KR20090081103A - Dicing Tapes for semi-conductor packaging and Manufacturing method thereof - Google Patents

Abstract

A dicing tape for the semiconductor packaging is provided to inhibit the migration of a plasticizer and an additive of a PVC film, thereby improving the pick-up in the semiconductor packing process, room temperature stability and durability. A dicing tape(1) for the semiconductor packaging comprises a base film(5), an adhesive layer(3) and a release film(2), wherein a curing resin layer(4) having a storage modulus of 4.0x10^4 dyne/cm^2 or more is formed between the base film and the adhesive layer. The base film is a poly(vinyl chloride) film. The curing resin layer is formed by curing a curing resin layer composition with UV rays, heat or radioactive rays.

Description

Dicing tapes for semi-conductor packaging and manufacturing method

Embodiments of the present invention relate to a dicing tape for semiconductor packaging and a method of manufacturing the same, and more particularly, to attach (mounting) a semiconductor wafer having a circuit design during a semiconductor packaging process to an adhesive tape and to cut the die to a circuit size (die). The present invention relates to a dicing tape applied to a step (pickup) of detaching a chip after cutting) from an adhesive sheet.

In the semiconductor manufacturing process, circuit-designed wafers are separated into small chips through dicing in a size having a large diameter, and each separated chip is subjected to a step-by-step process of bonding to a supporting member such as a PCB substrate or a lead frame substrate by bonding. have. In general, the dicing tape has a structure including an adhesive layer on the base film and a release film on the adhesive layer. In the semiconductor process, the release film is peeled off, the adhesive layer is laminated on the wafer chip, and the chip is cut to the size of the designed circuit. The cutting process is called a dicing process. Generally, dicing is carried out to a depth of a lower base film under the adhesive layer, and the ultraviolet ray is applied from the lower part of the film to pick up the individualized chip and attach it to the support member. Reduces the peel force between the layer and the wafer chip interface. The individualized chip having the adhesive layer attached thereto is picked up with a constant force by using a pickup called a collet and attached to a supporting member such as a PCB substrate or a lead frame.

The main purpose of the dicing tape is to be attached to the back side of the wafer to prevent the film from scattering or flowing during dicing and cracking the wafer. If the dicing tape is not used, the film is scattered or flows due to the blades rotating at a high speed, and the chip is damaged. Therefore, the individualizing process of the chip was made easy by using a dicing tape having an appropriate adhesive force.

In the conventional dicing tape, polyolefin-based films have been applied as a base film. However, polyolefin-based films have low modulus and high elongation, so that there is no expansion effect. There was a problem with pickup. To solve this problem, the application of polyvinyl chloride (PVC) films with high modulus and low elongation has been actively studied. However, when using a PVC film, plasticizers and additives are added to soften the PVC film, but such plasticizers and additives are migrated to the coating adhesive layer, which causes a fatal problem in the durability of the product over time. It did not solve the underlying problem of using PVC film. Therefore, prior to the development of an adhesive composition that is optimal for pickup, development of a migration inhibitory composition of a plasticizer and an additive of a PVC film is prioritized.

One problem to be solved by the present invention is to provide a dicing tape excellent in durability, pickup properties and room temperature stability by inhibiting the migration (Migration) of the plasticizer and additives of the PVC film.

Another object of the present invention is to provide a method for producing a dicing tape that can suppress migration of plasticizers and additives of PVC films.

One aspect of the present invention for achieving the above object is a dicing tape comprising a base film, a pressure-sensitive adhesive layer and a release film, the number of cured with a storage modulus of 4.0 × 10 ⁴ dyne / ㎠ or more between the base film and the adhesive layer The present invention relates to a dicing tape for semiconductor packaging, further comprising a layer.

Another aspect of the invention

(Iii) laminating the cured resin layer composition on the base film;

(Ii) curing the film to form a cured resin layer;

(Iii) forming a pressure-sensitive adhesive layer by laminating a curable pressure-sensitive adhesive composition on the cured resin layer on which curing is completed; And

(Iii) Laminating a release film on the adhesive layer relates to a method for producing a dicing tape.

The dicing tape according to the embodiments of the present invention further comprises a cured resin layer having a storage modulus of 4.0 × 10 ⁴ dyne / cm 2 or more between the PVC film and the adhesive layer, thereby suppressing migration of the plasticizer and the additive of the PVC film to the semiconductor. It has excellent pick-up property in the packaging process and excellent room temperature stability and durability. In addition, the dicing tape according to the embodiments of the present invention is subjected to the primary coating of the photocurable mixed curable resin layer and the coating of the photocurable intrinsic pressure-sensitive adhesive composition to give the adhesive performance to facilitate the peeling off after the wafer chip is attached thereon It is a dicing tape of 2 layer structure which carries out 2nd time, and it is excellent in pick-up property by bringing sufficient adhesive force reduction after hardening even in the chip of 10 mm x 10 mm or more size.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

One embodiment of the present invention is a dicing tape comprising a base film, an adhesive layer and a release film, further comprising a cured resin layer having a storage modulus of 4.0 × 10 ⁴ dyne / cm 2 or more between the base film and the adhesive layer. A dicing tape for semiconductor packaging is provided.

1 is a schematic cross-sectional view of a dicing tape according to an embodiment of the present invention. The dicing tape 1 according to the exemplary embodiment of the present invention is in a state where the cured resin layer 4 is first coated on the base film 5 and cured, and adheres to the upper part of the cured resin layer 4. The layer 3 is laminated and coated, and the release film 2 for protecting the adhesive layer 3 is laminated on the adhesive layer 3.

* Base film

In one embodiment of the present invention, the base film 5 is preferably a poly vinyl chloride (Poly vinyl chloride, PVC) film.

Generally, various plastic films are used as the base film of the dicing tape, and in particular, thermoplastic plastic films are used. Thermoplastic film is preferable in terms of the resilience of the film because the use of a thermoplastic film allows expansion to pick up after the dicing process and in some cases to pick up chips remaining after the expansion after a period of time. .

In addition, it is preferable that the base film not only be expandable but also UV-permeable, and in particular, when the pressure-sensitive adhesive is a UV curable pressure-sensitive adhesive composition, it is preferable that the base film is a film having excellent transmittance with respect to ultraviolet rays of a wavelength at which the pressure-sensitive adhesive composition can be cured. Therefore, it is preferable that a base film does not contain an ultraviolet absorber etc.

Examples of the polymer film that can be used as such substrate include polyethylene such as polyethylene, polypropylene, ethylene / propylene copolymer, polybutene-1, ethylene / vinyl acetate copolymer, mixture of polyethylene / styrenebutadiene rubber, polyvinylchloride film, and the like. Olefin-based films and the like can be mainly used. In addition, plastics such as polyethylene terephthalate, polycarbonate and poly (methyl methacrylate), thermoplastic elastomers such as polyurethane and polyamide-polyol copolymer, and mixtures thereof can be used. Moreover, these base films may have a multilayer structure in order to improve the cutting property and the expandability at the time of dicing.

The base film is preferably surface modified to increase the adhesion with the adhesive layer. Surface modification can be both physical and chemical methods, the physical method can be corona discharge treatment or plasma treatment, the chemical method can be used such as in-line coating treatment or primer treatment.

In the embodiments of the present invention, a polyolefin-based film having a high modulus and a low elongation instead of a polyolefin-based film having a low modulus and a high elongation rate and a large expansion effect is used for a thin chip having a thickness of 100 μm or less or a large size chip. It is advantageous for pickup.

As for the thickness of the said base film, 30-300 micrometers are preferable normally from a viewpoint of workability, ultraviolet permeability, etc. If the thickness of the base film is less than 30㎛, the film is easily deformed by heat generated during ultraviolet irradiation, and if the thickness of the base film is more than 300㎛, the force to expand on the equipment is excessively required and is not preferable in terms of cost. . Preferably the thickness of the said base film is 50-200 micrometers more preferably.

* Curing resin layer

In one embodiment of the present invention, the cured resin layer 4 is located between the base film 5 and the adhesive layer 3, the storage modulus is preferably 4.0 × 10 ⁴ dyne / ㎠ or more. In the dicing tape of the present invention, the cured resin layer improves room temperature stability and durability of the dicing tape by preventing migration of the additive or plasticizer of the PVC film to the adhesive layer when the PVC film is used as the base film.

Therefore, in the embodiments of the present invention, the cured resin layer 4 is cured from the fabrication step of the tape prior to the dicing process, the cured resin layer composition is cured, and the coating film cohesion is increased by the crosslinking reaction and the modulus is increased, thereby making the stable coating film layer. It is preferable to use the resin forming a resin to suppress the migration of the additive or plasticizer of the PVC film and to have excellent interfacial adhesion with the adhesive layer.

In the embodiments of the present invention, the curable resin layer composition usable for forming the cured resin layer 4 may be cured by ultraviolet irradiation or heat-curing or other external energy to increase the cohesion and modulus of the coating film before and after adding energy to the PVC film. Any composition can be used as long as it inhibits the migration of plasticizers and additives.

In one embodiment of the present invention, for example, the curing resin layer composition is cured by ultraviolet light, the ultraviolet curing resin layer composition is (i) 100 parts by weight of a polymer binder resin; (Ii) 80 to 150 parts by weight of ultraviolet curable acrylate; (Iii) 3 to 10 parts by weight of a thermosetting agent; And (iii) 0.1 to 3 parts by weight of the photoinitiator (ii) based on 100 parts by weight of the ultraviolet curable acrylate.

The polymer binder resin (iii) may have various adhesive properties such as acrylic, polyester, urethane, silicone, and natural rubber, but acrylic adhesives having good cohesion and heat resistance and easy introduction of low molecular weight materials are preferred. . In particular, an acrylic pressure sensitive adhesive having a high content of 2-hydroxy ethyl methacrylate, which is a monomer that increases the modulus of the binder due to high Tg, is preferable. Moreover, as for the weight average molecular weight of a polymeric binder, 100,000 or more and 1.5 million or less are preferable. In 100,000 or less, the coating cohesion is insufficient, and the coating layer is easily detached by the blade during dicing, thereby causing chip crack and chip flying. If the molecular weight is 1.5 million or more, the solubility is lowered and the workability during coating is poor.

The (ii) ultraviolet curable acrylate may be used as long as it has a structure having a carbon carbon double bond that can be cured by ultraviolet rays, and is not particularly limited. For example, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, Pentaerythritol hexaacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate , Polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate may be used one or more selected from the group consisting of.

The thermosetting agent (i) reacts with the functional group of the adhesive binder to act as a crosslinking agent and has a three-dimensional network structure as a result of the crosslinking reaction. The thermosetting agent may be used alone or in combination of two or more as a compound selected from melamine, polyisocyanates, melamine / formaldehyde resins and epoxy resins. The polymer binder resin and (ii) ultraviolet curing acrylate having adhesive properties by the addition of the curing agent form a hard coating film on the surface of the base film 5, and no coating film desorption occurs by dicing or ultraviolet irradiation. .

As the photoinitiator (V), a photopolymerization initiator (D) included in the pressure-sensitive adhesive layer may be a conventional one without particular limitation. For example, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4,4'dichlorobenzophenone, acetophenone, diethoxyacetophenone and the like It can be used by these alone or by mixing two or more kinds of anthraquinones such as acetonephenones, 2-ethyl anthraquinone and t-butyl anthraquinone.

The thickness of the cured resin layer 4 in the embodiments of the present invention is preferably 5 ~ 10㎛. If the thickness is less than 5㎛, the effect of inhibiting migration of the PVC film plasticizer is inferior for a long time, and at the coating thickness of 10㎛ or more, the cutting depth is increased during the sawing process, thereby increasing the error occurrence rate during the pickup process.

* Adhesive layer

In one embodiment of the present invention, the adhesive layer 3 may use an ultraviolet curable pressure-sensitive adhesive composition commonly used in the art. The ultraviolet curable pressure sensitive adhesive composition includes an adhesive composition or an internal pressure sensitive adhesive composition in a mixed form of an acrylic adhesive binder and an ultraviolet curable acrylate.

In the case of a mixed adhesive composition, a mixed form of an acrylic adhesive binder and an ultraviolet curable acrylate, which forms a coating film and supports a coating layer, has been mainly used. When the mixed composition of these forms is applied to a general dicing film, even if the ultraviolet curable acrylate is mostly a low molecular material, no transition occurs because the relative member to be bonded is an inorganic material such as a wafer. It is possible to pick up with a significant decrease in adhesion.

The intrinsic pressure-sensitive adhesive composition is a form in which a low-molecular substance having a carbon-carbon double bond is introduced into the side chain of the pressure-sensitive adhesive resin showing the pressure-sensitive adhesive component by chemical reaction to behave like one molecule. The intrinsic pressure-sensitive adhesive composition is prepared by two steps: a pressure-sensitive resin polymerization step and a carbon-carbon double bond addition step to the polymerized pressure-sensitive adhesive resin. That is, the intrinsic pressure-sensitive adhesive composition is to introduce a low molecular acrylate into a polymer that acts as a binder by chemical bonding rather than physical mixing. When using such an intrinsic pressure-sensitive adhesive composition it is possible to prevent the problem of the transition of low molecular weight material.

Reaction mechanisms for introducing a low molecular acrylate having a carbon-carbon double bond by a two-stage addition reaction of an intrinsic pressure-sensitive adhesive binder are as follows. It is a combination of the functional groups which are easy to make polymer react with acrylic side chains, such as a carboxyl group, an epoxy group, a hydroxyl group, and an isocyanate group, a carboxyl group, and an amine group. In addition, any combination of functional groups may be used as long as the reactor can introduce a low molecular acrylate having a carbon-carbon double bond into the adhesive polymer side chain. Each functional group can be prepared by selectively applying to a polymer adhesive binder or a low molecular acrylate.

In the case of using the intrinsic pressure-sensitive adhesive composition, no transition of low-molecular acrylate occurs, and the adhesion at the interface between the pressure-sensitive adhesive layer 3 and the wafer chip is significantly reduced after ultraviolet irradiation, so that it is possible to pick up even a large size chip.

In the embodiments of the present invention, the adhesive layer 3 preferably has a molecular weight of 100,000 to 1.5 million. In 100,000 or less, when the adhesive composition is coated, the adhesion to the substrate is insufficient and the coating film cohesion is insufficient, so that the coating layer is easily detached by the blade during dicing to induce chip flying or chip crack. If the molecular weight is 1.5 million or more, solvent solubility is inferior and processability, such as coating, is inferior.

In one embodiment of the present invention, the pressure-sensitive adhesive layer 3 is a low molecular material having a carbon-carbon double bond in the copolymer binder side chain. It is applied using the composition to significantly reduce the adhesion to the wafer chip after UV curing to achieve satisfactory pickup.

In one embodiment of the present invention, the embedded UV curable pressure-sensitive adhesive composition comprises (i) 100 parts by weight of an integrated adhesive binder (ii) 0.5 to 10 parts by weight of a thermosetting agent; And (iii) 0.1 to 2 parts by weight of the photoinitiator.

* Release film

In the exemplary embodiment of the present invention, the release film 2 may be one that is commonly used in the art, and is not particularly limited, and silicone-based and fluorine-based release PET films may be applied.

According to another embodiment of the present invention,

(Iii) laminating the cured resin layer composition on the base film;

(Ii) curing the film to form a cured resin layer;

(Iii) forming a pressure-sensitive adhesive layer by laminating a curable pressure-sensitive adhesive composition on the cured resin layer on which curing is completed; And

(Iii) Laminating a release film on the adhesive layer relates to a method for producing a dicing tape.

That is, in the method of manufacturing a dicing tape of the present invention, the cured resin layer composition is first coated on the base film 5 to cure, and then the curable pressure-sensitive adhesive composition is secondarily coated on the cured resin layer 4 on which the curing is completed. After the adhesive layer 3 is formed, a dicing tape is finally manufactured by laminating the release film 2 on the adhesive layer 3.

In the manufacturing method of the present invention, it is preferable to use a polyvinyl chloride (PVC) film as the base film, and the thickness of the base film is usually 30 to 300 μm in terms of workability, UV transmittance, and the like. It is desirable to. If the thickness of the base film is less than 30㎛, the film is easily deformed by the heat generated during ultraviolet irradiation. If the thickness of the base film is more than 300㎛, excessive force for expansion on the equipment is required and it is not preferable in terms of cost. . Preferably the thickness of the said base film is 50-200 micrometers more preferably.

In the production method of the present invention, the cured resin layer composition is cured to increase the coating film cohesion force due to the crosslinking reaction and the modulus increases to form a stable coating film layer, thereby suppressing migration of the additive or plasticizer of the PVC film and interfacial adhesion with the adhesive layer. It is preferable to use this excellent thing.

The curable resin layer composition usable in embodiments of the present invention is a composition which cures by ultraviolet irradiation or increases the cohesion and modulus of the coating film before and after the energy addition by heat curing or other external energy, thereby inhibiting migration of the plasticizer and the additive of the PVC film. Anything can be used.

In one embodiment of the present invention, for example, the curing resin layer composition is cured by ultraviolet light, the ultraviolet curing resin layer composition is (i) 100 parts by weight of a polymer binder resin; (Ii) 80 to 150 parts by weight of ultraviolet curable acrylate; (Iii) 3 to 10 parts by weight of a thermosetting agent; And (iii) 0.1 to 3 parts by weight of the photoinitiator (ii) based on 100 parts by weight of the ultraviolet curable acrylate.

The polymer binder resin (iii) may have various adhesive properties such as acrylic, polyester, urethane, silicone, and natural rubber, but acrylic adhesives having good cohesion and heat resistance and easy introduction of low molecular weight materials are preferred. . In particular, an acrylic pressure sensitive adhesive having a high content of 2-hydroxy ethyl methacrylate, which is a monomer that increases the modulus of the binder due to high Tg, is preferable. Moreover, as for the weight average molecular weight of a polymeric binder, 100,000 or more and 1.5 million or less are preferable. In 100,000 or less, the coating cohesion is insufficient, and the coating layer is easily detached by the blade during dicing, thereby causing chip crack and chip flying. If the molecular weight is 1.5 million or more, the solubility is lowered and the workability during coating is poor.

The (ii) ultraviolet curable acrylate may be used as long as it has a structure having a carbon carbon double bond that can be cured by ultraviolet rays, and is not particularly limited. For example, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, Pentaerythritol hexaacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate , Polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate may be used one or more selected from the group consisting of.

The thermosetting agent (i) reacts with the functional group of the adhesive binder to act as a crosslinking agent and has a three-dimensional network structure as a result of the crosslinking reaction. As the thermosetting agent, a compound selected from melamine, polyisocyanates, melamine / formaldehyde resin, and epoxy resin may be used alone or in combination of two or more thereof. The polymer binder resin and (ii) ultraviolet curing acrylate having adhesive properties by the addition of the curing agent form a hard coating film on the surface of the base film 5, and no coating film desorption occurs by dicing or ultraviolet irradiation. .

As the photoinitiator (V), a photopolymerization initiator (D) included in the pressure-sensitive adhesive layer may be a conventional one without particular limitation. For example, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4,4'dichlorobenzophenone, acetophenone, diethoxyacetophenone and the like It can be used by these alone or by mixing two or more kinds of anthraquinones such as acetonephenones, 2-ethyl anthraquinone and t-butyl anthraquinone.

The thickness of the cured resin layer 4 in the embodiments of the present invention is preferably 5 ~ 10㎛. If the thickness is less than 5㎛, the effect of inhibiting migration of the PVC film plasticizer is inferior for a long time, and at the coating thickness of 10㎛ or more, the cutting depth is increased during the sawing process, thereby increasing the error occurrence rate during the pickup process.

The method of forming the cured resin layer 4 on the base film 5 includes a method of directly coating the cured resin layer composition on the upper part of the base film, and in addition to the transfer method after completion of drying after coating on a release film or the like. There is also a method for transferring. In all the above methods, the cured resin layer may be applied without any limitation as long as it can form a coating film such as bar coating, gravure coating, comma coating, reverse roll coating, applicator coating, and spray coating. .

In the manufacturing method of the present invention, the adhesive layer 3 may be formed by laminating an ultraviolet curable pressure-sensitive adhesive composition commonly used in the art on the cured resin layer 4 on which the curing is completed. The lamination method of the ultraviolet curable pressure-sensitive adhesive composition may be used any one of the same method as the coating method of the cured resin layer composition.

As the ultraviolet curable pressure sensitive adhesive composition, a pressure sensitive adhesive composition or an internal pressure sensitive adhesive composition of a mixed form of an acrylic pressure sensitive adhesive and an ultraviolet curable acrylate may be used. The mixed adhesive composition or the embedded adhesive composition is the same as described above.

In the embodiments of the present invention, the adhesive layer is preferably 5 ~ 20㎛. The adhesion force of the ring frame is lower than 5㎛ and the coating thickness of 20㎛ or more shows a tendency to increase the error occurrence rate during the picking process because the depth to be cut during the sawing process increases.

As the release film 2 usable in the manufacturing method of the present invention, those commonly used in the art may be used, and are not particularly limited, but silicone and fluorine-based PET release films may be applied.

Hereinafter, the present invention will be described in more detail with reference to examples, but these examples are for illustrative purposes only and are not intended to limit the protection scope of the present invention.

Production Example  1: Preparation of cured resin layer composition

After mixing 400 g of an acrylic adhesive binder having a glass transition temperature of -35 ° C and a weight average molecular weight of 500,000 with a 30% solids content and 70 g of an epoxy acrylate FDOM-101 (Cyden), 3 g of a polyisocyanate curing agent AK-75 (Aekyung) Chemistry) and 1 g of IC-184 (Ciba-Geigy) were added to prepare a cured resin layer composition.

Production Example  2: Preparation of Curable Adhesive Composition

Into a 2L four-necked flask, the reagents were added under the mixing conditions of Preparation Example 2 in Table 1 below, and the reaction process was as follows. 240 g of ethyl acetate and 120 g of toluene, which are organic solvents, were placed first, a reflux cooler was installed on one side, a thermometer was installed on one side, and a dropping panel was installed on the other side. After raising the flask solution temperature to 60 ° C., a mixed solution of 51 g of methyl methacrylate, 54 g of butyl acrylate monomer, 285 g of 2-ethylhexyl acrylate, 180 g of 2-hydroxyethyl methacrylate, and 30 g of acrylic acid was prepared. After that, the mixed solution was added dropwise at 60 to 70 ° C. using a dropping panel. After the dropping, the stirring speed was 250 rpm, and after the completion of the dropping, the reactants were aged at the same temperature for 3 hours, and then 60 g of methoxypropyl acetate and 0.2 g of azobisisobutyronitrile were added and maintained for 4 hours. The solids were measured and the reaction stopped. The viscosity after polymerization was 10000-15000 cps, and the content of solid content was corrected to 40%. 45 g of glycidyl methacrylate was added to the prepared acrylic adhesive binder and reacted at 50 ° C. for about 1 hour to prepare an internal adhesive binder. To 100 g of the prepared adhesive binder, 2 g of a thermosetting agent AK-75 (Aekyung Chemical), A curable pressure-sensitive adhesive composition was prepared by mixing 1 g of photoinitiator IC-184 (Ciba-Geigy).

Production Example  3: Preparation of Curable Adhesive Composition

Into a 2L four-necked flask, the reagents were added under the mixing conditions of Preparation Example 3 in Table 2 below, and the reaction process was as follows. 240 g of ethyl acetate and 120 g of toluene, which are organic solvents, were placed first, a reflux cooler was installed on one side, a thermometer was installed on one side, and a dropping panel was installed on the other side. After raising the flask solution temperature to 60 ° C., a mixed solution of 66 g of methyl methacrylate, 78 g of butyl acrylate monomer, 270 g of 2-ethylhexyl acrylate, 156 g of 2 hydroxyethyl methacrylate, and 30 g of acrylic acid was prepared. After that, the mixed solution was added dropwise at 60-70 ° C for 3 hours using a dropping panel. After dropping, the stirring speed was 250rpm, and after completion of dropping, the reactants were aged at the same temperature for 3 hours, and then 60 g of methoxypropyl acetate and 1.2 g of azobisisobutylonitrile were added and maintained for 4 hours. The solids were measured and the reaction stopped. The viscosity after polymerization was 10000-15000 cps, and the content of solid content was corrected to 40%. 45 g of glycidyl methacrylate was added to the prepared acrylic adhesive binder and reacted at 50 ° C. for about 1 hour to prepare an internal adhesive binder. To 100 g of the prepared adhesive binder, 2 g of a thermosetting agent AK-75 (Aekyung Chemical), A curable pressure-sensitive adhesive composition was prepared by mixing 1 g of photoinitiator IC-184 (Ciba-Geigy).

Example  One

First, the cured resin layer composition of Preparation Example 1 was coated on one side of a 38 micron PET release film using an applicator, dried at 80 ° C. for 2 minutes, and then laminated to a 90 micron PVC film at room temperature to prepare a photocurable resin film. Irradiation of high pressure mercury lamp with roughness of 70 W / cm using UV (Daesung Engineering) was performed for 3 seconds to form a photocured resin layer irradiated with an exposure dose of 300 mJ / cm ² . After laminating and coating the curable pressure-sensitive adhesive composition of Preparation Example 2 to a thickness of 10 microns, a lamination was performed on a PET release film at room temperature, and then Aging was performed in an oven at 40 ° C. for 3 days.

Example  2

Except for using the curable pressure-sensitive adhesive composition of Preparation Example 2 in Example 1 except that the curable pressure-sensitive adhesive composition of Preparation Example 3 was used in the same manner as in Example 1.

Comparative example  One

The curable adhesive composition of Preparation Example 2 was coated on one side of a 38-micron PET release film using an applicator, dried at 80 ° C. for 2 minutes, and then laminated on a 90 micron PVC film at room temperature, followed by Aging in a 40 ° C. oven for 3 days. It was.

Comparative example  2

It carried out similarly to the comparative example 1 except having used the curable adhesive composition of manufacture example 3 instead of using the curable adhesive composition of manufacture example 2 in the comparative example 1.

Comparative example  3

300g of adhesive binder with glass transition temperature of -30 ° C and weight average molecular weight of 350,000 with 33% solids and 80g of U-324A (Shin-Nakamura) with viscosity of 20000 cps at 40 ° C. Polyisocyanate curing agent L-45 (Japan Polyurethane Co., Ltd.) and 1 g of IC-651 (Ciba-Geigy Co., Ltd.) were added to prepare a curable pressure-sensitive adhesive composition. The curable pressure-sensitive adhesive composition was coated on one side of a 38-micron PET release film using an applicator, dried at 80 ° C. for 2 minutes, and then laminated at 90 ° C. on a 90-micron PVC film, followed by Aging in a 40 ° C. oven for 3 days.

[ Dicing  Evaluation of physical properties of tape]

① Determination of 180 degree peeling force between adhesive layer and wafer (before and after UV curing)

The 180 degree peeling force between an adhesive and a wafer is measured based on JISZ0237 standard. Dicing tape samples obtained in Examples and Comparative Examples were cut into 25 mm x 150 mm sizes, and then, each of the dicing tapes was cut in a 10N Load Cell using a tensile tester (Instron Series lX / s Automated materials Tester-3343). The wafer and the wafer were pinched by the upper and lower jig and peeled at a speed of 300 mm / min. UV irradiation was carried out using DS-MUV128-S1 (Daesung Engineering) for 3 seconds in a high-pressure mercury lamp with 70W / cm illuminance, and the exposure dose was 300mJ / cm ² , and 10 samples were measured before and after UV irradiation. It was.

② Tackiness measurement (before and after UV curing)

Only the adhesive layer of the dicing tapes obtained by Examples and Comparative Examples was measured before and after UV curing by a probe tack tester (Chemilab Tack Tester). This method uses ASTM D2979-71 to determine the maximum force required when a clean probe tip is brought into contact with the adhesive surface for 1.0 + 0.01 sec at a rate of 10 + 0.1 mm / sec and a contact load of 9.79 + 1.01 kPa and then released. do. UV irradiation was carried out using an AR 08 UV (Aaron) for 3 seconds in a high-pressure mercury lamp having a roughness of 70W / cm and irradiated with an exposure dose of 300mJ / cm ² , and the sample was measured by five before and after the UV irradiation to measure the average value.

③ Pick-up success rate (%)

A silicon wafer having a thickness of 80 μm was thermally pressed for 10 seconds at 60 ° C. on a dicing tape obtained in Examples and Comparative Examples, and then diced into a size of 9.0 mm × 9.7 mm using EFD-650 (DISCO). . Thereafter, the film was irradiated for 3 seconds in a high-pressure mercury lamp having a roughness of 70 W / cm using DS-MUV128-S1 (Daesung Engineering), and then irradiated with an exposure dose of 300 mJ / cm ² . After the irradiation was completed, a pick-up test was performed on a die-bonder device (SDB-10M, Mechatronics Corporation) for 200 chips in the center of the silicon wafer, and the success rate (%) was measured.

The physical properties of the dicing tapes prepared by Examples 1 to 2 and Comparative Examples 1 to 3 described above were measured at room temperature storage times, and the results are shown in Table 3 below.

As can be seen in the above embodiment, when the first coating and curing of the cured resin layer composition as in Examples 1, 2, and the second coating of the curable adhesive composition on the upper portion, 9.0mm × 9.7mm chip 100% pick-up success rate was achieved in size, and even after 15 days at room temperature, the peel strength and pick-up property before UV curing were equivalent to room temperature stability. On the other hand, in Comparative Examples 1 and 2, the transfer coating of the curable adhesive composition having the same composition as in Examples 1 and 2 directly onto the PVC film without the first coating resulted in half the peel strength and the Tack value before UV curing. When the expansion is performed to die-bond after dicing, the ring frame is desorbed, so the picking process cannot be attempted, and the peel strength and tack value before UV curing continue to decrease depending on the room temperature time. I could confirm it. This was confirmed that the result of the UV property is lowered by the migration of the PVC film even in the case of using the curable mixed adhesive composition in which the adhesive adhesive and the UV curable acrylate were mixed with the adhesive layer without the primary coating as in the case of Comparative Example 3 Could.

Although the present invention has been described in detail with reference to preferred embodiments of the present invention, these are merely exemplary, and those skilled in the art to which the present invention pertains have various modifications and equivalents therefrom. It will be appreciated that embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a schematic cross-sectional view of a dicing tape according to an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

1: dicing tape

2: release film

3: adhesive layer

4: cured resin layer

5: base film

Claims (11)

As a dicing tape containing a base film, an adhesion layer, and a release film, A dicing tape for semiconductor packaging, further comprising a cured resin layer having a storage modulus of 4.0 × 10 ⁴ dyne / cm 2 or more between the base film and the adhesive layer. The dicing tape according to claim 1, wherein the base film is a polyvinyl chloride film. The dicing tape according to claim 1, wherein the cured resin layer is a cured resin layer composition cured by ultraviolet rays, heat, or radiation. The method of claim 3, wherein the ultraviolet curable resin layer composition (Iii) polymeric binder resin ---------- 100 parts by weight; (Ii) ultraviolet curing acrylate ----- 80 to 150 parts by weight; (Iii) a thermosetting agent ----------- 3 to 10 parts by weight; And (Iii) Photoinitiator ---- (ii) Dicing tape containing 0.1-3 weight part with respect to 100 weight part. The dicing tape according to claim 4, wherein the (b) polymer binder resin has a weight average molecular weight in the range of 100,000 to 1.5 million. 6. The dicing tape according to claim 5, wherein the polymer binder resin (i) is at least one member selected from the group consisting of acrylic, polyester, urethane, silicone and natural rubber. The method of claim 4, wherein (ii) the ultraviolet curable acrylate is at least one member selected from the group consisting of methyl acrylate, ethyl acrylate, isopropyl acrylate, polyethylene glycol diacrylate, oligoester acrylate and urethane acrylate. Dicing tape, characterized in that. The dicing tape according to claim 1, wherein the pressure-sensitive adhesive layer comprises an ultraviolet curable pressure-sensitive adhesive composition. The dicing tape according to claim 8, wherein the ultraviolet curable pressure sensitive adhesive composition comprises an internal pressure sensitive adhesive composition in which a low molecular material having a carbon double bond is introduced into the polymer binder resin side chain. 9. The dicing tape according to claim 8, wherein the ultraviolet curable pressure-sensitive adhesive composition has a weight average molecular weight of 100,000 to 1.5 million. (i) laminating the cured resin layer composition on the base film; (ii) curing the film to form a cured resin layer; (iii) forming a pressure-sensitive adhesive layer by laminating a curable pressure-sensitive adhesive composition on the cured resin layer on which curing is completed; And (iv) a method of manufacturing a dicing tape comprising laminating a release film on the adhesive layer.

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