TWI716925B - 半導體晶粒的拾取系統 - Google Patents

半導體晶粒的拾取系統 Download PDF

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Publication number
TWI716925B
TWI716925B TW108123632A TW108123632A TWI716925B TW I716925 B TWI716925 B TW I716925B TW 108123632 A TW108123632 A TW 108123632A TW 108123632 A TW108123632 A TW 108123632A TW I716925 B TWI716925 B TW I716925B
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TW
Taiwan
Prior art keywords
semiconductor die
value
picking
peeling
pressure
Prior art date
Application number
TW108123632A
Other languages
English (en)
Chinese (zh)
Other versions
TW202017078A (zh
Inventor
馬詰邦彦
松下晃児
小林泰人
Original Assignee
日商新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商新川股份有限公司 filed Critical 日商新川股份有限公司
Publication of TW202017078A publication Critical patent/TW202017078A/zh
Application granted granted Critical
Publication of TWI716925B publication Critical patent/TWI716925B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
TW108123632A 2018-07-06 2019-07-04 半導體晶粒的拾取系統 TWI716925B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-129254 2018-07-06
JP2018129254 2018-07-06

Publications (2)

Publication Number Publication Date
TW202017078A TW202017078A (zh) 2020-05-01
TWI716925B true TWI716925B (zh) 2021-01-21

Family

ID=69060497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108123632A TWI716925B (zh) 2018-07-06 2019-07-04 半導體晶粒的拾取系統

Country Status (6)

Country Link
JP (1) JP6855097B2 (ja)
KR (1) KR102362985B1 (ja)
CN (1) CN112368818B (ja)
SG (1) SG11202013203RA (ja)
TW (1) TWI716925B (ja)
WO (1) WO2020009242A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421412B2 (ja) 2020-05-01 2024-01-24 株式会社Fuji 吸着装置の状態判定装置
TWI803343B (zh) * 2022-06-09 2023-05-21 梭特科技股份有限公司 利用氣流檢測固晶狀態的方法
CN117373988B (zh) * 2023-11-27 2024-04-16 苏州恩腾半导体科技有限公司 一种基于伯努利卡盘的晶圆保持装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012256931A (ja) * 2012-08-24 2012-12-27 Renesas Electronics Corp 半導体集積回路装置の製造方法
US20130122615A1 (en) * 2006-09-06 2013-05-16 Renesas Electronics Corporation Fabrication method of semiconductor device
WO2015170645A1 (ja) * 2014-05-07 2015-11-12 株式会社新川 ボンディング装置およびボンディング方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945339B1 (ja) 1970-08-12 1974-12-03
JPS5813432B2 (ja) 1978-10-11 1983-03-14 日立造船株式会社 可燃性液体の洋上備蓄用タンクヤ−ド
JPH10275849A (ja) * 1997-03-31 1998-10-13 Hitachi Ltd ダイピックアップ方法および装置ならびにダイボンダ
JP3956636B2 (ja) * 2001-03-30 2007-08-08 松下電器産業株式会社 微小ワークの移載装置および移載方法
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
US8092645B2 (en) 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP5348084B2 (ja) * 2010-07-20 2013-11-20 パナソニック株式会社 チップピックアップ装置およびチップピックアップ方法
JP2013033850A (ja) 2011-08-02 2013-02-14 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
CN104733345B (zh) * 2013-12-20 2017-12-01 晟碟信息科技（上海）有限公司 裸片预剥离装置和方法
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5717910B1 (ja) * 2014-02-26 2015-05-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5888455B1 (ja) * 2015-04-01 2016-03-22 富士ゼロックス株式会社 半導体製造装置および半導体片の製造方法
JP6643197B2 (ja) * 2016-07-13 2020-02-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130122615A1 (en) * 2006-09-06 2013-05-16 Renesas Electronics Corporation Fabrication method of semiconductor device
JP2012256931A (ja) * 2012-08-24 2012-12-27 Renesas Electronics Corp 半導体集積回路装置の製造方法
WO2015170645A1 (ja) * 2014-05-07 2015-11-12 株式会社新川 ボンディング装置およびボンディング方法

Also Published As

Publication number Publication date
KR20200123828A (ko) 2020-10-30
SG11202013203RA (en) 2021-01-28
CN112368818A (zh) 2021-02-12
JP6855097B2 (ja) 2021-04-07
WO2020009242A1 (ja) 2020-01-09
JPWO2020009242A1 (ja) 2021-02-15
CN112368818B (zh) 2024-04-09
TW202017078A (zh) 2020-05-01
KR102362985B1 (ko) 2022-02-15

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