CN113270066A - 显示模块 - Google Patents

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CN113270066A
CN113270066A CN202110038035.4A CN202110038035A CN113270066A CN 113270066 A CN113270066 A CN 113270066A CN 202110038035 A CN202110038035 A CN 202110038035A CN 113270066 A CN113270066 A CN 113270066A
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circuit
unit
display module
secondary substrate
substrate
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林益胜
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Macroblock Inc
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Macroblock Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示模块，包含载板、次基板单元、多个发光件，及电路单元。所述次基板单元间隔地设置在所述载板一侧。所述发光件设置在所述载板同表面。所述电路单元包括多个设置在所述次基板单元上并与所述发光件电连接的电路模块，且每一个所述电路模块包括用于控制所述发光件的开关控制电路及驱动电路。通过将所述发光件与所述电路单元分别设置在所述载板与所述次基板单元，使发光源与控制电路位于不同基板上，可有效减少构成所述载板与所述次基板单元的层数，从而降低制作成本与难度，并有效提升制程良率。

Description

显示模块
技术领域
本发明涉及一种显示模块，特别是涉及一种发光源与驱动控制电路设置在不同基板上的显示模块。
背景技术
现有的显示屏主要是由多个发光面板所组合而成，而单个发光面板的主要构成元件一般包括电路板、多个设置在该电路板的顶面的发光二极管，及多个设置在该电路板的背面并电连接所述发光二极管的驱动控制电路，通过所述驱动控制电路来控制所述发光二极管的发光。
现有的该显示屏已朝向高解析度的趋势发展，因此，单一个发光面板上的单位面积中的发光二极管数量也会随之增加，相对地，控制所述发光二极管的驱动控制电路的设置数量或其脚位也需一并提高。
然而，要将高密度的所述发光二极管与所述驱动控制电路同时设置在同一个电路板的两相反面时，其输出与输入的脚位及对应的电连接线路布局也会随之增加而更为复杂，因此，该电路板需要增加至八到十层或由更多层的复合层所构成，以因应高密度的元件设置及复杂的电路布局。
发明内容
本发明的目的在于提供一种显示模块。
本发明显示模块包含载板、次基板单元、多个发光件，及电路单元，所述次基板单元间隔地设置在所述载板一侧，所述发光件设置在所述载板同表面，所述电路单元包括多个设置在所述次基板单元上并与所述发光件电连接的电路模块，且每一个所述电路模块包括用于控制所述发光件的开关控制电路及驱动电路。
本发明显示模块，所述次基板单元包括第一次基板，及第二次基板，所述开关控制电路设置在所述第一次基板，所述驱动电路设置在所述第二次基板。
本发明显示模块，所述第一次基板与所述第二次基板分别设置在所述载板的相同侧边或不同侧边。
本发明显示模块，所述电路单元还包括与所述开关控制电路及所述驱动电路电连接的时序控制电路。
本发明显示模块，所述时序控制电路设置在所述第一次基板或所述第二次基板。
本发明显示模块，所述次基板单元还包括第三次基板，所述时序控制电路设置在所述第三次基板。
本发明显示模块，还包含用于电连接所述发光件与所述电路单元的连接单元。
本发明显示模块，所述载板选自印刷电路板、玻璃，或晶圆，所述次基板单元选自印刷电路板、玻璃，或聚酰亚胺。
本发明的有益效果在于：通过将所述发光件与该电路单元分别设置在该载板与该次基板单元，使发光源与控制电路位于不同基板上，可有效减少构成该载板与该次基板单元的层数，从而降低制作成本与难度，并有效提升制程良率。
附图说明
图1是俯视示意图，说明本发明显示模块的第一实施例；
图2是俯视示意图，说明本发明显示模块的第二实施例；
图3是俯视示意图，辅助说明图2本发明显示模块该第二实施例的其他态样；
图4是俯视示意图，辅助说明图2本发明显示模块该第二实施例的另一态样；
图5是俯视示意图，辅助说明图2本发明显示模块该第二实施例的又一态样；及
图6是俯视示意图，说明本发明显示模块的第三实施例。
具体实施方式
下面结合附图及实施例对本发明进行详细说明。
参阅图1，本发明显示模块的第一实施例，包含载板2、次基板单元3、多个发光件4、电路单元5，及连接单元6。
具体地说，该次基板单元3间隔地设置在该载板2一侧，且所述发光件4设置在该载板2的同一表面上，而该电路单元5则是设置在该次基板单元3上，再通过该连接单元6将该载板2与该次基板单元3电连接。
详细地说，于本实施例中，该载板2的材料可以选用印刷电路板(PCB)、玻璃(glass)，或晶圆(wafer)，而该次基板单元3的材料也可选用印刷电路板(PCB)、玻璃(glass)，或例如软膜(film)的聚酰亚胺(polyimide，PI)；所述发光件4则是以发光二极管(LED)为例作说明，但不限于此。
该电路单元5包括多个设置在该次基板单元3上并通过该连接单元6与所述发光件4电连接的电路模块51，且每一个该电路模块51包括用于控制所述发光件4的开关控制电路(switch IC)511(见图2)及驱动电路(driver IC)512(见图2)。换句话说，在本实施例中，是将该开关控制电路511及该驱动电路512整合在单一个该电路模块51中，从而将多个电路模块51设置在同一个次基板单元3；其中，该连接单元6是以排线为例作说明。
本实施例的显示模块主要是包含两个基板(该载板2与该次基板单元3)，从将能主动产生光源的所述发光件4单独设置在其中一基板(该载板2)，然后再将用于控制所述发光件4的电路单元5设置在另一个基板(该次基板单元3)，通过将发光源与电路分别设置在不同基板上时，可有效减少构成该载板2与该次基板单元3的层数，从而降低制程难度与制作成本，更能有效提升制程良率。
参阅图2至图4，本发明显示模块的第二实施例大致相同于该第一实施例，其不同处在于，该次基板单元3包括第一次基板31，及第二次基板32，且将该电路模块51中的该开关控制电路511与该驱动电路512彼此分离，而分别设置在该第一次基板31与该第二次基板32上。
具体地说，该第一次基板31与该第二次基板32分别设置在该载板2侧边，而该开关控制电路511设置在该第一次基板31上，该驱动电路512则是设置在该第二次基板32上，并通过该连接单元6电连接该载板2。要说明的是，该第一次基板31与该第二次基板32的设置位置并没有特别限制，其可如图2分别设置在该载板2的相邻两侧边，或如图3分别设置在该载板2的相反两侧边，甚至是如图4设置在该载板2的相同侧边，再通过该连接单元6与该载板2连接，其设置位置可依据应用的装置机构态样而弹性更动。
配合参阅图5，进一步地，当该第一次基板31与该第二次基板32是分别选用软性材质的薄膜时，则可直接贴附在该载板2上。
参阅图6，本发明显示模块的第三实施例大致相同于该第二实施例，其不同处在于，该电路单元5还包括与该开关控制电路511及该驱动电路512电连接的时序控制电路52，且该次基板单元3还包括第三次基板33。
具体地说，该时序控制电路52设置在该第三次基板33，再通过该连接单元6与该载板2、该第一次基板31，及该第二次基板32彼此电连接。此处要说明的是，本实施例与图6是以该时序控制电路52设置在单独基板上并位于该第一次基板31与该第二次基板32之间为例作说明，但实际应用上并不限于此，在实务上可依照走线方便与应用的机构设计来放置在其他位置，也可直接设置在该第一次基板31与该第二次基板32上。
综上所述，本发明显示模块，将能主动产生光源的所述发光件4单独设置在该载板2，然后再将用于控制所述发光件4的电路单元5单独设置该次基板单元3，或拆分该开关控制电路511及该驱动电路512而分别设置在该第一次基板31与该第二次基板32，也就是将发光源与电路分别设置在不同基板上，从而可有效减少构成该载板2与该次基板单元3的层数，从而降低制程难度与制作成本，更能有效提升制程良率，所以确实能达成本发明的目的。

Claims (8)

1.一种显示模块，其特征在于：所述显示模块包含载板、次基板单元、多个发光件，及电路单元，所述次基板单元间隔地设置在所述载板一侧，所述发光件设置在所述载板同表面，所述电路单元包括多个设置在所述次基板单元上并与所述发光件电连接的电路模块，且每一个所述电路模块包括用于控制所述发光件的开关控制电路及驱动电路。
2.根据权利要求1所述的显示模块，其特征在于：所述次基板单元包括第一次基板，及第二次基板，所述开关控制电路设置在所述第一次基板，所述驱动电路设置在所述第二次基板。
3.根据权利要求2所述的显示模块，其特征在于：所述第一次基板与所述第二次基板分别设置在所述载板的相同侧边或不同侧边。
4.根据权利要求2所述的显示模块，其特征在于：所述电路单元还包括与所述开关控制电路及所述驱动电路电连接的时序控制电路。
5.根据权利要求4所述的显示模块，其特征在于：所述时序控制电路设置在所述第一次基板或所述第二次基板。
6.根据权利要求4所述的显示模块，其特征在于：所述次基板单元还包括第三次基板，所述时序控制电路设置在所述第三次基板。
7.根据权利要求1所述的显示模块，其特征在于：所述显示模块还包含用于电连接所述发光件与所述电路单元的连接单元。
8.根据权利要求1所述的显示模块，其特征在于：所述载板选自印刷电路板、玻璃，或晶圆，所述次基板单元选自印刷电路板、玻璃，或聚酰亚胺。
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CN107871454A (zh) * 2016-09-26 2018-04-03 启端光电股份有限公司 微发光二极管显示面板
CN108957852A (zh) * 2018-07-16 2018-12-07 上海中航光电子有限公司 显示模组和显示装置
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