TWI704336B - Optical inspection apparatus - Google Patents
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Abstract
Description
本發明是有關於一種檢測設備,且特別是有關於一種光學檢測設備。 The present invention relates to a detection device, and particularly relates to an optical detection device.
光學檢測是運用機器視覺做為檢測標準技術,做為改良傳統上以人力使用光學儀器進行檢測的缺點。 Optical inspection is the use of machine vision as the inspection standard technology to improve the shortcomings of traditional manual optical instruments for inspection.
現行自動X光檢測機台,在進板時均是以輸送機上的對照式感測器為主。但在實際運用中,若待測物板厚差異,使得對照式感測器無法使用統一閥值,造成操作人員需要針對不同板厚差異去調整感測器閥值。且對照式感測器因有指向角的限制,對於輸送機在不同板寬的平整度要求也較高。 The current automatic X-ray inspection machine is mainly based on the contrast sensor on the conveyor when entering the plate. However, in actual application, if the thickness of the object to be measured is different, the contrast sensor cannot use a unified threshold, which causes the operator to adjust the sensor threshold according to the difference of the thickness. In addition, the contrast sensor has higher requirements for the flatness of the conveyor in different plate widths due to the limitation of the pointing angle.
然而,現行以輸送機上的對照式感測器做為停板感測,當待測物厚度變薄時,因光遮蔽的範圍變小,待測物無法停在正確位置,造成檢測產生異常。 However, the current contrast sensor on the conveyor is used as the stop plate sensing. When the thickness of the test object becomes thinner, the range of light shielding becomes smaller, and the test object cannot stop at the correct position, causing abnormal detection. .
本發明提出一種光學檢測設備,改善先前技術的問題。 The present invention proposes an optical detection device to improve the problems of the prior art.
在本發明的一實施例中,本發明所提出的光學 檢測設備,其包含光學掃描裝置、至少一反射式感測器、傳動機件以及處理器。反射式感測器設置於光學掃描裝置上,處理器電性連接光學掃描裝置、反射式感測器與傳動機件。傳動機件用於傳送待測物,在反射式感測器感測到待測物以後,處理器控制傳動機件暫停傳送待測物,使光學掃描裝置得以對待測物進行光學掃描。 In an embodiment of the present invention, the optical detection device provided by the present invention includes an optical scanning device, at least one reflective sensor, a transmission mechanism, and a processor. The reflective sensor is arranged on the optical scanning device, and the processor is electrically connected to the optical scanning device, the reflective sensor and the transmission mechanism. The transmission mechanism is used to transmit the object to be measured. After the reflective sensor detects the object, the processor controls the transmission mechanism to suspend the transmission of the object to be measured, so that the optical scanning device can perform optical scanning of the object to be measured.
在本發明的一實施例中,光學掃描裝置包含X光產生器與X光偵測器。X光產生器位於傳動機件的一方,X光偵測器位於傳動機件的另一方。X光產生器用於產生X光,X光偵測器用於偵測從X光產生器輸出並透過待測物的X光。 In an embodiment of the present invention, the optical scanning device includes an X-ray generator and an X-ray detector. The X-ray generator is located on one side of the transmission mechanism, and the X-ray detector is located on the other side of the transmission mechanism. The X-ray generator is used to generate X-rays, and the X-ray detector is used to detect the X-rays output from the X-ray generator and passing through the object to be tested.
在本發明的一實施例中,反射式感測器設置於X光產生器與X光偵測器中至少一者上。 In an embodiment of the present invention, the reflective sensor is disposed on at least one of the X-ray generator and the X-ray detector.
在本發明的一實施例中,反射式感測器包含第一反射式感測器以及第二反射式感測器。第一反射式感測器設置於X光產生器上,當第一反射式感測器感測到待測物時,處理器控制傳動機件減速傳送待測物。第二反射式感測器設置於X光產生器上,第二反射式感測器與第一反射式感測器彼此相間隔,當第二反射式感測器感測到待測物時,處理器控制傳動機件暫停傳送待測物。 In an embodiment of the present invention, the reflective sensor includes a first reflective sensor and a second reflective sensor. The first reflective sensor is arranged on the X-ray generator. When the first reflective sensor senses the object to be measured, the processor controls the transmission mechanism to decelerate and transmit the object to be measured. The second reflective sensor is arranged on the X-ray generator. The second reflective sensor and the first reflective sensor are spaced apart from each other. When the second reflective sensor detects the object to be measured, The processor controls the transmission mechanism to suspend the transmission of the object under test.
在本發明的一實施例中,X光產生器具有X光輸出口,第一反射式感測器與第二反射式感測器分別設置於X光輸出口的相對兩側。 In an embodiment of the present invention, the X-ray generator has an X-ray output port, and the first reflective sensor and the second reflective sensor are respectively disposed on opposite sides of the X-ray output port.
在本發明的一實施例中,反射式感測器包含第 一反射式感測器以及第二反射式感測器。第一反射式感測器設置於X光產生器上,當第一反射式感測器感測到待測物時,處理器控制傳動機件減速傳送待測物。第二反射式感測器設置於X光偵測器上,第二反射式感測器與第一反射式感測器彼此相間隔,當第二反射式感測器感測到待測物時,處理器控制傳動機件暫停傳送待測物。 In an embodiment of the present invention, the reflective sensor includes a first reflective sensor and a second reflective sensor. The first reflective sensor is arranged on the X-ray generator. When the first reflective sensor senses the object to be measured, the processor controls the transmission mechanism to decelerate and transmit the object to be measured. The second reflective sensor is arranged on the X-ray detector, the second reflective sensor and the first reflective sensor are spaced apart from each other, when the second reflective sensor senses the object to be measured , The processor controls the transmission mechanism to suspend the transmission of the object under test.
在本發明的一實施例中,反射式感測器包含第一反射式感測器以及第二反射式感測器。第一反射式感測器設置於X光偵測器上,當第一反射式感測器感測到待測物時,處理器控制傳動機件減速傳送待測物。第二反射式感測器設置於X光產生器上,第二反射式感測器與第一反射式感測器彼此相間隔,當第二反射式感測器感測到待測物時,處理器控制傳動機件暫停傳送待測物。 In an embodiment of the present invention, the reflective sensor includes a first reflective sensor and a second reflective sensor. The first reflective sensor is arranged on the X-ray detector. When the first reflective sensor detects the object to be measured, the processor controls the transmission mechanism to decelerate and transmit the object to be measured. The second reflective sensor is arranged on the X-ray generator. The second reflective sensor and the first reflective sensor are spaced apart from each other. When the second reflective sensor detects the object to be measured, The processor controls the transmission mechanism to suspend the transmission of the object under test.
在本發明的一實施例中,反射式感測器包含第一反射式感測器以及第二反射式感測器。第一反射式感測器設置於X光偵測器上,當第一反射式感測器感測到待測物時,處理器控制傳動機件減速傳送待測物。第二反射式感測器設置於X光偵測器上,第二反射式感測器與第一反射式感測器彼此相間隔,當第二反射式感測器感測到待測物時,處理器控制傳動機件暫停傳送待測物。 In an embodiment of the present invention, the reflective sensor includes a first reflective sensor and a second reflective sensor. The first reflective sensor is arranged on the X-ray detector. When the first reflective sensor detects the object to be measured, the processor controls the transmission mechanism to decelerate and transmit the object to be measured. The second reflective sensor is arranged on the X-ray detector, the second reflective sensor and the first reflective sensor are spaced apart from each other, when the second reflective sensor senses the object to be measured , The processor controls the transmission mechanism to suspend the transmission of the object under test.
在本發明的一實施例中,反射式感測器為單一個反射式感測器,單一個反射式感測器設置於X光產生器或X光偵測器上,當單一個反射式感測器感測到待測物時,處理器依據傳動機件的傳動速度預判停止時間點,進而於停止時間點令 傳動機件暫停傳送待測物。 In an embodiment of the present invention, the reflective sensor is a single reflective sensor, and the single reflective sensor is arranged on the X-ray generator or the X-ray detector. When the sensor detects the object to be measured, the processor predicts the stopping time point according to the transmission speed of the transmission mechanism, and then stops the transmission mechanism from transmitting the object to be measured at the stopping time point.
在本發明的一實施例中,待測物為電路板。 In an embodiment of the present invention, the test object is a circuit board.
綜上所述,本發明之技術方案與現有技術相比具有明顯的優點和有益效果。藉由本發明的技術方案,光學掃描裝置上反射式感測器之停板方式(即,停止待測物的傳送),可由處理器透過軟體設定停板位置,提升停板穩定性,且操作人員不需更改硬體設定。 In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the technical solution of the present invention, the stop method of the reflective sensor on the optical scanning device (that is, stop the transmission of the object to be measured), the stop position can be set by the processor through software, which improves the stability of the stop, and the operator No need to change the hardware settings.
以下將以實施方式對上述之說明作詳細的描述,並對本發明之技術方案提供更進一步的解釋。 Hereinafter, the above description will be described in detail by way of implementation, and a further explanation will be provided for the technical solution of the present invention.
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附符號之說明如下: In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the description of the attached symbols is as follows:
100、200、300、400、500、600、700‧‧‧光學檢測設備 100, 200, 300, 400, 500, 600, 700‧‧‧Optical inspection equipment
110‧‧‧光學掃描裝置 110‧‧‧Optical scanning device
112‧‧‧X光產生器 112‧‧‧X-ray generator
113‧‧‧X光輸出口 113‧‧‧X-ray output port
114‧‧‧X光偵測器 114‧‧‧X-ray detector
120‧‧‧反射式感測器 120‧‧‧Reflective sensor
130‧‧‧傳動機件 130‧‧‧Transmission parts
140‧‧‧處理器 140‧‧‧Processor
190‧‧‧待測物 190‧‧‧Object to be tested
210、310、410、510‧‧‧第一反射式感測器 210, 310, 410, 510‧‧‧The first reflective sensor
220、320、420、520‧‧‧第二反射式感測器 220, 320, 420, 520‧‧‧Second reflective sensor
610‧‧‧反射式感測器 610‧‧‧Reflective sensor
710‧‧‧反射式感測器 710‧‧‧Reflective sensor
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖是依照本發明一實施例之一種光學檢測設備的前視示意圖;以及第2~7圖是依照本發明多個實施例之光學檢測設備的側視示意圖。 In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: Figure 1 is a schematic front view of an optical inspection device according to an embodiment of the present invention; And FIGS. 2-7 are schematic side views of optical inspection equipment according to various embodiments of the present invention.
為了使本發明之敘述更加詳盡與完備,可參照所附之圖式及以下所述各種實施例,圖式中相同之號碼代表相同或相似之元件。另一方面,眾所週知的元件與步驟並未描述於實施例中,以避免對本發明造成不必要的限制。 In order to make the description of the present invention more detailed and complete, please refer to the attached drawings and various embodiments described below. The same numbers in the drawings represent the same or similar elements. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessary limitations on the present invention.
於實施方式與申請專利範圍中,涉及『連接』之描述,其可泛指一元件透過其他元件而間接耦合至另一元件,或是一元件無須透過其他元件而直接連結至另一元件。 In the implementation and the scope of the patent application, the description of "connection" can generally refer to a component that is indirectly coupled to another component through other components, or that one component is directly connected to another component without other components.
於實施方式與申請專利範圍中,涉及『電性連線』之描述,其可泛指一元件透過其他元件而間接與另一元件進行電氣連結,或是一元件無須透過其他元件而實體連接至另一元件。 In the implementation and the scope of the patent application, the description of "electrical connection" can generally refer to a component that is electrically connected to another component indirectly through other components, or that a component is physically connected to another component without going through other components. Another element.
於實施方式與申請專利範圍中,除非內文中對於冠詞有所特別限定,否則『一』與『該』可泛指單一個或複數個。 In the implementation mode and the scope of the patent application, unless the article is specifically limited in the context, "a" and "the" can generally refer to a single or plural.
第1圖是依照本發明一實施例之一種光學檢測設備100的前視示意圖。如第1圖所示,光學檢測設備100包含光學掃描裝置110、至少一反射式感測器120、傳動機件130以及處理器140。在架構上,反射式感測器120設置於光學掃描裝置110上,處理器140電性連接光學掃描裝置110、反射式感測器120與傳動機件130。舉例而言,傳動機件130可為輸送機,其包含步進馬達、傳送帶…等元件,處理器140可為中央處理器、控制器或其他處理電路。
FIG. 1 is a schematic front view of an
於運作時,傳動機件130用於傳送待測物190,在反射式感測器120感測到待測物190以後,處理器140控制傳動機件130暫停傳送待測物190,使光學掃描裝置110得以對待測物190進行光學掃描。舉例而言,待測物190可為電路板、半導體晶圓、顯示面板或其他物體。
In operation, the
在第1圖中,光學掃描裝置110包含X光產生器112與X光偵測器114。在架構上,X光產生器112位於傳動機件130的一方,X光偵測器114位於傳動機件130的另一方。於運作時,X光產生器112用於產生X光,X光偵測器114用於偵測從X光產生器輸出並透過待測物190的X光。於本實施例中,X光產生器112位於傳動機件130的上方,X光偵測器114位於傳動機件130的下方,但此不限制本發明。於其他實施例中,X光產生器112可位於傳動機件130的下方,X光偵測器114可位於傳動機件130的上方,熟習此項技藝者當視當時需要,彈性選擇之。 In FIG. 1, the
應瞭解到,雖然第1圖繪示反射式感測器120置於X光產生器112,舉例而言,反射式感測器120設置於X光產生器112的X光輸出口113的側邊,但本發明不以此為限。實務上,反射式感測器120設置於X光產生器112與X光偵測器114中至少一者上。舉例而言,反射式感測器120可為可為紅光感測器、藍光感測器、不可見光感測器(如:紅外線感測器)、雷射光感測器或其他非X光感測器,以避免干擾X光產生器112與X光偵測器114。 It should be understood that although FIG. 1 shows that the
為了對上述反射式感測器120做更進一步的闡述,請分別參照第2~7圖,第2~7圖是依照本發明多個實施例之光學檢測設備200、300、400、500、600、700的側視示意圖。 In order to further explain the above-mentioned
在第2圖中,反射式感測器120包含第一反射式感測器210以及第二反射式感測器220。在架構上,第一反射式感測器210設置於X光產生器112上,第二反射式感測器220設置於X光產生器112上,第一反射式感測器210與第 二反射式感測器220彼此相間隔。具體而言,X光產生器112具有X光輸出口113,第一反射式感測器210與第二反射式感測器220分別設置於X光輸出口113的相對兩側,以節省空間。 In FIG. 2, the
於運作時,待測物190被傳動機件130傳送,會先經過第一反射式感測器210,然後再經過第二反射式感測器220。當第一反射式感測器210感測到待測物190時,處理器140控制傳動機件130減速傳送待測物190。接下來,當第二反射式感測器220感測到待測物190時,處理器140控制傳動機件130暫停傳送待測物190,使X光產生器112產生X光,X光偵測器114偵測從X光產生器112輸出並透過待測物190的X光。藉此,X光產生器112與X光偵測器114得以對待測物190進行光學掃描。 During operation, the object to be measured 190 is transferred by the
或者,在進行光學掃描前,舉例而言,處理器140可透過X光產生器112與X光偵測器114確認待測物190的實際停止位置與目標位置(如:系統預設值)之間的偏移量,處理器140可透過傳動機件130微調待測物190的位置或移動X光產生器112與/或X光偵測器114,以消除該偏移量的影響,讓光學檢測設備200的光學掃描更為精準。 Or, before performing optical scanning, for example, the
在第3圖中,反射式感測器120包含第一反射式感測器310以及第二反射式感測器320。在架構上,第一反射式感測器310設置於X光產生器112上,第二反射式感測器320設置於X光偵測器114上,第一反射式感測器310以及第二反射式感測器320在垂直投影上彼此錯開,第一反射式 感測器310設置於X光輸出口113上最接近待測物190的行進方向的一側。 In FIG. 3, the
於運作時,待測物190被傳動機件130傳送,會先經過第一反射式感測器310,然後再經過第二反射式感測器320。當第一反射式感測器310感測到待測物190時,處理器140控制傳動機件130減速傳送待測物190。接下來,當第二反射式感測器320感測到待測物190時,處理器140控制傳動機件130暫停傳送待測物190,使X光產生器112產生X光,X光偵測器114偵測從X光產生器112輸出並透過待測物190的X光。藉此,X光產生器112與X光偵測器114得以對待測物190進行光學掃描。 During operation, the object to be measured 190 is transported by the
或者,在進行光學掃描前,舉例而言,處理器140可透過X光產生器112與X光偵測器114確認待測物190的實際停止位置與目標位置(如:系統預設值)之間的偏移量,處理器140可透過傳動機件130微調待測物190的位置或移動X光產生器112與/或X光偵測器114,以消除該偏移量的影響,讓光學檢測設備300的光學掃描更為精準。 Or, before performing optical scanning, for example, the
在第4圖中,反射式感測器120包含第一反射式感測器410以及第二反射式感測器420。在架構上,第一反射式感測器410設置於X光偵測器114上,第二反射式感測器420設置於X光產生器112上,第一反射式感測器410以及第二反射式感測器420在垂直投影上彼此錯開,第二反射式感測器420設置於X光輸出口113上最遠離待測物190的行進方向的一側。 In FIG. 4, the
於運作時,待測物190被傳動機件130傳送,會先經過第一反射式感測器410,然後再經過第二反射式感測器420。當第一反射式感測器410感測到待測物190時,處理器140控制傳動機件130減速傳送待測物190。接下來,當第二反射式感測器420感測到待測物190時,處理器140控制傳動機件130暫停傳送待測物190,使X光產生器112產生X光,X光偵測器114偵測從X光產生器112輸出並透過待測物190的X光。藉此,X光產生器112與X光偵測器114得以對待測物190進行光學掃描。 During operation, the object to be measured 190 is transferred by the
或者,在進行光學掃描前,舉例而言,處理器140可透過X光產生器112與X光偵測器114確認待測物190的實際停止位置與目標位置(如:系統預設值)之間的偏移量,處理器140可透過傳動機件130微調待測物190的位置或移動X光產生器112與/或X光偵測器114,以消除該偏移量的影響,讓光學檢測設備400的光學掃描更為精準。 Or, before performing optical scanning, for example, the
在第5圖中,反射式感測器120包含第一反射式感測器510以及第二反射式感測器520。在架構上,第一反射式感測器510設置於X光偵測器114上,第二反射式感測器520設置於X光偵測器114上,第一反射式感測器510與第二反射式感測器520彼此相間隔。具體而言,第一反射式感測器510比第二反射式感測器520更接近接近待測物190的行進方向。 In FIG. 5, the
於運作時,待測物190被傳動機件130傳送,會先經過第一反射式感測器510,然後再經過第二反射式感測 器520。當第一反射式感測器510感測到待測物190時,處理器140控制傳動機件130減速傳送待測物190。接下來,當第二反射式感測器520感測到待測物190時,處理器140控制傳動機件130暫停傳送待測物190,使X光產生器112產生X光,X光偵測器114偵測從X光產生器112輸出並透過待測物190的X光。藉此,X光產生器112與X光偵測器114得以對待測物190進行光學掃描。 During operation, the
或者,在進行光學掃描前,舉例而言,處理器140可透過X光產生器112與X光偵測器114確認待測物190的實際停止位置與目標位置(如:系統預設值)之間的偏移量,處理器140可透過傳動機件130微調待測物190的位置或移動X光產生器112與/或X光偵測器114,以消除該偏移量的影響,讓光學檢測設備500的光學掃描更為精準。 Or, before performing optical scanning, for example, the
在第6圖中,反射式感測器120包含單一個反射式感測器610。在架構上,反射式感測器610設置於X光產生器112上。具體而言,反射式感測器610可設置於X光輸出口113上最接近待測物190的行進方向的一側。 In FIG. 6, the
於運作時,待測物190被傳動機件130傳送。當反射式感測器610感測到待測物190時,處理器140依據傳動機件130的傳動速度預判停止時間點,進而於該停止時間點令傳動機件130暫停傳送待測物190,使X光產生器112產生X光,X光偵測器114偵測從X光產生器112輸出並透過待測物190的X光。藉此,X光產生器112與X光偵測器114得以對待測物190進行光學掃描。 During operation, the
或者,在進行光學掃描前,舉例而言,處理器140可透過X光產生器112與X光偵測器114確認待測物190的實際停止位置與目標位置(如:系統預設值)之間的偏移量,處理器140可透過傳動機件130微調待測物190的位置或移動X光產生器112與/或X光偵測器114,以消除該偏移量的影響,讓光學檢測設備600的光學掃描更為精準。 Or, before performing optical scanning, for example, the
在第7圖中,反射式感測器120包含單一個反射式感測器710。在架構上,反射式感測器710設置於X光偵測器114上。 In Figure 7, the
於運作時,待測物190被傳動機件130傳送。當反射式感測器710感測到待測物190時,處理器140依據傳動機件130的傳動速度預判停止時間點,進而於該停止時間點令傳動機件130暫停傳送待測物190,使X光產生器112產生X光,X光偵測器114偵測從X光產生器112輸出並透過待測物190的X光。藉此,X光產生器112與X光偵測器114得以對待測物190進行光學掃描。 During operation, the
或者,在進行光學掃描前,舉例而言,處理器140可透過X光產生器112與X光偵測器114確認待測物190的實際停止位置與目標位置(如:系統預設值)之間的偏移量,處理器140可透過傳動機件130微調待測物190的位置或移動X光產生器112與/或X光偵測器114,以消除該偏移量的影響,讓光學檢測設備700的光學掃描更為精準。 Or, before performing optical scanning, for example, the
綜上所述,本發明之技術方案與現有技術相比具有明顯的優點和有益效果。藉由本發明的技術方案,光學 掃描裝置上反射式感測器之停板方式(即,停止待測物的傳送),可由處理器透過軟體設定停板位置,提升停板穩定性,且操作人員不需更改硬體設定。 In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the technical solution of the present invention, the stop method of the reflective sensor on the optical scanning device (that is, stop the transmission of the object to be measured), the stop position can be set by the processor through software, which improves the stability of the stop, and the operator No need to change the hardware settings.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to those defined in the attached patent scope.
100‧‧‧光學檢測設備 100‧‧‧Optical Inspection Equipment
110‧‧‧光學掃描裝置 110‧‧‧Optical scanning device
112‧‧‧X光產生器 112‧‧‧X-ray generator
113‧‧‧X光輸出口 113‧‧‧X-ray output port
114‧‧‧X光偵測器 114‧‧‧X-ray detector
120‧‧‧反射式感測器 120‧‧‧Reflective sensor
130‧‧‧傳動機件 130‧‧‧Transmission parts
140‧‧‧處理器 140‧‧‧Processor
190‧‧‧待測物 190‧‧‧Object to be tested
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JPS61264220A (en) * | 1985-05-18 | 1986-11-22 | Hitachi Medical Corp | X-ray inspection instrument for quantity of contents in closed vessel |
TW201024829A (en) * | 2008-12-22 | 2010-07-01 | Au Optronics Corp | Detecting apparatus and detecting method for the detecting apparatus |
JP2016090494A (en) * | 2014-11-10 | 2016-05-23 | 株式会社 オプトメカトロ | X-ray inspection device |
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US5183144A (en) * | 1989-08-16 | 1993-02-02 | Cavanna S.P.A. | Apparatus for orienting products on a conveyor line particularly for automatic packaging machines and method relating thereto |
JP2000292371A (en) * | 1999-04-07 | 2000-10-20 | Hitachi Medical Corp | X-ray inspection device |
JP2005298086A (en) * | 2004-04-07 | 2005-10-27 | Mitsubishi Electric Engineering Co Ltd | Product conveying device |
JP4331130B2 (en) * | 2005-03-17 | 2009-09-16 | アンリツ産機システム株式会社 | Inspection equipment |
JP2009149387A (en) * | 2007-12-19 | 2009-07-09 | Ihi Corp | Position detection device of transferred article |
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CN104003113B (en) * | 2014-05-29 | 2016-04-20 | 江苏海事职业技术学院 | The using method of screening machine intelligence delivery system |
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JPS61264220A (en) * | 1985-05-18 | 1986-11-22 | Hitachi Medical Corp | X-ray inspection instrument for quantity of contents in closed vessel |
TW201024829A (en) * | 2008-12-22 | 2010-07-01 | Au Optronics Corp | Detecting apparatus and detecting method for the detecting apparatus |
JP2016090494A (en) * | 2014-11-10 | 2016-05-23 | 株式会社 オプトメカトロ | X-ray inspection device |
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