TWI714953B - 印刷電路板 - Google Patents

印刷電路板 Download PDF

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Publication number
TWI714953B
TWI714953B TW108102666A TW108102666A TWI714953B TW I714953 B TWI714953 B TW I714953B TW 108102666 A TW108102666 A TW 108102666A TW 108102666 A TW108102666 A TW 108102666A TW I714953 B TWI714953 B TW I714953B
Authority
TW
Taiwan
Prior art keywords
resin layer
layer
hole
circuit board
printed circuit
Prior art date
Application number
TW108102666A
Other languages
English (en)
Chinese (zh)
Other versions
TW202007238A (zh
Inventor
崔晸宇
閔太泓
張俊亨
宋堯韓
Original Assignee
南韓商三星電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW202007238A publication Critical patent/TW202007238A/zh
Application granted granted Critical
Publication of TWI714953B publication Critical patent/TWI714953B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW108102666A 2018-07-12 2019-01-24 印刷電路板 TWI714953B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판
KR10-2018-0081253 2018-07-12

Publications (2)

Publication Number Publication Date
TW202007238A TW202007238A (zh) 2020-02-01
TWI714953B true TWI714953B (zh) 2021-01-01

Family

ID=69170021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102666A TWI714953B (zh) 2018-07-12 2019-01-24 印刷電路板

Country Status (3)

Country Link
JP (1) JP7238241B2 (enExample)
KR (1) KR102158711B1 (enExample)
TW (1) TWI714953B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
US12446153B2 (en) * 2020-07-29 2025-10-14 Kyocera Corporation Circuit substrate and method for manufacturing the same
JP2022087730A (ja) * 2020-12-01 2022-06-13 味の素株式会社 プリント配線板
WO2022186037A1 (ja) * 2021-03-04 2022-09-09 Tdk株式会社 多層配線基板及びその製造方法
CN222263174U (zh) * 2022-03-07 2024-12-27 株式会社村田制作所 电路基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI238681B (en) * 1998-06-26 2005-08-21 Ibiden Co Ltd Multilayer printed wiring board and method of producing the same
CN104010815A (zh) * 2011-12-22 2014-08-27 太阳油墨制造株式会社 干膜及使用其的印刷电路板、印刷电路板的制造方法、以及倒装芯片安装基板
CN107887361A (zh) * 2016-09-30 2018-04-06 三星电机株式会社 扇出型半导体封装件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117345A (ja) * 1997-06-19 1999-01-22 Ibiden Co Ltd 多層プリント配線板
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG162620A1 (en) 2003-04-15 2010-07-29 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
US8431832B2 (en) * 2007-11-28 2013-04-30 Kyocera Corporation Circuit board, mounting structure, and method for manufacturing circuit board
JP5631281B2 (ja) * 2010-08-31 2014-11-26 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI238681B (en) * 1998-06-26 2005-08-21 Ibiden Co Ltd Multilayer printed wiring board and method of producing the same
CN104010815A (zh) * 2011-12-22 2014-08-27 太阳油墨制造株式会社 干膜及使用其的印刷电路板、印刷电路板的制造方法、以及倒装芯片安装基板
CN107887361A (zh) * 2016-09-30 2018-04-06 三星电机株式会社 扇出型半导体封装件

Also Published As

Publication number Publication date
KR102158711B1 (ko) 2020-09-22
TW202007238A (zh) 2020-02-01
KR20200007308A (ko) 2020-01-22
JP2020013976A (ja) 2020-01-23
JP7238241B2 (ja) 2023-03-14

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