KR102158711B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102158711B1
KR102158711B1 KR1020180081253A KR20180081253A KR102158711B1 KR 102158711 B1 KR102158711 B1 KR 102158711B1 KR 1020180081253 A KR1020180081253 A KR 1020180081253A KR 20180081253 A KR20180081253 A KR 20180081253A KR 102158711 B1 KR102158711 B1 KR 102158711B1
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KR
South Korea
Prior art keywords
resin layer
layer
circuit
via hole
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180081253A
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English (en)
Korean (ko)
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KR20200007308A (ko
Inventor
최정우
민태홍
장준형
송요한
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020180081253A priority Critical patent/KR102158711B1/ko
Priority to TW108102666A priority patent/TWI714953B/zh
Priority to JP2019010618A priority patent/JP7238241B2/ja
Publication of KR20200007308A publication Critical patent/KR20200007308A/ko
Application granted granted Critical
Publication of KR102158711B1 publication Critical patent/KR102158711B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020180081253A 2018-07-12 2018-07-12 인쇄회로기판 Active KR102158711B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판
TW108102666A TWI714953B (zh) 2018-07-12 2019-01-24 印刷電路板
JP2019010618A JP7238241B2 (ja) 2018-07-12 2019-01-24 プリント回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200030203A Division KR102194703B1 (ko) 2020-03-11 2020-03-11 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20200007308A KR20200007308A (ko) 2020-01-22
KR102158711B1 true KR102158711B1 (ko) 2020-09-22

Family

ID=69170021

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180081253A Active KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP7238241B2 (enExample)
KR (1) KR102158711B1 (enExample)
TW (1) TWI714953B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
WO2022024907A1 (ja) * 2020-07-29 2022-02-03 京セラ株式会社 回路基板およびその製造方法
JP2022087730A (ja) * 2020-12-01 2022-06-13 味の素株式会社 プリント配線板
WO2022186037A1 (ja) * 2021-03-04 2022-09-09 Tdk株式会社 多層配線基板及びその製造方法
JP7758154B2 (ja) * 2022-03-07 2025-10-22 株式会社村田製作所 回路基板及び回路基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117345A (ja) * 1997-06-19 1999-01-22 Ibiden Co Ltd 多層プリント配線板
MY120077A (en) * 1998-06-26 2005-08-30 Ibiden Co Ltd Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
KR101097076B1 (ko) 2003-04-15 2011-12-22 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판과 그 제조 방법
JP5066192B2 (ja) * 2007-11-28 2012-11-07 京セラ株式会社 配線基板及び実装構造体
JP5631281B2 (ja) * 2010-08-31 2014-11-26 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
KR20140110954A (ko) * 2011-12-22 2014-09-17 다이요 잉키 세이조 가부시키가이샤 드라이 필름 및 그것을 사용한 프린트 배선판, 프린트 배선판의 제조 방법, 및 플립 칩 실장 기판
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
KR101952864B1 (ko) * 2016-09-30 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法

Also Published As

Publication number Publication date
JP2020013976A (ja) 2020-01-23
JP7238241B2 (ja) 2023-03-14
TWI714953B (zh) 2021-01-01
TW202007238A (zh) 2020-02-01
KR20200007308A (ko) 2020-01-22

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