TWI718297B - 雷射光線的檢查方法 - Google Patents

雷射光線的檢查方法 Download PDF

Info

Publication number
TWI718297B
TWI718297B TW106114781A TW106114781A TWI718297B TW I718297 B TWI718297 B TW I718297B TW 106114781 A TW106114781 A TW 106114781A TW 106114781 A TW106114781 A TW 106114781A TW I718297 B TWI718297 B TW I718297B
Authority
TW
Taiwan
Prior art keywords
laser light
inspection
laser beam
laser
axis direction
Prior art date
Application number
TW106114781A
Other languages
English (en)
Chinese (zh)
Other versions
TW201808511A (zh
Inventor
荒川太朗
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201808511A publication Critical patent/TW201808511A/zh
Application granted granted Critical
Publication of TWI718297B publication Critical patent/TWI718297B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW106114781A 2016-06-08 2017-05-04 雷射光線的檢查方法 TWI718297B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016114440A JP6757185B2 (ja) 2016-06-08 2016-06-08 レーザー光線の検査方法
JP2016-114440 2016-06-08

Publications (2)

Publication Number Publication Date
TW201808511A TW201808511A (zh) 2018-03-16
TWI718297B true TWI718297B (zh) 2021-02-11

Family

ID=60593588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106114781A TWI718297B (zh) 2016-06-08 2017-05-04 雷射光線的檢查方法

Country Status (4)

Country Link
JP (1) JP6757185B2 (ja)
KR (1) KR102231739B1 (ja)
CN (1) CN107470782B (ja)
TW (1) TWI718297B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE212018000330U1 (de) 2017-11-10 2020-05-15 Alps Alpine Co., Ltd. Eingabevorrichtung
JP7137930B2 (ja) * 2018-01-11 2022-09-15 株式会社ディスコ 被加工物の加工方法
JP7257604B2 (ja) * 2018-11-19 2023-04-14 株式会社東京精密 レーザ加工装置及びその制御方法
WO2020163995A1 (zh) * 2019-02-12 2020-08-20 大族激光科技产业集团股份有限公司 一种硬脆性产品的加工方法、装置以及系统
CN113551619B (zh) * 2020-04-26 2023-03-28 宝山钢铁股份有限公司 一种无缝钢管直线度的在线测量方法及装置
JP7465425B2 (ja) 2020-07-14 2024-04-11 株式会社東京精密 検査用ウェーハの検査方法及び検査装置並びに検査用ウェーハ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008254064A (ja) * 2007-04-09 2008-10-23 Sumitomo Heavy Ind Ltd レーザ照射装置及びビーム位置測定方法
JP2016103506A (ja) * 2014-11-27 2016-06-02 株式会社ディスコ 透過レーザービームの検出方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104248A (en) * 1976-02-27 1977-09-01 Toshiba Corp Abnormality detection device of laser beam
JP2000035525A (ja) * 1998-07-17 2000-02-02 Nec Corp 光ファイバの光軸調整方法
JP3408805B2 (ja) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP5065637B2 (ja) * 2006-08-23 2012-11-07 株式会社ディスコ ウエーハの加工方法
JP2009238782A (ja) * 2008-03-25 2009-10-15 Fujikura Ltd 半導体装置及びその製造方法
US9165832B1 (en) * 2014-06-30 2015-10-20 Applied Materials, Inc. Method of die singulation using laser ablation and induction of internal defects with a laser
JP2016076522A (ja) * 2014-10-02 2016-05-12 株式会社ディスコ ウエーハの加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008254064A (ja) * 2007-04-09 2008-10-23 Sumitomo Heavy Ind Ltd レーザ照射装置及びビーム位置測定方法
JP2016103506A (ja) * 2014-11-27 2016-06-02 株式会社ディスコ 透過レーザービームの検出方法

Also Published As

Publication number Publication date
CN107470782A (zh) 2017-12-15
KR102231739B1 (ko) 2021-03-23
CN107470782B (zh) 2021-01-29
TW201808511A (zh) 2018-03-16
JP2017217673A (ja) 2017-12-14
JP6757185B2 (ja) 2020-09-16
KR20170138935A (ko) 2017-12-18

Similar Documents

Publication Publication Date Title
TWI718297B (zh) 雷射光線的檢查方法
TWI708285B (zh) 被加工物的檢查方法、檢查裝置、雷射加工裝置、及擴張裝置
TWI657495B (zh) 晶圓的加工方法
TWI609732B (zh) 雷射加工裝置
TWI670131B (zh) 雷射加工裝置
TWI660802B (zh) Laser processing device
TW201635357A (zh) 晶圓的加工方法
TW201630287A (zh) 雷射加工裝置
US20160172182A1 (en) Laser processing apparatus
TWI802712B (zh) 雷射加工裝置
JP6281328B2 (ja) レーザーダイシング装置及びレーザーダイシング方法
KR20150108312A (ko) 판형물의 가공 방법
TWI653114B (zh) 晶圓的加工方法
TW201618178A (zh) 晶圓之加工方法
TW201635358A (zh) 晶圓的加工方法
TWI712079B (zh) 晶圓之加工方法
TWI772521B (zh) 晶圓加工方法
TWI655048B (zh) 穿透雷射光束的檢測方法
TWI736760B (zh) 晶圓加工方法
JP2020068316A (ja) ウェーハの加工方法
JP2021030284A (ja) レーザー加工装置の加工結果の良否判定方法
TW201625374A (zh) 晶圓的加工方法
JP2011056576A (ja) 板状物の加工方法
TW202200302A (zh) 雷射加工裝置之檢查方法
TW202112475A (zh) 雷射加工方法以及雷射加工裝置