TWI681836B - Laser processing system and laser processing method - Google Patents

Abstract

Provided is a laser processing method and a laser processing system. The laser processing method includes simultaneously performing height measurement of a processing target and laser processing by using a laser radiator and a height measuring unit that are aligned in a processing direction.

Description

Laser processing system and laser processing method

The invention relates to a laser processing system and a laser processing method which can adjust the height according to the bending of the object to be processed.

Laser processing refers to a method in which a laser beam is condensed into a focal point form by a condenser lens, and the focal point is irradiated onto the surface or inside of the object to be processed.

When the laser beam is condensed to a focal point for processing, a higher energy density can be obtained, so the focal point of the laser beam can be used to cut the product or perform marking processing on the surface of the product. The size of the focused laser beam changes according to the wavelength of the laser beam, the focal length of the condenser lens, the diameter of the incident laser beam, etc. The laser beam can only be processed more accurately at the focal point And stable processing quality.

However, the height of each part of the object to be processed varies due to various factors such as bending of the object to be processed.

The height that will be processed during laser processing is called the depth of focus (Depth of Focus, DOF), if the surface of the processed product is out of focus, the processing cannot be achieved or the processing quality is adversely affected, so it is important to keep the laser irradiation portion and the object to be processed irradiated with the laser beam fixedly the distance between.

In order to maintain a fixed distance between the laser irradiation part and the object to be processed, first, after measuring the height of each part of the object to be processed, the height of the laser irradiation part may be adjusted based on the measured data to irradiate the laser beam.

However, in this mode, the data acquisition operation for measuring the height of each part of the object to be processed and the processing operation for irradiating the laser beam are separately performed. Therefore, the object to be processed needs to pass through the laser head at least twice, which is cumbersome, and there is a limit in reducing the processing time.

The present invention provides a laser processing system and a laser processing method, which simultaneously executes a data acquisition operation for measuring the height of each part of a processing object and a processing operation of irradiating a laser beam, thereby reducing the processing of the processing object time.

A laser processing method according to an aspect of the present invention uses a laser irradiation portion and a height measuring portion arranged along the processing direction to simultaneously measure the height of the object to be processed and the laser processing, and includes the following steps: And the step of measuring the height of the first region of the object to be processed; The object to be processed is relatively moved with respect to the laser irradiation unit and the height measurement unit to position the laser irradiation unit on the first region of the object to be processed, and the height measurement unit is positioned to be in contact with the object to be processed A step on the second area that is different from the first area of the object; when the laser irradiation section reaches the first area, adjusting the laser irradiation based on the height of the first area measured by the height measuring section The step of measuring the height of the portion and the height measuring portion; and the step of measuring the height of the second area by the height measuring portion while the laser irradiating portion irradiates the first area with a laser beam; In the step of the height of the area, the height information of the second area can be calculated by reflecting the height change of the height measuring portion in the measurement data of the second area measured by the height measuring portion.

In one embodiment, when the height of the height measuring section increases or decreases, the measurement data of the second area measured by the height measuring section can be calculated by subtracting or adding the height change of the height measuring section Height information of the above second area.

In one embodiment, the first area is an area at one end of the object to be processed. After the first area passes through the height measuring portion and before reaching the laser irradiating portion, the adjustment of the laser irradiating portion can be started. height.

In one embodiment, the height of the laser irradiation unit is changed multiple times until the height of the laser irradiation unit reaches the target height that the laser irradiation unit can reach the target height for irradiating the laser beam to a specific part of the first region The above target height.

In one embodiment, the height of the laser irradiation unit may be changed multiple times and the specific unit height may be changed each time.

In one embodiment, the height measurement unit may measure the height of the object to be processed at a measurement interval of a specific distance, and the number of times the height of the laser irradiation unit changes is less than that between the height measurement unit and the laser irradiation unit The distance is divided by the value obtained by the measurement interval of the height measuring section.

In one embodiment, the height information of the object to be processed can be calculated using the moving average of the measurement data measured by the height measuring unit.

A laser processing system according to an aspect of the present invention includes: a work table on which a processing object is mounted; a height measurement unit that measures the height of each region of the processing object; a laser irradiation unit that irradiates the processing object with a laser beam; The head, supporting the laser irradiation part and the height measuring part in such a manner that the laser irradiation part and the height measuring part are arranged along the processing direction; the lifting drive part for adjusting the height of the head; and the control part, controlling Driven by the elevating drive unit, and at least one of the worktable and the head can move in a direction crossing the optical axis direction of the laser beam, and the height measuring unit changes due to a change in the height of the head The height, the control unit may calculate the height information of the object to be processed by reflecting the height change of the height measurement unit in the measurement data measured by the height measurement unit, and control the lift drive unit based on the height information.

In one embodiment, when the height of the height measuring part increases or decreases, the control part may subtract or add the height change of the height measuring part to the measurement data measured by the height measuring part to calculate the processing The height information of the object.

In one embodiment, the object to be processed moves relative to the laser irradiation unit in a direction crossing the optical axis direction of the laser beam, and the control unit can control the elevating drive unit as follows: After one end region of the object passes through the height measuring section and before reaching the laser irradiation section, the height of the laser irradiation section is adjusted.

In one embodiment, the control unit can control the lift drive unit in such a manner that the laser irradiation unit changes the laser light multiple times so that the laser irradiation unit can reach a target height for irradiating a specific portion of the object to be processed with the laser beam The height of the irradiated part until the height of the laser irradiated part reaches the target height.

In one embodiment, the control unit can control the lift drive unit in such a manner that the height of the laser irradiation unit is changed multiple times and the specific unit height is changed every time.

In one embodiment, the height measurement unit may measure the height of the object to be processed at a measurement interval of a specific distance, and the number of times the height of the laser irradiation unit changes is less than that between the height measurement unit and the laser irradiation unit The distance is divided by the value obtained by the measurement interval of the height measuring section.

In one embodiment, the control unit may calculate the height information of the object to be processed using the moving average of the measurement data measured by the height measurement unit.

The laser processing system and the laser processing method of the embodiment of the present invention simultaneously perform the data acquisition operation for measuring the height of each part of the processing object and the processing operation of irradiating the laser beam, thereby reducing the processing of the processing object time.

10‧‧‧operating table

20‧‧‧Laser exposure department

30‧‧‧Altitude Measurement Department

40‧‧‧Head

50‧‧‧ Lifting drive

60‧‧‧Control Department

100‧‧‧Laser processing system

G‧‧‧Interval

g1, g2, g21, g3 ‧‧‧ measured data

H1, H2, H3‧‧‧ Height

h1, h2, h3‧‧‧ altitude information

L‧‧‧Laser beam

T ₀ ‧‧‧ specific time

T ₁ , T ₂ ‧‧‧ Overall laser processing time

t ₁ , t ₂ ‧‧‧ overall time

TA ₀ 、TA‧‧‧Object to be processed

TA1‧‧‧ Region 1

TA2‧‧‧ Region 2

TA3‧‧‧Region 3

△H1‧‧‧Altitude change

△H2‧‧‧Altitude change

FIG. 1 is a diagram conceptually showing an example of a laser processing system of an embodiment.

2 is a diagram for explaining an example of an object to be processed.

3a and 3b are diagrams for explaining the laser processing method of the comparative example.

4 is a diagram conceptually showing the operation of the laser processing system of the embodiment.

5a to 5c are diagrams showing the operation of the laser processing system of FIG. 4 in sequence.

6 is a graph showing an example of laser processing time of the laser processing system of the comparative example of FIGS. 3a and 3h.

7 is a graph showing an example of laser processing time of the laser processing system of the embodiment of FIG. 4.

8 is a graph showing an example of changing the height of a laser irradiation unit at a specific time.

FIG. 9 is a graph showing an example of changing the height of the laser irradiation unit from before a specific time point.

Hereinafter, referring to the accompanying drawings, embodiments of the present invention will be described in detail. In the drawings, the same reference numerals denote the same constituent elements, and the size or thickness of each constituent element may be exaggerated for the sake of clear explanation.

Terms including ordinal numbers such as "first" and "second" can be used to describe various constituent elements, but the constituent elements are not limited by the terms. The term is used only for the purpose of distinguishing one component from other components. For example, the first component may be named the second component without departing from the scope of the invention patent application of the present invention, and similarly, the second component may be named the first component. The term "and/or" includes a combination of multiple related items or any of the multiple related items.

FIG. 1 is a diagram conceptually showing an example of a laser processing system 100 of an embodiment. FIG. 2 is a diagram for explaining an example of the object TA ₀ to be processed.

Referring to FIG. 1, a laser processing system 100 includes a work table 10 on which an object TA ₀ is mounted, and a laser irradiation unit 20 that irradiates a laser beam L on the object TA ₀ .

At least one of the table 10 and the laser irradiation unit 20 can move in a direction crossing the optical axis direction of the laser beam L.

As an example, the table 10 can move in a direction perpendicular to the optical axis direction of the laser beam L. Therefore, the object to be processed TA ₀ mounted on the table 10 can be moved in the direction perpendicular to the optical axis direction of the laser beam L together with the table 10.

The laser irradiation unit 20 can irradiate the laser beam L to a specific area of the object TA ₀ . For example, the laser irradiation unit 20 can irradiate the laser beam L so as to converge the focal point of the laser beam L inside or on the surface of the object TA ₀ . As an example, the laser beam L may be condensed into the object TA ₀ to form a recombination area. As another example, the laser beam L can be condensed to a surface of the object TA ₀ is formed on the groove surface of the object of TA _0.

As the work table 10 moves, the laser beam L is irradiated to the object TA _{0 in a} direction opposite to the moving direction of the work table 10 (that is, the processing direction).

However, the ideal state of the object to be processed TA ₀ is flat, but the object to be processed TA is actually not flat due to various reasons such as the bending phenomenon of the object to be processed TA. Referring to FIG. 2, the object TA is curved, and the height of the upper surface of the object TA may not be fixed. Here, the height is defined as the height based on the upper surface of the table 10.

In the case where the height of the upper surface of the object TA is not fixed, when the laser beam L irradiated by the laser irradiation unit 20 is condensed to a specific height from the worktable 10, the laser beam L is condensed to If the position of the object to be processed TA is not fixed, or is not condensed in a part of the area of the object to be processed TA, etc., the processing quality will be significantly reduced.

In consideration of this aspect, the laser processing system 100 may further include: a height measuring unit 30 to measure the height of each area of the object TA to be processed; a head 40 arranged with the height measuring unit 30 and the laser irradiation unit 20 along the processing direction Supporting the above-mentioned height measuring section and the above-mentioned laser irradiation section; the lifting driving section 50 for adjusting the height of the head 40 supporting the laser irradiation section 20; and the control section 60 based on the measurement by the height measuring section 30 The data is measured to control the driving of the lift drive unit 50.

The height measuring unit 30 measures the height of each area of the object TA. plus The height of each area of the work object TA may be a height at which laser processing is realized, that is, depth of focus (Depth of Focus: DOF).

As an example, the object TA is moved relative to the height measuring unit 30, and the height measuring unit 30 measures the height of the object TA at specific time intervals. Therefore, the height of the object to be processed TA is measured by the height measuring unit 30 at measurement intervals at specific distances. The height measuring section 30 may be arranged downstream of the laser irradiation section 20 in the processing direction. The height measuring unit 30 may be arranged upstream of the laser irradiation unit 20 along the moving direction of the object TA. Therefore, before the laser beam L is irradiated to the partial region of the object by the laser irradiation unit 20, the height of the partial region of the object TA can be measured by the height measuring unit 30.

The height measuring unit 30 and the laser irradiation unit 20 may be separated by a specific interval. The distance G between the height measuring unit 30 and the laser irradiation unit 20 may be 70 mm or more. The distance G between the height measuring unit 30 and the laser irradiation unit 20 may be 1000 mm or less. Here, the interval G between the height measurement unit 30 and the laser irradiation unit 20 may be the distance from the center of the height measurement unit 30 to the center of the laser irradiation unit 20.

The height measurement unit 30 can measure the height of the object TA by a non-contact method. The height measuring part 30 may be a non-contact displacement sensor. The non-contact displacement sensor can measure the height of the object TA by measuring the distance from the object TA using laser or ultrasound. Here, the non-contact displacement sensor belongs to a well-known technology that is generally well-known, so a detailed description of the non-contact displacement sensor is omitted.

The control unit 60 may control the lift drive unit 50 to adjust the height of the laser irradiation unit 20 based on the measurement data measured by the height measurement unit 30. Lifting drive 50 The height of the laser irradiation unit 20 can be adjusted by adjusting the heights of the support height measuring unit 30 and the head 40 of the laser irradiation unit 20.

However, in the past, in order to adjust the height of the laser irradiation unit 20 by using such a height measuring unit 30, the following method was adopted: after the height of each region of the object TA to be measured by the height measuring unit 30, based on the measured Adjust the height of the laser irradiation unit 20 based on the data and perform laser processing.

3a and 3b are diagrams for explaining the laser processing method of the comparative example.

According to the comparative example, first, as shown in FIG. 3A, the height of each area of the object TA is measured by the height measuring unit 30. After the height measurement of each area of the object TA is completed, the height of the head 40 is adjusted based on the data measured by the height measurement unit 30 as shown in FIG. 3b, and the object TA is processed by the laser irradiation unit 20 The laser beam L is irradiated.

In the laser processing method of the comparative example, in order to measure the height of each area of the object TA, it is necessary to move the object TA once or more in order to measure the height of each area of the object TA. To irradiate the laser beam L, it is necessary to move the object TA once. Therefore, in the laser processing method of the comparative example, it is necessary to move the object TA to be processed twice or more, so there is a problem that the laser processing time increases.

Taking this aspect into consideration, the laser processing system 100 and the laser processing method of the embodiment intend to provide an apparatus and method for simultaneously measuring the height of the object to be processed TA and laser processing in order to reduce the laser processing time.

As mentioned above, the height measurement and laser processing can be performed simultaneously The number of movements of the object TA is reduced by more than half, thereby reducing the laser processing time.

4 is a diagram conceptually showing the operation of the laser processing system 100 of the embodiment, and FIGS. 5a to 5c are diagrams sequentially showing the operation of the laser processing system 100 of FIG. 4. For convenience, illustrations of the lift drive unit 50 and the control unit 60 are omitted in FIGS. 4 and 5a to 5c.

Referring to FIG. 4, in the laser processing system 100 of the embodiment, while the height measuring unit 30 arranged upstream in the moving direction of the object TA measures the height of a region of the object TA, the object TA The laser irradiation section 20 disposed downstream of the laser beam direction can irradiate the laser beam L to other areas of the object TA.

Referring to FIG. 5a, the workbench 10 moves in one direction, for example, the left direction. Therefore, the object TA mounted on the table 10 moves in the left direction.

The height measuring unit 30 arranged upstream in the moving direction of the object TA first measures the height of the first area TA1 of the object TA. The first area TA1 may be an end area of the object TA. However, the first area TA1 is not limited to this, and may be an intermediate area other than both end portions of the object TA.

At this time, the height H1 of the height measurement unit 30 does not change. Therefore, the height information h1 of the first area TA1 can be calculated based on the measurement data g1 measured by the height measurement unit 30. As an example, when the measurement data g1 is the distance between the first area TA1 of the object TA and the height measuring section 30, the height information h1 of the first area TA1 may be subtracted from the height H1 of the height measuring section 30 The above measurement data The value obtained by g1.

Referring to FIG. 5b, the object to be processed TA moves relative to the laser irradiation unit 20 and the height measurement unit 30, the laser irradiation unit 20 is located on the first region TA1, and the height measurement unit 30 is located in the second region adjacent to the first region TA1 TA2. The second area TA2 may be located upstream of the first area TA1 in the moving direction of the object TA.

The control unit 60 controls the elevation drive unit 50 based on the measurement data of the first area TA1 measured by the height measurement unit 30, thereby adjusting the height of the head 40. For example, the control unit 60 controls the elevation drive unit 50 based on the height information of the first area TA1, thereby adjusting the height of the head 40. Therefore, even if the height of the object TA changes, the laser irradiation unit 20 supported by the head 40 can converge the laser beam L to the specific depth of the first area TA1 of the object TA.

However, the height H2 of the height measurement unit 30 changes together with the laser irradiation unit 20 by adjusting the height of the head 40. Since the measurement data g2 measured by the height measurement unit 30 in the second area TA2 causes an error due to a change in the height H2 of the height measurement unit 30, it becomes difficult to directly use the measurement data g2 in the second area TA2 to calculate the 2 Height information h2 of the area TA2.

For example, as shown in FIG. 5b, the measurement data g2 of the second area TA2 measured in a state where the height measurement unit 30 rises by a specific height ΔH1 is higher than that of the second area TA2 measured in a state where the height measurement unit 30 does not rise. The measurement data g21 increases △H1.

Considering the measurement data caused by the height change of the height measuring section 30 For the error or distortion of the material, the control unit 60 reflects the height change of the height measurement unit 30 in the measurement data of the second area TA2, calculates and stores the height information of the second area TA2. For example, if the height of the height measurement unit 30 becomes higher by ΔH1, the control unit 60 may calculate the height information h2 of the second area TA2 based on the value obtained by subtracting the height change amount ΔH1 from the measurement data g2 of the second area TA2. Unlike the figure, if the height of the height measuring unit 30 decreases by ΔH1, the control unit 60 may calculate the height information h2 of the second area TA2 based on the value obtained by adding the height change amount ΔH1 to the measurement data of the second area TA2 .

Referring to FIG. 5c, the object TA moves relative to the laser irradiation unit 20 and the height measurement unit 30, the laser irradiation unit 20 is located on the second region TA2, and the height measurement unit 30 is located on the third region TA3 adjacent to the second region TA2 on. The third area TA3 may be located upstream of the second area TA2 in the moving direction of the object TA.

The control unit 60 controls the elevation drive unit 50 based on the height information h2 of the second area TA2, thereby adjusting the height of the head 40. Therefore, even if the height of the object to be processed TA changes, the laser irradiation unit 20 supported by the head 40 can condense the laser beam L to a specific depth in the second area TA2.

The height H3 of the height measuring unit 30 changes with the laser irradiation unit 20 by adjusting the height of the head 40. Taking into account the error or distortion caused by the height change amount ΔH2 of the height measuring section 30, the control section 60 can reflect the height change amount ΔH2 of the height measuring section 30 in the measurement data g3 of the third area TA3 to calculate the third area TA3 height information h3.

As described above, the laser beam 20 irradiates a laser beam L to a region During the period, the height measuring unit 30 measures the height of other adjacent areas to compensate for the amount of height change, thereby reducing the processing time, and minimizing the error in the height measurement to prevent the processing quality from deteriorating.

6 is a graph showing an example of the laser processing time of the laser processing system 100 of the comparative example of FIGS. 3a and 3b, and FIG. 7 is an example of the laser processing time of the laser processing system 100 of the embodiment of FIG. Chart.

3a, 3b, and 6, before irradiating the laser beam L, the height of each area of the object TA is first measured. At this time, it takes the entire time t ₁ to measure the height of each area.

After the height measurement of each area is completed, the object TA is moved to the initial position, and then the laser beam L is irradiated to the object TA by adjusting the height of the laser irradiation unit 20 based on the measured measurement data. At this time, it takes the entire time t _{2 to} irradiate the object TA with the laser beam L.

As described above, the laser processing system 100 of the comparative example irradiates the laser beam L after the measurement of the height of the object to be processed TA is completed, so the overall laser processing time T ₁ and the overall time t ₁ The sum of the total time t _{2 for} irradiating the laser beam L is the same or greater than the above sum.

In contrast, referring to FIGS. 4 and 7, in the laser processing system 100 of the embodiment, the object TA moves in a specific direction, and the height measuring unit 30 starts measuring the height of each area of the object TA.

That is, before the height measurement of each area of the object TA is completed, the laser light is irradiated from the time when the object TA passes through the lower part of the laser irradiation unit 20 The laser unit 20 starts to irradiate the laser beam L. At this time, although the height measurement unit 30 is in a state before the height measurement of each region of the object TA is completed, the height of the region of the object TA passing through the lower portion of the laser irradiation unit 20 is the measurement The end state.

Therefore, in the laser processing system 100 of the embodiment, while the laser irradiation unit 20 changes the height to irradiate the laser beam L to the object TA, the height measuring unit 30 can measure the change of the object TA in consideration of the height change height.

As described above, the step of measuring the height and the step of laser processing are not performed separately, thereby reducing the overall laser processing time. The laser processing system according to embodiment 100, the overall processing time T ₂ is less than the laser used for machining target TA overall height measurement times t ₁ to L of the entire laser beam irradiation time t ₂ and the sum.

On the other hand, as the position of the head 40 supporting the height measurement unit 30 and the laser irradiation unit 20 is changed in the optical axis direction, a load is applied to the lift drive unit 50. For example, referring to FIGS. 5a and 5b, when the object to be processed TA first reaches the lower portion of the laser irradiation unit 20, the laser irradiation unit 20 can reach the end region of the object to be irradiated with the laser beam L by the laser beam L The height of the laser irradiation unit 20 is adjusted in such a manner that the target height change amount ΔH1 at a specific depth. At this time, the required amount of height change ΔH1 of the laser irradiation unit 20 will be greater than the unit movement amount of the head 40 supporting the laser irradiation unit 20 within the reference time. Therefore, a load is applied to the lift drive unit 50 that raises the head 40.

Taking this aspect into consideration, the control section 60 of the embodiment can control the elevating drive section 50 in such a manner that the height measurement is performed at one end of the object TA After the fixed part 30 and before reaching the laser irradiation part 20, the height adjustment of the laser irradiation part 20 is started.

That is, the control unit 60 does not adjust the height of the laser irradiation unit 20 at a short moment when the end region of the object TA reaches the laser irradiation unit 20, but reaches the laser irradiation at the end region of the object TA The height adjustment is started before the unit 20, so that the height of the laser irradiation unit 20 can be adjusted in a relatively long time. Therefore, the control unit 60 can control the lift drive unit 50 so as to change the height of the laser irradiation unit 20 multiple times until the height of the laser irradiation unit 20 reaches the target height. The control unit 60 can control the lift drive unit 50 so that the height of the laser irradiation unit 20 is changed multiple times and the unit height is changed every time. The unit height for changing the height of the laser irradiation unit 20 may be 0.1 μm to 1.0 μm.

The control unit 60 can control the driving of the elevating drive unit 50 so that the height of the head 40 supporting the laser irradiation unit 20 is gradually or stepwise expressed.

8 is a graph showing an example of changing the height of the laser irradiation unit 20 at a specific time, and FIG. 9 is a graph showing an example of changing the height of the laser irradiation unit 20 before a specific time.

Referring to FIG. 8, when the height change of the laser irradiation section 20 up to a specific time point T ₀ requires ΔH1, the laser irradiation section 20 may be raised by ΔH1 at a time. However, when the height change amount ΔH1 of the laser irradiation unit 20 becomes large, for example, when the height of the laser irradiation unit 20 is greater than or equal to 10 times or more than 100 times the unit movement amount, Load is applied to the lift drive unit 50. Here, the unit movement amount of the laser irradiation unit 20 may be the same as the unit movement amount of the head 40.

In contrast, referring to FIG. 9, in order from a particular point in time before the time point ₀ T control unit _60-0 until the laser irradiation portion 20 will increase many times a particular point in time T, for example, 5 times is controlled drive of the elevation drive unit 50 In the event of a situation, it is possible to prevent or reduce a situation in which a load is applied to the lift drive 50.

In the above-mentioned embodiment, the number of times of changing the height of the laser irradiation unit 20 is exemplified as five, but it is not limited to this, and various modifications are possible. However, the number of times the height of the laser irradiation unit 20 changes can be smaller than the value obtained by dividing the distance between the height measurement unit 30 and the laser irradiation unit 20 by the measurement interval of the height measurement unit 30.

Since there is a certain interval between the height measuring unit 30 and the laser irradiation unit 20, there is a time difference from when a region of the object TA passes through the height measuring unit 30 until it reaches the laser irradiation unit 20. The control unit 60 can raise or lower the head 40 in stages using such a time difference.

The measurement data measured by the height measurement unit 30 can be stored in a memory variable every specific measurement interval and monitored in real time. The position value in the machining direction is divided by the measurement interval to count, and the counted value can be used as the address value of the memory variable that stores the measurement data of each area.

The height measurement unit 30 that performs measurement at specific measurement intervals along the processing direction can store the initial measurement data value generated by entering the area of the object TA to be actually processed and the memory variable storing such initial measurement data value address. When the initial measurement data value is n, the memory variable address storing the initial measurement data value is m, the initial measurement data value n is a positive value, and the number of steps (Step) is set to 5 stages, respectively, in the memory variable Address m-1, m-2, m-3, m -4 Store n-{(n/5)*1}, n-{(n/5)*2}, n-{(n/5)*3}, n-{(n/5)*4} Is used as the height data value.

If the initial measured data value n is a negative value, you can store n-{(n/5)*1}, n-{(n at the memory variable address m-1, m-2, m-3, m-4 /5)*2}, n-{(n/5)*3}, n-{(n/5)*4} values.

Furthermore, in order to remove noise from the measured data value measured by the height measurement unit 30, the control unit 60 may use a moving average filter.

As an example, the height information of the object TA can be calculated based on the weighted moving average of the measurement data measured by the height measurement unit 30. For example, the height of the object TA can be calculated based on the weighted moving average of the past data values measured by the height measuring unit 30 in the past based on the weighted moving average value compared to the current data values measured by the height measuring unit 30 News. When the currently measured current data value is n _t and the three most recent measured data values are n _t-1 , n _t-2 and n _t-3 , the moving average filter can calculate (n _t-3 *10+n _t-2 *10+n _t-1 *10+n _t )/31. When using the last 4 data values including the current data value, the moving average filter does not apply the first 3 data values but can be applied from the time point when the fourth data value is entered.

The control unit 60 can effectively remove noise in the measurement data measured by the height measurement unit 30 by using such a moving average filter.

On the other hand, in the above-mentioned embodiment, the example in which the table 10 moves horizontally and the head 40 moves vertically in the laser processing system 100 has been mainly described, but it is not limited thereto. For example, the table 10 can of course also be vertical Move, and the head 40 moves horizontally.

In the above, the embodiments of the present invention have been described, but the above embodiments are only examples, and those of ordinary skill in the art should understand that various modifications and equivalent other embodiments can be implemented according to the above embodiments.

10‧‧‧operating table

20‧‧‧Laser exposure department

30‧‧‧Altitude Measurement Department

40‧‧‧Head

100‧‧‧Laser processing system

L‧‧‧Laser beam

TA‧‧‧Object to be processed

Claims (14)

A laser processing method, which uses a laser irradiation portion and a height measuring portion arranged along the processing direction to simultaneously perform height measurement and laser processing on an object to be processed, comprising: measuring the object to be processed by the height measuring portion The step of the height of the first region; moving the object to be processed relative to the laser irradiation unit and the height measurement unit to position the laser irradiation unit to the object of the object to be processed The first area, and the step of positioning the height measuring section to a second area different from the first area of the object; when the laser irradiation section reaches the first area A step of adjusting the heights of the laser irradiation unit and the height measurement unit based on the height of the first region measured by the height measurement unit; and the laser irradiation unit The step of measuring the height of the second area by the height measuring section during the irradiation of the laser beam in the first area, and the step measured by the height measuring section in the step of measuring the height of the second area The height information of the second area is calculated by reflecting the height change of the height measuring unit in the measurement data of the second area. The laser processing method according to item 1 of the patent application scope, wherein when the height of the height measuring section increases or decreases, the measurement data of the second area measured by the height measuring section The height information of the second area is calculated by subtracting or adding the height change of the height measuring section. The laser processing method as described in item 1 of the patent application range, wherein the first area is an end area of the object to be processed, after the first area passes through the height measuring section and reaches the Before the laser irradiation part, the height of the laser irradiation part is adjusted. The laser processing method according to item 3 of the patent application range, wherein the laser irradiation unit can change the target height to irradiate the specific position of the first region to irradiate the laser beam multiple times The height of the laser irradiation part until the height of the laser irradiation part reaches the target height. The laser processing method as described in item 4 of the patent application range, wherein the height of the laser irradiating portion is changed a plurality of times and the specific unit height is changed every time. The laser processing method as described in item 4 of the patent application range, wherein the height measuring section measures the height of the object to be processed at a measurement interval of a specific distance, and the number of times of changing the height of the laser irradiation section is less than A value obtained by dividing the distance between the height measurement unit and the laser irradiation unit by the measurement interval of the height measurement unit. The laser processing method according to item 1 of the patent application scope, wherein height information of the object to be processed is calculated using a moving average of the measurement data measured by the height measurement unit. A laser processing system, including: a worktable carrying an object to be processed; a height measuring unit to measure the height of each region of the object to be processed; a laser irradiation unit to irradiate a laser beam to the object to be processed; a head , Supporting the laser irradiation section and the height measurement section in such a manner that the laser irradiation section and the height measurement section are arranged along the processing direction; an elevation drive section for adjusting the height of the head; and control Part, which controls the driving of the elevating driving part, and at least one of the worktable and the head can move in a direction crossing the optical axis direction of the laser beam. The height of the head changes to change the height, and the control unit calculates the height information of the object to be processed by reflecting the height change of the height measuring unit in the measurement data measured by the height measuring unit, based on The height information controls the lift drive unit. The laser processing system according to item 8 of the patent application scope, wherein the control unit subtracts or compares the measurement data measured by the height measurement unit when the height of the height measurement unit increases or decreases The height information of the object to be processed is calculated by adding the height change of the height measuring unit. The laser processing system according to item 8 of the patent application range, wherein the object to be processed moves relative to the laser irradiation section in a direction crossing the optical axis direction of the laser beam, and the control section The lift drive unit is controlled in such a manner that after one end region of the object passes through the height measurement unit and before reaching the laser irradiation unit, the height adjustment of the laser irradiation unit is started. The laser processing system according to item 10 of the patent application range, wherein the control unit controls the lift drive unit in such a manner that the laser irradiation unit can reach a specific part of the object to be processed to irradiate the laser The method of changing the height of the laser irradiation unit multiple times until the height of the laser irradiation unit reaches the target height. The laser processing system according to item 11 of the patent application range, wherein the control unit controls the lift drive unit so as to change the height of the laser irradiation unit multiple times and change a specific unit height each time. The laser processing system according to item 12 of the patent application range, wherein the height measuring section measures the height of the object to be processed at a measurement interval of a specific distance, and the number of times of height change of the laser irradiation section is less than A value obtained by dividing the distance between the height measurement unit and the laser irradiation unit by the measurement interval of the height measurement unit. The laser processing system according to claim 8 of the patent application, wherein the control unit calculates the height information of the object to be processed using a moving average of the measurement data measured by the height measurement unit.

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