TWI702261B - 適用於有機電子產品之含有類金屬奈米粒子的非水性油墨組成物 - Google Patents

適用於有機電子產品之含有類金屬奈米粒子的非水性油墨組成物 Download PDF

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TWI702261B
TWI702261B TW105121710A TW105121710A TWI702261B TW I702261 B TWI702261 B TW I702261B TW 105121710 A TW105121710 A TW 105121710A TW 105121710 A TW105121710 A TW 105121710A TW I702261 B TWI702261 B TW I702261B
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王菁
埃琳娜 希娜
羅伯特 斯威爾
弗洛安 迪凱伯
卡洛琳 史基爾曼
瑟爾吉 李
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日商日產化學工業股份有限公司
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TW105121710A 2015-07-17 2016-07-07 適用於有機電子產品之含有類金屬奈米粒子的非水性油墨組成物 TWI702261B (zh)

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TW105121710A TWI702261B (zh) 2015-07-17 2016-07-07 適用於有機電子產品之含有類金屬奈米粒子的非水性油墨組成物
TW105121705A TWI710607B (zh) 2015-07-17 2016-07-07 含有電洞載子化合物和聚合物酸的組成物，以及其用途
TW105121870A TWI710608B (zh) 2015-07-17 2016-07-07 適合於在有機電子中使用的非水性組成物

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TW105121705A TWI710607B (zh) 2015-07-17 2016-07-07 含有電洞載子化合物和聚合物酸的組成物，以及其用途
TW105121870A TWI710608B (zh) 2015-07-17 2016-07-07 適合於在有機電子中使用的非水性組成物

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US (1) US20180201800A1 (https=)
EP (1) EP3325563A4 (https=)
JP (2) JP6642694B2 (https=)
KR (1) KR102648007B1 (https=)
CN (2) CN107849377A (https=)
TW (3) TWI702261B (https=)
WO (1) WO2017014946A1 (https=)

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KR102499662B1 (ko) * 2015-03-03 2023-02-15 닛산 가가쿠 가부시키가이샤 정공 캐리어 화합물 및 중합체 산을 함유하는 조성물, 및 그의 용도
CN108521834B (zh) * 2015-12-28 2021-04-23 日产化学工业株式会社 用于有机电子学的纳米颗粒-导电聚合物复合材料
JP7082984B2 (ja) * 2017-02-20 2022-06-09 ノヴァレッド ゲーエムベーハー 電子半導体デバイスおよびその電子半導体デバイスの製造方法および化合物
EP3364476B1 (en) * 2017-02-20 2024-06-05 Novaled GmbH Active oled display, method for preparing an active oled display and compound
KR102677529B1 (ko) 2017-06-20 2024-06-24 닛산 가가쿠 가부시키가이샤 비수계 잉크 조성물
JP6935699B2 (ja) * 2017-08-22 2021-09-15 富士通株式会社 半導体材料、ガスセンサ、ガス測定装置、半導体材料の製造方法および硫化水素濃度測定方法
EP3766936A4 (en) * 2018-03-15 2021-12-01 Nissan Chemical Corporation COMPOSITION OF CARRIAGE OF LOADS
KR102683952B1 (ko) 2018-07-04 2024-07-12 닛산 가가쿠 가부시키가이샤 전하수송성 조성물
CN112469780A (zh) * 2018-07-24 2021-03-09 日产化学株式会社 电荷输送性组合物
EP3858927A1 (en) 2018-09-25 2021-08-04 Nissan Chemical Corporation Ink composition
US11851572B2 (en) * 2019-03-07 2023-12-26 Liquid X Printed Metals, Inc. Thermal cure dielectric ink
US11903304B2 (en) 2020-12-11 2024-02-13 Raynergy Tek Incorporation Photodiode comprising fluropolymer compound
EP4012793A1 (en) * 2020-12-14 2022-06-15 Raynergy Tek Incorporation Photodiode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090256117A1 (en) * 2008-04-11 2009-10-15 Plextronics, Inc. Doped conjugated polymers, devices, and methods of making devices
US20120175596A1 (en) * 2009-03-12 2012-07-12 E. I. Du Pont De Nemours And Company Electrically conductive polymer compositions for coating applications

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10239715A (ja) * 1997-02-25 1998-09-11 Showa Denko Kk エレクトロクロミック素子
US7317047B2 (en) * 2002-09-24 2008-01-08 E.I. Du Pont De Nemours And Company Electrically conducting organic polymer/nanoparticle composites and methods for use thereof
JP5299017B2 (ja) * 2002-10-24 2013-09-25 住友化学株式会社 高分子化合物およびそれを用いた高分子発光素子
US6999222B2 (en) * 2003-08-13 2006-02-14 The Regents Of The University Of California Plasmon assisted enhancement of organic optoelectronic devices
US7105237B2 (en) * 2003-10-01 2006-09-12 The University Of Connecticut Substituted thieno[3,4-B]thiophene polymers, method of making, and use thereof
US7455793B2 (en) * 2004-03-31 2008-11-25 E.I. Du Pont De Nemours And Company Non-aqueous dispersions comprising electrically doped conductive polymers and colloid-forming polymeric acids
EP2537874B1 (en) * 2006-07-21 2021-05-19 Nissan Chemical Corporation Sulfonation of conducting polymers and oled, photovoltaic, and esd devices
EP2250207B1 (en) * 2008-02-29 2012-01-04 Plextronics, Inc. Planarizing agents and devices
WO2009141903A1 (ja) * 2008-05-21 2009-11-26 パイオニア株式会社 有機発光素子
JP2010049210A (ja) * 2008-08-25 2010-03-04 Fujifilm Corp 塗布組成物、該塗布組成物の製造方法、透光性光散乱性膜、有機エレクトロルミネッセンス表示素子及び面状光源体
US20100273007A1 (en) * 2009-04-10 2010-10-28 Plextronics, Inc. Dehalogenation
WO2010127253A1 (en) * 2009-05-01 2010-11-04 Plextronics, Inc. Replacing aqueous with non-aqueous solvent
KR101966998B1 (ko) * 2010-07-02 2019-04-08 닛산 가가쿠 가부시키가이샤 정공 수송 조성물 및 관련 소자 및 방법 （ｉｉ）
JP2012252821A (ja) * 2011-06-01 2012-12-20 Konica Minolta Holdings Inc 透明電極および有機エレクトロルミネッセンス素子
EP2764518A1 (en) * 2011-10-04 2014-08-13 Plextronics, Inc. Improved doping methods for hole injection and transport layers
WO2014073683A1 (ja) * 2012-11-12 2014-05-15 三菱化学株式会社 有機電界発光素子およびその製造方法
CN103531713B (zh) * 2013-07-05 2016-06-08 深圳清华大学研究院 无机纳米晶/共轭聚合物杂化太阳能电池的制备方法
EP3325560A4 (en) * 2015-07-17 2019-03-27 Nissan Chemical Corporation Nonaqueous ink compositions containing metal nanoparticles for use in organic electronics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090256117A1 (en) * 2008-04-11 2009-10-15 Plextronics, Inc. Doped conjugated polymers, devices, and methods of making devices
US20120175596A1 (en) * 2009-03-12 2012-07-12 E. I. Du Pont De Nemours And Company Electrically conductive polymer compositions for coating applications

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