JP4003440B2 - Surface treatment apparatus and surface treatment method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface treatment apparatus and a surface treatment method.
[0002]
[Prior art]
As a method for drying and removing water adhering to the substrate, a method for drying a substrate using the Marangoni effect by the meniscus due to the surface tension of water and solvent gas + inert gas without causing water droplet marks on the substrate surface Is known (Japanese Patent Laid-Open No. 10-321587).
[0003]
This gazette discloses a drying apparatus (hereinafter referred to as a conventional “drying apparatus”) for carrying out the drying method as well as the drying method. There are disadvantages.
[0004]
1. A conventional drying apparatus has a function of only drying water adhering to a substrate (a plate to be processed). For example, a cleaning process such as a separately prepared cleaning tank is used for the preceding process. Must be done.
[0005]
Therefore, for example, in a line in which cleaning and drying of a substrate are performed continuously, it is necessary to arrange a cleaning device and a drying device side by side and move the substrate between the respective devices for processing. And requires a large installation space.
[0006]
In particular, when the substrate after being cleaned by the cleaning device is transferred to the drying device, it is necessary to prevent dust (foreign matter) from entering and adhering to the substrate. In some cases, it is necessary to install a mechanism or means having a function such as dust prevention.
[0007]
2. Water is attached to the surface of the substrate by some method, but the amount of water attached is not artificially controlled, so it is assumed that the amount of water fluctuates.
[0008]
In this case, as described above, since the gap distance between the draining blocks is fixed, the substrate transport speed becomes faster, or the substrate thickness is thinner than the design value (the substrate surface and the draining block In the case of a water film formed between the inner surface and the inner surface (hereinafter simply referred to as “water film”), it flows into the drying chamber (mixed gas filling space surrounded by the cover). The amount of water used may be excessive. In this case, it takes a long time for drying, or the meniscus increases beyond the appropriate size, and there is a possibility that the drying efficiency is lowered and drying failure (water droplet traces, other particles remain).
[0009]
On the other hand, if the amount of water adhering to the substrate becomes too small, water will be sufficiently diffused and not filled between the substrate surface and the inner surface of the draining block due to capillary action, which also causes poor drying. Cause.
[0010]
3. In the conventional drying apparatus, the meniscus size (the amount of water in the portion constituting the meniscus) varies when the substrate conveyance speed changes, but the meniscus size variation also occurs due to other factors.
[0011]
For example, when the substrate being transported swings in the thickness direction with respect to a pair of draining blocks in a fixed state, the thickness of the water film respectively formed on both surfaces of the substrate in the gap between the draining blocks is It fluctuates over time. As a result, the amount of water replenished to the meniscus varies, and the meniscus size varies. In particular, when the fluctuation speed is high, the meniscus surface (curved surface) vibrates. In this case, even if the substrate swings slightly, the water film is very thin enough to cause capillary action, and therefore the variation in meniscus size is inevitable. Further, such fluctuation is a phenomenon that easily occurs even in a clean room environment. In particular, when the water film is thin, the meniscus size changes with time, and the influence thereof is significant, which causes poor drying such as watermarks and spots.
[0012]
Thus, if the meniscus size fluctuates due to various causes, an imbalance occurs with the drying speed, and drying cannot be performed stably and satisfactorily under certain conditions. In particular, uniform and good drying cannot be performed over the entire substrate surface.
[0013]
4). In the conventional drying apparatus, even when dirt (foreign matter etc.) is mixed into the water entering the gap between the draining blocks, or dirt is generated in the water existing in the gap between the draining blocks (that is, the water film), Since the water cannot be removed or replaced, it is brought into the drying chamber, which may cause poor drying due to such water contamination.
[0014]
5). The conventional drying apparatus is configured such that the substrate passes through the gap between the pair of draining blocks. However, since the gap distance between the draining blocks is fixed, it can cope with changes in the thickness of the substrate. However, drying can be performed only on a substrate having a certain thickness. Further, when there is a pattern on the substrate, the gap between the block and the substrate fluctuates, so that the meniscus fluctuates, and there is a possibility that a portion where a capillary phenomenon does not occur occurs and a water droplet remains.
[0015]
6). In the conventional drying apparatus, both sides of the substrate are wet with water, and both sides of the substrate are simultaneously dried. Therefore, it is difficult to cope with drying only one side of the substrate. In particular, this is not possible when one side of the substrate painted with water is dry and the other side is not to be wetted with water.
[0016]
[Problems to be solved by the invention]
An object of the present invention is to provide a surface treatment apparatus and a surface treatment method capable of performing cleaning and drying of a plate to be processed with one apparatus having a simple configuration.
[0017]
[Means for Solving the Problems]
Such an object is achieved by the present inventions (1) to (14) below.
[0018]
(1) an apparatus main body for supporting the plate to be processed;
A moving body having a facing surface that can be positioned facing the surface of the plate to be treated;
Drive means for moving the movable body relative to the apparatus main body;
Cleaning liquid supply means for supplying a cleaning liquid to a gap between the surface and the facing surface from a cleaning liquid outlet formed in the movable body;
A surface active gas supply means for supplying a surface active gas containing a surfactant into a gap between the surface and the facing surface from a gas outlet formed in the moving body;
In the state where the facing surface is brought close to the surface of the plate to be treated, the cleaning liquid is supplied from the cleaning liquid outlet to the gap between the surface and the facing surface to clean the surface,
While the processed plate is in a non-horizontal state, the movable body is moved by the driving means while supplying the surface active gas from the gas outlet near the meniscus of the cleaning liquid formed on the higher side of the processed plate. The meniscus is moved along the surface to the rotation center side by rotating so that the vicinity of the lower edge of the plate to be processed is opened with respect to the processing plate as a rotation center. , Act to dry the surface,
A plurality of the gas outlets are formed in the moving body,
In the drying process, the gas outlet for supplying the surface active gas is sequentially switched in the moving direction of the meniscus in accordance with the movement of the meniscus.
[0019]
(2) The surface treatment apparatus according to (1), further including a processing plate tilting unit that tilts the processing target plate to make the processing target plate non-horizontal.
[0020]
(3) The surface treatment apparatus according to (1) or (2), further including a conveyance unit that conveys the plate to be processed.
[0021]
(4) The surface treatment apparatus according to (3), further including a positioning unit that positions a conveyance stop position of the processing target plate.
[0022]
(5) The surface treatment apparatus according to any one of (1) to (4), further including a removing unit that removes the cleaning liquid supplied to the gap between the surface of the plate to be processed and the facing surface.
[0023]
(6) The removing means includes an air feeding means for feeding air into a gap between the surface of the plate to be processed and the facing surface, and the air is pushed out and removed from the gap by the air feeding. The surface treatment apparatus as described in 5).
[0024]
(7) After removing the cleaning liquid by the removing means and then supplying the cleaning liquid by the cleaning liquid supply means, the cleaning liquid in the gap between the surface of the plate to be processed and the facing surface can be replaced (5) or The surface treatment apparatus as described in (6).
[0025]
(8) The surface treatment apparatus according to any one of (1) to (7), wherein the moving body has a substantially plate shape.
[0026]
(9) The surface treatment apparatus according to any one of (1) to (8), wherein the size of the plate to be treated and the size of the facing surface are substantially the same.
[0027]
(10) In a state where the facing surface of the moving body having a facing surface that can be positioned facing the surface of the plate to be processed and the surface are close to each other, the surface from the cleaning liquid outlet formed in the moving body Cleaning the surface by supplying a cleaning liquid to the gap with the facing surface;
A surface-active gas containing a surface-active agent is supplied from a gas outlet formed in the movable body near the meniscus of the cleaning liquid formed on the higher side of the plate to be processed in a non-horizontal state. However, by rotating the movable body so as to open with respect to the plate to be processed around the lower edge of the plate to be processed as a rotation center, the meniscus is rotated along the surface to the center of rotation. To the side, thereby drying the surface,
A plurality of the gas outlets are formed in the moving body,
In the drying treatment, the surface treatment method is characterized in that the gas outlet for supplying the surface-active gas is sequentially switched in the meniscus movement direction in accordance with the movement of the meniscus.
[0028]
(11) After removing the cleaning liquid supplied to the gap between the surface of the plate to be processed and the facing surface, supplying the cleaning liquid from the cleaning liquid outlet, thereby replacing the cleaning liquid and performing the cleaning process ( The surface treatment method as described in 10).
[0029]
(12) The surface treatment method according to (10) or (11), wherein the moving body is substantially plate-shaped.
[0030]
(13) The surface treatment method according to any one of (10) to (12), wherein a size of the plate to be treated and a size of the facing surface are substantially the same.
[0031]
(14) The surface treatment method according to any one of (10) to (13), wherein the cleaning liquid is pure water or ozone water.
[0032]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a surface treatment apparatus and a surface treatment method of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
[0033]
1 is a diagram (block diagram) schematically showing an embodiment of a surface treatment apparatus of the present invention, FIG. 2 is a bottom view of a moving body in the surface treatment apparatus shown in FIG. 1, and FIG. 3 is shown in FIG. FIG. 4 is an enlarged partial sectional side view showing the vicinity of the meniscus of the cleaning liquid in FIG. 3.
[0034]
A surface treatment apparatus 1A shown in FIG. 1 and FIG. 2 performs (applies) a treatment with a treatment liquid T, a washing treatment with a washing liquid R, and a drying treatment on the surface (treatment surface 101) of a plate 100 to be treated. It is.
[0035]
The surface treatment apparatus 1A includes an apparatus main body 11 that supports a plate 100 to be processed, a moving body 3 that has a facing surface 31 that can be positioned to face the processing surface 101 of the plate 100 to be processed, and the moving body 3 that has Drive means 5 that moves (displaces) relative to 11, processing liquid supply means 6 that supplies the processing liquid T to the gap 10 between the processing surface 101 and the opposing surface 31, and cleaning liquid supply means that supplies the cleaning liquid R to the gap 10. 7, surface active gas supply means 8 for supplying a surface active gas to the gap 10, transport means 12 for transporting the plate 100 to be processed, positioning means 13 for positioning a transport stop position of the plate 100 to be processed, A processing plate tilting means 14 for tilting the plate 100 to make it non-horizontal and an air supply means 15 for supplying air to the gap 10 are provided.
[0036]
This embodiment demonstrates the case where the to-be-processed board 100 which makes a rectangular flat plate shape is object.
[0037]
The type, material, and the like of the processed plate 100 in the present invention are not particularly limited, and examples thereof include a semiconductor substrate, a substrate such as an LCD (liquid crystal display screen) substrate, a metal plate such as a crystal plate, a glass plate, and a stainless steel plate. It is done. Moreover, the shape of the to-be-processed board 100 is not restricted to a rectangle, For example, a circular shape, an ellipse shape, etc. may be sufficient, and it can apply to the thing of what magnitude | size about it. That is, the present invention can be applied to any plate (plate-like member) treatment.
[0038]
The apparatus main body 11 can support the processed plate 100 in a substantially horizontal state or in a state where the processed plate 100 is inclined by the processed plate inclination means 14 described later. The surface treatment apparatus 1 </ b> A performs a process as described later on the treatment surface 101 that is the upper surface of the plate 100 to be treated supported by the apparatus main body 11.
[0039]
The apparatus main body 11 is provided with a conveying means 12 for conveying the plate 100 to be processed. The conveying means 12 has a plurality of rollers 121, and conveys the processing target plate 100 placed on these rollers 121 from the right side to the left side in the drawing in a substantially horizontal state.
[0040]
The processed plates 100 are carried one by one from the previous process (not shown) located on the right side in the drawing to the surface processing apparatus 1A by the conveying means 12, and after the processing in the surface processing apparatus 1A is finished, It is carried out to the post process (not shown) located on the left side.
[0041]
The apparatus main body 11 is provided with positioning means 13 for positioning the conveyance stop position of the processed plate 100 carried in by the conveyance means 12. The positioning means 13 has a stopper 131. The stopper 131 protrudes on the transport path of the plate 100 (the state shown in FIG. 1) and retracts from the transport path (not shown). ) And can be displaced.
[0042]
The mechanism for moving the stopper 131 up and down (displaced) can be realized by, for example, a mechanism having a rack gear, a pinion gear, and a motor that rotates the pinion gear. Note that this embodiment is realized by arranging a plurality of the mechanisms.
[0043]
The processed plate 100 carried into the surface treatment apparatus 1A from the conveying means 12 is stopped with respect to the apparatus main body 11 when the left edge 102 in the drawing contacts the stopper 131 in the protruding state. The processing by the surface treatment apparatus 1A is performed in this conveyance stopped state.
[0044]
When the processing on the processed plate 100 is completed, the positioning means 13 puts the stopper 131 in the retracted state, and releases the positioned state (stopped state) on the processed plate 100. As a result, the processed plate 100 that has been processed is carried out to the subsequent process by the conveying means 12. Next, the positioning means 13 brings the stopper 131 into a protruding state, and the conveying means 12 carries the next processed plate 100 into the conveyance stop position. Then, the surface treatment apparatus 1 </ b> A performs processing on the plate to be processed 100.
[0045]
Thus, the surface treatment apparatus 1A is a single wafer processing type apparatus, and processes the target plates 100 one by one.
[0046]
The apparatus main body 11 is further provided with a plate inclination means 14 to be processed. The to-be-processed board inclination means 14 has the pin 141 which can be displaced in the state which protruded on the conveyance path | route of the to-be-processed board 100 (state shown in FIG. 3), and the state which retracted from the conveyance path | route (state shown in FIG. 1). Have. The upper end of the pin 141 can be brought into contact with the lower surface of the right end portion in the drawing of the processed plate 100 at the conveyance stop position.
[0047]
The mechanism for moving the pin 141 up and down (displacement) can be realized by, for example, a mechanism having a rack gear, a pinion gear, and a motor that rotates the pinion gear. Note that this embodiment is realized by arranging a plurality of the mechanisms.
[0048]
As shown in FIG. 3, when the processing plate tilting means 14 protrudes the pin 141, the processing target plate 100 is tilted by lifting the right end side in the drawing and becomes non-horizontal.
[0049]
As described above, the apparatus main body 11 can support the processed plate 100 in both a horizontal state and a non-horizontal state.
[0050]
In addition, by adjusting the protrusion amount of the pin 141, the inclination angle α (see FIG. 3) of the processing target plate 100 with respect to the horizontal plane can be adjusted (changed).
[0051]
As will be described later, in the present invention, the processing surface 101 is dried while the processing target plate 100 is in a non-horizontal state, but in the present embodiment, the processing target plate tilting means 14 is provided. Thus, the to-be-processed board 100 can be carried in and carried out in a horizontal state. Therefore, compared with the case where the to-be-processed board 100 is conveyed in the non-horizontal state (inclined state), the efficiency of conveyance of the to-be-processed board 100 can be improved. In addition, the entire processing surface 101 can be uniformly and reliably processed by performing processing with the processing liquid T described later and cleaning processing with the cleaning liquid R in a state where the processing target plate 100 is horizontal.
[0052]
Note that the conveying unit 12 and the positioning unit 13 are not limited to the configurations shown in the drawings, and may have any configurations as long as they can exhibit the same function. Further, the processing plate tilting means 14 is not limited to the configuration shown in the figure as long as it can tilt the processing plate 100 without causing deformation of the processing plate 100 such as warpage. It may be.
[0053]
As shown in FIG. 2, the moving body 3 has a substantially rectangular plate shape (flat plate shape). As shown in FIG. 1, the facing surface 31, which is the lower surface of the moving body 3, faces the processing surface 101 of the processing target plate 100 (substantially in parallel) and can be positioned close to the processing surface 101. Yes.
[0054]
The surface processing apparatus 1A supplies the processing liquid T and the cleaning liquid R to the gap 10 formed between the opposing surface 31 and the processing surface 101 in a state where the opposing surface 31 is close to the processing surface 101 in a substantially parallel manner. A treatment with the treatment liquid T and a cleaning treatment are performed. The distance between the processing surface 101 and the opposing surface 31 (gap distance of the gap 10) when this processing is performed is such that the processing liquid T and the cleaning liquid R are sufficiently distributed in the gap 10, and the processing liquid T and the cleaning liquid R are affected by surface tension. The size is such that it can stay in the gap 10 and is preferably about 1 to 5 mm.
[0055]
In the present invention, when the processing liquid T or the cleaning liquid R is supplied to the gap 10 and processing is performed as described above, the processing target plate 100 is immersed in the tank in which the processing liquid T or the cleaning liquid R is stored. As compared with the above, the amount of the treatment liquid T and the cleaning liquid R used can be greatly reduced.
[0056]
In the present embodiment, the size of the facing surface 31 is substantially the same as or slightly larger than the size of the processed plate 100.
[0057]
Such a moving body 3 is provided so as to be movable (displaceable) with respect to the apparatus main body 11, and is driven (moved) by the driving means 5. The drive means 5 can rotate at least the movable body 3 around the rotation center 30 (see FIG. 3). In addition to this, the driving means 5 is capable of moving the moving body 3 in the direction described later. As this drive means 5, for example, various known drive mechanisms using a combination of a servo motor, a fluid pressure cylinder, a feed screw, a cam mechanism, a gear mechanism, a link mechanism, and the like can be used.
[0058]
The processing liquid supply means 6 that supplies the processing liquid T to the gap 10 extends from the processing liquid tank 61 that stores the processing liquid T, the processing liquid outlets 62 a to 62 h formed in the moving body 3, and the processing liquid tank 61. A supply line (flow path) 63, a pump 64 installed in the middle of the supply line 63, and a branch line (flow path) branched from the supply line 63 into eight and connected to the processing liquid outlets 62a to 62h, respectively. 66a to 66h.
[0059]
The processing liquid T performs various types of processing on the processing surface 101, and the operation of the pump 64 causes the processing liquid outlets 62 a to 62 h to pass from the processing liquid tank 61 through the supply line 63 and the branch lines 66 a to 66 h. And flows into the gap 10.
[0060]
The treatment with the treatment liquid T may be any treatment, for example, a resist coating process (resist), a stripping process for stripping the resist, an etching process, a cleaning process, a masking film removal process, a plating process, etc. Is mentioned.
[0061]
The treatment liquid T used for the resist stripping treatment is preferably ozone water (ozone aqueous solution) or dilute hydrofluoric acid. Thereby, the effect which removes a resist residue, a polymer, etc. can be heightened more.
[0062]
As shown in FIG. 2, the treatment liquid outlets 62 a to 62 h are configured by a plurality of small holes (orifices) that open to the facing surface 31, and these small holes are formed in a plurality of rows (eight rows in the illustrated configuration). ). In other words, the treatment liquid outlets 62a to 62h are arranged in a matrix (matrix). Thereby, the processing liquid T can be spread evenly over the entire processing surface 101.
[0063]
Here, for convenience of explanation, among the processing liquid outlets 62a to 62h, those arranged in the vertical direction in FIG. 2 (direction perpendicular to the paper surface of FIG. 1) are referred to as “rows”. Differentiate each column by letter. That is, what constitutes the rightmost column in the figure is the processing liquid outlet 62a, and what constitutes the left seven columns in the figure is the processing liquid outlets 62b to 62h, respectively.
[0064]
Note that the number of the processing liquid outlets 62a to 62h (the number of rows and the number of columns) is not limited to the illustrated configuration, and is appropriately set according to the size of the processing target plate 100, the viscosity of the processing liquid T, and the like.
[0065]
The small holes forming the treatment liquid outlets 62 a to 62 h are formed so as to penetrate to the upper surface 32 of the moving body 3. And the elongate casing 65a-65h which forms a flow path is each fixed to the upper surface 32 of the mobile body 3 for every row | line | column of the process liquid outflow ports 62a-62h. Thereby, the flow paths to the treatment liquid outlets 62a to 62h communicate with each other in the casings 65a to 65h for each row.
[0066]
Branch lines 66a to 66h branched from the supply line 63 are connected to the casings 65a to 65h, respectively. With such a configuration, the processing liquid tank 61 and the processing liquid outlets 62a to 62h are connected.
[0067]
In the present embodiment, a plurality of processing liquid outlets 62a to 62h are provided in a matrix, but in the present invention, at least one processing liquid outlet may be provided.
[0068]
Further, the treatment liquid supply means 6 may be capable of supplying a plurality of kinds of treatment liquids T (for example, ozone water and SC1 (ammonia water + excess water) or ozone water and dilute hydrofluoric acid). . That is, the processing liquid supply unit 6 may perform a plurality of types of processing on the processing surface 101.
[0069]
The cleaning liquid supply means 7 for supplying the cleaning liquid (rinsing liquid) R to the gap 10 includes a cleaning liquid tank 71 for storing the cleaning liquid R, a cleaning liquid outlet 72 formed in the moving body 3, a cleaning liquid tank 71, and a switching valve 70. A supply line (flow path) 73 to be connected, a pump 74 installed in the middle of the supply line 73, and a supply line (flow path) 75 for connecting the switching valve 70 and the cleaning liquid outlet 72 are configured.
[0070]
The cleaning liquid R performs a cleaning process (rinsing process) of the processing surface 101. When the switching valve 70 is in a first state to be described later, the pump 74 operates to pass the supply lines 73 and 75 from the cleaning liquid tank 71. Then, it flows out from the cleaning liquid outlet 72 and is supplied to the gap 10.
[0071]
The cleaning liquid R is not particularly limited as long as it performs a cleaning process, but is preferably pure water or ozone water. Thereby, the cleaning effect can be further improved.
[0072]
When pure water is used as the cleaning liquid R, for example, distilled water, ion exchange water, ultrapure water, RO water, or the like can be used. Further, when ozone water is used as the cleaning liquid R, it is preferable that the concentration is lower than that of the ozone water used as the treatment liquid T.
[0073]
As shown in FIG. 2, the cleaning liquid outlet 72 is composed of one small hole that opens at substantially the center of the facing surface 31. The small hole is formed so as to penetrate to the upper surface 32 of the movable body 3, and a casing 76 is fixed to an opening portion to the upper surface 32. A supply line 75 is connected to the casing 76.
[0074]
In the present embodiment, the processing liquid outlets 62a to 62h and the cleaning liquid outlet 72 are provided separately, but the processing liquid T and the cleaning liquid R may flow out from the same outlet. That is, the supply line for the treatment liquid T and the supply line for the cleaning liquid R may be shared (shared).
[0075]
In the illustrated configuration, the shapes of the processing liquid outlets 62a to 62h and the cleaning liquid outlet 72 are circular, but are not limited thereto, and may be, for example, elliptical or rectangular.
[0076]
The surface active gas supply means 8 for supplying the surface active gas to the gap 10 includes a surface active gas tank 81 for storing the surface active gas, a supply line (flow path) 82 extending from the surface active gas tank 81, and a middle of the supply line 82. And a provided pump 83.
[0077]
The surface active gas is a gas containing a surface active agent and has a property of reducing the surface tension of the cleaning liquid R when dissolved (absorbed) in the cleaning liquid R.
[0078]
As the surfactant contained in the surfactant gas, for example, various alcohols such as isopropyl alcohol (IPA), methyl alcohol, and ethyl alcohol can be used.
[0079]
The surfactant gas may be such a surfactant gas itself. For example, nitrogen (N ₂ ) It is preferable to mix about 0.1 to 10% of a surfactant gas with an inert gas (a gas with poor reactivity) such as a gas. Even if it is diluted in this way, the function as the surface active gas in the present invention can be sufficiently exerted, so that the amount of volatile organic compound (VOC) released (used) is further reduced. This is because it is preferable.
[0080]
A switching valve 80 is provided in the middle of the branch line 66 a of the processing liquid supply means 6, and the supply line 82 is connected to the switching valve 80.
[0081]
The switching valve 80 communicates the upstream side 661a and the downstream side 662a with respect to the switching valve 80 in the branch line 66a, and communicates the supply line 82 and the downstream side 662a with a first state in which the supply line 82 is closed (blocked). Then, it is possible to switch to the second state in which the upstream side 661a is closed (blocked).
[0082]
When the switching valve 80 is in the second state, the surface active gas passes from the surface active gas tank 81 through the supply line 82 and the downstream side 662a of the branch line 66a and from the processing liquid outlet 62a by the operation of the pump 83. It flows out and is supplied to the gap 10.
[0083]
Thus, in this embodiment, the processing liquid supply means 6 and the surface active gas supply means 8 share (share) the processing liquid outlet 62a and the downstream side 662a of the branch line 66a. That is, the treatment liquid outlet 62a is also a gas outlet from which the surface active gas flows out.
[0084]
In this embodiment, by sharing (sharing) a part of the flow path in the supply line of the treatment liquid T and the supply line of the surface active gas in this way, the configuration of the apparatus can be further simplified and downsized. it can.
[0085]
The air supply means 15 for supplying air to the gap 10 is, for example, nitrogen (N ₂ ) An inert gas tank 151 for storing an inert gas (a gas having poor reactivity) such as a gas, a supply line 152 extending from the inert gas tank 151, and a pump 153 provided in the middle of the supply line 152. Yes.
[0086]
The supply line 152 is connected to the switching valve 70. The switching valve 70 communicates the supply line 73 and the supply line 75 of the cleaning liquid supply means 7, and communicates the supply line 152 and the supply line 75 with a first state in which the supply line 152 is closed (blocked). It is possible to switch to the second state in which the line 73 is closed (blocked).
[0087]
When the switching valve 70 is in the second state and the pump 153 of the air supply means 15 is activated, the inert gas flows out from the cleaning liquid outlet 72 through the supply line 152 and the supply line 75 from the inert gas tank 151. To do. By supplying air to the gap 10 in this way, the processing liquid T or the cleaning liquid R supplied to the gap 10 can be pushed out (blowed off) and removed. That is, the air supply means 15 serves as a removal means for removing the processing liquid T and the cleaning liquid R supplied to the gap 10.
[0088]
After removing the processing liquid T or the cleaning liquid R in the gap 10 by the air supply means 15 as such a removing means, the processing liquid supply means 6 or the cleaning liquid supply means 7 supplies the processing liquid T or the cleaning liquid R again. The processing liquid T or the cleaning liquid R in the gap 10 can be replaced quickly and without any liquid remaining. Similarly, when the next processing is performed by switching the type of the processing liquid T, or when the cleaning liquid R is supplied after finishing the processing of the processing liquid T, the liquid can be replaced quickly and without any liquid remaining.
[0089]
Thus, in this embodiment, the processing liquid supply means 6 and the surface active gas supply means 8 share (share) the processing liquid outlet 62a and the downstream side 662a of the branch line 66a. That is, the treatment liquid outlet 62a is also a gas outlet from which the surface active gas flows out.
[0090]
In this embodiment, by sharing (sharing) a part of the flow path in the supply line of the treatment liquid T and the supply line of the surface active gas in this way, the configuration of the apparatus can be further simplified and downsized. it can.
[0091]
Drive means 5, pump 64 for treatment liquid supply means 6, pump 74 for cleaning liquid supply means 7, pump 84 for surface active gas supply means 8, transport means 12, positioning means 13, plate inclination means 14 for processing, air supply means 15 The switching valve 70 and the switching valve 80 are electrically connected to the control means 50, respectively, and operate based on a signal (control signal) from the control means 50.
[0092]
Such a surface treatment apparatus 1A may be provided with a collecting means for removing or collecting the processing liquid T and the cleaning liquid R that have flowed out (spilled) from the gap 10. Examples of the recovery means include a receiving tray (liquid reservoir) that receives the processing liquid T and the cleaning liquid R, and an absorbent material that absorbs the processing liquid T and the cleaning liquid R.
[0093]
Further, in the surface treatment apparatus 1A, the transport unit 12, the positioning unit 13, and the processing target plate tilting unit 14 may be omitted.
[0094]
Next, an embodiment of the surface treatment method of the present invention using the surface treatment apparatus 1A (operation of the surface treatment apparatus 1A) will be described.
[0095]
[1] In a state where the moving body 3 is retracted upward by the driving means 5, the processed plate 100 is carried by the conveying means 12. The processed plate 100 is positioned at a predetermined position by the stopper 131 and stopped.
[0096]
[2] Next, the moving body 3 is lowered by the driving unit 5, and the facing surface 31 is brought close to the processing surface 101. At this time, the facing surface 31 is made substantially parallel to the processing surface 101, and the gap distance between the facing surface 31 and the processing surface 101 is set to the size described above.
[0097]
In the present invention, the gap distance between the facing surface 31 and the processing surface 101 can be adjusted by adjusting the descent stop position of the moving body 3 at this time. By adjusting the gap distance of the gap 10, the amount of the treatment liquid T and the cleaning liquid R attached to the treatment surface 101 can be controlled. Moreover, it can respond to what the board thickness of the to-be-processed board 100 differs.
[0098]
The surface treatment apparatus 1 </ b> A detects the position of the processing surface 101 of the loaded processing target plate 100 with a sensor, and automatically adjusts the gap distance between the facing surface 31 and the processing surface 101 to a set value. It may be configured. Thereby, when processing with respect to the several to-be-processed board 100 continuously, it can respond also to the case where board | plate thickness changes from the middle.
[0099]
Further, unlike [1], the processing target plate 100 may be carried in with the moving body 3 in a predetermined lowering stop position.
[0100]
[3] Next, the switching valve 80 is placed in a state where the upstream side 661a and the downstream side 662a of the branch line 66a are in communication with each other, and the pump 64 is operated. Thereby, the processing liquid T is supplied from the processing liquid outlets 62 a to 62 h to the gap 10 between the processing surface 101 and the facing surface 31. When the gap 10 is filled with the processing liquid T, the pump 64 is stopped. In this way, a predetermined process using the processing liquid T is performed on the processing surface 101.
[0101]
During the processing with the processing liquid T, the moving body 3 (opposing surface 31) may be swung (vibrated) along the processing surface 101 (in a direction substantially parallel to the processing surface 101) by the driving unit 5. As a result, a minute flow is generated in the treatment liquid T in the gap 10 and is agitated, so that more reliable processing is performed and the processing efficiency can be improved.
[0102]
The swinging direction of the moving body 3 in this case may be the left-right direction or the up-down direction in FIG.
[0103]
Further, after the gap 10 is filled with the processing liquid T, the processing may be performed while the pump 64 is operated. As a result, since the processing can be performed in a state where new processing liquid T is continuously supplied, the processing liquid T in the gap 10 can be kept in a fresh state free from alteration, deterioration, dirt, etc. Can be further improved.
[0104]
Further, the air supply means 15 is operated to supply air to the gap 10, and after all the processing liquid T in the gap 10 is removed, the processing liquid supply means 6 refills the gap 10 with the processing liquid T, whereby the gap 10 The processing liquid T may be completely replaced to continue the processing. Thereby, the further improvement of processing efficiency can be aimed at. The replacement of the treatment liquid T may be performed a plurality of times as necessary.
[0105]
[4] When processing with a plurality of types of processing liquid T is performed (when the processing liquid supply means 6 can supply a plurality of types of processing liquid T), the processing liquid T is switched to a different type and the above-mentioned The same process as [3] is performed. Thereby, multiple types of processing can be performed.
[0106]
[5] Next, the air supply means 15 is operated to supply air to the gap 10 and the processing liquid T in the gap 10 is removed. This step may be omitted.
[0107]
[6] Next, the switching valve 70 is placed in a state where the supply line 73 and the supply line 75 are communicated, and the pump 74 is operated. As a result, the cleaning liquid R is supplied to the gap 10 from the cleaning liquid outlet 72. When the gap 10 is filled with the cleaning liquid R, the pump 64 is stopped. In this way, the cleaning process (rinsing process) is performed on the processing surface 101.
[0108]
Even after the gap 10 is filled with the cleaning liquid R, the pump 64 may continue to operate, and the cleaning process may be performed while flowing the cleaning liquid R into the gap 10 (while continuing to supply it). As a result, the cleaning efficiency (cleaning effect) can be improved.
[0109]
Also, once the pump 64 is stopped and the air supply means 15 is operated to supply air to the gap 10 to remove all of the processing liquid T in the gap 10, the cleaning liquid R is again introduced into the gap 10 from the cleaning liquid outlet 72. By filling, the cleaning liquid R in the gap 10 may be completely replaced and the cleaning process may be continued. As a result, the cleaning efficiency can be further improved, and the processing surface 101 can be cleaned more cleanly. Therefore, the degree of cleaning of the processing surface 101 after drying can be further improved. The replacement of the cleaning liquid R may be performed a plurality of times as necessary.
[0110]
Further, as a method for further enhancing the cleaning effect, an ultrasonic wave applying means (not shown) may be installed on the moving body 3 and ultrasonic cleaning may be used in combination.
[0111]
[7] Next, as shown in FIG. 3, the processed plate 100 is tilted by projecting the pins 141 of the processed plate tilting means 14, and is brought into a non-horizontal state.
[0112]
At this time, simultaneously with inclining the plate to be processed 100, the moving body 3 is inclined in the same direction by the driving means 5, the gap distance between the processing surface 101 and the opposing surface 31 is kept substantially constant, and the cleaning liquid R is placed in the gap 10. Is carried out in a state where it remains (filled).
[0113]
The inclination angle α with respect to the horizontal plane of the plate 100 to be processed at this time is not particularly limited and is appropriately determined in consideration of the viscosity of the cleaning liquid R and the like. In this embodiment, it is preferably about 1 to 30 °. 1 to 15 ° is more preferable.
[0114]
In such a state, a meniscus M of the cleaning liquid R is formed in the gap 10 on the higher level side (right side in the drawing) of the processed plate 100. The meniscus M has a substantially U-shaped (arc-shaped) curved surface.
[0115]
In addition, in this invention, the inclination angle with respect to the horizontal surface of the to-be-processed board 100 in a drying process is not restricted to the said range, but can be 1-90 degrees. That is, the drying process can be performed even when the plate 100 is vertical to the horizontal plane.
[0116]
[8] Next, the switching valve 80 is brought into communication between the supply line 82 and the downstream side 662a of the branch line 66a, and the pump 83 is operated. As a result, the surface active gas flows out from the processing liquid outlet 62a, and this surface active gas is supplied to the vicinity of the meniscus M of the cleaning liquid R formed on the higher level side of the processing target plate 100.
[0117]
When the surface active gas is dissolved in the cleaning liquid R, the surface tension of the cleaning liquid R is reduced in the vicinity of the meniscus M. Thereby, when particles (foreign matter such as dust) P are attached to the processing surface 101, the cleaning liquid R enters between the particles P and the processing surface 101, and the particles P float on the cleaning liquid R. (See FIG. 4).
[0118]
Further, in the meniscus M, a concentration gradient is generated in which the surfactant concentration decreases (decreases gradually) from the vicinity of the end M1 (end on the processing surface 101 side) toward the center M2, and thus the surface tension is It increases from the vicinity of the end M1 toward the center M2 (increases gradually). This is because the film thickness of the cleaning liquid R (distance between the processing surface 101 and the meniscus M) is smaller (thin) near the end portion M1 than the central portion M2, so that the dissolved (absorbed) surface active gas (surface activity) This is because the degree of dilution of the agent is small.
[0119]
Due to the difference (gradient) in surface tension as described above, a flow from the end M1 toward the center M2 occurs in the cleaning liquid R in the vicinity of the meniscus M, as indicated by the arrows in FIG. The effect caused by the surface tension (difference) is called the Marangoni effect, and this flow is called the Marangoni flow.
[0120]
When such a Marangoni flow occurs, in the vicinity of the end M1 of the meniscus M, the cleaning liquid R evaporates and the processing surface 101 is dried while the film thickness of the cleaning liquid R is further reduced. Thus, the processing surface 101 can be dried without leaving a water droplet mark (watermark) by evaporating and drying the cleaning liquid R in a thin film state.
[0121]
The particles P are caused to flow from the vicinity of the end M1 of the meniscus M toward the center M2 by the Marangoni flow. Therefore, it is possible to dry without leaving the particles P on the processing surface 101.
[0122]
In the meniscus M, a Marangoni flow from the end M3 opposite to the end M1 (the end on the facing surface 31 side) toward the center M2 is also generated by the same mechanism as described above. Thereby, in the drying process of the processing surface 101, it can prevent that the particle P remains also on the opposing surface 31, Therefore, when processing with respect to the to-be-processed board 100 next, on the opposing surface 31 It is possible to prevent the particles P from moving to the processing surface 101 and attaching.
[0123]
A hood (windshield) for preventing the supplied surface active gas from escaping from the gap 10 may be provided around the movable body 3 and the plate 100 to be processed. Thereby, the usage-amount of surface active gas can further be reduced.
[0124]
[9] Next, while the surface active gas is supplied to the vicinity of the meniscus M from the processing liquid outlet 62a, the driving means 5 rotates the vicinity of the edge 102 on the lower side (left side in the figure) of the processed plate 100. As the center 30, the moving body 3 is slowly rotated so as to open with respect to the processing target plate 100. Thereby, the meniscus M gradually moves toward the rotation center 30 side (edge portion 102 side). Along with this, the cleaning liquid R in the gap 10 gradually flows out from the vicinity of the edge 102. The outflowing cleaning liquid R is removed or recovered by the recovery means.
[0125]
By moving the meniscus M to the edge 102 in this way, the drying process as described in [8] can be performed on almost the entire processing surface 101.
[0126]
In the present invention, when the meniscus M moves, the liquid film in the vicinity of the end M1 is broken due to the fact that the surface tension in the vicinity of the meniscus M is reduced and the Marangoni flow from the end M1 toward the center M2 is generated. Thus, no droplets of the cleaning liquid R remain on the processing surface 101. Therefore, it is possible to perform a good drying without remaining water mark or particles P.
[0127]
Further, in the surface treatment apparatus 1A, by performing such a drying process with the processing target plate 100 in a non-horizontal state, the meniscus M can be moved more smoothly, and the droplets of the cleaning liquid R can be transferred onto the processing surface 101. Can be more reliably prevented.
[0128]
The moving speed of the meniscus M can be appropriately adjusted to a speed at which good drying is performed by adjusting the rotating speed of the moving body 3. In the present invention, by adjusting the moving speed of the meniscus M and the adjustment of the gap distance of the gap 10, it is possible to deal with different types of processed plates 100, cleaning liquids R, and the like.
[0129]
Note that the surface treatment apparatus and the surface treatment method of the present embodiment perform the treatment with the treatment liquid T prior to the cleaning treatment and the drying treatment of the treatment surface 101, but in the present invention, the treatment with the treatment liquid T is performed. It may be the one without the processing liquid supply means 6.
[0130]
As described above, in the present invention, by utilizing the Marangoni effect, the processing surface 101 can be reliably and uniformly dried, and the degree of cleanness of the processing surface 101 after drying is high.
[0131]
In addition, the cleaning and drying of the plate to be processed 100 can be performed with one apparatus, in particular, the cleaning and drying can be performed continuously, and these can be achieved with an apparatus having a simple configuration. Therefore, it is not necessary to prepare a cleaning device and a drying device separately and move the processed plate 100 between them to sequentially perform processing, thereby reducing the equipment cost and the installation space of the device. Has the advantage of being small.
[0132]
In particular, the surface treatment apparatus 1A according to the present invention does not perform cleaning and drying while conveying the plate 100 to be processed in the direction of the processing surface 101. Therefore, unlike the conventional drying apparatus, Therefore, it is not necessary to secure a transport path, and thus the apparatus can be reduced in size and space. In the present embodiment, since the size of the plate to be processed 100 and the facing surface 31 are substantially the same, and the size of the moving body 3 is not wasteful, such an effect becomes more remarkable.
[0133]
In addition, since cleaning and drying can be performed continuously with one apparatus, it is possible to reliably prevent foreign matters such as particles P removed from the processing target plate 100 from re-adhering. The degree of cleanness of the subsequent processing surface 101 is high.
[0134]
Further, as described above, in the present invention, it is possible to control the adhesion amount of the cleaning liquid R on the processing surface 101 by adjusting the gap distance of the gap 10 during drying, and the processed plate 100 is fixed. Since the process is performed in the state, there is no swing in the thickness direction of the plate 100 to be processed, so that the meniscus M can be maintained in an appropriate size and dried. Thereby, the improvement of the further drying efficiency can be aimed at, uniform drying can be performed over the whole processing surface 101, and the cleanliness degree of the processing surface 101 after drying also improves.
[0135]
Further, in the present invention, unlike the case where the drying process is performed by blowing the drying air ejected from the conventional air knife nozzle, the droplets of the cleaning liquid R are not scattered, and thus the processing surface 101 after the drying is cleaned. The degree is remarkably high.
[0136]
In addition, the amount of volatile organic compound used (amount released) is much smaller than when performing conventional IPA (isopropyl alcohol) vapor drying treatment. Therefore, the equipment can be further simplified such that the explosion-proof specification of the apparatus is not required, the equipment cost can be further reduced, and the burden on the environment is small.
[0137]
In the present embodiment, the processing target plate 100 is subjected to processing with the processing liquid T and cleaning processing with the cleaning liquid R in a horizontal state. However, in the present invention, the processing target plate 100 is in a non-horizontal state (on a horizontal plane). These may be performed in an inclined state or a vertical state. Furthermore, in the present invention, as described above, it is possible to perform the drying process even when the plate to be processed 100 is perpendicular to the horizontal plane. Therefore, the treatment with the treatment liquid T and the cleaning liquid are performed with the plate to be processed 100 perpendicular to the horizontal plane. A cleaning process and a drying process using R may be performed. In this case, even if the processed plate 100 is relatively large, it does not take up space, and the installation space for the apparatus can be further reduced.
[0138]
In the present embodiment, the surface active gas flows out from the processing liquid outlet 62a. However, the surface active gas outlet is changed from the processing liquid outlet 62a to the processing liquid outlet as the meniscus M moves. It is good also as what switches sequentially toward 62h. In order to realize such a mechanism, for example, a switching valve connected to the surface active gas tank 81 is also installed in each of the branch lines 66b to 66h, and the meniscus M is determined from the rotation speed (rotation position) of the moving body 3 or the like. These positions are detected, these valves are opened and closed, and the surface active gas outlet is sequentially switched from the outlet 62a toward the processing liquid outlet 62h.
[0139]
The surface treatment apparatus and the surface treatment method of the present invention have been described above with respect to the illustrated embodiment. However, the present invention is not limited to this. Moreover, each part which comprises the surface treatment apparatus of this invention can be substituted with the thing of the arbitrary structures which can exhibit the same function.
[0140]
【The invention's effect】
As described above, according to the present invention, cleaning and drying of a plate to be processed can be performed with one apparatus, in particular, cleaning and drying can be performed continuously, and these can be easily configured. Can be achieved with the device. Therefore, it is not necessary to prepare the cleaning device and the drying device separately, move the processed plate between them, and sequentially perform the processing, thereby reducing the equipment cost and the installation space of the device. It has the advantage of being small.
[0141]
In particular, since the apparatus of the present invention does not perform cleaning and drying while transporting the plate to be processed in the direction of the processing surface, a transport path is secured for drying the plate to be processed, as in the case of conventional drying apparatuses. Therefore, it is possible to reduce the size and space of the apparatus. In this case, when the size of the opposite surface is substantially the same as the plate to be processed, such an effect becomes more remarkable.
[0142]
And in the present invention, it is possible to remove or replace the cleaning liquid at the time of cleaning, so that it is not cleaned as a dirty cleaning liquid, and drying can be performed immediately after such cleaning, The degree of cleanliness of the dried surface is high.
[0143]
In particular, when pure water or ozone water is used as the cleaning liquid, the cleaning effect can be further improved.
[0144]
Moreover, according to this invention, it can respond also to what has a plate | board thickness from which a to-be-processed board differs.
[0145]
Further, in the present invention, the drying efficiency is high, and good drying without remaining water droplet traces or particles is possible. In particular, it is possible to control the amount of cleaning liquid adhering to the surface of the plate to be processed during drying, and since there is no oscillation in the thickness direction of the plate to be processed, the meniscus can be maintained at an appropriate size for drying. Thus, the drying efficiency can be further improved, uniform drying can be performed over the entire surface to be dried of the plate to be processed, and the degree of cleanliness of the dried surface is improved.
[0146]
In the present invention, only one side of the plate to be processed can be cleaned and dried, and various patterns such as single-sided cleaning / drying and double-sided cleaning / drying can be handled.
[0147]
Further, when the processing plate tilting means is provided, the processing plate can be placed in a horizontal state and a non-horizontal state. For example, the processing plate can be carried in / out or washed in a horizontal state. Advantages of performing processes other than drying in a horizontal state, such as improving efficiency, can be obtained.
[0148]
In addition, when performing the cleaning process in a non-horizontal state of the plate to be processed, particularly when the plate is processed in a horizontal state due to the large size of the plate to be processed, a relatively large installation space is required. Even if it is a case, the advantage of performing in a non-horizontal state that the installation space of an apparatus may be smaller can be enjoyed.
[0149]
In addition, in the case of having a processing plate conveying means or further having a positioning means, when processing a plurality of processing plates, particularly when processing these continuously, it is advantageous for automation of processing, Contributes to the improvement of mass productivity.
[Brief description of the drawings]
FIG. 1 is a diagram (block diagram) schematically showing an embodiment of a surface treatment apparatus of the present invention.
FIG. 2 is a bottom view of a moving body in the surface treatment apparatus shown in FIG.
3 is a partial cross-sectional side view showing a state in which a moving body is rotated in the surface treatment apparatus shown in FIG. 1;
4 is an enlarged partial sectional side view showing the vicinity of the meniscus of the cleaning liquid in FIG. 3;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1A ... Surface treatment apparatus 3 ... Moving body 31 ... Opposite surface 32 ... Upper surface 5 ... Driving means 6 ... Process liquid supply means 61 ... Process liquid tank 62a-62h ... Process liquid outlet 63 ... Supply line 64 …… Pump 65a to 65h …… Case 66a to 66h …… Branch line 661a …… Upstream side 662a …… Downstream side 7 …… Cleaning liquid supply means 71 …… Cleaning liquid tank 72 …… Cleaning liquid outlet 73 …… Supply Line 74 ... Pump 75 ... Supply line 76 ... Casing 8 ... Surfactant gas supply means 81 ... Surfactant gas tank 82 ... Supply line 83 ... Pump 11 ... Main body 12 ... Conveyance means 121 ... Roller 13 ... Positioning means 131 ... Stopper 14 ... Processed plate tilting means 141 ... Pin 15 ... Air supply means 151 ... Inert gas tank 52 …… Supply line 153 …… Pump 10 …… Gap 30 …… Rotation center 50 …… Control means 70 …… Switching valve 80 …… Switching valve 100 …… Processed plate 101 …… Processing surface 102 …… Edge T …… Processing solution R …… Cleaning solution M …… Menicus M1 …… End M2 …… Center M3 …… End P …… Particle

Claims (14)

An apparatus main body for supporting the processed plate;
A moving body having a facing surface that can be positioned facing the surface of the plate to be treated;
Drive means for moving the movable body relative to the apparatus main body;
Cleaning liquid supply means for supplying a cleaning liquid to a gap between the surface and the facing surface from a cleaning liquid outlet formed in the movable body;
A surface active gas supply means for supplying a surface active gas containing a surfactant into a gap between the surface and the facing surface from a gas outlet formed in the moving body;
In the state where the facing surface is brought close to the surface of the plate to be treated, the cleaning liquid is supplied from the cleaning liquid outlet to the gap between the surface and the facing surface to clean the surface,
While the processed plate is in a non-horizontal state, the movable body is moved by the driving means while supplying the surface active gas from the gas outlet near the meniscus of the cleaning liquid formed on the higher side of the processed plate. The meniscus is moved along the surface to the rotation center side by rotating so that the vicinity of the lower edge of the plate to be processed is opened with respect to the processing plate as a rotation center. , Act to dry the surface,
A plurality of the gas outlets are formed in the moving body,
In the drying process, the gas outlet for supplying the surface active gas is sequentially switched in the moving direction of the meniscus in accordance with the movement of the meniscus.   The surface treatment apparatus of Claim 1 which has a to-be-processed board inclination means which inclines the said to-be-processed board and makes it a non-horizontal state.   The surface treatment apparatus of Claim 1 or 2 which has a conveyance means to convey the said to-be-processed board.   The surface treatment apparatus of Claim 3 which has a positioning means which positions the conveyance stop position of the said to-be-processed board.   The surface treatment apparatus according to claim 1, further comprising a removing unit that removes the cleaning liquid supplied to a gap between the surface of the plate to be processed and the facing surface.   The said removal means is comprised by the air supply means which supplies air to the clearance gap between the surface of the said to-be-processed board, and the said opposing surface, The said cleaning liquid is pushed out from the said clearance gap by this air supply, and is removed. Surface treatment equipment.   The cleaning liquid in the gap between the surface of the plate to be processed and the facing surface can be replaced by supplying the cleaning liquid by the cleaning liquid supply means after removing the cleaning liquid by the removing means. Surface treatment equipment.   The surface treatment apparatus according to claim 1, wherein the movable body has a substantially plate shape.   The surface treatment apparatus according to claim 1, wherein a size of the plate to be treated and a size of the facing surface are substantially the same. The surface facing the surface from a cleaning liquid outlet formed in the moving body in a state where the facing surface of the moving body having a facing surface that can be positioned to face the surface of the plate to be processed is close to the surface. Cleaning the surface by supplying a cleaning liquid to the gap between,
A surface-active gas containing a surface-active agent is supplied from a gas outlet formed in the movable body near the meniscus of the cleaning liquid formed on the higher side of the plate to be processed in a non-horizontal state. However, by rotating the movable body so as to open with respect to the plate to be processed around the lower edge of the plate to be processed as a rotation center, the meniscus is rotated along the surface to the center of rotation. To the side, thereby drying the surface,
A plurality of the gas outlets are formed in the moving body,
In the drying treatment, the surface treatment method is characterized in that the gas outlet for supplying the surface-active gas is sequentially switched in the meniscus movement direction in accordance with the movement of the meniscus.   11. The cleaning process is performed by replacing the cleaning liquid by supplying the cleaning liquid from the cleaning liquid outlet after removing the cleaning liquid supplied to the gap between the surface of the plate to be processed and the facing surface. Surface treatment method.   The surface treatment method according to claim 10 or 11, wherein the moving body has a substantially plate shape.   The surface treatment method according to claim 10, wherein a size of the plate to be treated and a size of the facing surface are substantially the same.   The surface treatment method according to claim 10, wherein the cleaning liquid is pure water or ozone water.

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