches the upper surface of the board | substrate 2 of the IC chip 1 from an open position, the 1st stage of the lower surface of the slider 430 will fall along the recessed part 421d. Therefore, with this, the pressing part 430b of the slider 430 also advances and descends, and abuts on the upper surface of the board | substrate 2 of the IC chip 1 (refer FIG. 31 (b)). Then, afterwards, the pressing portion 430b of the slider 430 can be further advanced while being in contact with the upper surface of the substrate 2, and finally the side connecting portion 430a of the slider 430 is placed on the side of the substrate 2. While there is a gap between the substrate 2 of the IC chip 1 and the corner portion 411a of the socket body 411, the slider 430 is provided by the gap. ), The side surface of the IC chip 1 substrate 2 can be pushed by the side connection portion 430a. The contact pin 420 is made of a metal which is rich in elasticity, and the slider 430 gradually extends the arm 422 upwardly with respect to the base portion 421 when the slider 430 moves from the open position to the clamp position. Since the slider 430 is close to the substrate 2 of the IC chip 1 from the open position, the spring force accumulated in the arm 422 increases. This spring force reaches a peak just before the pressing portion 430b reaches the upper surface of the substrate 2, and is slightly smaller than the peak value when the pressing portion 430 reaches the upper surface of the substrate 2, but larger than in the open position. An increased spring force is applied to the top surface of the slider 430. Accordingly, the pressing portion 430b of the slider 430 abuts on the upper surface of the substrate 2 by its spring force, and at the same time, the terminal 4 on the bottom surface of the substrate 2 is brought into contact with the contact pin 420 of the contact pin 420. Press). Then, after the pressing portion 430b reaches the upper surface of the substrate 2, the slider 430 moves further while keeping the arm 422 at a substantially constant opening degree, so that the pressing force applied to the slider 430 is almost constant. maintain. As described above, when there is a gap between the substrate 2 of the IC chip 1 and the corner portion 411a of the socket body 411, the side connection portion 430a is the substrate 2 of the IC chip 1. After abutting on the side surface of, the slider 430 is further advanced by the gap thereof, so that the side surface of the substrate 2 of the IC chip 1 can be pushed at the side connecting portion 430a. Therefore, a wiping action in the moving direction of the slider 430, that is, the front-back direction, can be caused between the terminal 4 of the IC chip 1 and the contact portion 421a of the contact pin 420. This wiping action in the front-rear direction can be reciprocated once in the front-rear direction by moving two sliders 430 facing each other separately. Thus a more effective wiping action is obtained. Moreover, since the slider 430 on each side part of the socket main body 411 can be moved individually, the operation force required for the movement of the individual slider 430 can be made small. Therefore, the stress acting on the IC chip 1 can be reduced, and the attachment work of the IC chip 1 can be easily performed with a small force. In the IC socket 410 of the eighth embodiment, as shown in FIGS. 31 and 32, the base portion 421 of each contact pin 420 is provided with a bent portion 421e protruding to one side thereof. The lower surface of the slider 430 is provided with a plurality of couplers 430d that can be engaged with the bent portion 421e. In this embodiment, as shown in FIG. 32, the bent part 421e of each contact pin 420 protrudes in the opposite direction alternately in the arrangement order of the contact pin 420. As shown in FIG. Moreover, the coupler 430d is arrange | positioned at the both sides of the base part 421 of each contact pin 420, respectively. The coupler contacts the contact pin 420 while the pressing portion 430b of the slider 430 reaches the upper surface of the IC chip 1 from an open position spaced apart from the IC chip 1, and then moves further along the upper surface. ) And the curved portion 421e is passed while elastically displacing the base portion 421 of the side thereof, whereby the contact portion 421a of the contact pin 421 and the terminal 4 of the IC chip 1 move the slider 430. Friction in the direction orthogonal to the moving direction of the < RTI ID = 0.0 >),< / RTI > The action of the coupler 430d and the bend 421e will be described in more detail. As shown in FIGS. 31A and 32A, when the slider 430 is in the open position, The ruler 430d is in front of the bend 421e. As shown in Figs. 31 (b) and 32 (b), the slider 430 is advanced from the open position so that the pressing portion 430b reaches the upper surface of the substrate 2 of the IC chip 1. When the coupler 430d reaches the bend 421e. Thereafter, when the slider 430 is further advanced, the coupler 430d is engaged with the bent portion 420e of the contact pin 420 as shown in FIG. 32 (c) to press the protrusion side in the plate thickness direction. The contact pin 420 is flexibly elastically displaced to displace the contact portion 421a of the contact pin 420 in the horizontal direction. As shown in FIGS. 31C and 32D, when the side contact portion 430a of the slider 430 contacts the side surface of the substrate 2 of the IC chip 1, Since 430d has passed through the bent portion 421e, the contact portion 421a of the contact pin 421 returns to the position before the displacement. In this way, after the pressing portion 430b of the slider 430 reaches the upper surface of the substrate 2 of the IC chip 1, the side connecting portion 430a of the slider 430 is placed on the substrate side of the IC chip 1. During the contact, the contact portion 421a can be reciprocated once by elastically displacing the base portion 421 of the contact pin 420 in the direction substantially orthogonal to the moving direction of the slider 430. In the meantime, since the spring force of the arm 422 of the contact pin 420 acts on the upper surface of the substrate 2 of the IC chip 1 via the slider 430, the terminal 4 of the IC chip 1 And the contact pressure 421a of the contact pin 420 can be effectively rubbed in the direction orthogonal to the moving direction of the slider 430, so that a so-called wiping action in the left and right directions can be obtained. The amount of friction between the contact portion 421a and the terminal 4 of the IC chip 1 may vary depending on the contact pressure between the terminal 4 and the contact portion 421a, the tip shape of the contact portion 421a, and the like. 05 mm or more is preferable. In the IC socket of the above-described configuration, the coupler 430d of the slider 430 moves in a state in which the base portion 421 of the contact pin 420 is sandwiched between the two coupler 430d and the bent portion 421e. ), The base portion 421 can be flexibly elastically displaced while restricting the torsional displacement of the base portion 421 with the two couplers 430d. Therefore, the wiping action in the direction orthogonal to the moving direction of the slider 430 can be more reliably between the contact portion 421a of the contact pin 420 and the terminal 4 of the IC chip 1. Since the coupler 430d passes through the bent portion 421e of the contact pin 420, the contact portion 421a of the contact pin 420 alternately displaces in the opposite direction in the order of the arrangement of the contact pins 420. It is possible to reliably prevent the chip 1 from operating in accordance with the operation of the contact portion 421a of the contact pin 420. Therefore, the wiping action can be more reliably produced between the contact portion 421e of the contact pin 420 and the terminal 4 of the IC chip 1. In addition, when the slider 430 tries to return from the clamp position to the open position, the bent portion 421e of the contact pin 420 is brought into contact with the coupler 430d of the slider 430 to prevent its return. By acting, it is possible to prevent the IC chip 1 from suddenly falling off the socket body 411. 33 shows the insertion jig 432 for moving the slider 430 from the open position to the clamp position. When the guide pillar 432a of the insertion jig 432 is inserted into the positioning hole 411b of the socket main body 411, the inclined surface 432c provided on the leg portion 432b of the jig 432 becomes a slider ( Abutting against the shaft 431 protruding from both ends of the longitudinal direction of the 430, pushing the jig 432 further down, the shaft 431 on the inclined surface 432c of the leg portion 432b of the socket body 411 Since the pressure is applied to the inner side of the side portion, the slider 430 can be moved from the open position to the clamp position. The socket main body 411 is formed with a recess 411f that accepts this leg 432b. 34 shows a drawing jig 433 for moving the slider 430 from the clamp position to the open position. The drawing jig 433 is formed such that the inclined surface 433c of the leg portion 433b which abuts on the shaft 431 presses the shaft 431 in the direction opposite to the jig 432. The other configuration is the same as that of the fourth jig 432, and the slider 430 is easily opened from the clamp position by inserting the guide pillar 433a into the positioning hole 411b of the socket body 411 and pushing it down. You can move it to a location. As described above, the bent portions 421e of the contact pins 420 arranged on the side portions of the socket body 411 are preferably provided by alternately protruding in the opposite direction, but the contact pins 420 for each side portion. It is also possible to project the bent portion 421e in the same direction. In this case, however, if all of the bent portions 421e of the contact pins 420 on the four side edge portions protrude in the same left and right directions with respect to the moving direction of the slider 430, the IC may be moved by the flexible elastic displacement of the contact pins 420. Since the chip 1 is easy to move clockwise or counterclockwise, it is preferable to reverse the projecting direction of the bent portion 421e for each side as schematically shown in FIG. Further, the bent portion 421e of the contact pin 420 arranged on each side portion may have the protruding direction in the opposite direction in a plurality of group units as shown in FIG. In this case, however, when the distance between the contact pins is narrow, it is preferable to change the positions of the bent portions having different directions in the longitudinal direction of the contact pins 421 as shown in the figure. Moreover, when the space | interval of each contact pin 420 is narrow and the bending direction of the bending part 421e of the adjacent contact pin 420 differs, the coupler 430d of the slider 430 couple | bonds with the bending part 421e. The contact portions 421a of the adjacent contact pins 420 may come into contact with each other, and if the contact pins 420 are accidentally energized during the movement of the slider 430, a short circuit accident occurs. Thus, as shown in FIG. 37, the socket body 411 has a fixing portion for fitting the base portion 421 of the contact pin 420 between the bent portion 421e of the contact pin 420 and the contact portion 421. 411g may be installed. If there is such a fixed part 411g, the quantity which can be elastically displaced in the contact pin plate thickness direction of the contact part 421a is regulated, and the contact part 421a of the adjacent contact pin 421 can be prevented from contacting. 38 shows a ninth embodiment of the present invention similar to the eighth embodiment. In the figure, the same reference numerals are assigned to the same components as those in the eighth embodiment. In the IC socket of the ninth embodiment, a support angle at which the lower end is supported by the socket body 411 is extended downward from the contact portion 421a and the bent portion 421e to the base portion 421 of each contact pin 420. 421f is provided. In this embodiment, since the lower end portion of the support angle 421f positioned between the contact portion 421a of the contact pin 421 and the bent portion 421e is supported by the socket body 411, the coupler of the slider 430 When 430d passes through the bent portion 421e of the contact pin 420 and elastically displaces the base portion 421 of the contact pin 420 laterally, the contact portion 421a of the contact pin 420 is supported. With the lower end of 421f as a point, flexible elastic displacement can be easily performed in the lateral direction of the contact pin 420, that is, in the thickness direction. When the support angle 421f does not exist, when the coupler 430d of the slider 430 passes through the bent portion 421e of the contact pin 420, it is press-contacted to the bottom terminal 4 of the IC chip 1. It is conceivable that the contact portion 421a of the contact pin 420 being used becomes a point so that the base portion 421 of the contact pin 420 undergoes torsionally elastic displacement. When such torsional elastic change occurs, the wiping action cannot be obtained on the contact portion 421a of the contact pin 420. On the other hand, if the lower end part of the support angle 421f located between the contact part 421a of the contact pin 420 and the bend part 421e is supported by the socket main body 411, since the said torsional elastic displacement is suppressed, a contact pin will be suppressed. The contact portion 421a of the 420 can be flexibly elastically displaced laterally, that is, in the thickness direction. Therefore, a wiping action in the direction (left and right directions) substantially perpendicular to the moving direction of the slider 430 is reliably generated between the contact portion 421a of the contact pin 420 and the terminal 4 of the IC chip 1. You can do it. 39 shows a tenth embodiment of the present invention similar to the eighth embodiment. In the figure, the same reference numerals are assigned to the same components as those in the eighth embodiment. In the IC socket of the eighth embodiment, the arm 422 of the contact pin 420 constitutes a spring means. In the IC socket of the tenth embodiment, the spring plate 434 that presses the upper surface of the slider 430 is the contact pin. It is formed separately from 420 and is fixed to the socket main body 411. In this way, when the spring plate 434 separate from the contact pin 420 is used, the spring plate 434 covering the upper surface of the slider 430 can be separated from the contact pin 420 in a conductive state. It is possible to prevent the risk of short circuit between the contact pins 420. Moreover, the upper surface of the spring plate 434 can also be used as display parts, such as a product name and a model number, and is convenient. And although the spring board 434 of this embodiment is comprised by the board | plate material, you may comprise the spring board 434 by making a some board | plate material parallel to the arrangement direction of the contact pin 420. FIG. When the spring plate 434 is composed of a plurality of plate members, for example, even if the slider 430 or the spring plate 434 is in an inclined shape, the slider 430 and the spring plate 434 are in contact with only a part of the spring plate 434. It can prevent the situation. In addition, even if the spring plate 430 is composed of only one sheet, the slider 430 and the spring are formed in the same manner as the above by processing a plurality of premises at the end portion of the slider 430 on the side of the pressing portion 430b. It is possible to prevent the situation where the plate 434 comes into contact with only a portion. 40 shows an eleventh embodiment of the present invention similar to the eighth embodiment. In the figure, the same reference numerals are assigned to the same components as those in the eighth embodiment. In this embodiment, as in the fourth embodiment of FIG. 10, the rack 430e is formed on the slider 430, and the rack 435a facing the rack 430e of the slider 430 is provided on the stator 435. It is formed, and between the slider 430 and the rack 430e, the pinion 436 which meshes with both racks 430e and 435a is provided. An operation lever 437 is fixedly installed at an end or both ends of the pinion 436. When the lever 437 is rotated by operating the lever 437, the pinion 436 moves on the rack 435a of the stator 435. While moving the slider 430 is moved. Therefore, in this embodiment, the slider 430 can be easily moved without using the jig as shown in FIG. 33 and FIG. 41 to 43 show a twelfth embodiment of the IC socket according to the present invention. Referring to this figure, the IC socket 510 of the twelfth embodiment includes a plurality of socket-shaped socket bodies 511 having a substantially rectangular outline and a plurality of rows arranged in parallel with each other along side sides of the socket bodies 511. Rotary cam 522, which is disposed along each side of the contact pins 521 and the socket body 511 and is inserted almost in half in the transverse approximately U-shaped inner space formed by the row of contact pins 521. ) Is provided. Each contact pin 521 has a base portion 521A and an arm 521B. The base portion 521A of each contact pin 521 has a lower horizontal portion 521a extending substantially vertically along the side of the socket body 511 and a socket body 511 from one end of the lower horizontal portion 521a. An inclined portion 521c extending inclined upwardly toward the inner side of and a constant flat portion 521d extending substantially horizontally from the upper end of the inclined portion 521c toward the inner side of the socket body 511. An upward contact portion for contacting a terminal (not shown) disposed on the bottom surface of the IC chip substrate 2 at one end of the base portion 521A of each contact pin 521, that is, at the tip of the second horizontal portion 521d. 521b) is formed. At the other end of the base portion 521A of each contact pin 521, that is, at the other end of the drainage horizontal portion 521a, an external connection portion 521e for electrically connecting to an external circuit board is formed. At the other end of the base portion 521A of each contact pin 521, that is, at the other end of the sewer horizontal portion 521a, an external contact portion 521e for electrically connecting to an external circuit board is formed. Moreover, the base part 521A of each contact pin 521 is provided with the leg part 521f which protrudes downward from the horizontal horizontal part 521a, and the contact pin which formed the row at each side of the socket main body 511. The slits 511a into which the leg portions 521f of 521 are inserted and the grooves 511e into which the contact portions 521b of the contact pins 521 are inserted are arranged in parallel, respectively. The contact pins 521 formed by coupling with the slits 511a and the grooves 511e are positioned with respect to the socket body 511. The arm 521B of each contact pin 521 is curved portion 521i extending upwardly and outwardly from the first horizontal portion 521a of the base portion 521A, and from an upper end of the curved portion 521i. An inclination of the base portion 521A at the tip of the horizontal portion 521g, that is, the tip of the arm 521B, having a horizontal portion 521g extending substantially parallel to the first horizontal portion 521a of the base portion 521A. An almost circular engaging portion 521h in a downwardly inclined position located substantially above the portion 521c is formed. In the center of the upper surface of the rotary cam 522 is formed a coupling groove 522a having a cross-sectional shape that fits the engaging portion 521h of the arm 521B and extending over the entire length of the rotary cam 522. have. The engaging portion 521h of the arm 521B of the row of contact pins 521 is coupled to the engaging groove 522a of the rotary motion cam 522, whereby the rotary motion cam 522 is arm 521B. Rotational movement is possible between the open position of the standing posture shown in FIG. 41 (a) and the pressurization position of the substantially horizontal posture shown in FIG. In the open position, the rotary cam 522 is retracted from the insertion region of the IC chip substrate 2, and the rotary cam 522 presses the upper and side surfaces of the IC chip substrate 2 in the pressurized position. You can do it. Further, the rotary cam 522 is provided with a first contact portion 522b which is in tight contact with the inclined portion 521c of the contact pin 521 when the rotary cam 522 is in the open position, and the rotary cam 522 is pressurized. The second contact portion 522c in contact with the inclined portion 521c of the contact pin 521 and the inclined portion 522i extending from the second contact portion 522c toward the tip of the rotational cam 522 when in the position. At the distal end of the rotary cam 522, a side contact portion 522d abuts against the side surface of the IC chip substrate 2, and a top contact portion 522e for contacting the upper surface of the IC chip substrate 2 is formed. . A plurality of ribs 522f are provided in the engaging groove 522a of the rotary motion cam 522 for regulating the arms 521B of the row of contact pins 521 at equal intervals, and each rib 522f is provided. Is disposed between the engaging portions 521h of the adjacent contact pins 521. In addition, the rotary motion cam 522 is provided with a plurality of ribs 522h for regulating the base portions 521A of the row of contact pins 521 at equal intervals, and each rib 522h has an adjacent contact pin. It is disposed between the inclined portion 521c of the base portion 521A of the 521, and is continuous on the first contact portion 522b, the second contact portion 522c, and the inclined portion 522i of the rotary motion cam 522. Is extended. Therefore, part of the rib 522h is always located between the inclined portions 521c of the adjacent contact pins 521 during the rotational motion of the rotary motion cam 522. The rib 522h is disposed at a position where the rotary cam 522 and the base portion 521A of the contact pin 521 are in tight contact, so that even if the rib 522h has a low height, You can play the role well. The rotary motion cam 522 is provided with one or a plurality of protrusion pieces 522g protruding from its tip. The protrusion piece 522g may be disposed at the center or the end of the length of the rotational cam 522. By operating the projection piece 522g with a finger, the rotation movement cam 522 can be easily rotated. Next, the operation of the IC socket of the twelfth embodiment will be described. First, as shown in FIG. 41 (a), when the rotary cam 522 is moved to the standing open position, the first contact portion 522b of the rotary cam 522 is inclined 521c of the contact pin 521. As shown in FIG. ), The rotary motion cam 522 is stably held in the open position. In the open position, the portion located on the inclined portion 522i of the rib 522h of the rotary motion cam 522 is inclined, and the insertion of the IC chip substrate 2 serves as a guide to facilitate the insertion. The IC chip substrate 2 is mounted on the contact portion 521b of the contact pin 521, and then the rotational cam 522 is rotated by operating the finger piece 522g of the rotary cam 522 with the fingers. As shown in), it rotated to approximately horizontal pressing position. In the pressurized position, the rotary motion cam 522 is clamped between the engaging groove 522a and the second contact portion 522c between the engaging portion 521h of the contact pin 521 and the inclined surface 521c. You lose. At this time, since the second contact portion 522c is located outside the coupling groove 522a, the rotary motion cam 522 is exerted a force on the arm 521B of the contact pin 521 so that the pressing portion 522e is pressed downward. All. Therefore, the IC chip substrate 2 can be pressed downward. When the IC chip substrate 2 is taken out of the socket main body 511, the operation opposite to that described above may be performed. In the twelfth embodiment, as shown in FIG. 42, the rotary motion cam 522 has a length up to both ends of the row of contact pins 521. As a general rule, as shown in FIG. 43, a plurality of divided rotary motion cams may be held in the rows of the contact pins 521. In this case, since the divided rotational motion is further facilitated, the number of contact pins 521 forming a row is suitable. As described above, in the IC socket 510 of the twelfth embodiment, the contact pin 521 can be operated by manipulating the projection piece 522g with a finger, so that special accessories such as an insertion jig and an extraction jig are unnecessary. Further, since the rotational cam 522 can rotate by the same angle over its entire length, no torsion occurs, and thus the contact pins 521 change in the same shape at both ends and the center. Therefore, the number of contact pins 521 can be increased. In addition, since the operation of the rotary cam 522 only causes or knocks down the claw 522g, even if the socket is mounted on a large substrate or a thin substrate without applying a pressing force from above, there is a fear that the substrate may bend or break. none. 44 to 48 show a thirteenth embodiment of a socket assembly according to the invention. Referring to these drawings, the chip-on-board module 1 includes a substrate 2 and circuit components 3 such as an IC chip mounted on the substrate 2 (see FIG. 44). On the bottom face of the board | substrate 2, the some pad 4 which comprises a terminal is arrange | positioned at the narrow interval along the four edges of the bottom face, respectively. The socket, denoted by reference numeral 610 as a whole, is designed to electrically connect the module 1 to the circuit board 5. The socket 610 includes a socket body or support frame 611 made of an insulating material such as synthetic resin. The support frame 611 has a generally rectangular outline so as to surround the substrate 2 of the module 1, and the support frame 611 has four rows of contact pins 612 made of metal in a rectangular shape. It is mounted to make. Each contact pin 612 has an upward contact portion 612a at one end that is in contact with the pad 4 of the module 1, and is connected to the conductive pattern 6 of the printed circuit board 5 at the other end thereof. The substrate 2 of the module 1 has a base portion 612A having a connecting portion or a lead portion 612b and an arm 612c having elasticity, and a contact portion 612a of the four rows of contact pins 612. It is possible to support the four edges of the bottom of each). The lead portion 612b of each contact pin 612 extends along the mounting surface of the circuit board 5 and is formed on the mounting surface in two sections S1 and S2 as shown in FIGS. 44 and 46. It is soldered on the conductor pattern 6 by reflow. The arm 612c of each contact pin 612 is located inside the support frame 611 and curves upwardly while curved inward of the support frame 611 from the middle of the lead portion 612b. It consists of a straight portion extending almost linearly from the top of the curved portion toward the inner side of the support frame 611. As can be seen from FIGS. 44 and 45, the space for accommodating the module 1 is limited by the tip of the straight portion of the arm 612c of the four rows of contact pins 612. The contact pin 612 also has a protrusion 612d projecting upward from the lead portion 612b on the outside of the support frame 611. A plurality of ribs 611a and 611b extending in the longitudinal direction are provided in a row on the inner side and the outer side of the support frame 611, respectively, and the curved portion and the protrusions of the arms 612c of the contact pins 612 formed in rows. 612d is detachably coupled between the adjacent ribs 611a, 611b on the inner side and the outer side of the support frame 611, respectively. As easily understood in FIG. 44, the support frame 611 is adapted to be pulled upwards from the contact pins 612 soldered to the circuit board 612. As shown in FIG. 45 and FIG. 47, the four corner parts of the support frame 611 are formed with the engaging hole 611c which opens in the upper surface. When the module 1 is mounted on the contact 612a of the contact pin 612 after the contact pins 612 are soldered onto the circuit board 5, the auto feeder is mounted when the module 1 is mounted as an automatic feeder. By positioning the positioning pins provided in the coupling holes 611c of the support frame 611, the positioning of the module 1 and the contact pins 612 can be easily performed. The socket 610 is also provided with four sliders 613 for individually pressing the edges of the upper surface of the substrate 2 of the module 1 against the contact portions 612a of the contact pins 612. The slider 613 is held between the lead portion 612b and the arm 612c of the contact pins 612 rowed inside the support frame 611, and both ends of the slider 613 are contact pins 612. It protrudes from both ends of the column. The slider 613 has a pressurizing portion 613a for pressing the short edge of the substrate 2 of the module 1. More specifically, the pressing portion 613a of the slider 613 is an upper surface pressing portion for pressing the upper surface of the substrate 2 of the module 1 and a cross section pressing portion for pressing the cross section of the substrate 2 of the module 1. consist of. The slider 613 shown in FIG. 44 is in a pressurized position to press the edge of the module 1 against the contact portion 612a of the contact pin 612 by the spring force of the arm 612c of the contact pin 612. And the slider 613 shown in FIG. 46 is in the open position, releasing the module 1 from the contact pin 612. The slider 613 is pressed along the upper surface of the lead portion 612b of the contact pin 612 by the jig (not shown) coupled to both ends thereof, and the pressing position shown in FIG. 44 and the opening shown in FIG. You can move between them. When the slider 613 is moved from the open position to the pressurized position, the arm 612c is bent upward by the slider 613 to generate a pressing force. While the slider 613 is moved from the open position to the press position, the spring force of the arm 612c gradually increases due to the top shape of the lid portion 612b and peaks just before the slider 613 reaches the press position. Then, the spring force is slightly lower than the peak value until the slider 613 reaches the pressing position. The slider 613 has an upper partition wall coupled between a plurality of lower partition walls 613b coupled between the lead portions 612b of the row of contact pins 612 and the arms 612c of the contact pins 612. 613c) is installed. These partitions 613b and 613c serve to maintain the row of contact pins 612 at predetermined intervals at all times. Each slider 613 is preferably formed of a material having poor wettability with respect to the solder, for example, polyetherimide polyphenylenesulfide, polyether sulfone, or the like. As shown in FIG. 46, the lower partition 613b of the slider 613 covers the part located upward of the soldering section S1 of the sliding section of the lower partition 613b and the contact pin 612 as a whole. Is extended. Therefore, when soldering the contact pin 612 on the circuit board 5, the molten solder can be prevented from adhering to the sliding section between the lower partition wall 613b and the contact pin 612. In the socket 610 having the above configuration, the module 1 is mounted on the contact portions 612a of the contact pins 612 in each row, and then the slider 613 is moved from the respective open position to the pressurized position. Four edges of the board | substrate 2 of (1) can be pressed against the contact part 612a of the contact pin 612 individually by the four slider 613. Therefore, one slider 613 does not need to secure a pressing force sufficient to contact the front pad 4 of the module 1 and the contact portion 612a of the front contact pin 612 with the required contact pressure. It is sufficient to secure a pressing force such that the pad 4 in one row and the contact portion 612a of the row of contact pins 612 can be contacted with a required contact pressure. Therefore, the force required for the movement operation of each slider 613 can be made small, and the operation | work of attaching and detaching a module becomes easy. In addition, since the edge of the board | substrate 2 of the module 1 is pressed with the slider 4 with respect to the contact part 612a of the contact pin 612 which forms a row, the spring force of the arm 612c of the contact pin 612 is diarrhea. Even if there is a nonuniformity, the contact pressure between the contact portions 612a of the contact pins 612 forming the heat and the pads 4 forming the heat can be made uniform, and the reliability of conduction can be improved. In addition, since the two edges 613 facing each other can press the edges of the substrate 2 of the module 1 that face each other in sequence, the upper surface of the substrate 2 of the module 1 can be pressed against the slider 613. It can be moved in the moving direction. Therefore, a wiping action can be generated between the pad 4 of the module 1 and the contact portion 612a of the contact pin 612, and the reliability of the electrical connection can be improved. In the present embodiment, the slider 613 moves from the open position to the press position while pushing the rib 612b and the arm 612c of the contact pin 612, thereby moving the contact pin 612. The arm 612c is moved upward to generate an increased spring force. Therefore, by designing the contact pins 612 and the slider 613 so that the amount of movement of the slider 613 from the open position to the press position increases, the slider 613 is opened with a light force while the arm 612c is moved upward. It is possible to move from the position, and the operability of the slider 613 becomes good. Furthermore, the support frame 611 is a circuit of the contact pin 612 so that the lead portion 612b of the contact pin 612 can be detached from the contact pin 612 after the solder portion 612b is fixed on the circuit board 5 by soldering. The contact height of the contact pin 2 itself with respect to the circuit board 5 is reduced since it is coupled with the contact pin 612 on the opposite side to the soldered portion of the substrate 5 and mounted on the contact pin 612. The mounting height with respect to the circuit board 5 of the module 1 can be made small. After the contact pins 612 are soldered onto the circuit board 5, the support frame 611 may be left on the contact pins 612, but the support frame 611 and the contact pins 612 may be subjected to elastic forces of both. Since the support frame 611 is detachable from the contact pin 612 as necessary, the support frame 611 can be removed. Accordingly, after the contact pins 612 are soldered onto the circuit board 5, the support frame 611 is pulled out of the contact pins 612, whereby the socket 610 can be further reduced in weight. Preferably, the thickness of the support frame 611 is, as shown, the height from the circuit board 5 to the upper surface of the support frame 611 is approximately the same as the height of the contact pin 612 or the contact pin 612 It is set to be lower than the height of. Thereby, even if the support frame 611 is left on the contact pin 612, the mounting height of the socket 610 can be prevented from increasing. In addition, since the contact pins 612 which form a row are soldered to the circuit board 5 in a state supported by the supporting frame 611, the workability of soldering and the positional accuracy of each contact pin 612 with respect to the circuit board 5. Can be prevented from decreasing. Moreover, since the contact pins 612 which form a row are detachably coupled between the adjacent ribs 611a and 611b in the inside and the outer side of the support frame 611, the contact pins 612 which form a row are supported by the support frame. The ribs 611a and 611b inside and outside the 611 can be fixed in the horizontal direction. Therefore, the contact pins 612 forming the heat can be soldered onto the circuit board 5 at a high position. 49 shows a fourteenth embodiment of the socket assembly according to the present invention. In the fourteenth embodiment, the material located at the upper side of the soldering section S1 in the sliding area of the lower partition wall 613b of the slider 613 and the sliding contact pin 612 has a poor wettability to soldering. In other words, the solder is covered with a material 614 that is hard to adhere. The other configuration is the same as in the thirteenth embodiment. Therefore, it is possible to prevent the solder from adhering to the sliding region of the contact pin 612 with respect to the lower partition wall 613b of the slider 613. 50 and 51 show a fifteenth embodiment of the socket assembly according to the invention. Referring to these drawings, in the socket 610 of the fifteenth embodiment, the support frame 611 is detachably mounted with a top cover 615 covering the upper surface of the module 1. Similarly to the support frame 611 of the thirteenth embodiment, four corner portions of the support frame 611 of this fifteenth embodiment are formed with engaging holes (not shown) which open to the upper surface thereof, and an upper cover 615. ), A coupling pin 615a is detachably fitted to the coupling hole of the support frame 611. In addition, the upper lid 615 has an opening for viewing and confirming the rib 615b for regulating the distance between the arms 612c of the contact pins 612 formed in a row, and the contact portion 612a of the contact pins 612 from above. 615c is formed. The other configuration is the same as that of the thirteenth embodiment. In the socket 610 of the fifteenth embodiment, the upper cover 615 covering the upper side of the module mounting area of the contact pin 612 is detachably mounted to the support frame 611 so as to be adsorbed on the upper surface of the upper cover 615. A large suction surface for the socket type feeder can be secured. Therefore, automatic supply of the socket 610 onto the circuit board 5 by the socket supply can be performed quickly. Furthermore, since the top cover 615 can be disassembled from the support frame 611 after the contact pin 612 is soldered on the circuit board 5, the module on the contact portion 612a of the contact pin 612 ( 1) can be mounted without any problem. In addition, since the support frame 611 can be left on the circuit board 5, the support frame 611 can be used to quickly and easily position the module 1 and the contact pins 612 by the component feeder. You can do it. In addition, the contact pins 612 are arranged on the circuit board in a state where the contact pins 612 formed in the row are reliably positioned by the ribs 611a and 611b of the support frame 611 and the ribs 615b of the upper cover 615. It can be soldered on (5). The upper cover 615 is formed with an opening 615c for viewing and confirming the contact portion 612a of the contact pin 612 from above. When mounting the socket 610 on the circuit board 5 with the automatic feeder, while checking the position of the contact pin 612 and the circuit board 5 with a CCD camera or the like through the opening 615c of the upper cover 615. The contact pins 612 and the circuit board 5 can be quickly positioned. 52 shows a sixteenth embodiment of the socket assembly according to the present invention. The socket of this sixteenth embodiment differs from the fifteenth embodiment in that an upper cover 615 covering the upper surface of the module 1 is integrally installed in the support frame 611. In this sixteenth embodiment, after the contact pins 612 are soldered onto the circuit board 5, the support frame 611 is taken out of the contact pins 612 together with the top cover 615. FIG. 53 shows a seventeenth embodiment of the present invention in which a change is made to the slider 613 held by the contact pins 612 in each row. In FIG. 53, the support frame is not shown. The four sliders 613 in the seventeenth embodiment are formed so that the end portions abut against each other at the pressing position. Therefore, it is possible to prevent each slider 613 from moving excessively from the open position beyond the pressurized position. The other configuration is the same as that of the thirteenth embodiment, but the support frame of the seventeenth embodiment is formed to surround the four sliders 613. The support frame in the seventeenth embodiment is the same as the thirteenth embodiment after the contact pins 612 are soldered onto the circuit board 5, or the contact portion of the contact pins 612 with the slider 613. After mounting and fixing the module 1 on the 612a, it can be taken out of the contact pin 612, but it is also possible to leave it on the contact pin 612. 54 to 57 show an eighteenth embodiment of a socket for an electrical component according to the present invention, which is suitable when the support frame is removed from the contact pin after soldering the contact pin. FIG. 54 shows a state in which the module 1 is mounted on the circuit board 5 through the socket 610 fixed on the circuit board 5, and FIG. 55 shows the contact pin 612 by soldering the circuit board. (5) shows the step of adhering. 56 shows the arrangement of the contact pins 612 and the slider 613 when the slider 613 is in the pressurized position, and FIG. 57 shows the contact pins 612 when the slider 613 is in the open position. And the arrangement configuration of the slider 613 are shown. 58 shows a metal plate 616 for manufacturing the contact pins 612 in each row. The contact pins 612 connected to each other at both ends are formed by the punching of the metal plate 616. The contact pins 612 of each row in this eighteenth embodiment are soldered onto the circuit board 5 in the inner soldering section S1 and the outer soldering section S2 as in the thirteenth embodiment, respectively, The pitch and the width of the portion of the outer soldering section S2 of 612b are larger than the pitch and the width of the contact portion 612a, respectively. The contact pins 612 of each row are formed by simultaneous punching and simultaneous bending of one metal plate 616 shown in FIG. 58, as shown in FIGS. 54 and 55. FIG. Thus, the arm 612c of the contact pin 612 extends continuously from the contact portion 612a. In the vicinity of the outer soldering section S2 of the lead portion 612b, a bent portion 612e protruding upward is formed, and a contact forming a row on the inner surface of the support frame 611 integral with the upper lid 615. A rib 611c is formed to be detachably coupled in the vertical direction with the bent portion 612e of the pin 612. In addition, the upper cover 615 is formed with a wall 615d which works together with the support frame 611 to sandwich the bent portion 612e of the contact pin 612. The sliders 613 held in the contact pins 612 in each row are formed so as to abut on each other at both ends at the pressing positions shown in FIG. 56 simultaneously with the sliders of the seventeenth embodiment. And since the top cover 615 of the eighteenth embodiment is formed integrally with the support frame 611, the support frame 611 is connected to the contact pins 612 after the contact pins 612 are soldered onto the circuit board 5. The top cover 615 is formed separately from the support frame 611 so as to leave the support frame 611 on the contact pins 612 so that the support frame 611 can be detachably mounted on the support frame 611. Alternatively, the upper cover may be omitted. In the socket 610 of the eighteenth embodiment, since the pitch and the width of the portion of the outer soldering section S2 of the lead portion 612b of the contact pin 612 in the row are larger than the pitch and width of the contact portion 612a, respectively, The contact conduction of the finely pitched module pads 4 can be performed without impairing the bonding strength between the respective contact pins 612 and the circuit board 5. In addition, since the contact pins 612 of each row are formed by simultaneous punching and simultaneous bending of one sheet of metal plate 616, contact pins 612 having different pitches and widths can be easily obtained. Furthermore, after simultaneously holding the contact pins 612 of each row formed by simultaneous bending of one sheet metal plate 616 on the support frame 611, the contact pins 612 of each row can be completely separated from each other. Manufacturing is extremely easy. The sockets of the thirteenth to eighteenth embodiments may be used for electrical connection between a circuit board and other electrical components such as a leadless IC package or a lead IC package. 59 to 66 illustrate a nineteenth embodiment of the IC socket assembly according to the present invention. Referring first to FIGS. 59 to 61, the socket body or base plate 712 of the IC socket 710 is made of synthetic resin and has a substantially square outline. The guide cylinder part 712a is provided in four corners in the base board 712, and the two through-holes 712b and the groove 712c are provided in each side of the base board 712. As shown in FIG. The IC package 1 mounted on the IC socket 710 has terminals (land or pads) 4 arranged in rows on the upper surface of the substrate 2 along each side of the substrate 2 thereof. In each side of the board | substrate 2 of the IC package 1, each terminal 4 may extend continuously along the upper surface, the side surface, and the bottom surface of the board | substrate 2. As shown in FIG. Depending on the IC package, terminals may be arranged only on two opposite sides. However, in the case where a dedicated IC socket is used for such an IC package, the terminal may be provided only on two opposite sides. As shown in FIG. 60 and FIG. 61, the base plate 712 has ribs 712d formed on both sides of the groove 712c on the upper surface thereof. The rib 712d is also formed on the inner surface side of the groove 712c and on the side surface of the base plate 712. The pair of ribs 712d is one more than the number of contact pins described later, and are arranged at predetermined intervals along each side of the base plate 712. Moreover, as shown in FIG. 59, the base plate 712 is provided with the male part 712e which regulates the four corners of the board | substrate 2 of the IC package 1. As shown in FIG. The slider 713 made of synthetic resin is attached to the base plate 712 via a contact pin described later. Although the shaft 714 made of metal is attached to the slider 713, there is no fear of abrasion or deformation due to temperature, and the shaft 714 may be formed integrally with the slider 713 by synthetic resin. As shown in FIG. 60 and FIG. 61, this slider 713 is provided with the step part 713a as a 1st position control part, the inclination part 713b as a 2nd position control part, and the engaging part 713c, Moreover, it has the flat side surface 713d. As shown in FIG. 60, the slider 713 has ribs 713e formed on its upper surface, and ribs 713e are also formed on the same cross-sectional position on its lower surface. And such a set of ribs 713e is one set more than the number of the contact pin mentioned later, and are mutually arranged at predetermined intervals along each side of the base board 712. As shown in FIG. The structure of the contact pin 715 in this embodiment is mainly explained using FIG. The attachment portion 715a of the contact pin 715 is press-fitted between two ribs 712d adjacent in the groove 712c of the base plate 712. At one end of the contact pin 715, a connection terminal 715b connected to the printed wiring board is formed, and at the other end, the substrate 2 of the IC package 1 is pressed from above and the terminal 4 of the IC package 1 is further pressed. ), A contact portion 715c is formed. The first spring 715d and the second spring 715e are formed between them, and the tip of the extension 715h extending from between the external connection terminal 715b and the first spring 715d is formed. In contact with the bottom of the substrate 2, the IC package 1 is supported. Moreover, the contact parts 715f and 715g which are separated by the engaging part 713c of the slider 713 are formed between the contact part 715c and the 2nd spring 715e. The force applied downward is substantially applied to the first spring 715d, and the force applied in the substantially left and right directions is applied to the second spring 715e. Therefore, in FIG. 60, the 1st spring 715d presses the inclination part 713b of the slider 713, and restricts the movement of the slider 713 to the left-right direction unless a special strong force is applied from the exterior. In the present embodiment, the plurality of contact pins 715 having such a configuration are provided with two adjacent ribs 712d provided on the base plate 712, respectively, and two adjacent ribs 713e provided on the slider 713. The slider 713 is attached to the base plate 712 so as to be movable in the horizontal direction. Next, with reference to FIGS. 62 and 63, an example of a jig for moving the slider 713 by external force will be described. The jig 716 shown in FIG. 62 is square in the same manner as the base plate 712 as a whole, but since the recess is at its four corners and further has the same configuration in each corner, the base plate 712 and The relationship is shown so that only one corner is shown. The jig 716 is provided with a guide pin 716a fitted to the guide cylinder portion 712a, and an operation pin 716b having an inclined cut portion at its tip. In FIG. 63, another jig 717 is shown in the same manner, and a guide pin 717a fitted to the guide cylinder portion 712a and an operation pin 717b having an inclined cut portion at the tip are provided. have. The difference between the two jigs 716 and 717 is that the inclined direction of the cut portion formed at the tip of the actuating pins 716b and 717b is in the opposite direction. That is, the operation pin 716b shown in FIG. 62 is moved downward and its tip is coupled to the shaft 714, thereby moving the shaft 714, that is, the slider 713 in the inward direction of the base plate 712, The operation pin 717b shown in FIG. 63 is made to move the shaft 714 outward of the base plate 712 on the contrary. Next, the charging operation of the IC package 1 will be described with reference to FIGS. 64, 65, and 66. 64 shows a state in which the IC package is detachable. FIG. 64 shows a state in which the IC package 1 is inserted and mounted in the accommodating portion of the IC socket. FIG. 60 shows a state of completion of loading, while FIGs. 65 and 66 show The states on the way from the state of FIG. 64 to the state of FIG. 60 are displayed in order. First, FIG. 64 shows the state in which the slider 713 has been moved to the left, and the engaging portion 713c pushes the contact portion 715f to bend the second spring 715e from its neutral position to the left to make the contact portion 715c. Is retracted to the left, and the mounting and demounting of the IC package 1 is free. As for the slider 713, since the 1st spring 715d is engaged with the step part 713a and pressed downward, positional regulation is performed by friction. Therefore, the slider 713 is not moved in the horizontal direction by the usual vibration or the like, but if necessary, a protrusion is formed on one side of the first spring 715d and the stepped portion 713a, and a recess is formed on the other side, so-called click fixing. It may be in a form. 64 shows a state in which the IC package 1 is inserted into the receiving portion by the hand or the automatic device from above and placed on the extension 715h of the contact pin 715 while the slider 713 is thus positioned. It is shown. In the state of FIG. 64, when the insertion jig 716 shown in FIG. 62 is guided by the manual or automatic machine while guiding its guide pin 716a to the guide tube portion 712a, the operating pin 716b is moved by the slider 713. The shaft 714 protruding from both ends of the side is pushed laterally. The slider 713 is thereby moved inward, i.e. toward the IC package 1 and reaches the position of FIG. In the position of FIG. 65, the engaging portion 713c of the slider 713 is in a non-pressurized state with respect to the second spring 715e, and the second spring 715e is returning to the neutral position. In addition, the contact portion 715c of the contact pin 715 is located at a position spaced upward from the upper surface of the substrate 2 of the IC package 1. When the slider 713 further moves, the first spring 715d contacts the inclined portion 713b from the step portion 713a by its spring force. 66 shows the initial state where the first spring 715d is in contact with the inclined portion 713d. In the state of FIG. 66, since the first spring 715d is moved below the position shown in FIG. 65, the contact portion 715c is arranged on the side of the upper surface of the substrate 2 of the IC package 1. ) On the other hand, the engaging portion 713c of the slider 713 is in the position in contact with the contact portion 715g, the second spring 715e is in the neutral position and the side 713c of the slider 713 is still in the IC package 1 Is not in contact with the side surface of the substrate 2. At the position shown in FIG. 66, the contact portion 715c and the extension portion 715h sandwich the substrate 2 of the IC package 1 in the vertical direction, and the contact portion 715c is placed on the substrate 2 of the IC package. Since it is in contact with the provided terminal 4, the IC package 1 and the contact pin 715 are in an electrical connection state. Therefore, at this time, the flat part of the lower end through which the 1st spring 715d passed the inclination part 713b of the slider 713 forms a 2nd position control part. If the position control force is unstable, the clip fixing may be directed as described above. In the nineteenth embodiment, the upper surface of the slider 713 is formed in two upper and lower stages via a step difference, but it is not necessary to provide such a step difference. For example, the shape of the upper surface of the slider 713 and the shape of the first spring 715d may be as shown in FIG. In this case, the recessed part 713f of the slider 713 forms a 2nd position control part. In the nineteenth embodiment, the slider 713 is further moved from the position in FIG. 66 to the right, and the position shown in FIG. 60 is moved to the pressurized position of the slider 713, that is, the fully loaded position of the IC package 1. Doing. When the slider 713 is moved further to the right from the position of FIG. 66 in this manner, the first spring 715d of the contact pin 715 falls along the inclined portion 713b of the slider 713. Therefore, the contact pressure of the contact part 715c with respect to the terminal 4 of the upper surface of the board | substrate 2 of the IC package 1 increases. In addition, since the engaging portion 713c of the slider 713 pushes the contact portion of the contact pin 715, the second spring 715e is moved while resisting its elasticity from the neutral position. For this reason, the contact part 715c of the contact pin 715 slides with respect to the surface of the terminal 4 of the upper surface of the board | substrate 2, and what is called a wiping action arises. Therefore, even in the case where an oxide film is formed on the surface of the terminal 4 or dirt is attached to the dust, it is possible to remove them to achieve a secure conduction state. In addition, the socket 710 of the nineteenth embodiment is provided with a separate means for producing a wiping effect. That is, as shown in FIG. 64, when the IC package 1 is inserted into the accommodation portion of the socket 710, the IC package 1 is rarely placed exactly on the center of the accommodation portion. When all of?) Has moved from the open position to the pressurized position shown in FIG. 60, the IC package 1 is accurately positioned in the center of the receiving portion. Accordingly, the side surface of the substrate 2 of the IC package 1 is pushed by the slider 713 and slightly moved while moving each slider 713 from the open position to the pressurized position, whereby the contact portion of the contact pin 715 is moved. Since the relative position between 715c and the terminal 4 of the IC package 1 is rubbed, a wiping effect occurs. In this way, when the slider 713 is conveyed to the pressing position shown in FIG. 60, the jig 716 is pulled upward. This completes the loading operation of the IC package 1. In this loaded state, the slider 713 is biased to the left during the 60th by the second spring 715e, but the position limiting force by the first spring 715d joined to the inclined portion 713b of the slider 713 Since the side is strong, it does not move to the left, that is, the open position in the drawing in the normal state. Next, the case where the IC package 1 is taken out from the loaded state shown in FIG. 60 will be described. A drawing jig 717 shown in FIG. 63 is used to take out the IC package 1. When the guide pin 717a is guided to the guide tube portion 712a and pushed down by a manual or automatic machine, the operation pin 717b pushes the shaft 714 and moves the shaft 714 outward in the horizontal direction. Thus, the slider 713 is moved to the left in FIG. 60. The second spring 715e follows the engaging portion 713c to the neutral position shown in FIG. 66. Thereafter, the first spring 715d rises along the inclined portion 713b, is pushed up to the stepped portion 713a, and the contact portion 715c is separated from the substrate 2 to be in a state shown in FIG. 65. . From this state, the engaging portion 713c pushes the contact portion 715f and retracts the contact portion 715c from the mounting region of the IC package 1 while tensioning the second spring 715e. After the slider 713 reaches the open position shown in FIG. 64, the jig 717 is pulled out of the IC socket 1. Thereafter, the position of the slider 713 is maintained by the force applied downward by the first spring 715d. Therefore, the IC package 1 can be taken out by manual or automatic machine. As described above, in the nineteenth embodiment, the IC package 1 is sandwiched by the contact portion 715c and the extension portion 715h of the contact pin 715 at the time of loading the IC package 1, and thus the IC package 1 ), The terminal 4 of the terminal 4 extends from the top surface of the substrate 2 to the bottom surface of the substrate 2 at the bottom surface side of the substrate 2 of the IC package 1. ) Can also be contacted. Thus, the socket 710 of the nineteenth embodiment can be applied to any type of IC package of the surface mount type. In general, as shown in FIG. 68, the bottom surface of the IC package may be received by the large portion 712f provided in the base plate 712. In addition, the contact pin 715 includes a first contact pin having an external connection terminal 715b, a first spring 715d, a second spring 715e, and a contact portion 715c, an external connection terminal 715b, and an extension 715h. It is also possible to construct two separate parts from the second contact pin with (). In the nineteenth embodiment, the slider 713 is supported by only the contact pin 715, but the extension portion 715h may be removed and the bottom surface of the slider 713 may be in contact with the base plate 712. . Moreover, there is no need to provide a large gap as shown between the engaging portion 713c of the slider 713 and the contact portions 715f, 715g of the contact pin 715, and the engaging portion 713c is concave. The contact pin 715 may have a coupling relationship between them. In the nineteenth embodiment, all of the contact pins 715 in a row are separated from each other by ribs, but an insulating layer is formed on a part of the side of the contact pins, and the contact pins are filtered out several times so that the ribs are installed or omitted. Also good. In this case, however, the slider 713 is movable in the horizontal direction, but it is preferable to provide the bearing portion on the shaft 714 so that the slider 713 does not move in the axial direction or the longitudinal direction. Next, a twentieth embodiment of the IC socket assembly according to the present invention will be described with reference to FIGS. 69 to 74. FIG. In FIG. 69, the board | substrate 2 of the IC package 1 has the contour of a forward direction, and the terminal (land or pad) is arrange | positioned along its four sides, but those illustration is abbreviate | omitted. The socket body or base plate 812 of the IC socket 810 also has a contour in the forward direction, and the configuration along its four sides is the same. The base plate 812 is made of synthetic resin. The four corners of the base plate 812 are provided with shafts 812a having slits in three directions. In some IC packages, terminals are arranged only on two opposite sides. However, in the case of using an IC socket dedicated to such an IC package, the terminal may be provided only on two opposite sides. As shown in FIG. 71, 73, and 74, the base plate 812 is provided with the long groove 812b, and the rib 812c is formed in both sides with the long groove 812b. The rib 812c is also formed on the side of the long groove 812b and on the side of the base plate 812. The pair of ribs 812c is one pair larger than the number of contact pins described later, and are arranged at predetermined intervals along the side of the base plate 812. The working shaft member 813 made of synthetic resin is attached to the base plate 812 via a plurality of contact pins described later. However, the bearing part may be provided in the base plate 812. Arms 813a are provided at both ends of the working shaft member. Moreover, two projections 813b and 813c are provided in the circumferential surface thereof, and it can be joined to this contact pin in order to operate the contact pin mentioned later in a recessed part. In addition, ribs 813d are formed in the working shaft member 813 more than the number of contact pins described later along a portion of the periphery thereof. The contact pin 814 is press-fitted and attached to the base plate 812 so that the attachment portion 814a enters between adjacent ribs 812c provided on the side of the long groove 812b. The contact pin 814 has a base portion 814A, and at one end of the base portion 814A, a contact portion which presses the substrate 2 of the IC package 1 from above and contacts a terminal (not shown) ( 814c is formed, and an external connection terminal 814b connected to the printed wiring board is formed at the other end of the base portion 814A. Further, the contact pins 814 are continuously formed integrally with the base portion 814d, the second spring 814e is formed integrally with the contact portion 814A, and the second sputtering portion 814e forms the contact portion 814c. The force is applied in the direction. Moreover, the extension part 814f which protrudes from between the external connection terminal 814b and the 2nd spring 814e is in contact with the operation shaft member 813 from below, and the front-end | tip is the board | substrate 2 in FIG. The IC package 1 is supported by contacting the bottom surface. Moreover, the concave portion between the projections 813b and 813c formed as the engaging portion of the working shaft member 813 is formed between the contact portion 814c and the first spring 814d as the projection 814g as the engaging portion. Can be joined at In this embodiment, a plurality of contact pins 814 having such a configuration are disposed between adjacent ribs 812c provided on the base plate 812 and between adjacent ribs 813d provided on the operating shaft member 813. It is attached to the base plate 812 is rotatably attached to the operating shaft member 813 with respect to the base plate. As can be seen from FIG. 70, the cover 815 has a through hole 815a protruding the large diameter portion and the small diameter portion, and is attached to the base plate 812 so that the shaft 812a is press-fitted from the small diameter portion to be penetrated. It is. Moreover, the cover 815 is provided with the operation part 815b for pushing the arm 813a to rotate the operation shaft member 813. Moreover, the coil spring 816 which supported one end to the base plate 812 and the other end to the working shaft member 813 is wound by the working shaft member 813, and the working shaft member 813 is clockwise rotated in FIG. Force to rotate In FIG. 70, the state which pushed down the cover 815 while displaying the force of this coil spring 816 is shown. Next, the loading operation of the IC package 1 in the present embodiment will be described. 74 shows an open state in which the IC package can be removed. This open state is a state in which the operating shaft member 813 is rotated while supporting the force of the coil spring 816 by pushing down the cover 815 and pressing the arm 813a by the operation unit 815b. At this time, the first spring 814d of the contact pin 814 is formed by the protrusion 814g being pushed to the left by the protrusion 813b and also between the base of the protrusion 813b, that is, between the protrusions 813b and 813c. It is in the state pushed upward from the recessed bottom part. Therefore, the contact portion 814c is evacuated to a position where the IC package 1 can be mounted and detached. In this state, in order to put the IC package 1 into the loaded state, the pressing force by the cover 815 may be released. Accordingly, the working shaft member 813 rotates clockwise by the restoring force of the coil spring 816 and the first spring 814d of the contact pin, and the projection 813b of the working shaft member moves in the lower right direction. In the process, when the second spring 814e moves the protrusion 814g downward, and the first spring 814d reaches an approximately neutral point where the elasticity becomes inelastic, the contact portion 814c is connected to the IC package 1. It reaches on the terminal surface which is not shown in the board | substrate 2 of this, and is connected to this terminal surface by the action of the 2nd spring 814e. The working shaft member 813 rotates clockwise in this state. Accordingly, this time, the projection 813c is joined to the projection 814g, and the first spring 814d is tensioned and pushed in the opposite direction from the neutral position. Therefore, in the process, when the contact part 814c slides the terminal surface of the board | substrate 2, and an oxide film is formed or a dirt adheres, it is made to friction and eliminates it, and conducive to good conductivity. This action is commonly referred to as wiping. Then, the projection 813b engages with the side surface of the substrate 2 and enters the loaded state shown in FIG. By the way, as shown in FIG. 74, when IC package 1 is mounted on extension part 814f of contact pin 814, IC package 1 may not be mounted in the above position. Therefore, when the projection 813b is joined to the side surface of the board | substrate 2, any one of the operation shaft members arrange | positioned at the IC socket 4 sides, respectively, pushes the IC package 1. Therefore, the projection 813b performs positioning of the IC package 1 in the horizontal direction and also contributes to the wiping. When the IC package is replaced from the state of FIG. 71, the cover 815 may be pressed. In that case, the operation opposite to the above description is performed, and the projection 814g first follows the projection 813c to the neutral position of the first spring 814d. Thereafter, the projections 813b are joined to each other, and the first spring 814d is moved to the upper left while being tense to reach FIG. 74. From this state, the IC package 1 is taken out from the accommodation portion by a hand or a mechanical mechanism. When the next IC package is not mounted, the surface arm 813a further rotates the pressing force of the cover 815 from the position of FIG. 71 and stops at the position supported by the operation portion 815b. In the twentieth embodiment, the cover 815 is provided. However, as shown in FIG. 71, the presence of the cover 815 causes the height value of the entire IC socket 810 to be significantly increased. This is a significant loss in space when arranging a plurality of printed wiring boards connected with the IC socket 810 in various devices. For this reason, it is also possible to remove such cover 815. In this case, in order to restrict the rotation of the operating shaft member 813 by the coil spring 816, the restricting means is set so that the angle position of the arm 813a in FIG. 71 is preferably 30 degrees or less, and the base plate ( 812). Therefore, in that case, the IC package can be attached or detached using a jig corresponding to the cover 815 instead of the cover 815. In addition, when the horizontal distance from the contact position with the arm 813a of the operation part 815b of the cover to the center of rotation of the operating shaft member 813 is increased, the force for pushing down the cover 815 by the principle of lever is at least do. In the twentieth embodiment, the contact position with the arm 813a of the operation portion 815b of the cover is located in the upper direction of the position where the upper surface of the base plate 812 and the contact pin 814 are in contact with each other. Since the cover 815 is guided to the shaft 812a and pushed down vertically with respect to the upper surface of the base plate 812, the contact pin 814 has a base plate ( Only the force pushed vertically to the upper surface of the 812 is applied, and there is no force in the other direction. For this reason, the strength of the base plate 812 and the force for supporting the contact pin 814 do not have to be as strong as compared with arranging the contact position with the arm 813a of the operation portion 815b of the cover to another position. The plate 812 can be thinned. In particular, since the base plate 812 is thinner in the bottom portion of the long groove 812b, the strength is lowered, and thus it is preferable to set the contact position with the arm 813a of the operation portion 815b of the cover as in the twentieth embodiment. In the twentieth embodiment, the number of the ribs 813d is larger than the number of the contact pins 814 in the working shaft member 813, but the contact pins 814 are formed on some side surfaces thereof. It is also possible to install the rib 813d by several contact pins 814, and in some cases it may be possible not to install at all, but in such a case, the bearing of the operating shaft member 813 is attached to the base plate 812. It is necessary. In addition, the contact pin 814 includes a first contact pin having an external connection terminal 814b, a first spring 814d, a second spring 814e, and a contact portion 814c, an external connection terminal 814b, and an extension portion ( It is also possible to configure two parts independent of the second contact pin with 814f). In the twentieth embodiment, the IC package 1 is sandwiched between the ends of the contact portion 814c and the extension portion 814f, so that the bottom surface of the IC package 1 has a terminal surface or the terminal surface is placed downward. It can be used even if it is loaded, and of course, it can be used for IC packages with both sides of the conductive surface, and any surface-mount IC package can be applied. In this case, wiping by the distal end of the extension portion 814f is performed by moving the IC package 1 in the horizontal direction as the projection 813c of the operating shaft member as described above. In addition, this invention is not limited only to such a structure, As shown in FIG. 75, the large part 812e and the contact part 814c provided in the base board 812 may also clamp the IC package 1, as shown in FIG. . In the twentieth embodiment, the first and second springs 814d and 814e are provided with different contact directions in each of the contact pins 814, but the force acts in the lower right direction in FIG. It may be formed by a single spring. Next, an IC socket according to a twenty-first embodiment of the present invention will be described with reference to FIGS. 76 and 77. FIG. FIG. 76 is a cross sectional view showing an open state in which the IC package 1 can be removed in the same manner as in FIG. 74 used in the description of the twentieth embodiment, and FIG. 77 is a cross sectional view showing a state in which the IC package has been loaded in the same way as in FIG. . In the drawings, the same reference numerals are used for the same components as those shown in the twentieth embodiment. Therefore, description of the structure regarding them is abbreviate | omitted. The difference from the twentieth embodiment in the twenty-first embodiment is that the engaging portions formed in the operating shaft member 813 and the contact pin 814 are formed in the opposite relationship. That is, one projection 813e is provided in the working shaft member 813, and two projections 814h and 814i are provided in the contact pin 814, and their concave shape relationship is reversed. . As shown in FIG. 76, when the IC socket 810 is in the open state, the first spring 814d of the contact pin 814 is pushed from side to side by the protrusion 813e and the protrusion 814h. ) Is pushed upward by the peripheral surface of the working shaft member 813. In this state, when the pressing force of the cover 815 is released and the operating shaft member 813 rotates clockwise, the projection 814i follows the projection 813e while being engaged. And the contact part 814c contacts the terminal surface provided in the board | substrate 2 of the IC package 1 in the substantially neutral position of the elasticity of the 1st spring 814d. The operating shaft member 813 rotates clockwise again from this state. The projection 813e is thereby engaged with the projection 814h, and the first spring 814d pushes the projection 814h while tightening. Thus, the above wiping is performed, and after that, the state of FIG. 77 is stopped and at the same time, the contact portion 814c is pressed against the IC package 1 by the action of the second spring 814e. In the state where the IC package shown in FIG. 77 is fully loaded, the arm 813a is positioned at the position where the rotation is prevented by the operation unit 815b. However, such an operation cannot be performed. Therefore, in the present embodiment, the position where the rib 813d is joined to the side surface of the substrate 2 is appropriately set to the loading completion position, but it is not particularly necessary to do so, and as described above, the base plate 812 A restriction means may be provided. The operation is carried out by pushing down the operation cover 815 at the time of replacement of the IC package. However, as can be seen from the description of the twentieth embodiment, the operation is performed in the opposite manner to the case of the loading operation, and thus the description thereof is omitted. The configuration and operation other than the above description regarding the twenty-first embodiment are the same as in the twentieth embodiment. As described above, in the twentieth and twenty-first embodiments, the engagement portion of one of the actuating shaft member and the contact pin is in the form of a block, and the other is concave, and by Since the engagement is performed two times in sequence, the contacts are folded into the IC package by one junction, and wiping by the contacts is performed by the other junction. Therefore, the IC package can be loaded in a state where the conductivity is good.

According to the present invention, no excessive stress is applied to the electrical component or the circuit board, and the electrical component can be easily detachably attached to the electrical component, and further, the non-uniformity of the electrical contact with the terminals of the electrical component can be prevented. A socket assembly is also provided. Further, according to the present invention, there is provided a socket assembly capable of reliably making an electrical connection with a terminal of an electrical component. In addition, the present invention can cope with narrowing of the terminal pitch of the electrical component. A socket assembly is provided.

Claims (52)

A socket assembly for receiving an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, A socket body having a generally rectangular outline, Arranged in a row in parallel along at least mutually opposite sides of the socket body, each having an upward contact portion for contacting the terminal of the electrical component at one end thereof, and connecting the printed circuit board at the other end thereof; A plurality of flat contact pins having a base portion having a connecting portion for extending and an arm extending upwardly bent from the base portion, The base portion of the contact pins, each of which is formed in the row, and an open position for receiving the electrical component, the pressure of the arm being pushed by the resilient force of the arm, and the terminal of the electrical component being contacted. And a plurality of sliders capable of moving between a pressing position for pressing the contact portion of the pin. The socket assembly of claim 1, wherein the slider has an upper surface portion for pressing the upper surface of the electrical component and a side pressing portion for pressing the side surface of the electrical component. The contact pin according to claim 1, wherein the slider has a top surface in sliding contact with the arms of the row of contact pins and a bottom surface in sliding contact with the base portion, and the top and bottom surfaces of the slider respectively have a row of contact pins. And a plurality of ribs slidably fitted between the arms and the base portion, respectively, in a row. The socket assembly according to claim 1, wherein the socket assembly has jig guide means for guiding a jig in a vertical direction to move the slider coupled to both ends of the slider between the open position and the pressurized position. 5. The jig guide means according to claim 4, wherein the jig guide means has a guide hole formed at four corners of the socket body, and a guide groove hole adjacent to the guide hole and formed along both ends of the row of contact pins, both ends of the slider. And a pin positioned above the guide groove hole, the jig includes a guide pillar inserted into the guide hole and a leg portion inserted into the guide groove hole, and an inward or outward inclined surface is formed at the tip of the leg portion. Socket assembly. The socket assembly according to claim 1, wherein a plurality of ribs are formed in rows on the at least opposite sides of the socket body, the ribs being fitted between the base portions of the row of contact pins, respectively. According to claim 1 or 6, The at least opposite sides of the socket body is formed with a coupling groove extending along the row of the contact pins, The base portion of the row of contact pins formed in the coupling grooves A socket assembly having a protrusion formed therein. A socket assembly for receiving an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, A socket body having a generally rectangular outline, Arranged in a row in parallel along at least opposite sides of the socket body, each having an upward contact portion for contacting the terminal of the electrical component at one end thereof, and connecting the printed circuit board at the other end thereof; A plurality of flat contact pins having a base portion having a connecting portion for supporting the arm, and an arm extending upwardly curved from the base portion; And a plurality of sliders each disposed along the at least mutually opposite sides of the socket body, wherein each of the sliders is positioned above the base portion of the row of contact pins and the arms; An movable position capable of moving between an open position for accommodating a component and a press position for pressing the electrical component by the elastic force of the arm to press the terminal of the electrical component to the contact portion of the contact pin. And a stator located between the base portion and the arm of the rowed contact pins and fixed to the base portion, and a driver coupled to the mover and an opposing surface of the stator. The chair may rotate to move the mover between the open position and the pressurized position. Socket assembly. The socket assembly according to claim 8, wherein the stator of the slider has an upper surface pressing portion for pressing the upper surface of the electrical component, and a side pressing portion for pressing the side surface of the electrical component. 9. The stator of claim 8, wherein the stator of the slider has a top surface in sliding contact with the arms of the row of contact pins and a bottom surface in sliding contact with the base portion, wherein the top surface of the stator includes the row of contact pins. A socket assembly in which a plurality of ribs each slidably fitted between the arms are formed in a row. 9. The socket assembly of claim 8, wherein both ends of the driver are provided with levers for rotating the drive pinion. 9. The socket assembly of claim 8 wherein the driver is a pinion that engages a rack formed on opposite surfaces of the mover and the stator. A socket assembly for receiving an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, A socket body having a generally rectangular outline, The socket bodies are arranged in a row in parallel along at least opposite sides of the socket body, and each has an upward contact portion for contacting the terminals of the electrical component at one end, and is connected to the printed circuit board at the other end. A plurality of flat contact pins each having a base portion having a connecting portion to be formed, and an arm extending upwardly bent from the base portion; Each of the contact pins is supported by the base portion and the arm, and the open position for accommodating the electrical component and the elastic force of the arm presses the electrical component to connect the terminals of the electrical component to the contact pin. A plurality of sliders movable between the pressing positions to be pressed against the contact portions of Each of the sliders has one end for pressing the electrical component and the other end thereof on the opposite side thereof, and a plurality of arm insertion holes are formed at the other end side of the slider for accommodating the tip end of the arms of the row of contact pins. And a top surface of a slider covering the arms of the rowed contact pins. 14. The upper surface of the base portion near the contact portion of the contact pin is formed with a recess for lowering the slider reaching the vicinity of the pressing position, wherein the arm of the contact pin has the slider at the recess. And a distal end thereof inclined downwardly toward the contact portion so that the spring force applied to the slider increases as it approaches. The socket assembly according to claim 13, wherein an end portion formed at one end of the slider is in contact with a side surface and an upper surface of the electrical component. The slider according to claim 13, wherein the slider has an upper layer portion along an upper surface of the tip of the arm of the contact pin and a lower layer portion along a lower surface of the arm, and the upper layer portion of the slider faces the other end side of the slider. It extends longer than the said lower layer part, The said arm insertion hole of the said slider is opened in the cross section of the said lower layer part, The arm guide groove which is continuous with each said arm insertion hole is formed in the lower surface of the said upper layer part of the said slider. Socket assembly. The socket assembly of claim 13, wherein the slider has a sliding contact projecting from the bottom surface of the one end thereof, and only the sliding contact portion of the slider is in sliding contact with an upper surface of the base portion of the contact pin. The socket assembly of claim 13, wherein a guide rib is formed on a lower surface of the slider to be slidably coupled between the base portions of the row of contact pins. A socket assembly for receiving an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, With the socket body, A plurality of contact pins provided on the socket body and arranged in parallel along at least one side of the socket body, each of the contact pins each having a contact portion for contacting the terminal of the electrical component; Disposed along at least one side of the socket body and movable between an open position for receiving the electrical component and a pressing position for pressing the component to press-contact the terminal of the electrical component to the contact portion of the contact pin; With the slider, A spring means disposed along at least one side of the socket body and providing a pressing force to the slider with respect to the slider, The row of contact pins has a bent portion protruding to one side thereof, the slider has a pressing portion for pressing the upper surface of the electrical component, a plurality of couplers that can be coupled to the bending portion, and the pressing portion of the slider Reaching the top surface of the electrical component from an open position retracted from the top surface of the electrical component, and then passing through the bend with the coupler elastically displacing the contact pin laterally while further advancing along the top surface, thereby And sliding the contact portion with respect to the terminal of the electrical component. 20. The socket assembly of claim 19, wherein the coupler of the slider is disposed on both sides of each of the contact pins. 20. The socket assembly of claim 19, wherein the bent portion of each contact pin alternately protrudes in the opposite direction in the arrangement order of the contact pins. 20. The socket assembly according to claim 19, wherein each of the contact pins is provided with a support portion extending downward from between the contact portion and the bent portion and having a lower end supported by the socket body. A socket assembly for receiving an electrical component having a plurality of terminals and for electrically connecting the electrical component to a printed circuit board, A socket body having a generally rectangular outline, The socket bodies are arranged in a row in parallel along at least opposite sides of the socket body, and each has an upward contact portion for contacting the terminals of the electrical component at one end thereof, and is connected to the printed circuit board at the other end thereof. A plurality of flat contact pins each having a base portion having a connecting portion to be connected to the base portion, and an arm which is bent upwardly from the base portion and extended; A rotary motion cam, each supported by the leading end of the arm of the rowed contact pins, capable of a rotary motion between an upright position and an approximately horizontal position, The rotary motion cam retracts from the insertion region of the electrical component when in the standing state, and presses the electrical component by the elastic force of the arm of the contact pin when in the horizontal state to close the terminal of the electrical component. And a socket assembly adapted to squeeze said contacts in a columned contact pin. 24. The horizontal contact cam according to claim 23, wherein the rotary cam has a standing contact portion contacting the upper surface of the base portion of the contact pin in the standing state, and a horizontal contact portion contacting the upper surface of the base portion of the contact pin in the horizontal state. The elastic force of the arm of the contact pin is imparted to the rotational cam from the tip of the arm in a direction orthogonal to the contact portion when standing, and the distance from the horizontal contact to the electrical component is the tip of the arm. A socket assembly greater than the distance from the electrical component to the electrical component. 24. The socket assembly according to claim 23, wherein said rotary motion cam is provided with a leading piece for rotating said rotary motion cam. A socket assembly for receiving an electrical component having a plurality of terminals and for electrically connecting the electrical component to a conductor pattern on a printed circuit board, A support frame having a generally rectangular outline surrounding the periphery of the electrical component, The socket bodies are arranged in a row in parallel along at least opposite sides of the socket body, and each has an upward contact portion for contacting the terminal of the electrical component at one end and the conductor pattern of the printed circuit board at the other end; A plurality of flat contact pins having a base portion having a connecting portion for connecting with the base portion, an arm which is bent upwardly and extended from the base portion, The base part of each of the contact pins formed in the row and the open position for accommodating the electrical component are supported by the arm, and the elastic force of the arm presses the electrical component to contact the terminal of the electrical component. And a plurality of sliders that are movable between pressurized positions pressed against the contact portions of the pins, The contact pin is detachably coupled to the support frame such that the support frame can be detached from the contact pin after the contact portion of the contact pin is connected to the conductor pattern of the circuit board by soldering. Socket assembly. 27. The support pin according to claim 26, wherein a plurality of ribs are arranged in rows on the inner side and the outer side of the support frame, and the row of contact pins are detachable between the ribs adjacent to each other on the inner side and the outer side of the support frame. The socket assembly to be coupled. 27. The socket assembly of claim 26 wherein the support frame is removably mounted with a top cover that covers the top surface of the electrical component. 29. The socket assembly of claim 26, 27 or 28, wherein an upper surface of the support frame with respect to the circuit board has the same height as the contact pin and a height lower than the contact pin. 27. The socket assembly of claim 26, wherein the support frame is integrally provided with a top cover covering an upper surface of the electrical component. 27. The socket assembly of claim 26, wherein said row of contact pins are arranged in a rectangular shape, and said slider retained in said row of contact pins is formed such that end portions abut against each other in a pressing position. 31. The socket according to claim 28 or 30, wherein the cover is provided with a rib for restricting a gap between the arms of the rowed contact pins and an opening for viewing and confirming the contact portion of the contact pins from above. Assembly. 27. The socket assembly of claim 26, wherein each of the sliders is formed with a partition wall for regulating the spacing of the row of contact pins. 34. The soldering section of claim 33, wherein each of the sliders is formed of a material having poor wettability with respect to solder, and at least a part of the partition walls of each of the sliders is formed in a solder section of the sliding region of the contact pin with respect to the partition walls of the sliders. The socket assembly is formed to cover the section located above. 35. The socket assembly according to claim 34, wherein a section located above a solder section in a sliding area of the contact pin sliding with the partition wall of the slider is coated with a material having poor wettability to solder. 27. The socket assembly of claim 26, wherein the pitch and width of at least a portion of the contact portions of the rowed contact pins are respectively greater than the pitch and width of the contact portions. The socket assembly according to claim 26 or 36, wherein the contact pins in the respective rows are formed by simultaneous punching and simultaneous bending of a single conductive plate. One end has an external connection terminal and the other end has a contact portion capable of contacting the terminal of the electrical component when the electrical component is loaded, between them a first spring on the side of the external connection terminal and a second spring on the contact portion. A plurality of contact pins which are formed on the base plate and are insulated from each other on the base plate; At the releasable position and the reload position of the electrical component, the second spring has a first position regulating portion and a second position regulating portion which are in contact with the first spring and are regulated by their applied force, respectively. A socket assembly having a slide member having an engaging portion for moving the contact portion to the releasable position by pushing in the direction of the first spring from the elastic neutral position. 39. The device of claim 38, wherein the biasing force of the first spring acts in an approximately up and down direction of the loaded electrical component, and the biasing force of the second spring acts in an approximately lateral direction of the electrical component. And the engaging portion pushes the second spring in its second direction from its neutral position upon loading of the electrical component such that the contact portion slides into contact with the terminal of the electrical component. 39. The socket assembly of claim 38 wherein the slide member allows pushing the side of the electrical component upon loading the electrical component. 39. The socket assembly according to claim 38, wherein an extension portion protrudes from between the external connection terminal and the first spring, and the slide member is pinched from the vertical direction so as to be movable laterally by the first spring. 42. The terminal of claim 41, wherein at the loading position of the electrical component, the electrical component is pinched from the up-down direction at the distal end of the contact portion and the extension portion, and at least one of the contact portion and the distal end portion is electrically connected to the electrical component. Lohan socket assembly. 39. The socket assembly according to claim 38, wherein the slide member has coupling portions provided at both ends in a direction orthogonal to its moving direction, and the slide member is moved through the coupling portion by an external device. 39. The socket assembly of claim 38 wherein the slide member includes a plurality of ribs and the row of contact pins are insulated from each other by the ribs. A plurality of contact pins formed on the base plate by a spring formed between the contact portion and the external connection terminal which can contact the terminals of the loaded electrical component, and a coupling portion formed between the contact portion and the spring; And an actuating shaft member having an arm at least at one end thereof, and an engaging portion to which the respective contact pins engage the engaging portion is formed on the circumferential surface thereof and is disposed along the parallel direction of the contact pin and to which rotational force is applied by a spring member. And one of the engaging portion of the contact pin and the engaging portion of the actuating shaft member is formed in a block shape and the other is concave, so that the actuating shaft member is moved in two directions with respect to the contact pin. The couplings are made in sequence, and the one side of the contact to fold the contact with respect to the electrical component And the other coupling to slide the contact with respect to the electrical component upon loading. 46. The socket assembly of claim 45, wherein the engaging portion of the operating shaft member is concave, and the engaging portion pushes the side of the electrical component when the electrical component is loaded. 46. The socket assembly of claim 45, wherein the contact pin has an elongate portion protruding from between the external connection terminal and the spring portion, and the operating shaft member is fitted by the engaging portion and the elongate portion of the contact pin. . 48. The socket assembly of claim 47, wherein the electrical component is pinched by the distal end of the contact portion and the elongate portion at a loaded position, and at least one of the contact portion and the distal end serves as an electrically conductive terminal with the electrical component. 46. A socket assembly according to claim 45, wherein said spring comprises a first spring provided on said contact portion side and a second spring provided on said external connection terminal side. 46. The socket assembly of claim 45, wherein the actuating shaft member is provided with a plurality of ribs, and the contact pins are each isolated by the ribs. 46. The socket assembly according to claim 45, wherein means for regulating rotation of said working shaft member by said spring member at a predetermined angular position is provided in said base plate. 46. The socket assembly of claim 45, wherein a cover member attached to the base plate so as to be movable up and down allows the operating shaft member to rotate while supporting the force of the spring member through the arm.