TWI689025B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI689025B
TWI689025B TW105134908A TW105134908A TWI689025B TW I689025 B TWI689025 B TW I689025B TW 105134908 A TW105134908 A TW 105134908A TW 105134908 A TW105134908 A TW 105134908A TW I689025 B TWI689025 B TW I689025B
Authority
TW
Taiwan
Prior art keywords
substrate
center line
pattern
support member
reel
Prior art date
Application number
TW105134908A
Other languages
English (en)
Chinese (zh)
Other versions
TW201724322A (zh
Inventor
小宮山弘樹
加藤正紀
鈴木智也
奈良圭
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW201724322A publication Critical patent/TW201724322A/zh
Application granted granted Critical
Publication of TWI689025B publication Critical patent/TWI689025B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW105134908A 2015-10-30 2016-10-28 基板處理裝置 TWI689025B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015213786 2015-10-30
JPJP2015-213786 2015-10-30

Publications (2)

Publication Number Publication Date
TW201724322A TW201724322A (zh) 2017-07-01
TWI689025B true TWI689025B (zh) 2020-03-21

Family

ID=58630287

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105134908A TWI689025B (zh) 2015-10-30 2016-10-28 基板處理裝置
TW109104739A TWI745865B (zh) 2015-10-30 2016-10-28 基板處理裝置及元件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109104739A TWI745865B (zh) 2015-10-30 2016-10-28 基板處理裝置及元件製造方法

Country Status (5)

Country Link
JP (3) JP6741018B2 (ja)
KR (2) KR102220858B1 (ja)
CN (3) CN111781806B (ja)
TW (2) TWI689025B (ja)
WO (1) WO2017073608A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070028881A (ko) * 2005-09-08 2007-03-13 세메스 주식회사 기판 처리 장치 및 방법
KR20130009555A (ko) * 2011-07-13 2013-01-23 주식회사 원익아이피에스 기판지지부재 얼라인 장치와 이를 포함한 기판처리시스템, 및 기판지지부재 얼라인 방법
TW201447501A (zh) * 2013-04-18 2014-12-16 尼康股份有限公司 基板處理裝置、元件製造方法、掃描曝光方法、曝光裝置、元件製造系統及元件製造方法
WO2015152217A1 (ja) * 2014-04-01 2015-10-08 株式会社ニコン 基板処理装置、デバイス製造方法及び基板処理装置の調整方法

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JPH08316135A (ja) * 1995-05-12 1996-11-29 Nikon Corp 投影露光装置
JP3884098B2 (ja) * 1996-03-22 2007-02-21 株式会社東芝 露光装置および露光方法
JP2001215718A (ja) * 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
JP4202576B2 (ja) * 2000-03-23 2008-12-24 富士フイルム株式会社 走査露光装置
US7256811B2 (en) * 2002-10-25 2007-08-14 Kodak Graphic Communications Canada Company Method and apparatus for imaging with multiple exposure heads
JP2005026528A (ja) * 2003-07-03 2005-01-27 Nikon Corp 投影光学系、露光装置、調整方法、及び露光方法
JP2005316116A (ja) * 2004-04-28 2005-11-10 Dainippon Screen Mfg Co Ltd 円筒外面走査装置および方法
JP2006337614A (ja) * 2005-05-31 2006-12-14 Fujifilm Holdings Corp 描画方法および装置
JP4224479B2 (ja) 2005-09-07 2009-02-12 富士フイルム株式会社 パターン露光方法及び装置
JP4948866B2 (ja) * 2006-03-27 2012-06-06 富士フイルム株式会社 描画状態調整方法及び装置
JP2007298603A (ja) * 2006-04-28 2007-11-15 Shinko Electric Ind Co Ltd 描画装置および描画方法
JP2009116080A (ja) * 2007-11-07 2009-05-28 Nsk Ltd 露光方法及び露光装置
JP5404619B2 (ja) * 2008-06-09 2014-02-05 シャープ株式会社 露光装置
US8820234B2 (en) * 2009-10-30 2014-09-02 Esko-Graphics Imaging Gmbh Curing of photo-curable printing plates with flat tops or round tops by variable speed exposure
CN103477286A (zh) * 2011-09-07 2013-12-25 株式会社尼康 基板处理装置
CN106200277B (zh) * 2012-03-26 2018-02-27 株式会社尼康 处理装置
JP6123252B2 (ja) * 2012-11-21 2017-05-10 株式会社ニコン 処理装置及びデバイス製造方法
JP6074898B2 (ja) * 2012-03-26 2017-02-08 株式会社ニコン 基板処理装置
WO2014034161A1 (ja) * 2012-08-28 2014-03-06 株式会社ニコン 基板支持装置、及び露光装置
JP2014081452A (ja) * 2012-10-16 2014-05-08 Nikon Corp 露光装置、およびデバイス製造方法
JP2015018006A (ja) * 2013-07-08 2015-01-29 株式会社ニコン 基板処理装置、デバイス製造システム及びデバイス製造方法
JP2015145990A (ja) * 2014-02-04 2015-08-13 株式会社ニコン 露光装置
TWI639064B (zh) * 2014-04-01 2018-10-21 日商尼康股份有限公司 基板處理裝置及元件製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070028881A (ko) * 2005-09-08 2007-03-13 세메스 주식회사 기판 처리 장치 및 방법
KR20130009555A (ko) * 2011-07-13 2013-01-23 주식회사 원익아이피에스 기판지지부재 얼라인 장치와 이를 포함한 기판처리시스템, 및 기판지지부재 얼라인 방법
TW201447501A (zh) * 2013-04-18 2014-12-16 尼康股份有限公司 基板處理裝置、元件製造方法、掃描曝光方法、曝光裝置、元件製造系統及元件製造方法
WO2015152217A1 (ja) * 2014-04-01 2015-10-08 株式会社ニコン 基板処理装置、デバイス製造方法及び基板処理装置の調整方法

Also Published As

Publication number Publication date
KR20210024206A (ko) 2021-03-04
JP6950787B2 (ja) 2021-10-13
CN108351607B (zh) 2020-07-10
CN111781806B (zh) 2023-06-16
JP6741018B2 (ja) 2020-08-19
CN111781807A (zh) 2020-10-16
TWI745865B (zh) 2021-11-11
JP2019168705A (ja) 2019-10-03
KR20180075532A (ko) 2018-07-04
TW201724322A (zh) 2017-07-01
CN108351607A (zh) 2018-07-31
KR102357198B1 (ko) 2022-02-08
CN111781806A (zh) 2020-10-16
CN111781807B (zh) 2024-01-12
JPWO2017073608A1 (ja) 2018-08-16
WO2017073608A1 (ja) 2017-05-04
TW202025353A (zh) 2020-07-01
JP6733778B2 (ja) 2020-08-05
KR102220858B1 (ko) 2021-02-26
JP2020177239A (ja) 2020-10-29

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