TWI685287B - Electronic device and method of making the same - Google Patents

Abstract

This invention relates to an electronic device, comprising a protective body, a printed circuit board, at least one electronic component and a connecting member. The printed circuit board is enclosed in the protective body. The electronic component is enclosed in the protective body and disposed on a front surface of the printed circuit board. The connecting member is disposed on a rear surface of the printed circuit board with its only one end surface exposed at a top surface of the protective body and with its other portions enclosed in the protective body.

Description

Electronic device manufacturing method and its structure

The invention relates to a manufacturing method and structure of an electronic device, in particular to a manufacturing method and structure of an embedded radio frequency identification tag.

Nowadays, the price is dropping rapidly year by year, and the use of RFID tags has become more and more common. In the foreseeable future, there will be more and more items with RFID tags. Therefore, how to design the RFID tag package The structure to make it suitable for attaching to items (non-animals) that you want to attach will be one of the industry's future development priorities.

At present, most RFID tags are attached to articles in a conforming manner, and there are also methods of embedding or embedding RFID tags in articles. For example, Taiwan’s I497421 “Embedded RFID Tag”, the method is to embed a RFID tag into the mounting hole of a metal object. However, like the general method of embedding or embedding, the chip and antenna in this method are in It is easy to damage when it is embedded in the mounting hole without protection. Therefore, it is an urgent task to provide a well-protected embedded or embedded radio frequency identification tag.

In view of the problem that conventional embedded or embedded RFID tags lack good protection, the present invention provides an electronic device manufacturing method and structure that can be applied to embedded or embedded RFID tags to solve the problem.

More specifically, the present invention provides an electronic device manufacturing method. The method includes the following steps: First, a multi-circuit substrate and a bracket are provided. Wherein, the multi-circuit substrate includes a frame board and a plurality of circuit boards located in the frame board and spaced apart and arranged in a row, and a hollowed-out portion formed between the periphery of each circuit board and the frame board and used for The connected connection part is maintained, and a circuit pattern and electronic parts soldered on the circuit pattern are on the front of each circuit board, and a connection area is on the back of each circuit board. The bracket piece has a plurality of support rods protruding from one side in the same direction and arranged in a row at intervals, and the support rods respectively correspond to the connection areas of the circuit boards.

Next, a bonding operation is performed on the provided multi-circuit board and the bracket piece, so that a connecting block of each pole of the bracket piece is respectively bonded to the connection area on the back of the corresponding circuit board on the multi-circuit board . Then, a cutting operation is performed on the multi-circuit board 1 to which the bracket piece has been joined, to cut off the connection portion on the multi-circuit board, so that the circuit boards are separated from the frame board. Then, a protective body forming operation is carried out on the circuit boards combined with the bracket sheet, so that each circuit board and the electronic parts and connecting blocks on it are respectively covered in a protective body.

In an embodiment, the method of the present invention further includes: performing a disconnection operation on the supporting rods that already have the protective bodies, so as to cut off the supporting rods to obtain a plurality of electrons respectively having the protective bodies Device.

In one embodiment, the manufacturing steps of the above multi-circuit board of the present invention include: providing a printed circuit board with at least one row of the circuit pattern formed on the front side of the printed circuit board, and at least one row of the connection area formed on the back side. A connection area is opposite to the corresponding circuit pattern; a punching operation is performed on the printed circuit board to form the hollow portion and the connection portion on the periphery of each circuit pattern, so that the printed circuit board has multiple The circuit boards that have not been separated, each has a circuit pattern and a connection area on the front and back of each circuit board; a soldering operation is performed on the printed circuit board that has undergone the punching operation, to Electronic components are soldered to each circuit pattern of the printed circuit board. Preferably, the manufacturing step of the multi-circuit board further includes: performing a dividing operation on the printed circuit board to which the electronic components have been soldered, to obtain multiple pieces of the multi-circuit board. Wherein, the manufacturing step of the multi-circuit board further includes: after the soldering operation, performing a glue application operation on the printed circuit board to form a solid protective glue on each electronic component on the printed circuit board.

In one embodiment, the method of the present invention further includes: after the bonding operation, performing a glue application operation on the electronic components on the multi-circuit substrate to form a separate one on each electronic component on the multi-circuit substrate Insulating protective glue. Preferably, the method of the present invention further includes: after the bonding operation, performing another glue application operation on the multi-circuit substrate to form another insulating protective glue on each connection block on the multi-circuit substrate.

The invention also provides an electronic device, which includes a protective body made of non-conductive material, a circuit board and a connection block all covered by the protective body, wherein the circuit board includes a circuit on the front The pattern, the electronic parts soldered on the circuit pattern, and a connection area on the back, the connection block is coupled to the connection area, and one end surface of the connection block is exposed to a top surface of the protector.

In one embodiment, the electronic device of the present invention further includes an insulating protective glue, which is covered by the protective body and covers the electronic parts.

In one embodiment, the electronic component in the electronic device of the present invention includes a radio frequency identification chip and an inductor. The radio frequency identification chip is close to the top surface of the protective body, and the inductor is close to a bottom surface of the protective body.

In an embodiment, the protective body of the electronic device of the present invention is cylindrical, and its diameter is larger in the middle section, and gradually decreases from the middle section toward the top surface.

In one embodiment, the electronic device of the present invention further includes another insulating protective glue, which is covered by the protective body and covers the connection block.

In one embodiment, the electronic device of the present invention further includes an insulating protective glue, the protective glue is covered by the protective body, and the protective glue completely covers the radio frequency identification chip Above the inductor, the protective glue also covers a front face and two opposite sides of the inductor, and is covered to be equal to the inductor, wherein the front face of the inductor is adjacent to the RFID chip, and the two opposite sides are respectively Continue on the two opposite sides of the front.

Compared with the prior art, the electronic device manufactured by the above method of the present invention, its electronic parts (such as radio frequency identification chip and inductor) are sealed in the above protection body, so it can be well protected, and indeed solve the conventional embedded or The chip and antenna of the embedded radio frequency identification tag lack good protection.

FIG. 1 shows a flowchart of an embodiment of a method for manufacturing an electronic device of the present invention. The method includes step a, that is, providing a multi-circuit substrate 1 as shown in FIGS. 7 and 8. In this embodiment, the multi-circuit board 1 is a flexible circuit board, but it is not limited thereto. Among them, the manufacturing steps of the multi-circuit substrate 1 are shown in Figure 2:

First, step a1 is executed to provide a printed circuit board 100 shown in FIGS. 3 and 4. The printed circuit board 100 can be obtained by the existing printed circuit board manufacturing technology. In this embodiment, at least one row of circuit patterns 110 has been formed on the front side of the printed circuit board 100, and at least one row of connection regions 112 is formed on the back side. Each connection region 112 is opposite to the corresponding circuit pattern 110. In this embodiment, a plurality of rows are displayed, and each row has 8 circuit patterns 110 and the same number of connection areas 112 from back to back, but not limited to this.

Perform step a2 to perform a punching operation on the printed circuit board 100 to form a hollow portion 12 and a connection portion 13 for maintaining connection on the periphery of each circuit pattern 110, as shown in FIGS. 5 and 6 In order to make the printed circuit board 100 have a plurality of circuit boards 11 that have not yet been separated, each circuit board 11 has a circuit pattern 110 and a connection area 112 on the front and back respectively. Each circuit board 11 is a circuit board of an electronic device, such as a circuit board of a high-frequency radio frequency identification tag (RFID Tag), typically a circuit board of a radio frequency identification tag in the frequency band of 13.56 MHz, but not Limited. In addition, in this embodiment, the hollow portion 12 may include two opposed and substantially U-shaped hollow holes, and the connecting portion 13 may include two small thin neck pieces respectively located between the two hollow holes. Each circuit board 11 maintains a state of being integrally connected to the printed circuit board 100 through its own connection portion 13.

Then, step a3 is performed to perform a soldering operation on the printed circuit board 100 that has been subjected to the punching operation (for example, using surface component bonding technology (SMT)), for each circuit pattern 110 on the printed circuit board 100 Solder electronic parts 111 (see FIG. 7), such as a radio frequency identification chip 111a and an inductor 111b (inductor 111b is used as an antenna of the radio frequency identification chip 111a). In addition, the execution order of step a3 and step a2 can be replaced with each other. However, if the welding operation of step 3 is performed before the punching operation of step a2, the soldered electronic parts may be loosened due to the impact of the punching force. If step 2 is performed first and then step a3 is performed, the aforementioned loosening of electronic components can be avoided.

Step a4 is performed to perform a dividing operation on the printed circuit board 100 with the soldered electronic parts 111, for example, cutting along the dotted line shown in FIG. 5 to obtain a plurality of multi-circuit boards 1, as shown in FIGS. 7 and 8 Each multi-circuit board 1 that comes out includes a long frame 10 and a plurality of circuit boards 11 located in the frame 10 and spaced apart in a row. However, if there is only one row of the circuit patterns 110 and one row of the connection areas 112 on the front and back of the printed circuit board 100, respectively, after performing steps a2 and a3, a piece of the multi-circuit substrate 1 can be obtained without the need Then perform this step a4. So far, the provision of the multi-circuit substrate 1 in the above step a is completed.

Please refer to FIG. 1 again. The manufacturing method of the electronic device of the present invention further includes a step b, namely, providing at least one bracket sheet 2. As shown in FIGS. 9 and 10, the support piece 2 has two opposite sides, a plurality of positioning holes 200 arranged in a row and close to one side, and a plurality of positioning holes protruding from the other side in the same direction and spaced The struts 201 are arranged in a row. The number and position of the support rods 201 correspond to the circuit boards 11 on the multi-circuit board 1 provided in step a. For example, in this embodiment, since there are 8 circuit boards 11 on the multi-circuit board 1, there are 8 Two bracket pieces 2 are provided, and each bracket piece 2 has four support rods 201, and the positions of the support rods 201 correspond to the circuit boards 11 on the multi-circuit board 1 one-to-one. In addition, it is also possible to provide a support piece 2 with 8 struts 201 instead of the two support pieces 2 mentioned above. Among them, the support sheet 2 can be made by using the existing light-emitting diode support tape 20 as shown in FIG. 11, that is, according to the number and position of the circuit boards 11 on the multi-circuit substrate 1, the light-emitting diode The bracket tape 20 performs a cutting operation to obtain the aforementioned bracket piece 2.

Please note that the above steps a and b are in no particular order.

Next, step c is performed to perform a bonding operation on the provided multi-circuit substrate 1 and the support piece 2 for bonding a connecting block 201a of each pole 201 of the support piece 2 to the phases on the multi-circuit board 1 respectively Corresponding to the connection area 112 on the back of the circuit board 11, one is shown in FIG. In this embodiment, two support pieces 2 are used, and each connecting area 112 is a solder pad, and the connecting block 201a of each strut 201 is soldered to the corresponding solder pad.

Then, step d is performed to perform a cutting operation on the multi-circuit board 1 to which the support sheet 2 has been bonded, for example, a punching operation, to cut off the connection portion 13 on the multi-circuit board 1, so that the circuit boards 11 are removed from The frame plate 10 is separated, as shown in FIGS. 13 and 14. Before the cutting operation, each circuit board 11 is connected to the frame board 10 only by the small connecting portion 13, so only a small force is needed to cut the connecting portion 13 , Can greatly reduce the probability of the electronic parts on the circuit board 11 vibrating loosely due to punching.

Step e is performed, a protective body forming operation is performed on the circuit board 11 bonded to the support sheet 2, so that each circuit board 11 and the electronic parts 111 and the connection block 201 a thereof are respectively covered in a protective body 3 , As shown in Figure 15. In this embodiment, the protective body 3 is a non-conductive material, preferably made of plastic material or rubber material, but not limited to this, such as injection molding with a heat-resistant plastic material at 200 degrees Celsius. In this way, each circuit board 11 and the electronic component 111 thereon can be well protected by the protective body 3, which solves the problem of the conventional embedded or embedded radio frequency identification tags lacking good protection.

Preferably, the method of the present invention may further include step f, namely: performing a disconnection operation on the support rod 201 that already has the protective body 3, such as a punching operation, to cut off the support rods 201 to obtain A plurality of electronic devices as shown in FIGS. 16 to 18. Wherein, if each support rod 201 of the provided bracket piece 2 has been punched out in advance with all marks with a predetermined depth, the breaking operation performed in this step f is a breaking operation, that is, along the The notch breaks the support rod 201 to separate the electronic device having the protective body 3 from the bracket sheet 2.

Please refer to FIGS. 16 to 18, showing the structure of an electronic device using the method of the present invention, which includes a protective body 3, a circuit board 11 and a connection block 201a all covered by the protective body 3, wherein the protective body 3 is a non-conductive material, preferably plastic or rubber material. In addition, the height of the protector 3 is approximately 4 mm and the maximum diameter is approximately 4.1 mm, but it is not limited thereto. The circuit board 11 includes a circuit pattern 110 on the front (see FIG. 7), electronic parts 111 soldered on the circuit pattern 110, and a connection area 112 on the back (see FIG. 8). The connection block 201a is coupled to the connection In the region 112, one end surface of the connecting block 201a is exposed to a top surface of the protective body 3. Preferably, the RFID chip 111a of the electronic component 111 is close to the top surface of the protective body 3, the inductor 111b of the electronic component 111 is close to a bottom surface of the protective body 3, and the connection area 112 is also close to the surface of the protective body 3 Top surface, but not limited to this. When in use, the top surface of the electronic device is inserted into a hole on an article (not shown), so after being fully inserted, the top surface and the bottom surface of the electronic device are located at the bottom of the hole and the The opening allows the inductor 111b to be as close as possible to the opening, and the end surface of the connection block 201a is not visible from the outside.

In addition, the middle section of the protective body 3 is cylindrical and its diameter gradually decreases from the middle section to the top and bottom surfaces, respectively, so that the thicker middle section has only a small circle (the outer diameter of this small circle is usually slightly larger than the inner diameter of the hole ), and the magnitude of the taper towards the top is greater than that towards the bottom. In this way, the electronic device can be easily inserted into the hole, and is firmly locked in the hole.

Preferably, in the manufacturing step of the multi-circuit board 11 shown in FIG. 2, after the soldering operation in step a3, a glue application operation is performed on the printed circuit board 100 for the electronic parts 111 on the printed circuit board 100 Form an insulating protective glue 51 (see Figures 19 to 22), and then continue to perform the division operation of step a4; or, perform the glue application operation after the combination operation of step c, and then continue to perform the cutting of step d Break the job. In any case, in this gluing operation, epoxy resin can be used to apply glue to the electronic parts 111 on the printed circuit board 100. In this way, each electronic component 111 on the multi-circuit board 1 provided in step a above is provided with a protective glue 51 as shown in FIGS. 19 to 22 to protect the electronic component 111. Since the protective glue 51 covers the electronic parts 111 and fills the gap between the electronic parts 111 (for example, the gap between the RFID chip 111a and the inductor 111b), for example, in this embodiment, the protective glue 51 is completely covered The RFID chip 111a is coated to be approximately equal to the inductor 111b, and the protective glue 51 also covers a front face and two opposite sides of the inductor 111b, and is coated to be substantially equal to the inductor 111b, wherein the front face of the inductor 111b Adjacent to the RFID chip 111a, the two opposite sides are respectively connected to the two opposite sides of the front, so that the entire electronic part 111 is formed by the protective glue 51 to form a solid piece, so that the electronic part 111 is carried out in the subsequent The steps will not or not easily loosen. For example, when the protective body forming operation of step e is performed with a plastic injection mold, the protective glue 51 can prevent the electronic component 111 from being loose or not easily affected by the impact of the injection pressure, and can improve the plastic material in the plastic injection mold Liquidity. In addition, the protective glue 51 can also improve the adhesion of the electronic component 111 and strengthen the structural strength of the board body of the circuit board 111 itself, so as to resist the impact of vibration during the punching or cutting operation.

More preferably, after the combining operation in step c, another glue application operation is performed on the multi-circuit substrate 11 to form another insulating protective glue 52 on the connection block 201a on the multi-circuit substrate 11 (see Figure 18~22), and then continue to perform the cutting operation of step d. In this gluing operation, epoxy resin may also be used for gluing the connection block 201 a on the multi-circuit board 11. In this way, each connecting block 201a on the multi-circuit substrate 1 in FIG. 12 is respectively covered with a protective glue 52 as shown in FIGS. 19 to 22 to protect the connecting block 201a. Similarly, the protective glue 52 can prevent the connection block 201a from being loosened or not easy to be loosened in the subsequent steps, and can improve its adhesion and strengthen the structural strength of the circuit board 111 itself.

In summary, it can be seen that the electronic device of the present invention can protect the electronic components 111 on the internal circuit board 11 by the protective body 3, which does solve the prior art problems.

100‧‧‧ printed circuit board 1‧‧‧Multi circuit board 10‧‧‧Long frame 11‧‧‧ circuit board 110‧‧‧ circuit pattern 111‧‧‧Electronic parts 111a‧‧‧ radio frequency identification chip 111b‧‧‧Inductance 112‧‧‧ connection area 12‧‧‧ Cutout Department 13‧‧‧ Connection 2‧‧‧Bracket 20‧‧‧ LED bracket 200‧‧‧Locating hole 201‧‧‧Pole 201a‧‧‧Connecting block 3‧‧‧Protection 51、52‧‧‧Protection glue

FIG. 1 is a flowchart of an embodiment of a manufacturing method of an electronic device of the present invention. FIG. 2 is a manufacturing flowchart of the multi-circuit board of the embodiment of the present invention. 3 and 4 are partial plan views of the front and back sides of the printed circuit board in this embodiment of the invention. 5 and 6 are partial plan views of the front and back sides of the printed circuit board punched in this embodiment of the invention. 7 and 8 are partially enlarged perspective views (front and back) of the multi-circuit board in this embodiment of the invention. 9 and 10 are an enlarged partial plan view and an enlarged partial perspective view of a bracket piece in this embodiment of the present invention. Fig. 11 is a partial plan view of a bracket band used in this embodiment of the present invention. FIG. 12 is a plan view of the bracket piece and the multi-circuit board in the embodiment of the present invention. 13 and 14 are partially enlarged perspective views (front and back) of the support rod of the bracket piece in this embodiment of the present invention when it is combined with a circuit board. FIG. 15 is an enlarged partial perspective view of the circuit board on the bracket sheet in the embodiment of the present invention after being covered with a protective body. 16 to 18 are plan, three-dimensional and cross-sectional views (after enlarged) of an embodiment of the electronic device of the present invention. 19 to 22 are plan, perspective and cross-sectional views (after enlarged) of another embodiment of the electronic device of the present invention.

Claims (11)

An electronic device manufacturing method includes: providing a multi-circuit substrate, the multi-circuit substrate includes a frame board and a plurality of circuit boards located in the frame board and spaced apart in a row, the periphery of each circuit board and the frame There are hollowed-out portions and connecting portions for maintaining connection between the boards, and a circuit pattern and electronic parts soldered on the circuit pattern are on the front of each circuit board, and a connection area is provided on the back of each circuit board; A bracket piece having a plurality of support rods protruding from one side in the same direction and arranged in a row at intervals, the support rods respectively correspond to connection areas of circuit boards; and to the provided multi-circuit substrate Performing a bonding operation with the bracket piece, so that a connecting block of each pole of the bracket piece is respectively bonded to the connection area on the back side of the corresponding circuit board on the multi-circuit board; Performing a cutting operation on the circuit board to cut off the connecting parts on the multi-circuit board to separate the circuit boards from the frame board; and performing a protective body forming operation on the circuit board bonded to the support piece, In this way, each circuit board and the electronic parts and connecting blocks on it are wrapped in a protective body. The method according to claim 1, further comprising: A breaking operation is performed on the supporting rods that already have the protective bodies, so as to cut off the supporting rods to obtain a plurality of electronic devices each having the protective body. The method according to claim 1, wherein the manufacturing step of the multi-circuit substrate includes: providing a printed circuit board, at least one row of the circuit pattern has been formed on the front side of the printed circuit board, and at least one row of the connection area is formed on the back side Each connection area is opposite to the corresponding circuit pattern; a punching operation is performed on the printed circuit board to form the hollowed portion and the connection portion on the periphery of each circuit pattern to make the printed circuit board Having a plurality of circuit boards that have not been separated, each circuit board has a circuit pattern and a connection area on the front and back sides; and a soldering operation is performed on the printed circuit board that has undergone the punching operation, Used to solder electronic parts on each circuit pattern of the printed circuit board. The method according to claim 3, comprising: performing a dividing operation on the printed circuit board to which the electronic components have been soldered, to obtain a plurality of the multi-circuit substrates. The method according to claim 3, comprising: after the soldering operation, performing a glue application operation on the printed circuit board to form a solid protective glue on each electronic component on the printed circuit board. The method according to claim 1, comprising: after the bonding operation, performing a glue application operation on the electronic parts on the multi-circuit board to An insulating protective glue is formed on each electronic component on the multi-circuit board. The method according to claim 6, comprising: after the bonding operation, performing another glue application operation on the multi-circuit substrate to form another insulating protective glue on each connection block on the multi-circuit substrate. An electronic device includes a protective body made of a non-conductive material, a circuit board entirely covered by the protective body, the circuit board includes a circuit pattern on the front side, and electrons soldered on the circuit pattern The electronic component includes an RFID chip and an inductor. The RFID chip is close to the top surface of the protector, and the inductor is close to a bottom surface of the protector. The protector gradually shrinks from the middle to the top surface. The electronic device according to claim 8, further comprising an insulating protective glue covered by the protective body and covering the electronic parts. The electronic device according to claim 9, further comprising another insulating protective glue and a connection block covered by the protection body, the circuit board includes a connection area on the back side, the connection block is combined with the The connection area, and one end surface of the connection block is exposed to a top surface of the protection body, the other insulating protective glue is covered by the protection body, and covers the connection block. The electronic device according to claim 8, further comprising an insulating protective glue, the protective glue is covered by the protective body, and the protective glue is completely covered by the radio frequency identification chip, and is covered to be equal to or higher than The inductance, the protective glue also covers a front face and two opposite sides of the inductance Sense, wherein the front face of the inductor is adjacent to the RFID chip, and the two opposite side faces are respectively connected to the two opposite sides of the front face.

Images