TWI693105B - Development liquid discharge nozzle and development processing apparatus - Google Patents

Abstract

The first flow path is formed by the concave portion of the outer member and one side surface of the inner member, and the second flow path is formed by the band-shaped region of the concave portion of the outer member and the other side surface of the inner member. At the lower end of the first flow path, a slit-shaped first discharge port is formed, and at the lower end of the second flow path, a slit-shaped second discharge port is formed. A communication path is formed between the upper surface of the inner member and the step surface of the outer member. The first flow path and the second flow path communicate with each other via the communication path. In the outer member, an introduction path for introducing the developing solution to the first and second flow paths is formed.

Description

Developer spray nozzle and development processing device

The invention relates to a developing liquid ejection nozzle and a developing processing device.

In the development processing apparatus, for example, a developer discharge nozzle having a slit-shaped discharge port is used. The developer discharge nozzle described in Patent Document 1 includes first and second members having water repellency and a third member having hydrophilicity. The first, second, and third members are respectively provided in a plate shape, and the first and second members are joined to one surface and the other surface of the third member, respectively. A flow path for the developing solution is formed between the third member and the second member, and a slit-shaped ejection port is provided at the lower end portion thereof.

[Patent Document 1] Japanese Patent Laid-Open No. 11-221511

During the development process, a solution containing a developing solution, resist residues, etc. (hereinafter, referred to as a processing solution) adheres to the developing solution ejection nozzle. If the processing solution remains attached to the developer discharge nozzle for a period of time, solids will precipitate out of the processing solution. The precipitated solid matter becomes a factor of developing defects. In the flow path of the developing solution, even if the processing solution is attached, the processing solution can be removed by the flow of the developing solution, so it is not easy to precipitate solid matter. On the other hand, if the processing solution is attached to a part where no developer flows, it is difficult to remove the processing solution. Therefore, there is a possibility that solids are precipitated.

In the developer discharge nozzle of the above-mentioned Patent Document 1, since the third member is hydrophilic, it is easy to attach the processing solution around the third member. Even if the processing solution adheres to the flow path between the second member and the third member, the processing solution can be removed by the flow of the developing solution. On the other hand, if the processing solution penetrates between the first member and the third member, it is difficult to remove the developing solution, and solids are easily precipitated. In addition, the infiltrating developing solution slowly travels to the inside due to the capillary phenomenon. Therefore, the precipitation range of solid matter is expanded.

An object of the present invention is to provide a developer discharge nozzle and a development processing device that prevent development defects due to precipitation of solids.

(1) The developer discharge nozzle according to one aspect of the present invention includes: an inner member having first and second sides facing in opposite directions; and an outer member having a first side facing the inner member The first inner surface and the second inner surface opposed to the second side surface of the inner member; and a first flow path extending vertically is formed between the first side surface of the inner member and the first inner surface of the outer member. A second flow path extending vertically is formed between the second side surface of the member and the second inner surface of the outer member, and the introduction path for introducing the developing solution to the first and second flow paths is formed in the outer member for ejecting development The first discharge port of the liquid is formed at the lower end of the first flow path, and the second discharge port for discharging the developer is formed at the lower end of the second flow path.

In the developer discharge nozzle, a first flow path is formed between the first side surface of the inner member and the first inner surface of the outer member, and between the second side surface of the inner member and the second inner surface of the outer member The second flow path is formed. The developer is introduced into the first and second flow paths through the introduction path formed in the outer member. The developer introduced into the first flow path is discharged from the first discharge port, and the developer introduced into the second flow path is discharged from the second discharge port.

In this way, the developer flows through each of the first and second flow paths. Therefore, regardless of whether a solution containing a developing solution, resist residue, etc. (hereinafter, referred to as a processing solution) adheres to the first and second side surfaces of the inner member forming the first and second flow paths, and the first and second sides of the outer member Either of the second inner surfaces can remove the treatment solution by the flow of the developer. Take this to prevent self-attachment The treatment solution precipitated solids. As a result, development defects due to precipitation of solid matter are prevented.

(2) The inner member may have higher hydrophilicity than the outer member. In this case, when the liquid layer of the developer is formed on the substrate by ejecting the developer from the developer discharge nozzle onto the substrate, sufficient liquid accumulation is formed between the lower surface of the inner member and the upper surface of the substrate. This prevents the liquid layer from separating between the lower surface of the inner member and the upper surface of the substrate.

(3) The inner member may have an upper surface connecting the upper end of the first side surface and the upper end of the second side surface, and the outer member may have an upper surface connecting the upper end of the first inner surface and the upper end of the second inner surface. A third inner surface facing the upper surface of the inner member is formed between the upper surface of the inner member and the third inner surface of the outer member to connect the first and second flow paths, and the introduction path is The developer is introduced into the communication path.

In this case, the developer can be introduced into the first and second flow paths with a simple structure. In addition, since the first and second side surfaces and the upper surface of the inner member respectively form the flow path of the developing solution, it is possible to reduce the portion of the surface of the inner member where the processing solution may remain. By this, the precipitation of solid matter is sufficiently prevented.

(4) The developer discharge nozzle may further include a locking member that locks the inner member between the first and second inner surfaces of the outer member.

In this case, the cost for processing the inner member can be reduced, and the inner member can be fixed between the first and second inner surfaces of the outer member.

(5) The outer member may include a first member having a first inner surface and a second member having a second inner surface, and the first and second members may sandwich the inner member between the first and second members The states between the surfaces are fixed to each other.

In this case, the assembly of the developer discharge nozzle becomes easy. In addition, by sandwiching the inner member with the first and second members, the inner member is stably held between the first and second inner surfaces.

(6) The first and second ejection ports may be slit-shaped, and may be arranged side by side To extend. In this case, the liquid layer of the developer can be efficiently formed on the substrate.

(7) The first flow channel may also include: a first band-shaped flow channel, which is formed to extend in one direction along the first ejection port; and a plurality of first protruded flow channels, which are separated by It protrudes upward from the upper end of the first strip-shaped flow path and is arranged in a row in one direction; the second flow path includes: a second strip-shaped flow path that extends in a direction along the second ejection port Formed; and a plurality of second protruding flow paths, which are respectively protruded upward from the upper end of the second strip-shaped flow path and arranged in one direction; and the introduction path includes a plurality of connected introduction paths, which The plurality of communication introduction paths are provided so as to communicate with the plurality of first and second protruding flow paths, respectively.

In this case, the developer is uniformly introduced into the entirety of the first strip-shaped flow path from the plurality of first protruding flow paths, and the developer is uniformly introduced into the development of the entirety of the second strip-shaped flow path from the plural second protruding flow paths liquid. With this, the developer can be uniformly discharged from the entirety of the first and second discharge ports. Therefore, the liquid layer of the developer can be stably formed on the substrate.

(8) A developing device according to another aspect of the present invention includes: the developer discharge nozzle; the substrate holding portion that holds the substrate in a horizontal posture; and a developer supply system that supplies development to the developer discharge nozzle through the introduction path Liquid; and a moving device that moves the developer discharge nozzle relative to the substrate held by the substrate holding portion.

In this developing device, the developer discharge nozzle is relatively moved with respect to the substrate, and the developer is discharged from the developer discharge nozzle onto the substrate. In this way, a liquid layer of the developing solution is formed on the substrate, and development processing of the substrate is performed. In this case, since the above-mentioned developer discharge nozzle is used, development defects due to precipitation of solid matter are prevented.

(9) The moving device may move the developer discharge nozzle in a direction crossing the first and second side surfaces of the inner member.

In this case, the liquid layer of the developer can be efficiently formed on the substrate.

According to the present invention, development defects due to precipitation of solid matter can be prevented.

1‧‧‧Development processing device

5‧‧‧Frame

6‧‧‧Development solution supply section

7‧‧‧Baffle

10‧‧‧ Rotating and holding part

11‧‧‧Rotating chuck

12‧‧‧rotation axis

13‧‧‧Motor

20‧‧‧Handle shield

30‧‧‧Flushing nozzle

61‧‧‧slot nozzle

61a‧‧‧Nozzle arm

61b‧‧‧Nozzle mounting part

61x‧‧‧slot nozzle

62‧‧‧Nozzle lifting mechanism

63‧‧‧Nozzle sliding mechanism

70‧‧‧ Standby slot

70a‧‧‧standby slot

70b‧‧‧standby slot

70c‧‧‧Standby slot

71‧‧‧External components

71a‧‧‧Introduction

71b‧‧‧Hole

72‧‧‧External components

72b‧‧‧hole

73‧‧‧Inner components

73a‧‧‧Notch

75‧‧‧ locking member

75a‧‧‧screw

80‧‧‧Control Department

125‧‧‧Shield lifting mechanism

611‧‧‧ Installation bottom

612‧‧‧Installation side

612a‧‧‧screw hole

621‧‧‧Suction path

622‧‧‧Supply Road

623‧‧‧Liquid accumulation department

624‧‧‧Supply Road

630‧‧‧Connecting member

631‧‧‧ Suction

635‧‧‧Suction tube

710‧‧‧recess

711‧‧‧banded area

712‧‧‧ Highlighted area

720‧‧‧recess

721‧‧‧banded area

722‧‧‧ Highlighted area

CP‧‧‧Connect

DEV‧‧‧Development processing unit

DEV1‧‧‧Development processing unit

DEV2‧‧‧Development processing unit

DEV3‧‧‧Development processing unit

FP1a‧‧‧stream

FP2a‧‧‧stream

FP1b‧‧‧Stream

FP2b‧‧‧stream

GP‧‧‧step difference surface

LL‧‧‧Distance

MD‧‧‧Movement direction

OP1‧‧‧Spray outlet

OP2‧‧‧Spray outlet

SC‧‧‧screw

W‧‧‧Substrate

FIG. 1 is a schematic plan view of the development processing apparatus of the embodiment.

2 is a schematic side view of the development processing apparatus of FIG. 1.

FIG. 3 is a diagram showing the movement path of the slit nozzle.

4 is a perspective view showing the appearance of a slit nozzle and a nozzle arm.

5 is an exploded perspective view of a slit nozzle.

6 is a longitudinal cross-sectional view of a slit nozzle.

7 is a longitudinal cross-sectional view of a slit nozzle and a nozzle arm.

FIG. 8 is a cross-sectional view taken along line A-A of FIG. 7.

9 is a side view showing the inner surface of the outer member.

Fig. 10 is a side view showing one end of the slit nozzle.

11 is a schematic cross-sectional view for explaining the supply of the developing solution to the substrate through the slit nozzle.

12 is a cross-sectional view showing the configuration of a slit nozzle of a comparative example.

Hereinafter, the developer discharge nozzle and the development processing apparatus of the embodiment of the present invention will be described with reference to the drawings. In the following embodiments, the developer discharge nozzle is a slit nozzle having a slit-shaped discharge port.

(1) Structure of the development processing device

FIG. 1 is a schematic plan view of the development processing apparatus of the embodiment. 2 is a schematic side view of the development processing apparatus of FIG. 1. In FIGS. 1 and 2 and the following specific drawings of FIG. 3 and the following, in order to clarify the positional relationship, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are marked. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

As shown in FIG. 1, the development processing device 1 includes a housing 5. Inside the housing 5, three development processing units DEV and a developer supply unit 6 are provided. The three development processing units DEV have mutually The same structure is arranged in the X direction. Each development processing unit DEV includes a rotation holding unit 10, a processing shield 20, and a rinse nozzle 30.

As shown in FIG. 2, the rotation holding unit 10 includes a rotation chuck 11, a rotation shaft 12 and a motor 13. The rotating chuck 11 is disposed at the upper end of the rotating shaft 12 connected to the motor 13. The rotary chuck 11 holds the substrate W in a horizontal posture by vacuum suctioning the substantially central portion of the lower surface of the substrate W. The rotating shaft 12 and the rotating chuck 11 are integrally rotated by the motor 13. With this, the substrate W held by the rotary chuck 11 is rotated around the axis in the vertical direction (Z direction).

The processing shield 20 is provided so as to surround the rotation holding portion 10. The processing shield 20 is raised and lowered between a lower position and an upper position by a shield lifting mechanism (not shown). When the processing shield 20 is located at the lower position, the upper end of the processing shield 20 is lower than the position where the substrate W is held by the rotating chuck 11. When the substrate W is carried in and out of each development processing unit DEV, the processing shield 20 of the development processing unit DEV is arranged at a lower position. When the shield lifting mechanism 125 is at the upper position, the upper end of the processing shield 20 is higher than the position where the substrate W is held by the rotary chuck 11, and the periphery of the substrate W is surrounded by the processing shield 20. During the development process of the substrate W, the processing shield 20 is arranged at an upper position, and the droplets scattered from the rotating substrate W are received by the processing shield 20. The received droplets are introduced into a discharge part (discharge tube) not shown.

The rinse nozzle 30 is provided to be rotatable between a position to be avoided outside the processing shield 20 and a rinse position above the center portion of the substrate W held by the rotary chuck 11. The rinse nozzle 30 supplies the rinse liquid to the substrate W held by the rotary chuck 11 at the rinse position.

As shown in FIG. 1, the developer supply unit 6 includes a slit nozzle 61, a nozzle arm 61 a, a nozzle elevating mechanism 62 and a nozzle sliding mechanism 63. The slit nozzle 61 is provided so as to extend in the Y direction, and is connected to the nozzle elevating mechanism 62 via the nozzle arm 61a. The slit nozzle 61 is raised and lowered in the Z direction by the nozzle lifting mechanism 62. The slit nozzle 61 is moved in the arrangement direction (X direction) of the three development processing units DEV by the nozzle slide mechanism 63 so as to pass above the substrate W held by each rotary chuck 11.

The slit nozzle 61 is supplied with a developer from a developer supply source (not shown) via a nozzle arm 61a. The slit nozzle 61 moves above the substrate W held by the rotary chuck 11, and discharges the developer in a strip shape on the substrate W while facing it. By this, the liquid layer of the developer is formed so as to cover the upper surface of the substrate W. The liquid layer of the developing solution may be formed while the substrate W is rotating, or the liquid layer of the developing solution may be formed while the rotation of the substrate W is stopped.

A standby tank 70 is provided between adjacent development processing units DEV and outside the development processing unit DEV at one end. The slit nozzle 61 stands by on any standby tank 70 while the developer is not being discharged onto the substrate W. In the standby tank 70, the slit nozzle 61 periodically performs an automatic spraying process that ejects and discharges the developer remaining inside. By this, the developer which is deteriorated or deteriorated over time is prevented from being supplied to the substrate W. In the standby tank 70, the slit nozzle 61 is washed.

On one side surface of the frame 50, three shutters 7 are provided so as to face the three development processing units DEV, respectively. When the substrate W is carried into and out of the respective development processing units DEV, the corresponding shutter 7 is opened. During the development processing in each development processing unit DEV, the corresponding shutter 7 is closed.

(2) The operation of the development processing device

The outline of the operation of the development processing device 1 will be described. FIG. 3 is a diagram showing the movement path of the slit nozzle 61. The development processing apparatus 1 includes a control unit 80. The operation of each component of the development processing device 1 is controlled by the control unit 80. In FIG. 3, three development processing units DEV are set as development processing units DEV1, DEV2, and DEV3, and three standby slots 70 are set as standby slots 70a, 70b, and 70c, respectively. The development processing units DEV1, DEV2, and DEV3 are sequentially arranged in the X direction. A standby tank 70a is arranged between the development processing units DEV1 and DEV2, a standby tank 70b is arranged between the development processing units DEV2 and DEV3, and a standby tank 70c is arranged outside the development processing unit DEV3.

When the slit nozzle 61 is located on the standby groove 70c, the substrate W after the exposure process is transferred to the rotary chuck 11 of the development processing unit DEV1 by a transfer device (not shown). in In this case, the substrate W is transferred to the rotary chuck 11 of the development processing unit DEV1 with the processing shield 20 of the development processing unit DEV1 at the lower position, and after the substrate W is transported, the processing shield 20 rises to the upper position方位置。 Fang location. Then, the slit nozzle 61 moves to one end of the substrate W held by the rotary chuck 11 of the development processing unit DEV1 (the end away from the standby groove 70a side in the X direction), and moves to the substrate while ejecting the developer The other end of W (the end close to the standby groove 70a side in the X direction). Thereafter, the slit nozzle 61 moves to the standby groove 70a.

When the slit nozzle 61 is positioned on the standby tank 70a, the substrate W after the exposure process is transferred to the rotary chuck 11 of the development processing unit DEV2 by a transfer device (not shown). In this case, the substrate W is transferred to the rotary chuck 11 of the development processing unit DEV2 with the processing shield 20 of the development processing unit DEV2 at the lower position, and after the substrate W is transported, the processing shield 20 rises To the upper position. Then, the slit nozzle 61 moves to one end of the substrate W held by the rotary chuck 11 of the development processing unit DEV2 (the end close to the standby tank 70a side in the X direction), and moves to the substrate while ejecting the developer The other end of W (the end close to the standby groove 70b side in the X direction). Thereafter, the slit nozzle 61 moves to the standby groove 70b.

When the slit nozzle 61 is located on the standby tank 70b, the substrate W after the exposure processing is transported to the rotary chuck 11 of the development processing unit DEV3 by a transport device (not shown). In this case, the substrate W is transferred to the rotary chuck 11 of the development processing unit DEV3 with the processing cover 20 of the development processing unit DEV3 at the lower position. After the substrate W is transferred, the processing cover 20 Ascend to the upper position. Then, the slit nozzle 61 moves to one end of the substrate W held by the rotary chuck 11 of the development processing unit DEV3 (the end close to the standby groove 70b side in the X direction), and moves to the substrate while ejecting the developer The other end of W (the end close to the standby groove 70c side in the X direction). Thereafter, the slit nozzle 61 moves to the standby groove 70c.

In each of the development processing units DEV1 to DEV3, by making the slit nozzle 61 The developing solution is ejected while moving on the substrate W, and a liquid layer of the developing solution is formed on the substrate W. In this state, the development reaction of the photosensitive film (resist) formed on the substrate W proceeds. When a predetermined time passes after the liquid layer of the developer is formed, the rinse nozzle 30 is moved to the rinse position, and the rinse liquid is ejected. With this, the development reaction of the photosensitive film is stopped. Then, the substrate W is rotated by the rotation holding portion 10 while facing the substrate W, and the developer on the substrate W is rinsed. Thereafter, the substrate W is rotated while the ejection of the rinse liquid is stopped, and the rinse liquid is thrown away from the substrate W to dry the substrate W. The dried substrate W is transferred from the rotary chuck 11 by a transfer device (not shown). When the substrate W is transferred from the rotary chuck 11, the processing shield 20 is lowered to the lower position. In the development processing apparatus 1, such a series of operations are repeatedly performed.

The timing of loading and unloading of the substrate W for each of the development processing units DEV1 to DEV3 is not limited to the above example, and the operation speed of each part of the development processing device 1 may be appropriate according to the development processing time or the operation speed of the transport device change. In addition, the number of the development processing unit DEV, the standby tank 70, and the slit nozzle 61 may be appropriately changed.

(3) Composition of slit nozzle

The details of the slit nozzle 61 will be described. 4 is a perspective view of the appearance of a part of the slit nozzle 61 and the nozzle arm 61a. FIG. 5 is an exploded perspective view of the slit nozzle 61. FIG. 6 is a longitudinal sectional view of the slit nozzle 61, and FIG. 7 is a longitudinal sectional view of a part of the slit nozzle 61 and the nozzle arm 61a.

As shown in FIG. 4, the nozzle arm 61a includes a nozzle mounting portion 61b having a substantially L-shaped cross section. The slit nozzle 61 is attached to the nozzle attachment portion 61b. The upper surface and one side surface of the slit nozzle 61 overlap the nozzle mounting portion 61b.

The coupling member 630 is attached to the upper surface of the nozzle attachment portion 61b. One end of the suction pipe 635 is connected to the connecting member 630. The other end of the suction pipe 635 is connected to a vacuum generating device (exhaust device) not shown.

As shown in FIG. 5, the slit nozzle 61 includes outer members 71 and 72 and an inner member 73. External component 71 and 72 and the inner member 73 each extend in a long shape along the Y direction. The widths of the outer members 71 and 72 in the vertical direction are equal to each other, and the width of the inner member 73 is smaller than the width of the outer members 71 and 72. The inner member 73 is arranged between the outer members 71 and 72.

The outer members 71 and 72 are formed by, for example, a water-repellent material, and the inner member 73 is formed by, for example, a hydrophilic material. As the material of the outer members 71 and 72, for example, PCTFE (polychlorotrifluoroethylene) or PTFE (polytetrafluoroethylene) can be used. As the material of the inner member 73, for example, quartz can be used.

A concave portion 710 having a fixed depth is formed on the inner surface of the outer member 71 (the surface facing the inner member 73). The concave portion 710 includes a band-shaped region 711 and a plurality of protruding regions 712. The band-shaped region 711 extends in the Y direction along the lower end of the outer member 71. The plurality of protruding regions 712 are provided so as to protrude upward from the upper ends of the band-shaped regions 711, respectively, and are arranged at equal intervals in the Y direction. In addition, a plurality of introduction paths 71 a are formed in the outer member 71 so as to correspond to the plurality of protrusion regions 712, respectively. One end of each introduction path 71a opens in the corresponding protruding region 712, and the other end opens in the outer surface of the outer member 71. In addition, a plurality of holes 71b are provided in the upper end and both sides of the outer member 71.

A concave portion 720 of a fixed depth is formed on the inner surface of the outer member 72 (the surface facing the inner member 73). The concave portion 720 includes a band-shaped area 721 and a plurality of protruding areas 722. The band-shaped region 721 has the same shape as the band-shaped region 711 of the outer member 71, and each protruding region 722 has the same shape as each protruded region 712 of the outer member 71. A plurality of holes 72b are provided at the upper end and both sides of the outer member 72.

Notches 73a are formed on both sides of the inner member 73 from the lower end to a fixed height. The inner member 73 is locked between the outer members 71 and 72 by a locking member 75 (FIG. 9) described below.

As shown in FIG. 6, the lower ends of the outer surfaces of the outer members 71 and 72 are formed to be inclined inwardly, respectively. In addition, the upper surface and the lower surface of the inner member 73 are curved so as to be continuously connected to one side surface and the other side surface of the inner member 73, respectively.

A step is provided on the inner surface of the outer member 72, and the thickness of the upper portion of the outer member 72 is greater than the thickness of the lower portion. The upper portion of the inner surface of the outer member 72 abuts the upper portion of the inner surface of the outer member 71. The recesses 710 and 720 are formed in the lower part of the inner surface of the outer members 71 and 72, respectively. The inner member 73 is arranged between the recesses 710 and 720.

The flow path FP1a is formed by the band-shaped region 711 of the recess 710 of the outer member 71 and one side of the inner member 73, and the flow is formed by the band-shaped region 721 of the recess 720 of the outer member 72 and the other side of the inner member 73 Road FP2a. In addition, a slit-shaped ejection port OP1 is formed at the lower end of the flow path FP1a, and a slit-shaped ejection port OP2 is formed at the lower end of the flow path FP2a. The ejection ports OP1 and OP2 extend parallel to each other in the Y direction.

A plurality of flow paths FP1b are formed by the plurality of protruding regions 712 of the recess 710 of the outer member 71 and one side of the inner member 73, and the plurality of protruding regions 722 of the recess 720 of the outer member 72 and the other of the inner member 73 A plurality of flow channels FP2b are formed on one side. In FIG. 6, only one flow path FP1b and one flow path FP2b are shown. A communication path CP is formed between the upper surface of the inner member 73 and the step surface GP of the outer member 72. The plurality of flow paths FP1b and the plurality of flow paths FP2b communicate with each other via the communication path CP. In order to disperse the developer between the plurality of flow paths FP1b and the plurality of flow paths FP2b, it is preferable that the introduction path 71a of the outer member 71 is located higher than the upper end portion of the inner member 73.

As shown in FIG. 7, the nozzle mounting portion 61 b of the nozzle arm 61 a has a mounting bottom surface 611 and a mounting side surface 612. A plurality of screw holes 612a are formed on the mounting side 612 so as to line up in the Y direction. In FIG. 7, only one screw hole 612a is shown. In a state where the outer surface of the outer member 71 is in contact with the mounting side surface 612, a plurality of screws SC are screwed into the mounting side surface 612 through the plurality of hole portions 72b of the outer member 72 and the plurality of hole portions 71b of the outer member 71 A plurality of screw holes 612a. As a result, the outer members 71 and 72 are fixed to the nozzle mounting portion 61b. The upper surfaces of the outer members 71 and 72 face the mounting bottom surface 611 of the nozzle mounting portion 61b.

Inside the nozzle mounting portion 61b, a suction path 621, a supply path 622, a liquid storage portion 623, and a plurality of supply paths 624 are provided so as to communicate with each other. Connecting member Inside 630, a suction path 631 is formed. Hereinafter, the internal structure of the nozzle attachment portion 61b and the coupling member 630 will be described.

FIG. 8 is a cross-sectional view taken along line A-A of FIG. 7. As shown in FIG. 8, the liquid accumulating portion 623 gradually expands in the Y direction and extends downward, and then extends downward with a fixed width. The suction path 621 extends from the upper surface of the nozzle attachment portion 61b to the liquid accumulation portion 623. The suction path 631 and the suction path 621 of the connecting member 630 communicate with each other. In addition, the suction pipe 635 communicates with the suction path 631.

The supply path 622 is adjacent to the liquid reservoir 623 in the X direction and extends in the Y direction. One end of the supply path 622 is bent substantially vertically, and the upper end of the liquid reservoir 623 is opened. A plurality of (five in this example) supply channels 624 are arranged in the Y direction, and one end of each supply channel 624 is opened at the lower end of the liquid reservoir 623. Each supply path 624 has a fixed width in the Y direction and extends in a strip shape in the X direction. As shown in FIG. 7, each supply path 624 communicates with a plurality of introduction paths 71 a of the outer member 71. In this example, one supply path 624 is in communication with six introduction paths 71a.

Through the supply path 622, the developer is supplied to the liquid reservoir 623. The developer in the liquid reservoir 623 is introduced into the slit nozzle 61 through a plurality of supply channels 624. In addition, the gas in the liquid storage portion 623 is sucked through the suction channels 621 and 631 and the suction pipe 635 of FIG. 8. Thereby, in the liquid storage part 623, bubbles are removed from the developer.

(4) Locking member

9 and 10 are diagrams for explaining the locking member that locks the inner member 73. In FIG. 9, the inner surface of the outer member 71 is shown, and in FIG. 10, one end of the slit nozzle 61 is shown. In addition, in FIG. 9, the inner member 73 is indicated by a dotted line, and in FIG. 10, the inner member 73 is indicated by a dotted line.

As shown in FIGS. 9 and 10, locking members 75 are attached to both ends of the slit nozzle 61. As shown in FIG. 10, each locking member 75 is fixed to the lower end of the outer members 71 and 72 by a pair of screws 75a, respectively. As shown in FIG. 9, a part of each locking member 75 is located in each notch 73 a of the inner member 73. By this, the inner member 73 is locked by the pair of locking members 75 On both sides.

In addition, in the Y direction, the length of the upper half of the inner member 73 is greater than the length of the concave portion 710 of the outer member 71. Thereby, both ends of one side surface of the inner member 73 abut against the inner surface of the outer member 71 outside the concave portion 710. Therefore, one side surface of the inner member 73 is prevented from contacting the bottom surface of the concave portion 710 of the outer member 71. Therefore, as shown in FIG. 6, the flow paths FP1 a and FP1 b are secured between one side surface of the inner member 73 and the bottom surface of the concave portion 710. Similarly, both ends of the other side surface of the inner member 73 abut against the inner surface of the outer member 72 outside the concave portion 720. Therefore, the other side surface of the inner member 73 is prevented from contacting the bottom surface of the concave portion 720 of the outer member 72. Therefore, as shown in FIG. 6, the flow paths FP2 a and FP2 b are secured between the other side surface of the inner member 73 and the bottom surface of the concave portion 720. In addition, in a state where both side surfaces of the inner member 73 are sandwiched between the outer members 71, 72, the outer members 71, 72 are fixed to the nozzle mounting portion 61b by the screws SC of FIG. 7, whereby the inner member 73 is sandwiched It is held between the outer members 71 and 72.

In this example, the outer members 71 and 72 are screwed separately, but the inner member 73 is not screwed. For example, when the inner member 73 includes quartz, the cost for processing the inner member 73 becomes high. Therefore, forming a hole for screwing in the inner member 73 becomes a factor of increased cost. Therefore, the inner member 73 is not screwed, but the inner member 73 is locked by the locking member 75 and the inner member 73 is sandwiched by the outer members 71 and 72, thereby suppressing an increase in cost.

(5) Supply of developer

FIG. 11 is a schematic cross-sectional view for explaining the supply of the developing solution to the substrate W through the slit nozzle 61. As shown in FIG. 11, the liquid accumulating portion 623 from the nozzle mounting portion 61 b passes through the plurality of supply paths 624 to introduce the developing solution into the plurality of introduction paths 71 a of the slit nozzle 61. The developer is introduced into the plurality of flow paths FP1b through the plurality of introduction paths 71a, and the developer is introduced into the plurality of flow paths FP2b through the plurality of communication paths CP. The plurality of flow paths FP1b introduce the developing solution into the ejection port OP1 through the flow path FP1a, and the developing solution is ejected onto the substrate W from the ejection port OP1. In addition, the developer is introduced into the ejection port OP2 through the plurality of channels FP2b through the channel FP2a, and the developer is ejected onto the substrate W from the ejection port OP2.

The movement direction MD (X direction) of the slit nozzle 61 is perpendicular to the longitudinal direction (Y direction) of the ejection ports OP1 and OP2. In the moving direction MD of the slit nozzle 61, the ejection port OP2 is located further forward than the ejection port OP1.

In the present embodiment, since the developer liquid is discharged from the two discharge ports OP1 and OP2 of the slit nozzle 61, the flow rate and discharge of the developer liquid can be appropriately dispersed compared with the case where the developer liquid is discharged from only one discharge port Pressure. With this, the developer can be uniformly discharged onto the substrate W. As a result, the liquid layer of the developer can be stably formed on the substrate W.

In addition, when the inner member 73 is hydrophilic, sufficient liquid accumulation is formed between the lower surface of the inner member 73 and the upper surface of the substrate W. Therefore, separation of the liquid layer between the lower surface of the inner member 73 and the upper surface of the substrate W can be prevented. In addition, when the outer members 71 and 72 have water repellency, the phenomenon that the developer swells along the outer surfaces of the outer members 71 and 72 can be suppressed. This makes it difficult for the developing solution to adhere to the outer surfaces of the outer members 71 and 72, and can stably maintain the liquid layer on the substrate W.

12 is a cross-sectional view showing the configuration of a slit nozzle of a comparative example. The slit nozzle 61x of FIG. 12 is different from the slit nozzle 61 of FIGS. 4 to 11. In the slit nozzle 61x of FIG. 12, the width of the inner member 73 in the up-down direction is substantially equal to the width of the outer members 71, 72 in the up-down direction. In addition, the flow paths FP2a and FP2b are not formed between the outer member 72 and the inner member 73. Therefore, the developer is discharged only from the discharge port OP1.

The slit nozzle 61 of the present embodiment and the slit nozzle 61x of the above-mentioned comparative example were used to form a liquid layer of the developer on the substrate W, and the results were compared. Specifically, the moving speed of the slit nozzles 61, 61x and the flow rate of the developer are set to various values, and it is investigated whether the distance LL (FIG. 11) in the Y direction from the ejection port OP1 to the front end of the liquid layer is within an appropriate range (In this example, 10 mm or less). When the distance LL exceeds the appropriate range, it is difficult to properly adjust the thickness and the formation range of the liquid layer of the developer, and there is a possibility that the development failure of the substrate W may occur. In addition, the formation of the liquid layer of the developer is performed in a state where the rotation of the substrate W is stopped.

In Tables 1 and 2, "○" indicates that the distance LL (FIG. 11) is within an appropriate range, and "×" indicates that the distance LL (FIG. 11) is beyond the appropriate range.

As shown in Table 1, when the slit nozzle 61 of the present embodiment is used, only when the flow rate of the developer is 2000 ml/min and the movement speed of the slit nozzle 61 is 40 mm/s, the distance LL is larger than appropriate range.

On the other hand, as shown in Table 2, when the slit nozzle 61x of the comparative example is used, when the flow rate of the developer is 1900 ml/min and the movement speed of the slit nozzle 61x is 40 mm/s and is 45 mm In the case of /s, the distance LL exceeds the appropriate range. In addition, when the flow rate of the developer is 2000 ml/min and the movement speed of the slit nozzle 61x is 40 mm/s, when it is 45 mm/min and when it is 50 mm/min, the distance LL exceeds Appropriate range.

In this way, it can be seen that by using the slit nozzle 61 of the present embodiment, the liquid layer of the developer can be appropriately formed on the substrate W as compared with the case of using the slit nozzle 61x of the comparative example.

(6) Effect

In the slit nozzle 61 of this embodiment, the flow paths FP1a and FP1b are formed by one side surface of the inner member 73 and the concave portion 710 of the outer member 71, and the other side surface of the inner member 73 and the concave portion of the outer member 71 At 720, flow channels FP2a and FP2b are formed. The developing solution is introduced into the flow paths FP1a, FP1b, FP2a, and FP2b through the introduction path 71a formed in the outer member 71.

With this configuration, no matter which solution (processing solution) containing the developing solution and resist residue etc. adheres to both side surfaces of the inner member 73 and the concave portions 710 and 720 of the outer members 71 and 72, it can be The flow of the developer in the flow paths FP1a, FP1b, FP2a, and FP2b removes the processing solution. This prevents solid matter from precipitating from the attached treatment solution. As a result, development defects due to precipitation of solid matter are prevented.

In this embodiment, a communication path CP is formed between the upper surface of the inner member 73 and the stepped surface GP of the outer member 72, and the flow paths FP1b and FP2b communicate with each other via the communication path CP. With this, the developer can be introduced into the flow paths FP1a, FP1b, FP2a, and FP2b with a simple configuration. In addition, since one side surface, the other side surface, and the upper surface of the inner member 73 respectively form a flow path of the developing solution, it is possible to reduce a portion of the surface of the inner member 73 where the processing solution may remain. By this, the precipitation of solid matter is sufficiently prevented.

In this embodiment, a band-shaped flow path FP1a is formed so as to extend in one direction along the discharge port OP1, and a plurality of flow paths FP1b are formed so as to protrude upward from the upper end of the flow path FP1a. Further, a band-shaped flow path FP2a is formed so as to extend in one direction along the ejection port OP2, and a plurality of flow paths FP2b are formed so as to protrude upward from the upper end of the flow path FP2a.

By this, the entire flow path FP1a can be uniformly introduced into the development from the plurality of flow paths FP1b Liquid, and the developer is uniformly introduced into the entire flow path FP2a from the plurality of flow paths FP2b. Therefore, the developer can be evenly discharged from the entirety of the discharge ports OP1 and OP2. As a result, the liquid layer of the developer can be stably formed on the substrate W.

(7) Other embodiments

(7-1)

In the above embodiment, the outer members 71 and 72 are provided separately, but the present invention is not limited to this, and the outer members 71 and 72 may be provided integrally. In this case, the number of parts can be reduced. Moreover, the developer is prevented from penetrating into the gap between the outer member 71 and the outer member 72.

(7-2)

In the above embodiment, the flow paths FP1b and FP2b are communicated with each other via the communication path CP, but the present invention is not limited to this. The flow paths FP1b and FP2b may not be connected to each other, and not only the introduction path 71a for introducing the developer to the flow path FP1b but also the introduction path for introducing the developer to the flow path FP2b.

(7-3)

In the above embodiment, band-shaped flow paths FP1a and FP2a are formed so as to extend in one direction along the discharge ports OP1 and OP2, respectively, and a plurality of strips are formed so as to protrude upward from the upper ends of the flow paths FP1a and FP2a The flow paths FP1b and FP2b, but the shape of each flow path is not limited to this, and can be changed as appropriate.

(7-4)

The above embodiment is an example in which the present invention is applied to the slit nozzle 61 having slit-shaped ejection ports OP1 and OP2, but the present invention can also be applied to other developer ejection nozzles. For example, the present invention can also be applied to a developer discharge nozzle having a circular or elliptical discharge port. Alternatively, the present invention can also be applied to the developer discharge nozzles in which a plurality of discharge ports are arranged in a direction.

(8) Correspondence between the constituent elements of the patent application scope and the elements of the embodiment

The following is a comparison of each component of the patent application scope and each element of the embodiment The examples will be described, but the present invention is not limited to the following examples.

In the above embodiment, the slit nozzle 61 is an example of a developer discharge nozzle, the inner member 73 is an example of an inner member, the outer members 71 and 72 are examples of outer members, and the flow paths FP1a and FP1b are examples of first flow paths. , The flow paths FP2a and FP2b are examples of the second flow path, the introduction path 71a is an example of the introduction path and the communication introduction path, the discharge port OP1 is an example of the first discharge port, and the discharge port OP2 is an example of the second discharge port, Y The direction is an example of one direction.

Further, the stepped surface GP is an example of a third inner surface, the communication path CP is an example of a communication path, the locking member 75 is an example of a locking member, the outer member 71 is an example of a first member, and the outer member 72 is a second As an example of the member, the flow path FP1a is an example of a first strip-shaped flow path, the flow path FP1b is an example of a first protruded flow path, the flow path FP2a is an example of a second strip-shaped flow path, and the flow path FP2b is a second protruded flow Examples of roads.

The development processing device 1 is an example of a development processing device, the rotation holding portion 10 is an example of a substrate holding portion, the nozzle arm 61a is an example of a developer supply system, and the nozzle lifting mechanism 62 and the nozzle sliding mechanism 63 are examples of moving devices.

As each constituent element of the patent application scope, other various elements having the structure or function described in the patent application scope may also be used.

[Industry availability]

The invention can be effectively used for the development processing of various substrates.

61‧‧‧slot nozzle

71‧‧‧External components

71a‧‧‧Introduction

72‧‧‧External components

73‧‧‧Inner components

710‧‧‧recess

711‧‧‧banded area

712‧‧‧ Highlighted area

720‧‧‧recess

721‧‧‧banded area

722‧‧‧ Highlighted area

CP‧‧‧Connect

FP1a‧‧‧stream

FP2a‧‧‧stream

FP1b‧‧‧Stream

FP2b‧‧‧stream

GP‧‧‧step difference surface

OP1‧‧‧Spray outlet

OP2‧‧‧Spray outlet

Claims (21)

A developer discharge nozzle, comprising: an inner member having first and second side surfaces facing in opposite directions; a first outer member having a first inner surface facing the first side surface of the inner member; And a second outer member having a second inner surface facing the second side surface of the inner member; and a first inner surface of the first outer member has an upper portion of the first inner surface and a first recess; and the first 1 The concave portion is formed so as to extend below the upper portion of the first inner surface to the lower end of the first outer member; the second inner surface of the second outer member has a second inner surface upper portion and a second concave portion; and the first 2 The concave portion is formed so as to extend below the upper portion of the second inner surface to the lower end of the second outer member; the upper portion of the first inner surface of the first outer member and the upper portion of the second inner surface of the second outer member The first flow path extending vertically is formed between the first side surface of the inner member and the first recess of the first outer member, and the second side surface of the inner member and the second outer member A second flow path extending vertically is formed between the second recesses, and a first discharge port for discharging developer is formed at the lower end of the first flow path, and a second discharge port for discharging developer is formed At the lower end of the second flow path; the position of the upper end of the inner member is lower than the position of the upper end of the first and second recesses; A communication path that connects the first flow path and the second flow path is formed in the first and second concave portions at the upper end of the inner member; and an introduction path that introduces the developing solution to the communication path is provided in the above The first recess is formed in the first outer member so as to open inside. The developer discharge nozzle according to claim 1, wherein the first outer member has an outer surface extending vertically; and the introduction path has one end opened in the first concave portion and the other end opened in the outer surface. The developer discharge nozzle of claim 2, wherein the one end of the introduction path is located higher than the upper end of the inner member. The developer discharge nozzle according to any one of claims 1 to 3, wherein the inner member has higher hydrophilicity than the outer member. The developer discharge nozzle according to any one of claims 1 to 3, further comprising a locking member in which the inner member is located in the first recess of the first outer member and the second of the second outer member The inner member is locked in a manner between the recesses. The developer discharge nozzle according to claim 5, wherein the first outer member has a first locking portion in an area other than the first concave portion; and the second outer member has a second card in an area other than the second concave portion The inner member has a third locking portion in an area other than the area facing the first and second recesses; the lower ends of the first, second, and third locking portions are at the same height, and are formed by The locking portion is supported; the third locking portion of the inner member is sandwiched between the first locking portion of the first outer member and the second locking portion of the second outer member. The developer discharge nozzle according to any one of claims 1 to 3, wherein the first and second discharge ports are slit-shaped and extend in one direction in parallel to each other. The developer discharge nozzle according to claim 7, wherein the first flow path includes: a first strip-shaped flow path formed so as to extend upward in the one side along the first discharge port; and a plurality of first protruding flows Channels, etc. are protruded upward from the upper end of the first strip-shaped flow channel and arranged in the one direction; the second flow channel includes: a second strip-shaped flow channel The second ejection port is formed so as to extend upward in the one side; and a plurality of second protruding flow paths, which are respectively protruded upward from the upper end of the second band flow path, and are arranged in the one direction upward And the above-mentioned introduction channels include a plurality of connected introduction channels, and the plurality of connected introduction channels are provided in such a manner as to communicate with the first and second protruding flow channels of the plurality of channels, respectively. A development processing apparatus includes: a substrate holding portion that holds a substrate in a horizontal posture; the developer discharge nozzle of claim 1; a nozzle mounting portion that mounts the developer discharge nozzle; and a developer supply system that passes the above The nozzle mounting portion supplies the developer to the developer discharge nozzle; and a moving device that moves the developer discharge nozzle relative to the upper surface of the substrate held by the substrate holding portion. The development processing device according to claim 9, wherein the nozzle mounting portion includes a liquid reservoir portion supplied with the developer from the developer supply system, and the introduction path that supplies the developer of the liquid reservoir to the developer discharge nozzle Supply path. The development processing apparatus according to claim 10, wherein the liquid accumulating portion gradually expands in the first horizontal direction and extends downward. The development processing apparatus according to claim 11, wherein the nozzle mounting portion has a suction path that opens at the top of the liquid storage portion. The development processing apparatus according to claim 11 or 12, wherein the first and second ejection ports are slit-shaped and extend in the first direction in parallel with each other. The development processing apparatus according to claim 13, wherein the introduction path of the developer discharge nozzle includes a plurality of communication introduction paths arranged in a row in the first direction; and the supply path of the nozzle mounting portion causes the liquid The accumulation part communicates with the plurality of communication introduction parts. The development processing device according to claim 14, wherein the moving device discharges the developer solution in such a manner that the first and second nozzle openings of the developer discharge nozzle face the surface of the substrate held by the substrate holding portion The nozzle moves in the second horizontal direction crossing the first horizontal direction. The development processing device according to any one of claims 9 to 12, wherein the first and second flow paths of the developer discharge nozzle extend perpendicularly and linearly with respect to the upper surface of the substrate held by the substrate holding portion. A developer discharge nozzle, comprising: an inner member having first and second side surfaces facing in opposite directions; and an outer member having a first inner surface facing the first side surface of the inner member, and A second inner surface facing the second side surface of the inner member; and a first flow path extending vertically is formed between the first side surface of the inner member and the first inner surface of the outer member, at A second flow path extending vertically is formed between the second side surface of the inner member and the second inner surface of the outer member; an introduction path for introducing the developing solution to the first and second flow paths is formed in the above External component A first ejection port for ejecting developer is formed at the lower end of the first flow path, and a second ejection port for ejecting developer is formed at the lower end of the second flow path; and the inner member has a The upper end portion of the first side surface is connected to the upper surface of the upper end portion of the second side surface, and the outer member has an upper end portion of the first inner surface and an upper end portion of the second inner surface connected to the inner member. A third inner surface facing the upper surface is formed between the upper surface of the inner member and the third inner surface of the outer member, and a communication path for communicating the first and second flow paths is formed, and the introduction The channel system is formed such that the developer is introduced into the above-mentioned communication channel. A developer discharge nozzle, comprising: an inner member having first and second side surfaces facing in opposite directions; and an outer member having a first inner surface facing the first side surface of the inner member, and A second inner surface facing the second side surface of the inner member; and a first flow path extending vertically is formed between the first side surface of the inner member and the first inner surface of the outer member, at A second flow path extending vertically is formed between the second side surface of the inner member and the second inner surface of the outer member; an introduction path for introducing the developing solution to the first and second flow paths is formed in the above The outer member; the first ejection port for ejecting developer is formed at the lower end of the first flow path, and the second ejection port for ejecting developer is formed at the lower end of the second flow path; and the outer The member includes: a first member having the aforementioned first inner surface; and a second member having the aforementioned second inner surface; and The first and second members are fixed to each other with the inner member sandwiched between the first and second inner surfaces. A developer discharge nozzle, comprising: an inner member having first and second side surfaces facing in opposite directions; and an outer member having a first inner surface facing the first side surface of the inner member, and A second inner surface facing the second side surface of the inner member; and a first flow path extending vertically is formed between the first side surface of the inner member and the first inner surface of the outer member, at A second flow path extending vertically is formed between the second side surface of the inner member and the second inner surface of the outer member; an introduction path for introducing the developing solution to the first and second flow paths is formed in the above Outer member; the first ejection port for ejecting developer is formed at the lower end of the first flow path, the second ejection port for ejecting developer is formed at the lower end of the second flow path; the first And the second ejection outlets are slit-shaped and extend parallel to each other in one direction; and the first flow path includes: a first band-shaped flow passage extending upward along the first ejection port on the one side Formed in a manner; and a plurality of first protruding flow paths, which are provided so as to protrude upward from the upper end portions of the first strip-shaped flow paths, and are arranged in the one direction upward; the second flow path includes: 2 A band-shaped flow path formed so as to extend upward in the one side along the second ejection port; and a plurality of second protruded flow paths formed from the upper end of the second band-shaped flow path Protruding upwards and arranged in the direction of the one direction; and the introduction path includes a plurality of connected introduction paths, the plurality of connected introduction paths are respectively connected to the first and second protruding flow paths Way setting. A development processing device comprising: the developer discharge nozzle according to any one of claims 17 to 19; a substrate holding portion that holds the substrate in a horizontal posture; and a developer supply system that applies the developer to the developer through the introduction path The ejection nozzle supplies the developer; and a moving device that moves the developer ejection nozzle relative to the substrate held by the substrate holding portion. The development processing device according to claim 20, wherein the moving device moves the developer discharge nozzle in a direction crossing the first and second side surfaces of the inner member.

Images