JPS60107900A - Device for mounting electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an electronic component mounting device for mounting an electronic component having a pair of lead terminals at both ends of a component body onto a printed circuit board, and particularly relates to an electronic component mounting device for mounting an electronic component having a pair of lead terminals at both ends of a component body, and particularly The present invention relates to an electronic component mounting device in which a receiving member for holding the electronic component is improved when each IJ-do terminal is bent to correspond to a through hole in a printed circuit board.

<Background Art and its Problems> Conventionally, an electronic component mounting apparatus for mounting a so-called axial type electronic component having a pair of lead ends at both ends of a component body onto a printed circuit board is known. In such an electronic component mounting apparatus, as an electronic component mounted on a printed circuit board, the board insertion interval of lead terminals is 1Q7.
71J+ products, and products from five companies are known. Above I
Q: Electronic components with an insertion interval of 212,711 have been widely used in the past, and the dimensions of the component body are relatively small compared to the above insertion interval, making it difficult to bend lead terminals using the electronic component mounting device described above. There is a relatively large amount of leeway;
The base end of the lead terminal is supported by a receiving member, so that the lead terminal can be easily bent. However, due to the recent demand for high-density component mounting,
There is an increasing need to use electronic components with an insertion interval of 5 VTM, and in such electronic components, the interval between the lead terminals is set to -V so that the interval is close to the dimension of the main body of the electronic component. Because of this necessity, an electronic component mounting apparatus having a configuration as shown in FIGS. 1 to 3 is used. In other words, the electronic component 1 is held by the feeding tapes 4, 4 attached to the tips of the pair of lead terminals 3, 3, respectively, and the cutting mechanism 5 of the electronic component mounting device. 6 is located near the tip of each of the lead terminals 3, 3, and faces so as to sandwich the cup from both upper and lower sides. Furthermore, a receiving member 8 of the electronic component mounting device faces the component body 7 of the electronic component 1 at a lower position thereof, and a receiving member 8 of the electronic component mounting device faces the component body 7 of the electronic component 1.
At the upper position, bending members 9, 9 of the electronic component mounting apparatus are arranged to face the base end portions of the respective lead terminals 3, 3. Then, as shown in FIG. 2, the electronic component 1 is cut by the cutting mechanisms 5, 6 at the tips of the lead terminals 3, 3, cut from the feeding tapes 4, 4, and then bent. The lead terminals 3, 3 are bent at a predetermined distance from each other while being pressed by the parts 9, 9, and the part main body 7 is received and held by the parts 8. , and furthermore, as shown in FIG. The pressing member 10. is moved in a direction from the upper position to the lower position of the electronic component 1.
10, the lead terminals 3, 3 are inserted into the through holes 'la, 'la formed in the printed circuit board 2, and are attached to the printed circuit board 2.

By the way, in the above conventional electronic component mounting apparatus, a protective sheet 11 made of an elastic synthetic resin material is disposed on a portion of the receiver 8 that receives the component body 7, and this protect sheet 11 is formed from an elastic synthetic resin material during the mounting operation. This prevents the component body 7 from colliding with the receiving member 8 from being damaged. However, since the above-mentioned installation work is repeatedly performed at high speed, such a protective sheet 11 may peel off from the retainer 8 within a short period of time, or may wear out due to long-term use. There are drawbacks. Such falling off or wear of the protective sheet 11 may lead to damage to the electronic component 1, which may hinder the stabilization of the quality of the printed circuit board 2 on which the electronic component 1 is mounted, leading to a decrease in yield. There is.

In addition, a receiving member 8 that holds a component body 7 such as a double series is also provided.
By providing a receiving part to support the base end of each lead terminal 3, 3 instead, it is possible to avoid damage to the component body 7 described in "2." If the electronic component 1 has to be bent so that the distance between the lead terminals 3, 3 is close to the length dimension of the component body 7, the lead terminals 3, 3 should be bent as described above. The receiving member of the supporting structure must be positioned extremely accurately with respect to the electronic component 1 held by the feeding tape 4, and must support the extremely narrow portion of the base end of each of the lead terminals 3, 3. If this position shifts even slightly, the fslj product main body 7 of the electronic component 1 described in Section 2 may get caught between the bending member 9 and the component main body 7 may be damaged. It has the disadvantage of being

<Purpose of the Invention> In view of the above-mentioned circumstances, the present invention has a receiving member with excellent durability, allows stable equipment operation of electronic components at all times, and connects each lead terminal of the electronic component to the component body. An object of the present invention is to provide an electronic component mounting device that does not damage the electronic component even when the electronic component is bent to have an interval close to the length dimension of the electronic component.

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides an electronic component having a pair of lead terminals at both ends of the component body, with the receiver being held by a member as described above. In an electronic component mounting apparatus that bends a lead terminal and releases the holding state of the receiver to mount it on a printed circuit board, the receiver has a member that has a cutout recess that accommodates the component body. In addition, inner facing surfaces of a pair of side walls formed on both sides of the notch recess and receiving the lead terminals are sloped surfaces, and the component body is guided into the notch recess.

<Example> Hereinafter, specific examples of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 4, the electronic component mounting apparatus in this embodiment connects the tips of a pair of lead terminals 13.13 provided at both ends of the component body 12 to feeding tapes 14.14.
The electronic component 15 is attached to the printed circuit board 16 and is held by the feed tape 14.14 and sent out to a predetermined position as the feed tape 14.14 runs.
(See Figure 9). That is, the electronic component 15 is attached to the tip of each lead terminal 13.13 of the electronic component 15 by the feeding tape 14.1.
4, a cutting mechanism 17-18 of an electronic component mounting device is provided for cutting each lead terminal 13-13. These cutting mechanisms 17, 18 are connected to each lead terminal 13.
The cutting mechanism 18 on the moving side is placed on the upper side of the cutting mechanism 18 on the receiving side, and the cutting mechanism 18 on the receiving side is placed on the lower side. 17 descends to shear each of the lead terminals 13, 13.

Further, when the lead terminals 13 and 13 are bent, the electronic component 15 is
A receiving member 19 of an electronic component mounting device for receiving and holding the electronic component is faced. This receiving member 19 has
As shown in FIG. 5, the receiving part 2 facing the electronic component 15
0 is formed. This receiving portion 20 is formed to have a width corresponding to the interval between the lead terminals 13 and 13 after bending, and has a length between both ends of the upper part body 12 facing the electronic component 15. has a width corresponding to
The notch has a depth that allows at least the lower half portion of the component body 12 located below the arrangement position of the lead terminals 13 and 13 to be accommodated when the component body 12 is stored. A recessed portion 21 is formed by cutting from the distal end of the receiver portion 20 to the proximal end side. Furthermore, by forming the notch l recess 21, the width of both the notch recesses 21 is approximately 1 of the difference between the length of the component body 12 and the width between the bent lead terminals 13 and 13. It is thick. The inner facing surfaces of these side walls 22, 22 are formed with inclined surfaces 23, 23. These inclined surfaces 23.23 extend from the tips of the respective side walls 22.22, that is, from the ends protruding toward the electronic component 15 side, to the respective side walls 22.2.
These outer walls 22, 22 are formed so as to become gradually thicker toward the base end of the outer wall 22, 22. The tip end portion of each side wall 22.22 on which such an inclined surface 23.23 is formed is formed into a slightly sharp shape with only a slight roundness remaining at the tip edge.

Further, a pair of bending members 24, 24 of this electronic component mounting device are disposed on the upper side of the electronic component 15 so as to face the base end portions of the respective lead terminals 13.13. These bending members 24, 24 are provided so as to be able to freely descend toward the electronic component 15, and each tip is formed as a pressing portion that presses and bends each of the lead terminals 13, 13. has been done. These suppressing portions have inclined surfaces 25 and 25 formed on their inner facing surfaces, and are formed in a shape that gradually tapers. Further, the distance between the mutually opposing inner surfaces of the bending members 24.24 is slightly smaller than the width of the outer side walls of the respective side walls 22.22. The lead terminal 13.13 has a large value.
When bent, the receiver part 2o is fitted between the respective inner surfaces. Moreover, each of the above-mentioned bending members 24, 2
Grooves 26.26 are formed on the inner surface of 4 to guide each of the lead terminals 13.13 when bent.

Furthermore, a suppressing member 27.27 is disposed above the electronic component 15 so as to descend toward the electronic component 15 and move the electronic component 15 downward.

Therefore, the cutting mechanism 17, 18, 17, 18 as described above is
, the receiver is the member 19, the bending member 24, 24 and the pressing member 27
, 2γ, when mounting the electronic component 15 on the printed circuit board 16, first, as shown in FIG.
7.18, the tips of each lead terminal 13.13 are cut and the electronic component 15 is attached to the feeding tape 14.14.
Separate more. Then, the electronic component 15 is pressed against each lead terminal 14, 14 by the cutting mechanism 17, 18, 18 on the moving side and each bending part [24, 24, and the receiver is pressed against the receiving part 20 of the member 19. Move to the side. Then, the receiver protruded toward one of the side walls 22 with respect to the notch/recess 21 of the member 19.
As shown in Figure 7, the end of the
It is pressed and moved toward the notch l recess 21 side while slidingly contacting the inclined RFT 523 formed in the . Therefore,
The component main body 12 is accommodated in the notch 1 (B part 21) with its 914 part guided by the inclined surface 23.
However, as shown in FIG. 8, the receiver protrudes toward the portion 20, and after the lead terminal 13°13 is bent along the groove 26.26, the receiver protrudes toward the portion 20 as shown in FIG. has retreated and the electronic component 1 is held by each of the bending members 24 and 24.
5 is pressed by the pressing part U27.27, and each of the lead wires 13.13 is inserted into the through hole 16 formed in the printed circuit board 16.
a, this printed circuit board 1 by inserting it into 16a.
At step 6, the electronic component 15 described in section 2 is installed.

In this way, in the electronic component mounting apparatus of this embodiment, when the lead terminals 13.13 are bent, the member 19 of the receiver receives the base end of each of the lead terminals 13.13, so that the electronic component 15, the component body 12 is not subjected to an excessive load during this bending operation, and the component body 12 is not damaged.

Further, the receiver for receiving the electronic component 15 is a member 19.
Since the inclined surfaces 23.23 are provided on each side wall 22.22 of the electronic component 15, when receiving the electronic component 15, the component body 12 is accommodated face up in the notch Z recess 21 of the receiver member 19. . Therefore, since the length of the component body 12 has a value close to the distance between the lead terminals 13 and 13 after bending, each of the lead terminals 13 is placed very close to each end of the component body 12. Even if the component body 12 has to be bent at a close position, the component main body 12 is guided by the inclined surfaces 23, 23, and the lead terminals 13, 13 can be bent while being maintained at accurate positions. As a result,
Due to the positional shift l/ of the component body 20, the receiver is fixed by the member 19 and the bending member 24.
In the electronic component 15 whose lead terminals 13 and 13 are bent, the component body 12 is biased toward one of the lead terminals 13 of the upper pot lead terminals 13 and 13. Never. Therefore, the above suppressing section A=)+
27 and 27 to suppress and move the electronic component 15;
” When mounting on the printed circuit board 16 in Section 2, -1- Section 81
(The main body 12 of the product is tilted, and the tip i1 of each lead terminal 13, 13 is
The 11th position of the male part will not be distorted and will be installed in a well-balanced manner.

<Effects of the Invention> As is clear from the description of the embodiments described above, according to the present invention, there is no need to provide a protective cover that easily peels off on the receiving member that receives electronic components, so this receiving member has excellent durability. This makes it possible to reduce the frequency of replacing this receiving member and improve the operating rate of the electronic component mounting apparatus.

Furthermore, since the receiving member of the present invention receives the base end of the lead terminal of the electronic component described in item 2, it does not apply an excessive load to the main body of the electronic component, which may cause damage to the main body of the electronic component. Without a doubt, stable mounting work can be realized.

In addition, since an inclined surface for guiding the component body is provided on the side wall of the receiver that receives the base end of the lead terminal, when the lead terminal is bent, the receiver is a member of the component body. It can be reliably guided and stored in the notched l recess. Therefore, the component body has a length extremely close to the distance between the pair of lead terminals after bending, and each of the terminals is connected to each proximal end extremely close to each end of the component body. Even if the component body has to be bent at a portion, the component body can be reliably positioned, and the receiver of the component body can be reliably prevented from being damaged by the member and the bending member.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view of the main part of a conventional electronic component mounting apparatus, and FIG. 2 is a schematic cross-sectional view of the main part of the conventional electronic component mounting apparatus, showing a state in which the lead terminal of an electronic component is bent. 3 is a schematic cross-sectional view of the main part showing the state in which electronic components are mounted on a printed circuit board using the conventional electronic component mounting device, and FIG. 4 shows an embodiment of the electronic component mounting device according to the present invention. FIG. 5 is a schematic perspective view of the receiving member; FIG. 6 is a schematic cross-sectional view of the main part showing a state in which a lead terminal of an electronic component is being cut by the electronic component mounting apparatus according to the present invention. , FIG. 7 is a partially omitted enlarged cross-sectional view showing a state in which the end of the main body of the electronic component is guided by the inclined surface provided on the side wall of the receiving member, and FIG. 8 is the electronic component mounting apparatus according to the present invention. FIG. 9 is a schematic cross-sectional view of the main parts showing a state in which the upper terminals of the electronic component are bent, and FIG. 9 shows a state in which the electronic component is mounted on a printed circuit board by the electronic component mounting apparatus according to the present invention. FIG. 2 is a schematic cross-sectional view of essential parts. 12... Part body, 13... Lead terminal, 15...
・Electronic components, 16...Printed circuit boards, 17.18...
- Cutting mechanism, 19... Receiver is member, 21... Notch recess, 22... Side wall, 23... Inclined surface, 24... Bending mechanism Patent applicant Sony Corporation representative Patent attorney Small Kodo Ike 1) Ei Mura - Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] An electronic component having a pair of lead terminals at both ends of the component body is held by a receiver member, and the lead terminals are bent, the holding state by the receiver member is released, and the electronic component is mounted on a printed circuit board. In the electronic component mounting apparatus, the receiver member has a notched recess for accommodating the component body, and inner facing surfaces of a pair of side walls formed on both sides of the notched recess to receive the respective lead terminals. is an inclined surface, and the electronic component mounting device is configured to guide the component body into the notch recess.