TWI718297B - 雷射光線的檢查方法 - Google Patents
雷射光線的檢查方法 Download PDFInfo
- Publication number
- TWI718297B TWI718297B TW106114781A TW106114781A TWI718297B TW I718297 B TWI718297 B TW I718297B TW 106114781 A TW106114781 A TW 106114781A TW 106114781 A TW106114781 A TW 106114781A TW I718297 B TWI718297 B TW I718297B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser light
- inspection
- laser beam
- laser
- axis direction
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016114440A JP6757185B2 (ja) | 2016-06-08 | 2016-06-08 | レーザー光線の検査方法 |
JP2016-114440 | 2016-06-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201808511A TW201808511A (zh) | 2018-03-16 |
TWI718297B true TWI718297B (zh) | 2021-02-11 |
Family
ID=60593588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106114781A TWI718297B (zh) | 2016-06-08 | 2017-05-04 | 雷射光線的檢查方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6757185B2 (ja) |
KR (1) | KR102231739B1 (ja) |
CN (1) | CN107470782B (ja) |
TW (1) | TWI718297B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE212018000330U1 (de) | 2017-11-10 | 2020-05-15 | Alps Alpine Co., Ltd. | Eingabevorrichtung |
JP7137930B2 (ja) * | 2018-01-11 | 2022-09-15 | 株式会社ディスコ | 被加工物の加工方法 |
JP7257604B2 (ja) * | 2018-11-19 | 2023-04-14 | 株式会社東京精密 | レーザ加工装置及びその制御方法 |
WO2020163995A1 (zh) * | 2019-02-12 | 2020-08-20 | 大族激光科技产业集团股份有限公司 | 一种硬脆性产品的加工方法、装置以及系统 |
CN113551619B (zh) * | 2020-04-26 | 2023-03-28 | 宝山钢铁股份有限公司 | 一种无缝钢管直线度的在线测量方法及装置 |
JP7465425B2 (ja) | 2020-07-14 | 2024-04-11 | 株式会社東京精密 | 検査用ウェーハの検査方法及び検査装置並びに検査用ウェーハ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008254064A (ja) * | 2007-04-09 | 2008-10-23 | Sumitomo Heavy Ind Ltd | レーザ照射装置及びビーム位置測定方法 |
JP2016103506A (ja) * | 2014-11-27 | 2016-06-02 | 株式会社ディスコ | 透過レーザービームの検出方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52104248A (en) * | 1976-02-27 | 1977-09-01 | Toshiba Corp | Abnormality detection device of laser beam |
JP2000035525A (ja) * | 1998-07-17 | 2000-02-02 | Nec Corp | 光ファイバの光軸調整方法 |
JP3408805B2 (ja) * | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP5065637B2 (ja) * | 2006-08-23 | 2012-11-07 | 株式会社ディスコ | ウエーハの加工方法 |
JP2009238782A (ja) * | 2008-03-25 | 2009-10-15 | Fujikura Ltd | 半導体装置及びその製造方法 |
US9165832B1 (en) * | 2014-06-30 | 2015-10-20 | Applied Materials, Inc. | Method of die singulation using laser ablation and induction of internal defects with a laser |
JP2016076522A (ja) * | 2014-10-02 | 2016-05-12 | 株式会社ディスコ | ウエーハの加工方法 |
-
2016
- 2016-06-08 JP JP2016114440A patent/JP6757185B2/ja active Active
-
2017
- 2017-05-04 TW TW106114781A patent/TWI718297B/zh active
- 2017-06-01 KR KR1020170068343A patent/KR102231739B1/ko active IP Right Grant
- 2017-06-05 CN CN201710413237.6A patent/CN107470782B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008254064A (ja) * | 2007-04-09 | 2008-10-23 | Sumitomo Heavy Ind Ltd | レーザ照射装置及びビーム位置測定方法 |
JP2016103506A (ja) * | 2014-11-27 | 2016-06-02 | 株式会社ディスコ | 透過レーザービームの検出方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107470782A (zh) | 2017-12-15 |
KR102231739B1 (ko) | 2021-03-23 |
CN107470782B (zh) | 2021-01-29 |
TW201808511A (zh) | 2018-03-16 |
JP2017217673A (ja) | 2017-12-14 |
JP6757185B2 (ja) | 2020-09-16 |
KR20170138935A (ko) | 2017-12-18 |
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