KR102036886B1 - Photosensitive resin composition and insulating layer prepared from the same - Google Patents
Photosensitive resin composition and insulating layer prepared from the same Download PDFInfo
- Publication number
- KR102036886B1 KR102036886B1 KR1020130034772A KR20130034772A KR102036886B1 KR 102036886 B1 KR102036886 B1 KR 102036886B1 KR 1020130034772 A KR1020130034772 A KR 1020130034772A KR 20130034772 A KR20130034772 A KR 20130034772A KR 102036886 B1 KR102036886 B1 KR 102036886B1
- Authority
- KR
- South Korea
- Prior art keywords
- photosensitive resin
- resin composition
- weight
- group
- carbon atoms
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 59
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 239000011230 binding agent Substances 0.000 claims abstract description 39
- -1 imide sulfonate Chemical class 0.000 claims description 45
- 125000004432 carbon atom Chemical group C* 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 34
- 239000002904 solvent Substances 0.000 claims description 22
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 15
- 239000004094 surface-active agent Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 150000007514 bases Chemical class 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000003431 cross linking reagent Substances 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 8
- 239000004611 light stabiliser Substances 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims description 5
- 125000000468 ketone group Chemical group 0.000 claims description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical group COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 5
- 150000001242 acetic acid derivatives Chemical class 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 150000002170 ethers Chemical class 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- 150000002596 lactones Chemical class 0.000 claims description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- 239000012954 diazonium Substances 0.000 claims description 3
- 150000001989 diazonium salts Chemical group 0.000 claims description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 3
- 150000004714 phosphonium salts Chemical class 0.000 claims description 3
- 238000000016 photochemical curing Methods 0.000 claims description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- NIXKBAZVOQAHGC-UHFFFAOYSA-N phenylmethanesulfonic acid Chemical compound OS(=O)(=O)CC1=CC=CC=C1 NIXKBAZVOQAHGC-UHFFFAOYSA-N 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 21
- 238000002834 transmittance Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 67
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 47
- 238000000034 method Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 16
- 238000011161 development Methods 0.000 description 12
- 230000018109 developmental process Effects 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 230000008901 benefit Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 125000003566 oxetanyl group Chemical group 0.000 description 4
- 125000000466 oxiranyl group Chemical group 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000001602 bicycloalkyls Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 3
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- FZXRXKLUIMKDEL-UHFFFAOYSA-N 2-Methylpropyl propanoate Chemical compound CCC(=O)OCC(C)C FZXRXKLUIMKDEL-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- JVZRCNQLWOELDU-UHFFFAOYSA-N 4-Phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=NC=C1 JVZRCNQLWOELDU-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N N-phenyl aniline Natural products C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 description 2
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical compound NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- QVQGTNFYPJQJNM-UHFFFAOYSA-N dicyclohexylmethanamine Chemical compound C1CCCCC1C(N)C1CCCCC1 QVQGTNFYPJQJNM-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- AOGQPLXWSUTHQB-UHFFFAOYSA-N hexyl acetate Chemical compound CCCCCCOC(C)=O AOGQPLXWSUTHQB-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- SNICXCGAKADSCV-JTQLQIEISA-N (-)-Nicotine Chemical compound CN1CCC[C@H]1C1=CC=CN=C1 SNICXCGAKADSCV-JTQLQIEISA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 1
- MJYFYGVCLHNRKB-UHFFFAOYSA-N 1,1,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)CF MJYFYGVCLHNRKB-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- HQSLKNLISLWZQH-UHFFFAOYSA-N 1-(2-propoxyethoxy)propane Chemical compound CCCOCCOCCC HQSLKNLISLWZQH-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- JONNRYNDZVEZFH-UHFFFAOYSA-N 2-(2-butoxypropoxy)propyl acetate Chemical compound CCCCOC(C)COC(C)COC(C)=O JONNRYNDZVEZFH-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- MIYRHXBYLQWDQS-UHFFFAOYSA-N 2-(2-ethoxypropoxy)-1-methoxypropane Chemical compound CCOC(C)COC(C)COC MIYRHXBYLQWDQS-UHFFFAOYSA-N 0.000 description 1
- CKCGJBFTCUCBAJ-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propyl acetate Chemical compound CCOC(C)COC(C)COC(C)=O CKCGJBFTCUCBAJ-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- QFNYOIKHNYCFRG-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC1=CC=CC=C1 QFNYOIKHNYCFRG-UHFFFAOYSA-N 0.000 description 1
- GWQAFGZJIHVLGX-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethyl acetate Chemical compound CCCOCCOCCOC(C)=O GWQAFGZJIHVLGX-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- UFBBZQDFWTVNGP-UHFFFAOYSA-N 2-(2-propoxypropoxy)propyl acetate Chemical compound CCCOC(C)COC(C)COC(C)=O UFBBZQDFWTVNGP-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 2-dodecanoyloxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCC ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- UGNKTMODNRGYHX-UHFFFAOYSA-N 2-ethyl-5-methoxy-5-methylhexanoic acid Chemical compound CCC(C(O)=O)CCC(C)(C)OC UGNKTMODNRGYHX-UHFFFAOYSA-N 0.000 description 1
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical compound CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 1
- NRGGMCIBEHEAIL-UHFFFAOYSA-N 2-ethylpyridine Chemical compound CCC1=CC=CC=N1 NRGGMCIBEHEAIL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- WBPAQKQBUKYCJS-UHFFFAOYSA-N 2-methylpropyl 2-hydroxypropanoate Chemical compound CC(C)COC(=O)C(C)O WBPAQKQBUKYCJS-UHFFFAOYSA-N 0.000 description 1
- DWYHDSLIWMUSOO-UHFFFAOYSA-N 2-phenyl-1h-benzimidazole Chemical compound C1=CC=CC=C1C1=NC2=CC=CC=C2N1 DWYHDSLIWMUSOO-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- QMAQLCVJIYANPZ-UHFFFAOYSA-N 2-propoxyethyl acetate Chemical compound CCCOCCOC(C)=O QMAQLCVJIYANPZ-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- JRXXEXVXTFEBIY-UHFFFAOYSA-N 3-ethoxypropanoic acid Chemical compound CCOCCC(O)=O JRXXEXVXTFEBIY-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- IIRBYAFJHORDJQ-UHFFFAOYSA-N 3-methoxypentyl propanoate Chemical compound CCC(OC)CCOC(=O)CC IIRBYAFJHORDJQ-UHFFFAOYSA-N 0.000 description 1
- YSIKHBWUBSFBRZ-UHFFFAOYSA-N 3-methoxypropanoic acid Chemical compound COCCC(O)=O YSIKHBWUBSFBRZ-UHFFFAOYSA-N 0.000 description 1
- CRORGGSWAKIXSA-UHFFFAOYSA-N 3-methylbutyl 2-hydroxypropanoate Chemical compound CC(C)CCOC(=O)C(C)O CRORGGSWAKIXSA-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- BDCLDNALSPBWPQ-UHFFFAOYSA-N 3-oxohexanoic acid Chemical compound CCCC(=O)CC(O)=O BDCLDNALSPBWPQ-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- VJXRKZJMGVSXPX-UHFFFAOYSA-N 4-ethylpyridine Chemical compound CCC1=CC=NC=C1 VJXRKZJMGVSXPX-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FMGYKKMPNATWHP-UHFFFAOYSA-N Cyperquat Chemical compound C1=C[N+](C)=CC=C1C1=CC=CC=C1 FMGYKKMPNATWHP-UHFFFAOYSA-N 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 1
- IJMWOMHMDSDKGK-UHFFFAOYSA-N Isopropyl propionate Chemical compound CCC(=O)OC(C)C IJMWOMHMDSDKGK-UHFFFAOYSA-N 0.000 description 1
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920002035 Pluronic® L 10 Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002359 Tetronic® Polymers 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- BTMVHUNTONAYDX-UHFFFAOYSA-N butyl propionate Chemical compound CCCCOC(=O)CC BTMVHUNTONAYDX-UHFFFAOYSA-N 0.000 description 1
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- IZRVEUZYBVGCFC-UHFFFAOYSA-N ethyl 2-hydroxyisovalerate Chemical compound CCOC(=O)C(O)C(C)C IZRVEUZYBVGCFC-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229940100608 glycol distearate Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- OOHAUGDGCWURIT-UHFFFAOYSA-N n,n-dipentylpentan-1-amine Chemical compound CCCCCN(CCCCC)CCCCC OOHAUGDGCWURIT-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940017144 n-butyl lactate Drugs 0.000 description 1
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- JACMPVXHEARCBO-UHFFFAOYSA-N n-pentylpentan-1-amine Chemical compound CCCCCNCCCCC JACMPVXHEARCBO-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 235000005152 nicotinamide Nutrition 0.000 description 1
- 239000011570 nicotinamide Substances 0.000 description 1
- 229960002715 nicotine Drugs 0.000 description 1
- SNICXCGAKADSCV-UHFFFAOYSA-N nicotine Natural products CN1CCCC1C1=CC=CN=C1 SNICXCGAKADSCV-UHFFFAOYSA-N 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- IZJVVXCHJIQVOL-UHFFFAOYSA-N nitro(phenyl)methanesulfonic acid Chemical compound OS(=O)(=O)C([N+]([O-])=O)C1=CC=CC=C1 IZJVVXCHJIQVOL-UHFFFAOYSA-N 0.000 description 1
- SBOJXQVPLKSXOG-UHFFFAOYSA-N o-amino-hydroxylamine Chemical compound NON SBOJXQVPLKSXOG-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- GXOHBWLPQHTYPF-UHFFFAOYSA-N pentyl 2-hydroxypropanoate Chemical compound CCCCCOC(=O)C(C)O GXOHBWLPQHTYPF-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- KIWATKANDHUUOB-UHFFFAOYSA-N propan-2-yl 2-hydroxypropanoate Chemical compound CC(C)OC(=O)C(C)O KIWATKANDHUUOB-UHFFFAOYSA-N 0.000 description 1
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 description 1
- HUAZGNHGCJGYNP-UHFFFAOYSA-N propyl butyrate Chemical compound CCCOC(=O)CCC HUAZGNHGCJGYNP-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MCSINKKTEDDPNK-UHFFFAOYSA-N propyl propionate Chemical compound CCCOC(=O)CC MCSINKKTEDDPNK-UHFFFAOYSA-N 0.000 description 1
- 125000004309 pyranyl group Chemical group O1C(C=CC=C1)* 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- JCJNUSDBRRKQPC-UHFFFAOYSA-M tetrahexylazanium;hydroxide Chemical compound [OH-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC JCJNUSDBRRKQPC-UHFFFAOYSA-M 0.000 description 1
- MRYQZMHVZZSQRT-UHFFFAOYSA-M tetramethylazanium;acetate Chemical compound CC([O-])=O.C[N+](C)(C)C MRYQZMHVZZSQRT-UHFFFAOYSA-M 0.000 description 1
- IEVVGBFMAHJELO-UHFFFAOYSA-M tetramethylazanium;benzoate Chemical compound C[N+](C)(C)C.[O-]C(=O)C1=CC=CC=C1 IEVVGBFMAHJELO-UHFFFAOYSA-M 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
Abstract
The present invention relates to a photosensitive resin composition, and more particularly, by including a binder resin containing a repeating unit represented by the formula (1) or (2), fast sensitivity and high transmittance can be obtained, excellent resolution, and developing residual film ratio It is related with the photosensitive resin composition which can manufacture the insulating film which is excellent and the residue which does not generate | occur | produce in the formed pattern.
Description
The present invention relates to a photosensitive resin composition and an insulating film produced therefrom.
In display devices such as thin film transistor (TFT) type liquid crystal displays, inorganic protective films such as silicon nitride have conventionally been used as protective films for protecting and insulating TFT (Thin Film Transistor) circuits. There is a problem that it is difficult to improve the opening ratio due to this high, and in order to overcome this, there is a trend that the demand for low dielectric constant organic insulating film is increasing.
As such an organic insulating film, a photosensitive resin, which is a polymer compound in which the solubility in a specific solvent is changed by chemical reaction with light and electron beams, is generally used. The microprocessing of the circuit pattern is performed by the polarization of the polymer due to the photoreaction of the organic insulating film. By change and crosslinking reaction. In particular, the organic insulating material uses a change characteristic of solubility in a solvent such as an aqueous alkali solution after exposure.
The organic insulating layer is classified into a positive type and a negative type according to solubility in developing of the photosensitive portion. In the positive type photoresist, the exposed portion is dissolved by the developer, and in the negative type photoresist, the exposed portion is not dissolved in the developer and the unexposed portion is dissolved to form a pattern.
Among these, the positive type organic insulating film can eliminate the use of the organic developer used in the negative type organic insulating film by using an aqueous alkali solution, which is advantageous in terms of the working environment, and theoretically, Since the swelling phenomenon can be prevented, the resolution is improved. In addition, after the organic film is formed, it is easy to remove by the stripping solution, and the substrate recovery and reusability are greatly improved by removing the organic film when a defective panel is generated during the process.
In particular, in forming an insulating film of a liquid crystal display device as such an organic insulating film, the insulating film must not only have excellent insulation property but also have low thermal expansion property to reduce stress at an interface when coated on a substrate, and also physically. It must have a strong character.
In addition, the insulating film, the protective film, and the like inevitably form an interface with a metal, a silicon compound, and the like, wherein excellent interface adhesion is a very important factor in terms of reliability of the device. The insulating film is subjected to a fine pattern forming process to provide interconnection passages between the circuits. If the photoresist is provided to the insulating film itself, the process of forming a pattern by applying a separate photoresist on the conventional insulating film can be reduced. It is possible to form a fine pattern.
For this reason, the positive type organic insulating layer composition includes a photosensitive compound (PAC) that provides photosensitivity to a binder resin, such as an acrylic photosensitive resin used as a typical binder resin, a noblock resin type, a polyimide, or a siloxane type. Research into applying the added composition has been actively conducted, and recently, the insulating film has been commercialized and various devices using the same have been released.
Sensitivity is mentioned as an important characteristic among the characteristics calculated | required by the said organic insulating film. Since the improvement of the sensitivity enables a significant reduction of the production time in the industrial production of the display device, in the present situation where the demand for the liquid crystal display device and the like is remarkably increasing, the sensitivity is the most required for this kind of organic insulating film. It is recognized as one of the important characteristics.
However, the organic insulating film composition using the acrylic photosensitive resin and PAC which are conventionally used is often insufficient in sensitivity, and in particular, the solubility difference between the portion irradiated with ultraviolet rays and the portion not irradiated with ultraviolet rays is not large enough to have a sufficient resolution. .
For example, US Pat. No. 4139391 discloses a photosensitive resin organic insulating film composition prepared using a copolymer of an acrylic acid compound and an acrylate compound as a binder resin and an acrylate compound as a polyfunctional monomer. However, the difference in solubility between the exposed portion and the non-exposed portion is not large enough, so that the development characteristics are not good, and the binder resin, which should remain during the development process, is partially dissolved in the developing solution to obtain a fine pattern of 15 microns or less.
Thus, the conventional organic insulating film was not able to fully satisfy the problem regarding sensitivity. Although it is possible to improve the sensitivity by increasing the solubility or development time of the alkaline developer for the polymer used, this method is limited, and also the solubility of the unexposed portion occurs, which lowers the overall residual film rate. In the large display substrate, there existed a fault which causes a film bleeding and a pattern damage.
In addition, the organic insulating layer composition has excellent process resistance such as heat resistance, solvent resistance, and long-term high temperature firing resistance, good adhesion with a support layer, and wide process margin for forming a pattern under various process conditions according to the intended use. In addition, various characteristics such as high sensitivity and high permeability, film bleeding after development, and low loss by the developer are required.
An object of the present invention is to provide a photosensitive resin composition capable of obtaining fast sensitivity and high transmittance.
An object of the present invention is to provide a photosensitive resin composition having excellent resolution and improving the development residual film ratio without residues on the formed pattern, thereby improving the uniformity of the coating composition.
An object of this invention is to provide the resin composition suitable for chemical-resistance and heat resistance which are needed for a post process.
An object of the present invention is to provide an insulating film made of the photosensitive resin composition.
1. Photosensitive resin composition comprising a binder resin comprising a repeating unit represented by the following formula (1) or (2):
[Formula 1]
Wherein R 1 and R 2 are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, or may be bonded to each other to form a ring having 5 to 20 carbon atoms;
R 3 is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms;
R 4 is an alkylene group having 1 to 17 carbon atoms and may include a keto group;
m is an integer from 0 to 2.
[Formula 2]
Wherein R 1 and R 2 are each independently an alkyl group having 1 to 6 carbon atoms, or may be bonded to each other to form a ring having 5 to 20 carbon atoms;
R 3 is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms;
R 4 is an alkylene group having 1 to 17 carbon atoms and may include a keto group;
m is an integer from 0 to 2).
2. In the above 1, wherein the repeating unit represented by Formula 1 or 2 is at least one of the repeating units represented by the following formula (1-a) to (1-f) photosensitive resin composition:
3. In the above 1, wherein the binder resin is a photosensitive resin composition containing 5 to 50 mol% of the repeating unit represented by the formula (1) or 2.
4. according to the above 1, the weight average molecular weight of the binder resin is 5,000 to 30,000 photosensitive resin composition.
5. according to the above 1, wherein the binder resin is 5 to 50% by weight of the total composition of the photosensitive resin composition.
6. according to the above 1, the photosensitive resin composition further comprising a photoacid generator, a sensitizer and a solvent.
7. In the above 6, the photoacid generator is a diazonium salt, phosphonium salt, sulfonium salt, iodonium salt, imide sulfonate, oxime sulfonate, diazo disulfone, disulfone, ortho -Photosensitive resin composition which is at least 1 sort (s) chosen from the group which consists of a nitrobenzyl sulfonate type and a triazine type compound.
8. according to the above 6, the photoacid generator comprises a photosensitive resin composition containing 0.1 to 20 parts by weight based on 100 parts by weight of the binder resin.
9. The photosensitive resin composition of claim 6, wherein the solvent is at least one selected from the group consisting of ethers, acetates, esters, ketones, amides, and lactones.
10. The photosensitive resin composition of the above 6, wherein the solvent is propylene glycol methyl ether acetate, diethylene glycol methyl ethyl ester or a mixture thereof.
11. In the above 6, wherein the solvent is a photosensitive resin composition containing 40 to 90% by weight of the total weight of the composition.
12. The photosensitive resin composition of 1 above, further comprising at least one selected from the group consisting of a basic compound, a surfactant, an adhesion improving agent, a thermal crosslinking agent, a light stabilizer, a photocuring accelerator, an antihalation agent, and an antifoaming agent.
13. The insulating film cured photosensitive resin composition of any one of 1 to 12 above.
14. A liquid crystal display device with an insulating film above 13.
The photosensitive resin composition of this invention can obtain fast sensitivity and high transmittance | permeability.
The present invention is excellent in resolution and excellent in developing residual film ratio, and no residue is generated in the formed pattern.
The photosensitive resin composition of this invention hardens the pattern after image development, and provides post process stability of an organic film.
The photosensitive resin composition of this invention has the outstanding electrical property, and is excellent in chemical-resistance and heat resistance.
The present invention includes a binder resin containing a repeating unit represented by the formula (1) or (2), thereby obtaining fast sensitivity and high transmittance, and having excellent resolution and excellent development residual film ratio. It relates to a photosensitive resin composition which can be prepared.
Hereinafter, the present invention will be described in detail.
<Binder Resin>
The photosensitive resin composition of the present invention includes a binder resin including a repeating unit represented by the following Chemical Formula 1 or 2:
[Formula 1]
Wherein R 1 and R 2 are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, or may be bonded to each other to form a ring having 5 to 20 carbon atoms;
R 3 is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms;
R 4 is an alkylene group having 1 to 17 carbon atoms and may include a keto group;
m is an integer from 0 to 2.
[Formula 2]
Wherein R 1 and R 2 are each independently an alkyl group having 1 to 6 carbon atoms, or may be bonded to each other to form a ring having 5 to 20 carbon atoms;
R 3 is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms;
R 4 is an alkylene group having 1 to 17 carbon atoms and may include a keto group;
m is an integer from 0 to 2).
The repeating unit represented by Formula 1 or 2 has a dihydroxy group protected with an alkyl group, thereby inhibiting the dissolution rate of the alkaline developer in the unexposed portion, and in the exposed portion, the alkyl group is separated by an acid generated to become a dihydroxy group. The rate of dissolution for the alkaline developer is increased. This can improve the development residual ratio and the residue on the bottom of the contact hole.
The repeating unit represented by Formula 1 or 2 is not particularly limited, and may be, for example, a repeating unit represented by the following Formulas (1-a) to (1-f).
In the binder resin according to the present invention, since the repeating unit represented by the formula (1) or (2) may be appropriately mixed according to the specific kind of other monomers to be copolymerized, the content thereof is not particularly limited, and for example, the repeating unit represented by the formula (1) or (2) 5 to 50 mol% of units may be included. When the repeating unit represented by the formula (1) or (2) is within the above range, it is possible to maximize the effect of preventing the occurrence of electrical signal interference with the wiring when the transparent electrode is deposited by improving the sensitivity and improving the residual film ratio and improving the residue of the pattern. can do.
The binder resin according to the present invention may be formed by copolymerizing other monomers used in the binder resin known in the art in addition to the repeating unit of Formula 1 or 2. For example, at least one of the monomers represented by Formulas 3 and 4 may be further copolymerized. The monomer represented by the formula (3) serves to improve the transmittance, the monomer represented by the formula (4) serves to improve the hardness.
[Formula 3]
Wherein R 1 is a hydrogen atom or a methyl group; R 2 is a hydrogen atom; or an alkoxy group having 1 to 8 carbon atoms, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 4 to 8 carbon atoms, a tetrahydrofuranyl group, or tetrahydro C1-C8 alkoxy unsubstituted or substituted with a pyranyl group, an oxirane group, an oxetane group, an oxiranylalkoxy group having 1 to 8 carbon atoms, a bicycloalkyl group having 4 to 12 carbon atoms or a tricycloalkyl group having 6 to 18 carbon atoms Group, alkyl group of 1 to 8 carbon atoms, cycloalkyl group of 4 to 8 carbon atoms, tetrahydrofuranyl group, tetrahydropyranyl group, oxirane group, oxetane group, bicycloalkyl group of 4 to 12 carbon atoms, tetrahydropyranyl group or carbon number 6 to 18 tricycloalkyl group;
[Formula 4]
Wherein R is a hydrogen atom; or an alkoxy group having 1 to 6 carbon atoms, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 8 carbon atoms, a tetrahydrofuranyl group, a tetrahydropyranyl group, an oxirane group, an oxetane group A C1-C6 alkoxy group, a C1-C6 alkyl group, a C4-C8 cycloalkyl group, tetrahydrofura unsubstituted or substituted with a C4-C12 bicycloalkyl group or a C6-C18 tricycloalkyl group A silyl group, a tetrahydropyranyl group, an oxirane group, an oxetane group, a bicycloalkyl group having 4 to 12 carbon atoms or a tricycloalkyl group having 6 to 18 carbon atoms;
The binder resin according to the present invention may be polymerized by further including an acrylate monomer commonly known in the art and commonly used in addition to the monomer.
The acrylate monomers are, for example, ethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polypropylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate , Trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, methyl (Meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (Meth) acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, t-butyl cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, t-jade (Meth) acrylate, dodecyl (meth) acrylate, octadecyl (meth) acrylate, acetoxyethyl (meth) acrylate, phenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2 -Methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2- (2-methoxyethoxy) ethyl (meth) acrylate, 3-phenoxy-2-hydroxypropyl (meth ) Acrylate, benzyl (meth) acrylate, diethylene glycol monomethyl ether (meth) acrylate, diethylene glycol monoethyl ether (meth) acrylate, diethylene glycol monophenyl ether (meth) acrylate, triethylene glycol Monomethyl ether (meth) acrylate, triethylene glycol monoethyl ether (meth) acrylate, β-phenoxyethoxyethyl acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, cyclopentanyl (meth) acrylate,Dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, trifluoroethyl (meth) acrylate, octafluoropentyl (meth) acrylate, perfluorooctylethyl (meth) Acrylate, tribromophenyl (meth) acrylate, tribromophenyloxyethyl (meth) acrylate, glycidyl (meth) acrylate, etc. are mentioned. These can be used individually or in mixture of 2 or more types.
The weight average molecular weight of the binder resin according to the present invention is preferably 5,000 to 30,000 in terms of maintaining excellent resolution, pattern straightness, and the like during pattern formation.
Although the content of the binder resin is not particularly limited within the range capable of functioning, it may be included in 5 to 50% by weight of the total weight of the composition, preferably 10 to 40% by weight may be included. When the content of the binder resin is included in more than 5% by weight, 50% by weight or less of the total weight of the composition has the advantage that the effect of improving the sensitivity and resolution with an appropriate viscosity can be maximized.
<Mine generator>
The photosensitive resin composition of this invention contains a photoacid generator further.
Photoacid generators are compounds that generate acids by irradiation with actinic light or radiation.
The type of photoacid generator is not particularly limited, and examples thereof include diazonium salts, phosphonium salts, sulfonium salts, iodonium salts, imide sulfonates, oxime sulfonates, diazodisulfones, disulfones, Ortho-nitrobenzyl sulfonate type, a triazine type compound, etc. are mentioned. These can be used individually or in mixture of 2 or more types.
The content of the photoacid generator is not particularly limited within the range capable of performing the function, but may be included in an amount of 0.1 to 20 parts by weight, and preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the binder resin. When the amount of the photoacid generator is included in an amount of 0.1 parts by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the binder resin, chemical change due to the catalysis of acid may occur sufficiently and uniform application may be made when applying the composition. have.
<Solvent>
The photosensitive resin composition of this invention contains a solvent further.
The kind of solvent is not particularly limited, and any solvent may be used as long as it can dissolve the above-mentioned components, has a suitable drying speed, and can form a uniform and smooth coating film after evaporation of the solvent.
Specific examples include ethers, acetates, esters, ketones, amides and lactones. These can be used individually or in mixture of 2 or more types.
Specific examples of the ethers include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and ethylene glycol dipropyl ether; Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; Propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether and diethylene glycol monoethyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether; Dipropylene glycol monoalkyl ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and dipropylene glycol monobutyl ether; Dipropylene glycol dialkyl ether, such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, and dipropylene glycol ethyl methyl ether, etc. are mentioned.
Specific examples of the acetates include ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, and ethylene glycol monobutyl ether acetate; Propylene glycol monoalkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and propylene glycol monobutyl ether acetate; Diethylene glycol monoalkyl ether acetates such as diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, and diethylene glycol monobutyl ether acetate; Dipropylene glycol monoalkyl ether acetates such as dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, and dipropylene glycol monobutyl ether acetate.
Specific examples of the esters include methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-amyl lactate, isoamyl lactate, n-butyl acetate, isobutyl acetate, and acetic acid. n-amyl, isoamyl acetate, n-hexyl acetate, 2-ethylhexyl acetate, ethyl propionate, n-propyl propionate, isopropyl propionate, n-butyl propionate, isobutyl propionate, methyl butyrate, ethyl butyrate, ethyl butyrate, N-propyl butyrate, isopropyl butyrate, n-butyl butyrate, ethyl hydroxyacetate, ethyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-3-methylbutyrate, ethyl methoxyacetate, ethyl ethoxyacetate , 3-Methoxypropionate, 3-methoxy ethylpropionate, 3-ethoxypropionate methyl, 3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-meth Methyl-3-methoxybutyl propionate, 3-methyl-3-methoxybutylbutyrate, methyl acetoacetic acid, ethyl acetoacetic acid, methyl pyrivate, ethyl pyrivate, diethylene glycol methyl ethyl ester and the like.
Specific examples of the ketones include methyl ethyl ketone, methyl propyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, 2-heptanone, 3-heptanone, 4-heptanone, cyclohexanone and the like.
Specific examples of the amides include N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone and the like.
Specific examples of the lactones include γ-butyrolactone.
Preferably, propylene glycol methyl ether acetate, diethylene glycol methyl ethyl ester, or a mixture thereof is used in view of coating properties and uniformity of the film thickness of the insulating film.
The solvent is not particularly limited in its content within the range capable of functioning, but may include 40 to 90% by weight of the total weight of the composition, preferably 50 to 80% by weight. When the content of the solvent is included in more than 40% by weight, 90% by weight or less based on the total weight of the composition can maintain the solid content and viscosity at an appropriate level has the advantage that the coating properties are increased.
<Sensitizer>
The photosensitive resin composition of this invention contains a sensitizer further.
A sensitizer is a component which accelerates decomposition of a photoacid generator and improves a sensitivity. The sensitizer according to the present invention is not particularly limited, and may be, for example, a compound represented by the following Chemical Formula 5.
[Formula 5]
(Wherein R 1 and R 2 are each independently an alkyl group having 1 to 6 carbon atoms).
The sensitizer represented by the formula (5) may preferably be a compound represented by the following formulas (6) to (8).
[Formula 6]
[Formula 7]
[Formula 8]
The sensitizer is not particularly limited in the content within the range that can function, but may be included in 0.1 to 20 parts by weight, preferably 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin. When the content of the sensitizer is included in an amount of 0.1 to 20 parts by weight or less based on 100 parts by weight of the binder resin, there is an advantage of maximizing the effect of improving the sensitivity or improving the transmittance by spectral sensitization.
<Additive>
The photosensitive resin composition of the present invention is an additive such as a basic compound, a surfactant, an adhesion improving agent, a thermal crosslinking agent, a light stabilizer, a photocuring accelerator, an antihalation agent (leveling agent), an antifoaming agent, and the like, which are generally used. It may further include within the scope does not deviate.
The kind of basic compound is not specifically limited, It can select arbitrarily and can use from what is used by chemically amplified resist. Specific examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, quaternary ammonium salts of carboxylic acids, and the like. These can be used individually or in mixture of 2 or more types.
Specific examples of aliphatic amines include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanol Amine, dicyclohexylamine, dicyclohexylmethylamine, and the like.
Specific examples of the aromatic amine include aniline, benzylamine, N, N-dimethylaniline, diphenylamine, and the like.
Specific examples of heterocyclic amines include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4- Dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, nicotine, nicotinic acid, nicotinic acid amide, quinoline, 8-oxyquinoline , Pyrazine, pyrazole, pyridazine, purine, pyrrolidine, piperidine, piperazine, morpholine, 4-methylmorpholine, 1,5-diazabicyclo [4.3.0] -5-nonene, 1, 8-diazabicyclo [5.3.0] -7-undecene, etc. are mentioned.
Specific examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, tetra-n-hexyl ammonium hydroxide, and the like.
Specific examples of the quaternary ammonium salt of carboxylic acid include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, tetra-n-butylammonium benzoate and the like.
The basic compound is not particularly limited in the range within which it can function, but may be included 0.001 to 1 parts by weight, preferably 0.005 to 0.5 parts by weight based on 100 parts by weight of the binder resin. When the content of the basic compound is included in an amount of 0.001 part by weight or more and 1 part by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage in that an interlayer insulating film having good heat resistance and solvent resistance can be formed.
Surfactant is a component which improves the adhesiveness of a board | substrate and the photosensitive resin composition.
The kind of surfactant is not specifically limited, Various surfactants, such as a fluorine-containing surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone surfactant, can be used. These can be used individually or in mixture of 2 or more types.
Specific examples of fluorine-containing surfactants include MAGAFAC F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780 and F781 (trade name, manufactured by DIC Corporation), FLUORAD FC430, FC431 and FC171 (trade name, product of Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC-383, S393 and KH- 40 (brand name, the product made by Asahi Glass Co., Ltd.), SOLSPERSE 20000 (brand name, the product made by Lubrizol Japan Limited), etc. are mentioned.
Specific examples of nonionic surfactants include glycerol, trimethylolpropane and trimethylol ethane, and their ethoxylates or propoxylates (eg, glycerol propoxylate or glycerine ethoxylate); Polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, such as PLURONIC L10, L31, L61, L62, 10R5, 17R2 and 25R2, and TETRONIC 304, 701, 704, 901, 904 and 150R1 (trade name, manufactured by BASF) Polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester and the like.
Specific examples of cationic surfactants include phthalocyanine-modified compounds such as EFKA-745 (trade name, manufactured by Morishita & Co., Ltd.), and organo such as KP341 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.). Siloxane polymers; (Meth) acrylic acid-based (co) polymers such as POLYFLOW No. 75, No. 90, No. 95 (trade name, manufactured by Kyoeisha Chemical Co., Ltd.), W001 (trade name, manufactured by Yusho Co., Ltd.), and the like. Can be mentioned.
Specific examples of the anionic surfactant include W004, W005, and W017 (trade name, manufactured by Yusho Co., Ltd.).
Specific examples of silicone surfactants include TORAY SILICONE DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA and SH8400 (trade name, manufactured by Dow Corning Toray Co., Ltd.), TSF-4440, 4300, 4445, 4460 and 4452 ( Trade names, manufactured by Momentive Performance Materials Inc.), KP341, KF6001 and KF6002 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), BYK307, 323, and 330 (trade name, manufactured by BYK Chemie).
The amount of the surfactant is not particularly limited within the range capable of functioning thereof, but may be included in an amount of 0.01 to 5 parts by weight, and preferably 0.05 to 3 parts by weight, based on 100 parts by weight of the binder resin. When the amount of the surfactant is contained in an amount of 0.01 parts by weight or more and 5 parts by weight or less based on 100 parts by weight of the binder resin, there is an advantage of maximizing the effect of improving the adhesion between the substrate and the resin composition.
An adhesive improving agent improves the adhesiveness between the inorganic material used as a base material, for example, silicon compounds, such as silicon, silicon oxide, and silicon nitride, metals, such as gold, copper, and aluminum, and an insulating film, and is useful also in adjusting the taper angle with a board | substrate. Do.
The kind of adhesive improving agent is not specifically limited, As a specific example, a silane coupling agent or a thiol type compound is mentioned, Preferably it is a silane coupling agent.
The kind of the silane coupling agent is not particularly limited, and specific examples thereof include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrialkoxysilane, and γ-glycidoxypropylalkyldi. Alkoxysilane, (gamma) -methacryloxypropyltrialkoxysilane, (gamma) -methacryloxypropylalkyl dialkoxysilane, (gamma)-chloropropyltrialkoxysilane, (gamma)-mercaptopropyltrialkoxysilane, (beta)-(3, 4- epoxycyclo Hexyl) ethyl trialkoxysilane, vinyl trialkoxysilane, etc. are mentioned, Preferably it is (gamma)-glycidoxy propyl trialkoxysilane or (gamma)-methacryloxypropyl trialkoxysilane, More preferably, (gamma)-glycidoxy Propyltrialkoxysilane. These can be used individually or in mixture of 2 or more types.
Although the content of the adhesion improving agent is not particularly limited within the range capable of its function, it may be included in an amount of 0.1 to 20 parts by weight, and preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the binder resin. When the content of the adhesion improving agent is included in an amount of 0.1 parts by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage in that the adhesion with the insulating film and the adjustment of the taper angle with the substrate can be maximized.
The thermal crosslinking agent is a component for smoothly generating a crosslinking reaction through UV irradiation and heat treatment when forming an insulating film as a composition, and improving heat resistance.
The type of thermal crosslinking agent is not particularly limited, and specific examples thereof include polyacrylate resins, epoxy resins, phenol resins, melamine resins, organic acids, amine compounds, anhydride compounds, and the like. These can be used individually or in mixture of 2 or more types.
The content of the thermal crosslinking agent is not particularly limited within the range capable of its function, but may be included in an amount of 0.01 to 5 parts by weight, and preferably 0.1 to 3 parts by weight, based on 100 parts by weight of the binder resin. When the content of the thermal crosslinking agent is included in an amount of 0.01 parts by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage in that the effect of improving heat resistance is maximized.
A light stabilizer is a component which improves the light resistance of the photosensitive resin composition.
The kind of the light stabilizer is not particularly limited, and specific examples thereof include benzotriazole type, triazine type, benzophenone type, hindered aminoether type, hindered amine compound and the like. These can be used individually or in mixture of 2 or more types.
The light stabilizer is not particularly limited in its content within the range capable of its function, but may be included 0.01 to 5 parts by weight, preferably 0.1 to 3 parts by weight based on 100 parts by weight of the binder resin. When the content of the light stabilizer is contained in an amount of 0.01 parts by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage of maximizing the light resistance improvement effect.
<Insulation film>
The present invention provides an insulating film made of the composition.
The method for forming an insulating film according to the present invention comprises the steps of applying the photosensitive resin composition of the present invention on a substrate or a source / drain or silicon nitride layer formed on the substrate of the display device; Pre-bake the photosensitive resin composition; Selectively exposing and developing the photosensitive resin composition to form a pattern; And heat treating the formed pattern.
As the substrate, glass or transparent plastic resins commonly used in liquid crystal displays, organic ELs, and the like are mainly used, but are not particularly limited depending on the characteristics of the display apparatus used. For example, a metal film constituting a gate electrode is formed on an insulating substrate such as a glass substrate, and the metal film is used as a surface layer.
The method of applying the photosensitive resin composition to the upper part of the substrate is not particularly limited, and for example, a rotary coating such as a coating method using a slit nozzle such as a spray coating method, a roll coating method, a discharge nozzle type coating method, or a central dropping spin method. Method, extrusion coating method, bar coating method and the like, can be coated by combining two or more coating methods.
The applied film thickness varies depending on the application method, the solid content concentration of the composition, the viscosity, and the like, but is usually applied so that the film thickness becomes 0.5 to 100 m after drying.
After the grilling step is performed, the solvent is volatilized by applying vacuum, infrared rays, or heat to obtain a non-flowable coating film after forming the coating film. Heating conditions vary depending on the type and composition of each component, but may be performed at 60 to 130 ° C. for 5 to 500 seconds for hot plate heating, and 60 to 140 when using a hot oven. It may be carried out at 20 ° C for 20 to 1,000 seconds.
Next, the selective exposure process may be excimer laser, far ultraviolet, ultraviolet light, visible light, electron beam, X-ray or g-ray (wavelength 436nm), i-ray (wavelength 365nm), h-ray (wavelength 405nm) or mixed rays thereof. Is carried out while examining. The exposure may be performed by contact, porximity, projection exposure, or the like.
In the present invention, after performing the alkali development, the step of performing a heat treatment (high temperature firing) of the photosensitive resin composition. The thermal crosslinking agent is applied to the composition of the photosensitive resin composition for the high temperature baking. The heat treatment step may be performed for 30 minutes to 3 hours under a temperature of 150 to 350 ℃ using a heating apparatus such as a hot plate or oven. After the heat treatment, a completely cross-cured pattern is obtained.
<LCD display device>
In addition, the present invention provides a liquid crystal display device having the insulating film.
The liquid crystal display device may have a configuration commonly used in the art other than the insulating film.
Hereinafter, preferred examples are provided to aid the understanding of the present invention, but these examples are merely illustrative of the present invention and are not intended to limit the scope of the appended claims, which are within the scope and spirit of the present invention. It is apparent to those skilled in the art that various changes and modifications can be made to the present invention, and such modifications and changes belong to the appended claims.
Example 1-5 and Comparative example 1-2
To the photosensitive resin composition was prepared with the components and compositions shown in Table 1 below.
(A)
(B) /
Sensitizer (C)
(D)
(E)
(F)
(G)
A1: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 35/0/15/10/20/10/10/0
A2: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 30/0/15/5/20/10/20/0
A3: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 20/0/10/0/20/10/40/0
A4: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 0/25/15/10/20/15/15/0
A5: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 0/30/15/5/20/10/20/0
A6: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 35/0/15/10/20/10/0/10
A7: (a) / (b) / (c) / (d) / (e) / (f) / (g) / (h) = 0/35/15/10/25/15/0/0
A8: (a) / (b) / (c) / (d) / (e) / (f) / (i) = 0/30/15/5/20/10/20
2. Photoacid Generator (B)
3. Sensitizer (C)
3. Solvent (D)
D1: propylene glycol monomethyl ether acetate, D2: diethylene glycol methyl ethyl ester
4. Basic compound (E): dicyclohexylmethylamine
5. Surfactant (F)
F1: SH8400, F2: F475
6. Adhesive improver (G): KBM-403 (γ-glycidoxypropyltrialkoxysilane)
Test Example
Evaluation was carried out as follows for the resin composition prepared according to Examples and Comparative Examples, the results are shown in Table 2 below.
(1) sensitivity and development Residual rate evaluation
On a 0.7 mm-thick glass substrate (Corning 1735, Corning), the photosensitive resin compositions of Examples and Comparative Examples were respectively applied with a spinner, heated for 125 seconds on a 100 ° C hotplate to volatilize the solvent, and the photoresist was 4.0 µm thick. The resin composition layer was formed.
Thereafter, in order to obtain a contact hole pattern having a diameter of 10 m, the exposure part was exposed with an i-line stepper (NSR-205i11D, Nikon Corporation) using a mask having a rectangular pattern opening having a side of 10 m.
The substrate after exposure was puddle-developed at 2.38% tetramethylammonium hydroxide aqueous solution at 23 DEG C for 40 seconds, and the film thickness before and after development of the coated insulating film unexposed portion was measured to determine the residual film ratio (post-development film). Thickness / predevelopment film thickness X 100) was measured. Then, the film was heated in an oven at 230 ° C. for 30 minutes to obtain a cured film.
Subsequently, the substrate was cut vertically and the exposure amount which becomes a 10 micrometer contact hole in each composition was selected as a sensitivity.
In addition, the bottom surface residue of the contact hole was observed and evaluated according to the following criteria.
<Evaluation Criteria>
○: no residue
△: partial defective
X: front defect
(2) transmittance
The transmittance at 400 nm was measured using a spectrophotometer.
Referring to Table 2, it can be seen that the insulating film formed of the photosensitive resin compositions of Examples 1 to 6 has good sensitivity and excellent transmittance. And it was confirmed that the residual phenomenon does not occur although the developing residual film ratio was excellent.
However, although the insulating film formed from the composition of the comparative example 1 was excellent in a sensitivity and a transmittance | permeability, it was confirmed that the developing residual film rate fell and a residue phenomenon generate | occur | produced.
It was confirmed that the insulating film formed from the composition of Comparative Example 2 was excellent in developing residual film ratio but very poor in transmittance and sensitivity, and residue was generated.
Claims (14)
[Formula 2]
Wherein R 1 and R 2 are each independently an alkyl group having 1 to 6 carbon atoms, or may be bonded to each other to form a ring having 5 to 20 carbon atoms;
R 3 is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms;
R 4 is an alkylene group having 1 to 17 carbon atoms and may include a keto group;
m is an integer from 0 to 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130034772A KR102036886B1 (en) | 2013-03-29 | 2013-03-29 | Photosensitive resin composition and insulating layer prepared from the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130034772A KR102036886B1 (en) | 2013-03-29 | 2013-03-29 | Photosensitive resin composition and insulating layer prepared from the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140118584A KR20140118584A (en) | 2014-10-08 |
| KR102036886B1 true KR102036886B1 (en) | 2019-10-25 |
Family
ID=51991404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130034772A KR102036886B1 (en) | 2013-03-29 | 2013-03-29 | Photosensitive resin composition and insulating layer prepared from the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR102036886B1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944615B2 (en) | 1976-02-16 | 1984-10-31 | 富士写真フイルム株式会社 | Photosensitive resin composition and metal image forming material using the same |
| KR100273172B1 (en) * | 1998-08-01 | 2001-03-02 | 윤덕용 | Photoresist using a compound having a dioxaspirocyclic derivative in the acrylic side chain |
| KR20080060545A (en) * | 2006-12-27 | 2008-07-02 | 동우 화인켐 주식회사 | Chemical amplification type positive photoresist composition |
| KR100922844B1 (en) * | 2007-12-13 | 2009-10-20 | 제일모직주식회사 | Photosensitive resin composition for dielectrics |
-
2013
- 2013-03-29 KR KR1020130034772A patent/KR102036886B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140118584A (en) | 2014-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102157641B1 (en) | Chemically amplified photosensitive resist composition and insulation layer prepared from the same | |
| KR101364229B1 (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| TW200903167A (en) | Positive photosensitive resin composition and cured film forming method using the same | |
| TWI710856B (en) | Chemically amplified photosensitive resin composition and insulation film prepared from the same | |
| CN107340686B (en) | Positive photosensitive resin composition and insulating film produced therefrom | |
| KR101354538B1 (en) | A photoactive compound including xanthene structure and an organic insulation layer composition comprising the same | |
| KR20130099338A (en) | Chemically amplified positive-imageable, high photo-sensitive organic insulator composition with high thermal stability and method of forming organic insulator using thereof | |
| KR102011728B1 (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR101988931B1 (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR20140090762A (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR20140090825A (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR102036886B1 (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR101988930B1 (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR102293227B1 (en) | Positive type composition and method for pattern formation of transparent conductors using the same | |
| KR20150105121A (en) | Photosensitive resist composition | |
| KR102330078B1 (en) | Negative-type Photosensitive Resin Composition | |
| KR20150105120A (en) | Photosensitive resist composition | |
| KR20170033022A (en) | Positive-type photosensitive resist composition and insulation layer prepared from the same | |
| KR20150019512A (en) | Photosensitive resin composition and insulating layer prepared from the same | |
| KR20160072490A (en) | Chemically amplified photosensitive resist composition | |
| KR20160011032A (en) | Chemically amplified photosensitive resist composition and method of reducing yellowing by using the same | |
| KR20160005967A (en) | Chemically amplified photosensitive resist composition and method of reducing yellowing by using the same | |
| KR20160012545A (en) | Chemically amplified photosensitive resin composition and method of reducing yellowing by using the same | |
| KR20160012385A (en) | Chemically amplified photosensitive resisn composition and method of reducing yellowing by using the same | |
| KR20160087198A (en) | Chemically amplified photosensitive resist composition and method of reducing yellowing by using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |