KR101319393B1 - A method producing a boad having multi-chip and a boad having multi-chip - Google Patents

Abstract

The present invention is a substrate with circuit lines formed on both sides; A cavity formed through the upper and lower surfaces of the substrate; A support plate inserted into the cavity; Upper and lower chips respectively mounted on upper and lower surfaces of the support plate; An upper connection line bonded to electrically connect the upper chip and the circuit line of the upper surface of the substrate; And a lower connection line bonded to electrically connect the lower chip and a circuit line of the lower surface of the substrate, and a manufacturing method thereof.

According to the present invention, it is possible to mount two layers of semiconductor chips on one substrate, thereby providing a substrate on which a thin multi-semiconductor chip is mounted.

Semiconductor Chip, Substrate, Support Plate, Wire, Bonding, Molding, Lamination

Description

A manufacturing method of a substrate on which a multi chip is mounted and a substrate on which a multi chip is mounted {A METHOD PRODUCING A BOAD HAVING MULTI-CHIP AND A BOAD HAVING MULTI-CHIP}

1 is a flowchart of Embodiment 1;

FIG. 2 is a schematic diagram for explaining the circuit line forming step of FIG.

Figure 3 is a schematic diagram for explaining the solder masking step of Figure 1;

4 is a schematic view for explaining the cavity forming step of FIG.

Figure 5 is a schematic diagram for explaining the solder mask removing step of Figure 1;

6 is a schematic view for explaining the solder ball forming step of FIG.

Figure 7 is a schematic diagram for explaining the support plate insertion step of Figure 1;

8 is a schematic view for explaining the semiconductor chip attaching step of FIG.

9 is a schematic view for explaining the connection line bonding step of FIG.

10 is a schematic view for explaining the molding step of FIG.

<Description of the symbols for the main parts of the drawings>

100: substrate 110: circuit line

120: solder mask 130: cavities

140: solder ball 150: support plate

160: upper chip 162: adhesive

164: ground wire 170: lower chip

172: adhesive 174: ground wire

180: upper connecting line 190: lower connecting line

200: molding part

The present invention relates to a substrate on which a semiconductor chip is mounted and a method of manufacturing the same, and more particularly, to a substrate and a method of manufacturing the same that can be manufactured in a thin shape while a multi-semiconductor chip is mounted.

BACKGROUND ART In general, with the miniaturization of electronic products, a technology of stacking a substrate on which semiconductor chips are mounted in an upper and lower layers has been developed.

However, when stacking the substrate on which the semiconductor chip is mounted, there is a disadvantage that the thickness of the product can not be avoided by stacking the substrate.

An object of the present invention is to provide a substrate on which a thin multi-semiconductor chip is mounted which can reduce the size of an electronic product by mounting a predetermined number of multi-semiconductor chips on one substrate but not stacking the substrate.

The present invention comprises the steps of forming circuit lines on both sides of the substrate; Forming a cavity penetrating the upper and lower surfaces of the substrate; Inserting a support plate into the cavity; Attaching an upper chip and a lower chip to upper and lower surfaces of the support plate, respectively; Bonding the upper chip and the circuit line of the upper surface of the substrate to an upper conductive line that can be energized, and bonding the lower chip and the lower circuit of the lower surface of the substrate to an electrically conductive lower connection line. The manufacturing method of the board | substrate with which the multi-chip is mounted.

The present invention may also include molding a bonding portion of the upper connection line and the lower connection line.

The present invention comprises the steps of forming a solder mask on the upper and lower surfaces of the substrate; The method may further include removing a portion of the solder mask corresponding to a bonding portion of the upper and lower connection lines.

The present invention comprises the steps of forming a solder ball on the lower surface of the substrate; It may also include removing a portion of the solder mask corresponding to the portion where the solder ball is formed.

On the other hand, the present invention and the circuit board is formed on both sides; A cavity formed through the upper and lower surfaces of the substrate; A support plate inserted into the cavity; Upper and lower chips respectively mounted on upper and lower surfaces of the support plate; An upper connection line bonded to electrically connect the upper chip and the circuit line of the upper surface of the substrate; And a lower connection line bonded to electrically connect the lower chip and a circuit line of the lower surface of the substrate.

In the present invention; The support plate is also in the form of a longitudinal cross-section "H".

In the present invention; The support plate is made of metal; The upper chip and the lower chip may be grounded to the support plate, respectively.

In the present invention; An upper molding part for molding a bonding part of the upper connection line to protect the bonded portion of the upper connection line; It may also include a lower molding portion for molding the bonding portion of the lower connection line to protect the bonded portion of the lower wire.

In the present invention; Solder balls are formed on the lower surface of the substrate; A soldermask may be applied to the upper and lower surfaces of the substrate except for a portion where the upper and lower connection lines are bonded and a portion where the solder ball is formed.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

Example 1

Example 1 relates to a method for manufacturing a substrate on which a multi chip according to the present invention is mounted. 1 is a flowchart of Embodiment 1, FIG. 2 is a circuit line forming step of FIG. 1, FIG. 3 is a solder masking step of FIG. 1, FIG. 4 is a cavity forming step of FIG. 1, and FIG. 5 is FIG. Figure 6 is a solder mask removal step, Figure 6 is a solder ball forming step of Figure 1, Figure 7 is a support plate insertion step of Figure 1, Figure 8 is a semiconductor chip attachment step of Figure 1, Figure 9 is a connection line bonding step of Figure 1 10 shows the molding step of FIG.

1 and 2, Embodiment 1 has a circuit line forming step S10. In the circuit line forming step (S10), circuit lines 110 are formed on both sides of the substrate 100, and via holes (not shown) are provided for electrical connection of the circuit lines 110 patterned on the upper and lower surfaces of the substrate 100. Is formed. The substrate 100 is made of epoxy resin, and the circuit line 110 is patterned with copper (Cu). In addition, circuit lines 110 made of copper (Cu) are also patterned in the via holes (not shown).

1 and 3, Embodiment 1 has a solder masking step S20. In the solder masking step S20, a solder mask 120 is coated on upper and lower surfaces of the substrate 100 on which the circuit lines 110 are formed.

1 and 4, Embodiment 1 has a cavity forming step S30. In the cavity forming step S30, the cavity 130, which is a hole penetrating the upper and lower surfaces of the substrate 100, is formed.

1 and 5, Embodiment 1 has a solder mask removing step S40. In the solder mask removing step (S40), the solder mask 120 coated on the portion where the solder ball (140 of FIG. 6) is attached and the connection line (180, 190 of FIG. 9) is bonded through the exposure is removed. do.

1 and 6, Embodiment 1 has a solder ball forming step S50. In the solder ball forming step (S50), the solder ball 140 is formed at a portion to which the solder ball 140 is attached among the portions of the circuit line 110 exposed in the solder mask removing step (S40).

1 and 7, Embodiment 1 has a supporting plate insertion step (S60). In the supporting plate inserting step S60, the supporting plate 150 is inserted into the cavity 130 formed in the cavity forming step S30. The support plate 150 has a longitudinal cross-section "H" shape, and is installed so that the "-" character portion is located at the center portion of the upper and lower ends of the cavity 130, that is, at both center portions of both sides of the substrate 100. On the other hand, the support plate 150 is formed of a metal material.

1 and 8, Embodiment 1 has a semiconductor chip attaching step (S70). In the semiconductor chip attaching step (S70), the upper chip 160 and the lower chip 170 are attached to the upper and lower surfaces of the support plate 150, respectively. Attachment of the upper chip 160 and the lower chip 170 is via adhesives 162 and 172, which are connected to the ground lines 164 and 174 of the upper chip 160 and the lower chip 170. While enclosing the upper chip 160 and the lower chip 170 is fixed to the upper and lower surfaces of the support plate 150. That is, the ground wires 164 and 174 of the upper chip 160 and the lower chip 170 are connected to the upper and lower surfaces of the support plate 150 to connect the upper chip 160 and the lower chip 170 to the support plate 150 made of metal. It will be grounded.

1 and 9, Embodiment 1 has a connecting line bonding step. In the bonding line bonding step, one end of the upper connection line 180 and the lower connection line 190 is bonded to the upper chip 160 and the lower chip 170, and the other end is connected to the circuit line 110 on the upper and lower surfaces of the substrate 100. By bonding, the upper chip 160, the lower chip 170, and the circuit lines 110 on the upper and lower surfaces of the substrate 100 are electrically connected to each other. The upper connection line 180 and the lower connection line 190 are formed of a wire made of gold (Au).

1 and 10, Embodiment 1 has a molding step. In the molding step, the upper connection line 180 and the lower connection line 190 may be connected to the upper chip 160 and the lower chip 170 to protect the bonding portions of the upper connection line 180 and the lower connection line 190. ) Is molded with a resin layer to form the molding part 200.

According to the first embodiment, two layers of semiconductor chips can be mounted on one substrate, whereby a thin multi-chip package can be manufactured.

The support plate 150 of the first embodiment has a longitudinal section of "H" shape, but in other embodiments, the longitudinal section may be of "ㅏ" or "ㅓ" shape, or "-" shape. . That is, the longitudinal section of the support plate 150 is sufficient to have a form that divides the cavity 130 into upper and lower portions.

In the first embodiment, the support plate 150 is made of metal, but in another embodiment, the support plate 150 may be formed of a ground part by covering the conductive paint even if the support plate 150 is not made of metal.

Example 2

The present invention relates to a substrate on which the multi-chip according to the present invention is mounted.

Referring to FIG. 10, Embodiment 2 has a substrate 100. The substrate 100 is made of an epoxy resin, and the circuit lines 110 are patterned on both surfaces of the substrate 100.

10 and 4, a cavity 130, which is a hole penetrating the upper and lower surfaces, is formed in the substrate 100.

10 and 7, the support plate 150 is inserted into the cavity 130. The support plate 150 is formed of a metal material. The support plate 150 is formed in the shape of "H".

10 and 8, an upper chip 160 and a lower chip 170 are mounted on upper and lower surfaces of the support plate 150, respectively. At this time, the adhesives 162 and 172 connect and fix the ground wires 164 and 174 of the upper chip 160 and the lower chip 170 to the upper and lower surfaces of the support plate 150, and the upper chip 160 and the lower chip 170. Respectively fixed to the support plate 150.

10 and 9, Embodiment 2 has an upper connection line 180 and a lower connection line 190. The upper connection line 180 is a gold wire that is bonded to electrically connect the upper chip 160 and the circuit line 110 on the upper surface of the substrate 100. Similarly, the lower connection line 190 is a gold wire that is bonded to electrically connect the lower chip 170 and the circuit line 110 on the bottom surface of the substrate 100.

10 and 6, upper and lower surfaces of the substrate 100 are bonded to the upper connection line 180 and the lower connection line 190, and solder balls 140 to be described later are formed. Except for the portion, a soldermask 120 is coated.

10 and 6, solder balls are formed on the bottom surface of the substrate.

10 and 9, Embodiment 2 has a molding part 200. The molding part 200 may cover the upper connection line 180 and the lower connection line 190 with the upper chip 160 and the lower chip to protect the bonding portions of the upper connection line 180 and the lower connection line 190. It is formed by molding (170) together with the resin layer (170). That is, the molding part 200 includes an upper molding part (not shown) for molding a bonding part of an upper connection line and a lower molding part for molding a bonding part of a lower connection line. (Not shown).

In the substrate on which the multi-chip is mounted according to the second embodiment, two layers of semiconductor chips can be mounted on one substrate, thereby providing a thin multi-chip package.

The support plate 150 of the second embodiment has a longitudinal section of "H" shape, but in other embodiments, the longitudinal section may be of "ㅏ" or "ㅓ" shape, or "-" shape. . That is, the longitudinal section of the support plate 150 is sufficient to have a form that divides the cavity 130 into upper and lower portions.

In the second embodiment, the support plate 150 is made of a metal material. However, in another embodiment, the support plate 150 may be formed of a ground part by covering the conductive paint even if the support plate 150 is not made of a metal material.

According to the present invention, it is possible to mount two layers of semiconductor chips on one substrate, thereby providing a substrate on which a thin multi-semiconductor chip is mounted.

The present invention has the effect that the semiconductor chip mounted on the support plate can be easily grounded by using the support plate as a metal material.

Claims (9)

Forming circuit lines on both sides of the substrate; Forming a cavity penetrating the upper and lower surfaces of the substrate; Inserting a support plate into the cavity; Attaching an upper chip and a lower chip to upper and lower surfaces of the support plate, respectively; Bonding the upper chip and the circuit line of the upper surface of the substrate to an upper conductive line that can be energized, and bonding the lower chip and the lower circuit of the lower surface of the substrate to an electrically conductive lower connection line. The manufacturing method of the board | substrate with which the multichip was mounted. The method of claim 1, further comprising: And molding a bonding part of the upper connection line and the lower connection line. The method of claim 2; Forming a solder mask on the upper and lower surfaces of the substrate; And removing a portion of the solder mask that corresponds to a bonding portion of the upper and lower connection lines. The method of claim 3; Forming solder balls on the bottom surface of the substrate; And removing a portion corresponding to a portion where the solder ball is formed in the solder mask. A substrate having circuit lines formed on both surfaces thereof; A cavity formed through the upper and lower surfaces of the substrate; A support plate inserted into the cavity; Upper and lower chips respectively mounted on upper and lower surfaces of the support plate; An upper connection line bonded to electrically connect the upper chip and the circuit line of the upper surface of the substrate; A lower connection line bonded to electrically connect the lower chip and a circuit line on the lower surface of the substrate, The support plate is made of metal, And the upper chip and the lower chip are respectively grounded to the support plate. The method of claim 5; The support plate has a multi-chip mounting board, characterized in that the longitudinal cross-section "H" shape. delete The method of claim 5; An upper molding part for molding a bonding part of the upper connection line to protect the bonded portion of the upper connection line;  And a lower molding part configured to mold a bonding part of the lower connection line to protect the bonded part of the lower wire. The method of claim 8; Solder balls are formed on the lower surface of the substrate, A multi-chip characterized in that a solder mask is coated on the upper and lower surfaces of the substrate except for a portion where the upper and lower connection lines are bonded and a portion where the solder ball is formed. This mounted substrate.

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