CN114205999A - Circuit board lapping structure - Google Patents
Circuit board lapping structure Download PDFInfo
- Publication number
- CN114205999A CN114205999A CN202110901603.9A CN202110901603A CN114205999A CN 114205999 A CN114205999 A CN 114205999A CN 202110901603 A CN202110901603 A CN 202110901603A CN 114205999 A CN114205999 A CN 114205999A
- Authority
- CN
- China
- Prior art keywords
- conductive
- circuit board
- base
- seat
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 claims abstract description 11
- 239000000806 elastomer Substances 0.000 claims abstract description 11
- 238000002955 isolation Methods 0.000 claims description 27
- 238000004804 winding Methods 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a circuit lapping structure. The circuit lapping structure is suitable for connecting the first circuit board and the second circuit board. The circuit board lapping structure comprises: base, pedestal, support column and rotating member. The base is used for being arranged on the first circuit board and comprises a contact surface, and the contact surface is provided with a conductive part and an isolating part. The base body is used for being arranged on the second circuit board. The supporting column is connected between the base and the seat body. The rotating member is electrically connected with the base body and comprises a rotating surface and a conductive elastic body. The support column penetrates through the rotating piece. The conductive elastomer is connected to the rotating surface and extends towards the base. The rotating member can rotate relative to the base to enable the conductive elastic body to contact the conductive part or the isolating part.
Description
Technical Field
The present invention relates to a circuit board overlapping structure, and more particularly, to a circuit board overlapping structure capable of selecting whether to electrically connect.
Background
Fig. 1 is a schematic diagram of a conventional circuit board bonding structure. The existing electronic products often have a stacked structure between circuit boards or with other components. As shown in fig. 1, in order to lap joint the first circuit board 1, the second circuit board 2 and the base 3 together, they may be connected by lap joint posts 4. The overlapping post 4 may be, for example, threaded, snapped, etc. to overlap multiple components. Here, the stud 4 includes a stud 41 and a nut 42, which are screwed together. Two ends of the stud 41 respectively pass through the through hole 11 of the first circuit board 1 and the through hole 21 of the second circuit board 2, one end is locked on the base 3, and the other end is locked with the nut 42.
In some cases, the vias 11, 21 are conductive vias and the landing posts 4 are made of conductive material to electrically connect the two circuit boards. However, in some cases, the bonding position is located in an electrically sensitive area on the circuit board, and the bonding is performed by using the bonding post 4 made of an electrically insulating material. Therefore, the problems of Electrostatic Discharge (ESD) or Electromagnetic Interference (EMI) caused by electrical connection due to bonding can be avoided. Therefore, when assembling the electronic product, the posts 4 made of different materials need to be used for lapping according to different requirements. Therefore, not only the material preparation cost is increased, but also the assembly complexity and the production error rate are increased.
Disclosure of Invention
The present invention is directed to a circuit board overlapping structure to solve at least one of the above problems.
In view of the foregoing problems, an embodiment of the present invention provides a circuit board bonding structure suitable for connecting a first circuit board and a second circuit board. The circuit board lapping structure comprises: base, pedestal, support column and rotating member. The base is used for being arranged on the first circuit board and comprises a contact surface, and the contact surface is provided with a conductive part and an isolating part. The base body is used for being arranged on the second circuit board. The supporting column is connected between the base and the seat body. The rotating member is electrically connected with the base body and comprises a rotating surface and a conductive elastic body. The support column penetrates through the rotating piece. The conductive elastomer is connected to the rotating surface and extends towards the base. The rotating member can rotate relative to the base to enable the conductive elastic body to contact the conductive part or the isolating part.
In some embodiments, the conductive portion and the isolation portion are respectively spaced from the contact surface of the supporting pillar by the same distance.
In some embodiments, the conductive elastomer is a circular arc segment. One end of the arc segment is provided with an extension part which is connected with the rotating surface of the rotating piece. The other end of the arc section is provided with a contact part which is contacted with the contact surface of the base.
In some embodiments, the conductive elastomer is a circular arc segment. The arc segment comprises two extending parts at two opposite ends and a contact part between the two extending parts. The two extension ends are connected to the rotating surface of the rotating member. The contact part is contacted with the contact surface of the base.
In some embodiments, the circuit board overlapping structure further includes a conductive member located between the base and the rotating member, such that the rotating member is electrically connected to the base through the conductive member.
In some embodiments, the conductive member comprises at least one conductive dome. The conductive elastic sheet is in a winding shape and is abutted against the rotating piece.
In some embodiments, the conductive member comprises a plurality of conductive clips. The conductive elastic sheets are in an arch grid shape and surround and are embossed on the base body.
In some embodiments, the rotating member is cylindrical and covers the outer side of the seat body, and has a ring-shaped sidewall, and the ring-shaped sidewall is connected with the conductive member.
In some embodiments, the base includes a conductive seat and an isolation seat overlapped with each other. The conductive seat is provided with a conductive bump, and the isolation seat is provided with a through hole. The conductive bump is exposed on the surface of the isolation seat through the through hole to form a conductive part.
In some embodiments, the isolator mount also has a detent to form the isolator.
In some embodiments, the conductive seat includes a first conductive seat and a second conductive seat that are overlapped. The first conductive seat is provided with a conductive column and an opening. The conductive posts protrude through the openings to form conductive bumps.
According to the circuit board lapping structure of some embodiments of the invention, two circuit boards can be lapped together, and whether the two circuit boards are electrically conducted through the lapping structure can be selected. Therefore, different bonding materials are not required to be prepared according to the electrical conduction, and the material preparation cost can be saved. On the other hand, the assembly complexity and the production error rate can be reduced.
Drawings
Fig. 1 is a schematic diagram of a conventional circuit board bonding structure.
Fig. 2 is a perspective cross-sectional view of a circuit board overlapping structure according to an embodiment of the invention.
Fig. 3 is a cross-sectional view of a circuit board overlapping structure according to an embodiment of the invention.
Fig. 4 is a cross-sectional view of another state of a circuit board overlapping structure according to an embodiment of the invention.
Fig. 5 is an exploded perspective view (one) of a circuit board overlapping structure according to an embodiment of the invention.
Fig. 6 is an exploded perspective view of a circuit board overlapping structure according to an embodiment of the invention (ii).
Fig. 7 and 8 are perspective views of conductive elastomers according to some embodiments of the present invention.
Fig. 9 is an exploded perspective view of a base according to another embodiment of the present invention.
Fig. 10 is a cross-sectional view of a circuit board landing structure according to another embodiment of the invention.
The reference numbers are as follows:
1: first circuit board
11: through hole
2: second circuit board
21: through hole
3: base
4: lapping column
41 stud
42 screw cap
100: base
110 conducting part
120 contact surface
121 conductive part
122 isolating part
130 conductive seat
131 conductive bump
132 column
140 isolating seat
141 through hole
142 positioning groove
143 window (C)
144 hollow column
150 first conductive seat
151 conductive post
160 second conductive seat
161 opening
162 upright post
200 seat body
210 conducting part
220 abutting surface
221 groove
230 connecting part
300 support column
310 clamping part
400 rotating part
410 surface of revolution
420 conductive elastomer
421 an extension part
422 contact part
430 through hole
440 ring side wall
500 conductive member
510 conductive spring plate
520 conductive spring plate
530 electrically conductive tape
610 first circuit board
620 second circuit board
Detailed Description
Reference is made to fig. 2 to 6 in combination. Fig. 2 is a perspective cross-sectional view of a circuit board overlapping structure according to an embodiment of the invention. Fig. 3 is a cross-sectional view of a circuit board overlapping structure according to an embodiment of the invention. Fig. 4 is a cross-sectional view of another state of a circuit board overlapping structure according to an embodiment of the invention. Fig. 5 is an exploded perspective view (one) of a circuit board overlapping structure according to an embodiment of the invention. Fig. 6 is an exploded perspective view of a circuit board overlapping structure according to an embodiment of the invention (ii). The circuit board lap joint structure may be adapted to connect the first circuit board 610 and the second circuit board 620. The circuit board overlapping structure includes a base 100, a base 200, a supporting pillar 300 and a rotating member 400.
The base 100 is disposed on the first circuit board 610. The base 100 includes a conductive portion 110 and a contact surface 120. The contact surface 120 has a conductive portion 121 and an isolation portion 122. The conduction portion 110 is electrically connected to the conductive portion 121, and the conduction portion 110 is electrically isolated from the isolation portion 122. When the base 100 is disposed on the first circuit board 610, the conductive portion 121 can be electrically connected to the first circuit board 610 through the conductive portion 110. In the present embodiment, the conducting portion 110 may be further fixedly disposed on the first circuit board 610 by a Surface Mount Technology (SMT), but the invention is not limited thereto. In some embodiments, the base 100 can be fixed to the first circuit board 610 by other methods (e.g., plugging, screwing, clipping, etc.).
The base 100 is composed of a plurality of members. Here, the base 100 includes a conductive seat 130 and an isolation seat 140 overlapped with each other. The conductive base 130 is made of a conductive material, and the isolation base 140 is made of an electrically insulating material. The conductive pad 130 has a conductive bump 131, and the isolation pad 140 has a through hole 141. The conductive bump 131 is exposed on the surface of the isolation seat 140 through the through hole 141 to form the conductive portion 121. The isolation seat 140 further has a positioning groove 142 to form the isolation portion 122. The conductive base 130 further has a pillar 132, and the isolation base 140 further has a window 143 and a hollow pillar 144. The window 143 communicates with the inner space of the hollow pillar 144, and the inner space of the hollow pillar 144 corresponds to the pillar 132. Thus, the upright 132 may extend through the window 143 into the interior space of the hollow column 144 to form the support column 300.
In some embodiments, the isolation seat 140 is formed by injection molding.
In some embodiments, the conductive portion 121 is made of a conductive material, and the isolation portion 122 is made of an electrically insulating material. In some embodiments, the isolation portion 122 is made of a conductive material and is electrically isolated from the conducting portion 110 by other electrically insulating elements.
The base 200 is disposed on the second circuit board 620. The base 200 includes a conduction portion 210, an abutting surface 220 and a connection portion 230. The conductive portion 210 is electrically connected to the connecting portion 230. The connecting portion 230 is electrically connected to the rotating member 400. In this embodiment, the circuit board bonding structure further includes a conductive member 500. The conductive member 500 is made of a conductive material. The conductive member 500 is located between the base 200 and the rotating element 400, and is electrically connected to the rotating element 400 and the connecting portion 230 of the base 200, respectively. Thus, the rotating member 400 can be electrically connected to the base 200 through the conductive member 500. In some embodiments, the connecting portion 230 can be electrically connected to the rotating member 400 by other means, such as adding a conductive agent (e.g., conductive oil) between the rotating member 400 and the base 200 that are tightly nested.
Referring to fig. 4, the supporting column 300 is connected between the base 100 and the base body 200, so that the base 100 and the base body 200 maintain a certain distance. In the present embodiment, one end of the supporting column 300 is fixedly connected to the base 100, and the other end of the supporting column 300 abuts against the abutting surface 220 of the base 200. Here, the contact surface 220 is opposite to the conduction part 210, but the invention is not limited thereto. It should be noted that, for the sake of clarity, fig. 2 and fig. 3 are schematic diagrams showing a state that the supporting column 300 is not yet abutted against the abutting surface 220 of the seat body 200.
As shown in fig. 2 and 5, in some embodiments, the abutting surface 220 of the base 200 includes a groove 221 for receiving a portion of the supporting post 300 to assist in firmly abutting against the supporting post 300. Here, the opening shape of the groove 221 is a circular shape, but the invention is not limited thereto. When the supporting post 300 abuts against the base 200, the base 100 contacts with the rotating member 400 (not shown in fig. 4 for the conductive elastomer 420). The base 100 and the rotation member 400 provide a supporting force to maintain the distance between the first circuit board 610 and the second circuit board 620.
The rotating member 400 includes a rotating surface 410 and a conductive elastic body 420. The rotating surface 410 has a through hole 430 for the supporting pillar 300 to pass through the rotating member 400, so that the rotating surface 410 of the rotating member 400 can rotate around the supporting pillar 300. The conductive elastic body 420 is connected to the rotation surface 410 and extends toward the base 100. Therefore, the rotation of the rotation member 400 relative to the base 100 allows the conductive elastic body 420 to contact the conductive portion 121 or the isolation portion 122. When the conductive elastic body 420 contacts the conductive portion 121, the conductive portion 110 of the base 100 is electrically connected to the conductive portion 210 of the base 200, so that the first circuit board 610 and the second circuit board 620 can be electrically connected through the bonding structure. When the conductive elastic body 420 contacts the isolation portion 122, the conduction portion 110 of the base 100 and the conduction portion 210 of the base 200 are electrically isolated, so that the first circuit board 610 and the second circuit board 620 are not electrically conducted through the lap joint structure.
In some embodiments, the supporting column 300 is fixedly connected to at least one of the base 100 and the base body 200.
In some embodiments, the supporting column 300 is detachably connected to the base 100 and the base 200, respectively, and the rotating member 400 may be fixed or rotatable relative to the supporting column 300.
In the present embodiment, one end of the support post 300 has a snap-in portion 310. The locking portion 310 is an arrow-sagittal elastic locking claw for locking the rotating member 400 to prevent the rotating member 400 from being separated from the supporting post 300. The arrow-sagittal portion of the support post 300 (i.e., the end of the clip portion 310) at the end can be received in the groove 221 of the abutment surface 220 of the seat body 200 (as shown in fig. 4).
In this embodiment, the rotating member 400 further includes a ring sidewall 440 connected to the rotating surface 410, so that the rotating member 400 is cylindrical. The rotating member 400 covers the outer side of the base 200. That is, the cylindrical inner space is used for accommodating the conductive member 500 and the base 200. The annular sidewall 440 is connected to the conductive member 500, such that the base 200 and the rotating member 400 are electrically connected via the conductive member 500.
In some embodiments, the conductive member 500 may be implemented in the form of a wire or a conductive spring, for example. In the present embodiment, the conductive member 500 includes a plurality of conductive elastic pieces 510 and 520. The conductive elastic sheet 520 is in an arch grid shape and surrounds and is embossed on the base 200. That is, the conductive elastic pieces 520 are arranged around the side surface of the base 200 at intervals, and each conductive elastic piece 520 is arched and protrudes in a direction away from the base 200. The protruding portion of the conductive elastic piece 520 abuts against the annular sidewall 440 of the rotating member 400 to maintain the electrical connection between the conductive member 500 and the rotating member 400, and further to keep the rotating member 400 stable. The conductive member 500 further includes two conductive strips 530 respectively connected to two ends of the conductive elastic piece 520. In the present embodiment, two conductive elastic pieces 510 are taken as an example, but the invention is not limited thereto, and the number of the conductive elastic pieces may be greater or smaller. One end of the conductive elastic piece 510 is connected to the other components of the conductive member 500 (here, the conductive strip 530) to electrically connect to the base 200. The conductive elastic sheet 510 is coiled and has elastic restoring force, and can sufficiently abut against the rotating member 400 to maintain the electrical connection between the conductive member 500 and the rotating member 400. The conductive elastic sheet 510 is wound toward the base 200. Besides abutting against the rotating member 400, the conductive spring 510 may have its end contacting the base 200.
The base 200 further includes a connecting portion 230 for connecting the conductive member 500. In the present embodiment, the connecting portion 230 is located on the side surface of the base 200 and is recessed with respect to the conducting portion 210 and the abutting surface 220, so that the grid-shaped conductive elastic piece 520 and the two conductive strips 530 of the conductive member 500 can be clamped therebetween.
In the present embodiment, the conductive elastic body 420 is an arc segment, and includes two extending portions 421 respectively located at two opposite ends and a contact portion 422 located between the extending portions 421. The extension 421 is connected to the rotation surface 410 of the rotation member 400. The contact portion 422 contacts the contact surface 120 of the base 100. Therefore, the position of the conductive elastic body 420 contacting the base 100 can be changed by rotating the rotary member 400 left (clockwise) or right (counterclockwise).
Referring to fig. 7 and 8, perspective views of the conductive elastic body 420 according to some embodiments of the present invention are shown. The conductive elastic body 420 is different from the previous embodiment in that the conductive elastic body 420 has two extending portions 421, where the conductive elastic body 420 has only one extending portion 421, the extending portion 421 is located at one end of the conductive elastic body 420, and the other end of the conductive elastic body 420 has a contact portion 422 for contacting the contact surface 120 of the base 100. The rotating member 400 shown in fig. 8 is adapted to rotate left to change the position of the conductive elastic body 420 contacting the base 100; the rotating member 400 shown in fig. 8 is suitable for changing the position of the conductive elastic body 420 contacting the base 100 by rotating right.
In some embodiments, the contact portion 422 has a bump for positioning on the conductive portion 121 or the isolation portion 122, but the invention is not limited thereto.
In some embodiments, the conductive elastomer 420 is formed as a circular arc segment by die cutting the rotating surface 410 of the rotating member 400.
Refer to fig. 3 and 6. In some embodiments, the conductive portion 121 and the isolation portion 122 of the base 100 are respectively spaced from the contact surface 120 of the supporting pillar 300 by the same distance corresponding to the conductive elastic body 420 which is a circular arc segment. That is, the conductive portion 121 and the isolation portion 122 are located on a circle with the position where the supporting pillar 300 contacts the contact surface 120 as a center.
Refer to fig. 9 and 10. Fig. 9 is an exploded perspective view of a base 100 according to another embodiment of the present invention. Fig. 10 is a cross-sectional view of a circuit board landing structure according to another embodiment of the invention. The difference between the foregoing embodiments is that the conductive socket 130 may be composed of a plurality of members. Here, the conductive socket 130 includes a first conductive socket 150 and a second conductive socket 160 that are overlapped. The first conductive pad 150 has a conductive pillar 151, and the second conductive pad 160 has an opening 161 and a pillar 162. The conductive pillars 151 protrude through the openings 161 to form conductive bumps 131. The post 162 may extend into the interior space of the hollow post 144 to form the support post 300 described above. Compared with the conductive seat 130 formed by a single member, the conductive seat 130 is formed by a plurality of members, so that the difficulty of forming each member can be reduced.
In some embodiments, the first conductive socket 150 and the second conductive socket 160 are fixed by gluing.
In some embodiments, the base 200 and the rotating member 400 are made of a conductive material.
The shapes of the base 100, the base body 200, the supporting posts 300, the rotating member 400 and the conductive member 500 of the above embodiments are merely examples, and the invention is not limited thereto.
According to the circuit board lapping structure of some embodiments of the invention, two circuit boards can be lapped together, and whether the two circuit boards are electrically conducted through the lapping structure can be selected. Therefore, different bonding materials are not required to be prepared according to the electrical conduction, and the material preparation cost can be saved. On the other hand, the assembly complexity and the production error rate can be reduced. In addition, according to the circuit board overlapping structure of some embodiments of the invention, the circuit board is arranged on the circuit board through SMT, so that the routing space of the circuit board can be saved.
Claims (11)
1. A circuit board lap joint structure is suitable for connecting a first circuit board and a second circuit board, and comprises:
a base, used for being arranged on the first circuit board, comprising a contact surface which is provided with a conductive part and an isolating part;
a base body for being arranged on the second circuit board;
a supporting column connected between the base and the seat body; and
the rotating piece is electrically connected with the seat body and comprises a rotating surface and a conductive elastomer, the supporting column penetrates through the rotating piece, the conductive elastomer is connected with the rotating surface and extends towards the base, and the rotating piece can rotate relative to the base to enable the conductive elastomer to be in contact with the conductive part or the isolating part.
2. The circuit board assembly structure according to claim 1, wherein the conductive portion and the isolation portion are respectively spaced from the supporting pillar at the same distance from the contact surface.
3. The circuit board overlapping structure according to claim 1, wherein the conductive elastic body is an arc segment, one end of the arc segment has an extension portion connected to the rotation surface of the rotation member, and the other end of the arc segment has a contact portion contacting the contact surface of the base.
4. The circuit board assembly structure of claim 1, wherein the conductive elastic body is an arc segment, the arc segment includes two extending portions at opposite ends and a contact portion between the two extending portions, the two extending portions are connected to the rotating surface of the rotating member, and the contact portion contacts the contact surface of the base.
5. The circuit board overlapping structure according to claim 1, further comprising a conductive member disposed between the base and the rotating member, such that the rotating member is electrically connected to the base through the conductive member.
6. The circuit board attachment structure according to claim 5, wherein the conductive member comprises at least one conductive elastic piece, and the at least one conductive elastic piece is in a winding shape and abuts against the rotating member.
7. The circuit board assembly structure according to claim 5, wherein the conductive member comprises a plurality of conductive clips, and the plurality of conductive clips are in an arch-shaped grid shape and surround and are embossed on the base body.
8. The circuit board overlapping structure according to claim 5, wherein the rotating member is cylindrical and covers the outer side of the seat body, and has a ring-shaped sidewall, and the ring-shaped sidewall is connected to the conductive member.
9. The circuit board lap joint structure according to claim 1, wherein the base comprises a conductive seat and an isolation seat which are overlapped, the conductive seat has a conductive bump, the isolation seat has a through hole, and the conductive bump is exposed on the surface of the isolation seat through the through hole to form the conductive portion.
10. The circuit board overlapping structure according to claim 9, wherein the isolation seat further has a positioning groove to form the isolation portion.
11. The circuit board lap joint structure according to claim 9, wherein the conductive seat comprises a first conductive seat and a second conductive seat overlapped with each other, the first conductive seat has a conductive pillar, the first conductive seat has an opening, and the conductive pillar protrudes through the opening to form the conductive bump.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109132478A TWI726814B (en) | 2020-09-18 | 2020-09-18 | Circuit board fastening structure |
| TW109132478 | 2020-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114205999A true CN114205999A (en) | 2022-03-18 |
Family
ID=77036521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110901603.9A Pending CN114205999A (en) | 2020-09-18 | 2021-08-06 | Circuit board lapping structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114205999A (en) |
| TW (1) | TWI726814B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI828515B (en) * | 2023-01-11 | 2024-01-01 | 康揚企業股份有限公司 | Spacer columns with conductive function (2) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100402448B1 (en) * | 1994-04-07 | 2003-10-22 | 가부시끼가이샤 엠푸라스 | Socket assembly |
| US20090111297A1 (en) * | 2007-10-31 | 2009-04-30 | Quanta Computer Inc. | Connecting apparatus adapted in a board module |
| US20120048705A1 (en) * | 2010-08-30 | 2012-03-01 | Panasonic Corporation | Switching device |
| WO2012171565A1 (en) * | 2011-06-16 | 2012-12-20 | Siemens Aktiengesellschaft | Electrical contact device for connecting circuit boards |
| CN103403972A (en) * | 2011-03-07 | 2013-11-20 | 罗伯特·博世有限公司 | Contact plug for directly contacting circuit board |
| WO2015119257A1 (en) * | 2014-02-07 | 2015-08-13 | 日本発條株式会社 | Connection structure for semiconductor mounting substrate and connection unit for semiconductor mounting substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203748164U (en) * | 2014-01-08 | 2014-07-30 | 纬创资通股份有限公司 | Fixation structure and circuit board adapter |
| TWM538266U (en) * | 2016-08-04 | 2017-03-11 | Molex Taiwan Ltd | Power connection device assembly and power connection device |
-
2020
- 2020-09-18 TW TW109132478A patent/TWI726814B/en active
-
2021
- 2021-08-06 CN CN202110901603.9A patent/CN114205999A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100402448B1 (en) * | 1994-04-07 | 2003-10-22 | 가부시끼가이샤 엠푸라스 | Socket assembly |
| US20090111297A1 (en) * | 2007-10-31 | 2009-04-30 | Quanta Computer Inc. | Connecting apparatus adapted in a board module |
| US20120048705A1 (en) * | 2010-08-30 | 2012-03-01 | Panasonic Corporation | Switching device |
| CN103403972A (en) * | 2011-03-07 | 2013-11-20 | 罗伯特·博世有限公司 | Contact plug for directly contacting circuit board |
| WO2012171565A1 (en) * | 2011-06-16 | 2012-12-20 | Siemens Aktiengesellschaft | Electrical contact device for connecting circuit boards |
| WO2015119257A1 (en) * | 2014-02-07 | 2015-08-13 | 日本発條株式会社 | Connection structure for semiconductor mounting substrate and connection unit for semiconductor mounting substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI828515B (en) * | 2023-01-11 | 2024-01-01 | 康揚企業股份有限公司 | Spacer columns with conductive function (2) |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202213873A (en) | 2022-04-01 |
| TWI726814B (en) | 2021-05-01 |
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