TWI710856B - Chemically amplified photosensitive resin composition and insulation film prepared from the same - Google Patents

Abstract

The present invention provides a chemically amplified photosensitive resin composition capable of obtaining an insulating film excellent in pattern adhesion and uniformity, and an insulating film produced therefrom. The present invention relates to a chemically amplified photosensitive resin composition and an insulating film produced therefrom. In more detail, it relates to a chemically amplified photosensitive resin composition and an insulating film produced therefrom. The chemically amplified photosensitive resin composition contains (A) a binder resin and (B) a photoacid. The generator and (C) solvent can obtain an insulating film with excellent pattern adhesion and uniformity, wherein (A) the adhesive resin contains (a-1) at least a part of the phenolic hydroxyl group or the carboxyl group with an acid-decomposable group Group-protected resin, (a-2) epoxy-containing acrylic resin, and (a-3) silicone resin.

Description

Chemically amplified photosensitive resin composition and insulating film produced therefrom

The present invention relates to a chemically amplified photosensitive resin composition (chemically amplified photosensitive resin composition) and an insulating film produced therefrom.

In display devices such as thin film transistor (TFT) type liquid crystal display devices, as a protective film for protecting and insulating TFT (thin film transistor) circuits, inorganic protective films such as silicon nitride have been used. membrane. However, since the dielectric constant is high, there is a problem that the aperture ratio does not increase. In order to eliminate this problem, an organic insulating film with a low dielectric constant tends to be more required.

As such an organic insulating film, a photosensitive resin is generally used, which is a polymer compound that undergoes a chemical reaction via light and an electron beam and changes its solubility in a specific solvent. Then, the microfabrication of the circuit pattern is performed through the change in the polarity of the polymer caused by the photoreaction of the organic insulating film and the crosslinking reaction. In particular, the above-mentioned organic insulating film material utilizes the changing characteristics of the solubility to a solvent such as an alkaline aqueous solution after exposure.

The above-mentioned organic insulating film is classified into a positive type and a negative type according to the solubility of the photosensitive portion for development. The positive photoresist is a method in which the exposed part is dissolved in a developer to form a pattern, and the negative photoresist is a method in which the exposed part is insoluble in the developer and the unexposed part is dissolved to form a pattern.

Among them, for the positive organic insulating film, by using an alkaline aqueous solution, it is possible to avoid the use of the organic developer used in the negative organic insulating film. This is not only advantageous in terms of the working environment, but also theoretically can prevent the swelling phenomenon of the part that is not exposed to ultraviolet rays, so it has the advantage of improving the resolution. In addition, it also has the following advantages: After the organic film is formed, it is easily removed by a peeling liquid, and when a defective panel in the process occurs, by removing the organic film, the substrate recovery and reusability are significantly improved.

In particular, as such an organic insulating film, when constituting an insulating film of a liquid crystal display device, etc., the insulating film is required to have excellent insulation, low thermal expansion for reducing stress at the interface when it is coated on a substrate, and Physically tough characteristics, etc.

Furthermore, the aforementioned insulating film, protective film, etc. inevitably form an interface with metals, silicon compounds, and the like. In this case, excellent adhesion is a very important element in terms of device reliability. In order to provide interconnection paths between circuits, the insulating film undergoes a process of forming fine patterns. At this time, if photosensitivity is imparted to the insulating film itself, it is possible to reduce the conventional process of applying another photoresist on the insulating film to form a pattern, so that a fine pattern can be formed more easily.

For this reason, for the above-mentioned positive organic insulating film composition, studies using the following compositions are actively being conducted: Acrylic photosensitive resins used as representative adhesive resins are the Novolac resin, polyimide, silicone and other adhesive resins are added with photosensitive compounds (PAC, photo active compound). Recently, the above-mentioned insulating film has been commercialized, and the time has come to sell various components using the above-mentioned insulating film.

In particular, when the insulating film must be formed on the silicon nitride film, in order to improve the adhesion, the silicon nitride film is surface treated with hexamethyldisilazane (HDMS) in advance, but HDMS is Very harmful substances to the human body.

In order to solve this problem, Korean Laid-open Patent No. 10-2010-0049687 discloses a positive photosensitive resin composition comprising: a phenol resin modified with a compound having an unsaturated hydrocarbon group, which is formed under the action of light Acidic compounds, thermal crosslinking agents and solvents. However, the sensitivity is not good, and if HDMS is not used, sufficient adhesion is still not obtained.

Prior art literature

Patent literature

【Patent Document 1】

Korean Patent Publication No. 10-2010-0049687

The object of the present invention is to provide a chemically amplified photosensitive resin composition having excellent adhesion to a substrate.

In addition, an object of the present invention is to provide a chemically amplified photosensitive resin composition having excellent sensitivity, transparency and gradient of the formed pattern.

Furthermore, an object of the present invention is to provide an insulating film produced from the chemically amplified photosensitive resin composition.

1. A chemically amplified photosensitive resin composition comprising: (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group, and (a-2) an epoxy group-containing acrylic resin (A) Binder resin, (B) photoacid generator, and (C) solvent with (a-3) silicone resin.

2. The chemically amplified photosensitive resin composition according to the above item 1, wherein the resin (a-1) includes at least one of the monomers represented by the following chemical formula 1, chemical formula 2, chemical formula 3, and chemical formula 4 It is made by polymerization.

[化學式1中，R為經碳數1至6的烷基取代或未經取代的碳數1至6的烷基；四氫吡喃基；或者經碳數1至6的烷氧基或碳數4至8的環烷氧基取代或未經取代的碳數1至6的烷基。]

[In Chemical Formula 1, R is an alkyl group with 1 to 6 carbons substituted or unsubstituted by an alkyl group with 1 to 6 carbons; tetrahydropyranyl; or an alkoxy group with 1 to 6 carbons or carbon Cycloalkoxy substituted or unsubstituted alkyl having 1 to 6 carbons having 4 to 8. ]

[化學式2中，R₁為氫原子或甲基，R₂為碳數1至6的烷基或碳數4至8的環烷基。]

[In Chemical Formula 2, R ₁ is a hydrogen atom or a methyl group, and R ₂ is an alkyl group having 1 to 6 carbons or a cycloalkyl group having 4 to 8 carbons. ]

[化學式3中，R₁為氫原子或甲基，R₂為碳數3至8的伸烷基，R₃為碳數1至6的烷基或碳數4至8的環烷基。]

[In Chemical Formula 3, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 3 to 8 carbons, and R ₃ is an alkyl group having 1 to 6 carbons or a cycloalkyl group having 4 to 8 carbons. ]

[化學式4中，R₁為氫原子或甲基，R₂為碳數1至6的伸烷基或碳數4至8的伸環烷基，R₃為碳數1至6的烷基或碳數4至8的環烷基。]

[In chemical formula 4, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons or a cycloalkylene group having 4 to 8 carbons, and R ₃ is an alkyl group having 1 to 6 carbons or Cycloalkyl having 4 to 8 carbons. ]

3. The chemically amplified photosensitive resin composition according to the above item 1, wherein the repeating unit formed from the monomer of the above chemical formula 1 to 4 is contained at 20 to 60 mol% with respect to the entire resin (a-1) .

4. The chemically amplified photosensitive resin composition according to the above item 1, wherein the weight average molecular weight of the resin (a-1) is 5,000 to 35,000.

5. The chemically amplified photosensitive resin composition according to the above item 1, wherein the (a-2) resin is formed by polymerizing a monomer represented by the following Chemical Formula 5 or Chemical Formula 6.

[化學式5中，R₁為氫原子或甲基，R₂為碳數1至6的伸烷基，R₃與R₄相互獨立地為氫原子或碳數1至6的烷基、或者可以相互連接而形成碳數3至8的環，m為1至6的整數。]

[In chemical formula 5, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons, and R ₃ and R ₄ are independently a hydrogen atom or an alkyl group having 1 to 6 carbons, or may They are connected to each other to form a ring having 3 to 8 carbon atoms, and m is an integer of 1 to 6. ]

[化學式6中，R₁為氫原子或甲基，R₂為碳數1至6的伸烷基，R₃與R₄相互獨立地為氫原子或碳數1至6的烷基、或者可以相互連接而 形成碳數3至8的環。]

[In Chemical Formula 6, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons, and R ₃ and R ₄ are independently a hydrogen atom or an alkyl group having 1 to 6 carbons, or may Connect to each other to form a ring with 3 to 8 carbon atoms. ]

6. The chemically amplified photosensitive resin composition according to the above item 5, wherein the resin composition (a-2) contains 5 to 60 mol% of repeats formed from the monomer represented by the chemical formula 5 or 6 unit.

7. The chemically amplified photosensitive resin composition according to the above item 1, wherein the weight average molecular weight of the resin (a-2) is 5,000 to 40,000.

8. The chemically amplified photosensitive resin composition according to the above item 1, wherein the (a-3) resin is a resin obtained by polymerizing monomers represented by the following Chemical Formula 7, Chemical Formula 8, and Chemical Formula 9 below.

[Chemical Formula 7] Si(OR ₁ ) ₄ [In Chemical Formula 7, R _{1 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. ]

[Chemical formula 8] CH ₃ Si(OR ₂ ) ₃ [In Chemical formula 8, R _{2 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. ]

[Chemical Formula 9] C ₆ H ₅ Si(OR ₃ ) ₃ [In Chemical Formula 9, R _{3 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. ]

9. The chemically amplified photosensitive resin composition according to the above item 8, which contains 10 to 60 mol% of the repeating unit formed by the monomer represented by Chemical Formula 7, relative to the entire resin (a-3), and 10 to 60 Mole% of the repeating unit formed by the monomer represented by Chemical Formula 8, 10 to 60 mol% of the repeating unit formed by the monomer represented by Chemical Formula 9.

10. The chemically amplified photosensitive resin composition according to the above item 1, wherein the weight average molecular weight of the resin (a-3) is 500 to 20,000.

11. The chemically amplified photosensitive resin composition according to the above item 1, wherein the adhesive resin contains (a-1) 30 to 55 parts by weight of resin and (a-2) relative to 100 parts by weight of the total adhesive resin 30 to 60 parts by weight of resin and (a-3) 1 to 25 parts by weight of resin.

12. The chemically amplified photosensitive resin composition according to the above item 1, wherein the photoacid generator is selected from the group consisting of diazonium salt, phosphonium salt, sulfonate, iodonium salt, imidate sulfonate, and oxime One or more of sulfonate compounds, diazobismuth compounds, diazide compounds, o-nitrobenzylsulfonate compounds, and triazine compounds.

13. The chemically amplified photosensitive resin composition according to the above item 1, wherein the solvent is one or more selected from ethers, acetates, esters, ketones, amides, and lactones.

14. An insulating film obtained by curing the chemically amplified photosensitive resin composition according to any one of the above items 1 to 13.

15. An image display device having the insulating film described in the above item 14.

If the chemically amplified photosensitive resin composition of the present invention is used, an insulating film excellent in pattern adhesion and uniformity can be obtained.

In addition, if the chemically amplified photosensitive resin composition of the present invention is used, it is possible to obtain high sensitivity and significantly improved transmittance.

The chemically amplified photosensitive resin composition of the present invention has excellent resolution, improved fluidity, and easy processing.

<Chemically amplified photosensitive resin composition>

The embodiment of the present invention provides a chemically amplified photosensitive resin composition comprising: (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group, (a-2 ) Acrylic resins containing epoxy groups and (a-3) silicone resins (A) adhesive resins, (B) photoacid generators, and (C) solvents can achieve pattern adhesion and Insulating film with excellent uniformity.

Hereinafter, the chemically amplified photosensitive resin composition according to the embodiment of the present invention will be described in detail.

(A) Adhesive resin

The adhesive resin system of the present invention includes (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group, (a-2) an epoxy-containing acrylic resin, and (a- 3) Three kinds of resins including silicone resin.

The photosensitive resin composition of the present invention can form a photosensitive pattern excellent in adhesion and uniformity to a substrate by including the above-mentioned three kinds of resins as binder resins. In particular, even for silicon nitride films, excellent adhesion can be exhibited without processing with HMDS.

[Resin in which at least a part of phenolic hydroxyl group or carboxyl group is protected with acid-decomposable group (a-1)]

(a-1) The resin system exhibits a function of imparting solubility to a cured pattern with a photoacid generator during exposure.

(a-1) The resin is a resin containing a functional group in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid-decomposable group. The above-mentioned functional group is not particularly limited, and it can be exemplified by including the following chemical formula 1, chemical formula 2, A resin obtained by polymerizing at least one of the monomers shown in Chemical Formula 3 and Chemical Formula 4.

[化學式1中，R為經碳數1至6的烷基取代或未經取代的碳數1至6的烷基；四氫吡喃基；或者經碳數1至6的烷氧基或碳數4至8的環烷氧基取代或未經取代的碳數1至6的烷基。]

[In Chemical Formula 1, R is an alkyl group with 1 to 6 carbons substituted or unsubstituted by an alkyl group with 1 to 6 carbons; tetrahydropyranyl; or an alkoxy group with 1 to 6 carbons or carbon Cycloalkoxy substituted or unsubstituted alkyl having 1 to 6 carbons having 4 to 8. ]

[化學式2中，R₁為氫原子或甲基，R₂為碳數1至6的烷基或碳數4至8的環烷基。]

[In Chemical Formula 2, R ₁ is a hydrogen atom or a methyl group, and R ₂ is an alkyl group having 1 to 6 carbons or a cycloalkyl group having 4 to 8 carbons. ]

[化學式3中，R₁為氫原子或甲基，R₂為碳數3至8的伸烷基，R₃為碳數1至6的烷基或碳數4至8的環烷基。]

[In Chemical Formula 3, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 3 to 8 carbons, and R ₃ is an alkyl group having 1 to 6 carbons or a cycloalkyl group having 4 to 8 carbons. ]

[化學式4中，R₁為氫原子或甲基，R₂為碳數1至6的伸烷基或碳數4至8的伸環烷基，R₃為碳數1至6的烷基或碳數4至8的環烷基。]

[In chemical formula 4, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons or a cycloalkylene group having 4 to 8 carbons, and R ₃ is an alkyl group having 1 to 6 carbons or Cycloalkyl having 4 to 8 carbons. ]

In the resin (a-1), the repeating units formed by the monomers represented by the above chemical formulas 1 to 4 can be appropriately mixed according to the specific types of other monomers to be copolymerized, so there is no special content and mixing ratio. The limitation is, for example, from the viewpoint of pattern formation, it is preferable to polymerize by containing 20 to 60 mol% with respect to the entire resin (a-1).

(a-1) The resin may further include a repeating unit formed from a monomer having a phenolic hydroxyl group or a carboxyl group (not protected by an acid-decomposable group). Examples of such monomers include the above-mentioned ethylenically unsaturated monomers having a carboxyl group, hydroxystyrene, and hydroxymethylstyrene.

From the viewpoint of improvement of the residual film rate and reduction of residues, the weight average molecular weight of the (a-1) resin is preferably 5,000 to 35,000, more preferably 5,000 to 20,000.

[Epoxy-containing acrylic resin (a-2)]

The acrylic resin (a-2) according to the present invention is an epoxy group-containing resin, and since it can be thermally cured, a pattern with higher durability can be formed. Thermal curing can be performed in, for example, a post-baking process.

In order to introduce an epoxy group into an acrylic resin, the (a-2) resin according to an embodiment of the present invention can be formed by polymerizing a monomer represented by the following chemical formula 5.

[化學式5中，R₁為氫原子或甲基，R₂為碳數1至6的伸烷基，R₃與R₄相互獨立地為氫原子或碳數1至6的烷基、或者可以相互連接而形成碳數3至8的環，m為1至6的整數。]

[In chemical formula 5, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons, and R ₃ and R ₄ are independently a hydrogen atom or an alkyl group having 1 to 6 carbons, or may They are connected to each other to form a ring having 3 to 8 carbon atoms, and m is an integer of 1 to 6. ]

Chemical Formula 5 shown a single system containing an oxygen atom adjacent to R _2, the case of containing oxygen atoms in the chain, increasing the rotation radius of a single bond, the glass transition temperature decreases, the fluidity is improved, can be easily processed .

In addition, in Chemical Formula 5, by adjusting m, the length of the monomer can be adjusted, and thus the slope of the formed pattern can be adjusted. In this case, by reducing the gradient of the pattern, it is possible to prevent the cured film from falling off and cracks during the vapor deposition of the transparent electrode.

Furthermore, as another embodiment of the present invention, the (a-2) resin according to the present invention can be formed by polymerizing a monomer represented by the following chemical formula 6 to introduce epoxy groups.

[化學式6中，R₁為氫原子或甲基，R₂為碳數1至6的伸烷基，R₃與R₄相互獨立地為氫原子或碳數1至6的烷基、或者能夠相互連接而 形成碳數3至8的環。]

[In chemical formula 6, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons, and R ₃ and R ₄ are independently a hydrogen atom or an alkyl group having 1 to 6 carbons, or can Connect to each other to form a ring with 3 to 8 carbon atoms. ]

The monomer represented by Chemical Formula 6 has the advantage of improving the transmittance of the polymerized resin.

(a-2) In the resin, repeating units containing epoxy groups, for example, repeating units formed by monomers represented by the above chemical formula 5 or 6 can be appropriately mixed according to the specific types of other monomers to be copolymerized. The content and mixing ratio are not particularly limited. For example, relative to the entire resin (a-2), it is polymerized at 5 mol% to 60 mol%. This improves the transparency, the ease of processing, and adjusts the gradient of the pattern. It is preferable from the viewpoint of maximizing the effect of preventing the occurrence of cracks in the cured film during vapor deposition.

(a-2) Resin In addition to the monomer of Chemical Formula 5 or Chemical Formula 6, a monomer that can form an acrylic resin and can be polymerized in the art can be used.

For example, (a-2) resin can use ethylenic unsaturated monomer which has a carboxyl group. The type of ethylenically unsaturated monomer having a carboxyl group is not particularly limited, and examples include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid; Its acid anhydride; ω-carboxyl polycaprolactone mono(meth)acrylate and the like, mono(meth)acrylates which have polymers of carboxyl and hydroxyl groups at both ends, etc. Preferably, it can be acrylic acid and methacrylic acid. These can be used individually or in mixture of two or more types.

In addition, the (a-2) resin may further contain at least one other monomer copolymerizable with the above-mentioned monomer and polymerized. For example, styrene, vinyl toluene, methyl styrene, p-chlorostyrene, o-methoxy styrene, m-methoxy styrene, p-methoxy styrene, o-vinyl Aromatic vinyl compounds such as benzyl methyl ether, m-vinylbenzyl methyl ether, p-vinylbenzyl methyl ether; N-cyclohexyl maleimide, N-benzyl maleimide Amine, N-phenylmaleimide, N-o-hydroxyphenylmaleimide, N-m-hydroxyphenylmaleimide, N-p-hydroxyphenylmaleimide , N-o-methylphenylmaleimide, N-m-methylphenylmaleimide, N-p-methylphenylmaleimide, N-o-methoxy N-substituted maleimide compounds such as phenyl maleimide, N-m-methoxyphenyl maleimide, N-p-methoxyphenyl maleimide; Methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate , Alkyl (meth)acrylates such as secondary butyl (meth)acrylate and tertiary butyl (meth)acrylate; cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, ( 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.02,6]decane-8-yl (meth)acrylate, 2-biscyclopentyloxyethyl (meth)acrylate, (meth)acrylate Cycloaliphatic (meth)acrylates such as isobornyl acrylate; aryl (meth)acrylates such as phenyl (meth)acrylate and benzyl (meth)acrylate; 3-(methacrylic acid) Oxymethyl)oxetane, 3-(methacryloxymethyl)-3-ethyloxetane, 3-(methacryloxymethyl)-2-tri Fluoromethyloxetane, 3-(methacryloxymethyl)-2-phenyloxetane, 2-(methacryloxymethyl)oxetane, Unsaturated oxetane compounds such as 2-(methacryloxymethyl)-4-trifluoromethyloxetane; cycloalkane, bicycloalkane or tricycloalkane with carbon number 4 to 16 Ring-substituted (meth)acrylates, etc. These can be used individually or in mixture of two or more types.

From the viewpoint of improvement of developability and reduction of residue, the weight average molecular weight of the acrylic resin (a-2) is preferably 5,000 to 40,000, and more preferably 15,000 to 30,000.

[Silicone resin (a-3)]

The silicone resin (a-3) according to the present invention has a function of improving the adhesion to the substrate.

The silicone resin (a-3) may be a resin containing monomers represented by the following chemical formula 7, chemical formula 8, and chemical formula 9 by polymerization.

[Chemical Formula 7] Si(OR ₁ ) ₄ [In Chemical Formula 7, R _{1 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. ]

[Chemical formula 8] CH ₃ Si(OR ₂ ) ₃ [In Chemical formula 8, R _{2 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. ]

[Chemical Formula 9] C ₆ H ₅ Si(OR ₃ ) ₃ [In Chemical Formula 9, R _{3 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. ]

The repeating unit formed by the monomer represented by the above chemical formula 7 can be contained in 10 to 60 mol% with respect to the entire silicone resin. The repeating unit formed by the monomer represented by the above chemical formula 8 can be contained in 10 to 60 mol% with respect to the entire silicone resin. The repeating unit formed by the monomer represented by the above chemical formula 9 can be contained at 10 to 60 mol% with respect to the entire silicone resin. Within the aforementioned content range, it becomes the most excellent in terms of adhesion to the substrate, pattern angle, developability, and the like.

From the viewpoints of improvement of developability and reduction of residues, the weight average molecular weight of the silicone resin (a-3) is preferably 500 to 20,000, and more preferably 1,000 to 7,000.

The adhesive resin system according to the present invention can significantly improve the adhesion to the substrate without reducing the pattern forming ability by mixing the above-mentioned three kinds of resins. In the case of silicon nitride film, excellent adhesion is maintained without HDMS treatment.

In the adhesive resin according to the present invention, the mixing ratio of the three resins is not particularly limited, but from the viewpoint of improving the residual film rate and adhesion, relative to 100 parts by weight of the total adhesive resin, (a- 1) The mixing weight ratio of (a-2) and (a-3) resin is (a-1) 30 to 55 parts by weight of resin, (a-2) 30 to 60 parts by weight of resin and (a-3) resin 1 to 25 parts by weight.

The content of the adhesive resin involved in the present invention is not particularly limited if it is within the scope of its function. For example, it can be contained at 5 to 50% by weight relative to the total weight of the composition. It is contained at 10 to 40% by weight. If the content of the binder resin is 5% by weight or more and 50% by weight or less relative to the total weight of the composition, it has the following advantages: it has an appropriate viscosity and maximizes the effect of improving sensitivity and resolution.

(B) Photoacid generator

The photoacid generator is a compound that generates acid by irradiating active light or radiation.

The type of photoacid generator is not particularly limited, and examples include diazonium salt series, phosphonium salt series, sulfonium salt series, iodonium salt series, imidate sulfonate series, oxime sulfonate series, and diazonium salt series. Double chute series, double chute series, o-nitrobenzylsulfonate series, triazine series compounds, etc. These can be used alone or in combination of two or more kinds.

The content of the photoacid generator is not particularly limited as long as it exhibits its function. For example, it can be contained in an amount of 0.1 to 20 parts by weight with respect to 100 parts by weight of the binder resin, preferably 0.5 Contain to 10 parts by weight. If the content of the photoacid generator is 0.1 parts by weight or more and 20 parts by weight relative to 100 parts by weight of the binder resin, it has the following advantages: the chemical change caused by the catalytic action of the acid can be sufficiently generated, and the composition It can be applied evenly during coating.

In the present invention, if necessary, a sensitizer may be further contained together with a photoacid generator.

The sensitizer is a component that promotes the decomposition of the photoacid generator to increase the sensitivity. The sensitizer according to the present invention is not particularly limited. For example, polynuclear aromatics, xanthenes, xanthones, cyanines, oxonols, thiazides, acridines, Acridones, anthraquinones, squaraines, styryls, base styryls, coumarins, anthracene compounds, etc. These can be used alone or in combination of two or more kinds.

Preferably, the sensitizer involved in the present invention may be a compound of the following chemical formula 10.

[化學式10中，R₁與R₂相互獨立地為碳數1至6的烷基。]

[In Chemical Formula 10, R ₁ and R ₂ are independently an alkyl group having 1 to 6 carbon atoms. ]

The sensitizer of Chemical Formula 10 may preferably be compounds of the following Chemical Formulas 11 to 13.

The content of the sensitizer is not particularly limited as long as it exhibits its function. For example, relative to 100 parts by weight of the binder resin, it can be contained in 0.01 to 60 parts by weight, preferably 0.5 to 10 parts by weight contain. If the content of the sensitizer is 0.01 to 60 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage of maximizing the effect of improving the sensitivity or the transmittance due to the spectral sensitization.

(C) Solvent

The type of solvent is not particularly limited, and any solvent can be used as long as it can dissolve the above-mentioned components, has a suitable drying speed, and can form a uniform and smooth coating film after evaporation of the solvent.

Specific examples thereof include ethers, acetates, esters, ketones, amides, and lactones. These can be used individually or in mixture of two or more types.

Specific examples of ethers include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether. ; Ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether; propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether Propylene glycol monoalkyl ethers such as ether and propylene glycol monobutyl ether; propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, and diethylene glycol monoethyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether; dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol Dipropylene glycol monoalkyl ethers such as monopropyl ether and dipropylene glycol monobutyl ether; dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, and dipropylene glycol ethyl methyl ether, etc. .

Specific examples of acetates include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl Ethylene glycol monoalkyl ether acetates such as ether acetate; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetic acid Ester and other propylene glycol monoalkyl ether acetates; diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl Diethylene glycol monoalkyl ether acetates such as ether acetate; dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl Dipropylene glycol monoalkyl ether acetates such as base ether acetate, etc.

Specific examples of esters include methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-pentyl lactate, isoamyl lactate, n-acetate Butyl, isobutyl acetate, n-pentyl acetate, isoamyl acetate, n-hexyl acetate, 2-ethylhexyl acetate, ethyl propionate, n-propyl propionate, isopropyl propionate, n-propyl propionate Butyl ester, isobutyl propionate, methyl butyrate, ethyl butyrate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, ethyl hydroxyacetate, 2-hydroxy Ethyl-2-methylpropionate, ethyl 2-hydroxy-3-methylbutyrate, ethyl methoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, 3-methyl Ethyl oxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, 3-methyl-3-methoxybutyl butyrate, methyl acetylacetate, ethyl acetylacetate, methyl pyruvate, ethyl pyruvate Ester, diethylene glycol methyl ethyl ester, etc.

Specific examples of ketones include methyl ethyl ketone, methyl propyl ketone, methyl n-butyl ketone, methyl isobutyl ketone, 2-heptanone, 3-heptanone, and 4-heptanone. , Cyclohexanone and so on.

As specific examples of amides, N-methylformamide, N,N-dimethylformamide, N-methylacetamide, N,N-dimethylacetamide, N -Methylpyrrolidone, etc.

As a specific example of lactones, γ-butyrolactone can be cited.

Preferably, from the viewpoint of coating properties and uniformity of the thickness of the insulating film, propylene glycol methyl ether acetate, diethylene glycol methyl ethyl ester, or a mixture thereof can be used.

The content of the solvent is not particularly limited if it is within the scope of its function. For example, relative to the total weight of the composition, it can be contained at 40 to 90% by weight, preferably 50 to 80% by weight. . If the content of the solvent is 40% by weight or more and 90% by weight or less with respect to the total weight of the composition, there is an advantage that the solid content and viscosity can be maintained at an appropriate level, and therefore the coatability is increased.

(D) Additives

In addition to this, the photosensitive resin composition of the present invention may further contain generally used basic compounds, surfactants, adhesion improvers, thermal crosslinking agents, and light stabilizers within the scope not departing from the purpose of the present invention. , Light curing accelerator, anti-glare agent (leveling agent), defoamer and other additives.

The kind of basic compound is not particularly limited, and it can be arbitrarily selected and used from basic compounds used as a chemically amplified resist. Specific examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, and quaternary ammonium salts of carboxylic acids. These can be used individually or in mixture of two or more types.

Specific examples of aliphatic amines include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanolamine, and dicyclohexylamine , Dicyclohexylmethylamine, etc.

Specific examples of aromatic amines include aniline, benzylamine, N,N-dimethylaniline, and diphenylamine.

Specific examples of heterocyclic amines include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole , Nicotine, niacin, niacinamide, quinoline, 8-hydroxyquinoline, pyrazine, pyrazole, pyridazine, purine, pyrrolidine, piperidine, 1,5-diazabicyclo[4.3.0 ]-5-nonene, 1,8-diazabicyclo[5.3.0]-7-undecene, etc.

Specific examples of quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, and tetra-n-hexylammonium hydroxide.

Specific examples of the quaternary ammonium salt of carboxylic acid include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, and tetra-n-butylammonium benzoate.

The content of the basic compound is not particularly limited as long as it exhibits its function, but it may be contained in 0.001 to 1 part by weight relative to 100 parts by weight of the binder resin, preferably 0.005 to 0.5 part by weight Copies. If the content of the basic compound is 0.001 part by weight or more and 1 part by weight relative to 100 parts by weight of the adhesive resin, there is an advantage that an interlayer insulating film having good heat resistance and solvent resistance can be formed.

The surfactant is a component that improves the adhesion between the substrate and the photosensitive resin composition.

The type of surfactant is not particularly limited, and various surfactants such as fluorine-containing surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicon surfactants can be used. These can be used individually or in mixture of two or more types.

Specific examples of fluorinated surfactants include MAGAFAC F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780 and F781 (trade name , DIC Corporation (manufactured by DIC Corporation), FLUORAD FC430, FC431 and FC171 (trade names, manufactured by Sumitomo 3M Limited), SURFLONS-382, SC-101, SC-103, SC-104, SC -105, SC1068, SC-381, SC-383, S393 and KH-40 (trade name, manufactured by Asahi Glass Co., Ltd.), SOLSPERSE20000 (trade name, Lubrizol Japan Co., Ltd.) (Manufactured by Lubrizol Japan Limited), etc.

As specific examples of nonionic surfactants, glycerin, trimethylolpropane, trimethylolethane, and its ethoxylates or propoxylates (such as glycerol propoxylate or glycerol ethoxylate) can be cited. Base); PLURONIC L10, L31, L61, L62, 10R5, 17R2, 25R2, and TETRONIC 304, 701, 704, 901, 904, 150R1 (trade name, BASF (BASF) company manufacture) and other polyoxyethylene dodecane Base ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, polyethylene glycol dilaurate, polyethylene glycol Distearate, sorbitan fatty acid ester, etc.

Specific examples of cationic surfactants include phthalocyanine modified compounds such as EFKA-745 (trade name, manufactured by Morishita & Co., Ltd.), and KP341 (trade name, Shin-Etsu Chemical Co., Ltd.) Co., Ltd. (Shin-Etsu Chemical Co., Ltd.) and other organosiloxane polymers; POLYFLOW No.75, No.90, No.95 (trade name, Kyoeisha Chemical Co., Ltd.) ., Ltd.) and other (meth)acrylic (co)polymers, W001 (trade name, manufactured by Yusho Co., Ltd.), etc.

As a specific example of an anionic surfactant, W004, W005, W017 (trade name, manufactured by Yusho Co., Ltd.), etc. are mentioned.

Specific examples of silicon surfactants include TORAY SILICONE DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, and SH8400 (trade name, manufactured by Dow Corning Toray Co., Ltd.) ), TSF-4440, 4300, 4445, 4460 and 4452 (trade name, manufactured by Momentive Performance Materials Inc.), KP341, KF6001 and KF6002 (trade name, Shin-Etsu Chemical Industry Co., Ltd. (Shin -Etsu Chemical Co., Ltd.), BYK307, 323, and 330 (trade names, manufactured by BYK Chemie), etc.

The content of the surfactant is not particularly limited if it is within the range in which it can perform its function. However, the content of the surfactant may be 0.01 to 5 parts by weight, preferably 0.05 to 3 parts by weight, relative to 100 parts by weight of the binder resin. Copies. If the content of the surfactant is 0.01 part by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the adhesive resin, there is an advantage of maximizing the effect of improving the adhesion between the substrate and the resin composition.

Adhesion improvers are used to improve the adhesion of inorganic substances used as substrates, such as silicon compounds such as silicon, silicon oxide, silicon nitride, and metals such as gold, copper, and aluminum, to insulating films, and can also be used to adjust the taper angle with the substrate .

The type of the adhesion improver is not particularly limited. As a specific example, a silane coupling agent or a thiol-based compound can be cited, and preferably, a silane coupling agent can be cited.

The type of silane coupling agent is not particularly limited. Specific examples include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-glycidoxypropyl Trialkoxysilane, γ-glycidoxypropylalkyldialkoxysilane, γ-methacryloxypropyltrialkoxysilane, γ-methacryloxypropylalkyl Dialkoxysilane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β-(3,4-epoxycyclohexyl)ethyltrialkoxysilane, vinyl Trialkoxysilane, etc. Preferably, γ-glycidoxypropyltrialkoxysilane or γ-methacryloxypropyltrialkoxysilane can be cited, and more preferably, γ-glycidoxysilane can be cited. Propyl trialkoxysilane. These can be used individually or in mixture of two or more types.

The content of the adhesion improver is not particularly limited as long as it exhibits its function, but it may contain 0.1 to 20 parts by weight relative to 100 parts by weight of the adhesive resin, preferably 0.5 to 10 parts by weight. Parts by weight. If the content of the adhesion improver is 0.1 part by weight or more and 20 parts by weight or less relative to 100 parts by weight of the adhesive resin, it has the effect of improving the adhesion to the insulating film and adjusting the taper angle with the substrate Maximize the advantages.

The thermal crosslinking agent is a component that allows the crosslinking reaction to proceed smoothly and improves heat resistance by UV irradiation and heat treatment when forming an insulating film from the composition.

The type of thermal crosslinking agent is not particularly limited, and specific examples include polyacrylate resins, epoxy resins, phenol resins, melamine resins, organic acids, amine compounds, and anhydrous compounds. These can be used individually or in mixture of two or more types.

The content of the thermal crosslinking agent is not particularly limited if it is within the scope of its function, but it may contain 0.01 to 5 parts by weight relative to 100 parts by weight of the binder resin, preferably 0.1 to 3 parts by weight. Parts by weight. If the content of the thermal crosslinking agent is 0.01 parts by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the adhesive resin, there is an advantage of maximizing the effect of improving heat resistance.

The light stabilizer is a component that improves the light resistance of the photosensitive resin composition.

The kind of light stabilizer is not particularly limited, and specific examples include benzotriazole-based, triazine-based, benzophenone-based, hindered aminoether-based, hindered amine-based compounds, and the like. These can be used individually or in mixture of two or more types.

The content of the light stabilizer is not particularly limited if it is within the scope of its function, but relative to 100 parts by weight of the binder resin, it may contain 0.01 to 5 parts by weight, preferably 0.1 to 3 parts by weight Copies. If the content of the light stabilizer is 0.01 part by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage of maximizing the effect of improving light resistance.

<Insulation film>

The present invention provides an insulating film made from the above composition.

The method for forming an insulating film according to the present invention can include: applying the photosensitive resin composition of the present invention to the upper part of the substrate of the display device, or applying the upper part of the source/drain or silicon nitride layer formed on the substrate The step of pre-bake the photosensitive resin composition; the step of selectively exposing and developing the photosensitive resin composition to form a pattern; and the step of heat-treating the formed pattern.

As the substrate, glass or transparent plastic resin commonly used in liquid crystal display devices, organic EL, etc. are mainly used, and is not particularly limited by the characteristics of the display device used. For example, it is possible to use a substrate in which a metal film constituting a gate electrode is formed on an insulating substrate such as a glass substrate, and the metal film becomes a surface layer.

The method of applying the photosensitive resin composition to the upper part of the substrate, etc. is not particularly limited. For example, there are spin coating, roll coating, nozzle coating and other coating methods using slit nozzles, and center drop spin coating. Spin coating method, extrusion coating method, bar coating method, etc., can be applied by combining two or more coating methods.

The thickness of the coated film depends on the coating method, the solid content concentration of the composition, the viscosity, etc., and the coating is usually performed so that the film thickness after drying is 0.5 to 100 microns.

The subsequent pre-baking step is a process of applying vacuum, infrared rays or heat to volatilize the solvent in order to obtain a non-fluid coating film after the coating film is formed. The heating conditions depend on the type and proportion of each component. In the case of hot plate (hot plate, hot plate) heating, it can be carried out at 60 to 130°C for 5 to 500 seconds. In the case of using a hot oven, it can be Perform at 60 to 140°C for 20 to 1,000 seconds.

Then, irradiate excimer laser, extreme ultraviolet, ultraviolet, visible light, electron beam, X-ray or g-ray (wavelength 436nm), i-ray (wavelength 365nm), h-ray (wavelength 405nm) ), or mixed light, while performing selective exposure process. Exposure can be performed using contact, proximity, projection exposure methods, or the like.

In the present invention, after performing alkali development, a step of heat-treating the photosensitive resin composition (high-temperature firing) is performed. A thermal crosslinking agent or the like is used in the configuration of the photosensitive resin composition used for the high-temperature firing. The above heat treatment step can be performed at a temperature of 150 to 350°C for 30 minutes to 3 hours using a heating device such as a hot plate or an oven. After the above heat treatment is completed, a pattern that is completely crosslinked and cured is obtained.

<Image display device>

Furthermore, the present invention provides an image display device including the above-mentioned insulating film.

The insulating film of the present invention can be applied not only to ordinary liquid crystal display devices, but also to various image display devices such as electroluminescence display devices, plasma display devices, and field emission display devices.

In addition to the above-mentioned insulating film, the image display device can have a configuration generally used in this field.

The preferred embodiments are shown below to facilitate the understanding of the present invention, but these embodiments are only examples of the present invention and do not limit the scope of the attached patent application. It is obvious to those skilled in the art that various modifications and corrections can be made to these embodiments within the scope of the present invention and the scope of the technical idea, and the modifications and corrections certainly belong to the scope of the attached patent application.

Examples and comparative examples

A photosensitive resin composition having the composition and content described in Table 1 below was produced.

1. Adhesive resin (a, b, c are molar ratio)

a/b=60/40、Mw=12,000 A1-1:

a/b=60/40, Mw=12,000

a/b/c=60/25/15、Mw=12,000 A1-2:

a/b/c=60/25/15, Mw=12,000

a/b/c=55/15/30、Mw=11,000 A1-3:

a/b/c=55/15/30, Mw=11,000

a/b/c=55/15/30、 Mw=11,000 A1-4:

a/b/c=55/15/30, Mw=11,000

A2-1, A2-2:

A2-1: a/b/c/d=15/15/40/30, Mw=25,000

A2-2: a/b/c/d=20/15/30/35, Mw=25,000

A2-3, A2-4, A2-5:

A2-3: a/b/c/d=15/15/40/30, Mw=25,000

A2-4: a/b/c/d=20/15/30/35, Mw=25,000

A2-5: a/b/c/d=30/30/0/40, Mw=25,000

A3:

A3-1: a/b/c=30/30/40[R=H], Mw=4,000

A3-2: a/b/c=35/35/30[R=H], Mw=4,000

A3-3: a/b/c=30/30/40[R=CH ₃ ], Mw=4,000

A3-4: a/b/c=35/35/30[R=CH ₃ ], Mw=4,000

A3-5: a/b/c=30/30/40[R=C ₂ H ₅ ], Mw=4,000

A3-6: a/b/c=35/35/30[R=C ₂ H ₅ ], Mw=4,000

A3-7: a/b/c=5/30/65[R=H], Mw=4,000

2. Photoacid generator:

3. Light sensitizer:

4. Solvent

D1: Propylene glycol methyl ethyl acetate

D2: Diethylene glycol methyl ethyl ester

5. Basic compound: Dicyclohexylmethylamine

6. Coupling agent: γ-glycidoxypropyl trialkoxysilane

7. Surfactant:

G1: SH-8400 (manufactured by Dow Corning)

G2: F-475 (manufactured by DIC Co., Ltd.)

Experimental example

The following evaluation was performed about the resin composition manufactured based on an Example and a comparative example, and the result is shown in the following Table 2.

(1) Measurement of sensitivity

The photosensitive resin compositions of the Examples and Comparative Examples were respectively coated on a 0.7 mm thick glass substrate (Corning 1737, manufactured by Corning) using a spin coater, and heated on a hot plate at 100°C for 125 seconds. So that the solvent evaporates. Thus, a photosensitive resin composition layer having a thickness of 4.0 micrometers was formed.

Then, in order to obtain a contact hole pattern with a diameter of 10 microns, a mask with an opening of a quadrilateral pattern with a side length of 10 microns was used in the exposure part, and exposure was carried out with an i-line stepper (NSR-205i11D, manufactured by Nikon Corporation) .

For the exposed substrate, a 2.38% tetramethylammonium hydroxide aqueous solution was used as a developing solution, followed by spin immersion development at 23° C. for 40 seconds, and heating in an oven at 230° C. for 30 minutes to obtain a cured film.

Then, the substrate was cut perpendicularly, and the exposure amount to become a 10-micron contact hole was selected as sensitivity in each composition.

(2) Pattern angle

The pattern obtained in Experimental Example (1) was cut vertically, and the angle with the substrate was calculated from the optical photograph.

(3) Measurement of transmittance

The transmittance at 400 nm of the film obtained in Experimental Example (1) was measured with a spectrophotometer.

(4) Evaluation of adhesion

On the glass substrate on which SiNx is vapor-deposited, the photosensitive resin composition of the examples and the comparative examples are respectively coated with a spin coater without HMDS (Hexamethyldisilazane) solution applied, by It was heated on a hot plate at 100°C for 125 seconds to volatilize the solvent, and a photosensitive resin composition layer with a thickness of 4.0 microns was formed.

Then, exposure was performed using an i-line stepper (NSR-205i11D, manufactured by Nikon Co., Ltd.) using a mask having a pattern of 5 to 20 micrometer holes.

For the exposed substrate, a 2.38% tetramethylammonium hydroxide aqueous solution was used as a developing solution, and spin immersion development was performed at 23° C. for 40 seconds to confirm whether the pattern was peeled off.

◎: The pattern is not peeled off in all areas

○: The pattern is finely peeled off in a part of the area

△: A considerable part of the pattern is peeled off

X: The pattern is peeled off in all areas

As shown in the above-mentioned Table 2, it can be confirmed that the insulating film formed with the photosensitive resin composition of Examples 1 to 21 has very excellent adhesiveness. In addition, the sensitivity and transmittance are equivalent to or higher than those of the past, and the pattern angle is appropriately displayed.

On the other hand, the compositions of Comparative Examples 1 to 5, which did not use the silicone adhesive, showed very poor adhesion.

In addition, in the case of Comparative Example 6 that does not contain acrylic resin, there is a problem that the transmittance is significantly reduced. Furthermore, in the case of Comparative Example 7 in which an epoxy-free acrylic resin was used, there was a problem that not only the transmittance was lowered, but also the pattern angle was excessively lowered.

Claims (13)

A chemically amplified photosensitive resin composition, comprising (A) a binder resin, (B) a photoacid generator, and (C) a solvent, and (A) a binder resin including ( a-1) Resins in which at least part of phenolic hydroxyl groups or carboxyl groups are protected with acid-decomposable groups, (a-2) epoxy-containing acrylic resins, and (a-3) silicone resins, wherein, relative to 100 parts by weight of the total adhesive resin, the adhesive resin contains 30 to 55 parts by weight of the (a-1) resin, 30 to 60 parts by weight of the (a-2) resin, and 1 to 1 to the (a-3) resin 25 parts by weight. The chemically amplified photosensitive resin composition according to claim 1, wherein the (a-1) resin is composed of monomers represented by the following chemical formula 1, chemical formula 2, chemical formula 3, and chemical formula 4 At least one is aggregated,

In the chemical formula 1, R is an alkyl group with 1 to 6 carbons, tetrahydropyranyl, or an alkoxy group with 1 to 6 carbons or a carbon A cycloalkoxy substituted or unsubstituted alkyl group having 1 to 6 carbons having 4 to 8,

In Chemical Formula 2, R ₁ is a hydrogen atom or a methyl group, and R ₂ is an alkyl group having 1 to 6 carbons or a cycloalkyl group having 4 to 8 carbons,

In Chemical Formula 3, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 3 to 8 carbons, and R ₃ is an alkyl group having 1 to 6 carbons or a cycloalkyl group having 4 to 8 carbons,

In the chemical formula 4, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons or a cycloalkylene group having 4 to 8 carbons, and R ₃ is an alkyl group having 1 to 6 carbons or Cycloalkyl having 4 to 8 carbons. The chemically amplified photosensitive resin composition according to claim 1, wherein the compound (a-1) contains a monomer represented by chemical formulas 1 to 4 at 20 to 60 mol% with respect to the entire resin. unit. The chemically amplified photosensitive resin composition according to claim 1, wherein the weight average molecular weight of the (a-1) resin is 5,000 to 35,000. The chemically amplified photosensitive resin composition according to claim 1, wherein the (a-2) resin is formed by polymerizing a monomer represented by the following chemical formula 5 or chemical formula 6,

In chemical formula 5, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons, and R ₃ and R ₄ are independently a hydrogen atom or an alkyl group having 1 to 6 carbons, or can Are connected to each other to form a ring with 3 to 8 carbons, and m is an integer from 1 to 6,

In Chemical Formula 6, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbons, and R ₃ and R ₄ are independently a hydrogen atom or an alkyl group having 1 to 6 carbons, or can Connect to each other to form a ring with 3 to 8 carbon atoms. The chemically amplified photosensitive resin composition according to claim 5, wherein the resin (a-2) contains a monomer represented by chemical formula 5 or chemical formula 6 in 5 to 60 mole% Repeating unit. The chemically amplified photosensitive resin composition according to claim 1, wherein the (a-2) resin has a weight average molecular weight of 5,000 to 40,000. The chemically amplified photosensitive resin composition according to claim 1, wherein the (a-3) resin is polymerized by containing monomers represented by the following chemical formula 7, chemical formula 8, and chemical formula 9 Resin, [Chemical Formula 7] Si(OR ₁ ) ₄ In Chemical Formula 7, R _{1 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, [Chemical Formula 8] CH ₃ Si(OR ₂ ) ₃ In Chemical Formula 8, R _{2 is} independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, [Chemical Formula 9] C ₆ H ₅ Si(OR ₃ ) _{3 is} in Chemical Formula 9 , R ₃ are independently a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms. The chemically amplified photosensitive resin composition according to claim 8, which contains 10 to 60 mol% of the repeating unit formed by the monomer represented by Chemical Formula 7, relative to the entire resin (a-3). To 60 mol% of the repeating unit formed by the monomer represented by Chemical Formula 8, and 10 to 60 mol% of the repeating unit formed by the monomer represented by Chemical Formula 9. The chemically amplified photosensitive resin composition according to claim 1, wherein the weight average molecular weight of the (a-3) resin is 500 to 20,000. The chemically amplified photosensitive resin composition according to claim 1, wherein the photoacid generator is selected from the group consisting of a diazonium salt system, a phosphonium salt system, a sulfonium salt system, an iodonium salt system, and an imine sulfonate system One or more of oxime sulfonate-based compounds, diazo-bismuth-based compounds, diazonium-based compounds, o-nitrobenzylsulfonate-based compounds, and triazine-based compounds. The chemically amplified photosensitive resin composition according to claim 1, wherein the solvent is one or more selected from ethers, acetates, esters, ketones, amides, and lactones. An insulating film obtained by curing the chemically amplified photosensitive resin composition according to any one of claims 1 to 12.