TWI721783B - 顯示模組 - Google Patents
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- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000011521 glass Substances 0.000 claims description 4
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- 235000012431 wafers Nutrition 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- Electroluminescent Light Sources (AREA)
Abstract
一種顯示模組包含一載板、一次基板單元、多個發光件,及一電路單元。該次基板單元是設置在該載板一側。該等發光件設置在該載板同一表面。該電路單元包括多個設置在該次基板單元上並與該等發光件電連接的電路模組,且每一個該電路模組包括用以控制該等發光件的一開關控制電路及一驅動電路。
Description
本發明是有關於一種顯示模組,特別是指一種發光源與驅動控制電路設置在不同基板上的顯示模組。
現有的顯示屏主要是由多個發光面板所組合而成,而單個發光面板的主要構成元件一般包括一電路板、多個設置在該電路板的一頂面的發光二極體,及多個設置在該電路板的一背面並電連接該等發光二極體的驅動控制電路,透過該等驅動控制電路來控制該等發光二極體的發光。
現有的該顯示屏已朝向高解析度的趨勢發展,因此,單一個發光面板上的單位面積中的發光二極體數量也會隨之增加,相對地,控制該等發光二極體的驅動控制電路的設置數量或其腳位也需一併提高。
然而,要將高密度的該等發光二極體與該等驅動控制電路同時設置在同一個電路板的兩相反面時,其輸出與輸入的腳位及對應的電連接線路布局也會隨之增加而更為複雜,因此,該電路板需要增加至八~十層或由更多層的複合層所構成,以因應高密度的元件設置及複雜的電路布局。
因此,本發明的目的,即在提供一種顯示模組。
於是,本發明顯示模組包含一載板、一次基板單元、多個發光件,及一電路單元。該次基板單元是設置在該載板一側。該等發光件設置在該載板同一表面。該電路單元包括多個設置在該次基板單元上並與該等發光件電連接的電路模組,且每一個該電路模組包括用以控制該等發光件的一開關控制電路及一驅動電路。
本發明之功效在於,透過將該等發光件與該電路單元分別設置在該載板與該次基板單元,使發光源與控制電路位在不同基板上,可有效減少構成該載板與該次基板單元的層數,從而降低製作成本與難度,並有效提升製程良率。
在本發明被詳細描述前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。
參閱圖1,本發明顯示模組的一第一實施例,包含一載板2、一次基板單元3、多個發光件4、一電路單元5,及一連接單元6。
具體地說,該次基板單元3是間隔地設置在該載板2一側,且該等發光件4是設置在該載板2的同一表面上,而該電路單元5則是設置在該次基板單元3上,再透過該連接單元6將該載板2與該次基板單元3電連接。
詳細地說,於本實施例中,該載板2的材料可以選用印刷電路板(PCB)、玻璃(glass),或晶圓(wafer),而該次基板單元3的材料也可選用印刷電路板(PCB)、玻璃(glass),或例如軟膜(film)的聚醯亞胺(polyimide,PI);該等發光件4則是以發光二極體(LED)為例做說明,但不限於此。
該電路單元5包括多個設置在該次基板單元3上並透過該連接單元6與該等發光件4電連接的電路模組51,且每一個該電路模組51包括用以控制該等發光件4的一開關控制電路(switch IC)511(見圖2)及一驅動電路(driver IC)512(見圖2)。換句話說,在本實施例中,是將該開關控制電路511及該驅動電路512整合在單一個該電路模組51中,從而將多個電路模組51設置在同一個次基板單元3;其中,該連接單元6是以排線為例做說明。
本實施例的顯示模組主要是包含兩個基板(該載板2與該次基板單元3),從將能主動產生光源的該等發光件4單獨設置在其中一基板(該載板2),然後再將用以控制該等發光件4的電路單元5設置在另一個基板(該次基板單元3),透過將發光源與電路分別設置在不同基板上時,可有效減少構成該載板2與該次基板單元3的層數,從而降低製程難度與製作成本,更能有效提升製程良率。
參閱圖2至圖4,本發明顯示模組的一第二實施例大致相同於該第一實施例,其不同處在於,該次基板單元3包括一第一次基板31,及一第二次基板32,且將該電路模組51中的該開關控制電路511與該驅動電路512彼此分離,而分別設置在該第一次基板31與該第二次基板32上。
具體地說,該第一次基板31與該第二次基板32是分別設置在該載板2側邊,而該開關控制電路511是設置在該第一次基板31上,該驅動電路512則是設置在該第二次基板32上,並透過該連接單元6電連接該載板2。要說明的是,該第一次基板31與該第二次基板32的設置位置並沒有特別限制,其可如圖2分別設置在該載板2的相鄰兩側邊,或如圖3分別設置在該載板2的相反兩側邊,甚至是如圖4設置在該載板2的相同側邊,再透過該連接單元6與該載板連接,其設置位置可依據應用的裝置機構態樣而彈性更動。
配合參閱圖5,進一步地,當該第一次基板31與該第二次基板32是分別選用軟性材質的薄膜時,則可直接貼附在該載板2上。
參閱圖6,本發明顯示模組的一第三實施例大致相同於該第二實施例,其不同處在於,該電路單元5還包括一與該開關控制電路511及該驅動電路512電連接的時序控制電路2,且該次基板單元3還包括一第三次基板33。
具體地說,該時序控制電路5設置在該第三次基板33,再透過該連接單元6與該載板2、該第一次基板31,及該第二次基板32彼此電連接。此處要說明的是,本實施例與圖6是以該時序控制電路5是以設置在單獨基板上,並位在該第一次基板31與該第二次基板32之間為例做說明,但實際應用上並不限於此,在實務上可依照走線方便與應用的機構設計來放置在其他位置,也可直接設置在該第一次基板31與該第二次基板32上。
綜上所述,本發明顯示模組,將能主動產生光源的該等發光件4單獨設置在該載板2,然後再將用以控制該等發光件4的電路單元5單獨設置該次基板單元3,或拆分該開關控制電路511及該驅動電路512而分別設置在該第一次基板31與該第二次基板32,也就是將發光源與電路分別設置在不同基板上,從而可有效減少構成該載板2與該次基板單元3的層數,從而降低製程難度與製作成本,更能有效提升製程良率,故確實能達成本發明的目的。
惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。
2:載板
3:次基板單元
31:第一次基板
32:第二次基板
33:第三次基板
4:發光件
5:電路單元
51:電路模組
511:開關控制電路
512:驅動電路
52:時序控制電路
6:連接單元
本發明的其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:
圖1是一俯視示意圖,說明本發明顯示模組的一第一實施例;
圖2是一俯視示意圖,說明本發明顯示模組的一第二實施例;
圖3是一俯視示意圖,輔助說明圖2本發明顯示模組該第二實施例的其他態樣;
圖4是一俯視示意圖,輔助說明圖2本發明顯示模組該第二實施例的另一態樣;
圖5是一俯視示意圖,輔助說明圖2本發明顯示模組該第二實施例的又一態樣;及
圖6是一俯視示意圖,說明本發明顯示模組的一第三實施例。
2:載板
3:次基板單元
4:發光件
5:電路單元
51:電路模組
6:連接單元
Claims (8)
- 一種顯示模組,包含:一載板;一次基板單元,設置在該載板一側,並與該載板彼此間隔設置;多個發光件,設置在該載板同一表面;及一電路單元,包括多個設置在該次基板單元上並與該等發光件電連接的電路模組,且每一個該電路模組包括用以控制該等發光件的一開關控制電路及一驅動電路。
- 如請求項1所述的顯示模組,該次基板單元包括一第一次基板,及一第二次基板,該等開關控制電路設置在該第一次基板,該等驅動電路設置在該第二次基板。
- 如請求項2所述的顯示模組,其中,第一次基板與第二次基板分別設置在該載板的相同側邊或不同側邊。
- 如請求項2所述的顯示模組,其中,該電路單元還包括一與該開關控制電路及該驅動電路電連接的時序控制電路。
- 如請求項4所述的顯示模組,該時序控制電路設置在該第一次基板或該第二次基板。
- 如請求項4所述的顯示模組,該次基板單元還包括一第三次基板,該時序控制電路設置在該第三次基板。
- 如請求項1所述的顯示模組,其中,該顯示模組還包含一用以電連接該等發光件與該電路單元的連接單元。
- 如請求項1所述的顯示模組,其中,該載板選自印刷電路板、玻璃,或晶圓,而該次基板單元則選自印刷電路板、 玻璃,或聚醯亞胺。
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TW109104889A TWI721783B (zh) | 2020-02-15 | 2020-02-15 | 顯示模組 |
CN202110038035.4A CN113270066A (zh) | 2020-02-15 | 2021-01-12 | 显示模块 |
US17/248,532 US11664481B2 (en) | 2020-02-15 | 2021-01-28 | Display device |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206684448U (zh) * | 2017-03-29 | 2017-11-28 | 肇庆高新区虎鲨电子技术有限公司 | 液晶显示装置 |
CN109493811A (zh) * | 2018-12-25 | 2019-03-19 | 厦门天马微电子有限公司 | 一种显示装置及其驱动方法 |
US10332462B2 (en) * | 2016-08-17 | 2019-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display module, and electronic device |
TWI682224B (zh) * | 2018-12-04 | 2020-01-11 | 友達光電股份有限公司 | 發光模組、驅動晶片以及驅動方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3810725B2 (ja) * | 2001-09-21 | 2006-08-16 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
JP2014102319A (ja) * | 2012-11-19 | 2014-06-05 | Sony Corp | 発光素子及び表示装置 |
CN204010634U (zh) * | 2014-08-22 | 2014-12-10 | 大连集思特科技有限公司 | Led 智能玻璃显示驱动器 |
KR102316986B1 (ko) * | 2014-12-09 | 2021-10-25 | 엘지디스플레이 주식회사 | 유기발광표시장치 |
US10356858B2 (en) * | 2016-09-26 | 2019-07-16 | Prilit Optronics, Inc. | MicroLED display panel |
CN108957852A (zh) * | 2018-07-16 | 2018-12-07 | 上海中航光电子有限公司 | 显示模组和显示装置 |
CN109148505B (zh) * | 2018-08-23 | 2022-04-29 | 京东方科技集团股份有限公司 | 一种顶发射MircroLED显示面板及其制造方法 |
-
2020
- 2020-02-15 TW TW109104889A patent/TWI721783B/zh active
-
2021
- 2021-01-12 CN CN202110038035.4A patent/CN113270066A/zh active Pending
- 2021-01-28 US US17/248,532 patent/US11664481B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10332462B2 (en) * | 2016-08-17 | 2019-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display module, and electronic device |
CN206684448U (zh) * | 2017-03-29 | 2017-11-28 | 肇庆高新区虎鲨电子技术有限公司 | 液晶显示装置 |
TWI682224B (zh) * | 2018-12-04 | 2020-01-11 | 友達光電股份有限公司 | 發光模組、驅動晶片以及驅動方法 |
CN109493811A (zh) * | 2018-12-25 | 2019-03-19 | 厦门天马微电子有限公司 | 一种显示装置及其驱动方法 |
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US20210257520A1 (en) | 2021-08-19 |
CN113270066A (zh) | 2021-08-17 |
US11664481B2 (en) | 2023-05-30 |
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