TWI701733B - 導電溝槽深度之感應監控 - Google Patents

導電溝槽深度之感應監控 Download PDF

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Publication number
TWI701733B
TWI701733B TW107146304A TW107146304A TWI701733B TW I701733 B TWI701733 B TW I701733B TW 107146304 A TW107146304 A TW 107146304A TW 107146304 A TW107146304 A TW 107146304A TW I701733 B TWI701733 B TW I701733B
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TW
Taiwan
Prior art keywords
signal
substrate
conductive
polishing
depth
Prior art date
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TW107146304A
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English (en)
Chinese (zh)
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TW201929080A (zh
Inventor
魯偉
王哲甫
王志宏
依拉維尼韓森Ｇ
班維紐多明尼克Ｊ
卡爾森伊格馬
史威克柏格斯勞Ａ
涂文強
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美商應用材料股份有限公司
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Publication of TW201929080A publication Critical patent/TW201929080A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW107146304A 2014-06-23 2015-06-22 導電溝槽深度之感應監控 TWI701733B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/312,503 US9754846B2 (en) 2014-06-23 2014-06-23 Inductive monitoring of conductive trench depth
US14/312,503 2014-06-23

Publications (2)

Publication Number Publication Date
TW201929080A TW201929080A (zh) 2019-07-16
TWI701733B true TWI701733B (zh) 2020-08-11

Family

ID=54870327

Family Applications (2)

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TW107146304A TWI701733B (zh) 2014-06-23 2015-06-22 導電溝槽深度之感應監控
TW104120022A TWI649799B (zh) 2014-06-23 2015-06-22 導電溝槽深度之感應監控

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104120022A TWI649799B (zh) 2014-06-23 2015-06-22 導電溝槽深度之感應監控

Country Status (6)

Country Link
US (3) US9754846B2 (enExample)
JP (1) JP6640754B2 (enExample)
KR (1) KR102383708B1 (enExample)
CN (2) CN111211052B (enExample)
TW (2) TWI701733B (enExample)
WO (1) WO2015200101A1 (enExample)

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TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
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JP7341022B2 (ja) 2019-10-03 2023-09-08 株式会社荏原製作所 基板研磨装置および膜厚マップ作成方法
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TWI810069B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
KR102732531B1 (ko) 2020-06-24 2024-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 패드 마모 보상을 이용한 기판 층 두께의 결정
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Also Published As

Publication number Publication date
US20150371913A1 (en) 2015-12-24
CN111211052B (zh) 2023-09-19
WO2015200101A1 (en) 2015-12-30
CN111211052A (zh) 2020-05-29
CN106463380B (zh) 2019-10-29
JP2017520124A (ja) 2017-07-20
US10741459B2 (en) 2020-08-11
TW201603134A (zh) 2016-01-16
US10103073B2 (en) 2018-10-16
TWI649799B (zh) 2019-02-01
KR102383708B1 (ko) 2022-04-05
US9754846B2 (en) 2017-09-05
CN106463380A (zh) 2017-02-22
US20190035699A1 (en) 2019-01-31
US20170365532A1 (en) 2017-12-21
JP6640754B2 (ja) 2020-02-05
KR20170018960A (ko) 2017-02-20
TW201929080A (zh) 2019-07-16

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