TWI702145B - Release film - Google Patents

Release film Download PDF

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TWI702145B
TWI702145B TW105104617A TW105104617A TWI702145B TW I702145 B TWI702145 B TW I702145B TW 105104617 A TW105104617 A TW 105104617A TW 105104617 A TW105104617 A TW 105104617A TW I702145 B TWI702145 B TW I702145B
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mass
antistatic layer
release
layer
release film
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TW105104617A
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Chinese (zh)
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TW201634287A (en
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佐藤慶一
深谷知巳
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日商琳得科股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/30Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/044Forming conductive coatings; Forming coatings having anti-static properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21Anti-static

Abstract

離型膜(10A)係具備基材(11)、於基材(11)之一側的面(11A)上所設置之防靜電層(12)、與於防靜電層(12)之上、或基材(11)之另一側的面上所設置之離型層(13),且基材(11)之一側的面(11A),係算術平均粗度Ra為15nm以下,最大突起高度Rp為150nm以下,同時防靜電層(12)係將含有聚噻吩系導電性高分子(A)之水性熱硬化性樹脂組成物硬化而得者,且其厚度為12~250nm者。 The release film (10A) is provided with a substrate (11), an antistatic layer (12) provided on the surface (11A) on one side of the substrate (11), and on the antistatic layer (12), Or the release layer (13) provided on the other side of the substrate (11), and the surface (11A) on one side of the substrate (11), the arithmetic mean roughness Ra is 15nm or less, the largest protrusion The height Rp is 150 nm or less, and the antistatic layer (12) is obtained by curing an aqueous thermosetting resin composition containing a polythiophene-based conductive polymer (A), and the thickness is 12 to 250 nm.

Description

離型膜 Release film

本發明有關具有防靜電層之離型膜,尤其有關於積層陶瓷電容器之製造過程使用之步驟膜。 The present invention relates to a release film with an antistatic layer, and particularly relates to a step film used in the manufacturing process of a multilayer ceramic capacitor.

近幾年來,積層陶瓷電容器進展為小型化、輕量化,伴隨此,陶瓷生片之薄膜化期望亦逐年提高,亦已可製造未達1μm之生片。此種薄膜之陶瓷生片容易發生針孔,且稍有凹凸即成為不良品,有良率降低之傾向。陶瓷生片一般通常係於離型膜上塗佈陶瓷漿料而製造,但為了防止上述針孔或凹凸之形成,而要求表面平滑性高的離型膜。 In recent years, multilayer ceramic capacitors have progressed toward miniaturization and lighter weight. With this, the expectation of thinning ceramic green sheets has increased year by year, and green sheets of less than 1 μm can be manufactured. The ceramic green sheet of this kind of thin film is prone to pinholes, and the slight unevenness will become a defective product, and the yield rate tends to decrease. A ceramic green sheet is generally manufactured by coating a ceramic slurry on a release film, but in order to prevent the formation of pinholes or irregularities, a release film with high surface smoothness is required.

另一方面,表面平滑性高的離型膜捲取成捲筒狀時會產生黏連,於捲筒捲出時容易引起產生帶電等之缺陷。為了防止此種缺陷,已知有使離型膜中含有防靜電劑等而賦予防靜電功能。 On the other hand, when the release film with high surface smoothness is wound into a roll shape, adhesion occurs, and defects such as electrification are likely to occur when the roll is rolled out. In order to prevent such defects, it is known that an antistatic agent or the like is contained in a release film to impart an antistatic function.

作為離型膜中使用之防靜電劑,近幾年來,有使用PEDOT-PSS(聚乙烯二氧噻吩與聚苯乙烯磺酸酯之混合物)等之導電性高分子。例如如專利文獻1所揭示 般,有離型膜之離型層係由包含硬化型聚矽氧乳液、硬化劑與PEDOT-PSS所成之離型劑組成物所形成。 As an antistatic agent used in release films, conductive polymers such as PEDOT-PSS (a mixture of polyethylene dioxythiophene and polystyrene sulfonate) have been used in recent years. For example, as disclosed in Patent Document 1 Generally, the release layer with a release film is formed by a release agent composition composed of a curing type silicone emulsion, a hardener, and PEDOT-PSS.

且,於離型膜設置有與離型層不同之防靜電層。已知防靜電層係由例如於聚酯樹脂、胺基甲酸酯樹脂、或丙烯酸系樹脂等中混合PEDOT-PSS等之導電性高分子之樹脂組成物(參考專利文獻2)而形成,或由在光硬化塗佈劑中混合PEDOT-PSS等之導電性高分子之樹脂組成物(參考專利文獻3)形成。 In addition, the release film is provided with an anti-static layer different from the release layer. It is known that the antistatic layer is formed by, for example, a resin composition (refer to Patent Document 2) in which a conductive polymer such as PEDOT-PSS is mixed with a polyester resin, a urethane resin, or an acrylic resin, or the like, or It is formed of a resin composition (refer to Patent Document 3) in which a conductive polymer such as PEDOT-PSS is mixed with a light-curing coating agent.

〔先前技術文獻〕 [Prior technical literature] 〔專利文獻〕 〔Patent Literature〕

專利文獻1:日本特開2003-251756號公報 Patent Document 1: Japanese Patent Application Publication No. 2003-251756

專利文獻2:日本特開2012-224011號公報 Patent Document 2: JP 2012-224011 A

專利文獻3:日本特開2010-6079號公報 Patent Document 3: Japanese Patent Application Publication No. 2010-6079

然而,如專利文獻1,於離型劑組成物中調配PEDOT-PSS時,離型劑成分的聚矽氧乳液與PEDOT-PSS之相溶性差,易引起PEDOT-PSS凝集成為粗大突起。因此,難以使離型膜表面平滑。且,專利文獻3中記載之樹脂組成物,PEDOT-PSS亦易凝集,難以確保防靜電層及形成於其防靜電層上之離型層之表面平滑性。 However, as in Patent Document 1, when PEDOT-PSS is formulated in the release agent composition, the polysiloxane emulsion of the release agent component has poor compatibility with PEDOT-PSS, which easily causes the PEDOT-PSS to aggregate into coarse protrusions. Therefore, it is difficult to smooth the surface of the release film. In addition, the resin composition described in Patent Document 3, PEDOT-PSS, also tends to aggregate, and it is difficult to ensure the surface smoothness of the antistatic layer and the release layer formed on the antistatic layer.

另一方面,專利文獻2中記載之樹脂組成物由於為無 交聯類型,故無法成為皮膜強度等充分者,容易產生防靜電層之耐溶劑性或防靜電層之外覆塗佈性亦即形成於防靜電層上之離型層等之塗佈液之塗佈性惡化等之缺陷。 On the other hand, the resin composition described in Patent Document 2 is Cross-linking type, so it cannot be sufficient film strength, etc., and it is easy to produce the solvent resistance of the antistatic layer or the coating property of the antistatic layer, that is, the coating solution of the release layer formed on the antistatic layer Defects such as deterioration of coatability.

本發明係鑑於以上問題點而完成者,課題在於提供表面平滑,且防靜電性能、耐溶劑性及外覆塗佈性優異之離型膜。 The present invention was completed in view of the above problems, and the subject is to provide a release film with a smooth surface and excellent antistatic properties, solvent resistance, and coating properties.

本發明人等積極檢討之結果,發現藉由含有如PEDOT-PSS之聚噻吩系導電性高分子、為水性且具有熱硬化性之樹脂組成物,於平滑之基材表面上形成特定厚度之防靜電層,可解決上述問題,而完成以下之本發明。亦即,本發明係提供以下之(1)~(9)者。 As a result of active review, the inventors found that by containing a polythiophene-based conductive polymer such as PEDOT-PSS, a water-based and thermosetting resin composition, a specific thickness of anti-corrosion layer is formed on a smooth substrate surface. The electrostatic layer can solve the above-mentioned problems and complete the following invention. That is, the present invention provides the following (1) to (9).

(1)一種離型膜,其係具備基材、於前述基材之一側的面上所設置之防靜電層、與於前述防靜電層之上、或前述基材之另一側的面上所設置之離型層,且前述基材之一側的面,係算術平均粗度Ra為15nm以下,最大突起高度Rp為150nm以下,同時前述防靜電層係將含有聚噻吩系導電性高分子(A)之水性熱硬化性樹脂組成物硬化而得者,同時前述防靜電層的厚度為12~250nm。 (1) A release film comprising a substrate, an antistatic layer provided on one side of the substrate, and a surface on the antistatic layer or on the other side of the substrate The release layer provided on the above substrate, and the surface on one side of the aforementioned substrate, the arithmetic average roughness Ra is 15nm or less, the maximum protrusion height Rp is 150nm or less, and the antistatic layer will contain polythiophene with high conductivity Molecule (A) is obtained by curing the water-based thermosetting resin composition, and the thickness of the antistatic layer is 12~250nm.

(2)如上述(1)之離型膜,其中前述離型層係設置於防靜電層上。 (2) The release film of (1) above, wherein the release layer is provided on the antistatic layer.

(3)如上述(1)或(2)之離型膜,其中前述離型 層的算術平均粗度Ra係未達10nm、最大突起高度Rp係未達100nm。 (3) The release film of (1) or (2) above, wherein the aforementioned release film The arithmetic average thickness of the layer Ra is less than 10 nm, and the maximum protrusion height Rp is less than 100 nm.

(4)如上述(1)~(3)中任一項之離型膜,其中前述水性熱硬化性樹脂組成物,係進一步含有含羥基之聚酯樹脂(B)、與三聚氰胺化合物(C)。 (4) The release film of any one of (1) to (3) above, wherein the aqueous thermosetting resin composition further contains a hydroxyl-containing polyester resin (B) and a melamine compound (C) .

(5)如上述(4)之離型膜,其中前述水性熱硬化性樹脂組成物,係相對於聚噻吩系導電性高分子(A)及含羥基之聚酯樹脂(B)之合計100質量份而言,含有8~35質量份的三聚氰胺化合物(C)。 (5) The release film according to the above (4), wherein the aforementioned water-based thermosetting resin composition is based on a total of 100 masses of the polythiophene-based conductive polymer (A) and the hydroxyl-containing polyester resin (B) In terms of parts, it contains 8 to 35 parts by mass of the melamine compound (C).

(6)如上述(4)或(5)之離型膜,其中前述水性熱硬化性樹脂組成物,係相對於含羥基之聚酯樹脂(B)100質量份而言,含有0.5~50質量份的聚噻吩系導電性高分子(A)。 (6) The release film according to (4) or (5) above, wherein the aqueous thermosetting resin composition contains 0.5-50 mass parts relative to 100 mass parts of hydroxyl-containing polyester resin (B) Parts of polythiophene-based conductive polymer (A).

(7)如上述(4)~(6)中任一項之離型膜,其中三聚氰胺化合物(C)係羥甲基三聚氰胺。 (7) The release film according to any one of (4) to (6) above, wherein the melamine compound (C) is methylol melamine.

(8)如上述(1)~(7)中任一項之離型膜,其中前述聚噻吩系導電性高分子(A)係聚乙烯二氧噻吩與聚苯乙烯磺酸酯的混合物(PEDOT-PSS)。 (8) The release film of any one of (1) to (7) above, wherein the aforementioned polythiophene-based conductive polymer (A) is a mixture of polyethylene dioxythiophene and polystyrene sulfonate (PEDOT -PSS).

(9)如上述(1)~(8)中任一項之離型膜,係使用於陶瓷生片之製造步驟用。 (9) The release film of any one of (1) to (8) above is used in the manufacturing step of ceramic green sheets.

本發明可提供表面平滑,且防靜電性能、耐溶劑性及外覆塗佈性優異之離型膜。 The present invention can provide a release film with a smooth surface and excellent antistatic properties, solvent resistance and coating properties.

10A、10B‧‧‧離型膜 10A、10B‧‧‧Release film

11‧‧‧基材 11‧‧‧Substrate

11A‧‧‧一側之面 11A‧‧‧One side surface

12‧‧‧防靜電層 12‧‧‧Anti-static layer

13‧‧‧離型層 13‧‧‧Release layer

圖1係顯示本發明之離型膜之一實施形態之示意剖面圖。 Fig. 1 is a schematic cross-sectional view showing an embodiment of the release film of the present invention.

圖2係顯示本發明之離型膜之另一實施形態之示意剖面圖。 Fig. 2 is a schematic cross-sectional view showing another embodiment of the release film of the present invention.

以下,針對本發明使用實施形態詳細說明。 Hereinafter, the embodiments of the present invention will be described in detail.

本發明之離型膜係具備基材、於基材之一側的面上所設置之防靜電層、與於防靜電層之上、或基材之另一側的面上所設置之離型層者。 The release film of the present invention includes a substrate, an antistatic layer provided on one side of the substrate, and a release film provided on the antistatic layer or on the other side of the substrate Layerer.

更具體而言,作為離型膜,舉例為如圖1所示,係具備基材11、於基材11之一側的面11A上所設置之防靜電層12、與於該防靜電層12之上所設置之離型層13之離型膜10A,但亦可為如圖2所示,防靜電層12設置於基材11之一側之面11A上同時離型層13設置於基材11之另一側之面11B上之離型膜10B。 More specifically, as a release film, for example, as shown in FIG. 1, a base material 11, an antistatic layer 12 provided on a surface 11A on one side of the base material 11, and an antistatic layer 12 The release film 10A of the release layer 13 provided on it, but can also be as shown in FIG. 2, the antistatic layer 12 is provided on the surface 11A on one side of the substrate 11 while the release layer 13 is provided on the substrate Release film 10B on surface 11B on the other side of 11.

捲取成捲筒狀之離型膜,視情況會發生黏連,於自滾筒捲出離型膜時會產生靜電。離型膜藉由具有防靜電層而防止此捲出時之帶電,可防止黏連或捲取性之降低。又,積層於離型層上之陶瓷生片等之各種物品自離型膜剝離時,不易因帶電而產生剝離不良。再者,亦可防 止因靜電而於離型層上附著灰塵等。 When the release film is wound into a roll, adhesion may occur depending on the situation, and static electricity will be generated when the release film is rolled out of the roll. The release film has an anti-static layer to prevent the electrification when it is rolled out, which can prevent adhesion or decrease in rollability. In addition, when various articles such as ceramic green sheets laminated on the release layer are peeled from the release film, it is not easy to cause peeling failure due to electrification. Furthermore, it can also prevent Prevents dust from adhering to the release layer due to static electricity.

作為離型膜,較好為如圖1所示,離型層13係設置於防靜電層12上者。此種離型膜中,藉由防靜電層12易於進一步防止離型層13上之帶電。 As the release film, as shown in FIG. 1, the release layer 13 is preferably provided on the antistatic layer 12. In this type of release film, the antistatic layer 12 can easily further prevent charging on the release layer 13.

其次,針對離型膜之各構件詳細說明。 Secondly, each component of the release film will be described in detail.

〔基材〕 〔Substrate〕

基材係供形成防靜電層之基材之一側之面(圖1、2中為面11A)係算術平均粗度Ra為15nm以下,最大突起高度Rp為150nm以下者。本發明中,基材之一側面之算術平均粗度Ra或最大突起高度Rp超過該等上限值時,即使用以形成防靜電層之組成物設為後述之水性熱硬化性樹脂組成物,亦難以使防靜電層表面平滑。防靜電層表面不平滑時,例如於防靜電層上設置離型層等之薄膜時,使該離型層等之表面不平滑,而於離型層上形成之陶瓷生片等之物品易於產生凹凸或針孔。 The substrate is a surface (surface 11A in Figs. 1 and 2) on one side of the substrate on which the antistatic layer is formed. The arithmetic mean roughness Ra is 15 nm or less, and the maximum protrusion height Rp is 150 nm or less. In the present invention, when the arithmetic average roughness Ra or the maximum protrusion height Rp of one side surface of the substrate exceeds these upper limits, even if the composition for forming the antistatic layer is the aqueous thermosetting resin composition described later, It is also difficult to smooth the surface of the antistatic layer. When the surface of the antistatic layer is not smooth, for example, when a film such as a release layer is provided on the antistatic layer, the surface of the release layer, etc., is not smooth, and the ceramic green sheet formed on the release layer is easy to produce Bumps or pinholes.

基於以上觀點,上述算術平均粗度Ra及最大突起高度Rp分別較好為12nm以下、120nm以下。且若亦考慮基材之製造容易性等,則算術平均粗度Ra、最大突起高度Rp分別較好為1nm以上、5nm以上。 From the above viewpoints, the arithmetic average roughness Ra and the maximum protrusion height Rp are preferably 12 nm or less and 120 nm or less, respectively. In addition, considering the ease of manufacture of the substrate, the arithmetic average roughness Ra and the maximum protrusion height Rp are preferably 1 nm or more and 5 nm or more, respectively.

作為基材,若算術平均粗度Ra及最大突起高度Rp在上述範圍,則無特別限制,舉例為例如聚對苯二甲酸乙二酯或聚萘二甲酸乙二酯等之聚酯,聚丙烯或聚甲基戊烯等之聚烯烴,聚碳酸酯、聚乙酸乙烯酯等之塑膠所 成之膜,該等可為單層,亦可為同種或不同種之2層以上之多層。該等中較好為聚酯膜,特佳為聚對苯二甲酸乙二酯膜。聚對苯二甲酸乙二酯膜由於加工時、使用時等中不易發生灰塵等,故可有效地防止例如因灰塵導致之陶瓷漿料塗佈不良等。 As the substrate, if the arithmetic average roughness Ra and the maximum protrusion height Rp are in the above range, there are no particular restrictions. Examples include polyesters such as polyethylene terephthalate or polyethylene naphthalate, and polypropylene Or polyolefins such as polymethylpentene, polycarbonate, polyvinyl acetate and other plastics The formed film can be a single layer, or multiple layers of two or more layers of the same or different species. Among these, a polyester film is preferred, and a polyethylene terephthalate film is particularly preferred. Since the polyethylene terephthalate film is less likely to generate dust during processing, use, etc., it can effectively prevent, for example, poor ceramic slurry coating caused by dust.

且,基材厚度並未特別限定,通常為10~300μm,較好為15~200μm左右。 In addition, the thickness of the base material is not particularly limited, but is usually 10 to 300 μm, preferably about 15 to 200 μm.

基材為了確保算術平均粗度Ra及最大突起高度Rp,以不含有粒子者較佳,但只要可確保上述之算術平均粗度Ra及最大突起高度Rp,則亦可含有粒子。含有粒子時,為了減小基材之算術平均粗度Ra及最大突起高度Rp,只要減小該粒子(例如用以賦予易滑性之氧化矽、碳酸鈣及氧化鈦等之填料)之粒徑,減少該粒子之調配量即可。 In order to ensure the arithmetic average thickness Ra and the maximum protrusion height Rp, the base material preferably does not contain particles. However, as long as the above-mentioned arithmetic average thickness Ra and the maximum protrusion height Rp can be ensured, the substrate may contain particles. When particles are contained, in order to reduce the arithmetic average roughness Ra and the maximum protrusion height Rp of the substrate, it is only necessary to reduce the particle size of the particles (for example, fillers such as silica, calcium carbonate, and titanium oxide to impart slipperiness) , Just reduce the amount of the particles.

〔防靜電層〕 〔Anti-static layer〕

防靜電層係使含聚噻吩系導電性高分子(A)(以下亦簡稱為(A)成分)之水性熱硬化性樹脂組成物硬化而得者。 The antistatic layer is obtained by curing an aqueous thermosetting resin composition containing a polythiophene-based conductive polymer (A) (hereinafter also simply referred to as (A) component).

本發明中,由於藉由將形成防靜電層之樹脂組成物設為熱硬化性,而提高防靜電層之皮膜強度,故防靜電層之耐溶劑性良好。再者,於防靜電層上設置離型層等之薄層時,該薄層之外覆塗佈性良好。亦即,於防靜電層上形成離型層等之薄層時,可防止產生塗佈不均,防止發生排斥或條紋等。 In the present invention, since the resin composition forming the antistatic layer is thermosetting, the film strength of the antistatic layer is increased, so the solvent resistance of the antistatic layer is good. Furthermore, when a thin layer such as a release layer is provided on the antistatic layer, the coating property of the outer coating of the thin layer is good. That is, when a thin layer such as a release layer is formed on the antistatic layer, uneven coating can be prevented, and repelling or streaks can be prevented.

又,藉由將組成物設為水性者,聚噻吩系導電性高分子(A)於組成物中不會凝集等而容易分散或溶解,可使防靜電層或其上形成之離型層等平滑。進而防止形成於防靜電層上之離型層等產生凹凸或針孔。 In addition, by making the composition water-based, the polythiophene-based conductive polymer (A) is easily dispersed or dissolved without agglomeration, etc. in the composition, so that the antistatic layer or the release layer formed on it can be obtained smooth. Furthermore, it prevents the release layer formed on the antistatic layer from producing unevenness or pinholes.

又,防靜電層厚度為12~250nm者。防靜電層厚度未達12nm時,厚度過薄,防靜電層之表面電阻值無法藉(A)成分充分降低,難以賦予防靜電性能。且,無法形成充分之皮膜,耐溶劑性或外覆塗佈性變低。另一方面大於250nm時,即使基材之一側之面設為平滑面,亦難以使防靜電層表面平滑,難以確保形成於防靜電層上之離型層等之表面平滑性。基於以上觀點,防靜電層之厚度較好為15~200nm。又,防靜電層厚度係使用分光橢圓偏振儀測定者。 In addition, the thickness of the antistatic layer is 12 to 250 nm. When the thickness of the antistatic layer is less than 12nm, the thickness is too thin, and the surface resistance of the antistatic layer cannot be sufficiently reduced by the component (A), and it is difficult to impart antistatic performance. In addition, a sufficient film cannot be formed, and solvent resistance or overcoatability becomes low. On the other hand, when it is larger than 250 nm, even if one side of the substrate is a smooth surface, it is difficult to smooth the surface of the antistatic layer, and it is difficult to ensure the surface smoothness of the release layer formed on the antistatic layer. Based on the above viewpoints, the thickness of the antistatic layer is preferably 15 to 200 nm. In addition, the thickness of the antistatic layer was measured using a spectroscopic ellipsometer.

又,防靜電層可藉由適當變更水性熱硬化性樹脂組成物中之固體成分濃度,變更塗佈裝置之間隙等而成為期望厚度。水性熱硬化性樹脂組成物中之固體成分濃度並未特別限制,但較好為0.4~2.0質量%左右,更好為0.5~1.6質量%左右。 In addition, the antistatic layer can have a desired thickness by appropriately changing the solid content concentration in the aqueous thermosetting resin composition, changing the gap of the coating device, and the like. The solid content concentration in the water-based thermosetting resin composition is not particularly limited, but it is preferably about 0.4 to 2.0% by mass, more preferably about 0.5 to 1.6% by mass.

防靜電膜較好由聚酯樹脂與三聚氰胺化合物交聯而形成之硬化膜所成,具體而言,較好為使除了上述(A)成分以外,又含有含羥基之聚酯樹脂(B)(以下亦簡稱為聚酯樹脂(B)或(B)成分)與三聚氰胺化合物(C)(以下亦簡稱為(C)成分)之水性熱硬化性樹脂組成物硬化而成者。 The antistatic film is preferably made of a cured film formed by cross-linking a polyester resin and a melamine compound. Specifically, it is preferable to include a hydroxyl-containing polyester resin (B) in addition to the above-mentioned component (A) ( Hereinafter, it is also abbreviated as polyester resin (B) or (B) component) and melamine compound (C) (hereinafter also abbreviated as (C) component) by curing a water-based thermosetting resin composition.

又,水性熱硬化性樹脂組成物只要於含水之稀釋液中使各成分分散或溶解而為水分散性或水溶性即可。 In addition, the aqueous thermosetting resin composition may be water-dispersible or water-soluble by dispersing or dissolving each component in a diluent containing water.

以下,針對構成防靜電層之個成分更詳細說明。 Hereinafter, the components constituting the antistatic layer will be described in more detail.

<聚噻吩系導電性高分子(A)> <Polythiophene-based conductive polymer (A)>

聚噻吩系導電性高分子(A)之具體化合物舉例為例如聚乙烯二氧噻吩、聚丙烯二氧噻吩、聚(乙烯/丙烯)二氧噻吩等之聚烷二氧基噻吩與聚苯乙烯磺酸酯之混合物;聚(3-噻吩-β-乙烷磺酸)等之具有磺酸基之聚噻吩系化合物等。該等中較好為聚烷二氧基噻吩與聚苯乙烯磺酸酯之混合物,其中,更好為聚乙烯二氧噻吩與聚苯乙烯磺酸酯之混合物(PEDOT-PSS)。 Examples of specific compounds of the polythiophene-based conductive polymer (A) are polyalkylene dioxythiophene and polystyrene sulfonate such as polyethylene dioxythiophene, polypropylene dioxythiophene, poly(ethylene/propylene) dioxythiophene, etc. A mixture of acid esters; polythiophene compounds with sulfonic acid groups such as poly(3-thiophene-β-ethanesulfonic acid). Among them, a mixture of polyalkyldioxythiophene and polystyrene sulfonate is preferred, and a mixture of polyethylene dioxythiophene and polystyrene sulfonate (PEDOT-PSS) is more preferred.

藉由使防靜電劑含有聚噻吩系導電性高分子(A),即使為薄膜亦可充分降低表面電阻值,可有效防止帶電。且,聚噻吩系導電性高分子(A)具有水溶性禍水分散性,因此,如上述,於水性熱硬化性樹脂組成物可容易溶解或分散。 By containing the polythiophene-based conductive polymer (A) in the antistatic agent, the surface resistance value can be sufficiently reduced even if it is a thin film, and charging can be effectively prevented. Furthermore, the polythiophene-based conductive polymer (A) has water-soluble and water-dispersible properties, and therefore, as described above, can be easily dissolved or dispersed in the water-based thermosetting resin composition.

用以形成防靜電層之水性熱硬化性樹脂組成物,相對於聚酯樹脂(B)100質量份,較好含有0.5~50質量份的聚噻吩系導電性高分子(A)。藉由(A)成分含有上述下限值以上,可使離型膜發揮適當之防靜電性能。且藉由成為上限值以下,可防止(A)成分凝集,產生防靜電層之硬化不良。 The water-based thermosetting resin composition for forming the antistatic layer preferably contains 0.5-50 parts by mass of the polythiophene-based conductive polymer (A) relative to 100 parts by mass of the polyester resin (B). When the component (A) contains the above lower limit or more, the release film can exhibit proper antistatic performance. And by being below the upper limit value, the (A) component can be prevented from agglomerating and causing poor curing of the antistatic layer.

基於以上觀點,水性熱硬化性樹脂組成物中,(A)成分相對於(B)成分100質量份,更好含有0.6~20質量份。 Based on the above point of view, in the aqueous thermosetting resin composition, the (A) component is more preferably contained in 0.6 to 20 parts by mass relative to 100 parts by mass of the (B) component.

<聚酯樹脂(B)> <Polyester resin (B)>

聚酯樹脂(B)係藉由多元羧酸成分與多元醇成分反應而得者。聚酯樹脂(B)係其分子內含有羥基者,用以構成聚酯之醇成分之OH基相對於多元羧酸成分之COOH基之當量比(OH基/COOH基)較好大於1.0。藉由使聚酯樹脂(B)含有羥基而可與三聚氰胺化合物(C)交聯。 The polyester resin (B) is obtained by reacting a polycarboxylic acid component and a polyol component. The polyester resin (B) contains hydroxyl groups in its molecule, and the equivalent ratio (OH group/COOH group) of the OH group of the alcohol component of the polyester to the COOH group of the polycarboxylic acid component is preferably greater than 1.0. The polyester resin (B) can be crosslinked with the melamine compound (C) by containing a hydroxyl group.

此處,多元羧酸成分係1分子中具有2個以上羧基之化合物,可使用例如鄰苯二甲酸、間苯二甲酸、對苯二甲酸、四氫鄰苯二甲酸、四氫間苯二甲酸、四氫對苯二甲酸、六氫鄰苯二甲酸、六氫間苯二甲酸、六氫對苯二甲酸、苯偏三甲酸、己二酸、癸二酸、琥珀酸、杜鵑花酸、萘二羧酸、4,4-二苯基二羧酸、六氯降冰片烯二羧酸(HET acid)、富馬酸、馬來酸、依康酸、均苯四甲酸等之聚酯樹脂製造中一般可使用之多元酸。又,作為多元羧酸成分,亦可使用上述多元羧酸成分之酸酐。該等多元羧酸成分可單獨使用或組合2種以上使用。 Here, the polycarboxylic acid component is a compound having two or more carboxyl groups in one molecule. For example, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic acid, and tetrahydroisophthalic acid can be used. , Tetrahydroterephthalic acid, hexahydrophthalic acid, hexahydroisophthalic acid, hexahydroterephthalic acid, trimellitic acid, adipic acid, sebacic acid, succinic acid, azaleaic acid, naphthalene Manufacturing of polyester resins such as dicarboxylic acid, 4,4-diphenyldicarboxylic acid, hexachloronorbornene dicarboxylic acid (HET acid), fumaric acid, maleic acid, itaconic acid, pyromellitic acid, etc. Polybasic acid that can be used in general. Moreover, as a polyhydric carboxylic acid component, you may use the acid anhydride of the said polyhydric carboxylic acid component. These polyvalent carboxylic acid components can be used individually or in combination of 2 or more types.

多元醇成分為1分子中具有2個以上羥基之化合物,其具體例舉例為乙二醇、丙二醇、二乙二醇、三乙二醇、四乙二醇、二丙二醇、聚乙二醇、聚丙二醇、新 戊二醇、己二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、2-丁基-2-乙基-1,3-丙二醇、甲基丙二醇、環己烷二甲醇、3,3-二乙基-1,5-戊二醇等之二醇類,甘油、三羥甲基乙烷、三羥甲基丙烷、赤糖醇、季戊四醇、二季戊四醇等之3元以上之醇等之通常製造聚酯樹脂時使用者。該等多元醇成分可單獨或組合2種以上使用。 The polyol component is a compound having two or more hydroxyl groups in one molecule, and specific examples thereof are ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, polyethylene glycol, and poly Propylene glycol, new Pentylene glycol, hexanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 2-butyl-2-ethyl- Diols such as 1,3-propanediol, methylpropanediol, cyclohexanedimethanol, 3,3-diethyl-1,5-pentanediol, glycerin, trimethylolethane, trimethylol It is usually used in the production of polyester resins such as propane, erythritol, pentaerythritol, dipentaerythritol and other alcohols with trivalent or higher. These polyol components can be used individually or in combination of 2 or more types.

聚酯樹脂(B)為了作為水性熱硬化性樹脂組成物之成分,較好聚有水溶性或水分散性。聚酯樹脂(B)並未特別限定,但為了賦予水溶性或水分散性,較好使用含有含磺酸鹽基或羧酸鹽基之構成單位作為聚酯之構成單位者。 The polyester resin (B) is preferably water-soluble or water-dispersible in order to be a component of the water-based thermosetting resin composition. The polyester resin (B) is not particularly limited, but in order to impart water solubility or water dispersibility, it is preferable to use a structural unit containing a sulfonate group or a carboxylate group as a structural unit of the polyester.

又,聚酯樹脂(B)於水性熱硬化性樹脂組成物中係成為主要成分者,相對於組成物中之固體成分總量通常含有50質量%以上,較好含有65~92質量%。又,本說明書中,所謂固體成分總量,係將硬化步驟等之製造過程中揮發之溶劑等之揮發成分自水性熱硬化性樹脂組成物除去之量。 In addition, the polyester resin (B) is the main component in the water-based thermosetting resin composition, and it usually contains 50% by mass or more of the total solid content in the composition, preferably 65 to 92% by mass. In this specification, the term "total solid content" refers to the amount of volatile components such as solvents volatilized during the manufacturing process such as the curing step, which are removed from the aqueous thermosetting resin composition.

<三聚氰胺化合物(C)> <Melamine Compound (C)>

又,三聚氰胺化合物(C)之具體例舉例為羥甲基三聚氰胺或烷氧基化羥甲基三聚氰胺,但基於水溶性高、熱硬化速度快之方面,更好為羥甲基三聚氰胺。又,羥甲基三聚氰胺舉例為於三聚氰胺之胺基之氮原子上鍵結1~6個羥甲基者。又,烷氧基化羥甲基三聚氰胺舉例為羥甲基三 聚氰胺之羥甲基之至少一部分經低級醇烷氧基化者,具體舉例為甲氧基化羥甲基三聚氰胺、丁氧基化羥甲基三聚氰胺等之烷氧基的碳數為1~4者。 In addition, specific examples of the melamine compound (C) are methylol melamine or alkoxylated methylol melamine, but in terms of high water solubility and fast heat curing speed, methylol melamine is more preferable. In addition, methylol melamine is exemplified by one in which 1 to 6 methylol groups are bonded to the nitrogen atom of the amino group of melamine. In addition, alkoxylated methylol melamine is exemplified by methylol tri At least part of the methylol of polycyanamide is alkoxylated with lower alcohols, specific examples are methoxylated methylol melamine, butoxylated methylol melamine, etc. The carbon number of the alkoxy group is 1~ 4 persons.

又,三聚氰胺化合物(C)較好為水溶性三聚氰胺,係作為上述化合物之水溶液者使用。 In addition, the melamine compound (C) is preferably a water-soluble melamine, which is used as an aqueous solution of the above-mentioned compound.

防靜電層除了(B)成分以外又調配(C)成分,由於聚酯樹脂與三聚氰胺化合物交聯,故上述之外覆塗佈性、耐溶劑性等變良好。 The antistatic layer contains the component (C) in addition to the component (B), and since the polyester resin is crosslinked with the melamine compound, the above-mentioned overcoatability, solvent resistance, etc. become good.

水性熱硬化性樹脂組成物中,相對於(A)成分及(B)成分之合計100質量份,較好含有8~35質量份之三聚氰胺化合物(C)。防靜電層藉由調配8質量份以上之(C)成分,而使上述之耐溶劑性或外覆塗佈性良好,進而易使防靜電層表面平滑化。且藉由設為35質量份以下,使組成物之分散安定性良好,不易發生凝集物。 The water-based thermosetting resin composition preferably contains 8 to 35 parts by mass of the melamine compound (C) relative to 100 parts by mass of the total of the components (A) and (B). The antistatic layer is prepared with 8 parts by mass or more of the (C) component, so that the above-mentioned solvent resistance or overcoatability is good, and the surface of the antistatic layer is easily smoothed. And by setting it to 35 parts by mass or less, the dispersion stability of the composition is good, and agglomerates are unlikely to occur.

且,上述三聚氰胺化合物(C)之含量,相對於(A)成分及(B)成分之合計100質量份,較好為10~32質量份。 In addition, the content of the melamine compound (C) is preferably 10 to 32 parts by mass with respect to 100 parts by mass of the total of (A) component and (B) component.

又,防靜電層之表面電阻值較好未達1×1011Ω/□,更好未達1×1010Ω/□。藉由使防靜電層之表面電阻值成為未達1×1011Ω/□,可適當防止離型膜之帶電,尤其,易於抑制使用離型膜製造陶瓷生片時發生之各種缺陷。 In addition, the surface resistance of the antistatic layer is preferably less than 1×10 11 Ω/□, more preferably less than 1×10 10 Ω/□. By making the surface resistance of the antistatic layer less than 1×10 11 Ω/□, the release film can be properly prevented from being charged, and in particular, it is easy to suppress various defects that occur when the release film is used to manufacture ceramic green sheets.

用以形成防靜電層之水性熱硬化性樹脂組成物至少含水作為稀釋溶劑,亦可進而含二甲基亞碸、異丙 醇(IPA)、乙醇等之水以外之極性溶劑作為稀釋溶劑。又,稀釋溶劑更好使用全溶劑中之30質量%以上70質量%以下為水者。藉由將水設為70質量%以下,不易發生於塗佈水性熱硬化性樹脂組成物時產生之排斥等。 The water-based thermosetting resin composition used to form the antistatic layer contains at least water as a diluting solvent, and may further contain dimethyl sulfoxide and isopropyl Polar solvents other than water such as alcohol (IPA) and ethanol are used as diluting solvents. In addition, it is more preferable to use water as the dilution solvent in which 30% by mass or more and 70% by mass or less of the total solvent are water. By setting the water to 70% by mass or less, it is less likely to cause repulsion when the water-based thermosetting resin composition is applied.

且,藉由將水設為30質量%以上,可使(A)成分於稀釋液中分散或溶解,易於防止(A)成分之凝集。進而,可使水溶性或水分散性之(B)成分及水溶性的(C)成分於組成物中容易分散或溶解。因此,熱硬化性樹脂組成物之塗佈性良好,可形成適當皮膜。 In addition, by setting water to 30% by mass or more, the component (A) can be dispersed or dissolved in the diluent, and the aggregation of the component (A) can be easily prevented. Furthermore, the water-soluble or water-dispersible (B) component and the water-soluble (C) component can be easily dispersed or dissolved in the composition. Therefore, the coating property of the thermosetting resin composition is good, and an appropriate film can be formed.

防靜電層係將至少(A)~(C)成分以稀釋溶劑稀釋而得之水性熱硬化性樹脂組成物塗佈於基材上後,加熱乾燥熱硬化而得者。 The antistatic layer is obtained by applying a water-based thermosetting resin composition obtained by diluting at least the components (A) to (C) with a diluent solvent on a substrate, and then heating and drying and thermally curing.

此處,水性熱硬化性樹脂組成物之塗佈方法並未特別限定,舉例為例如凹版塗佈法、棒塗佈法、噴霧塗佈法、旋轉塗佈法、刮刀塗佈法、輥塗佈法、模嘴塗佈法等。 Here, the coating method of the water-based thermosetting resin composition is not particularly limited, and examples include, for example, gravure coating, bar coating, spray coating, spin coating, knife coating, and roll coating. Method, die nozzle coating method, etc.

又,水性熱硬化性樹脂組成物除了(A)~(C)成分以及稀釋溶劑以外,只要不損及本發明效果,亦可含有(A)~(C)成分以外之樹脂成分、各種添加劑等。惟,水性熱硬化性樹脂組成物為了確保防靜電層表面之平滑性,宜不含有無機填料等之填充材。 In addition to the components (A) to (C) and the dilution solvent, the aqueous thermosetting resin composition may also contain resin components other than the components (A) to (C), various additives, etc., as long as the effects of the present invention are not impaired. . However, in order to ensure the smoothness of the surface of the antistatic layer, the water-based thermosetting resin composition should not contain fillers such as inorganic fillers.

〔離型層〕 〔Release layer〕

離型層係由離型劑構成者,具體而言可使用聚矽氧樹脂系離型劑、醇酸樹脂系離型劑、烯烴樹脂系離型劑、丙 烯酸樹脂系離型劑、橡膠系離型劑、三聚氰胺樹脂系離型劑、氟樹脂系離型劑等,但較好為矽氧樹脂系離型劑。以下,針對使用聚矽氧樹脂系離型劑作為離型劑之情況詳細說明。 The release layer is composed of a release agent, specifically, silicone resin release agent, alkyd resin release agent, olefin resin release agent, acrylic An acrylic resin-based release agent, a rubber-based release agent, a melamine resin-based release agent, a fluororesin-based release agent, etc., but a silicone resin-based release agent is preferred. The following is a detailed description of the use of silicone resin-based release agents as release agents.

作為聚矽氧樹脂系離型劑較好使用加成反應型聚矽氧樹脂組成物。加成反應型聚矽氧樹脂組成物係於由加成反應型聚矽氧樹脂與交聯劑所成之主劑中,添加觸媒及根據需要之加成反應抑制劑、剝離調整劑、密著提升劑、光增感劑等之其他添加劑者。 As the silicone resin-based release agent, an addition reaction type silicone resin composition is preferably used. The addition reaction type silicone resin composition is based on the main agent composed of the addition reaction type silicone resin and the cross-linking agent, with the addition of catalysts, addition reaction inhibitors, peeling regulators, and density as needed. With other additives such as enhancers, photosensitizers, etc.

作為加成反應型聚矽氧樹脂並未特別限制,可使用各種者,但可使用例如分子中具有烯基作為官能基之聚有機矽氧烷,更具體而言舉例為以乙烯基或己烯基等為官能基之聚二甲基矽氧烷。 The addition reaction type polysiloxane resin is not particularly limited, and various ones can be used, but for example, polyorganosiloxanes having an alkenyl group as a functional group in the molecule can be used. More specifically, vinyl or hexene can be used. Polydimethylsiloxane such as functional groups.

又,亦可使用使具有烯基且例如質量平均分子量(Mw)為70000以上之直鏈狀聚有機矽氧烷與具有烯基且質量平均分子量(Mw)為500~50000左右之分支狀之有機矽氧烷寡聚物混合者作為加成反應行聚矽氧樹脂。又,本說明書中之質量平均分子量(Mw)意指藉由凝膠滲透層析儀(GPC),以聚苯乙烯換算值求得者。 In addition, it is also possible to use a linear polyorganosiloxane having an alkenyl group and having a mass average molecular weight (Mw) of 70,000 or more and a branched organic having an alkenyl group and a mass average molecular weight (Mw) of about 500 to 50,000. The silicone oligomer mixture is used as an addition reaction to perform polysiloxane resin. In addition, the mass average molecular weight (Mw) in this specification means a value obtained by gel permeation chromatography (GPC) in terms of polystyrene.

作為交聯劑舉例為例如一分子中具有至少2個鍵結於矽原子之氫原子的聚有機矽氧烷,具體舉例為聚甲基氫矽氧烷。交聯劑之使用量對於加成反應型聚矽氧樹之100質量份,較好為0.1~100重量份,更好為0.5~25質量份之範圍內選定。且作為觸媒係使用鉑系觸媒。 The crosslinking agent is exemplified by polyorganosiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule, and a specific example is polymethylhydrosiloxane. The use amount of the crosslinking agent is selected within the range of 100 parts by mass of the addition reaction type polysiloxane tree, preferably 0.1-100 parts by mass, more preferably 0.5-25 parts by mass. And as the catalyst system, a platinum-based catalyst is used.

離型層為使積層於離型層上之陶瓷生片等之物品不產生凹凸或針孔,故較好表面為平滑。具體而言,較好離型層表面之算術平均粗度Ra未達10nm同時最大突起高度Rp未達100nm,更好算術平均粗度Ra為8nm以下同時最大突起高度Rp為80nm以下。又,若亦考慮離型層製造容易性,則算術平均粗度Ra、最大突起高度Rp較好分別為1nm以上、10nm以上。 The release layer is used to prevent unevenness or pinholes from the ceramic green sheets laminated on the release layer, so the surface is preferably smooth. Specifically, it is preferable that the arithmetic average roughness Ra of the surface of the release layer is less than 10 nm and the maximum protrusion height Rp is less than 100 nm, and it is more preferable that the arithmetic average roughness Ra is 8 nm or less and the maximum protrusion height Rp is 80 nm or less. Moreover, considering the ease of manufacturing the release layer, the arithmetic average roughness Ra and the maximum protrusion height Rp are preferably 1 nm or more and 10 nm or more, respectively.

本發明如上述將基材之算術平均粗度Ra及最大突起高度Rp設為特定值以下,並且將防靜電層之構成設為特定者,可使形成於防靜電層上之離型層之算術平均粗度Ra及最大突起高度Rp如上述減小。 In the present invention, as described above, the arithmetic average roughness Ra and the maximum protrusion height Rp of the base material are set to a specific value or less, and the structure of the antistatic layer is set to a specific one, so that the arithmetic of the release layer formed on the antistatic layer The average thickness Ra and the maximum protrusion height Rp are reduced as described above.

作為構成離型層之離型劑可使用非溶劑型者或使用水作為稀釋溶劑之水系者,但較好為使用有機溶劑作為稀釋溶劑者。藉由使用溶劑型之離型劑,可廣範圍地使用各種離型劑,易於將離型性能等之各種要求性能設計於所期望者。 As the release agent constituting the release layer, a non-solvent type or an aqueous type using water as a diluting solvent can be used, but an organic solvent is preferably used as the diluting solvent. By using solvent-based release agents, various release agents can be used in a wide range, and it is easy to design various required performances such as release performance to what is desired.

離型劑為溶劑型時,作為稀釋溶劑使用之有機溶劑之具體例舉例為甲苯、IPA、甲基乙基酮(MEK)、甲基異丁基酮(MIBK)等。防靜電層由於如上述耐溶劑性良好,故即使離型劑使用溶劑型者,於形成離型層時,亦可防止防靜電層溶解等之缺陷。 When the release agent is a solvent type, specific examples of the organic solvent used as the dilution solvent are toluene, IPA, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), and the like. Since the antistatic layer has good solvent resistance as described above, even if the release agent uses a solvent type, when the release layer is formed, defects such as dissolution of the antistatic layer can be prevented.

離型層可藉由將離型劑組成物塗佈於防靜電層上或基材之另一側之面(亦即未設置防靜電層之側的面)上,隨後加熱乾燥該塗佈膜等硬化而形成。且離型劑 之塗佈方法並未特別限定,舉例為例如凹版塗佈法、棒塗佈法、噴霧塗佈法、旋轉塗佈法、刮刀塗佈法、輥塗佈法、模嘴塗佈法等。 The release layer can be formed by coating the release agent composition on the antistatic layer or on the other side of the substrate (that is, the side on which the antistatic layer is not provided), and then heat and dry the coating film Wait for hardening to form. And release agent The coating method is not particularly limited, and examples include, for example, a gravure coating method, a bar coating method, a spray coating method, a spin coating method, a knife coating method, a roll coating method, and a die coating method.

又,離型層厚度並未特別限定,較好調整為乾燥後之單位面積重為0.03~0.4g/m2左右。 In addition, the thickness of the release layer is not particularly limited, but it is preferably adjusted so that the weight per unit area after drying is about 0.03 to 0.4 g/m 2 .

〔離型膜之使用方法〕 〔How to use the release film〕

離型膜較好於積層陶瓷電容器之製造過程中使用者,更好為陶瓷生片之製造步驟用中所用。陶瓷生片具體而言係於離型膜之離型層上塗佈陶瓷漿料後,經適當乾燥等而製作者。且離型膜除了陶瓷生片以外,亦可在將各種材料塗佈於離型層上,經適當硬化等製作薄片形狀之物品時使用者,亦可使用於其他用途。又,於離型膜上製作之陶瓷生片或其他物品在製作薄片後,自離型膜剝離。 The release film is better for users in the manufacturing process of multilayer ceramic capacitors, and is better used in the manufacturing process of ceramic green sheets. The ceramic green sheet is specifically produced by applying ceramic slurry on the release layer of the release film, and then appropriately drying it. In addition to the ceramic green sheet, the release film can also be used for other purposes when various materials are coated on the release layer, and the product in the shape of a sheet is made after proper curing. In addition, the ceramic green sheets or other articles made on the release film are peeled from the release film after the sheet is made.

實施例 Example

以下基於實施例進一步詳細說明本發明,但本發明不受該等例之限制。 The present invention will be described in further detail below based on examples, but the present invention is not limited by these examples.

本發明之測定方法、評價方法如以下。 The measurement method and evaluation method of the present invention are as follows.

〔防靜電層之厚度測定方法〕 〔Method for measuring thickness of antistatic layer〕

使用J.A.Woollam Japan製之分光橢圓偏振儀「M-2000」進行測定。 The measurement was performed using a spectroscopic ellipsometer "M-2000" manufactured by J.A. Woollam Japan.

〔表面電阻值之評價〕 [Evaluation of surface resistance]

防靜電層之表面電阻值係藉以下方法測定。 The surface resistance of the antistatic layer is measured by the following method.

測定裝置:三菱化學分析股份有限公司製「HIRESTA UP」 Measuring device: "HIRESTA UP" manufactured by Mitsubishi Chemical Analysis Co., Ltd.

測定條件:施加電壓100V,測定時間10秒後,測定值為5次測定之平均值 Measurement conditions: 100V applied voltage, 10 seconds after the measurement time, the measurement value is the average of 5 measurements

〔防靜電層之塗膜性之評價〕 〔Evaluation of the coating properties of the antistatic layer〕

以手指於形成於基材上之防靜電層表面擦拭10次,以下述評價基準於螢光燈下目視判斷膠渣(霧狀)及擦落(脫落)。 Wipe the surface of the antistatic layer formed on the substrate with a finger 10 times, and visually judge the scum (fogging) and rubbing (off) under a fluorescent lamp based on the following evaluation criteria.

A:未變化 B:有霧狀或脫落之任一者 A: No change B: Any of foggy or shedding

〔耐溶劑性之評價〕 〔Evaluation of solvent resistance〕

於旭化成股份有限公司製之BEMCOT(型號:AP-2)中含適量溶劑(MEK),於形成於基材上之防靜電層之表面以約100g/cm2荷重以1往返10cm長度為1秒左右之速度往返擦取20次,在螢光燈下藉以下評價基準目視確認防靜電層有無脫落。 The BEMCOT (model: AP-2) manufactured by Asahi Kasei Co., Ltd. contains an appropriate amount of solvent (MEK), and the surface of the anti-static layer formed on the substrate is about 100g/cm 2 load and 1 round trip 10cm length is 1 second Wipe 20 times back and forth at a speed of left and right, and visually confirm whether the anti-static layer has fallen off under a fluorescent lamp using the following evaluation criteria.

A:無變化 B:有脫落。 A: No change B: Falling off.

〔外覆塗佈性之評價〕 〔Evaluation of coating properties〕

針對各實施例、比較例,於螢光燈下目視確認塗佈有離型劑組成物之面是否因離型劑組成物之稀釋溶劑而於面 狀態產生缺陷(白化、不均或傷痕),或於形成之離型層之面狀態產生缺陷(排斥或條紋)。無上述缺陷者判定為“A”,即使產生一種時亦判斷為“B”。 For each embodiment and comparative example, visually confirm under fluorescent light whether the surface coated with the release agent composition is on the surface due to the diluting solvent of the release agent composition Defects (whitening, unevenness or scars) in the state, or defects (repelling or streaks) in the surface state of the formed release layer. Those without the above-mentioned defects are judged as "A", and even if one type occurs, it is judged as "B".

〔表面粗度之測定〕 〔Determination of surface roughness〕

算術平均粗度Ra及最大突起高度Rp係基於JIS B0601-1994藉以下條件測定。 The arithmetic average roughness Ra and the maximum protrusion height Rp are measured under the following conditions based on JIS B0601-1994.

測定裝置:Veeco公司製之光干涉式表面粗度計「WYKO-1100」 Measuring device: Light interference type surface roughness meter "WYKO-1100" manufactured by Veeco

測定條件:PSI模式,透鏡50倍率 Measurement conditions: PSI mode, lens 50 magnification

〔實施例1〕 [Example 1] (防靜電層之形成) (Formation of anti-static layer)

對於以二甲基亞碸15質量份及水85質量份稀釋水溶性之含羥基聚酯樹脂((B)成分)8.4質量份與PEDOT-PSS((A)成分)0.5質量份而成之稀釋液A(中京油脂股份有限公司製,S-495:固體成分8.2質量%)100質量份,混合由水溶性羥甲基三聚氰胺((C)成分)70質量份與水30質量份所成之三聚氰胺化合物溶液(中京油脂股份有限公司製,P-795:固體成分70.0質量%)1.7質量份,進而於其中添加水與IPA之混合溶劑(質量比1:1),稀釋成固體成分0.6質量%,獲得熱硬化性樹脂組成物之塗佈液。 Diluted water-soluble hydroxyl-containing polyester resin ((B) component) 8.4 mass parts and PEDOT-PSS ((A) component) 0.5 mass parts with 15 mass parts of dimethyl sulfide and 85 mass parts of water Liquid A (manufactured by Zhongjing Oil Co., Ltd., S-495: solid content 8.2% by mass) 100 parts by mass, mixed with melamine composed of 70 parts by mass of water-soluble methylol melamine (component (C)) and 30 parts by mass of water Compound solution (manufactured by Zhongjing Oil & Fat Co., Ltd., P-795: solid content 70.0% by mass), 1.7 parts by mass, and further added with a mixed solvent of water and IPA (mass ratio 1:1), and diluted to 0.6 mass% of solid content, The coating liquid of the thermosetting resin composition is obtained.

於由聚對苯二甲酸乙二酯膜(厚度31μm,塗佈液所 塗佈之面的算術平均粗度Ra 10nm,最大突起高度Rp 80nm)所成之基材上,以使乾燥後膜厚成為15nm之方式均一塗佈該熱硬化性樹脂組成物之塗佈液,於120℃乾燥60秒,形成防靜電層。 It is made of polyethylene terephthalate film (thickness 31μm, coating liquid The coating solution of the thermosetting resin composition is uniformly coated on a substrate made of the coated surface (Ra 10nm in arithmetic average roughness and the maximum protrusion height Rp 80nm) so that the film thickness after drying becomes 15nm, Dry at 120°C for 60 seconds to form an antistatic layer.

(離型層之形成) (Formation of the release layer)

將兩末端三乙烯基改質直鏈狀聚有機矽氧烷、分支狀乙烯基改質有機矽氧烷寡聚物及聚甲基氫矽氧烷之混合物(質量平均分子量:287000)以MEK稀釋為固體成分30質量%。對於該稀釋液100質量份,添加鉑系觸媒(信越化學工業股份有限公司製,PL-50T)2質量份,以MEK調整為固體成分濃度為0.7質量%,獲得加成反應型聚矽氧樹脂組成物之塗佈液。 A mixture of straight-chain polyorganosiloxanes modified with trivinyl groups at both ends, branched vinyl-modified organosiloxane oligomers and polymethylhydrosiloxanes (mass average molecular weight: 287,000) diluted with MEK The solid content is 30% by mass. To 100 parts by mass of the diluent, 2 parts by mass of platinum-based catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., PL-50T) were added, and the solid content concentration was adjusted to 0.7% by mass by MEK to obtain an addition reaction type polysiloxane Coating liquid for resin composition.

所得塗佈液以使乾燥後之膜厚成為單位面積重0.04g/m2之方式以棒塗佈法均一塗佈於防靜電層上之後,於130℃乾燥1分鐘形成離型層,獲得於防靜電層上積層離型層之離型膜。 The obtained coating solution was uniformly coated on the antistatic layer by the bar coating method so that the film thickness after drying became 0.04 g/m 2 per unit area, and then dried at 130°C for 1 minute to form a release layer. The release film of the release layer on the antistatic layer.

〔實施例2〕 [Example 2]

除了調整水與IPA之混合溶劑(質量比1:1)之添加量,將熱硬化性樹脂組成物之塗佈液之固體成分濃度設為1.5質量%,且防靜電層之厚度成為200nm以外,與實施例1同樣實施。 Except for adjusting the addition amount of the mixed solvent of water and IPA (mass ratio 1:1), the solid content concentration of the coating liquid of the thermosetting resin composition is 1.5% by mass, and the thickness of the antistatic layer is 200nm, It was implemented in the same manner as in Example 1.

〔實施例3〕 [Example 3]

除了對於稀釋液A 100質量份,將三聚氰胺化合物溶液之調配量變更為3.5質量份以外,與實施例1同樣實施。 The same procedure as in Example 1 was carried out except for changing the blending amount of the melamine compound solution to 3.5 parts by mass for 100 parts by mass of the diluent A.

〔實施例4〕 [Example 4]

除了調整水與IPA之混合溶劑(質量比1:1)之添加量,將熱硬化性樹脂組成物之塗佈液之固體成分濃度設為1.5質量%,且防靜電層之厚度成為200nm以外,與實施例3同樣實施。 Except for adjusting the addition amount of the mixed solvent of water and IPA (mass ratio 1:1), the solid content concentration of the coating liquid of the thermosetting resin composition is 1.5% by mass, and the thickness of the antistatic layer is 200nm, The same procedure as in Example 3 was carried out.

〔實施例5〕 [Example 5]

除了對於稀釋液A 100質量份,將三聚氰胺化合物溶液之調配量變更為1.45質量份以外,與實施例1同樣實施。 The same procedure as in Example 1 was carried out except that the amount of the melamine compound solution was changed to 1.45 parts by mass for 100 parts by mass of the diluent A.

〔實施例6〕 [Example 6] (防靜電層之形成) (Formation of anti-static layer)

對於以二甲基亞碸15質量份及水85質量份稀釋水溶性之含羥基聚酯樹脂((B)成分)8.4質量份與PEDOT-PSS((A)成分)0.5質量份而成之稀釋液A(中京油脂股份有限公司製,S-495:固體成分8.2質量%)100質量份,混合由水溶性羥甲基三聚氰胺((C)成分)70質量份與水30質量份所成之三聚氰胺化合物溶液(中京油脂 股份有限公司製,P-795:固體成分70.0質量%)1.7質量份,進而於其中添加水與IPA之混合溶劑(質量比1:1),稀釋成固體成分0.6質量%,獲得熱硬化性樹脂組成物之塗佈液。 Diluted water-soluble hydroxyl-containing polyester resin ((B) component) 8.4 mass parts and PEDOT-PSS ((A) component) 0.5 mass parts with 15 mass parts of dimethyl sulfide and 85 mass parts of water Liquid A (manufactured by Zhongjing Oil Co., Ltd., S-495: solid content 8.2% by mass) 100 parts by mass, mixed with melamine composed of 70 parts by mass of water-soluble methylol melamine (component (C)) and 30 parts by mass of water Compound solution (Zhongjing Oil Co., Ltd., P-795: solid content 70.0% by mass) 1.7 parts by mass, and then add a mixed solvent of water and IPA (mass ratio 1:1) to dilute to 0.6 mass% of solid content to obtain a thermosetting resin Composition coating liquid.

於由聚對苯二甲酸乙二酯膜(厚度31μm,塗佈液所塗佈之面的算術平均粗度Ra 10nm,最大突起高度Rp 80nm)所成之基材上,以使乾燥後膜厚成為15nm之方式均一塗佈該熱硬化性樹脂組成物之塗佈液,於120℃乾燥60秒,形成防靜電層。 On a substrate made of a polyethylene terephthalate film (thickness 31μm, arithmetic average roughness of the surface coated by the coating solution Ra 10nm, maximum protrusion height Rp 80nm) to make the film thick after drying The coating solution of the thermosetting resin composition was uniformly applied to a thickness of 15 nm and dried at 120°C for 60 seconds to form an antistatic layer.

(離型層之形成) (Formation of the release layer)

將兩末端三乙烯基改質直鏈狀聚有機矽氧烷、分支狀乙烯基改質有機矽氧烷寡聚物及聚甲基氫矽氧烷之混合物(質量平均分子量:287000)以MEK稀釋為固體成分30質量%。對於該稀釋液100質量份,添加鉑系觸媒(信越化學工業股份有限公司製,PL-50T)2質量份,以MEK調整為固體成分濃度為0.7質量%,獲得加成反應型聚矽氧樹脂組成物之塗佈液。 A mixture of straight-chain polyorganosiloxanes modified with trivinyl groups at both ends, branched vinyl-modified organosiloxane oligomers and polymethylhydrosiloxanes (mass average molecular weight: 287,000) diluted with MEK The solid content is 30% by mass. To 100 parts by mass of the diluent, 2 parts by mass of platinum-based catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., PL-50T) were added, and the solid content concentration was adjusted to 0.7% by mass by MEK to obtain an addition reaction type polysiloxane Coating liquid for resin composition.

所得塗佈液以使乾燥後之膜厚成為單位面積重0.04g/m2之方式以棒塗佈法均一塗佈於與防靜電層相反面之聚對苯二甲酸乙二酯膜上之後,於130℃乾燥1分鐘形成離型層,獲得防靜電層與離型層基層而成之離型膜。 The obtained coating solution was uniformly coated on the polyethylene terephthalate film on the opposite side of the antistatic layer by the bar coating method so that the film thickness after drying became 0.04 g/m 2 per unit area weight, Dry at 130°C for 1 minute to form a release layer to obtain a release film consisting of an antistatic layer and a base layer of the release layer.

〔比較例1〕 [Comparative Example 1]

除了調整水與IPA之混合溶劑(質量比1:1)之添加量,將熱硬化性樹脂組成物之塗佈液之固體成分濃度設為0.5質量%,以使乾燥後膜厚成為10nm之方式塗佈以外,與實施例1同樣形成防靜電層。隨後,與實施例1同樣,於防靜電層上形成離型層。 In addition to adjusting the addition amount of the mixed solvent of water and IPA (mass ratio 1:1), the solid content concentration of the coating liquid of the thermosetting resin composition is set to 0.5% by mass, so that the film thickness after drying becomes 10nm Except for coating, an antistatic layer was formed in the same manner as in Example 1. Subsequently, as in Example 1, a release layer was formed on the antistatic layer.

〔比較例2〕 [Comparative Example 2]

除了調整水與IPA之混合溶劑(質量比1:1)之添加量,將熱硬化性樹脂組成物之塗佈液之固體成分濃度設為2.0質量%,以使乾燥後膜厚成為300nm之方式塗佈以外,與實施例1同樣形成防靜電層。隨後,與實施例1同樣,於防靜電層上形成離型層。 In addition to adjusting the addition amount of the mixed solvent of water and IPA (mass ratio 1:1), the solid content concentration of the coating liquid of the thermosetting resin composition is set to 2.0% by mass, so that the film thickness after drying becomes 300nm Except for coating, an antistatic layer was formed in the same manner as in Example 1. Subsequently, as in Example 1, a release layer was formed on the antistatic layer.

〔比較例3〕 [Comparative Example 3]

除了於稀釋液A中添加水與IPA之混合溶劑(質量比1:1),稀釋為固體成分0.6質量%,獲得樹脂組成物之塗佈液。該樹脂組成物係不含有三聚氰胺化合物(C),不具有熱硬化性者。以使乾燥後膜厚成為15nm之方式於與實施例1同樣之基材上塗佈樹脂組成物之塗佈液,在120℃乾燥60秒,形成防靜電層。隨後,與實施例1同樣,於防靜電層上形成離型層。 Except for adding a mixed solvent of water and IPA (mass ratio 1:1) to diluent A, it is diluted to 0.6% by mass of solid content to obtain a coating liquid of a resin composition. This resin composition system does not contain a melamine compound (C) and does not have thermosetting properties. The coating liquid of the resin composition was coated on the same substrate as in Example 1 so that the film thickness after drying became 15 nm, and dried at 120° C. for 60 seconds to form an antistatic layer. Subsequently, as in Example 1, a release layer was formed on the antistatic layer.

〔比較例4〕 [Comparative Example 4]

於含有以質量比45:20:10之比例含有二季戊四醇 六丙烯酸酯、二季戊四醇三丙烯酸酯及N-乙烯基吡咯啶酮之丙烯酸系單體混合物75質量份、乙酸丁酯20質量份及IPA 30質量份之黏合劑溶液125質量份中,混合以1.3質量%之比例含有PEDOT-PSS之水溶液15.5質量份及α-羥基環己基苯基甲酮(光起始劑)0.2質量份,進而以IPA稀釋至丙烯酸系單體混合物及PEDOT-PSS之合計量為2.5質量%,獲得光硬化型樹脂組成物之塗佈液。 It contains dipentaerythritol in a mass ratio of 45:20:10 75 parts by mass of acrylic monomer mixture of hexaacrylate, dipentaerythritol triacrylate and N-vinylpyrrolidone, 20 parts by mass of butyl acetate, and 30 parts by mass of IPA in 125 parts by mass of the binder solution, mixed to 1.3 The ratio of mass% contains 15.5 parts by mass of PEDOT-PSS aqueous solution and 0.2 parts by mass of α-hydroxycyclohexyl phenyl ketone (photoinitiator), and then diluted with IPA to the total amount of acrylic monomer mixture and PEDOT-PSS At 2.5% by mass, a coating liquid for a photocurable resin composition was obtained.

將該光硬化型樹脂組成物之塗佈液於與實施例1同樣之基材上以使乾燥後之膜厚成為100nm之方式均一塗佈,在70℃乾燥60秒後,照射光量200mJ/cm2之紫外線,形成防靜電層。隨後與實施例1同樣,於防靜電層上形成離型層。 The coating liquid of the photocurable resin composition was uniformly coated on the same substrate as in Example 1 so that the film thickness after drying became 100nm, and after drying at 70°C for 60 seconds, the amount of light irradiated was 200mJ/cm 2. Ultraviolet rays form an anti-static layer. Subsequently, as in Example 1, a release layer was formed on the antistatic layer.

〔比較例5〕 [Comparative Example 5]

以IPA將四乙氧基矽烷之部分水解物(COLCOAT公司製,N-103X)稀釋成固體成分0.6質量%,作成樹脂塗佈液。將該樹脂塗佈液以使乾燥後之膜厚成為70nm之方式均一塗佈於與實施例1同樣之基材上,在120℃乾燥60秒,形成防靜電層。隨後,與實施例1同樣,於防靜電層上形成離型層。 The partial hydrolysate of tetraethoxysilane (manufactured by COLCOAT, N-103X) was diluted with IPA to a solid content of 0.6% by mass to prepare a resin coating liquid. This resin coating liquid was uniformly applied on the same substrate as in Example 1 so that the film thickness after drying became 70 nm, and dried at 120° C. for 60 seconds to form an antistatic layer. Subsequently, as in Example 1, a release layer was formed on the antistatic layer.

Figure 105104617-A0202-12-0024-1
Figure 105104617-A0202-12-0024-1

※又,表1中,(A)成分(PEDOT-PSS)之質量份表示相對於(B)成分100質量份的質量份。(C)成分(三聚氰胺化合物)之質量份表示相對於(A)成分與(B)成分之合計100質量份之質量份。 ※In Table 1, the parts by mass of (A) component (PEDOT-PSS) indicate parts by mass relative to 100 parts by mass of (B) component. (C) The mass part of the component (melamine compound) means the mass part with respect to the total of 100 mass parts of (A) component and (B) component.

以上實施例1~5中,於平滑基材上,藉由含PEDOT-PSS之水性熱硬化性樹脂組成物,形成特定厚度之防靜電層,離型膜之防靜電性能良好,並且防靜電層之塗膜性、耐溶劑性、外覆塗佈性良好。又,由於可確保防靜電層表面之平滑性,故可使形成於防靜電層上之離型層之算術平均粗度Ra或最大突起高度Rp變低,可確保離型層之平滑性。再者,實施例6中,係於基材之與設置防靜電層之面相反側之面上設置離型層者,但可使各種性能良好。 In the above examples 1 to 5, the water-based thermosetting resin composition containing PEDOT-PSS is used to form an antistatic layer with a specific thickness on a smooth substrate. The release film has good antistatic performance and an antistatic layer The film has good film resistance, solvent resistance, and coating properties. In addition, since the smoothness of the surface of the antistatic layer can be ensured, the arithmetic average thickness Ra or the maximum protrusion height Rp of the release layer formed on the antistatic layer can be lowered, and the smoothness of the release layer can be ensured. Furthermore, in Example 6, a release layer is provided on the surface of the substrate opposite to the surface on which the antistatic layer is provided, but various properties can be improved.

另一方面,比較例1之離型膜,由於防靜電層較薄,表面電阻值高,無法具有充分之抗靜電性能,耐溶劑性或外覆塗佈性亦不充分。且,比較例2中,防靜電層太厚, 故無法確保防靜電層表面之平滑性,離型層之表面粗度亦變大。 On the other hand, the release film of Comparative Example 1 cannot have sufficient antistatic performance due to its thin antistatic layer and high surface resistance, as well as insufficient solvent resistance or overcoatability. Moreover, in Comparative Example 2, the antistatic layer is too thick, Therefore, the smoothness of the surface of the antistatic layer cannot be ensured, and the surface roughness of the release layer becomes larger.

再者,比較例3、4中,由於樹脂組成物並非水性熱硬化性,故耐溶劑性、外覆塗佈性不充分,且(A)成分產生凝集無法充分確保平滑性。且比較例5之離型膜係防靜電層不含有(A)成分者,防靜電層之耐溶劑性及外覆塗佈性差,並且離型層表面粗度增大無法充分確保平滑性。 Furthermore, in Comparative Examples 3 and 4, since the resin composition is not water-based thermosetting, the solvent resistance and the overcoatability are insufficient, and the (A) component aggregates and cannot sufficiently ensure smoothness. In addition, if the antistatic layer of the release film system of Comparative Example 5 does not contain the component (A), the antistatic layer has poor solvent resistance and overcoatability, and the surface roughness of the release layer is increased and the smoothness cannot be sufficiently ensured.

10A‧‧‧離型膜 10A‧‧‧Release film

11‧‧‧基材 11‧‧‧Substrate

11A‧‧‧一側之面 11A‧‧‧One side surface

12‧‧‧防靜電層 12‧‧‧Anti-static layer

13‧‧‧離型層 13‧‧‧Release layer

Claims (7)

一種離型膜,其係具備基材、於前述基材之一側的面上所設置之防靜電層、與於前述防靜電層之上、或前述基材之另一側的面上所設置之離型層,其特徵為,前述基材之一側的面,係算術平均粗度Ra為15nm以下,最大突起高度Rp為150nm以下,同時前述防靜電層係將含有聚噻吩系導電性高分子(A)之水性熱硬化性樹脂組成物硬化而得者,同時前述防靜電層的厚度為12~250nm,前述水性熱硬化性樹脂組成物,係進一步含有含羥基之聚酯樹脂(B)、與三聚氰胺化合物(C),前述水性熱硬化性樹脂組成物,係相對於聚噻吩系導電性高分子(A)及含羥基之聚酯樹脂(B)之合計100質量份而言,含有8~35質量份的三聚氰胺化合物(C)。 A release film comprising a substrate, an antistatic layer provided on one side of the substrate, and an antistatic layer provided on the antistatic layer or on the other side of the substrate The release layer is characterized in that the arithmetic average roughness Ra of one side of the substrate is 15nm or less, the maximum protrusion height Rp is 150nm or less, and the antistatic layer contains polythiophene with high conductivity The water-based thermosetting resin composition of molecule (A) is cured, and the thickness of the antistatic layer is 12~250nm. The water-based thermosetting resin composition further contains hydroxyl-containing polyester resin (B) , And the melamine compound (C), the aforementioned water-based thermosetting resin composition, based on the total 100 parts by mass of the polythiophene-based conductive polymer (A) and the hydroxyl-containing polyester resin (B), contains 8 ~35 parts by mass of the melamine compound (C). 如請求項1之離型膜,其中前述離型層係設置於前述防靜電層之上。 The release film of claim 1, wherein the release layer is disposed on the antistatic layer. 如請求項1或2之離型膜,其中前述離型層的算術平均粗度Ra係未達10nm、最大突起高度Rp係未達100nm。 Such as the release film of claim 1 or 2, wherein the arithmetic average roughness Ra of the aforementioned release layer is less than 10 nm, and the maximum protrusion height Rp is less than 100 nm. 如請求項1或2之離型膜,其中前述水性熱硬化性樹脂組成物,係相對於含羥基之聚酯樹脂(B)100質量份而言,含有0.5~50質量份的聚噻吩系導電性高分子(A)。 The release film of claim 1 or 2, wherein the aforementioned water-based thermosetting resin composition contains 0.5-50 parts by mass of polythiophene-based conductive material relative to 100 parts by mass of hydroxyl-containing polyester resin (B)性polymer (A). 如請求項1或2之離型膜,其中三聚氰胺化合物 (C)係羥甲基三聚氰胺。 Such as the release film of claim 1 or 2, in which the melamine compound (C) is methylol melamine. 如請求項1或2之離型膜,其中前述聚噻吩系導電性高分子(A)係聚乙烯二氧噻吩與聚苯乙烯磺酸酯的混合物。 The release film of claim 1 or 2, wherein the aforementioned polythiophene-based conductive polymer (A) is a mixture of polyethylene dioxythiophene and polystyrene sulfonate. 如請求項1或2之離型膜,係使用於陶瓷生片之製造步驟用。 For example, the release film of claim 1 or 2 is used in the manufacturing steps of ceramic green sheets.
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