KR102284046B1 - Bad inspection system of substrates using image tracking - Google Patents

Abstract

The present invention relates to a system in which a sensor module recognizes the position of a substrate and inspects the substrate by moving an inspector by an error when the substrate is not accurately positioned in an inspection area and the error occurs. An object of the present invention is to provide a defective substrate inspection system using image tracking, which tracks a stationary position of a substrate in real time with an installed sensor module, rather than a method of accurately stopping the substrate, and moves an inspector to the stationary position by an error distance detected by the sensor module. The defective substrate inspection system using image tracking according to the present invention includes the sensor module, first and second inspectors, an inspector moving device, and a controller.

Description

Bad inspection system of substrates using image tracking

The present invention relates to a board defect inspection system, and more particularly, a sensor module recognizes the position of the substrate, and when an error occurs without being accurately positioned in the inspection area, the inspection machine moves as much as the error to inspect the defect of the substrate. It's about the system.

A manufacturing process of a flat panel display (FPD) includes a process of treating a substrate and a process of inspecting the substrate. A flat panel display device refers to a glass substrate used in manufacturing fields such as LCD, PDP, and OLED, and defects such as contamination, scratches, bevel chips, cutting chips, and cracks may occur during substrate processing. . Therefore, in order to improve the quality of the flat panel display device, the process of inspecting the flat panel display device for defects must be performed.

Among them, the edge inspection is to inspect the sides of the flat panel display device, and a side with a relatively short length is called a short side, and a side with a relatively long length is called a long side. In the case of long-side inspection, the inspection is carried out in real time when the flat panel display element is transferred along the board transfer device. proceed with

At this time, in order to position the flat panel display device at an accurate position, the speed of the substrate transport device for transporting the flat panel display device should be gradually reduced to stop in the inspection area. At this time, in order to accurately stop the flat panel display device in the inspection area, the substrate transfer apparatus is stopped by dividing the deceleration section into second deceleration and dividing the substrate transfer apparatus into primary deceleration and secondary deceleration.

However, as the deceleration section is divided, it takes a lot of time to stop the substrate transfer apparatus in the inspection area, so the efficiency of the inspection process is lowered, and the length of the substrate transfer apparatus is also increased by dividing the deceleration section into two and controlling it. There is a problem. In addition, even if the deceleration section is divided into two to stop the substrate transfer device that transports the flat panel display device, it is difficult to locate the flat panel display device in the accurate inspection area, so the accuracy of edge inspection of the flat panel display device is improved and the inspection Research on a substrate inspection apparatus and method capable of reducing time is being actively conducted.

1. Republic of Korea Patent Publication No. 10-2022471 ("Board Inspection Device", 2019.09.10.)

The present invention has been devised to solve the above problems, and an object of the present invention is not a method of accurately stopping the substrate in the inspection area, but tracking the position where the substrate is stopped with the installed sensor module in real time, and the sensor module is detected An object of the present invention is to provide a substrate defect inspection system using image tracking that moves the inspector to a position where the substrate is stopped by one error distance.

A substrate defect inspection system using image tracking of the present invention includes: a sensor module for measuring a position of a substrate; first and second inspectors perpendicular to the x-axis direction, which is the movement direction of the substrate, respectively, for detecting defects on first and second sides of the substrate facing each other; a tester moving device capable of moving at least one of the first and second testers; and a controller receiving sensing information from the sensor module and controlling the inspector moving device, wherein the controller recognizes the position of the substrate based on the sensing information received from the sensor module, and and controlling the inspector moving device so that the positions of the inspector and the first side or the second inspector and the second side or the first and second inspectors and the first and second sides are matched.

In addition, the sensor module detects a position error in which any one of the first and second sides deviates from the correct position compared with a predetermined fixed position; the inspector moving device moves the first or second inspector to a position matching a side opposite to a side of the substrate measured by the sensor module based on the position error information; The moved first or second inspector detects a defect in a side opposite to the side of the substrate measured by the sensor module.

In addition, the sensor module is a line sensor; characterized in that.

In addition, the sensor module includes at least one image pickup device, and captures an image of a first side or a second side of the substrate; The controller determines whether a photographed edge includes a defective area based on the image acquired from the sensor module, and calculates the position of the substrate based on the image and whether the photographed edge includes a defective area; characterized.

In addition, when the photographed side includes the defective area, the controller calculates the position of the substrate based on the position of the side of the remaining area except for the defective area in the image.

In addition, the substrate defect inspection system, the substrate transfer device for moving the substrate sequentially from the first position through the second position to the third position, respectively, temporarily stop at the first position and the third position; further comprising , when the substrate is stationary at the first position, the sensor module recognizes the position of the second side of the substrate, the first inspector inspects the first side of the substrate, and the substrate stops at the third position When it is done, the sensor module recognizes the position of the first side of the substrate, and the second inspector inspects the defect of the second side of the substrate.

In addition, the board defect inspection system further includes a third and fourth inspector for inspecting defects of third and fourth sides connecting the first side and the second side of the substrate, respectively, wherein the third and fourth inspectors include: and inspecting defects of the third and fourth sides of the substrate while the substrate passes through a second position located between the first position and the third position.

In addition, the lengths of the first and second sides are shorter than the lengths of the third and fourth sides; The first and second inspectors may include: an inspection unit that inspects whether there is a defect in a predetermined region of the substrate; and an inspection unit moving module that moves the inspection unit in a y-axis direction perpendicular to the moving direction of the substrate.

Also, the first inspector and the second inspector are spaced apart from each other in the x-axis direction by a length of the substrate in the x-axis direction; The tester moving device may include a support member for fixing the first inspector and the second inspector so that their relative positions are fixed; and a moving part for moving the position of the support member in the x-axis direction.

In addition, the tester moving device includes first and second moving parts for moving the positions of the first and second testers in the x-axis direction, respectively; The controller may move the positions of the first and second inspectors to predetermined positions, and a distance between the first inspector and the second inspector may be a length of the substrate in an x-axis direction.

The board defect inspection system using image tracking of the present invention is not a method of accurately stopping the board in the inspection area, but tracks the position where the board is stopped in real time with an installed sensor module, Since it moves to this stopped position, there is an effect that accurate inspection can be performed without stopping the substrate in an accurate inspection area.

In addition, since it is not necessary to divide and control the deceleration section of the substrate transfer apparatus, it is not necessary to install a long length of the substrate transfer apparatus, so there is an economic effect. has the effect of increasing

1 is a front view of a short-side inspector of a substrate defect inspection system according to a first embodiment of the present invention;
2 is a plan view of a short-side inspector of the substrate defect inspection system according to the first embodiment of the present invention;
3 to 5 are plan views of a short-side inspector of the substrate defect inspection system according to the first embodiment of the present invention;
6 is a substrate inspection flowchart using the substrate defect inspection system according to the first embodiment of the present invention;
7 is a plan view of a short-side inspector of a substrate defect inspection system according to a second embodiment of the present invention;
8 is a plan view of a short-side inspector of a substrate defect inspection system according to a third embodiment of the present invention;
9 is a front view of a long side inspector of the board defect inspection system according to the first embodiment of the present invention;
10 is a front view of a long side inspector of the board defect inspection system according to the first embodiment of the present invention;
11 is a plan view and a front view of a long side inspector of a substrate defect inspection system according to a first embodiment of the present invention;
12 is an enlarged front view of a long side inspector of the board defect inspection system according to the first embodiment of the present invention;

Prior to description, the first and second sides, which are relatively short sides, of the substrate of the substrate defect inspection system of the present invention may be short sides, and relatively long third and fourth sides may be long sides. Hereinafter, an embodiment of the present invention as described above will be described in detail with reference to the drawings.

1 is a front view of a short-side inspection machine of the substrate defect inspection system according to a first embodiment of the present invention. As shown in FIG. 1 , the substrate 10 is transferred by the substrate transfer device B, and a short-side inspector 100 for inspecting the short side of the substrate 10 is installed on the upper portion of the substrate transfer device B. . The short side inspector 100 includes an inspector 110 that inspects whether there is a defect on the short side (first side, second side) of the substrate 10 and a sensor module 120 that inspects whether the substrate is installed at a predetermined position. and the tester 110 is installed in combination with a tester moving device that moves the tester 110 in the x-axis direction. In this case, for convenience of explanation, the inspector that inspects the defects of the first side 11 may be the first inspector, and the inspector that inspects the defects of the second side 12 may be the second inspector.

)를 산출하고, 산출된 오차 거리(

)는 제어기(300)에 송신된다. 제어기(300)는 센서 모듈(120)로부터 수신 받은

값만큼 제 1 검사기(110)가 이동하도록 제어하고, 제 1 검사기(110)를 이동시키는 검사기 이동 장치(미도시)가 제 1 검사기(110)를 -

또는 +

만큼 이동시키는 것을 특징으로 한다. The sensor module 120 measures whether the substrate 10 is accurately located in the inspection area, or how much it deviates from the reference line if it is not accurately located, thereby measuring the error distance (

), and the calculated error distance (

) is transmitted to the controller 300 . The controller 300 receives the received from the sensor module 120

A tester moving device (not shown) that controls the first tester 110 to move by the value and moves the first tester 110 moves the first tester 110 -

or +

It is characterized by moving as much.

2 , the first inspector 110 of the short-sided inspector 100 is installed to be movable along the x-axis direction, and the sensor module 120 is inspected by the first inspector 110 . Recognizes the second side 12 of the substrate 10 positioned to face the first side 11 of the substrate, and when the reference line and the second side 12 are located on the same line, the substrate 10 is accurately It is judged to have stopped in the inspection area.

At this time, the sensor module 120 may determine whether the substrate 10 is accurately positioned in the inspection area from an image generated by irradiating a line beam to the substrate 10 with a line sensor and colliding the substrate 10 with the line beam. . However, when a part of the second side 12 of the substrate 10 has a broken defect, it is determined that an error has occurred due to a defect occurring on the second side 12 despite being located in the correct inspection area, When the first tester 110 moves, there may be a problem that the first side 11 cannot be accurately inspected. In order to solve this problem, the sensor module 120 may use an image capturing device. Even if there is a defect in the second side 12 , the image photographing apparatus calculates the position of the substrate 10 based on the position of the side of the remaining area except for the defective area, so that accuracy can be improved.

값은 0이기 때문에 제 1 검사기(110)는 별도의 이동 없이 제 1 변(11)을 정확하게 검사할 수 있다.An operation of the first inspector 110 according to image tracking of the sensor module 120 will be described in more detail with reference to FIGS. 3 to 5 . As shown in Fig. 3 (a), the substrate 10 is positioned in the correct inspection area, and as shown in Fig. 3 (b), the reference line L1 and the second side 12 are so it matches

Since the value is 0, the first inspector 110 can accurately inspect the first side 11 without a separate movement.

만큼 돌출되어 있다. 이는

만큼 오차 거리가 발생했다는 것으로, 센서 모듈(120)은 제어기(300)에

값을 송신하고, 제어기(300)는

만큼 제 1 검사기(110)가 우측으로 이동하도록 제어 신호를 송신한다. 따라서 도 4의 (c)에 도시된 바와 같이 제1 검사기(110)가

만큼 우측으로 이동하여 기판(10)의 제 1 변(11)을 정확하게 검사할 수 있다. 4 is that the substrate 10 is stopped before reaching the correct inspection area as shown in (a) of FIG. 4, and as shown in (b) of FIG.

protruding as much. this is

As much as an error distance has occurred, the sensor module 120 sends the controller 300

sending the value, and the controller 300

As much as the first tester 110 transmits a control signal to move to the right. Therefore, as shown in (c) of Figure 4, the first inspector 110

By moving to the right, the first side 11 of the substrate 10 can be accurately inspected.

만큼의 간격을 두고 제 2 변(12)이 인식된다. 이는

만큼 오차 거리가 발생했다는 것으로, 센서 모듈(120)은 제어기(300)에

값을 송신하고, 제어기(300)는

만큼 제 1 검사기(110)가 좌측으로 이동하도록 제어 신호를 송신한다. 따라서 도 3c의 (c)에 도시된 바와 같이 제 1 검사기(110)가

만큼 좌측으로 이동하여 기판(10)의 제 1 변(11)을 정확하게 검사할 수 있다.FIG. 5 shows that the substrate 10 is stopped after passing the correct inspection area as shown in FIG. 5(a), and as shown in FIG.

The second side 12 is recognized with an interval of the same. this is

As much as an error distance has occurred, the sensor module 120 sends the controller 300

sending the value, and the controller 300

As much as the first tester 110 transmits a control signal to move to the left. Therefore, as shown in (c) of Fig. 3c, the first inspector 110

The first side 11 of the substrate 10 can be accurately inspected by moving to the left as much as possible.

만큼 이동하는 것으로 도시되어 있으나, 센서 모듈(120) 또한

만큼 이동할 수 있다. 센서 모듈(120) 또한

만큼 이동하여 제 2 변(12)의 위치를 실시간으로 트래킹함으로써 검사 공정의 정확도를 높일 수 있다. The short-edge tester 100 according to the first embodiment of the present invention includes only the first tester 110 .

Although shown to move as much as, the sensor module 120 also

can move as much as The sensor module 120 also

By moving as much as possible to track the position of the second side 12 in real time, it is possible to increase the accuracy of the inspection process.

6 is a diagram showing a substrate inspection flow chart using the substrate defect inspection system according to the first embodiment of the present invention. As shown in FIG. 6 , in the general inspection process of the substrate 10 , the substrate transfer device B is temporarily stopped at the first position so that the first inspector 110 inspects the first side 11 of the substrate 10 . After that, the third side 13 and the fourth side 14 of the substrate 10 that are transferred by the substrate transfer apparatus B and pass the second position by operating the substrate transfer apparatus B again are inspected by a long side inspector. 200 inspects in real time, and temporarily stops the substrate transfer device B at the third position so that the second inspector 110 inspects the second side 12 of the substrate 10 . The sensor module 120 tracks the position of the second side 12 when the first side 11 of the substrate 10 is inspected, and the position of the first side 11 when the second side 12 is inspected. Preferably, it is installed to track the position. Since the inspection process as described above is divided into three processes and the inspection is performed, there is a problem that the inspection process takes a lot of time. Accordingly, an embodiment for solving this problem will be described with reference to FIGS. 7 and 8 .

7 is a plan view of a short-side inspector of a substrate defect inspection system according to a second embodiment of the present invention. For convenience of explanation, the inspector of the second embodiment of the present invention may be the first inspector 110a for inspecting the defect of the first side 11, and the inspector for inspecting the defect of the second side 12 may be It may be the second inspector 110b. As shown in FIG. 7 , the first inspector 110a for inspecting the first side 11 of the substrate 10 and the second side 12 inspector 110b for inspecting the second side 12 are one It is installed on the support member 130 to simultaneously inspect the first side 11 and the second side 12 of the substrate 10 .

만큼 발생했다고 가정했을 때, 제 1 검사기(110a)와 제 2 검사기(110b)를 동시에 좌측 또는 우측으로

만큼 이동시키면 제 1 변(11)과 제 2 변(12)을 정확하게 검사할 수 있다.The width and height of the substrate 10 have already been manufactured in the same manufacturing process, and since the size is always constant, the substrate 10 transferred along the substrate transfer device B with the sensor module 120 accurately stops in the inspection area. It is determined whether the error is in the data collected by the sensor module 120

When it is assumed that the occurrence of the

If it is moved as much as possible, the first side 11 and the second side 12 can be accurately inspected.

At this time, the first inspector 110a and the second inspector 110b of the substrate defect inspection system according to the modified example of the second embodiment are installed by separate support members, respectively, and a moving part is installed in each support member, so that the first inspector (110a) and the second tester (110b) can be moved. The board failure system according to a modification of the second embodiment includes at least one or more limit switches, so that the controller 300 brings one of the first inspector 110a and the second inspector 110b into contact with the limit switch. moving, and receiving the signal of the limit switch, characterized in that the first tester (110a) or the second tester (110b) corrects the position information.

Therefore, since the board defect inspection system according to the second embodiment described with reference to FIG. 7 and the modified example of the second embodiment proceeds only with the short-side inspection step and the long-side inspection step, the inspection process is reduced from the 3rd step to the 2nd step and leads It has the effect of reducing the time.

8 is a plan view of a short-side inspector of a substrate defect inspection system according to a third embodiment of the present invention. As shown in FIG. 8 , a plurality of substrates 10 may be simultaneously inspected. For convenience of description, the substrate located on the left is referred to as a first substrate 10c and the substrate located on the right is referred to as a second substrate 10d. In this case, the inspector that inspects the second side 12c of the first substrate 10c may be the first inspector 110c, and the inspector that inspects the first side 11d of the second substrate 10d is a second inspector. It may be a checker 110d. Although the first inspector 110c and the second inspector 110d move together in the Y-axis direction, when each sensor module 120 moves in the X-axis direction with respect to the acquired error distance, it is installed so as to be able to move independently at the same time. Since the short sides of the substrates 10c and 10d can be inspected, there is an effect that the lead time can be reduced.

The long side inspector 200 of the substrate defect inspection system of the present invention will be described in more detail with reference to FIGS. 9 to 12 .

9 is a front view of a long side inspector of the substrate defect inspection system according to the first embodiment of the present invention. As shown in FIG. 9 , the long side inspector 200 of the substrate defect inspection system of the present invention is installed on both sides of the long side of the substrate 10 and the inspector for inspecting the upper surface of the substrate 10 is a third inspector 210 . In addition, the inspector installed at a predetermined distance on both sides of the long side (third side, fourth side) of the substrate 10 to inspect the side surface of the substrate 10 may be the fourth inspector 220 . In this case, the third inspector 210 and the fourth inspector 220 may be a line sensor or an image capturing apparatus like the sensor module 120 .

The third inspector 210 inspects the upper surface of the substrate 10 to determine whether the third side 13 and the fourth side 14 are defective, and at the same time determines whether they are correctly positioned in the inspection area. The distance between the fourth inspector 220 and the substrate 10 is a distance that the fourth inspector 220 can focus on, and tracks whether the third inspector 210 is accurately positioned in the inspection area, and determines that the third inspector 210 is not accurately positioned. If necessary, the fourth inspector 220 moves by the error distance to maintain the distance between the fourth inspector 220 and the substrate 10 . In this case, the distance between the fourth inspector 220 and the substrate 10 may be easily adjusted by a person skilled in the art according to the working environment.

10 is a front view of a long side inspector of the substrate defect inspection system according to the first embodiment of the present invention. As shown in (a) of FIG. 10 , the third inspector 210 passes through the second position described above by the substrate transfer device B and the third side 13 and the fourth of the substrate 10 are transferred. Examine the stool (14). It is determined whether the third side 13 and the fourth side 14 of the substrate 10 are defective, and at the same time whether the substrate 10 is accurately positioned in the inspection area formed between the reference lines L2 and L3 is also determined.

를 도출하여 제어기(300)에 이를 송신하고, 제어기(300)는 제 4 검사기(220)가 이동하도록 제어하는 신호를 송신한다. 신호를 송신 받은 제 4검사기(220)는 도 11의 (a) 도시된 바와 같이

만큼 우측으로 이동하여 도 11의 (b)에 도시된 바와 같이 기판(10)의 장변 양측에 설치된 제 4 검사기(220)와 기판(10)과의 사이 거리는 미리 설정된 거리를 유지할 수 있다.As shown in (b) of FIG. 10 , when the substrate 10 is deflected to the right and moved, the substrate 10 is not located in the inspection area formed between the reference lines L2 and L3 of the long-side upper surface inspector 210 . Judging and biased distance

and transmits it to the controller 300 , and the controller 300 transmits a signal for controlling the fourth tester 220 to move. As shown in (a) of FIG. 11, the fourth tester 220 receiving the signal

The distance between the fourth inspector 220 installed on both sides of the long side of the substrate 10 and the substrate 10 may be maintained at a preset distance by moving to the right as shown in FIG. 11B .

12 is an enlarged front view of the long side inspector of the substrate defect inspection system according to the first embodiment of the present invention. The long side inspector 200 of the board defect inspection system of the present invention is divided into a third inspector 210 for inspecting the upper surface of the long side and a fourth inspector 220 for inspecting the side of the long side, so as to increase the accuracy of the inspection. can be characterized. When the defect C of the substrate 10 is formed as shown in FIG. 11 , the third inspector 210 cannot detect the defect. However, since the fourth inspector 220 can inspect it, the quality can be improved by accurately inspecting whether the substrate 10 is defective. 4 The distance between the inspector 220 and the substrate 10 should be kept constant.

The technical idea should not be construed as being limited to the above-described embodiment of the present invention. Various modifications can be made at the level of those skilled in the art without departing from the gist of the present invention as claimed in the claims. Accordingly, such improvements and modifications fall within the protection scope of the present invention as long as it is apparent to those skilled in the art.

10 board
11 first side
12 second side
13 third side
14 Part 4
B substrate transfer device
100 unilateral checker
110 checker
120 sensor module
130 support member
140 moving part
200 Long Edge Checker
210 Third Inspector
220 4th checker
300 controller

Claims (10)

A board defect inspection system comprising:
a sensor module including at least one image capturing device for capturing an image of the first or second side of the substrate, and measuring a position of the substrate;
first and second inspectors perpendicular to the x-axis direction, which is the movement direction of the substrate, respectively, for detecting defects on first and second sides of the substrate facing each other;
a tester moving device capable of moving at least one of the first and second testers; and
and a controller that receives sensing information from the sensor module and controls the tester moving device;
The controller is
The position of the substrate is recognized based on the sensing information received from the sensor module, and the first inspector and the first side or the second inspector and the second side or the first and second inspectors and the first and Controls the inspection machine moving device so that the positions of each of the two sides are matched,
It is determined based on the image obtained from the sensor module whether a photographed disparity defective area is included, and when the captured disparity defective area is included, the image is excluded from the defective area and the position of the edge of the remaining area is based calculating the position of the substrate with
Board defect inspection system, characterized in that.
According to claim 1,
the sensor module detects a position error in which any one of the first and second sides deviates from the correct position compared with a predetermined fixed position;
the inspector moving device moves the first or second inspector to a position matching a side opposite to a side of the substrate measured by the sensor module based on the position error information;
detecting, by the moved first or second inspector, a defect in a side opposite to the side of the substrate measured by the sensor module;
Board defect inspection system, characterized in that.
3. The method of claim 2,
The sensor module may be a line sensor;
Board defect inspection system, characterized in that.
delete delete According to claim 1,
The board defect inspection system,
Further comprising; a substrate transfer device for sequentially moving the substrate from the first position through the second position to the third position, and temporarily stopping at the first position and the third position, respectively,
When the substrate is stationary in the first position, the sensor module recognizes the position of the second side of the substrate, the first inspector inspects the first side of the substrate,
when the substrate is stationary at the third position, the sensor module recognizes the position of the first side of the substrate, and the second inspector inspects the defect of the second side of the substrate;
Board defect inspection system, characterized in that.
7. The method of claim 6,
The board defect inspection system,
It further includes a; third and fourth inspectors for inspecting defects of the third and fourth sides connecting the first side and the second side of the substrate, respectively;
The third and fourth inspectors,
inspecting the third and fourth sides of the substrate for defects while the substrate passes through a second position located between the first position and the third position;
Board defect inspection system, characterized in that.
8. The method of claim 7,
the lengths of the first and second sides are shorter than the lengths of the third and fourth sides;
The first and second inspectors,
an inspection unit for inspecting whether there is a defect in a predetermined area of the substrate; and
Further comprising an inspection unit moving module for moving the inspection unit in a y-axis direction perpendicular to the moving direction of the substrate;
Board defect inspection system, characterized in that.
According to claim 1,
the first inspector and the second inspector are spaced apart from each other in the x-axis direction by a length of the substrate in the x-axis direction;
The checker moving device,
a support member for fixing the first inspector and the second inspector so that their relative positions are fixed; and
including a moving part for moving the position of the support member in the x-axis direction;
Board defect inspection system, characterized in that.
According to claim 1,
The checker moving device,
and first and second moving parts for moving the positions of the first and second inspection devices in the x-axis direction, respectively;
The controller is
Doedoe moving the positions of the first and second inspectors to a predetermined position,
a distance between the first inspector and the second inspector is a length of the substrate in the x-axis direction;
Board defect inspection system, characterized in that.

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