IL261616B - Method and system for charge control for imaging floating metal structures on non-conducting substrates" - Google Patents

Method and system for charge control for imaging floating metal structures on non-conducting substrates"

Info

Publication number
IL261616B
IL261616B IL261616A IL26161618A IL261616B IL 261616 B IL261616 B IL 261616B IL 261616 A IL261616 A IL 261616A IL 26161618 A IL26161618 A IL 26161618A IL 261616 B IL261616 B IL 261616B
Authority
IL
Israel
Prior art keywords
imaging
charge control
metal structures
floating metal
conducting substrates
Prior art date
Application number
IL261616A
Other languages
English (en)
Hebrew (he)
Other versions
IL261616A (en
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of IL261616A publication Critical patent/IL261616A/en
Publication of IL261616B publication Critical patent/IL261616B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1471Arrangements for directing or deflecting the discharge along a desired path for centering, aligning or positioning of ray or beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/153Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10Lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/18Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/20Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/261Details
    • H01J37/265Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004Charge control of objects or beams
    • H01J2237/0041Neutralising arrangements
    • H01J2237/0044Neutralising arrangements of objects being observed or treated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004Charge control of objects or beams
    • H01J2237/0048Charging arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/10Lenses
    • H01J2237/103Lenses characterised by lens type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202Movement
    • H01J2237/20278Motorised movement
    • H01J2237/20285Motorised movement computer-controlled
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22Treatment of data
    • H01J2237/221Image processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24592Inspection and quality control of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26Electron or ion microscopes
    • H01J2237/28Scanning microscopes
    • H01J2237/2802Transmission microscopes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26Electron or ion microscopes
    • H01J2237/28Scanning microscopes
    • H01J2237/2809Scanning microscopes characterised by the imaging problems involved

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electron Sources, Ion Sources (AREA)
IL261616A 2016-04-04 2018-09-05 Method and system for charge control for imaging floating metal structures on non-conducting substrates" IL261616B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662318078P 2016-04-04 2016-04-04
US15/387,388 US10460903B2 (en) 2016-04-04 2016-12-21 Method and system for charge control for imaging floating metal structures on non-conducting substrates
PCT/US2017/025595 WO2017176595A1 (en) 2016-04-04 2017-03-31 Method and system for charge control for imaging floating metal structures on non-conducting substrates

Publications (2)

Publication Number Publication Date
IL261616A IL261616A (en) 2019-03-31
IL261616B true IL261616B (en) 2022-04-01

Family

ID=59959718

Family Applications (1)

Application Number Title Priority Date Filing Date
IL261616A IL261616B (en) 2016-04-04 2018-09-05 Method and system for charge control for imaging floating metal structures on non-conducting substrates"

Country Status (9)

Country Link
US (1) US10460903B2 (enExample)
EP (1) EP3443577A4 (enExample)
JP (1) JP7041666B2 (enExample)
KR (1) KR102215496B1 (enExample)
CN (1) CN109075001B (enExample)
IL (1) IL261616B (enExample)
SG (1) SG11201807248UA (enExample)
TW (1) TWI716575B (enExample)
WO (1) WO2017176595A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10338013B1 (en) * 2018-01-25 2019-07-02 Kla-Tencor Corporation Position feedback for multi-beam particle detector
US12165838B2 (en) * 2018-12-14 2024-12-10 Kla Corporation Joint electron-optical columns for flood-charging and image-forming in voltage contrast wafer inspections
DE102019218315B3 (de) 2019-11-27 2020-10-01 Carl Zeiss Microscopy Gmbh Verfahren zur Spannungskontrastbildgebung mit einem Korpuskularvielstrahlmikroskop, Korpuskularvielstrahlmikroskop für Spannungskontrastbildgebung und Halbleiterstrukturen zur Spannungskontrastbildgebung mit einem Korpuskularvielstrahlmikroskop
US11239048B2 (en) * 2020-03-09 2022-02-01 Kla Corporation Arrayed column detector
KR20250154503A (ko) * 2023-03-03 2025-10-28 칼 짜이스 에스엠테 게엠베하 주사 전자 현미경에서 집적 회로 패턴을 포함하는 물체의 표면 상의 전하를 균형화하기 위한 방법 및 시스템
WO2025098639A1 (en) * 2023-11-07 2025-05-15 Carl Zeiss Multisem Gmbh Multi-beam charged particle microscope for inspection with reduced charging effects

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4055297A (en) * 1996-08-08 1998-02-25 William Marsh Rice University Macroscopically manipulable nanoscale devices made from nanotube assemblies
US5869833A (en) 1997-01-16 1999-02-09 Kla-Tencor Corporation Electron beam dose control for scanning electron microscopy and critical dimension measurement instruments
US6066849A (en) * 1997-01-16 2000-05-23 Kla Tencor Scanning electron beam microscope
US6232787B1 (en) * 1999-01-08 2001-05-15 Schlumberger Technologies, Inc. Microstructure defect detection
US6344750B1 (en) 1999-01-08 2002-02-05 Schlumberger Technologies, Inc. Voltage contrast method for semiconductor inspection using low voltage particle beam
US6586733B1 (en) * 1999-05-25 2003-07-01 Kla-Tencor Apparatus and methods for secondary electron emission microscope with dual beam
JP4066078B2 (ja) * 1999-05-27 2008-03-26 株式会社ニコン 写像型電子顕微鏡
US6445199B1 (en) * 1999-12-14 2002-09-03 Kla-Tencor Corporation Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures
US6627884B2 (en) 2001-03-19 2003-09-30 Kla-Tencor Technologies Corporation Simultaneous flooding and inspection for charge control in an electron beam inspection machine
DE60237952D1 (de) * 2001-10-10 2010-11-25 Applied Materials Israel Ltd Verfahren und Vorrichtung zur Ausrichtung einer Säule für Strahlen geladener Teilchen
GB2411763B (en) 2004-03-05 2009-02-18 Thermo Electron Corp Flood gun for charge neutralization
US7230240B2 (en) 2004-08-31 2007-06-12 Credence Systems Corporation Enhanced scanning control of charged particle beam systems
US7183546B2 (en) * 2004-09-16 2007-02-27 Applied Materials, Israel, Ltd. System and method for voltage contrast analysis of a wafer
US7205542B1 (en) * 2005-11-14 2007-04-17 Kla-Tencor Technologies Corporation Scanning electron microscope with curved axes
WO2008010777A1 (en) * 2006-07-21 2008-01-24 National University Of Singapore A multi-beam ion/electron spectra-microscope
US7488938B1 (en) * 2006-08-23 2009-02-10 Kla-Tencor Technologies Corporation Charge-control method and apparatus for electron beam imaging
JP2010027743A (ja) * 2008-07-16 2010-02-04 Ebara Corp インプリント用ガラス基板、レジストパターン形成方法、インプリント用ガラス基板の検査方法及び検査装置
JP5292412B2 (ja) * 2009-01-15 2013-09-18 株式会社日立ハイテクノロジーズ 荷電粒子線応用装置
JP5695917B2 (ja) * 2011-01-26 2015-04-08 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP6121651B2 (ja) * 2012-04-04 2017-04-26 株式会社日立ハイテクノロジーズ 電子顕微鏡、電子顕微鏡の観察条件の設定方法、および電子顕微鏡による観察方法
JP6014688B2 (ja) * 2013-01-31 2016-10-25 株式会社日立ハイテクノロジーズ 複合荷電粒子線装置
US9257260B2 (en) * 2013-04-27 2016-02-09 Kla-Tencor Corporation Method and system for adaptively scanning a sample during electron beam inspection
JP6316578B2 (ja) * 2013-12-02 2018-04-25 株式会社日立ハイテクノロジーズ 走査電子顕微鏡システム及びそれを用いたパターン計測方法並びに走査電子顕微鏡
US9767986B2 (en) * 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
US9165742B1 (en) * 2014-10-10 2015-10-20 Kla-Tencor Corporation Inspection site preparation
KR102387776B1 (ko) 2015-05-08 2022-04-15 케이엘에이 코포레이션 전자빔 시스템의 수차 보정 방법 및 시스템

Also Published As

Publication number Publication date
EP3443577A1 (en) 2019-02-20
CN109075001B (zh) 2021-12-21
KR102215496B1 (ko) 2021-02-10
WO2017176595A1 (en) 2017-10-12
EP3443577A4 (en) 2019-12-18
JP2019511107A (ja) 2019-04-18
TW201801123A (zh) 2018-01-01
IL261616A (en) 2019-03-31
JP7041666B2 (ja) 2022-03-24
SG11201807248UA (en) 2018-10-30
CN109075001A (zh) 2018-12-21
TWI716575B (zh) 2021-01-21
US20170287675A1 (en) 2017-10-05
KR20180123171A (ko) 2018-11-14
US10460903B2 (en) 2019-10-29

Similar Documents

Publication Publication Date Title
IL261616B (en) Method and system for charge control for imaging floating metal structures on non-conducting substrates"
SG11202003732YA (en) Target object positioning system and positioning method
GB2579911B (en) Image enhancement system and method
GB2581907B (en) Image enhancement method and system
EP3568729A4 (en) METHOD AND SYSTEM FOR MOTION CAMERA WITH EMBEDDED CARDANIUM SUSPENSION
KR101815394B9 (ko) 벽면 이동을 위한 비행로봇 메커니즘 및 제어방법
GB2572404B (en) Method and system for controlling processing
ZA201800701B (en) Reclaimer control system and method
GB2575096B (en) Motion restriction system and method
SG11202100074SA (en) System and method for facilitating enhanced offline payment
SI3546137T1 (sl) Robotski sistem in način krmiljenja robota
EP3586087A4 (en) IMAGE-BASED CONFIRMATION SYSTEM AND METHOD
ZA202000147B (en) Method and system for short-process copper smelting
ES3048307T3 (en) Method and systems for departure control
KR101882111B1 (ko) 영상 간의 특질 변환 시스템 및 그 방법
GB2570449B (en) Method and system for auto-setting of cameras
GB201904454D0 (en) Tracking system and method
NO20190136A1 (en) System and method for underwater surveillance
GB201800340D0 (en) Imaging system and method
SG11202011659RA (en) System and method for facilitating reclamation requests
GB2574205B (en) Robot interaction system and method
GB2564387B (en) Method and system for auto-setting of cameras
PL3611119T3 (pl) Wysuwny pomost przeładunkowy oraz sposób użytkowania tego pomostu
GB201902757D0 (en) Imaging system and method
GB2570448B (en) Method and system for improving auto-setting of cameras