TWI716575B - 掃描電子顯微鏡設備及用於成像浮動金屬結構之充電控制的方法 - Google Patents

掃描電子顯微鏡設備及用於成像浮動金屬結構之充電控制的方法 Download PDF

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TWI716575B
TWI716575B TW106111261A TW106111261A TWI716575B TW I716575 B TWI716575 B TW I716575B TW 106111261 A TW106111261 A TW 106111261A TW 106111261 A TW106111261 A TW 106111261A TW I716575 B TWI716575 B TW I716575B
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Taiwan
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electron
sample
electron beam
additional
exposures
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TW106111261A
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English (en)
Chinese (zh)
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TW201801123A (zh
Inventor
亞瓊 希迪
魯卡 葛瑞拉
克里斯多福 希爾斯
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美商克萊譚克公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1471—Arrangements for directing or deflecting the discharge along a desired path for centering, aligning or positioning of ray or beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/261—Details
    • H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements
    • H01J2237/0044—Neutralising arrangements of objects being observed or treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0048—Charging arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/10—Lenses
    • H01J2237/103—Lenses characterised by lens type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20278—Motorised movement
    • H01J2237/20285—Motorised movement computer-controlled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/221—Image processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24592—Inspection and quality control of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2802—Transmission microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2809—Scanning microscopes characterised by the imaging problems involved

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electron Sources, Ion Sources (AREA)
TW106111261A 2016-04-04 2017-03-31 掃描電子顯微鏡設備及用於成像浮動金屬結構之充電控制的方法 TWI716575B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662318078P 2016-04-04 2016-04-04
US62/318,078 2016-04-04
US15/387,388 2016-12-21
US15/387,388 US10460903B2 (en) 2016-04-04 2016-12-21 Method and system for charge control for imaging floating metal structures on non-conducting substrates

Publications (2)

Publication Number Publication Date
TW201801123A TW201801123A (zh) 2018-01-01
TWI716575B true TWI716575B (zh) 2021-01-21

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TW106111261A TWI716575B (zh) 2016-04-04 2017-03-31 掃描電子顯微鏡設備及用於成像浮動金屬結構之充電控制的方法

Country Status (9)

Country Link
US (1) US10460903B2 (enExample)
EP (1) EP3443577A4 (enExample)
JP (1) JP7041666B2 (enExample)
KR (1) KR102215496B1 (enExample)
CN (1) CN109075001B (enExample)
IL (1) IL261616B (enExample)
SG (1) SG11201807248UA (enExample)
TW (1) TWI716575B (enExample)
WO (1) WO2017176595A1 (enExample)

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US10338013B1 (en) * 2018-01-25 2019-07-02 Kla-Tencor Corporation Position feedback for multi-beam particle detector
US12165838B2 (en) * 2018-12-14 2024-12-10 Kla Corporation Joint electron-optical columns for flood-charging and image-forming in voltage contrast wafer inspections
TWI743626B (zh) * 2019-01-24 2021-10-21 德商卡爾蔡司多重掃描電子顯微鏡有限公司 包含多束粒子顯微鏡的系統、對3d樣本逐層成像之方法及電腦程式產品
DE102019218315B3 (de) 2019-11-27 2020-10-01 Carl Zeiss Microscopy Gmbh Verfahren zur Spannungskontrastbildgebung mit einem Korpuskularvielstrahlmikroskop, Korpuskularvielstrahlmikroskop für Spannungskontrastbildgebung und Halbleiterstrukturen zur Spannungskontrastbildgebung mit einem Korpuskularvielstrahlmikroskop
US11239048B2 (en) * 2020-03-09 2022-02-01 Kla Corporation Arrayed column detector
EP4060714A1 (en) * 2021-03-18 2022-09-21 ASML Netherlands B.V. Flood column and charged particleapparatus
WO2024184078A2 (en) * 2023-03-03 2024-09-12 Carl Zeiss Smt Gmbh Method and systems for balancing charges on a surface of an object comprising integrated circuit patterns in a scanning electron microscope
WO2025098639A1 (en) * 2023-11-07 2025-05-15 Carl Zeiss Multisem Gmbh Multi-beam charged particle microscope for inspection with reduced charging effects

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US6066849A (en) * 1997-01-16 2000-05-23 Kla Tencor Scanning electron beam microscope
US20040000642A1 (en) * 1999-05-25 2004-01-01 Lee Veneklasen Apparatus and methods for secondary electron emission microscope with dual beam
US20050205800A1 (en) * 2004-03-05 2005-09-22 Thermo Electron Corporation Flood gun for charge neutralization
US20070235659A1 (en) * 2001-10-10 2007-10-11 Applied Materials Israel Limited Method and device for aligning a charged particle beam column
WO2008010777A1 (en) * 2006-07-21 2008-01-24 National University Of Singapore A multi-beam ion/electron spectra-microscope
US20100012838A1 (en) * 2008-07-16 2010-01-21 Ebara Corporation Inspection method and apparatus of a glass substrate for imprint
TW201532101A (zh) * 2013-12-02 2015-08-16 日立全球先端科技股份有限公司 掃描電子顯微鏡系統及利用其之圖案測量方法以及掃描電子顯微鏡
US20150364296A1 (en) * 2013-01-31 2015-12-17 Hitachi High-Technologies Corporation Composite Charged Particle Beam Detector, Charged Particle Beam Device, and Charged Particle Beam Detector
TW201621963A (zh) * 2014-08-29 2016-06-16 克萊譚克公司 掃描式電子顯微鏡及檢查和審查樣本之方法

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US5869833A (en) * 1997-01-16 1999-02-09 Kla-Tencor Corporation Electron beam dose control for scanning electron microscopy and critical dimension measurement instruments
US6344750B1 (en) * 1999-01-08 2002-02-05 Schlumberger Technologies, Inc. Voltage contrast method for semiconductor inspection using low voltage particle beam
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JP4066078B2 (ja) 1999-05-27 2008-03-26 株式会社ニコン 写像型電子顕微鏡
US6445199B1 (en) * 1999-12-14 2002-09-03 Kla-Tencor Corporation Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures
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US6066849A (en) * 1997-01-16 2000-05-23 Kla Tencor Scanning electron beam microscope
US20040000642A1 (en) * 1999-05-25 2004-01-01 Lee Veneklasen Apparatus and methods for secondary electron emission microscope with dual beam
US20070235659A1 (en) * 2001-10-10 2007-10-11 Applied Materials Israel Limited Method and device for aligning a charged particle beam column
US20050205800A1 (en) * 2004-03-05 2005-09-22 Thermo Electron Corporation Flood gun for charge neutralization
WO2008010777A1 (en) * 2006-07-21 2008-01-24 National University Of Singapore A multi-beam ion/electron spectra-microscope
US20100012838A1 (en) * 2008-07-16 2010-01-21 Ebara Corporation Inspection method and apparatus of a glass substrate for imprint
US20150364296A1 (en) * 2013-01-31 2015-12-17 Hitachi High-Technologies Corporation Composite Charged Particle Beam Detector, Charged Particle Beam Device, and Charged Particle Beam Detector
TW201532101A (zh) * 2013-12-02 2015-08-16 日立全球先端科技股份有限公司 掃描電子顯微鏡系統及利用其之圖案測量方法以及掃描電子顯微鏡
TW201621963A (zh) * 2014-08-29 2016-06-16 克萊譚克公司 掃描式電子顯微鏡及檢查和審查樣本之方法

Also Published As

Publication number Publication date
US20170287675A1 (en) 2017-10-05
US10460903B2 (en) 2019-10-29
CN109075001A (zh) 2018-12-21
SG11201807248UA (en) 2018-10-30
EP3443577A4 (en) 2019-12-18
KR20180123171A (ko) 2018-11-14
EP3443577A1 (en) 2019-02-20
KR102215496B1 (ko) 2021-02-10
IL261616A (en) 2019-03-31
TW201801123A (zh) 2018-01-01
WO2017176595A1 (en) 2017-10-12
JP2019511107A (ja) 2019-04-18
JP7041666B2 (ja) 2022-03-24
IL261616B (en) 2022-04-01
CN109075001B (zh) 2021-12-21

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