KR102648007B1 - 유기 전자 장치에 사용하기에 적합한 준금속 나노입자를 함유하는 비-수성 잉크 조성물 - Google Patents

유기 전자 장치에 사용하기에 적합한 준금속 나노입자를 함유하는 비-수성 잉크 조성물 Download PDF

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KR102648007B1
KR102648007B1 KR1020187004391A KR20187004391A KR102648007B1 KR 102648007 B1 KR102648007 B1 KR 102648007B1 KR 1020187004391 A KR1020187004391 A KR 1020187004391A KR 20187004391 A KR20187004391 A KR 20187004391A KR 102648007 B1 KR102648007 B1 KR 102648007B1
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ink composition
aqueous ink
polythiophene
fluoroalkyl
alkyl
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KR20180021208A (ko
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징 왕
엘레나 셰이나
로버트 스위셔
플로리안 디캄포
캐롤린 스킬먼
세르게이 비. 리
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닛산 가가쿠 가부시키가이샤
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KR1020187004391A 2015-07-17 2016-07-06 유기 전자 장치에 사용하기에 적합한 준금속 나노입자를 함유하는 비-수성 잉크 조성물 Active KR102648007B1 (ko)

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Application Number Priority Date Filing Date Title
US201562194000P 2015-07-17 2015-07-17
US62/194,000 2015-07-17
PCT/US2016/041048 WO2017014946A1 (en) 2015-07-17 2016-07-06 Non-aqueous ink compositions containing metalloid nanoparticles suitable for use in organic electronics

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KR20180021208A KR20180021208A (ko) 2018-02-28
KR102648007B1 true KR102648007B1 (ko) 2024-03-18

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US (1) US20180201800A1 (https=)
EP (1) EP3325563A4 (https=)
JP (2) JP6642694B2 (https=)
KR (1) KR102648007B1 (https=)
CN (2) CN107849377A (https=)
TW (3) TWI702261B (https=)
WO (1) WO2017014946A1 (https=)

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KR102499662B1 (ko) * 2015-03-03 2023-02-15 닛산 가가쿠 가부시키가이샤 정공 캐리어 화합물 및 중합체 산을 함유하는 조성물, 및 그의 용도
CN108521834B (zh) * 2015-12-28 2021-04-23 日产化学工业株式会社 用于有机电子学的纳米颗粒-导电聚合物复合材料
JP7082984B2 (ja) * 2017-02-20 2022-06-09 ノヴァレッド ゲーエムベーハー 電子半導体デバイスおよびその電子半導体デバイスの製造方法および化合物
EP3364476B1 (en) * 2017-02-20 2024-06-05 Novaled GmbH Active oled display, method for preparing an active oled display and compound
KR102677529B1 (ko) 2017-06-20 2024-06-24 닛산 가가쿠 가부시키가이샤 비수계 잉크 조성물
JP6935699B2 (ja) * 2017-08-22 2021-09-15 富士通株式会社 半導体材料、ガスセンサ、ガス測定装置、半導体材料の製造方法および硫化水素濃度測定方法
EP3766936A4 (en) * 2018-03-15 2021-12-01 Nissan Chemical Corporation COMPOSITION OF CARRIAGE OF LOADS
KR102683952B1 (ko) 2018-07-04 2024-07-12 닛산 가가쿠 가부시키가이샤 전하수송성 조성물
CN112469780A (zh) * 2018-07-24 2021-03-09 日产化学株式会社 电荷输送性组合物
EP3858927A1 (en) 2018-09-25 2021-08-04 Nissan Chemical Corporation Ink composition
US11851572B2 (en) * 2019-03-07 2023-12-26 Liquid X Printed Metals, Inc. Thermal cure dielectric ink
US11903304B2 (en) 2020-12-11 2024-02-13 Raynergy Tek Incorporation Photodiode comprising fluropolymer compound
EP4012793A1 (en) * 2020-12-14 2022-06-15 Raynergy Tek Incorporation Photodiode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009141903A1 (ja) * 2008-05-21 2009-11-26 パイオニア株式会社 有機発光素子
JP2010049210A (ja) * 2008-08-25 2010-03-04 Fujifilm Corp 塗布組成物、該塗布組成物の製造方法、透光性光散乱性膜、有機エレクトロルミネッセンス表示素子及び面状光源体

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10239715A (ja) * 1997-02-25 1998-09-11 Showa Denko Kk エレクトロクロミック素子
US7317047B2 (en) * 2002-09-24 2008-01-08 E.I. Du Pont De Nemours And Company Electrically conducting organic polymer/nanoparticle composites and methods for use thereof
JP5299017B2 (ja) * 2002-10-24 2013-09-25 住友化学株式会社 高分子化合物およびそれを用いた高分子発光素子
US6999222B2 (en) * 2003-08-13 2006-02-14 The Regents Of The University Of California Plasmon assisted enhancement of organic optoelectronic devices
US7105237B2 (en) * 2003-10-01 2006-09-12 The University Of Connecticut Substituted thieno[3,4-B]thiophene polymers, method of making, and use thereof
US7455793B2 (en) * 2004-03-31 2008-11-25 E.I. Du Pont De Nemours And Company Non-aqueous dispersions comprising electrically doped conductive polymers and colloid-forming polymeric acids
EP2537874B1 (en) * 2006-07-21 2021-05-19 Nissan Chemical Corporation Sulfonation of conducting polymers and oled, photovoltaic, and esd devices
EP2250207B1 (en) * 2008-02-29 2012-01-04 Plextronics, Inc. Planarizing agents and devices
CA2720694C (en) * 2008-04-11 2017-05-23 Plextronics, Inc. Doped conjugated polymers, devices, and methods of making devices
KR101561402B1 (ko) * 2009-03-12 2015-10-16 이 아이 듀폰 디 네모아 앤드 캄파니 코팅 도포를 위한 전기 전도성 중합체 조성물
US20100273007A1 (en) * 2009-04-10 2010-10-28 Plextronics, Inc. Dehalogenation
WO2010127253A1 (en) * 2009-05-01 2010-11-04 Plextronics, Inc. Replacing aqueous with non-aqueous solvent
KR101966998B1 (ko) * 2010-07-02 2019-04-08 닛산 가가쿠 가부시키가이샤 정공 수송 조성물 및 관련 소자 및 방법 （ｉｉ）
JP2012252821A (ja) * 2011-06-01 2012-12-20 Konica Minolta Holdings Inc 透明電極および有機エレクトロルミネッセンス素子
EP2764518A1 (en) * 2011-10-04 2014-08-13 Plextronics, Inc. Improved doping methods for hole injection and transport layers
WO2014073683A1 (ja) * 2012-11-12 2014-05-15 三菱化学株式会社 有機電界発光素子およびその製造方法
CN103531713B (zh) * 2013-07-05 2016-06-08 深圳清华大学研究院 无机纳米晶/共轭聚合物杂化太阳能电池的制备方法
EP3325560A4 (en) * 2015-07-17 2019-03-27 Nissan Chemical Corporation Nonaqueous ink compositions containing metal nanoparticles for use in organic electronics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009141903A1 (ja) * 2008-05-21 2009-11-26 パイオニア株式会社 有機発光素子
JP2010049210A (ja) * 2008-08-25 2010-03-04 Fujifilm Corp 塗布組成物、該塗布組成物の製造方法、透光性光散乱性膜、有機エレクトロルミネッセンス表示素子及び面状光源体

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