TWI697977B - 包括磁性門密封件的基板載體門組件、基板載體及方法 - Google Patents

包括磁性門密封件的基板載體門組件、基板載體及方法 Download PDF

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Publication number
TWI697977B
TWI697977B TW105112340A TW105112340A TWI697977B TW I697977 B TWI697977 B TW I697977B TW 105112340 A TW105112340 A TW 105112340A TW 105112340 A TW105112340 A TW 105112340A TW I697977 B TWI697977 B TW I697977B
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TW
Taiwan
Prior art keywords
carrier
magnetic field
substrate
substrate carrier
field generator
Prior art date
Application number
TW105112340A
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English (en)
Chinese (zh)
Other versions
TW201703176A (zh
Inventor
約翰Ｊ 瑪索可
尼爾 馬利
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201703176A publication Critical patent/TW201703176A/zh
Application granted granted Critical
Publication of TWI697977B publication Critical patent/TWI697977B/zh

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
    • E05C19/00—Other devices specially designed for securing wings, e.g. with suction cups
    • E05C19/16—Devices holding the wing by magnetic or electromagnetic attraction
    • E05C19/166—Devices holding the wing by magnetic or electromagnetic attraction electromagnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW105112340A 2015-05-22 2016-04-20 包括磁性門密封件的基板載體門組件、基板載體及方法 TWI697977B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562165555P 2015-05-22 2015-05-22
US62/165,555 2015-05-22

Publications (2)

Publication Number Publication Date
TW201703176A TW201703176A (zh) 2017-01-16
TWI697977B true TWI697977B (zh) 2020-07-01

Family

ID=57325191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105112340A TWI697977B (zh) 2015-05-22 2016-04-20 包括磁性門密封件的基板載體門組件、基板載體及方法

Country Status (6)

Country Link
US (1) US10196845B2 (enExample)
JP (1) JP2018515936A (enExample)
KR (1) KR102319415B1 (enExample)
CN (1) CN107636243A (enExample)
TW (1) TWI697977B (enExample)
WO (1) WO2016190982A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9694910B2 (en) 2013-02-22 2017-07-04 World View Enterprises Inc. Near-space operation systems
US9540091B1 (en) 2016-02-11 2017-01-10 World View Enterprises Inc. High altitude balloon systems and methods
US10336432B1 (en) 2017-01-09 2019-07-02 World View Enterprises Inc. Lighter than air balloon systems and methods
US10124875B1 (en) 2017-01-09 2018-11-13 World View Enterprises Inc. Continuous multi-chamber super pressure balloon
DE202017100143U1 (de) * 2017-01-12 2017-02-06 Simonswerk Gmbh Türanordnung
TWI735570B (zh) * 2017-05-09 2021-08-11 日商樂華股份有限公司 噴嘴單元、及具備噴嘴單元的環境氣體置換裝置、與環境氣體置換方法
US11703754B2 (en) * 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod
TWI779505B (zh) * 2020-05-14 2022-10-01 台灣積體電路製造股份有限公司 光罩盒及防止光罩污染之方法
US12009242B2 (en) * 2021-08-30 2024-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transport container
KR102717220B1 (ko) * 2022-10-31 2024-10-15 (주)신산이엔지 웨이퍼 카세트
US12325504B2 (en) 2022-11-07 2025-06-10 World View Enterprises Inc. Magnetic ballast dispenser

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120220107A1 (en) * 2011-02-28 2012-08-30 Hitachi Kokusai Electric Inc. Substrate processing apparatus, wafer holder, and method of manufacturing semiconductor device
US20130162117A1 (en) * 2010-06-08 2013-06-27 Shiro Hara Coupling transfer system

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JPH03215960A (ja) * 1990-01-22 1991-09-20 Ebara Corp 容器開閉機構
JP3347812B2 (ja) * 1992-05-19 2002-11-20 株式会社荏原製作所 真空容器並びに該真空容器を用いた真空処理方法
US5398481A (en) * 1992-05-19 1995-03-21 Ebara Corporation Vacuum processing system
JPH0637176A (ja) * 1992-05-21 1994-02-10 Ebara Corp 保管箱の防塵装置及びその着脱機構
JP3963227B2 (ja) 1997-06-13 2007-08-22 ミライアル株式会社 蓋付き薄板収納容器
TW518649B (en) 2002-01-30 2003-01-21 Chi Mei Optoelectronics Corp Substrate container with non-friction door element
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
US20070140822A1 (en) 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US20070175792A1 (en) 2006-02-02 2007-08-02 Barry Gregerson Magnetic seal for wafer containers
KR20090053915A (ko) * 2006-08-18 2009-05-28 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
KR101613836B1 (ko) * 2007-05-17 2016-04-21 브룩스 오토메이션 인코퍼레이티드 측면 개방형 기판 캐리어 및 로드 포트
US8424703B2 (en) * 2008-05-01 2013-04-23 Brooks Automation, Inc. Substrate container sealing via movable magnets
TWI365836B (en) * 2009-05-08 2012-06-11 Gudeng Prec Industral Co Ltd Wafer container with the magnetic latch
US10115616B2 (en) 2013-07-18 2018-10-30 Applied Materials, Inc. Carrier adapter insert apparatus and carrier adapter insert detection methods
CN109671643B (zh) 2013-08-12 2023-11-28 应用材料公司 具有工厂接口环境控制的基板处理系统、装置和方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130162117A1 (en) * 2010-06-08 2013-06-27 Shiro Hara Coupling transfer system
US20120220107A1 (en) * 2011-02-28 2012-08-30 Hitachi Kokusai Electric Inc. Substrate processing apparatus, wafer holder, and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
KR102319415B1 (ko) 2021-10-28
US20160340947A1 (en) 2016-11-24
TW201703176A (zh) 2017-01-16
CN107636243A (zh) 2018-01-26
WO2016190982A1 (en) 2016-12-01
JP2018515936A (ja) 2018-06-14
US10196845B2 (en) 2019-02-05
KR20180010249A (ko) 2018-01-30

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