KR100734760B1 - Antistatic releasable film and Antistatic adhesive releasable film using it and Method for production thereof - Google Patents

Abstract

The present invention relates to an antistatic peeling film, an antistatic adhesive peeling film using the same, and a method for manufacturing the same, and more particularly, to support and fix an article during processing and packaging of electronic components, and after the processing is completed, by simple heating. The present invention relates to a functional transparent antistatic peeling film, an antistatic adhesive peeling film using the same, and a method of manufacturing the same, which can be easily peeled off by losing the antistatic effect.

Description

Antistatic peeling film, antistatic adhesive peeling film using same and manufacturing method thereof {Antistatic releasable film and Antistatic adhesive releasable film using it and Method for production etc}

1 is a cross-sectional view of the first pressure-sensitive adhesive release film is applied a transparent antistatic coating layer according to the present invention.

Figure 2 is a cross-sectional view of the antistatic adhesive release film laminated to the first adhesive release film of the second antistatic release film is applied a transparent antistatic coating layer according to the present invention.

<Description of the symbols for the main parts of the drawings>

10, 40: base film 20, 50: conductive layer

30: adhesive release layer 60: release layer

100: first adhesive release film 200: second antistatic release film

300: antistatic adhesive release film

The present invention relates to an antistatic peeling film, an antistatic adhesive peeling film using the same, and a method for manufacturing the same, and more particularly, to support and fix an article during processing and packaging of electronic components, and by simple heating after processing is completed. The present invention relates to a functional transparent antistatic peeling film, an antistatic adhesive peeling film using the same, and a method of manufacturing the same, which can be easily peeled off by losing the adhesive strength.

Recently, due to the rapid development of the electronic industry, along with the miniaturization of electronic devices, surface-mounted components having high mounting density of electronic components have increased, and their sizes have also been miniaturized. In particular, products such as dicing or deferred polishing of semiconductor wafers, laminated thin film ceramic capacitors (MLCC), ferrite beads, resistors, etc. are using adhesive release films as carrier films when forming products due to the simplification of processes and high efficiency.

In the conventional electronic component manufacturing process, adhesives and waxes have been used for temporary fixing of parts for processing parts, but a lot of manual work and time are required for peeling work, and it is easy to damage parts and removes wax and adhesive after peeling. There is a problem such as the need for a cleaning operation to make the adhesive tape or adhesive sheet is used a lot.

Unlike adhesives, adhesive films such as adhesive tapes or adhesive sheets do not require drying, curing, etc., and they can be easily obtained by simply pressing them, and they can be applied in various fields. It is used. Such adhesive sheets are often peeled off after use in processes such as electronic component factories. In such cases, a strong adhesive force at the time of use and an easily peelable adhesive sheet after use, that is, a product having excellent adhesiveness and peelability are required. have.

Recently, various methods for solving such problems have been developed. For example, adhesive peeling films have been developed to have a necessary adhesive strength during use but to remove adhesive strength after use.

The method of removing the adhesive strength after processing by bonding in the electronic component process is to irradiate UV to harden the adhesive by chemical change and to lose the adhesive force, and to expand the foaming agent by heating by adding a foaming agent which is expanded by heat to the adhesive. There is a method of losing the adhesive force by reducing the contact area with the adherend.

Heat-peelable adhesive peeling film is Korean Patent Registration Publication No. 10-0328236, Republic of Korea Patent Publication No. 2004-0027483, 2003-0082361, 2005-0062451, etc. Japanese Patent Laid-Open No. 56-61468, 56-61469 Etc. are proposed.

However, the pressure-sensitive adhesive release film produced by the above proposal has an effect of losing the adhesive strength at the time of use and the adhesive strength after use, but the antistatic function effect is in a state of no effect. With the recent miniaturization of electronic components, not only excellent adhesive strength is required when supporting electronic components, but also excellent peeling functions when peeling and an antistatic effect are urgently required. This is because if there is no charging effect when the electronic component is peeled off, dust or fine particles may adhere to the surface of the electronic component. In particular, when the conventional heat-peelable pressure-sensitive adhesive peeling film is used for dicing or deferred polishing of a semiconductor wafer, a large number of very fine contaminants that cannot be visually recognized remain on the surface of the semiconductor wafer during peeling, which is not suitable for practical use. This can happen. In this regard, the antistatic function is emerging as an important issue.

The present invention has been made to complement the vulnerability to the static electricity of the conventional adhesive peeling film and the adhesiveness of the existing antistatic peeling film, the object of the present invention is to fix and support the parts or packaging materials applicable to the semiconductor and electronic industry The adhesive peeling film used has a strong adhesive force at first to support the parts, and the adhesive force is easily dissipated by simple heating after the parts are processed, which not only has excellent peeling characteristics but also prevents adhesion from foreign substances due to electrostatic phenomenon during peeling. The present invention provides an antistatic release film that minimizes excellent peeling workability and defect rate, an antistatic adhesive release film using the same, and a method of manufacturing the same.

In order to achieve the above object, the present invention provides an antistatic release film comprising a conductive layer formed on at least one side of the base film, and a release layer formed on the conductive layer.

The present invention also includes a first pressure-sensitive adhesive release film, the conductive layer is formed on at least one surface of the base film, the pressure-sensitive adhesive release layer formed on the conductive layer; A conductive layer is formed on at least one side of the base film, and includes a second antistatic release film having a release layer formed on the conductive layer, wherein the second antistatic release film is attached to the first adhesive release film. It provides an antistatic adhesive release film.

In another aspect, the present invention is to form a conductive layer by coating a conductive polymer composition on at least one side of the base film, and to form a pressure-sensitive adhesive layer by coating an adhesive release composition on the conductive layer and to prepare a first adhesive release film; ; Coating a conductive polymer composition on at least one side of the base film to form a conductive layer, and coating a silicone resin coating liquid on the conductive layer to form a peeling layer to produce a second antistatic peeling film; It provides a method for producing an antistatic adhesive release film comprising the step of attaching the second antistatic release film to the first adhesive release film.

The present invention supports and secures an article during processing and packaging of electronic components, and after finishing processing, the adhesive force can be easily peeled off by simple heating or UV (ultraviolet rays) and additionally has an antistatic effect. It relates to an antistatic adhesive release film.

Referring to FIG. 1, a conductive polymer composition is coated on at least one surface of the base film 10 to form a conductive layer 20, that is, an antistatic layer, and an adhesive peeling layer is coated on the conductive layer 20. The first adhesive release film 100 may be manufactured by forming the 30. Referring to FIG. 2, a conductive polymer composition is coated on at least one surface of the base film 40 to form a conductive layer 50, and a release layer 60 is coated by coating a silicone resin coating liquid on the conductive layer 50. By forming the second antistatic peeling film 200 can be produced. The second antistatic release film 200 may be attached to the first adhesive release film 100 to manufacture an antistatic adhesion release film 300 according to the present invention.

The conductive layers 20 and 50 of the first adhesive release film 100 and the second antistatic release film 200 of the present invention may be made of an antistatic transparent conductive polymer composition. 30 weight percent, 2-25 weight percent thermosetting binder, 20-40 weight percent water, 40-70 weight percent organic solvent, and 0.1-5 weight percent silane coupling agent.

If the content of the conductive polymer is less than 5% by weight may increase the surface resistance, when the content of more than 30% by weight may be excellent surface resistance but transparency may decrease. In the case of the thermosetting binder, the adhesive force decreases when the content is less than 2 wt%, and when the content exceeds 25 wt%, the adhesive force is excellent but the surface resistance may increase. In addition, in the case of the silane coupling agent, if the content is less than 0.1% by weight, the adhesive force between the conductive layer and the adhesive layer may decrease, and when the content of the silane coupling agent exceeds 5% by weight, the surface resistance may increase.

As the conductive polymer, polyaniline, polypyrrole, polythiophene, poly (3,4-ethylenethiophene, derivatives or copolymers thereof, and? -Conjugated water-soluble or organic solvent-soluble electrically conductive polymers may be used.

Examples of the organic solvent include polar organic solvents such as dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methyl-2-pyrrolidone (NMP), 2-butanone and 4-methyl-2-pentanone; Alcohol, such as methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol, t-butyl alcohol, benzyl alcohol, ethylene glycol, etc. can be illustrated, Preferably DMSO, NMP, isopropyl alcohol is used. These organic solvents can be used individually or in mixture of 2 or more types.

As the thermosetting binder, a water-soluble binder or a solvent type binder can be used. As an example of such a binder, a polymer binder that can be used with a curing agent such as a melamine curing agent or an epoxy curing agent may be used as an acrylic binder, a urethane binder, a urethane-acrylic binder, an ester binder, an ether binder, or an epoxy binder type. Acrylic binders are preferred.

The silane coupling agent is commercially available from Shin-Etsu, Dow Corning Co., Ltd .. The structure of the silane coupling agent has a form of X-Si-OR, where X is mainly a vinyl group, an epoxy group, an amino group, and a methacryl group. , A mercapto group, and the like, and OR represents a methoxy group and an ethoxy group. Examples of the silane coupling agent include vinyltrichloro silane, vinyltrimethoxy silane, vinyltriethoxy silane, γ-glycidoxypropyl trimethoxysilane. ), γ-methacryloxypropyl trimethoxysilane, γ-methacryloxypropyl methyl dimethoxysilane, γ-methacryloxypropyl methyl dimethoxysilane, γ-methacryloxypropyl trimethoxysilane methacryloxypropyl methyl diethoxysilane) and γ-amino propyl trimethoxy silane, and preferably γ-glycidoxypropyl trimethoxysilane of Shin-Etsu Co., Ltd. (Japan). and γ-methacryloxypropyl trimethoxysilane.

As the base film of the present invention, a film formed of polyolefin such as polypropylene and polyethylene, polyester such as polyethylene terephthalate, polystyrene, polyamide, polycarbonate, polyacetal, mixtures and copolymers thereof can be used. Preferably, a polyester film and a polyolefin film are suitable.

As the composition of the pressure-sensitive adhesive layer 30 of the first pressure-sensitive adhesive peeling film 100, 0.1 to 5 parts by weight of the curing agent, 10 to 50 parts by weight of the thermal expansion blowing agent, 0.05 to 20 parts by weight of the antistatic agent, The pressure-sensitive adhesive peeling composition containing 0.1 to 5 parts by weight of the silane coupling agent and 40 to 300 parts by weight of the organic solvent can be used.

When the content of the thermal expansion blowing agent is less than 10 parts by weight, the peeling effect may be reduced, and when it exceeds 50 parts by weight, the peeling property may be excellent but the adhesive strength may be reduced. If the antistatic agent is less than 0.05 parts by weight may increase the surface resistance, and if it exceeds 20 parts by weight, the surface resistance is excellent but the adhesion and peeling force may be reduced.

As the functional adhesive, low molecular weight compounds having an unsaturated carbon bond are used. Specific examples thereof include butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, stearyl methacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4 -Butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, acrylamide, glycidyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate Latex, 2-hydroxy butyl acrylate, 2-hydroxybutyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate and oligoester acrylate and the like are used, and an acrylate including a hydroxyl group for reactivity Or polymerizable compounds such as methacrylate may be used. In addition, peroxides such as benzoyl peroxide, which is a reaction promoter, may be used to increase adhesion. In addition, polyvinyl butyral resin, polyvinylacetate resin, polyvinyl alcohol resin, polyurethane, rubber-based resin and the like can be added and used.

As a hardening | curing agent, 1 type, or 2 or more types of compound can be mixed and used out of an isocyanate type, a methylol type, and an epoxy type crosslinking agent.

The organic solvent may be used by dissolving in toluene, xylene, ethyl acetate and at least one solvent selected from alcohols such as ethanol, methanol, isopropanol and propanol.

The antistatic agent is an ion-complex type antistatic agent and includes all alkali metal salts, i.e., all salts of Li, Na, and K. More specifically, LiPF ₆ , LiBF ₄ , LiSbF ₆ , LiClO ₄ , LiCF ₃ SO ₃ , LiAsF ₆ , LiC (CF ₃ SO ₃ ) ₃ , LiN (CF ₃ SO ₃ ) ₂ , LiI, LiBr, LiCl, LiF, NaPF ₆ , NaClO ₄ , NaI, NaSCN, KSCN, KPF ₆ , KClO _4, etc. The cation-ion conductive material and anion-ion conductive material prepared using all metal salts including Fe, Ni, Cu, Zn and the like alone or in a mixture.

As the silane coupling agent, silane coupling agents included in the conductive layers 20 and 50 may be used.

Examples of the thermally expandable blowing agent include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, and polyvinyl chloride such as isobutane, propane, and pentane. It may be a thermally expandable microsphere encapsulated by forming an envelope with at least one material selected from the group consisting of vinylidene chloride and polystyrene. The thermally expandable microspheres may have a size of 1 to 100 μm. For example, it is preferable to use the ADVACELL series of Sekisui, Japan and the microsphere F-50D of Matsumoto (Japan).

In the second antistatic peeling film 200 of the present invention, as the composition of the peeling layer 60, a commercially available aqueous or oily silicone resin may be used, and 0.01 to 10 weight of a silane coupling agent is added to the silicone resin. A submixed silicone resin coating liquid can be used.

The present invention will be described in more detail with reference to the following Examples. However, the following examples are only preferred examples of the present invention, and the present invention is not limited to the following examples.

Of the first adhesive release film Production Example

<Example 1>

10 wt% poly (3,4-ethylenedioxythiophene) (Baytron PH), 5 wt% acrylic-urethane copolymer binder (Stahl Asia Pte Ltd., WF-4644), 30 wt% water, 49.7 wt% isopropyl alcohol , 2% by weight of N-methyl-2-pyrrolidone, 3% by weight of dimethyl sulfoxide, and 0.3% by weight of a silane coupling agent (KBM503, Shin-Etsu, Japan) were combined to prepare a conductive coating solution.

The conductive coating solution was coated on a polyester (PET) film with a thickness of 0.8 μm (after drying) by gravure coating and thermally cured at 80-100 ° C. for 2 minutes to form a conductive layer on the PET film. The surface resistance of the PET film on which the conductive layer was formed was 2 × 10 ⁵ Pa / sq.

45% by weight butyl acrylate, 5% by weight 2-ethylhexyl acrylate, 20% by weight methyl methacrylate, 5% by weight lauryl acrylate, 5% by weight hydroxyethyl methacrylate and 5% by weight acrylic acid, polyvinyl 3 parts by weight of a toluene diisocyanate curing agent, 100 parts by weight of an acrylic adhesive prepared by containing 15% by weight of butyral resin (sekisui Co. Japan, BL-SH), thermally expandable foaming agent (Matsumoto, Japan, micro spare F-50D) 40 parts by weight, 1 part by weight of antistatic agent (ELECON-100ED, Nanochem Tech), 0.1 part by weight of silane coupling agent (KBM503, Shin-Etsu, Japan) to 100 parts by weight of mixed solvent of toluene and ethyl acetate (50:50) The adhesive peeling composition was prepared by mixing.

The pressure-sensitive adhesive peeling composition was coated on the conductive layer of the PET film on which the conductive layer was formed by a comma coating method, and heated and dried at a temperature of 80 ° C. or lower to prepare a first pressure-sensitive adhesive peeling film.

<Example 2>

A first adhesive peeling film was prepared under the same conditions as in Example 1 except that the silane coupling agent was not used in the adhesive peeling composition.

<Example 3>

A first adhesive peeling film was prepared under the same conditions as in Example 1 except that the antistatic agent was not used in the adhesive peeling composition.

Comparative Example 1

3 parts by weight of a toluene diisocyanate curing agent to 100 parts by weight of an acrylic pressure sensitive adhesive consisting of 65% by weight of butyl acrylate, 30% by weight of methyl methacrylate, and 5% by weight of acrylic acid, and a mixed solvent of toluene and ethyl acetate (50:50) Mixing by 100 parts by weight to prepare a primer coating solution. The primer coating solution was coated on a polyester (PET) film by a comma coating method and thermally cured at 80-100 ° C. for 2 minutes to form a primer layer. The film on which the primer layer was formed exhibited the properties of the insulator.

45% by weight butyl acrylate, 5% by weight 2-ethylhexyl acrylate, 20% by weight methyl methacrylate, 5% by weight lauryl acrylate, 5% by weight hydroxyethyl methacrylate and 5% by weight acrylic acid, polyvinyl 3 parts by weight of a toluene diisocyanate curing agent, 100 parts by weight of an acrylic adhesive prepared by containing 15% by weight of butyral resin (sekisui Co. Japan, BL-SH), thermally expandable foaming agent (Matsumoto, Japan, micro spare F-50D) 40 parts by weight was mixed with 100 parts by weight of a mixed solvent of toluene and ethyl acetate (50:50) to prepare an adhesive peeling composition.

The adhesive peeling composition was coated on the primer layer of the film on which the primer layer was formed by a comma coating method, and heated and dried at a temperature of 80 ° C. or lower to prepare a first adhesive peeling film.

Surface resistance of the first pressure-sensitive adhesive peeling film prepared in Examples 1 to 3 and Comparative Example 1 was measured under the conditions of 55% RH, 23 ℃, applied voltage 500V according to the ASTM-D257 measuring method, the adhesive force is TMD-20M model According to JIS-Z0237, the measurement was carried out at a peel rate of 300 m / min at a humidity of 65% RH and 23 ° C., and the adhesive force after heating at 120 ° C. for 5 minutes was measured. These physical property test results are shown in Table 1 below.

Example 1 Example 2 Example 3 Comparative Example 1 Surface resistance before heating (Ω / sq.) 10 ⁶ 10 ⁶ 10 ⁷ to 10 ⁸ Insulator Adhesive force before heating (g / 25 mm) 840 820 840 830 Surface resistance after heating (Ω / sq.) 10 ⁷ to 10 ⁸ 10 ⁷ to 10 ⁸ 10 ⁹ Insulator Adhesive force before heating (g / 25 mm) 0 0 0 0

As can be seen in Examples 1 to 3 and Comparative Example 1, the first adhesive peeling film according to the present invention is excellent charging while showing similar properties and peeling properties before and after heating as compared to the conventional adhesive peeling film It can be seen that the effect is shown. Therefore, it can be seen that the defect rate for the electrostatic phenomenon can be minimized when the electronic component is peeled off using the adhesive release film of the present invention.

Of the second antistatic release film Production Example

<Example 4>

10 wt% poly (3,4-ethylenedioxythiophene) (Baytron PH), 5 wt% acrylic-urethane copolymer binder (Stahl Asia Pte Ltd., WF-4644), 30 wt% water, 49.7 wt% isopropyl alcohol , 2% by weight of N-methyl-2-pyrrolidone, 3% by weight of dimethyl sulfoxide, and 0.3% by weight of a silane coupling agent (KBM503, Shin-Etsu, Japan) were combined to prepare a conductive coating solution.

The conductive coating solution was coated on a polyester (PET) film with a thickness of 0.8 μm (after drying) by gravure coating and thermally cured at 80-100 ° C. for 2 minutes to form a conductive layer on the PET film. The surface resistance of the PET film on which the conductive layer was formed was 2 × 10 ⁵ Pa / sq.

Silicon-based LS-203 (Dow Corning) 100 parts by weight of the catalyst, Sil-off 2000 (Dow Corning) 0.75 parts by weight, solvent toluene 500 parts by weight, silane coupling agent (KBM503, Shin-Etsu, Japan) 0.3 A release composition was prepared by blending parts by weight.

The release composition was coated on the conductive layer of the film on which the conductive layer was formed at a coating speed of 70 m / min, and dried for 3 to 5 minutes under a drying temperature of 85 to 100 ° C. to prepare a second antistatic release film.

Example 5

A second antistatic release film was prepared under the same conditions as in Example 4 except that the silane coupling agent was not used in the release composition.

<Example 6>

A second antistatic release film was prepared under the same conditions as in Example 4 except that 1 part by weight of an antistatic agent (ELECON-100ED, Nanochem Tech) was added to the release composition.

Comparative Example 2

A silane coupling agent (KBM503, Shin-Etsu, Japan) instead of the conductive coating layer is a primer (Syl-off) 2000 (Dow) catalyst based on 100 parts by weight of silicone resin LS-203 (Dow Corning) on a polyester (PET) film Corning) 0.75 parts by weight, solvent toluene 500 parts by weight, silane coupling agent (KBM503, Shin-Etsu, Japan) 0.3 parts by weight of the release coating solution prepared by mixing the coating speed 70m / min, drying temperature 85 ℃ ~ 100 ℃ conditions It was dried for 3 to 5 minutes under to prepare a second antistatic peeling film.

The evaluation method for the performance of the second antistatic peeling film prepared in Examples 4 to 6 and Comparative Example 2 was performed by the following method.

1. Peelability Evaluation Method

The standard adhesive tape is pressed onto the silicone-coated film under certain conditions and aged under certain conditions to measure the strength (peel strength) required to peel off the adhesive tape.

2. Residual adhesion rate

As the pressure-sensitive adhesive comes into contact with the siliconized surface for release paper, the silicone may shift to change the adhesive force of the adhesive. As a method for evaluating this, a standard adhesive tape is attached to a siliconized surface for release paper, aged under certain conditions, and the adhesive force (A1) after peeling off from the siliconized surface and the adhesive force (A2) of the adhesive tape not in contact with the silicon surface are measured. Residual adhesion rate is represented by the following equation (1). Residual Adhesion Rate (%) = (A1 / A2) × 100

3. Adhesiveness

As a method of measuring the adhesion between the silicone release layer and the PET film, after rubbing strongly 5-10 times with a finger, the degree of detachment of the silicon layer is visually confirmed. If there is no change on the surface of the release layer at the time of confirmation, it is regarded as defective if it turns out to be good or cloudy or if the detachment of the silicon layer is visible.

4. Surface Resistance

According to ASTM-D257 measuring method, it measured under the conditions of 55% RH, 23 degreeC, and the applied voltage 500V.

The measurement results are shown in Table 2 below.

Example 4 Example 5 Example 6 Comparative Example 2 Peeling force (g / 25mm) 55 51 53 50 Residual Adhesion (%) 96 93 94 94 Adhesion Good Good Good Good Surface resistance (Ω / sq.) 10 ⁸ to 10 ⁹ 10 ⁸ to 10 ⁹ 10 ⁷ to 10 ⁸ Isolation

As can be seen in Examples 4 to 6 and Comparative Example 2, the second antistatic peeling film of the present invention has excellent peeling force, residual adhesive strength, adhesion characteristics compared to the conventional peeling film, while showing an excellent antistatic effect Could show. Therefore, it can be seen that the failure rate for the electrostatic phenomenon using the release film can be minimized.

Of antistatic adhesive release film Production Example

<Example 7>

An antistatic adhesive release film was prepared by attaching the second antistatic release film prepared in Example 4 to the first adhesive release film prepared in Example 1.

<Example 8>

An antistatic adhesive release film was prepared by attaching the second antistatic release film prepared in Example 5 to the first adhesive release film prepared in Example 1.

Example 9

An antistatic adhesive release film was prepared by attaching the second antistatic release film prepared in Example 6 to the first adhesive release film prepared in Example 1.

Comparative Example 3

An adhesive release film was prepared by attaching the second antistatic release film prepared in Example 4 to the first adhesive release film prepared in Comparative Example 1.

<Comparative Example 4>

An adhesive release film was prepared by attaching the second antistatic release film prepared in Example 6 to the first adhesive release film prepared in Comparative Example 1.

Comparative Example 5

A pressure-sensitive adhesive release film was prepared by attaching the second antistatic release film prepared in Comparative Example 2 to the first pressure-sensitive adhesive release film prepared in Comparative Example 1.

Friction vs. voltage (tribo) measurements of the antistatic adhesive release films prepared in Examples 7 to 9 and Comparative Examples 3 to 5 were carried out. The measuring device used SIMCO-FMX002 (SIMCO CO.) Model, the purpose of measurement is an antistatic adhesive peeling film with an antistatic peeling film according to the present invention and an adhesive peeling film with a peeling film without a conventional antistatic function This is to compare the friction vs. voltage against the electrostatic effect when peeling off. The measurement results are shown in Table 3 below.

Example 7 Example 8 Example 9 Comparative Example 3 Comparative Example 4 Comparative Example 5 First adhesive release film Example 1 Example 1 Example 1 Comparative Example 1 Comparative Example 1 Comparative Example 1 2nd antistatic release film Example 4 Example 5 Example 6 Example 4 Example 6 Comparative Example 2 Friction vs Voltage (V) <10 <10 <5 <300 <150 <1700

As shown in Table 3, the antistatic adhesive release film prepared by attaching the antistatic second antistatic release film to the antistatic first adhesive release film according to the present invention and the adhesive release films of Comparative Examples 3 to 5 were compared. When the antistatic adhesive peeling film according to the present invention was found to show a very excellent anti-voltage effect.

The antistatic peeling film according to the present invention exhibits excellent antistatic effect while showing similar characteristics of peeling force, residual adhesive force, and adhesive properties as compared with the conventional peeling film. In addition, the antistatic adhesive peeling film having the second antistatic peeling film is adhered to the antistatic adhesive peeling film to prevent the removal of the second antistatic peeling film, there is no electrostatic phenomenon is excellent in the high voltage effect, the first from dust or dirt In addition to protecting the adhesive peeling film, the antistatic adhesive peeling film according to the present invention has a strong adhesive force at first, supports the parts, and easily peels off by simple heating after processing the parts, thereby showing excellent peeling characteristics. By preventing adhesion from foreign substances due to electrostatic phenomena when peeling off electronic components, it is possible to minimize the excellent peeling workability and the defective rate, thereby increasing productivity and improving work efficiency.

Claims (11)

delete delete A conductive layer formed on at least one side of the base film and a release layer formed on the conductive layer, An antistatic release film, characterized in that the release layer is made of a silicone resin coating solution in which 0.01 to 10 parts by weight of a silane coupling agent is added to an aqueous or oily silicone resin. A first adhesive peeling film in which a conductive layer is formed on at least one surface of a base film, and the adhesive peeling layer was formed on the said conductive layer, A conductive layer is formed on at least one side of the base film, and includes a second antistatic release film having a release layer formed on the conductive layer. The antistatic adhesive release film, characterized in that the second antistatic release film is attached to the first adhesive release film. The method of claim 4, wherein the conductive layer of the first adhesive peeling film and the conductive layer of the second antistatic peeling film is 5 to 30% by weight of the conductive polymer, 2 to 25% by weight of the thermosetting binder, 20 to 40% by weight of water, An antistatic adhesive release film comprising an electrically conductive polymer composition comprising 40 to 70% by weight of an organic solvent and 0.1 to 5% by weight of a silane coupling agent. The pressure-sensitive adhesive release layer of claim 1, wherein the pressure-sensitive adhesive release layer of the first pressure-sensitive adhesive release film is 0.1 to 5 parts by weight of a curing agent, 10 to 50 parts by weight of a thermal expansion foaming agent, 0.05 to 20 parts by weight of an antistatic agent, and a silane coupling agent of 0.1 to 100 parts by weight of a functional adhesive. An antistatic adhesive release film comprising a pressure-sensitive adhesive peeling composition comprising from 5 parts by weight to 5 parts by weight and an organic solvent. The antistatic adhesive release film according to claim 4, wherein the release layer of the second antistatic release film comprises a silicone resin coating solution in which 0.01 to 10 parts by weight of a silane coupling agent is added to an aqueous or oily silicone resin. Coating a conductive polymer composition on at least one side of the base film to form a conductive layer, coating the adhesive peeling composition on the conductive layer to form an adhesive peeling layer to manufacture a first adhesive peeling film; Coating a conductive polymer composition on at least one side of the base film to form a conductive layer, and coating a silicone resin coating solution on the conductive layer to form a peeling layer to prepare a second antistatic peeling film; Method for producing an antistatic adhesive release film comprising the step of attaching the second antistatic release film to the first adhesive release film. The pressure-sensitive adhesive release layer of claim 1, wherein the pressure-sensitive adhesive release layer of the first pressure-sensitive adhesive release film is 0.1 to 5 parts by weight of a curing agent, 10 to 50 parts by weight of a thermal expansion foaming agent, 0.05 to 20 parts by weight of an antistatic agent, and a silane coupling agent of 0.1 to 100 parts by weight of a functional adhesive. Method for producing an antistatic adhesive peeling film, characterized in that consisting of a pressure-sensitive adhesive peeling composition containing from 5 to 5 parts by weight and 40 to 300 parts by weight of an organic solvent. The pressure-sensitive adhesive release layer of claim 1, wherein the pressure-sensitive adhesive release layer of the first pressure-sensitive adhesive film is 0.1 to 5 parts by weight of the curing agent, 10 to 50 parts by weight of the thermal expansion foaming agent, 0.05 to 4 parts by weight of the antistatic agent, and 0.1 of the silane coupling agent, relative to 100 parts by weight of the functional adhesive. Method for producing an antistatic adhesive release film, characterized in that consisting of a pressure-sensitive adhesive peeling composition comprising from 5 to 5 parts by weight and 40 to 100 parts by weight of an organic solvent. [Claim 10] The antistatic adhesive peeling film of claim 8, wherein the peeling layer of the second antistatic peeling film is made of a silicone resin coating solution in which 0.01 to 10 parts by weight of a silane coupling agent is added to an aqueous or oily silicone resin. Manufacturing method.

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