JP4098270B2 - Socket for semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device socket capable of detachably housing a semiconductor device mounted on a predetermined wiring board.

  A semiconductor device (hereinafter also referred to as a semiconductor device), which is one of semiconductor-related parts, is generally mounted on a wiring board such as a liquid crystal display device via a socket for a semiconductor device. The semiconductor device socket has a housing portion in which, for example, an SOP (Small Outline Package) type semiconductor device is positioned and housed as the semiconductor device, and is called a so-called mounting socket. For example, as disclosed in Patent Document 1, the mounting socket is provided on a printed wiring board having an input / output unit for supplying a predetermined signal and transmitting a signal from the semiconductor device. The mounting socket has the above-described housing portion, and a socket body portion that has a contact terminal group provided in the housing portion and is fixed at a predetermined position on the printed wiring board, and is detachable from the socket body portion, The main element includes a cover member having a pressing portion that presses the tip of each lead terminal of the accommodated semiconductor device so as to contact the contact portion of each contact terminal.

  The cover member has, for example, a plurality of hook-shaped claw portions on the outer peripheral portions of both side surface portions. Further, the socket main body portion has a notch portion through which the claw portion of the cover member passes when the cover member is mounted, and an engaged portion to which the claw portion that has passed through the notch portion is engaged with each other. Are provided on the inner peripheral portion of each side surface portion.

In such a configuration, when the semiconductor device is mounted in the housing portion of the socket body, first, the semiconductor device is positioned and arranged in the housing portion of the socket body. At that time, the tip of each lead terminal of the semiconductor device is in contact with the contact portion of the contact terminal arranged outside the housing portion through each slit formed at a predetermined interval in the wall portion forming the housing portion. . Next, after the claw portion of the cover member disposed above the semiconductor device passes through the notch portion of the socket body portion, the pressing portion of the cover member is brought into contact with each lead terminal of the semiconductor device with a predetermined pressure. It can be moved in the terminal arrangement direction. Thereby, the nail | claw part of a cover member will be engaged with the to-be-engaged part of a socket main-body part.
Therefore, by holding the cover member on the socket body, the semiconductor device is held in the housing portion of the socket body portion, and the terminals of the semiconductor device are electrically connected to the contact terminals.

JP-A-8-185946

  As described above, when the pressing portion of the cover member is moved in the arrangement direction of the lead terminals while being brought into contact with each lead terminal of the semiconductor device with a predetermined pressure, the partition wall forming the slit and the outer peripheral portion of each lead terminal Since there is a gap between them, the tips of some of the lead terminals of the semiconductor device may be bent in the direction in which the lead terminals are arranged.

  In such a case, when the semiconductor device to be attached / detached is, for example, a memory element or the like in which internal data can be rewritten, there is a problem that the semiconductor device cannot be reused because the lead terminals are bent in the arrangement direction. .

  In view of the above problems, the present invention is a socket for a semiconductor device capable of detachably storing a semiconductor device mounted on a predetermined wiring board, and the terminal of the semiconductor device mounted when the semiconductor device is attached / detached An object of the present invention is to provide a socket for a semiconductor device capable of avoiding a situation where the wire is bent.

In order to achieve the above-described object, a socket for a semiconductor device according to the present invention is arranged in a socket body having a housing portion that detachably houses a semiconductor device, and a housing portion of the socket body, and is electrically connected to a terminal of the semiconductor device. A plurality of contact terminals each having an elastically displaceable contact part and a movable piece part for moving the contact part up and down, and slidably arranged so as to be close to or separated from the housing part of the socket body. A first pressing surface that has a guide portion having a predetermined gradient at a peripheral edge of the slit that faces the contact terminal and is formed along the sliding direction, and presses or guides the distal end portion of the movable piece portion; A slide cover member that is formed adjacent to the pressing surface and has a second pressing surface that clamps or releases the terminal of the semiconductor device in cooperation with the tip of the contact portion. However, when the semiconductor device is placed close to the housing portion, the tip of the movable piece of the contact terminal is guided and lifted by the guide portion, and the contact portion of the semiconductor device is raised as the movable piece rises. The terminal of the semiconductor device is sandwiched between the second pressing surface and the tip of the contact portion by being raised together with the terminal.

As is apparent from the above description, according to the socket for a semiconductor device according to the present invention, when the slide cover member is brought close to the housing portion on which the semiconductor device is mounted, the tip of the movable piece portion of the contact terminal is The guide part is raised by being guided by the guide part, and the contact part is raised together with the terminal of the semiconductor device as the movable piece part is raised, so that the terminal of the semiconductor device becomes the second pressing surface and the tip part of the contact part. because it is held between no possibility that the terminal of the semiconductor device is bent along the arrangement direction, therefore, when the detachable, can avoid a situation where terminals of the mounted semiconductor device is bent.

FIG. 2 schematically shows an appearance of an example of a socket for a semiconductor device according to the present invention.
2A and 2B, the socket for a semiconductor device includes a socket body 10 having a housing portion 10A for housing a semiconductor device 14 as shown in FIGS. 9A and 9B, which will be described later, and each of the semiconductor devices 14 housed. The lead terminals of the semiconductor device 14 are electrically connected to a pair of slide cover members 12R and 12L that selectively press or release the lead terminals against the contact portions of the contact terminals described later, and a conductor layer of a wiring board (not shown). A plurality of contact terminals 16ai (i = 1 to n, n is 70, for example) connected as a main element.

  For example, as shown in FIGS. 9A and 9B, the semiconductor device 14 is formed as an SOP (Small Outline Package) type, and has, for example, 35 gull-wing-type on each side surface in the longitudinal direction. Lead terminals 14ai (i = 1 to n, n is 70, for example) are provided. Only the maximum value of the width dimension WB of the outer periphery of the package of the semiconductor device 14 is standardized to a predetermined value. Further, the tolerance of the width dimension WB of the outer periphery of the package of the semiconductor device 14 and the tolerance of the distance WL between the tips of the lead terminals 14ai of the semiconductor device 14 are set to predetermined values. Further, the distance P between the centers of the adjacent lead terminals 14ai is set as the lead pitch e. Each side surface of the package of the semiconductor device 14 has a predetermined gradient with respect to a straight line orthogonal to the flat surface. The maximum value of the package thickness T is standardized.

  The tolerance of the bending allowance BL of the contact portion of the gull-wing lead terminal 14ai and the tolerance of the height H from the contact portion of the lead terminal 14ai to the base end of the lead terminal 14ai are set to predetermined values.

  Since the pair of slide cover members 12R and 12L have the same structure, the cover member 12L will be described, and the description of the cover member 12R will be omitted.

  The substantially rectangular parallelepiped cover member 12L is made of, for example, a resin material, and is supported so as to be slidable, that is, in contact with and slide in a width direction of the socket body 10 described later. As shown in FIGS. 4 and 5, the cover member 12 </ b> L has a sliding contact surface at the lower end portion that is in sliding contact with the base of the socket body 10, that is, in a sliding state. Further, the cover member 12L has slits 12Si (i = 1 to n, n is, for example, 35) at positions facing each contact terminal 16ai described later at a predetermined interval at a part of the lower end portion thereof. Yes. Each slit 12Si is formed so as to penetrate between the adjacent partition walls PW so as to communicate the accommodating portion side, which will be described later, and the outside, and to open to the sliding contact surface. As shown in FIG. 5, a first pressing surface 12PS1 that presses while sliding in contact with a movable piece portion 16D of a contact terminal 16ai to be described later is provided at a portion where the opposing partition walls PW forming the slit 12Si are connected to each other. And a second pressing surface 12PS2 which is formed flat adjacent to the first pressing surface 12PS1 and presses while being in sliding contact with the contact portion 16C of the contact terminal 16ai or the lead terminal 14ai.

As shown in FIG. 5, the first pressing surface 12PS1 protrudes toward the base of the socket body 10, and includes a first slope portion SA having a predetermined slope that is inclined downward to the right, and a first slope surface. And a second slope portion SB that is formed continuously with the portion SA and has a predetermined slope that rises diagonally to the right. The slope of the second slope SB is set to be larger than the slope of the first slope SA. The slope of the second slope SB may be substantially the same as the slope of the first slope SA without being limited to such an example.
As a result, a portion where one end of the second inclined surface portion SB and one end of the first inclined surface portion SA are connected forms the top of the first pressing surface 12PS1 in the vicinity of one end portion.

  The upper portion of the slide cover member 12L has a predetermined interval along its longitudinal direction, for example, every five slits 12Si, that is, between the fifth slit 12Si and the sixth slit 12Si from one end. Recesses 12Ri (where i = 1 to n, n is a positive integer) are formed in the corresponding partition wall PW, and one end of the recess 12Ri is open toward the accommodation portion side, and will be described later. It is engaged with the end of the partition wall on the side wall forming part of 10A.

  At both ends in the longitudinal direction of the cover member 12L, as shown in an enlarged manner in FIG. 8, arm portions 12A each having a protruding portion 12AP that is selectively engaged with a groove portion 10G of the socket body 10 described below at one end. Is provided. FIG. 8 shows a case where the protrusion 12AP and the groove 10G are not engaged.

One end of the arm portion 12A is formed integrally with the cover member 12L, while the above-described protrusion 12AP is formed on the other end of the arm portion 12A.
The socket body 10 is made of, for example, a heat-resistant polyamide-based resin, and has a housing portion 10A that houses the above-described semiconductor device 14 in the center. Opposite side wall portions 10RW and 10LW that form the outer portion of the accommodating portion 10A are formed around the accommodating portion 10A on the long side of the socket main body portion 10.

  As shown in FIG. 8, grooves 10G in which the protrusions 12AP of the arm 12A are selectively engaged are formed at both ends of the side walls 10RW and 10LW, respectively. An inclined surface 10IS that guides the protrusion 12AP is formed on the periphery of the groove 10G. Further, when the slide cover members 12L and 12R are separated from each other by the end portion of the slope portion 10IS, the position of the arm portion 12A is regulated by engaging the projection portion 12AP with the end portion.

  In the side wall portions 10RW and 10LW, as shown in an enlarged view in FIG. 7, a plurality of slits SLA are formed at a pitch corresponding to the interval between the lead terminals 14ai described above. Adjacent slits SLA are partitioned by a partition wall PA. In each slit SLA, the lead terminal 14ai of the mounted semiconductor device 14 is inserted and positioned.

  Further, one partition wall PB having a shape different from the shape of the partition wall PA is provided for a predetermined number of partition walls PA, for example, five partition walls PA. The partition wall PB has projections PBa that project and face the recesses 12Ri of the slide cover members 12L and 12R, respectively. As shown in FIG. 5, when the slide cover members 12L and 12R are close to each other toward the housing portion 10A, the protrusion PBa having an L-shaped cross-sectional shape is formed in the recess 12Ri of the slide cover members 12L and 12R. Engaged. Thereby, for example, deformation of the socket main body 10 and the slide covers 12L and 12R due to heat in a soldering operation or the like is prevented.

  Corner walls CW that are engaged with the respective corners of the package of the semiconductor device 14 to be mounted are formed at both ends of the side wall portions 10RW and 10LW. The corner wall CW plays a role of guiding the semiconductor device 14 to make it easier to mount the semiconductor device 14 in the accommodating portion 10 </ b> A of the socket body 10.

  In the accommodating portion 10A, a contact terminal accommodating portion 10B in which the contact terminals 16ai are disposed is provided at a position below the mounted semiconductor device 14.

  As shown in FIG. 1 and FIG. 6, the contact terminal 16ai is made of a thin metal material, and is fixed to a fixing portion 16F that is press-fitted into a groove formed corresponding to each slit SLA of the socket body 10 and fixed. A fixed terminal portion 16S connected to the conductor layer of the wiring board by being connected to the portion 16F, and a contact portion connected to the fixed portion 16F via an elastically displaceable bending portion and electrically connected to the tip of the lead terminal 14ai 16C and a movable piece portion 16D that moves the contact portion 16C up and down in accordance with the movement of the slide cover members 12L and 12R.

The fixed terminal portion 16S is connected to the curved portion so as to be positioned immediately below a contact portion 16C described later. That is, the fixed terminal portion 16S is formed so that the center axis in the width direction of the fixed terminal portion 16S in FIG. 6 and the center axis in the width direction of the contact portion 16C coincide. Thereby, when the contact terminal 16ai is fixed to the socket body 10, the center axis in the width direction of the fixing groove and the center axis in the width direction of the contact portion 16C coincide with each other, so the socket body 10 of the contact portion 16C of the contact terminal 16ai. The relative position with respect to is easy.
As shown in FIG. 3, the distal end portion of the fixed terminal portion 16 </ b> S protrudes outward from the end portion of the socket body 10.

  One end of the strip-shaped contact portion 16C and the movable piece portion 16D formed substantially parallel to each other is connected to the curved portion. Further, the other ends of the belt-like contact portion 16C and the movable piece portion 16D can be individually elastically displaced and are formed by branching from the curved portion. The length from one end to the other end of the movable piece portion 16D is set slightly larger than the corresponding length in the contact portion 16C. As a result, when the slide cover members 12L and 12R are at a position separated from the accommodating portion 10A, the distal end portion of the movable piece portion 16D abuts against the top portion of the first pressing surface 12PS1 as shown in FIG. It touches. On the other hand, the contact portion 16C is separated from the first pressing surface 12PS1 and the second pressing surface 12PS2. At that time, the height of the contact portion 16C from the inner surface of the bottom portion of the socket body 10 is set slightly higher than the height of the movable piece portion 16D.

  Further, when the slide cover members 12L and 12R are located close to the accommodating portion 10A, as shown in FIG. 5, the distal end portion of the movable piece portion 16D is ahead of the top portion of the first pressing surface 12PS1. In contact with the first inclined surface SA. On the other hand, the tip of the contact portion 16C is in contact with the second pressing surface 12PS2 or the lead terminal 14ai of the semiconductor device 14.

  In such a configuration, when the semiconductor device 14 is mounted in the housing portion 10A of the socket body 10, first, as shown in FIG. 1, the slide cover members 12L and 12R are at positions separated from the housing portion 10A. The semiconductor device 14 is disposed in the accommodating portion 10A. At that time, each lead terminal 14ai of the semiconductor device 14 is inserted into each slit SLB of the side wall portions 10RW and 10LW. Thereby, the position of the semiconductor device 14 along the longitudinal direction with respect to the housing portion 10A is automatically determined. At that time, each lead terminal 14ai is placed on each contact portion 16C of the contact terminal 16ai.

  Next, as shown in FIG. 5, the slide cover members 12L and 12R are brought close to each other along the direction substantially orthogonal to the arrangement direction of the contact portions 16C of the lead terminals 14ai and the contact terminals 16ai with respect to the accommodating portion 10A. The At that time, the distal end portion of the movable piece portion 16D is guided by the top portion of the first pressing surface 12PS1 and the first inclined surface portion SA of the slide cover members 12L and 12R.

  As a result, the tip of the movable piece 16D of the contact terminal 16ai is raised, and the tip of the contact 16C is raised by its elastic force, so that the tip of the lead terminal 14ai is not bent undesirably. The lead terminal 14ai is sandwiched between the second pressing surface 12PS2 and the tip of the contact portion 16C. Further, as shown in FIG. 5, the protrusion PBa is engaged with the recesses 12Ri of the slide cover members 12L and 12R. At this time, since the protrusion 12AP of the arm 12A is engaged with the groove 10G of the socket body 10, the slide cover members 12L and 12R are securely fixed to the socket body 10 so as not to move easily. .

Since the lead terminal 14ai is held between the second pressing surface 12PS2 and the tip of the contact portion 16C simply by sliding the slide cover members 12L and 12R in this way, the operator can hold the slide cover members 12L and 12R with one hand. Easy operation is also possible.
Further, when the slide cover members 12L and 12R slide, the lead terminal 14ai is rubbed against the tip of the contact portion 16C and wiped.

  Further, even when the interval between the lead terminals of the semiconductor device is narrower, the slide cover members 12L and 12R are substantially orthogonal to the arrangement direction of the contact portions 16C of the lead terminals 14ai and contact terminals 16ai with respect to the housing portion 10A. Since they are close to each other along the direction, the tip of the lead terminal 14ai is not undesirably bent.

  On the other hand, when removing the semiconductor device 14 from the housing portion 10A, first, the protrusion 12AP of the arm portion 12A is disengaged from the groove portion 10G of the socket body 10 by using a dedicated jig. Next, the slide cover members 12L and 12R are pulled away from the state shown in FIG. 5 to the state shown in FIG. Therefore, the semiconductor device 14 can be removed from the housing portion 10A. Accordingly, since a dedicated jig is required to remove the semiconductor device 14 from the housing portion 10A, it is possible to prevent criminal acts such as rewriting the internal data of the semiconductor device 14 intentionally.

It is a fragmentary sectional view which shows the principal part in an example of the socket for semiconductor devices which concerns on this invention. It is a top view which shows roughly the external appearance of an example of the socket for semiconductor devices which concerns on this invention. FIG. 3 is a front view of the example shown in FIG. FIG. 3 is a side view of the example shown in FIG. It is a fragmentary sectional view with which operation | movement description in the example shown by FIG. 1 is provided. It is a top view which shows the structure of the contact terminal used in the example shown by FIG. FIG. 3 is a partial cross-sectional view in the example shown in FIG. FIG. 3 is a partially enlarged view showing an enlarged arm portion of a slide cover member in the example shown in FIG. (A) is a top view which shows the semiconductor device attached to or detached from an example of the socket for semiconductor devices which concerns on this invention, (B) is a front view of (A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Socket main body 10A Housing part 12R, 12L Slide cover member 14 Semiconductor device 14ai Lead terminal 16ai Contact terminal 12PS1 1st press surface 12PS2 2nd press surface

Claims (6)

A socket body including a housing portion for detachably housing the semiconductor device;
A plurality of contact terminals that are arranged in the housing portion of the socket body and are electrically connected to the terminals of the semiconductor device; and a movable piece portion that moves the contact portion up and down so as to be elastically displaceable;
A guide portion that is slidably disposed so as to approach or separate from the housing portion of the socket main body, and that has a predetermined gradient at a peripheral edge of a slit that faces the contact terminal and is formed along the sliding direction. A first pressing surface that presses or guides the distal end portion of the movable piece portion, and is formed adjacent to the first pressing surface, and the terminal of the semiconductor device cooperates with the distal end portion of the contact portion. And a second pressing surface to be clamped or released, and a slide cover member,
When the slide cover member is brought close to the housing portion on which the semiconductor device is mounted, the distal end portion of the movable piece portion of the contact terminal is guided and raised by the guide portion, and the movable piece portion The semiconductor device is characterized in that the contact portion is raised together with the terminal of the semiconductor device as it rises, whereby the terminal of the semiconductor device is sandwiched between the second pressing surface and the tip of the contact portion. Device socket. The contact terminal includes a movable piece portion that engages with the first pressing surface, and a contact portion that is formed substantially parallel to the movable piece portion and is engaged with or disengaged from the second pressing surface. The socket for a semiconductor device according to claim 1, comprising: When the slide cover member is slid in a direction substantially orthogonal to the arrangement direction of the terminals of the semiconductor device disposed in the housing portion, the slide cover member engages with one end of a partition wall provided in the socket body. the semiconductor device socket according to claim 1, wherein Rukoto which have a recess for. 2. The socket for a semiconductor device according to claim 1 , wherein a plurality of the slide cover members are arranged opposite to the socket body . 3. The semiconductor device socket according to claim 2 , wherein the total length of the movable piece portion of the contact terminal is set to be larger than the total length of the contact portion .   2. The semiconductor device socket according to claim 1, wherein the guide portion is a slope portion having a predetermined slope.

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