TW201933965A - Electronic device and method of making the same - Google Patents

Abstract

This invention relates to an electronic device, comprising a protective body, a printed circuit board, at least one electronic component and a connecting member. The printed circuit board is enclosed in the protective body. The electronic component is enclosed in the protective body and disposed on a front surface of the printed circuit board. The connecting member is disposed on a rear surface of the printed circuit board with its only one end surface exposed at a top surface of the protective body and with its other portions enclosed in the protective body.

Description

Electronic device manufacturing method and structure thereof

The invention relates to a method for manufacturing an electronic device and a structure thereof, in particular to a method for manufacturing an embedded radio frequency identification tag and a structure thereof.

Nowadays, the use of RFID tags has become more and more popular in the current year, and RFID tags have become more and more popular. In the foreseeable future, there will be more and more RFID tags, so how to design RFID tags The structure, which makes it suitable for attachment to the item (non-animal) to be attached, will be one of the future development priorities of the industry.

Most of the current RFID tags are attached to the article in a conformable manner, and there are also ways to embed or embed the RFID tag in the article. For example, Taiwan I497421 "embedded circular RFID tag" is implemented by embedding a radio frequency identification tag in the mounting hole of a metal object. However, as in the case of general embedding or embedding, the wafer and antenna in this practice are It is easy to damage when it is embedded in the mounting hole without protection. Therefore, it is imperative to provide a well-protected embedded or embedded RFID tag.

In view of the problem that conventional embedded or embedded RFID tags lack good protection, the present invention provides an electronic device manufacturing method and structure thereof that can be applied to embedded or embedded RFID tags, thereby solving the problem.

More specifically, the present invention provides a method of fabricating an electronic device, the method comprising the steps of: first, providing a multi-circuit substrate and a stent. The multi-circuit substrate includes a frame plate and a plurality of circuit boards located in the frame plate and spaced apart in a row, and a hollow portion is formed between the periphery of each circuit board and the frame plate and is used for The connection portion is kept connected, and a front surface of each circuit board has a circuit pattern and electronic components soldered on the circuit pattern, and a back surface of each circuit board has a connection region. The bracket piece has a plurality of struts protruding from one side in the same direction and spaced apart in a row, and the struts respectively correspond to the connecting areas of the circuit boards.

And then performing a bonding operation on the provided multi-circuit substrate and the bracket piece, so that a connecting block of each strut of the bracket piece is respectively coupled to a connecting area on the back surface of the corresponding circuit board on the multi-circuit substrate . Then, a cutting operation is performed on the multi-circuit substrate 1 that has been bonded to the bracket piece to cut off the connection portion on the multi-circuit substrate to separate the circuit boards from the frame plate. Then, a protective body forming operation is performed on the circuit board bonded to the bracket piece, so that each circuit board and the electronic component and the connecting block thereon are respectively wrapped in a protective body.

In an embodiment, the method of the present invention further includes: performing a disconnecting operation on the struts that have the protective bodies to cut the struts to obtain a plurality of electrons respectively having the protective body Device.

In an embodiment, the manufacturing step of the multi-circuit substrate of the present invention comprises: providing a printed circuit board having at least one row of the circuit patterns formed on the front surface thereof, and at least one row of the connection regions on the back surface, each a connecting area is opposite to the corresponding circuit pattern; performing a punching operation on the printed circuit board to form the hollow portion and the connecting portion respectively on the periphery of each circuit pattern, so as to have the printed circuit board The circuit boards that have not been separated, each of the front and back sides of each circuit board has a circuit pattern and a connection area; and a soldering operation is performed on the printed circuit board on which the punching operation has been performed, Electronic components are soldered to each of the circuit patterns of the printed circuit board. Preferably, the manufacturing step of the multi-circuit substrate further comprises: performing a splitting operation on the printed circuit board on which the electronic components have been soldered to obtain a plurality of the multi-circuit substrates. The manufacturing step of the multi-circuit substrate further includes: after the soldering operation, performing a glue coating operation on the printed circuit board to form a solid protective glue on each electronic component on the printed circuit board.

In an embodiment, the method of the present invention further includes: performing a coating operation on the electronic components on the multi-circuit substrate after the bonding operation, to form a separate one on each of the electronic components on the multi-circuit substrate Insulating protective glue. Preferably, the method of the present invention further comprises: after the bonding operation, performing a coating operation on the multi-circuit substrate to form another insulating protective glue on each connecting block on the multi-circuit substrate.

The present invention also provides an electronic device comprising a protective body made of a non-conductive material, a circuit board and a connecting block both covered by the protective body, wherein the circuit board comprises a circuit on the front side The pattern, the electronic component soldered on the circuit pattern, and a connection region on the back surface, the connection block is coupled to the connection region, and an end surface of the connection block is exposed on a top surface of the protection body.

In one embodiment, the electronic device of the present invention further includes an insulating protective glue coated by the protective body and covering the electronic component.

In one embodiment, the electronic component of the electronic device of the present invention includes a radio frequency identification chip and an inductor, the radio frequency identification chip being adjacent to the top surface of the protection body, the inductance being close to a bottom surface of the protection body.

In one embodiment, the protective body of the electronic device of the present invention has a cylindrical shape and has a large middle section and gradually tapers from the middle portion toward the top surface.

In an embodiment, the electronic device of the present invention further includes another insulating protective adhesive, the protective adhesive is covered by the protective body, and the connecting block is covered.

In an embodiment, the electronic device of the present invention further includes an insulating protective adhesive, the protective adhesive is covered by the protective body, and the protective adhesive is completely covered with the RFID chip, and is coated and etc. Above the inductor, the protective adhesive further covers a front surface and two opposite sides of the inductor, and is wrapped to be equal to the inductor, wherein the front surface of the inductor is adjacent to the radio frequency identification chip, and the two opposite sides are respectively Continued on the opposite sides of the front.

Compared with the prior art, the electronic device manufactured by the above method of the present invention has electronic components (such as radio frequency identification chips and inductors) sealed in the protective body, so that good protection can be obtained, and the conventional embedded or There is a lack of good protection for wafers and antennas embedded in RFID tags.

1 shows a flow chart of one embodiment of a method of fabricating an electronic device of the present invention, the method comprising the step a of providing a multi-circuit substrate 1 as shown in FIGS. The multi-circuit substrate 1 is a flexible circuit board in this embodiment, but is not limited thereto. The manufacturing steps of the multi-circuit substrate 1 are as shown in FIG. 2:

First, step a1 is performed to provide a printed circuit board 100 shown in Figs. Printed circuit board 100 is available by existing printed circuit board fabrication techniques. In this embodiment, at least one row of circuit patterns 110 has been formed on the front surface of the printed circuit board 100, and at least one row of connection regions 112 are formed on the back surface, and each of the connection regions 112 is opposite to the corresponding circuit pattern 110. In this embodiment, a plurality of rows are displayed, each row having eight circuit patterns 110 and back-to-back and the same number of connection regions 112, but not limited thereto.

Step a2 is performed to perform a punching operation on the printed circuit board 100 for forming a through hollow portion 12 and a connecting portion 13 for maintaining a connection on the periphery of each circuit pattern 110, as shown in FIGS. 5 and 6. The printed circuit board 100 has a plurality of circuit boards 11 that have not been separated. Each of the front and back sides of the circuit board 11 has a circuit pattern 110 and a connection region 112. Each of the circuit boards 11 is a circuit board of an electronic device, such as a high frequency radio frequency identification (RFID Tag) circuit board, typically a circuit board such as a radio frequency identification tag in the 13.56 MHz band, but not Limited. In addition, in this embodiment, the hollow portion 12 may include two oppositely facing and substantially U-shaped hollow holes, and the connecting portion 13 may include two small thin neck pieces respectively located between the two hollow holes. Each of the circuit boards 11 is in a state of being integrally connected to the printed circuit board 100 by its own connecting portion 13.

Then, step a3 is performed to perform a soldering operation on the printed circuit board 100 on which the punching operation has been performed (for example, using surface part bonding technology (SMT)) for respectively on each circuit pattern 110 of the printed circuit board 100. The upper electronic component 111 (see FIG. 7) is soldered, for example, a radio frequency identification chip 111a and an inductor 111b (the inductor 111b is an antenna of the radio frequency identification chip 111a). In addition, the order of execution of step a3 and step a2 may be replaced with each other. However, if the soldering operation of step 3 is performed first and then the punching operation of step a2 is performed, the soldered electronic components may be loosened by the punching force. If step 2 is performed first and then step a3 is performed, the above-mentioned electronic component loosening can be avoided.

Step a4 is performed to perform a dividing operation on the printed circuit board 100 of the soldered electronic component 111, for example, cutting along the dotted line indicated in FIG. 5 to obtain a multi-chip multi-circuit substrate 1, as shown in FIGS. Each of the plurality of circuit boards 1 that is formed includes a long sheet-shaped frame plate 10 and a plurality of the above-mentioned circuit boards 11 which are located in the frame plate 10 and are arranged side by side in a row. However, if the front and back sides of the printed circuit board 100 have only one row of the circuit patterns 110 and a row of the connection regions 112, after the steps a2 and a3 are performed, one of the plurality of circuit substrates 1 can be obtained, without This step a4 is performed again. Thus, the provision of the circuit board 1 of the above step a is completed.

Referring to FIG. 1 again, the electronic device manufacturing method of the present invention further includes a step b of providing at least one bracket piece 2. As shown in FIGS. 9 and 10, the bracket piece 2 has two opposite side edges, a plurality of positioning holes 200 arranged in a row and adjacent to one side thereof, and a plurality of positioning holes 200 projecting from the other side in the same direction. The poles 201 are arranged in a row. The number and position of the struts 201 correspond to the circuit board 11 on the multi-circuit substrate 1 provided in the step a. For example, in this embodiment, since the circuit board 11 on the multi-circuit substrate 1 has a total of eight pieces, it is provided. Two support pieces 2 each having four struts 201, and the positions of the struts 201 correspond one-to-one to the circuit board 11 on the multi-circuit substrate 1. In addition, a piece of the stent piece 2 having eight struts 201 may be provided instead of the two pieces of the stent piece 2. The bracket piece 2 can be selected by using the existing light-emitting diode support strip 20 as shown in FIG. 11 , that is, the light-emitting diode according to the number and position of the circuit board 11 on the multi-circuit substrate 1 . The bracket band 20 performs a cutting operation to obtain the aforementioned bracket piece 2.

Please note that the above steps a and b are not in order.

Then, step c is performed to perform a bonding operation on the multi-circuit substrate 1 and the bracket piece 2 provided for bonding the connecting blocks 201a of each of the rods 201 of the bracket piece 2 to the phase on the multi-circuit substrate 1 respectively. Corresponding to the connecting area 112 on the back side of the circuit board 11, as shown in FIG. In this embodiment, two stent sheets 2 are used, and each joint region 112 is a solder pad, and the connecting block 201a of each pole 201 is soldered to a corresponding solder pad.

Then, step d is performed to perform a cutting operation on the multi-circuit substrate 1 to which the stent piece 2 has been bonded, for example, a punching operation for cutting the connection portion 13 on the multi-circuit substrate 1 so that the circuit boards 11 are The frame plate 10 is separated as shown in Figs. Before the cutting operation, since each of the circuit boards 11 is connected to the frame plate 10 only by the small connecting portion 13, the connection portion 13 can be cut only by applying a small force. , can greatly reduce the probability of the electronic parts on the circuit board 11 being shaken and loosened due to punching.

Step (e) is performed to perform a protective body forming operation on the circuit board 11 coupled to the bracket piece 2, so that each of the circuit board 11 and the electronic component 111 and the connecting block 201a thereon are respectively wrapped in a protective body 3. , as shown in Figure 15. In this embodiment, the protective body 3 is a non-conductive material, preferably made of a plastic material or a rubber material, but not limited thereto, for example, a plastic material having a heat resistance of 200 degrees Celsius. In this way, each of the circuit boards 11 and the electronic components 111 thereon can be well protected by the protection body 3, solving the problem that the conventional embedded or embedded RFID tags lack good protection.

Preferably, the method of the present invention may further comprise the step f of performing a disconnecting operation on the strut 201 having the protective body 3, for example, a punching operation for cutting the strut 201 to obtain A plurality of electronic devices as shown in FIGS. 16 to 18. Wherein, if each of the rods 201 of the bracket piece 2 provided has all the marks having a predetermined depth punched out beforehand, the disconnecting operation carried out in this step f is a breaking operation, that is, along the The cuts break the strut 201 to separate the electronic device having the protective body 3 from the stent piece 2.

16 to 18, showing a structure of an electronic device using the method of the present invention, comprising a protective body 3, a circuit board 11 both covered by the protective body 3, and a connecting block 201a, wherein the protective body 3 is a non-conductive material, preferably a plastic or rubber material. In addition, the height of the protective body 3 is about 4 mm and the maximum diameter is about 4.1 mm, but not limited thereto. The circuit board 11 includes a circuit pattern 110 (see FIG. 7) on the front side, an electronic component 111 soldered on the circuit pattern 110, and a connection region 112 on the back side (see FIG. 8). The connection block 201a is coupled to the connection. An end face of the region 112 is exposed to a top surface of the protective body 3. Preferably, the radio frequency identification chip 111a of the electronic component 111 is close to the top surface of the protection body 3. The inductance 111b of the electronic component 111 is close to a bottom surface of the protection body 3. The connection area 112 is also close to the protection body 3. Top, but not limited to this. In use, the top surface of the electronic device is inserted into a hole in an article (not shown), so after being completely inserted, the top surface and the bottom surface of the electronic device are respectively located at the bottom of the hole and The aperture allows the inductor 111b to be as close as possible to the aperture and the end face of the connection block 201a is not visible from the outside.

In addition, the middle portion of the protective body 3 has a cylindrical shape and its diameter gradually decreases from the middle portion to the top surface and the bottom surface, so that the thicker middle portion has only a small circle (the outer diameter of the small circle is usually slightly larger than the inner diameter of the hole). ), and the extent to the top surface is greater than the extent to the bottom surface. In this way, the electronic device can be easily inserted into the hole and secured in the hole.

Preferably, the manufacturing step of the multi-circuit substrate 11 shown in FIG. 2 can also perform a gluing operation on the printed circuit board 100 after the soldering operation of the step a3 for the electronic component 111 on the printed circuit board 100. Forming an insulating protective rubber 51 (see FIGS. 19-22), and then continuing to perform the dividing operation of step a4; or, performing the bonding operation after the combined operation of step c, and then continuing to perform the cutting of step d Broken job. In any event, in this gluing operation, the electronic component 111 on the printed circuit board 100 may be optionally coated with an epoxy resin. Thus, each of the electronic components 111 on the multi-circuit substrate 1 provided in the above step a is provided with a protective adhesive 51 as shown in FIGS. 19 to 22 to protect the electronic component 111. Since the protective adhesive 51 covers the electronic component 111 and is filled in a gap between the electronic components 111 (for example, a gap between the RFID chip 111a and the inductor 111b), for example, in this embodiment, the protective adhesive 51 is completely covered. The RFID chip 111a is wrapped to be substantially equal to the inductor 111b, and the protective adhesive 51 also covers a front surface and opposite sides of the inductor 111b, and is wrapped to be substantially equal to the inductor 111b, wherein the front surface of the inductor 111b Adjacent to the RFID chip 111a, the two opposite sides are respectively connected to the opposite sides of the front surface, so that the entire electronic component 111 forms a solid piece by the protective glue 51, so that the electronic component 111 is subsequently carried out. The steps are not or not easy to loose. For example, when the protective body forming operation of the step e is performed by using a plastic injection mold, the protective rubber 51 can make the electronic component 111 not loose or easily detached by the impact of the injection pressure, and can improve the plastic material in the plastic injection mold. Mobility. In addition, the protective adhesive 51 can also improve the adhesion of the electronic component 111 and strengthen the structural strength of the board itself of the circuit board 111 to resist the shock of the punching or cutting operation.

More preferably, after the bonding operation of step c, a multi-circuit substrate 11 is additionally subjected to a coating operation for forming another insulating protective adhesive 52 on the connecting block 201a on the multi-circuit substrate 11 (see Figure 18~22), and then continue the cutting operation of step d. In this gluing operation, the connection block 201a on the multi-circuit substrate 11 can also be rubberized by epoxy resin. Thus, each of the connection blocks 201a on the multi-circuit substrate 1 in FIG. 12 is covered with a protective adhesive 52 as shown in FIGS. 19 to 22 to protect the connection block 201a. Similarly, the protective tape 52 can prevent the connecting block 201a from being loosened during the subsequent steps, and can improve the adhesion and strengthen the structural strength of the board itself.

In summary, the electronic device of the present invention can protect the electronic component 111 on the internal circuit board 11 by the protective body 3, and solve the prior art problem.

100‧‧‧Printed circuit board

1‧‧‧Multiple circuit boards

10‧‧‧Long sheet frame

11‧‧‧ boards

110‧‧‧ circuit pattern

111‧‧‧Electronic parts

111a‧‧‧RF identification chip

111b‧‧‧Inductance

112‧‧‧Connected area

12‧‧‧镂空部

13‧‧‧Connecting Department

2‧‧‧ bracket piece

20‧‧‧Lighting diode bracket

200‧‧‧Positioning holes

201‧‧‧ pole

201a‧‧‧Connection block

3‧‧‧Protection

51, 52‧‧‧protective adhesive

1 is a flow chart of one embodiment of a method of fabricating an electronic device of the present invention. Fig. 2 is a flow chart showing the manufacture of the multi-circuit substrate of the embodiment of the present invention. 3 and 4 are partial plan views of the front and back surfaces of the printed circuit board in the embodiment of the present invention. 5 and 6 are partial plan views of the front and back sides of the printed circuit board subjected to the punching operation in the embodiment of the present invention. 7 and 8 are partial enlarged views (front and back) of the multi-circuit substrate in the embodiment of the present invention. 9 and 10 are a partial plan enlarged view and a partially enlarged view of a stent piece in the embodiment of the present invention. Figure 11 is a partial plan view of the stent strip used in this embodiment of the present invention. Figure 12 is a plan view showing a state in which a stent piece in this embodiment of the present invention is combined with a multi-circuit substrate. 13 and 14 are partial perspective enlarged views (front and back) of the support piece of the bracket piece in the embodiment of the present invention when the circuit board is combined with the circuit board. Fig. 15 is a partially enlarged perspective view showing the circuit board on the bracket piece in the embodiment of the present invention covered with a protective body. 16 to 18 are plan, perspective and cross-sectional views (after enlargement) of an embodiment of the electronic device of the present invention. 19 to 22 are plan, perspective and cross-sectional views (after enlargement) of another embodiment of the electronic device of the present invention.

Claims (13)

An electronic device manufacturing method includes: providing a multi-circuit substrate, the multi-circuit substrate comprising a frame plate and a plurality of circuit boards located in the frame plate and spaced apart in a row, the periphery of each circuit board and the frame A through hole is formed between the plates and a connecting portion for maintaining the connection, and a front surface of each circuit board has a circuit pattern and electronic components soldered on the circuit pattern, and a back surface of each circuit board has a connection region; a bracket piece having a plurality of struts protruding from one side in the same direction and spaced apart in a row, the struts respectively corresponding to the connecting areas of the circuit boards; the multi-circuit substrate provided Performing a combined operation with the bracket piece such that a connecting block of each of the bracket pieces is respectively coupled to a connecting area on a back surface of the corresponding circuit board on the multi-circuit substrate; The circuit substrate 1 performs a cutting operation for cutting the connection portion on the multi-circuit substrate to separate the circuit boards from the frame plate; and performing a protection on the circuit board bonded to the support plate Body shaping work, so that each of the electronic component and the circuit board and the connecting block are coated on a protective body. The method of claim 1, further comprising: performing a disconnecting operation on the struts that have the protective bodies to cut the struts to obtain a plurality of electrons respectively having the protective body Device. The method of claim 1, wherein the manufacturing step of the multi-circuit substrate comprises: providing a printed circuit board having at least one row of the circuit pattern formed on a front surface thereof, and at least one row of the connection region on the back surface Each of the connection regions is opposite to the corresponding circuit pattern; performing a punching operation on the printed circuit board to respectively form the hollow portion and the connection portion on the periphery of each circuit pattern to make the printed circuit board Having a plurality of circuit boards that have not been separated, each of the front and back sides of each circuit board has a circuit pattern and a connection area; and performing a soldering operation on the printed circuit board on which the punching operation has been performed, For respectively soldering electronic components on each circuit pattern of the printed circuit board. The method of claim 3, comprising: performing a splitting operation on the printed circuit board on which the electronic components have been soldered to obtain a plurality of the plurality of circuit substrates. The method of claim 3, comprising: after the soldering operation, performing a gluing operation on the printed circuit board to form a solid protective glue on each of the electronic components on the printed circuit board. The method of claim 1, comprising: after the bonding operation, performing a coating operation on the electronic components on the multi-circuit substrate to form an insulation on each of the electronic components on the multi-circuit substrate Protective glue. The method of claim 6, comprising: after the bonding operation, performing a glue application operation on the multi-circuit substrate to form another insulating protective glue on each of the connection blocks on the multi-circuit substrate. An electronic device comprising a protective body made of a non-conductive material, a circuit board and a connecting block both covered by the protective body, wherein the circuit board comprises a circuit pattern on the front surface, soldered to the An electronic component on the circuit pattern and a connection region on the back surface, the connection block is coupled to the connection region, and an end surface of the connection block is exposed on a top surface of the protection body. The electronic device of claim 8, further comprising an insulating protective glue covered by the protective body and covering the electronic component. The electronic device of claim 8, wherein the electronic component comprises a radio frequency identification chip and an inductor, the radio frequency identification chip being adjacent to the top surface of the protection body, the inductance being close to a bottom surface of the protection body. The electronic device according to claim 8, wherein the protective body has a cylindrical shape and a middle portion of the diameter is large, and gradually tapers from the middle portion toward the top surface. The electronic device of claim 9, further comprising another insulating protective glue coated by the protective body and covering the connecting block. The electronic device of claim 10, further comprising an insulating protective adhesive, the protective adhesive being covered by the protective body, and the protective adhesive is completely coated with the radio frequency identification chip, and the cladding is higher than In the inductor, the protective adhesive further covers a front surface and two opposite sides of the inductor, and is wrapped up to be higher than the inductor, wherein the front surface of the inductor is adjacent to the radio frequency identification chip, and the two opposite sides are respectively connected to The two opposite sides of the front.