JP2010152449A - Rfid tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID tag for reducing man-hour for mounting and cost, and improving mass productivity. <P>SOLUTION: In the RFID tag 1, an IC chip 8 is mounted on a substrate 2 with antenna patterns 4, 6 formed thereon and are sealed with a sealing resin 10, and land parts 12 are formed on a mounting surface of the substrate 2. The RFID tag 1 is surface-mounted by bonding the land parts 12 to mounting patterns formed on a circuit board 20. Thereby, the RFID tag 1 is firmly mounted on the circuit board 20 together with other electronic components 16, 18, and can be used as a tag for wirelessly transmitting/receiving data on the circuit board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an RFID tag that transmits and receives data without contact.

  2. Description of the Related Art In recent years, RFID tags that can be attached to various articles and transmit / receive data related to the articles without contact have been widely used. In general, the RFID tag has an IC chip mounted on a substrate on which an antenna pattern is formed, and the IC chip is connected to the antenna pattern.

In the RFID tag as described above, it is known that an adhesive layer such as a hot-melt resin is provided on the back surface of the substrate and is attached to the surface of various articles by this adhesive layer (for example, Patent Documents). 1).
JP 2006-236169 A

  Usually, since RFID tags are used to identify individual items and manage data, it is necessary to bond the RFID tags to the items one by one. In addition, when many electronic components are mounted or many conductive patterns are provided, such as circuit boards, the mounting location is extremely limited, so careful manual bonding is required. there were. As described above, when manually bonding one by one, the man-hour and the cost increase, and the mass productivity decreases.

  The problem to be solved by the present invention is to provide an RFID tag capable of solving the above-mentioned problems of the prior art, reducing the number of mounting steps and costs, and improving the mass productivity.

  The RFID tag of the present invention includes a substrate on which an antenna pattern is formed, an IC chip attached on the substrate and connected to the antenna pattern, a sealing resin for sealing the IC chip, and mounting of the substrate And a land portion provided on the surface. The land portion in the RFID tag is bonded onto a circuit board. A plurality of the land portions are provided on the outer periphery of the antenna pattern provided on the substrate. Further, the substrate is configured by a laminated substrate in which the antenna substrate on which the antenna pattern is formed and the land substrate on which the land portion is formed are stacked and bonded.

  Since the RFID tag of the present invention is provided with a land portion on a substrate, it can be surface-mounted on various articles, particularly on a circuit board. For this reason, it can be mounted together with other electronic components mounted on the circuit board using an automatic machine such as a chip mounter and can be surface mounted by reflow soldering. As a result, the efficiency of the RFID tag attachment work can be increased to prevent an increase in cost, and the mass productivity can be improved.

  In addition to individual identification at the time of manufacture and shipment, such as circuit boards, when mounting on products that need to be incorporated into products after shipment or that require use of manufacturing history for post-sales maintenance, etc. It is necessary to attach firmly so that it can be used over. Since the RFID tag of the present invention can be firmly soldered like other electronic components, it can be used with high reliability over a long period of time.

  In the present invention, the land portion is provided on the outer periphery of the antenna pattern provided on the substrate. When the antenna pattern is formed by etching the copper foil layer or the like, the land portion can be formed at the same time. Further, the land portion can be provided by overlapping and adhering the land substrate provided with the land portion to the antenna substrate provided with the antenna pattern. For this reason, a land part can be easily provided in an RFID tag not provided with a land part.

  The RFID tag of the present invention is obtained by mounting an IC chip on a substrate on which an antenna pattern is formed, sealing with a sealing resin, and providing a land portion on the mounting surface of the substrate. The RFID tag is surface-mounted by bonding its land portion to an attachment pattern provided on a circuit board. As a result, the RFID tag is firmly attached to the circuit board at the same time as other electronic components, and can be used to transmit and receive data related to the circuit board in a non-contact manner.

  FIG. 1 is a cross-sectional view of an essential part of an RFID tag 1 according to an embodiment of the present invention, and FIG. 2 is a back view showing a back surface as a mounting surface. Reference numeral 2 denotes an insulating substrate such as a glass epoxy substrate. Conductive antenna patterns 4 and 6 are formed on the front and back surfaces of the substrate 2. The antenna patterns 4 and 6 are formed by etching a copper foil layer or the like clad on the substrate 2 and are formed in a substantially spiral shape. The antenna patterns 4 and 6 are connected in series by wrapping around through holes or side surfaces of the substrate 2, and are formed so that both ends are located on the surface of the substrate 2. Note that the antenna pattern 6 in the present embodiment is wound in a rectangular shape that is bent so that the corner portion bites inward so as to avoid a land portion described later.

  Reference numeral 8 denotes an IC chip. In this embodiment, the IC chip is die-bonded and fixed on the substrate 2 and connected to both ends of the antenna patterns 4 and 6 by wire bonding. It is also possible to mount the antenna patterns 4 and 6 on both ends by flip chip or the like.

  A sealing resin 10 is made of epoxy resin or the like and seals the IC chip 8 and the antenna pattern 4 on the surface side of the substrate 2. The RFID tag 1 in the present embodiment has a shape that allows the RFID tag 1 to be handled in the same manner as a chip-shaped electronic component by sealing the entire surface side of the substrate 2 with the sealing resin 10, for example, an automatic machine The upper surface that can be adsorbed by the like is adjusted to a flat surface.

  Reference numeral 12 denotes a land portion formed on the back surface of the substrate 2 serving as a mounting surface. In the present embodiment, the land portions 12 are provided on the outer periphery of the antenna pattern 6 provided on the substrate 2 and are arranged at the four corners of the rectangular mounting surface. The land portion 12 can also be formed by printing, plating, embedding a metal plate, etc. In this embodiment, the antenna pattern 6 is formed by etching a copper foil layer provided on the substrate 2. Are formed by the same etching process. Since the land portion 12 is used for bonding to a circuit board or the like, the thickness is set to be higher than the antenna pattern 6.

  A resist film 14 covers and insulates the antenna pattern 6 provided on the back surface of the substrate 2.

  As shown in FIG. 3, the RFID tag 1 having the above configuration can be mounted on a circuit board 20 on which various electronic components 16 and 18 such as IC and LED are mounted. That is, the RFID tag 1 is provided with an attachment pattern (not shown) such as an independent dummy electrode that is not connected to a pattern for connecting the electronic components 16 and 18 on the surface of the circuit board 20, and a land portion on the pattern. 12 is attached with a conductive paste or the like and soldered by passing through a reflow furnace. Such surface mounting can be performed at the same time as the other electronic components 16, 18, etc., and the mounting can be automated together with the other electronic components 16, 18 by using a chip mounter or the like.

  FIG. 4 is a cross-sectional view of the main part when the substrate of the RFID tag shown in FIG. 1 has a laminated structure. In the substrate 22 shown in FIG. 4, the substrates 22A and 22B having the antenna patterns 4 and 6 formed on the front and back surfaces are bonded with an adhesive layer 22C made of an insulating resin or the like. The antenna patterns 4 and 6 of the substrates 22A and 22B are connected in series. Even in the case of the substrate 22 having such a laminated structure, the land portion 12 can be formed on the back surface of the lowermost substrate 22B in the same manner as shown in FIG.

  FIG. 5 is a cross-sectional view of the principal part when the land portion of the RFID tag shown in FIG. 1 or FIG. 4 is provided on the land substrate, and FIG. As shown in FIG. 5, the substrate 32 is provided with antenna patterns 4 and 6 on the front and back surfaces thereof, as well as the substrate 22 shown in FIG. 4 (or may be the same as the substrate 2 shown in FIG. 1). The antenna substrates 32A and 32B, in which 4 and 6 are connected in series by the through-hole 24 and the connecting member 26, are adhered by the adhesive layer 32C, and the land substrate 32D having the land portion 12 provided on the back surface to be the mounting surface It has a laminated structure in which it is bonded to the antenna substrate 32B with an adhesive layer 32E. In this substrate 32, since only the antenna patterns 4 and 6 are formed on the antenna substrates 32A and 32B, it is not necessary to avoid the space for providing the land portion 12 and the land portion 12, and the antenna patterns 4 and 6 are formed. Space can be increased. Further, since only the land portion 12 is formed on the land substrate 32D, there are no restrictions on the position, shape, and number thereof, and the degree of freedom for forming the land portion 12 can be increased. Since the antenna pattern 6 of the antenna substrate 32B is sealed with the adhesive layer 32E, it is not necessary to provide the resist layer 14.

It is principal part sectional drawing of the RFID tag which concerns on one Example of this invention. FIG. 2 is a back view showing a back surface as a mounting surface of the RFID tag shown in FIG. 1. It is a side view which shows the state which mounted the RFID tag shown in FIG. 1 on the circuit board. FIG. 4 is a cross-sectional view of the main part when the substrate of the RFID tag shown in FIG. 1 has a laminated structure. FIG. 5 is a cross-sectional view of a main part when a land portion of the RFID tag shown in FIG. 1 or FIG. 4 is provided on a land substrate. FIG. 6 is a rear view of the RFID tag shown in FIG. 5.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 RFID tag 2, 22, 32 Board | substrate 4, 6 Antenna pattern 8 IC chip 10 Sealing resin 12 Land part 14 Resist layer 16, 18 Electronic component 20 Circuit board 22A, 22B Board | substrate 22C Adhesive layer 24 Through hole 26 Connection member 32A, 32B Antenna substrate 32C Adhesion layer 32D Land substrate 32E Adhesion layer

Claims (4)

A substrate on which an antenna pattern is formed;
An IC chip mounted on the substrate and connected to the antenna pattern;
A sealing resin for sealing the IC chip;
A land portion provided on the mounting surface of the substrate;
An RFID tag comprising:   The RFID tag according to claim 1, wherein the land portion is bonded on a circuit board.   The RFID tag according to claim 1, wherein a plurality of the land portions are provided on an outer periphery of the antenna pattern provided on the substrate.   The said board | substrate is comprised by the laminated substrate which piled up and adhere | attached the board | substrate for antennas in which the said antenna pattern was formed, and the board | substrate for land in which the said land part was formed. RFID tag.

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