JP2015109330A - Connection structure between substrates - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure between substrates which secures good connection state between wirings provided at separated substrates and achieves downsizing.SOLUTION: A connection structure of substrates includes: a conductive member having conductivity and provided between a first substrate and a second substrate which are separated from each other; and a fastening member which fastens the first substrate to the second substrate with the conductive member sandwiched between the first substrate and the second substrate. The conductive member includes a contact part having a plate-like shape, the contact part including one side of the plate-like shape contacted with a first wiring pattern provided on the first substrate and the other side of the plate-like shape contacted with a second wiring pattern provided on the second substrate.

Description

  Embodiments described herein relate generally to a connection structure between substrates.

  2. Description of the Related Art Conventionally, electronic devices have a structure in which a plurality of physically separated substrates are electrically connected via a conductive member. For example, there is one using a member made of metal such as iron and having conductivity for connection between substrates provided with wiring patterns constituting a main circuit of an inverter. The conventional connection structure between the substrates shown in FIGS. 14 to 16 includes a plurality of first substrates 61 and second substrates 62 that are physically separated into two in this case via a plate member 71 having conductivity. Electrically connected. The plate-like member 71 is formed by bending both sides of a metal plate, for example.

  As shown in FIG. 16, the plate-like member 71 is in contact with both the first wiring pattern 611 provided on the first substrate 61 and the second wiring pattern 621 provided on the second substrate 62. It is provided between the first substrate 61 and the second substrate 62. The first substrate 61 and the plate-like member 71 are fastened by a screw member 65 and a nut 66. The plate-like member 71 is fixed to the second substrate 62 with solder 67.

  The conventional connection structure between substrates shown in FIGS. 17 and 18 includes a cylindrical member 72 configured in a cylindrical shape instead of the plate-shaped member 71 configured of a metal plate. The cylindrical member 72 is a press-fit spacer made of, for example, iron metal, and is provided with a female screw inside the cylindrical shape. The cylindrical member 72 is press-fitted into the second substrate 62 while being in contact with the second wiring pattern 621. In addition, the cylindrical member 72 is fastened by the screw member 65 in a state where the cylindrical member 72 is in contact with the first wiring pattern 611.

  In such a configuration, it is necessary to secure a space for arranging the nut 66 into which the screw member 65 is screwed or the cylindrical member 72 having the female screw portion between the first substrate 61 and the second substrate 62. For this reason, the distance between the first substrate 61 and the second substrate 62 tends to be large, and as a result, the overall downsizing of the device having a connection structure between the substrates has been hindered.

  On the other hand, when the first wiring pattern 611 and the second wiring pattern 621 are directly contacted without using the conductive members 71 and 72 and the like, the members 71 and 72 and the nut 66 are replaced with the first substrate 61 and the second wiring pattern 621. Since it is not necessary to provide between the board | substrate 62, size reduction is attained. However, for example, a contact failure may occur due to a step formed by the protective films 612 and 622 for protecting the wiring patterns 611 and 621.

JP 2000-194000 A

  In view of this, a connection structure between substrates is provided that enables miniaturization while ensuring a good connection state between wirings provided on separate substrates.

  The connection structure between the substrates of the embodiment has conductivity, a conductive member provided between the separated first substrate and the second substrate, the first substrate, the conductive member, and the second substrate. And a fastening member that is fastened in a state of sandwiching. The conductive member is plate-shaped, and one side of the plate-like shape contacts the first wiring pattern provided on the first substrate, and the other side of the plate-like shape corresponds to the second wiring pattern provided on the second substrate. It has a contact part which contacts.

The perspective view which shows the connection structure between the board | substrates by 1st embodiment. The perspective view which decomposes | disassembles and shows the connection structure between the board | substrates of FIG. Sectional drawing which follows the X3-X3 line of FIG. FIG. 2 equivalent diagram according to the second embodiment FIG. 3 equivalent view according to the second embodiment FIG. 2 equivalent diagram according to the third embodiment FIG. 3 equivalent diagram according to the third embodiment FIG. 2 equivalent diagram according to the fourth embodiment FIG. 3 equivalent diagram according to the fourth embodiment FIG. 2 equivalent diagram according to the fifth embodiment FIG. 3 equivalent diagram according to the fifth embodiment FIG. 2 equivalent diagram according to the sixth embodiment FIG. 3 equivalent diagram according to the sixth embodiment The perspective view which shows the connection structure between the conventional boards using a plate-shaped member FIG. 14 is an exploded perspective view showing a connection structure between substrates in FIG. Sectional drawing which follows the X16-X16 line | wire of FIG. FIG. 15 equivalent view showing a conventional connection structure between substrates using a cylindrical member. FIG. 16 equivalent view showing a conventional connection structure between substrates using a cylindrical member

  Hereinafter, a connection structure between substrates according to a plurality of embodiments will be described with reference to the drawings. In addition, in each embodiment, the same code | symbol is attached | subjected to the substantially same component and description is abbreviate | omitted.

(First embodiment)
First, a first embodiment will be described with reference to FIGS.
The connection structure between the substrates shown in FIGS. 1 to 3 is used for, for example, an electrical connection between the substrates of the inverter circuit in the inverter device, and is physically separated from the first substrate 10 and the second substrate 20. Is electrically connected. In the embodiment, the inverter device includes a first substrate 10, a second substrate 20, a housing 30, a fastening member 40, and a conductive member 50.

  The 1st board | substrate 10 and the 2nd board | substrate 20 are comprised from insulating members, such as resin. As shown in FIG. 3, the first substrate 10 has a first wiring pattern 11. The second substrate 20 has a second wiring pattern 21. The first wiring pattern 11 and the second wiring pattern 21 are formed of a conductive metal thin film, for example, and constitute an inverter main circuit together with other wiring patterns and electronic components (not shown).

  As shown in FIG. 3, the first substrate 10 has a first protective film 12. The second substrate 20 has a second protective film 22. The first protective film 12 and the second protective film 22 are so-called resists such as thermosetting resins, and are thinly applied to the first substrate 10 and the second substrate 20. The first protective film 12 and the second protective film 22 protect the wiring patterns 11 and 21 from physical and chemical influences. The first protective film 12 covers substantially the entire first wiring pattern 11 with a part of the first wiring pattern 11 exposed. Similarly, the second protective film 22 covers substantially the entire second wiring pattern 22 with a part of the second wiring pattern 21 exposed.

  In this case, the exposed portion of the first wiring pattern 11, that is, the portion of the first wiring pattern 11 that is not covered with the first protective film 12 is defined as the first substrate side exposed portion 13. An exposed portion of the second wiring pattern 21, that is, a portion of the second wiring pattern 21 that is not covered with the second protective film 22 is defined as a second substrate side exposed portion 23. As shown in FIG. 2, the second substrate side exposed portion 23 is formed in a rectangular shape. Although not shown, the first substrate side exposed portion 13 is also formed in the same shape as the second substrate side exposed portion 23.

  The first substrate 10 has a first substrate hole 14. The first substrate hole 14 is in the exposed portion of the first wiring pattern 11, that is, in the first substrate side exposed portion 13 where the first protective film 12 does not exist, and penetrates the first substrate 10 together with the first wiring pattern 11 in a circle. Is formed. The second substrate 20 has a second substrate hole 24. The second substrate hole 24 is in an exposed portion of the second wiring pattern 21, that is, in the second substrate side exposed portion 23 where the second protective film 22 does not exist, and penetrates the second substrate 20 in a circle together with the second wiring pattern 21. Is formed.

  The housing 30 is made of an insulating material such as resin. The housing 30 is configured, for example, in a box shape, and stores the first substrate 10 and the second substrate 20 as well as electronic components that constitute the inverter device. The housing 30 is not limited to a box shape. The housing 30 has a support portion 31. As shown in FIGS. 2 and 3, the support portion 31 is formed integrally with the housing 30 so as to protrude from the housing 30 in a cylindrical shape. The support portion 31 is not limited to a cylindrical shape, and may be a polygonal column shape. Further, the support portion 31 may be configured separately from the housing 30.

  The first substrate 10 and the second substrate 20 are attached to the housing 30 by fixing means (not shown) while being supported by the support portion 31. The support part 31 has a housing part 311. The accommodating portion 311 has a hexagonal hole shape, and is formed from the end portion of the support portion 31 on the second substrate 20 side to the middle portion of the support portion 31. The nut 41 is housed in the housing portion 311 in a non-rotatable state.

  The fastening member 40 includes a nut 41 and a screw member 42. The nut 41 is a hexagonal nut which is a general-purpose product, for example. The screw member 42 is a seated screw that is a general-purpose product, for example. The screw member 42 has a male screw portion 421 and a head portion 422 that are integrally formed, and a seat portion 423 that is formed separately. The seat 423 is formed in an annular shape. Note that the screw member 42 may be configured integrally with the male screw portion 421, the head portion 422, and the seat portion 423. The outer diameter of the seat portion 423 is larger than the inner diameter of the first substrate hole portion 14. Further, the outer diameter of the male screw portion 421 is smaller than the inner diameter of the first substrate hole portion 14 and the inner diameter of the second substrate hole portion 24.

  The conductive member 50 is composed of a conductive member, for example, a metal member such as iron. The conductive member 50 has a contact portion 51 and a conductive member hole 52. The contact part 51 is formed in a rectangular plate shape. In the case of this embodiment, the contact part 51 constitutes the entire shape of the conductive member 50. The outer shape of the contact portion 51 is slightly smaller than the shapes of the first substrate side exposed portion 13 and the second substrate side exposed portion 23. The conductive member hole 52 is formed at a substantially central portion of the conductive member 50 and penetrates the contact portion 51 in a circular shape. The inner diameter of the conductive member hole 52 is larger than the outer diameter of the male screw portion 421 of the screw member 42.

  As shown in FIG. 3, the second substrate 20, the conductive member 50, and the first substrate 10 are attached to the support portion 31 of the housing 30 in order from the support portion 31 side. In this case, the first substrate 10 and the second substrate 20 have the first wiring pattern 11 and the second wiring pattern 21 facing each other, and the first substrate side exposed portion 13 and the second substrate side exposed portion 23 overlap. Arranged in this way. The conductive member 50 is sandwiched between the first substrate side exposed portion 13 and the second substrate side exposed portion 23.

  The male screw portion 421 of the screw member 42 is, from the first substrate 10 side, the first substrate hole portion 14 of the first substrate 10, the conductive member hole portion 52 of the conductive member 50, and the second substrate hole portion 24 of the second substrate 20. And is screwed into the nut 41 accommodated in the accommodating portion 311. Thereby, the fastening member 40 is fixing by pinching | pinching the 1st board | substrate 10, the electrically-conductive member 50, and the 2nd board | substrate 20 from the both sides.

  The conductive member 50 is in contact with both the first wiring pattern 11 and the second wiring pattern 21. That is, the contact portion 51 of the conductive member 50 has one surface in contact with the first wiring pattern 11 and the other surface in contact with the second wiring pattern 21. Therefore, the first wiring pattern 11 and the second wiring pattern 21 are electrically connected via the conductive member 50. In this case, the conductive member 50 is disposed so as not to overlap any of the stepped portion 121 of the first protective film 12 and the stepped portion 221 of the second protective film 22.

  According to this, the first wiring pattern 11 and the second wiring pattern 21 are electrically connected via the conductive member 50. The conductive member 50 does not overlap any of the stepped portion 121 of the first protective film 12 and the stepped portion 221 of the second protective film 22. Therefore, all of one surface of the conductive member 50 is in contact with the first wiring pattern 11 in the first substrate side exposed portion 13. Further, the other surface of the conductive member 50 is all in contact with the second wiring pattern 21 in the second substrate side exposed portion 23. Therefore, contact failure caused by the step portions 121 and 221 can be avoided. As a result, it is possible to ensure a good connection state between the first wiring pattern 11 and the second wiring pattern 21 provided on the physically separated first substrate 10 and second substrate 20.

  Further, the nut 41 constituting the fastening member 40 is not provided between the first substrate 10 and the second substrate 20. Therefore, it is not necessary to secure a space for arranging the nut 41 between the first substrate 10 and the second substrate 20. Therefore, the distance between the first substrate 10 and the second substrate 20 can be reduced, and as a result, the entire apparatus having the connection structure between the first substrate 10 and the second substrate 20 as described above. Can be miniaturized.

  Further, the conductive member 50 is not fixed to the second substrate 20 by soldering or the like. Therefore, the assembling work can be facilitated. Further, according to this, the conductive member 50 can be detached from the second substrate 20 even after being attached to the second substrate 20. Therefore, it is possible to redo when attaching the conductive member 50 to the second substrate 20, and it is possible to remove the conductive member 50 from the second substrate 20 and reuse it for another second substrate 20.

  The procedure for attaching the first substrate 10, the second substrate 20, and the conductive member 50 to the housing 30 can be as follows, for example. First, the first substrate 10, the conductive member 50, and the second substrate 20 are clamped by sandwiching the nut 41 and the screw member 42 of the fastening member 40. After that, the nut 30 is accommodated in the accommodating portion 311 of the support portion 31 so that the assembly of the first substrate 10, the conductive member 50, and the second substrate 20 is supported by the support portion 31. Attach to. Thereafter, the assembly of the first substrate 10, the second substrate 20, and the conductive member 50 is fixed to the housing 30 by fixing means (not shown).

  The procedure for attaching the first substrate 10, the second substrate 20, and the conductive member 50 to the housing 30 may be as follows, for example. First, the nut 41 is disposed in the housing portion 311. Thereafter, the second substrate 20, the conductive member 50, and the first substrate 10 are sequentially disposed on the support portion 31. Thereafter, the screw member 42 is passed from the first substrate 10 side through the first substrate hole 14, the conductive member hole 52, and the second substrate hole 24 and screwed into the nut 41. Thereafter, the assembly of the first substrate 10, the second substrate 20, and the conductive member 50 is fixed to the housing 30 by fixing means (not shown).

(Second embodiment)
Next, a second embodiment will be described with reference to FIGS. 4 and 5.
In the connection structure between substrates according to the second embodiment, the conductive member 50 is different from the first embodiment in that the conductive member 50 further includes a first bent portion 53 as a bent portion. In the present embodiment, the conductive member 50 has a first bent portion 53 integrally. The first bent portion 53 is provided near one corner side on one side of the contact portion 51. The first bent portion 53 is formed by bending a portion protruding from one side of the contact portion 51 in a direction perpendicular to the contact portion 51.

  The second substrate 20 further includes a first bent portion hole 25 and a first bent portion mounting portion 26 shown in FIG. The first bent portion hole 25 is provided corresponding to the first bent portion 53, and is a hole that is slightly larger than the outer shape of the first bent portion 53. The first bent portion hole 25 is provided in the region of the second substrate side exposed portion 23. The first bent portion attachment portion 26 is a metal thin film, like the second wiring pattern 21, and is provided on the opposite side of the second substrate 20 from the second wiring pattern 21. The first bent portion attachment portion 26 may be a part of another wiring pattern provided on the second substrate 20. The first bending portion 53 is attached to the first bending portion attachment portion 26 by the solder 27 after passing through the first bending portion hole portion 25.

According to this, the effect similar to said 1st embodiment is obtained by the point which can electrically connect the 1st wiring pattern 11 and the 2nd wiring pattern 21 in space-saving.
Further, in the present embodiment, the conductive member 50 is fixed to the second substrate 20 in a non-rotatable state by soldering the first bent portion 53 to the first bent portion mounting portion 26. Therefore, for example, the conductive member 50 rotates around the conductive member hole 52 through the screw member 42 to prevent the conductive member 50 from overlapping the stepped portions 121 and 221 and causing poor contact. it can. As a result, the connection state between the substrates 10 and 20 can be maintained in a good state.

(Third embodiment)
Next, a third embodiment will be described with reference to FIGS.
The connection structure between the substrates according to the third embodiment is that the conductive member 50 further includes a second bent portion 54 that is a bent portion, and the housing 30 further includes a fixing portion 32. Different from the embodiment. The second bent portion 54 is formed integrally with the contact portion 51 and is provided on the end portion side of the second substrate 20 in the vicinity of the conductive member 50. The second bent portion 54 is formed by bending a portion protruding from one side of the contact portion 51 at a right angle to the housing 30 side with respect to the contact portion 51 at a position that does not overlap the second substrate 20.

  The fixing part 32 is formed integrally with the housing 30. The fixed part 32 is provided side by side with the support part 31 and is provided so as to protrude from the housing 30 into a rectangular column shape. The fixing part 32 has a groove part 321. The groove portion 321 is a groove extending so as to be parallel to the short side portion 201 of the second substrate 20, and is slightly deeper than the length dimension of the second bent portion 54. As in the first embodiment, the conductive member 50 is fastened and fixed by the fastening member 40 while being sandwiched between the first substrate 10 and the second substrate 20. The second bent portion 54 of the conductive member 50 is fitted in the groove portion 321 of the fixed portion 32.

According to this, the same effect as each said embodiment can be acquired by the point which can electrically connect the 1st wiring pattern 11 and the 2nd wiring pattern 21 in space-saving.
Furthermore, the same effect as the second embodiment can be obtained in that the conductive member 50 is fixed to the second substrate 20 in a non-rotatable state.
Moreover, according to this embodiment, unlike the said 2nd embodiment, the 2nd bending part 54 of the electrically-conductive member 50 can be fixed to the fixing | fixed part 32 of the housing | casing 30 without soldering. Therefore, the assembling work can be facilitated.

  Further, if the relationship between the dimension of the groove width of the groove part 321 and the dimension of the plate thickness of the second bent part 54 is a clearance fit, the conductive member 50 can be removed even after the second bent part 54 is fitted into the groove part 321. It becomes possible. On the other hand, if the relationship between the groove width dimension of the groove part 321 and the plate thickness dimension of the second bent part 54 is tightly fitted, the conductive member 50 will have the first bent part 54 fitted into the groove part 321 once It cannot be removed easily. Thus, according to the present embodiment, whether or not the conductive member 50 can be detached is easily changed by changing the relationship between the groove width dimension of the groove part 321 and the plate thickness dimension of the second bent part 54. be able to.

(Fourth embodiment)
Next, a fourth embodiment will be described with reference to FIGS.
In the fourth embodiment, the conductive member 50 has two third bent portions 55 as bent portions. The third bent portion 55 is formed integrally with the contact portion 51, and is formed by bending portions protruding from opposite sides of the contact portion 51 to the housing 30 side at a right angle. The second substrate 20 has two holes 28 for third bent portions. The third bent portion hole 28 is a hole through which the third bent portion 55 passes, and is provided in the region of the second substrate side exposed portion 23 of the second substrate 20 corresponding to the third bent portion 55. . After the third bent portion 55 is passed through the third bent portion hole 28, the tip portion is bent to form the crimped portion 56. Thereby, the conductive member 50 is fixed to the second substrate 20.

According to this, the same effect as each said embodiment can be acquired by the point which can electrically connect the 1st wiring pattern 11 and the 2nd wiring pattern 21 in space-saving.
Moreover, the effect similar to said 2nd embodiment and 3rd embodiment is acquired by the point by which the electrically-conductive member 50 is fixed to the 2nd board | substrate 20 in the non-rotatable state.
In addition, since the conductive member 50 can be fixed to the second substrate 20 without using solder, facilities relating to assembly can be simplified.

(Fifth embodiment)
Next, a fifth embodiment will be described with reference to FIGS.
In the connection structure between substrates according to the fifth embodiment, the conductive member 50 has a locking portion 57. The locking portion 57 is formed integrally with the conductive member 50. The locking portion 57 is formed by bending the distal end portion of the third bending portion 55 into, for example, a curved shape.
The two third bent portions 55 are inserted into the third bent portion hole portions 28 while elastically deforming the locking portions 57, respectively. When the third bending portion 55 is inserted into the third bending portion hole 28, the locking portion 57 is locked around the third bending portion hole 28. Thereby, the conductive member 50 is fixed so as not to be easily detached from the second substrate 20.

According to this, the same effect as each said embodiment can be acquired by the point which can electrically connect the 1st wiring pattern 11 and the 2nd wiring pattern 21 in space-saving.
Moreover, the effect similar to said 2nd-4th embodiment is obtained by the point by which the electrically-conductive member 50 is fixed to the 2nd board | substrate 20 in the non-rotatable state.
Further, even after the conductive member 50 is attached to the second substrate 20, the conductive member 50 is removed from the second substrate 20 by elastically deforming the locking portion 57 and releasing the lock with the second substrate 20. Can do.

(Sixth embodiment)
Next, a sixth embodiment will be described with reference to FIGS.
In the connection structure between substrates according to the sixth embodiment, the conductive member 50 is formed to be bent in a U shape so as to sandwich either the first substrate 10 or the second substrate 20. The conductive member 50 is formed by bending so as to sandwich the second substrate 20. The conductive member 50 is attached so as to sandwich the second substrate 20 from one short side 201 side of the second substrate 20. In this case, in a state where the conductive member 50 is attached to the second substrate 20, the rotation of the conductive member 50 is restricted.

According to this, the same effect as each said embodiment can be acquired by the point which can electrically connect the 1st wiring pattern 11 and the 2nd wiring pattern 21 in space-saving.
Moreover, the effect similar to said 2nd-5th embodiment is obtained by the point by which the electrically-conductive member 50 is fixed to the 2nd board | substrate 20 in the non-rotatable state.
In addition, the conductive member 50 can be removed from the second substrate 20 even after being attached to the second substrate 20, in that the first embodiment, the third embodiment, or the fifth embodiment. The same effect can be obtained.

  In each of the above embodiments, expressions such as the first substrate 10 and the second substrate 20 are expressions used for convenience in order to specify a target substrate among a plurality of substrates. Therefore, in the above embodiments, the first substrate 10 and the second substrate 20 may be interchanged. Further, the number of substrates to be electrically connected is not limited to two, and may be three or more.

The contact portion 51 of the conductive member 50 may not be a flat plate. For example, the contact part 51 is good also as a structure which has an uneven | corrugated shape or a wave shape.
As mentioned above, the connection structure between the board | substrates of embodiment has electroconductivity, the electrically conductive member provided between the isolate | separated 1st board | substrate and the 2nd board | substrate, said 1st board | substrate, the said electrically conductive member, and said 2nd And a fastening member that is fastened with the substrate sandwiched therebetween. The conductive member is plate-shaped, and one side of the plate-like shape contacts the first wiring pattern provided on the first substrate, and the other side of the plate-like shape corresponds to the second wiring pattern provided on the second substrate. It has a contact part which contacts.

  According to this, since the first wiring pattern and the second wiring pattern are electrically connected via the conductive member, the first wiring provided on the physically separated first substrate and the second substrate A good connection state between the pattern and the second wiring pattern can be ensured. And since there is no need to secure a space for arranging a nut or the like between the first substrate and the second substrate, the distance between the first substrate and the second substrate can be reduced. As a result, it is possible to reduce the size of the entire device including the connection structure between the first substrate and the second substrate.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof.

  In the drawings, 10 is a first substrate, 11 is a first wiring pattern, 20 is a second substrate, 21 is a second wiring pattern, 32 is a fixing portion, 40 is a fastening portion, 50 is a conductive member, 51 is a contact portion, 53 Denotes a first bending portion (bending portion), 54 denotes a second bending portion (bending portion), 55 denotes a third bending portion (bending portion), and 57 denotes a locking portion.

Claims (7)

A conductive member having conductivity and provided between the separated first substrate and the second substrate;
A fastening member fastened in a state of sandwiching the first substrate, the conductive member, and the second substrate;
The conductive member is plate-shaped, and one side of the plate-like shape contacts the first wiring pattern provided on the first substrate, and the other side of the plate-like shape corresponds to the second wiring pattern provided on the second substrate. A connection structure between substrates having contact portions that come into contact with each other.   The connection structure between substrates according to claim 1, wherein the contact portion is formed in a flat plate shape. The conductive member has a bent portion formed by bending a part of a plate at the end of the contact portion;
The connection structure between substrates according to claim 1 or 2, wherein the bent portion is soldered to a substrate that passes through at least one of the first substrate and the second substrate and the bent portion passes through. The conductive member has a bent portion formed by bending a part of a plate at the end of the contact portion;
3. The connection structure between substrates according to claim 1, wherein a housing to which the first substrate and the second substrate are attached has a fixing portion into which the bending portion is inserted to fix the conductive member. The conductive member has a bent portion formed by bending a part of a plate at the end of the contact portion;
The said bending part penetrates at least any one of said 1st board | substrate or said 2nd board | substrate, and is fixing to the said board | substrate by bending the front-end | tip part of the said bending part. Connection structure. The conductive member has a bent part formed by bending a part of a plate at the end of the contact part, and a locking part formed by bending a tip part of the bent part,
The connection structure between substrates according to claim 1 or 2, wherein the bent portion penetrates at least one of the first substrate and the second substrate, and the locking portion is locked to the substrate.   The connection structure between substrates according to claim 1 or 2, wherein the conductive member is formed to bend so as to sandwich either the first substrate or the second substrate.

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