JP2017520124A5 - - Google Patents

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Publication number
JP2017520124A5
JP2017520124A5 JP2016574899A JP2016574899A JP2017520124A5 JP 2017520124 A5 JP2017520124 A5 JP 2017520124A5 JP 2016574899 A JP2016574899 A JP 2016574899A JP 2016574899 A JP2016574899 A JP 2016574899A JP 2017520124 A5 JP2017520124 A5 JP 2017520124A5
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JP
Japan
Prior art keywords
substrate
sensor
polishing
platen
zone
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JP2016574899A
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Japanese (ja)
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JP2017520124A (ja
JP6640754B2 (ja
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Priority claimed from US14/312,503 external-priority patent/US9754846B2/en
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JP2016574899A 2014-06-23 2015-06-18 導電性トレンチの深さの誘導性モニタリング Active JP6640754B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/312,503 US9754846B2 (en) 2014-06-23 2014-06-23 Inductive monitoring of conductive trench depth
US14/312,503 2014-06-23
PCT/US2015/036520 WO2015200101A1 (en) 2014-06-23 2015-06-18 Inductive monitoring of conductive trench depth

Publications (3)

Publication Number Publication Date
JP2017520124A JP2017520124A (ja) 2017-07-20
JP2017520124A5 true JP2017520124A5 (enExample) 2018-07-26
JP6640754B2 JP6640754B2 (ja) 2020-02-05

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JP2016574899A Active JP6640754B2 (ja) 2014-06-23 2015-06-18 導電性トレンチの深さの誘導性モニタリング

Country Status (6)

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US (3) US9754846B2 (enExample)
JP (1) JP6640754B2 (enExample)
KR (1) KR102383708B1 (enExample)
CN (2) CN106463380B (enExample)
TW (2) TWI701733B (enExample)
WO (1) WO2015200101A1 (enExample)

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JP7062644B2 (ja) * 2016-09-21 2022-05-06 アプライド マテリアルズ インコーポレイテッド フィルタリングのための補償を用いた終点検出
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
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JP7640562B2 (ja) 2020-05-14 2025-03-05 アプライド マテリアルズ インコーポレイテッド 研磨中のインシトゥモニタリングで使用するためのニューラルネットワークをトレーニングするための技術及び研磨システム
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WO2022186993A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution

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