TWI693731B - 高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 - Google Patents

高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 Download PDF

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TWI693731B
TWI693731B TW105119414A TW105119414A TWI693731B TW I693731 B TWI693731 B TW I693731B TW 105119414 A TW105119414 A TW 105119414A TW 105119414 A TW105119414 A TW 105119414A TW I693731 B TWI693731 B TW I693731B
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Taiwan
Prior art keywords
piezoelectric
piezoelectric element
lower electrode
frequency ultrasonic
concave portion
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TW105119414A
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English (en)
Chinese (zh)
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TW201705560A (zh
Inventor
小林牧子
田邊將之
椎名毅
隅田劍生
河口範夫
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國立大學法人熊本大學
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/13—Tomography
    • A61B8/14—Echo-tomography

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
TW105119414A 2015-06-24 2016-06-21 高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 TWI693731B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-126268 2015-06-24
JP2015126268A JP6122066B2 (ja) 2015-06-24 2015-06-24 高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ

Publications (2)

Publication Number Publication Date
TW201705560A TW201705560A (zh) 2017-02-01
TWI693731B true TWI693731B (zh) 2020-05-11

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TW105119414A TWI693731B (zh) 2015-06-24 2016-06-21 高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭

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JP (1) JP6122066B2 (https=)
TW (1) TWI693731B (https=)
WO (1) WO2016208425A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101965171B1 (ko) * 2018-08-24 2019-08-13 (주)비티비엘 초음파센서의 제조방법
EP4468743A4 (en) * 2022-01-19 2026-01-07 Cast Inc ULTRASONIC PROBE AND METHOD FOR MANUFACTURING ULTRASONIC PROBE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012011024A (ja) * 2010-07-01 2012-01-19 Konica Minolta Medical & Graphic Inc 超音波探触子、および超音波診断装置
JP2013168573A (ja) * 2012-02-16 2013-08-29 Mitsubishi Heavy Ind Ltd 超音波厚みセンサの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071920Y2 (ja) * 1988-05-10 1995-01-18 東レ株式会社 超音波トランスデューサ
JP2002008939A (ja) * 2000-04-13 2002-01-11 Fujitsu Ltd 選択的コーティングによるセラミック体の製造方法
JP4759117B2 (ja) * 2000-06-22 2011-08-31 日本特殊陶業株式会社 金属酸化物膜付き基板及び金属酸化物膜付き基板の製造方法
JP2004111835A (ja) * 2002-09-20 2004-04-08 Canon Inc 圧電体素子の製造方法、圧電体素子及びインクジェット式記録ヘッド
JP2005327919A (ja) * 2004-05-14 2005-11-24 Seiko Epson Corp デバイスの製造方法及びデバイス、電気光学素子、プリンタ
US7449821B2 (en) * 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP5540361B2 (ja) * 2011-06-07 2014-07-02 日立Ｇｅニュークリア・エナジー株式会社 超音波センサ及びその製造方法
JP2013207155A (ja) * 2012-03-29 2013-10-07 Mitsubishi Materials Corp 強誘電体薄膜の製造方法
JP6132337B2 (ja) * 2013-04-24 2017-05-24 国立大学法人電気通信大学 超音波診断装置及び超音波画像構築方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012011024A (ja) * 2010-07-01 2012-01-19 Konica Minolta Medical & Graphic Inc 超音波探触子、および超音波診断装置
JP2013168573A (ja) * 2012-02-16 2013-08-29 Mitsubishi Heavy Ind Ltd 超音波厚みセンサの製造方法

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WO2016208425A1 (ja) 2016-12-29
JP6122066B2 (ja) 2017-04-26
JP2017011144A (ja) 2017-01-12
TW201705560A (zh) 2017-02-01

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