JP2018025799A - Chemically amplified photosensitive resin composition and insulation film produced from the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chemically amplified photosensitive resin composition that can give an insulation film having excellent adhesiveness and uniformity of a pattern, and an insulation film produced from the composition.SOLUTION: The present invention relates to a chemically amplified photosensitive resin composition and an insulation film produced from the composition. More particularly, the present invention relates to: a chemically amplified photosensitive resin composition which comprises (A) a binder resin comprising (a-1) a resin in which a phenolic hydroxyl group or a carboxyl group is at least partially protected by an acid decomposable group, (a-2) an acrylic resin containing an epoxy group and (a-3) a siloxane resin, (B) a photoacid generator and (C) a solvent and which can give an insulation film excellent in adhesiveness and uniformity of a pattern; and an insulation film produced from the above composition.SELECTED DRAWING: None

Description

  The present invention relates to a chemically amplified photosensitive resin composition and an insulating film produced therefrom.

  In a display device such as a thin film transistor (TFT) type liquid crystal display device, an inorganic protective film such as silicon nitride has been conventionally used as a protective film for protecting and insulating a TFT (Thin Film Transistor) circuit. . However, since the dielectric constant is high, there is a problem that the aperture ratio is not improved, and in order to solve the problem, the demand for an organic insulating film having a low dielectric constant tends to increase.

  As such an organic insulating film, a photosensitive resin that is a polymer compound that changes its solubility in a specific solvent by a chemical reaction with light and an electron beam is generally used. The microfabrication of the circuit pattern is performed by a polymer polarity change and a crosslinking reaction caused by a photoreaction of the organic insulating film. In particular, the organic insulating film material uses a change characteristic of solubility in a solvent such as an alkaline aqueous solution after exposure.

  The organic insulating film is classified into a positive type and a negative type according to the solubility of the exposed portion with respect to development. The positive type photoresist is a method in which the exposed part is dissolved in the developer to form a pattern, while the negative type photoresist is the part in which the exposed part is not dissolved in the developer and the part not exposed is dissolved to form a pattern. It is a method to do.

  Among these, the positive type organic insulating film can eliminate the use of the organic developer used in the negative type organic insulating film by using an alkaline aqueous solution. This is not only advantageous in terms of work environment, but theoretically has an advantage of improving the resolution because the swelling phenomenon of the portion not exposed to ultraviolet rays can be prevented. In addition, it is easy to remove with an exfoliating liquid after the organic film is formed, and there is an advantage that the substrate recovery and reusability are remarkably improved by removing the organic film when a defective panel is generated in the process.

  In particular, when an insulating film of a liquid crystal display device or the like is configured as such an organic insulating film, the insulating film has an excellent insulating property, and is low for reducing stress at the interface when coated on a substrate. Thermal expansibility, physically tough properties, etc. are required.

  Furthermore, the insulating film, the protective film, and the like inevitably form an interface with a metal, a silicon compound, and the like, but the excellent adhesion at this time is a very important factor in terms of device reliability. The insulating film goes through a process of forming a fine pattern in order to provide an interconnection path between circuits. At this time, if photosensitivity is imparted to the insulating film itself, a process for forming a pattern by applying another photoresist on the conventional insulating film can be reduced, so that a fine pattern can be formed more easily. become.

  For this reason, the positive type organic insulating film composition is sensitive to binder resins such as acrylic photosensitive resins used as typical binder resins, novolak resin-based, polyimide or siloxane-based resins. There are many studies on applying a composition to which a given compound (PAC; photo active compound) or the like is added. Recently, the insulating film has been commercialized, and various devices using the insulating film have been released.

  In particular, when it is necessary to form the insulating film on the silicon nitride film, the silicon nitride film is surface-treated in advance with hexamethyldisilazane (HDMS) in order to improve the adhesion. Is a substance that is very harmful to the human body.

  In order to solve this problem, Korean Patent No. 10-2010-0049687 discloses a phenol resin modified with a compound having an unsaturated hydrocarbon group, a compound that generates an acid by light, a thermal crosslinking agent, and A positive photosensitive resin composition containing a solvent is disclosed. However, the sensitivity is not good and sufficient adhesion is still not obtained unless HDMS is used.

Korean Published Patent No. 10-2010-0049687

  An object of this invention is to provide the chemically amplified photosensitive resin composition excellent in adhesiveness with a board | substrate.

  Another object of the present invention is to provide a chemically amplified photosensitive resin composition excellent in sensitivity, transmittance of the formed pattern and inclination.

  Furthermore, an object of this invention is to provide the insulating film manufactured with the said chemically amplified photosensitive resin composition.

  1. (A-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxy group is protected with an acid-decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) a siloxane resin (A A chemically amplified photosensitive resin composition comprising a binder resin, (B) a photoacid generator, and (C) a solvent.

  2. In the item 1, the (a-1) resin is polymerized by containing at least one monomer represented by the following chemical formula 1, chemical formula 2, chemical formula 3 and chemical formula 4; Resin composition.

〔式中、Ｒは、炭素数１〜６のアルキル基で置換又は非置換された炭素数１〜６のアルキル基；テトラヒドロピラニル基；或いは、炭素数１〜６のアルコキシ基または炭素数４〜８のシクロアルコキシ基で置換又は非置換された炭素数１〜６のアルキル基である。〕

[Wherein, R represents an alkyl group having 1 to 6 carbon atoms which is substituted or unsubstituted with an alkyl group having 1 to 6 carbon atoms; a tetrahydropyranyl group; or an alkoxy group having 1 to 6 carbon atoms or 4 carbon atoms. It is a C1-C6 alkyl group substituted or unsubstituted by -8 cycloalkoxy groups. ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキル基または炭素数４〜８のシクロアルキル基である。〕

[Wherein, R ₁ represents a hydrogen atom or a methyl group, and R ₂ represents an alkyl group having 1 to 6 carbon atoms or a cycloalkyl group having 4 to 8 carbon atoms. ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数３〜８のアルキレン基であり、Ｒ_３は、炭素数１〜６のアルキル基または炭素数４〜８のシクロアルキル基である。〕

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 3 to 8 carbon atoms, and R ₃ is an alkyl group having 1 to 6 carbon atoms or an alkyl group having 4 to 8 carbon atoms. A cycloalkyl group; ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキレン基または炭素数４〜８のシクロアルキレン基であり、Ｒ_３は、炭素数１〜６のアルキル基または炭素数４〜８のシクロアルキル基である。〕

[Wherein, R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 1 to 6 carbon atoms or a cycloalkylene group having 4 to 8 carbon atoms, and R ₃ represents 1 to 6 carbon atoms. Or an alkyl group having 4 to 8 carbon atoms. ]

  3. In said item 2, the chemical amplification type photosensitive resin composition in which the repeating unit which the said monomer of the said Chemical formula 1-4 forms is contained in 20-60 mol% with respect to the said (a-1) whole resin. .

  4). In the item 1, the (a-1) resin is a chemically amplified photosensitive resin composition having a weight average molecular weight of 5,000 to 35,000.

  5. In said item 1, said (a-2) resin is a chemical amplification type photosensitive resin composition polymerized including the monomer represented by following Chemical formula 5 or Chemical formula 6.

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキレン基であり、Ｒ_３及びＲ_４は、互いに独立に水素原子または炭素数１〜６のアルキル基であるか、若しくは互いに連結されて炭素数３〜８の環を形成することができ、ｍは１〜６の整数である。〕

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbon atoms, and R ₃ and R ₄ are each independently a hydrogen atom or a C 1 to 6 carbon atom. It is an alkyl group, or can be connected to each other to form a ring having 3 to 8 carbon atoms, and m is an integer of 1 to 6. ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキレン基であり、Ｒ_３及びＲ_４は、互いに独立に水素原子または炭素数１〜６のアルキル基であるか、若しくは互いに連結されて炭素数３〜８の環を形成することができる。〕

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbon atoms, and R ₃ and R ₄ are each independently a hydrogen atom or a C 1 to 6 carbon atom. It can be an alkyl group or linked to each other to form a ring having 3 to 8 carbon atoms. ]

  6). In the item 5, the chemical amplification type photosensitive resin in which the repeating unit formed by the monomer of the chemical formula 5 or the chemical formula 6 is included in an amount of 5 to 60 mol% with respect to the total amount of the resin (a-2). Composition.

  7). In said item 1, said (a-2) resin is a chemically amplified photosensitive resin composition whose weight average molecular weight is 5,000-40,000.

  8). In the item 1, the (a-3) resin is a chemically amplified photosensitive resin composition that is a resin that is polymerized by including monomers represented by the following chemical formula 7, chemical formula 8, and chemical formula 9.

〔式中、Ｒ_１は、互いに独立に水素原子または炭素数１〜５の直鎖又は分岐鎖のアルキル基である。〕

Wherein, R ₁ is a linear or branched alkyl group having a hydrogen atom or a 1 to 5 carbon atoms independently of one another. ]

〔式中、Ｒ_２は、互いに独立に水素原子または炭素数１〜５の直鎖又は分岐鎖のアルキル基である。〕

Wherein, R ₂ is a straight-chain or branched-chain alkyl group having a hydrogen atom or a 1 to 5 carbon atoms independently of one another. ]

〔式中、Ｒ_３は、互いに独立に水素原子または炭素数１〜５の直鎖又は分岐鎖のアルキル基である。〕

[In formula, R < ₃ > is a hydrogen atom or a C1-C5 linear or branched alkyl group mutually independently. ]

  9. In the item 8, 10 to 60 mol% of the repeating unit formed by the monomer of the chemical formula 7 and the repeating unit formed by the monomer of the chemical formula 8 with respect to the whole resin (a-3). A chemically amplified photosensitive resin composition comprising 10 to 60 mol% and 10 to 60 mol% of a repeating unit formed by the monomer represented by Chemical Formula 9.

  10. In the item 1, the (a-3) resin is a chemically amplified photosensitive resin composition having a weight average molecular weight of 500 to 20,000.

  11. In the item 1, the binder resin is (a-1) 30 to 55 parts by weight of resin, (a-2) 30 to 60 parts by weight of resin, and (a-3) with respect to 100 parts by weight of the total binder resin. A chemically amplified photosensitive resin composition comprising 1 to 25 parts by weight of a resin.

  12 In the above item 1, the photoacid generator is a diazonium salt, phosphonium salt, sulfonium salt, iodonium salt, imide sulfonate, oxime sulfonate, diazodisulfone, disulfone, ortho-nitrobenzyl sulfonate, A chemically amplified photosensitive resin composition which is at least one selected from the group consisting of triazine compounds.

  13. In the item 1, the chemically amplified photosensitive resin composition, wherein the solvent is at least one selected from the group consisting of ethers, acetates, esters, ketones, amides, and lactones.

  14 14. An insulating film obtained by curing the chemically amplified photosensitive resin composition according to any one of items 1 to 13.

  15. 15. An image display device comprising the insulating film according to item 14.

  If the chemically amplified photosensitive resin composition of the present invention is used, an insulating film having excellent pattern adhesion and uniformity can be obtained.

  Moreover, if the chemically amplified photosensitive resin composition of the present invention is used, high sensitivity and significantly improved transmittance can be obtained.

  The chemically amplified photosensitive resin composition of the present invention has excellent resolution, improved flowability, and is easy to process.

<Chemically amplified photosensitive resin composition>
Examples of the present invention include (a-1) a resin in which at least a part of a phenolic hydroxyl group or carboxy group is protected with an acid-decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) Chemical amplification type that can obtain an insulating film having excellent pattern adhesion and uniformity by including (A) binder resin containing siloxane resin, (B) photoacid generator, and (C) solvent. A photosensitive resin composition is provided.

  Hereinafter, the chemically amplified photosensitive resin composition according to the examples of the present invention will be described in detail.

(A) Binder resin The binder resin according to the present invention includes (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxy group is protected with an acid-decomposable group, and (a-2) an acrylic resin containing an epoxy group. And (a-3) three kinds of resins of siloxane resin.

  The photosensitive resin composition of this invention can form the photosensitive pattern excellent in the adhesiveness and uniformity with a board | substrate by including three types of resin mentioned above as binder resin. In particular, excellent adhesion can be exerted even on a silicon nitride film without processing HMDS.

[Resin (a-1) in which at least a part of phenolic hydroxyl group or carboxy group is protected with an acid-decomposable group]
(A-1) The resin fulfills the function of imparting solubility to the cured pattern with a photoacid generator during exposure.

  (A-1) The resin is a resin containing a functional group in which at least a part of the phenolic hydroxyl group or carboxy group is protected with an acid-decomposable group. Although there is no restriction | limiting in particular in the said functional group, Resin polymerized including at least 1 of the monomer represented by following Chemical formula 1, Chemical formula 2, Chemical formula 3, and Chemical formula 4 is mentioned.

〔式中、Ｒは、炭素数１〜６のアルキル基で置換又は非置換された炭素数１〜６のアルキル基；テトラヒドロピラニル基；或いは、炭素数１〜６のアルコキシ基または炭素数４〜８のシクロアルコキシ基で置換又は非置換された炭素数１〜６のアルキル基である。〕

[Wherein, R represents an alkyl group having 1 to 6 carbon atoms which is substituted or unsubstituted with an alkyl group having 1 to 6 carbon atoms; a tetrahydropyranyl group; or an alkoxy group having 1 to 6 carbon atoms or 4 carbon atoms. It is a C1-C6 alkyl group substituted or unsubstituted by -8 cycloalkoxy groups. ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキル基または炭素数４〜８のシクロアルキル基である。〕

[Wherein, R ₁ represents a hydrogen atom or a methyl group, and R ₂ represents an alkyl group having 1 to 6 carbon atoms or a cycloalkyl group having 4 to 8 carbon atoms. ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数３〜８のアルキレン基であり、Ｒ_３は、炭素数１〜６のアルキル基または炭素数４〜８のシクロアルキル基である。〕

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 3 to 8 carbon atoms, and R ₃ is an alkyl group having 1 to 6 carbon atoms or an alkyl group having 4 to 8 carbon atoms. A cycloalkyl group; ]

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキレン基または炭素数４〜８のシクロアルキレン基であり、Ｒ_３は、炭素数１〜６のアルキル基または炭素数４〜８のシクロアルキル基である。〕

[Wherein, R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 1 to 6 carbon atoms or a cycloalkylene group having 4 to 8 carbon atoms, and R ₃ represents 1 to 6 carbon atoms. Or an alkyl group having 4 to 8 carbon atoms. ]

  (A-1) In the resin, the repeating unit formed by the monomers of Chemical Formulas 1 to 4 can be appropriately mixed depending on the specific type of the other monomer to be copolymerized. The mixing ratio is not particularly limited, but for example, it is preferable from the viewpoint of pattern formation that the polymerization is carried out by containing 20 to 60 mol% of the whole (a-1) resin.

  (A-1) The resin may further contain a repeating unit formed of a monomer having a phenolic hydroxyl group or a carboxy group (not protected by an acid-decomposable group). Examples of such monomers include the aforementioned ethylenically unsaturated monomers having a carboxy group, hydroxystyrene, and hydroxymethylstyrene.

  (A-1) The resin preferably has a weight average molecular weight of 5,000 to 35,000, preferably 5,000 to 20,000, from the viewpoint of improving the remaining film ratio and reducing the residue.

[Acrylic resin containing epoxy group (a-2)]
The acrylic resin (a-2) according to the present invention is a resin containing an epoxy group, and by enabling thermosetting, a pattern with higher durability can be formed. Thermosetting can be performed, for example, in a post-bake process.

  In order to introduce an epoxy group into the acrylic resin, the (a-2) resin according to an embodiment of the present invention may be polymerized by including a monomer represented by the following chemical formula 5.

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキレン基であり、Ｒ_３及びＲ_４は、互いに独立に水素原子または炭素数１〜６のアルキル基であるか、若しくは互いに連結されて炭素数３〜８の環を形成することができ、ｍは１〜６の整数である。〕

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbon atoms, and R ₃ and R ₄ are each independently a hydrogen atom or a C 1 to 6 carbon atom. It is an alkyl group, or can be connected to each other to form a ring having 3 to 8 carbon atoms, and m is an integer of 1 to 6. ]

Monomer represented by Formula 5 includes an oxygen atom adjacent to R _2. When the chain contains an oxygen atom, the radius of rotation of the single bond is increased, the glass transition temperature is lowered, the flowability is improved, and processing is facilitated.

  In Formula 5, the length of the monomer can be adjusted by adjusting m. Thereby, the inclination of the formed pattern can be adjusted. In this case, by lowering the inclination of the pattern, it is possible to prevent the cured film from dropping or cracking during the deposition of the transparent electrode.

  Furthermore, as another embodiment of the present invention, the (a-2) resin according to the present invention may be polymerized by including a monomer represented by the following chemical formula 6 to introduce an epoxy group.

〔式中、Ｒ_１は、水素原子またはメチル基であり、Ｒ_２は、炭素数１〜６のアルキレン基であり、Ｒ_３及びＲ_４は、互いに独立に水素原子または炭素数１〜６のアルキル基であるか、若しくは互いに連結されて炭素数３〜８の環を形成することができる。〕

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbon atoms, and R ₃ and R ₄ are each independently a hydrogen atom or a C 1 to 6 carbon atom. It can be an alkyl group or linked to each other to form a ring having 3 to 8 carbon atoms. ]

  The monomer represented by Chemical Formula 6 has the advantage of improving the transmittance of the polymerized resin.

  (A-2) In the resin, the repeating unit containing an epoxy group, for example, the repeating unit formed by the monomer of Chemical Formula 5 or 6 is appropriately selected depending on the specific type of other monomer to be copolymerized. Since it can mix, content and a mixing ratio are not specifically limited. For example, (a-2) including 5 mol% to 60 mol% and polymerizing with respect to the entire resin improves the transparency, improves the ease of processing, and adjusts the inclination of the pattern. This is preferable from the viewpoint of maximizing the effect of preventing the occurrence of cracks in the cured film during vapor deposition.

  (A-2) The resin may be polymerized using a monomer known in the art that can form an acrylic resin in addition to the monomer of Chemical Formula 5 or Chemical Formula 6 described above.

  For example, as the (a-2) resin, an ethylenically unsaturated monomer having a carboxy group can be used. The type of ethylenically unsaturated monomer having a carboxy group is not particularly limited, but examples thereof include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid, and the like. Anhydrides of ω-carboxypolycaprolactone mono (meth) acrylates and the like, and polymer mono (meth) acrylates having a carboxy group and a hydroxyl group at both ends, preferably acrylic acid and methacrylic acid, Also good. These can be used individually or in mixture of 2 or more types.

  Moreover, (a-2) resin may further superpose | polymerize further including the at least 1 other monomer copolymerizable with the said monomer. For example, styrene, vinyl toluene, methyl styrene, p-chlorostyrene, o-methoxy styrene, m-methoxy styrene, p-methoxy styrene, o-vinyl benzyl methyl ether, m-vinyl benzyl methyl ether, p-vinyl benzyl methyl ether Aromatic vinyl compounds such as N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, N-o-hydroxyphenylmaleimide, Nm-hydroxyphenylmaleimide, Np-hydroxyphenylmaleimide, N-o- Methylphenylmaleimide, Nm-methylphenylmaleimide, Np-methylphenylmaleimide, N-o-methoxyphenylmaleimide, Nm-methoxyphenylmaleimide, Np-methoxyphenylmaleimide, etc. N-substituted maleimide compounds; methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate , Sec-butyl (meth) acrylate, alkyl (meth) acrylates such as t-butyl (meth) acrylate; cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5. 2.1.0 Aliphatic (meth) acrylates such as 2,6] decan-8-yl (meth) acrylate, 2-dicyclopentanyloxyethyl (meth) acrylate, isobornyl (meth) acrylate; (Meth) acrylate, Aryl (meth) acrylates such as benzyl (meth) acrylate; 3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, 3- (methacryloyloxymethyl) -2-trifluoromethyloxetane Unsaturated oxetane compounds such as 3- (methacryloyloxymethyl) -2-phenyloxetane, 2- (methacryloyloxymethyl) oxetane, 2- (methacryloyloxymethyl) -4-trifluoromethyloxetane; And (meth) acrylates substituted with a cycloalkane, dicycloalkane or tricycloalkane ring. These can be used individually or in mixture of 2 or more types.

  The acrylic resin (a-2) has a weight average molecular weight of 5,000 to 40,000, preferably 15,000 to 30,000, from the viewpoint of improving developability and reducing residues.

[Siloxane resin (a-3)]
The siloxane resin (a-3) according to the present invention has a function of improving the adhesion to the substrate.

  The siloxane resin (a-3) may be a resin that is polymerized by including monomers represented by the following chemical formula 7, chemical formula 8, and chemical formula 9.

〔式中、Ｒ_１は、互いに独立に水素原子または炭素数１〜５の直鎖又は分岐鎖のアルキル基である。〕

Wherein, R ₁ is a linear or branched alkyl group having a hydrogen atom or a 1 to 5 carbon atoms independently of one another. ]

〔式中、Ｒ_２は、互いに独立に水素原子または炭素数１〜５の直鎖又は分岐鎖のアルキル基である。〕

Wherein, R ₂ is a straight-chain or branched-chain alkyl group having a hydrogen atom or a 1 to 5 carbon atoms independently of one another. ]

〔式中、Ｒ_３は、互いに独立に水素原子または炭素数１〜５の直鎖又は分岐鎖のアルキル基である。〕

[In formula, R < ₃ > is a hydrogen atom or a C1-C5 linear or branched alkyl group mutually independently. ]

  The repeating unit formed by the monomer of Chemical Formula 7 may be included in an amount of 10 to 60 mol% with respect to the entire siloxane resin. The repeating unit formed by the monomer of Chemical Formula 8 may be included in an amount of 10 to 60 mol% with respect to the entire siloxane resin. The repeating unit formed by the monomer of Chemical Formula 9 may be included in an amount of 10 to 60 mol% with respect to the entire siloxane resin. In the content range described above, the adhesiveness to the substrate, the pattern angle, the developability and the like are most excellent.

  The siloxane resin (a-3) has a weight average molecular weight of 500 to 20,000, preferably 1,000 to 7,000, from the viewpoint of improving developability and reducing residues.

  The binder resin according to the present invention can remarkably increase the adhesion to the substrate without reducing the pattern forming ability by mixing the above-described three kinds of resins. In the case of a silicon nitride film, excellent adhesion is maintained without processing HDMS.

  In the binder resin according to the present invention, the mixing ratio of the three resins is not particularly limited, but the mixing weight ratio of the (a-1), (a-2) and (a-3) resins is 100 wt. (A-1) 30 to 55 parts by weight of resin, (a-2) 30 to 60 parts by weight of resin, and (a-3) 1 to 25 parts by weight of resin, This is preferable from the viewpoint of improving adhesion.

  The content of the binder resin according to the present invention is not particularly limited as long as the function is performed. For example, the binder resin may be contained in an amount of 5 to 50% by weight, preferably 10 to 40%, based on the total weight of the composition. It may be included by weight percent. When the content of the binder resin is 5% by weight or more and 50% by weight or less with respect to the total weight of the composition, there is an advantage that the effect of having an appropriate viscosity and improving sensitivity and resolution is maximized.

(B) Photoacid generator A photoacid generator is a compound that generates an acid upon irradiation with an actinic ray or radiation.

  The type of the photoacid generator is not particularly limited. For example, diazonium salt, phosphonium salt, sulfonium salt, iodonium salt, imide sulfonate, oxime sulfonate, diazodisulfone, disulfone, ortho-nitrobenzyl sulfonate And triazine compounds. These can be used individually or in mixture of 2 or more types.

  The content of the photoacid generator is not particularly limited as long as the function is performed. For example, the photoacid generator may be contained in an amount of 0.1 to 20 parts by weight, preferably 0.5 to 100 parts by weight of the binder resin. It may be contained in 10 parts by weight. When the content of the photoacid generator is 0.1 part by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the binder resin, a chemical change due to the catalytic action of the acid can sufficiently occur, and There is an advantage that it can be applied uniformly during application.

  In this invention, you may further contain a sensitizer with a photo-acid generator as needed.

  The sensitizer is a component that promotes decomposition of the photoacid generator and improves sensitivity. The sensitizer according to the present invention is not particularly limited. For example, polynuclear aromatics, xanthenes, xanthones, cyanines, oxonols, thiazines, acridines, acridones, anthraquinones, squaryliums, styryls. , Base styryls, coumarins, anthracene compounds and the like. These can be used individually or in mixture of 2 or more types.

  Preferably, the sensitizer according to the present invention may be a compound of the following chemical formula 10.

〔式中、Ｒ_１及びＲ_２は、互いに独立に炭素数１〜６のアルキル基である。〕

Wherein, _{R 1} and _{R 2} is an alkyl group having 1 to 6 carbon atoms independently of one another. ]

  The sensitizer of Chemical Formula 10 may preferably be a compound of Chemical Formulas 11 to 13 below.

  The content of the sensitizer is not particularly limited as long as the function is performed. For example, the sensitizer may be included in an amount of 0.01 to 60 parts by weight, preferably 0.5 to 100 parts by weight with respect to 100 parts by weight of the binder resin. It may be included at 10 parts by weight. When the content of the sensitizer is 0.01 part by weight or more and 60 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage of maximizing the effect of improving the sensitivity or the transmittance by spectral sensitization. is there.

(C) The type of the solvent solvent is not particularly limited as long as it can dissolve the above-described components, has an appropriate drying rate, and can form a uniform and smooth coating film after evaporation of the solvent. These solvents can also be used.

  Specific examples thereof include ethers, acetates, esters, ketones, amides, lactones and the like. These can be used individually or in mixture of 2 or more types.

  Specific examples of ethers include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol di Ethylene glycol dialkyl ethers such as propyl ether; propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether; propylene glycol dimethyl ether, propylene glycol diethyl ether, die Propylene glycol dialkyl ethers such as lenglycol monomethyl ether and diethylene glycol monoethyl ether; diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether and diethylene glycol ethyl methyl ether; dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether and dipropylene Dipropylene glycol monoalkyl ethers such as glycol monopropyl ether and dipropylene glycol monobutyl ether; dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether and dipropylene glycol ethyl methyl ether And the like.

  Specific examples of acetates include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monoalkyl ether acetates such as ethylene glycol monobutyl ether acetate; propylene glycol monomethyl ether acetate, propylene Propylene glycol monoalkyl ether acetates such as glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate; diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl Diethylene glycol monoalkyl ether acetates such as pill ether acetate and diethylene glycol monobutyl ether acetate; Dipropylene such as dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate And glycol monoalkyl ether acetates.

  Specific examples of esters include methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-amyl lactate, isoamyl lactate, n-butyl acetate, isobutyl acetate, n-amyl acetate , Isoamyl acetate, n-hexyl acetate, 2-ethylhexyl acetate, ethyl propionate, n-propyl propionate, isopropyl propionate, n-butyl propionate, isobutyl propionate, methyl butyrate, ethyl butyrate, n-propyl butyrate, butyric acid Isopropyl, n-butyl butyrate, ethyl hydroxyacetate, ethyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-3-methylbutyrate, ethyl methoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, 3-methoxy Ethyl propionate, 3 Methyl ethoxypropionate, ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutylpropionate, 3-methyl-3-methoxybutyl butyrate And methyl acetoacetate, ethyl acetoacetate, methyl pyruvate, ethyl pyruvate, and diethylene glycol methyl ethyl ester.

  Specific examples of ketones include methyl ethyl ketone, methyl propyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, 2-heptanone, 3-heptanone, 4-heptanone, cyclohexanone and the like.

  Specific examples of amides include N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone and the like.

  Specific examples of lactones include γ-butyrolactone.

  Preferably, propylene glycol methyl ether acetate, diethylene glycol methyl ethyl ester, or a mixture thereof is preferably used from the viewpoint of coatability and uniformity of the film thickness of the insulating film.

  The content of the solvent is not particularly limited as long as the function is performed. For example, the solvent may be contained in an amount of 40 to 90% by weight, preferably 50 to 80% by weight, based on the total weight of the composition. But you can. When the content of the solvent is 40% by weight or more and 90% by weight or less with respect to the total weight of the composition, the solid content and viscosity can be maintained at an appropriate level, and the coating property is increased. is there.

(D) Additives The photosensitive resin composition of the present invention includes other commonly used basic compounds, surfactants, adhesion improvers, thermal crosslinking agents, light stabilizers, photocuring accelerators, antihalation agents ( An additive such as a leveling agent and an antifoaming agent may further be included within the range not departing from the object of the present invention.

  The kind of basic compound is not particularly limited, and can be arbitrarily selected from those used as chemically amplified resists. Specific examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, quaternary ammonium salts of carboxylic acids, and the like. These can be used individually or in mixture of 2 or more types.

  Specific examples of the aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanolamine, dicyclohexyl. Examples include amines and dicyclohexylmethylamine.

  Specific examples of the aromatic amine include aniline, benzylamine, N, N-dimethylaniline, diphenylamine and the like.

  Specific examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, and N-methyl-4-phenylpyridine. , 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, nicotine, nicotinic acid, nicotinamide, quinoline, 8-oxyquinoline, pyrazine , Pyrazole, pyridazine, purine, pyrrolidine, piperidine, 1,5-diazabicyclo [4.3.0] -5-nonene, 1,8-diazabicyclo [5.3.0] -7-undecene and the like.

  Specific examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, tetra-n-hexylammonium hydroxide and the like.

  Specific examples of the quaternary ammonium salt of carboxylic acid include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, tetra-n-butylammonium benzoate and the like.

  The content of the basic compound is not particularly limited as long as the function is performed, but may be included in an amount of 0.001 to 1 part by weight, preferably 0.005 to 0 parts by weight with respect to 100 parts by weight of the binder resin. .5 parts by weight may be included. When the content of the basic compound is 0.001 part by weight or more and 1 part by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage that an interlayer insulating film having good heat resistance and solvent resistance can be formed.

  The surfactant is a component that improves the adhesion between the substrate and the photosensitive resin composition.

  The type of the surfactant is not particularly limited, and various surfactants such as a fluorine-containing surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicon surfactant can be used. These can be used individually or in mixture of 2 or more types.

  Specific examples of the fluorine-containing surfactant include MAGAFAC F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, and F781 (trade name, DIC). Corporation), FLUORAD FC430, FC431 and FC171 (trade names, Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC -383, S393 and KH-40 (trade name, manufactured by Asahi Glass Co., Ltd.), SOLPERSE 20000 (trade name, manufactured by Lubrizol Japan Limited), and the like. I can get lost.

  Specific examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates or propoxylates (eg, glycerol propoxylate or glycerine ethoxylate); PLURONIC L10, L31, L61, L62, 10R5 , 17R2, 25R2, and TETRONIC 304, 701, 704, 901, 904, 150R1 (trade name, manufactured by BASF), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene Octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate Such as sorbitan fatty acid esters.

  Specific examples of the cationic surfactant include phthalocyanine-modified compounds such as EFKA-745 (trade name, manufactured by Morishita & Co., Ltd.), KP341 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.). ); An organosiloxane polymer such as POLYFLOW No. 75, no. 90, no. 95 (trade name, manufactured by Kyoeisha Chemical Co., Ltd.), (meth) acrylic acid type (co) polymer, W001 (trade name, manufactured by Yusho Co., Ltd.), and the like.

  Specific examples of the anionic surfactant include W004, W005, and W017 (trade name, manufactured by Yusho Co., Ltd.).

  Specific examples of the silicon surfactant include TRAY SILICON DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, and SH8400 (trade name, manufactured by Dow Corning Toray Co., Ltd.), TSF-4440, 4300, 4445. , 4460 and 4452 (trade names, manufactured by Momentive Performance Materials Inc.), KP341, KF6001 and KF6002 (trade names, manufactured by Shin-Etsu Chemical Co., Ltd.), BYK307, 323 and 330C (trade names e, B, e) Etc.).

  The content of the surfactant is not particularly limited as long as its function is performed, but it may be contained in an amount of 0.01 to 5 parts by weight, preferably 0.05 to 3 parts per 100 parts by weight of the binder resin. It may be included in parts by weight. There exists an advantage which maximizes the effect which improves adhesiveness of a board | substrate and a resin composition as content of surfactant is 0.01 weight part or more and 5 weight part or less with respect to 100 weight part of binder resin. .

  The adhesion improver improves the adhesion between an insulating material and an inorganic material as a base material, for example, silicon compounds such as silicon, silicon oxide, and silicon nitride, gold, copper, and aluminum, and has a taper angle with the substrate. It is also useful for adjustment.

  Although the kind of adhesive improvement agent is not specifically limited, As a specific example, a silane coupling agent or a thiol compound is mentioned, Preferably, a silane coupling agent is mentioned.

  Although the kind of silane coupling agent is not particularly limited, specific examples include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrialkoxysilane, and γ-glycidoxypropylalkyl. Dialkoxysilane, γ-methacryloxypropyltrialkoxysilane, γ-methacryloxypropylalkyldialkoxysilane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyl Examples include trialkoxysilane and vinyltrialkoxysilane. Preferably, γ-glycidoxypropyltrialkoxysilane or γ-methacryloxypropyltrialkoxysilane is used, and more preferably, γ-glycidoxypropyltrialkoxysilane is used. These can be used individually or in mixture of 2 or more types.

  The content of the adhesion improver is not particularly limited as long as the function is performed, but may be included at 0.1 to 20 parts by weight, preferably 0.5 to 100 parts by weight with respect to 100 parts by weight of the binder resin. It may be included at 10 parts by weight. When the content of the adhesion improving agent is 0.1 part by weight or more and 20 parts by weight or less with respect to 100 parts by weight of the binder resin, the effect of improving the adhesiveness with the insulating film and adjusting the taper angle with the substrate is maximized. There is an advantage of becoming.

  The thermal crosslinking agent is a component that improves the heat resistance by allowing the crosslinking reaction to be smoothly performed by UV irradiation and heat treatment when an insulating film is formed from the composition.

  The kind of thermal crosslinking agent is not specifically limited, As a specific example, polyacrylate resin, an epoxy resin, a phenol resin, a melamine resin, an organic acid, an amine compound, an anhydrous compound etc. are mentioned. These can be used individually or in mixture of 2 or more types.

  The content of the thermal crosslinking agent is not particularly limited as long as the function is performed, but may be included in an amount of 0.01 to 5 parts by weight, preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the binder resin. It may be included in parts by weight. When the content of the thermal crosslinking agent is 0.01 part by weight or more and 5 parts by weight or less with respect to 100 parts by weight of the binder resin, there is an advantage that the effect of improving the heat resistance is maximized.

  A light stabilizer is a component which improves the light resistance of the photosensitive resin composition.

  The kind of light stabilizer is not particularly limited, and specific examples include benzotriazole-based, triazine-based, benzophenone-based, hindered aminoether-based, hindered amine-based compounds, and the like. These can be used individually or in mixture of 2 or more types.

  The content of the light stabilizer is not particularly limited as long as the function is performed, but may be included in an amount of 0.01 to 5 parts by weight, preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the binder resin. It may be included in parts by weight. When the content of the light stabilizer is 0.01 to 5 parts by weight with respect to 100 parts by weight of the binder resin, there is an advantage that the effect of improving light resistance is maximized.

<Insulating film>
The present invention provides an insulating film made of the composition.

  The method for forming an insulating film according to the present invention includes a step of applying the photosensitive resin composition of the present invention to an upper portion of a substrate of a display device or an upper portion of a source / drain or silicon nitride layer formed on the substrate. And pre-bake the photosensitive resin composition, selectively exposing and developing the photosensitive resin composition to form a pattern, and heat-treating the formed pattern. it can.

  As the substrate, glass or transparent plastic resin usually used for liquid crystal display devices, organic ELs and the like is mainly used, but is not particularly limited by the characteristics of the display device used. For example, a metal film that forms a gate electrode on an insulating substrate such as a glass substrate and the metal film serves as a surface layer can be used.

  The method for applying the photosensitive resin composition to the upper part of the substrate or the like is not particularly limited, and examples thereof include a coating method using a slit nozzle such as a spray coating method, a roll coating method, and a discharge nozzle type coating method, and a central dropping spin method. There are a spin coating method, an extrusion coating method, a bar coating method, etc., and coating can be performed by combining two or more coating methods.

  The thickness of the applied film depends on the application method, the solid content concentration of the composition, the viscosity, and the like, but is usually applied so that the film thickness after drying becomes 0.5 to 100 μm.

  The pre-baking stage performed thereafter is a step of volatilizing the solvent by applying vacuum, infrared rays or heat in order to obtain a coating film having no fluidity after the coating film formation. The heating conditions depend on the type and composition of each component, but in the case of heating with a hot plate, the heating can be performed at 60 to 130 ° C. for 5 to 500 seconds. It can be performed at ˜140 ° C. for 20 to 1,000 seconds.

  Thereafter, the selective exposure step can be an excimer laser, deep ultraviolet, ultraviolet, visible light, electron beam, X-ray or g-ray (wavelength 436 nm), i-ray (wavelength 365 nm), h-ray (wavelength 405 nm), or It is performed while irradiating these mixed rays. The exposure can be performed by a contact type, a proximity type, a projection type exposure method, or the like.

  In this invention, after performing alkali image development, the step which heat-processes (high-temperature baking) the photosensitive resin composition is performed. A thermal crosslinking agent or the like is applied to the composition of the photosensitive resin composition for high-temperature baking. The heat treatment step may be performed using a heating device such as a hot plate or an oven at a temperature of 150 to 350 ° C. for 30 minutes to 3 hours. After finishing the heat treatment, a completely crosslinked and hardened pattern is obtained.

<Image display device>
Furthermore, the present invention provides an image display device provided with the insulating film.

  The insulating film of the present invention can be applied not only to a normal liquid crystal display device but also to various image display devices such as an electroluminescence display device, a plasma display device, and a field emission display device.

  The image display device can have a configuration normally used in this field except for the insulating film.

  The following examples are presented to assist in understanding the present invention, but these examples are merely illustrative of the invention and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments within the scope and spirit of the invention, and these variations and modifications can be Of course, it belongs to the range.

Examples and Comparative Examples Photosensitive resin compositions having the compositions and contents described in Table 1 below were produced.

４．溶媒
Ｄ１：プロピレングリコールメチルエチルアセテート
Ｄ２：ジエチレングリコールメチルエチルエステル
５．塩基性化合物：ジシクロヘキシルメチルアミン
６．カップリング剤：γ−グリシドキシプロピルトリアルコキシシラン
７．界面活性剤：
Ｇ１：ＳＨ−８４００（ダウコーニング社製）
Ｇ２：Ｆ−４７５（ＤＩＣ社製）

4). Solvent D1: Propylene glycol methyl ethyl acetate D2: Diethylene glycol methyl ethyl ester Basic compound: dicyclohexylmethylamine6. 6. Coupling agent: γ-glycidoxypropyltrialkoxysilane Surfactant:
G1: SH-8400 (manufactured by Dow Corning)
G2: F-475 (manufactured by DIC)

Experimental Examples The following evaluations were performed on the resin compositions produced based on the examples and comparative examples, and the results are shown in Table 2 below.

(1) Measurement of sensitivity Each of the photosensitive resin compositions of Examples and Comparative Examples was applied to a 0.7 mm thick glass substrate (Corning 1737, manufactured by Corning) with a spinner, and then on a hot plate at 100 ° C. The solvent was volatilized by heating for 125 seconds. As a result, a photosensitive resin composition layer having a thickness of 4.0 μm was formed.

  Thereafter, in order to obtain a contact hole pattern having a diameter of 10 μm, exposure is performed with an i-line stepper (NSR-205i11D, manufactured by Nikon Corporation) using a mask having an opening of a square pattern with an exposed portion having a side of 10 μm. It was.

  The exposed substrate was subjected to paddle development at 23 ° C. for 40 seconds using a 2.38% tetramethylammonium hydroxide aqueous solution as a developer, and heated in an oven at 230 ° C. for 30 minutes to obtain a cured film. .

  Thereafter, the substrate was cut vertically, and the exposure amount at which each composition had a 10 μm contact hole was selected as sensitivity.

(2) Pattern angle The pattern obtained in Experimental Example (1) was cut vertically, and the angle with the substrate was calculated from the optical photograph.

(3) Measurement of transmittance The transmittance at 400 nm of the film obtained in Experimental Example (1) was measured with a spectrophotometer.

(4) Evaluation of adhesion The photosensitive resin compositions of Examples and Comparative Examples were each applied by a spinner on a glass substrate on which SiNx was deposited without applying an HMDS (Hexamethyldisilazane) solution to 100 ° C. The solvent was volatilized by heating on a hot plate for 125 seconds. As a result, a photosensitive resin composition layer having a thickness of 4.0 μm was formed.

  Thereafter, exposure was performed with an i-line stepper (NSR-205i11D, manufactured by Nikon Corporation) using a mask having a 5-20 μm hole pattern.

  The substrate after the exposure was subjected to paddle development for 40 seconds at 23 ° C. using a 2.38% tetramethylammonium hydroxide aqueous solution as a developer, and the presence or absence of pattern peeling was confirmed.

◎: The pattern is not peeled at all in the region ○: The pattern is finely peeled off in a part of the region Δ: A considerable part of the pattern is peeled off X: The pattern is peeled off in the whole region

  As shown in the said Table 2, it has confirmed that the insulating film formed with the photosensitive resin composition of Examples 1-21 was very excellent in adhesiveness. In addition, the sensitivity and the transmittance also showed an effect equal to or better than the conventional one and an appropriate pattern angle.

  On the other hand, the compositions of Comparative Examples 1 to 5 that did not use a siloxane binder showed very poor adhesion.

  Moreover, in the case of the comparative example 6 which does not contain an acrylic resin, there existed a problem that the transmittance | permeability fell remarkably. Furthermore, in the case of the comparative example 7 which uses the acrylic resin which does not contain an epoxy group, there existed a problem that not only the transmittance | permeability fell but a pattern angle became too low.

Claims (15)

(A-1) a resin in which at least a part of the phenolic hydroxyl group or carboxy group is protected with an acid-decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) a siloxane resin (A) A binder resin,
(B) a photoacid generator;
(C) A chemically amplified photosensitive resin composition comprising a solvent. 2. The chemically amplified photosensitivity according to claim 1, wherein the (a-1) resin is polymerized by including at least one monomer represented by the following chemical formula 1, chemical formula 2, chemical formula 3 and chemical formula 4: Resin composition.

[Wherein, R represents an alkyl group having 1 to 6 carbon atoms which is substituted or unsubstituted with an alkyl group having 1 to 6 carbon atoms; a tetrahydropyranyl group; or an alkoxy group having 1 to 6 carbon atoms or 4 carbon atoms. It is a C1-C6 alkyl group substituted or unsubstituted by -8 cycloalkoxy groups. ]

[Wherein, R ₁ represents a hydrogen atom or a methyl group, and R ₂ represents an alkyl group having 1 to 6 carbon atoms or a cycloalkyl group having 4 to 8 carbon atoms. ]

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 3 to 8 carbon atoms, and R ₃ is an alkyl group having 1 to 6 carbon atoms or an alkyl group having 4 to 8 carbon atoms. A cycloalkyl group; ]

[Wherein, R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 1 to 6 carbon atoms or a cycloalkylene group having 4 to 8 carbon atoms, and R ₃ represents 1 to 6 carbon atoms. Or an alkyl group having 4 to 8 carbon atoms. ]   The chemically amplified photosensitive resin composition according to claim 2, wherein the repeating unit formed by the monomers represented by the chemical formulas 1 to 4 is contained in an amount of 20 to 60 mol% with respect to the whole (a-1) resin. object.   The chemically amplified photosensitive resin composition according to any one of claims 1 to 3, wherein the (a-1) resin has a weight average molecular weight of 5,000 to 35,000. The chemically amplified photosensitive resin composition according to any one of claims 1 to 4, wherein the (a-2) resin is polymerized by including a monomer represented by the following Chemical Formula 5 or Chemical Formula 6. object.

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbon atoms, and R ₃ and R ₄ are each independently a hydrogen atom or a C 1 to 6 carbon atom. It is an alkyl group, or can be connected to each other to form a ring having 3 to 8 carbon atoms, and m is an integer of 1 to 6. ]

[Wherein, R ₁ is a hydrogen atom or a methyl group, R ₂ is an alkylene group having 1 to 6 carbon atoms, and R ₃ and R ₄ are each independently a hydrogen atom or a C 1 to 6 carbon atom. It can be an alkyl group or linked to each other to form a ring having 3 to 8 carbon atoms. ]   6. The chemically amplified photosensitive property according to claim 5, wherein the repeating unit formed by the monomer of the chemical formula 5 or the chemical formula 6 is included in an amount of 5 to 60 mol% with respect to the entire resin (a-2). Resin composition.   The chemically amplified photosensitive resin composition according to claim 1, wherein the (a-2) resin has a weight average molecular weight of 5,000 to 40,000. The chemistry according to any one of claims 1 to 7, wherein the resin (a-3) is a resin that is polymerized by including a monomer represented by the following chemical formula 7, chemical formula 8, and chemical formula 9. Amplified photosensitive resin composition.

Wherein, R ₁ is a linear or branched alkyl group having a hydrogen atom or a 1 to 5 carbon atoms independently of one another. ]

Wherein, R ₂ is a straight-chain or branched-chain alkyl group having a hydrogen atom or a 1 to 5 carbon atoms independently of one another. ]

[In formula, R < ₃ > is a hydrogen atom or a C1-C5 linear or branched alkyl group mutually independently. ]   10 to 60 mol% of the repeating unit formed by the monomer of the chemical formula 7, 10 to 60 mol% of the repeating unit formed by the monomer of the chemical formula 8, based on the whole resin (a-3) The chemically amplified photosensitive resin composition according to claim 8, comprising 10 to 60 mol% of repeating units formed by the monomer represented by Chemical Formula 9.   The chemically amplified photosensitive resin composition according to any one of claims 1 to 9, wherein the (a-3) resin has a weight average molecular weight of 500 to 20,000.   The binder resin is 30 to 55 parts by weight of the (a-1) resin, 30 to 60 parts by weight of the resin (a-2), and the resin (a-3) 1 with respect to 100 parts by weight of the total binder resin. The chemically amplified photosensitive resin composition according to any one of claims 1 to 10, comprising ~ 25 parts by weight.   The photoacid generator is composed of diazonium salt, phosphonium salt, sulfonium salt, iodonium salt, imide sulfonate, oxime sulfonate, diazodisulfone, disulfone, ortho-nitrobenzyl sulfonate, triazine compound. The chemically amplified photosensitive resin composition according to any one of claims 1 to 11, which is one or more selected from the group.   The chemical amplification type according to any one of claims 1 to 12, wherein the solvent is one or more selected from the group consisting of ethers, acetates, esters, ketones, amides, and lactones. Photosensitive resin composition.   The insulating film by which the chemically amplified photosensitive resin composition as described in any one of Claims 1-13 was hardened.   An image display device comprising the insulating film according to claim 14.