JP7000204B2 - Socket for electrical components - Google Patents

Description

The present invention relates to a socket for electrical components in which a large number of contact pins are arranged in a socket body with the lower end inserted into the through hole of the lower plate and the upper end inserted into the upper through hole of the upper plate.

Conventionally, as a socket for an electric component for electrically connecting an electric component such as a semiconductor device (hereinafter referred to as "IC package"), an IC socket in which a large number of contact pins are arranged is known.

For example, in Patent Document 1 below, a large number of contact pins are provided in the module, a curved deformation portion is provided in the middle portion of each contact pin, and the lower end portion is inserted into the holes of the first support plate and the second support plate. And the IC socket whose upper end is inserted into the hole of the floating plate is described.

In this IC socket, the tip of each contact pin inserted into the hole of the first and second support plates can be moved in the hole to prevent the tip side from being deformed when it comes into contact with the substrate. is doing.

Japanese Unexamined Patent Publication No. 2012-54207

However, in the conventional IC package, a large number of holes are provided in the partition plates arranged at the upper and lower intermediate positions to separately support the curved deformation portion of each contact pin, and the holes in the first support plate and the holes in the second support plate are provided. By sandwiching the contact pins by shifting them from each other, it was prevented that a large number of contact pins arranged in close proximity to each other at a fine pitch did not come into contact with each other.

Therefore, the structure of the IC package in which a large number of contact pins are arranged is complicated, and various labors and costs in manufacturing are increased.

Therefore, the present invention is a simple socket for an electric component having a large number of contact pins whose lower end is inserted into the through hole of the lower plate and whose upper end is inserted into the upper through hole of the upper plate. An object of the present invention is to provide a socket for an electric component capable of preventing contact between adjacent contact pins in a configuration.

In order to achieve such a problem, the socket for an electric component according to claim 1 includes a socket body for accommodating the electric component, and the socket body is arranged apart from the lower plate and the lower plate. A large number of contact pins having an upper plate and arranged in the socket body are formed into an elongated shape by press molding, and the lower end thereof is inserted into the lower through hole of the lower plate. In a socket for an electric component whose upper end is inserted into an upper through hole of the upper plate, the lower plate can slide a first plate having a first hole and a second plate having a second hole. The lower through hole has the first hole and the second hole, and the lower end portion of the contact pin has a substantially U-shaped cross section, and the first hole is formed. The plate and the second plate slide to shift the relative positions of the first hole and the second hole, and the inner surfaces of the first hole and the second hole abut on the four corners of the substantially U-shape. It is characterized by being prevented from rotating in a state where it can slide up and down.

Further, in the socket for electrical parts according to claim 2, in addition to the invention according to claim 1, the lower end portion of the contact pin is inserted into the lower through hole when the tip protrudes from the lower plate. It is characterized in that it is configured so that when it is press-fitted, it rises in the lower through hole of the lower plate and the tip thereof is accommodated in the lower plate, the press-fitting is released.

Further, in the socket for electrical parts according to claim 3, in addition to the invention according to claim 1, the first hole of the first plate arranged below the second plate is at the lower portion. A lower end protrusion having a large diameter portion and a small diameter portion at the upper portion, and being accommodated in the large diameter portion and lockable at the boundary between the large diameter portion and the small diameter portion at the lower end portion of the contact pin. It is characterized by having.

Further, in the socket for electrical parts according to claim 4, in addition to the invention according to any one of claims 1 to 3, the upper through hole has a large diameter portion at the lower portion and a small diameter portion at the upper portion. The upper end portion of the contact pin is characterized by having an upper end side protrusion that is accommodated in the large diameter portion and can be locked at the boundary between the large diameter portion and the small diameter portion.

According to the first aspect of the present invention, the first plate having the first hole and the second plate having the second hole are slidably laminated and have the first hole and the second hole. Since the lower through hole is configured, by sliding the first plate and the second plate, the region where the first hole and the second hole overlap in a plan view can be contracted in the slide direction.

Therefore, it has a substantially U-shaped cross section, and the four corners of the substantially U-shape at the lower end of the contact pin inserted into the lower through hole can be brought into contact with the inner surfaces of the first hole and the second hole. Sufficient detent can be applied to each contact pin.

This makes it possible to prevent the rotation of the contact pins formed into an elongated shape by press molding, and a large number of contact pins arranged at a minute arrangement pitch rotate slightly so that adjacent contact pins come into contact with each other. You can prevent such things.

As a result, there is no need for a structure that supports each contact pin at an intermediate position between the lower plate and the upper plate and keeps it in a predetermined position, and simplifies the configuration in which a large number of contact pins are arranged in the socket body. Is possible. Therefore, it is possible to provide a socket for an electric component capable of preventing contact between adjacent contact pins with a simple configuration.

According to the second aspect of the present invention, when the tip of the lower end of the contact pin protrudes from the lower plate, the lower end is press-fitted into the lower through hole, so that a large number of contact pins are placed in predetermined positions. It can be held in place and the adjacent contact pins do not come into contact with each other.

On the other hand, when the lower end of the contact pin rises in the lower through hole of the lower plate and the tip of the lower end is accommodated in the lower plate, the press-fitting into the lower through hole of the lower end is released. However, since the inner surface of the lower through hole is in contact with the four corners of the lower end in a substantially U-shape, the lower end is prevented from rotating in a state where it can slide up and down, and even if the press-fitting of the lower end is released. , Each contact pin does not rotate, and adjacent contact pins do not come into contact with each other.

As a result, it is possible to prevent the contact pins from coming into contact with each other regardless of whether the socket body is mounted on the substrate or the like.

According to the third aspect of the present invention, the first hole of the first plate arranged below the second plate has a large diameter portion at the lower portion and a small diameter portion at the upper portion, and the lower end of the contact pin. The portion has a lower end protrusion that is accommodated in the large diameter portion and locked at the boundary between the large diameter portion and the small diameter portion. Therefore, by locking the lower end protrusion to the small diameter portion, it is possible to prevent the lower end portion of the contact pin from moving upward from the first plate, and it is possible to prevent the lower end portion of the contact pin from coming out of the lower through hole. .. Therefore, the lower through hole can simultaneously realize the detent function and the disconnection prevention function of each of a large number of contact pins.

According to the invention of claim 4, the upper through hole has a lower large diameter portion and an upper small diameter portion, and is accommodated in the large diameter portion at the upper end portion of the contact pin to have a large diameter portion and a small diameter portion. It has an upper end side protrusion that is locked to the boundary with the portion. Therefore, by locking the protrusion on the upper end side to the small diameter portion, it is possible to prevent the upper end portion of the contact pin from protruding significantly upward from the upper plate.

As a result, for example, when the upper end of a large number of contact pins is brought into contact with a large number of component terminals of an electrical component, even if the terminal does not exist at a position corresponding to some of the contact pins, the upper end of the contact pin is at that position. Can be prevented from protruding greatly and coming into contact with other contact pins or component terminals.

It is a partial vertical sectional view of the IC socket which concerns on embodiment of this invention. It is an enlarged perspective view which shows the arrangement of one contact pin in the IC socket which concerns on embodiment of this invention. It is an enlarged perspective view which shows the state which the lower end part of the contact pin in the IC socket which concerns on embodiment of this invention is inserted into the lower through hole of the lower plate. FIG. 5 is an enlarged cross-sectional view showing a state in which the upper end portion of the contact pin in the IC socket according to the embodiment of the present invention is inserted into the upper through hole of the upper plate. The contact pin of the IC socket which concerns on embodiment of this invention is shown, (a) is a perspective view, (b) is a front view, (c) is a side view. It is a figure explaining the upper end part of the contact pin of the IC socket which concerns on embodiment of this invention, (a) is the enlarged perspective view of the upper end part, (b) is the enlarged perspective view of the tip of the upper end part. (A)-(c) is a figure explaining the first half of the assembly procedure of the IC socket which concerns on embodiment of this invention. FIGS. (D) to (f) are diagrams illustrating the latter half of the procedure for assembling the IC socket according to the embodiment of the present invention. It is a figure which shows the state after inserting the lower end part of the contact pin in the IC socket which concerns on embodiment of this invention into the lower through hole of the lower plate, and before sliding of the lower plate, (a). A perspective view, (b) is a plan view, and (c) is a vertical sectional view. It is a figure which shows the state after inserting the lower end part of the contact pin in the IC socket which concerns on embodiment of this invention into the lower through hole of the lower plate, and after sliding of the lower plate, (a). A perspective view, (b) is a plan view, and (c) is a vertical sectional view. It is a partial cross-sectional view which shows the state which accommodated the IC package on the upper plate of the IC socket which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described.

1 to 11 show embodiments of the present invention.

As shown in FIGS. 1 and 2, the IC socket 10 as the "socket for electric parts" of this embodiment is arranged on the wiring board 11, and the IC package 12 as the "electric parts" is housed on the upper surface. A large number of contact pins 20 are configured to electrically connect the solder balls 12a as "terminals" of the IC package 12 and the electrodes 11a of the wiring board 11. The IC socket 10 is used, for example, as a test device for a continuity test such as a burn-in test for an IC package 12.

The socket main body 13 accommodating the IC package 12 is formed by integrally connecting the lower plate 14 and the upper plate 15 arranged apart from the lower plate 14 by providing a hollow portion 13a inside. There is.

A large number of contact pins 20 are arranged vertically and horizontally in a matrix with an extremely narrow arrangement pitch corresponding to a large number of solder balls 12a provided on the lower surface of the IC package 12, and penetrate the hollow portion 13a below. It is supported by the side plate 14 and the upper plate 15.

As shown in FIGS. 1 and 3, the lower plate 14 includes a first plate 16 joined to face the wiring board 11 and a second plate 17 arranged on the first plate 16. .. The first plate 16 is arranged close to or in contact with the surface of the wiring board 11, and the second plate 17 is arranged close to or in contact with the surface of the first plate 16.

Further, the first plate 16 and the second plate 17 are slidably arranged, and the first plate 16 is slidable with respect to the second plate 17 provided so as not to be relatively movable with respect to the upper plate 15. Has been done.

The lower plate 14 is provided with a lower through hole 14a penetrating in the thickness direction. The lower through hole 14a has a first hole 16a provided in the first plate 16 and a second hole 17a provided in the second plate 17. The first hole 16a and the second hole 17a are formed at the same pitch.

The first hole 16a of the first plate 16 has a lower large diameter portion 16b at the lower portion and a lower small diameter portion 16c having a smaller diameter than the lower large diameter portion 16b at the upper portion of the lower large diameter portion 16b.

In this embodiment, the lower large diameter portion 16b and the lower small diameter portion 16c are provided eccentrically, and the inner surface and the lower portion of the lower large diameter portion 16b on one side in the sliding direction of the first plate 16 and the second plate 17. The inner surface of the small diameter portion 16c is provided so as to be continuous with at least a part thereof.

Further, the diameter of the second hole 17a of the second plate 17 and the diameter of the lower small diameter portion 16c of the first plate 16 are provided to be substantially the same.

The first plate 16 and the second plate 17 have a lower small diameter portion 16c and a second small diameter portion 16c of the first hole 16a as shown in FIG. 3 in a state where the lower end portion 21 of the contact pin 20 is inserted into the lower through hole 14a. The holes 17a are arranged in a state of being eccentric and displaced in the sliding direction.

As a result, the lower end portion 21 of the contact pin 20 is sandwiched between the inner surface of the lower large diameter portion 16b of the first hole 16a facing each other in the shearing direction and the inner surface of the second hole 17a.

As shown in FIGS. 1 and 4, the upper plate 15 is arranged above the preload plate 18 and the preload plate 18 provided so as to be immovable relative to the lower plate 14 to accommodate the IC package 12. It has a floating plate 19 provided so as to be able to move up and down.

The upper plate 15 is provided with an upper through hole 15a penetrating in the thickness direction. The upper through hole 15a has a pressurization hole 18a provided in the preload plate 18 and an elevating hole 19a provided in the floating plate 19.

The elevating hole 19a has an upper large diameter portion 19b at the lower portion and an upper small diameter portion 19c having a smaller diameter than the upper large diameter portion 19b at the upper portion of the upper large diameter portion 19b.

The diameter of the pressurization hole 18a is preferably formed to be equal to or larger than the diameter of the upper large diameter portion 19b, and here, the pressurization hole 18a and the upper large diameter portion 19b are formed to have the same diameter.

As shown in FIGS. 3, 4, 5 (a) to (c), the contact pin 20 is formed into an elongated shape by press molding.

The contact pin 20 includes a lower end portion 21 supported by the lower plate 14, an upper end portion 22 supported by the upper plate 15, and an intermediate portion 23 between the lower end portion 21 and the upper end portion 22. ..

The lower end 21 of the contact pin 20 has a substantially U-shaped cross section and is inserted into the lower through hole 14a of the lower plate 14 to provide the lower insertion portion 21a and at the lowermost end which is the lower tip. A lower contact portion 21b that can contact the electrode 11a of the wiring board 11 is provided.

In this embodiment, the lower insertion portion 21a having a substantially U-shaped cross section has a back surface continuous piece 21c and a pair of side surface continuous pieces 21d that continuously project from both sides in the width direction of the back surface continuous piece 21c. ing.

The back continuous piece 21c is provided flat and continuously in the vertical direction from the lower contact portion 21b to the intermediate portion 23. In the pair of side surface continuous pieces 21d, the surfaces constituting both side surfaces of the lower insertion portion 21a are provided flat and continuously in the vertical direction over the entire length of the lower insertion portion 21a.

The pair of side surface continuous pieces 21d have a lower end protrusion 21e, a temporary press-fitting portion 21f, and a press-fitting stopper 21g in order from the bottom by changing the amount and shape of protrusion from the back surface continuous piece 21c in the vertical direction. It is provided. In the present embodiment, a connecting portion having a constant protrusion amount from the back continuous piece 21c is further provided between the lower end protrusion 21e and the temporary press-fitting portion 21f and between the temporary press-fitting portion 21f and the press-fitting stopper 21g. Has been done.

The lower end protrusion 21e can be accommodated in the lower large diameter portion 16b of the first plate 16, has a size that can be locked at the boundary between the lower large diameter portion 16b and the lower small diameter portion 16c, and is formed in a hook shape. ..

The temporary press-fitting portion 21f is arranged in the second hole 17a of the second plate 17, and is an intermediate portion 23 from a size that can be accommodated in the lower small diameter portion 16c of the first hole 16a until it is slightly larger than the second hole 17a. It is formed so that the amount of protrusion gradually increases toward.

The press-fit stopper 21g is formed in a protruding shape that protrudes larger than the second hole 17a of the lower plate 14.

In the lower insertion portion 21a, when the lower contact portion 21b at the tip protrudes from the lower surface of the lower plate 14, the temporary press-fit portion 21f is press-fitted into the inner surface of the second hole 17a of the second plate 17. It is configured in.

Further, as shown in FIG. 3, when the lower contact portion 21b at the tip comes into contact with the electrode 11a of the wiring board 11 and is accommodated in the lower through hole 14a, the press-fitting of the temporary press-fitting portion 21f is released. It is configured to be urged downward by the elasticity of the intermediate portion 23 described later.

Further, in the lower insertion portion 21a, when the lower contact portion 21b is in contact with the electrode 11a of the wiring board 11, the substantially U-shaped four corners 21h of the lower insertion portion 21a are on the inner surface of the lower through hole 14a. It is in contact with the slidable surface.

Specifically, as shown in FIGS. 10B and 10C, the width direction of the back continuous piece 21c in the temporary press-fitting portion 21f is formed on the inner surface of the lower small diameter portion 16c of the first hole 16a and the inner surface of the second hole 17a. Both side edges and the protruding edges of the side continuous piece 21d are in contact with each other.

As shown in FIGS. It is provided so as to be able to move up and down in the upper small diameter portion 19c of the floating plate 19.

An elevating trigger 22c, which is accommodated in the upper large-diameter portion 19b of the elevating hole 19a of the floating plate 19 and consists of a boundary between the upper small-diameter portion 19c and a lockable protrusion, is provided at a position close to the lower side of the upper contact portion 22b. There is. Further, a pressurization trigger 22d made of a lockable protrusion is provided below the pressurization hole 18a of the preload plate 18 at a position below the upper contact portion 22b.

As shown in FIG. 5, the intermediate portion 23 of the contact pin 20 has a first spring portion 23a formed by bending the contact pin 20 and a second spring portion 23a formed by bending the contact pin 20 upward and having a diameter. It has 23b. Here, the first spring portion 23a and the second spring portion 23b are one side and the other side of the contact pin 20 in the plate thickness direction with respect to the virtual line L connecting the lower end portion 21 and the upper end portion 22 of the contact pin 20. It is formed by being curved so as to be opposite to each other. Further, the second spring portion 23b on the upper end portion 22 side is formed in a curved shape larger than the first spring portion 23a on the lower end portion 21 side. Further, the first spring portion 23a is curved so as to protrude in the same direction as the protruding direction of the side continuous piece 21d of the lower insertion portion 21a having a substantially U-shaped cross section at the lower end portion 21.

In the intermediate portion 23, the lower end portion 21 and the upper end portion 22 are elastically urged outward so as to be vertically oriented with each other, that is, the lower end portion 21 is urged toward the circuit wiring board 11 and the upper end portion 22 is urged. Is configured to urge the IC package 12 side.

Next, a method of manufacturing the IC socket 10 of this embodiment will be described with reference to FIGS. 7 and 8.

In order to manufacture the IC socket 10, the lower plate 14 and the upper plate 15 constituting the socket body 13 are precisely manufactured with resin or the like, and the lower through hole 14a and the upper through hole 15a are formed in a predetermined shape and pitch, respectively. Provided at. Further, the contact pins 20 shown in FIGS. 5A to 5C are manufactured by press molding.

As shown in FIG. 7 (a), first, the lower insertion portion 21a of the contact pin 20 is inserted into the second hole 17a of the second plate 17, and the temporary press-fitting portion 21f is temporarily press-fitted into the second hole 17a. The back surface of the back surface continuous piece 21c and the protruding edge of the pair of side surface continuous pieces 21d in the portion 21f are pressed against the inner surface of the second hole 17a, respectively.

As shown in FIG. 7B, by stacking the first plate 16 from below the second plate 17, the lower insertion portion 21a of each contact pin 20 is inserted into the first hole 16a, respectively.

At this time, as shown in FIGS. 9A to 9C, the inner surface of the lower small diameter portion 16c and the second hole are aligned with the axial center of the lower small diameter portion 16c of the first hole 16a and the axial center of the second hole 17a. The first plate 16 and the second plate 17 are laminated in a state where the inner surface of 17a is substantially continuous.

In this state, since the temporary press-fitting state is maintained, the upper end side of the temporary press-fitting portion 21f is in pressure contact with the upper end side of the second hole 17a. Near the boundary between the plate 16 and the second plate 17, the substantially U-shaped four corners 21h of the lower insertion portion 21a, that is, the widthwise side edges on the back surface of the back surface continuous piece 21c and the protruding edges of the pair of side surface continuous pieces 21d. Of the above, the protruding edges of the pair of side continuous pieces 21d are arranged apart from each other without contacting the first hole 16a.

Then, as shown in FIG. 7 (c), the first plate 16 is slid in one direction along the surface in which the first plate 16 is opposed to the second plate 17. This slide direction substantially coincides with the eccentric direction of the lower small diameter portion 16c and the lower large diameter portion 16b of the first hole 16a.

As a result, the lower through hole 14a is contracted as shown in FIGS. 10A to 10C. That is, in a plan view, a region where the first hole 16a of the first plate 16 and the lower small diameter portion 16c of the second hole 17a of the second plate 17 overlap, in other words, one of the inner surfaces of the first holes 16a arranged vertically. The area partitioned by the portion and a part of the inner surface of the second hole 17a is reduced.

Then, the axis of the second hole 17a and the axis of the lower small diameter portion 16c of the first hole 16a are eccentric, and between the lower end protrusion 21e of the lower insertion portion 21a and the press-fit stopper 21g side of the temporary press-fit portion 21f. The inner surface of the lower small diameter portion 16c of the first hole is inserted into the formed side view concave portion 21x.

Then, the lower insertion portion 21a is sandwiched in the shearing direction between the inner surface of the lower small diameter portion 16c of the first hole 16a facing each other in the slide direction and the inner surface of the second hole 17a in the lower through hole 14a.

As a result, the inner surface of the lower through hole 14a comes into contact with the substantially U-shaped four corners 21h of the lower insertion portion 21a. As a result, each contact pin 20 is prevented from rotating in a state where it can slide up and down with respect to the lower plate 14.

This slidable range extends from the position where the lower contact portion 21b is accommodated in the lower through hole 14a to the position where the lower contact portion 21b protrudes.

Therefore, during manufacturing, as shown by a virtual line in FIG. 10 (c), the lower end portion of each contact pin 20 is in a state where the lower contact portion 21b provided at the tip of the lower end portion 21 protrudes from the lower plate 14. 21 is maintained in the temporary press-fitting state.

Next, as shown in FIG. 8D, the preload plate 18 is arranged at an upper position separated from the lower plate 14, and the upper end portion 22 of each contact pin 20 is inserted into the pressurization hole 18a. As a result, a large number of upper contact portions 22b are arranged at the same height and at a predetermined pitch in a state where the pressurization trigger 22d of each contact pin 20 is in contact with the lower surface of the preload plate 18.

Further, as shown in FIG. 8 (e), the floating plate 19 is arranged above the preload plate 18 at a distance. As a result, the upper end portion 22 of each contact pin 20 is inserted into the elevating hole 19a of the floating plate 19. At that time, the upper contact portion 22b of each upper end portion 22 is arranged in the upper small diameter portion 19c of the elevating hole 19a, and the elevating trigger 22c is housed in the upper large diameter portion 19b.

The IC socket 10 can be manufactured by assembling the socket main body 13 in this way and further assembling the pressing portion 10a, an operating portion (not shown), or the like to the socket main body 13, as shown in FIG.

After that, the wiring board 11 is arranged and fixed to the lower end of the obtained IC socket 10 so as to face each other.

As a result, as shown in FIG. 8 (f), the lower contact portions 21b provided at the tips of the lower end portions 21 of a large number of contact pins 20 are in contact with and connected to the electrodes 11a of the wiring board 11, respectively. It is housed in the lower through hole 14a of the lower plate 14. Then, the lower insertion portion 21a of the lower end portion 21 of each contact pin 20 is released from the press-fitting state with the lower through hole 14a of the lower plate 14, respectively.

In order to use such an IC socket 10, as shown in FIG. 1, the IC package 12 is accurately positioned and placed on the floating plate 19 in a state of being joined to the wiring board 11, and the pressing portion 10a is used. Push down.

Then, as shown in FIG. 11, a large number of solder balls 12a of the IC package 12 descend, come into contact with the upper contact portion 22b of each contact pin 20, connect the IC package 12 and the wiring board 11, and perform various inspections. Can be carried out.

At this time, even if there is a portion where the solder ball 12a is not arranged in the IC package 12, since the elevating trigger 22c is provided at the upper end portion 22 of each contact pin 20, the elevating trigger 22c is inside the elevating hole 19a. By being locked at the boundary between the upper large diameter portion 19b and the upper small diameter portion 19c, the upper contact portion 22b does not protrude excessively, resulting in poor connection between a large number of contact pins 20 and the IC package 12. You can connect without any problems.

According to the IC socket of this embodiment as described above, in the lower plate 14, the first plate 16 having the first hole 16a and the second plate 17 having the second hole 17a are slidably laminated on the lower side. Since the through hole 14a has the first hole 16a and the second hole 17a, the first hole 16a and the second hole 17a in the plan view can be obtained by sliding the first plate 16 and the second plate 17. The overlapping areas can be shrunk in the sliding direction. Therefore, the inner surfaces of the first hole 16a and the second hole 17a can be brought into contact with the substantially U-shaped four corners 21h at the lower end 21 of the contact pin 20 having a substantially U-shaped cross section, which is sufficient for each contact pin 20. Can be used to prevent rotation.

As a result, it is possible to prevent the contact pins 20 formed into an elongated shape by press molding from rotating, and a large number of contact pins 20 arranged at a minute arrangement pitch rotate slightly and adjacent contact pins 20 are adjacent to each other. Can be prevented from coming into contact with each other. For example, each contact pin 20 can be arranged in a space at a predetermined pitch even at an intermediate position between the lower plate 14 and the upper plate 15, and even if the IC package 12 is elastically deformed during mounting or use, the contact pins 20 are in contact with each other. There is nothing to do.

As a result, there is no need for a structure that supports each contact pin 20 at an intermediate position between the lower plate 14 and the upper plate 15 and keeps the contact pin 20 in a predetermined position, and a large number of contact pins 20 are arranged on the socket body 13. Can be simplified. This makes it possible to prevent contact between adjacent contact pins with a simple configuration.

Further, according to the IC socket of this embodiment, when the IC socket 10 is not mounted on the wiring board 11 or the like, the lower contact portion 21b at the tip of the lower end portion 21 of the contact pin 20 protrudes from the lower plate 14. Therefore, the lower end portion 21 is press-fitted into the lower through hole 14a. Therefore, a large number of contact pins 20 can be held at predetermined positions, and adjacent contact pins 20 do not come into contact with each other.

On the other hand, when the IC socket 10 is surface-mounted on the wiring board 11 or the like, the lower end portion 21 of the contact pin 20 comes into contact with the electrode 11a or the like of the wiring board 11 or the like, and the lower end portion 21 of the contact pin 20 is on the lower side of the lower plate 14. By ascending in the through hole 14a, the lower contact portion 21b at the tip of the lower end portion 21 is accommodated in the lower plate 14, and the press fitting into the lower through hole 14a of the lower end portion 21 is released. At that time, the inner surface of the lower through hole 14a comes into contact with the substantially U-shaped four corners 21h of the lower end portion 21, so that the lower end portion 21 is prevented from rotating in a slidable state. Therefore, even if the press-fitting of the lower end portion 21 is released, the contact pins 20 do not rotate and the adjacent contact pins 20 do not come into contact with each other.

As a result, it is possible to prevent the contact pins 20 from coming into contact with each other regardless of whether the socket body 13 is mounted on the wiring board 11 or the like.

Further, according to the IC socket of this embodiment, the first hole 16a of the first plate 16 arranged below the second plate 17 has a lower lower large diameter portion 16b and an upper lower small diameter portion 16c. The lower end portion 21 of the contact pin 20 has a lower end protrusion 21e that is accommodated in the lower large diameter portion 16b and locked at the boundary between the lower large diameter portion 16b and the lower small diameter portion 16c.

Therefore, the lower end protrusion 21e is locked at the boundary between the lower small diameter portion 16c and the lower large diameter portion 16b, so that the lower end portion 21 of the contact pin 20 can be prevented from moving upward from the first plate 16 and the contact can be made. It is possible to prevent the lower end portion 21 of the pin 20 from coming out of the lower through hole 14a. Therefore, the lower through hole 14a can simultaneously realize the detent function and the disconnection prevention function of each of the large number of contact pins 20.

Further, according to the IC socket of this embodiment, the elevating hole 19a of the upper through hole 15a has a lower upper large diameter portion 19b and an upper upper small diameter portion 19c, and is located at the upper end portion 22 of the contact pin 20. It has an elevating trigger 22c housed in the upper large diameter portion 19b and locked at the boundary between the upper large diameter portion 19b and the upper small diameter portion 19c. Therefore, by locking the elevating trigger 22c to the boundary of the upper small diameter portion 19c, it is possible to prevent the upper end portion 22 of the contact pin 20 from protruding significantly upward from the floating plate 19 of the upper plate 15.

As a result, for example, when the upper end portions 22 of a large number of contact pins 20 are brought into contact with a large number of solder balls 12a of the IC package 12, even if the terminals do not exist at the positions corresponding to some of the contact pins 20, at that portion. It is possible to prevent the upper end portion 22 of the contact pin 20 from protruding significantly and coming into contact with another contact pin 20 or the solder ball 12a.

The above embodiments can be appropriately changed within the scope of the present invention.

For example, in the above embodiment, when the IC socket 10 is manufactured, the lower insertion portion 21a of the contact pin 20 is temporarily press-fitted into the second hole 17a of the second plate 17, and then the first plate 16 is laminated and inserted underneath. An example of assembling the lower plate by inserting the portion 21a into the first hole 16a has been described, but the present invention is not particularly limited. For example, if the first plate 16 and the second plate 17 can be precisely aligned and arranged in a laminated manner, the lower small diameter portion 16c of the first hole 16a is formed by laminating the first plate 16 and the second plate 17 first. After aligning the axes of the second hole 17a with the second hole 17a, the lower insertion portion 21a of the contact pin 20 is inserted into the lower through hole 14a and arranged as shown in FIGS. 9A to 9C. It is also possible to assemble the lower plate 14 by sliding the 1st plate 16 and the 2nd plate 17 and arranging them as shown in FIGS. 10A to 10C.

10 IC socket 11 Wiring board 11a Electrode 12 IC package 12a Solder ball 13 Socket body 13a Hollow part 14 Lower plate 14a Lower through hole 15 Upper plate 15a Upper through hole 16 First plate 16a First hole 16b Lower large diameter part 16c Lower small diameter part 17 2nd plate 17a 2nd hole 18 Preload plate 18a Pressurized hole 19 Floating plate 19a Elevating hole 19b Upper large diameter part 19c Upper small diameter part 20 Contact pin 21 Lower end 21a Lower insertion part 21b Lower contact part 21c Back continuous piece 21d Side continuous piece 21e Lower end protrusion 21f Temporary press-fitting stopper 21h Press-fitting stopper 21h Four corners 22 Upper end part 22a is missing number 22b Upper contact part 22c Elevating trigger 22d Pressurized trigger 23 Intermediate part 23a First spring part 23b Second spring part

Claims (4)

The socket body comprises a socket body for accommodating electrical components, the socket body having a lower plate and an upper plate disposed apart from the lower plate, and a large number of contact pins arranged in the socket body. Is formed into an elongated shape by press molding, and the lower end is inserted into the lower through hole of the lower plate and the upper end is inserted into the upper through hole of the upper plate. ,
The lower plate is formed by slidably stacking a first plate having a first hole and a second plate having a second hole, and the lower through hole is the first hole and the second hole. It has a hole and
The lower end portion of the contact pin has a substantially U-shaped cross section, and the first plate and the second plate slide to shift the relative positions of the first hole and the second hole. A socket for electrical parts, characterized in that the inner surfaces of the first hole and the second hole are in contact with the four corners of the substantially U-shape so as to be slidable up and down and prevented from rotating. The lower end of the contact pin is press-fitted into the lower through hole when the tip protrudes from the lower plate, rises in the lower through hole of the lower plate, and the tip is the lower plate. The socket for an electric component according to claim 1, wherein the press-fitting is released when the socket is housed in the socket. The first hole of the first plate arranged below the second plate has a large diameter portion at the lower portion and a small diameter portion at the upper portion.
1. The socket for electrical parts according to 2. The upper through hole has a large diameter portion at the lower portion and a small diameter portion at the upper portion, and the upper end portion of the contact pin is accommodated in the large diameter portion and is a boundary between the large diameter portion and the small diameter portion. The socket for an electric component according to any one of claims 1 to 3, wherein the socket has an upper end side protrusion that can be locked to the above.

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