CN115351427A - Processing method of dynamic focusing laser marking machine - Google Patents
Processing method of dynamic focusing laser marking machine Download PDFInfo
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- CN115351427A CN115351427A CN202211030447.4A CN202211030447A CN115351427A CN 115351427 A CN115351427 A CN 115351427A CN 202211030447 A CN202211030447 A CN 202211030447A CN 115351427 A CN115351427 A CN 115351427A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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Abstract
The invention discloses a processing method of a dynamic focusing laser marking machine, which relates to the technical field of laser marking, wherein a preheating region is preheated at a low temperature by using a laser spot with a larger area, and a controller gradually increases the laser power according to temperature information monitored by a temperature sensor in real time, so that the temperature of the laser spot irradiated on the preheating region is gradually increased from low to high, and the structural strength of the preheating region is relatively softened, thereby effectively avoiding the problem of cracking caused by large internal force due to the fact that a marking position is subjected to high-density high-temperature laser beams for a long time from the beginning to the end of marking, or the problem of cracking caused by the fact that a marking object has an overlarge temperature difference, and effectively avoiding the problem of cracking or cracking caused by the fact that the periphery of the marking position is heated unevenly. The double laser heads are used for processing, the first laser head preheats the preheating area, and the second laser head on the side of the first laser head carries out laser marking on the preheating area, so that the processing time is greatly shortened, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of laser marking, in particular to a processing method of a dynamic focusing laser marking machine.
Background
With the rapid development of the laser processing field, the application of the laser marking technology is more and more extensive, including consumer electronics, living goods, artware and the like.
When using laser marking machine to carve some special marks thing, for example, metal or glass material etc. owing to wait to carve the temperature of mark thing and hang down, and the temperature that touches partial mark thing behind the laser rises suddenly, leads to the material each part difference in temperature too big, and the difference in temperature too big probably can make the material burst, causes the damage of material. And when a marking object with higher structural strength is processed, the marking position is irradiated by a high-density high-temperature laser beam from the beginning of marking, and after a period of processing, the internal structure of the marking object is changed, so that larger internal force is generated to cause burst.
In order to solve the problem of cracking caused by marking, the existing marking machine firstly marks the marking position by using a laser beam with lower density and lower temperature, and gradually increases the density and the temperature of the laser beam along with the processing time, thereby effectively solving the problem of cracking of the marking object, but the processing mode still has the problem of cracking because of the following reasons: the peripheral position of the marking position is heated unevenly, so that the temperature difference between the marking position and the peripheral position is large or the marking position is not consistent under internal stress, and the marked object is cracked.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main objective of the present invention is to provide a processing method of a dynamic focusing laser marking machine, which solves the problem of cracking of a marking object.
In order to achieve the purpose, the invention adopts the following technical scheme: a processing method of a dynamic focusing laser marking machine comprises the following steps:
placing the marking object on the processing area and below the scanning head;
setting technological parameters on a controller, wherein the technological parameters comprise marking patterns, preheating areas, preheating temperature, laser spot size, laser density and laser scanning speed; starting up the machine, and starting the marking machine to work;
the laser displacement sensor obtains the distance information between the marking surface of the marking object and the scanning head according to the laser triangulation technology;
the temperature sensor senses the temperature of the marking surface to obtain the temperature information of the marking surface of the marking object;
entering a preheating mode: the controller controls the swing motor to drive the light path component to move according to the distance information and the temperature information, so that the laser spot emitted by the scanning head is enlarged to a preset spot size, the energy density of the laser spot is low, and the irradiation area is large; the laser spot irradiates a preheating area on the marking surface to start heating and preheating, the temperature sensor monitors the temperature information of the marking surface in real time, and the controller gradually increases the laser power according to the real-time monitored temperature information to enable the temperature of the laser spot irradiating the preheating area to gradually increase from low to high until the preheating temperature is reached;
entering a marking mode: when the temperature sensor senses that the temperature of the marking surface reaches the preheating temperature, the marking mode is entered, the controller controls the swing motor to drive the light path component to move again according to the distance information until the marking focal length is basically equal to the distance between the scanning head and the marking surface; the laser emitter emits a laser beam, and the laser beam sequentially passes through the light path component and the scanning head and then strikes the preheating area; the scanning head is used for controlling the marking laser beams to sequentially mark the marking surface in a scanning mode; the light path component is used for changing the marking focal length of the laser beam, and the controller controls the swing motor to drive the light path component to move and adjust according to the distance information monitored in real time so as to adapt to the fluctuation of different positions of the marking surface.
In one embodiment, in the preheating mode, after the laser spot becomes larger than the maximum laser spot, the maximum laser spot continuously heats the preheating region until the preheating temperature is reached.
In one embodiment, in the preheating mode, after the laser beam power is increased to the maximum power value, the laser beam with the maximum power continuously heats the preheating area until the preheating temperature is reached.
In one embodiment, when the predetermined light spot cannot completely cover the preheating region, the preheating region is divided into n sub-regions, n is greater than 1, and after the laser beam completes preheating and marking on the first sub-region, preheating and marking on the second sub-region are sequentially performed until the nth sub-region completes marking.
In one embodiment, in the marking mode, a laser beam performs laser marking perpendicular to a marking surface of the marking object; or the laser beam is not vertical to the marking surface of the marking object to carry out laser marking, at the moment, the marking surface is a reflecting surface, and the anti-counterfeiting mark is marked on the reflecting surface.
In one embodiment, the temperature sensor is a non-contact radiation temperature sensor.
In one embodiment, in the marking mode, the measured distance is compensated by a compensation formula to obtain a compensation distance, wherein the compensation formula is as follows:
wherein, a and b are coefficient parameters of the linear regression model respectively, L is a compensation value of the linear regression model, R is the reflectivity of the marking surface, X1 is a distance compensated according to the internal temperature of the laser head, and X0 is a compensation distance.
In one embodiment, the compensation formula for X1 is:
k represents the temperature slope, T represents the internal temperature of the laser head, and x2 represents the initial distance after fitting; wherein, the calculation mode of K is as follows:
c. d and e are coefficient parameters of the linear regression model respectively, and X is the measuring distance of the laser displacement sensor.
A processing method of a dynamic focusing laser marking machine comprises the steps that double laser heads are used for processing, a preheating area is preheated by a first laser head, laser marking is carried out on the preheated area by a second laser head located beside the first laser head, and the distance between the first laser head and the second laser head is adjusted through different servo motors.
In one embodiment, the distance between the first and second laser heads comprises: the distance between the first laser head and the second laser head on the X axis and the distance between the first laser head and the second laser head on the Y axis are different, and the first laser head and the second laser head move in different directions under the control of the servo motors.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
1. the preheating area (the marking position and the periphery of the marking position) is preheated at low temperature by the laser spot with larger area, the controller gradually increases the laser power according to the temperature information monitored by the temperature sensor in real time, so that the temperature of the laser spot irradiating the preheating area is gradually increased from low to relatively soften the structural strength of the preheating area, thereby effectively avoiding the problem of explosive cracking caused by large internal force due to the fact that the marking position receives high-density and high-temperature laser beams for a long time from the beginning to the end of marking or the problem of explosive cracking caused by overlarge temperature difference of the marking object, effectively avoiding the problem of cracking or explosive cracking caused by uneven heating of the periphery of the marking position, ensuring the processing safety and reducing the production cost.
2. The double laser heads are used for processing, the first laser head preheats the preheating area, and the second laser head on the side of the first laser head carries out laser marking on the preheating area, so that the processing time is greatly shortened, and the production efficiency is improved.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a perspective view of a marking machine provided by an embodiment of the present invention;
fig. 2 is a perspective view of an optical path component provided in an embodiment of the present invention.
Reference numerals:
10. frame 101, processing area
20. Laser marking head 21 and shell
22. Laser generator
231. Head swinging motor 232 and cam
233. Connecting band 234, lens mounting bracket
24. Scanning head 30 and laser displacement sensor
40. And a temperature sensor.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be constructed in operation as a limitation of the application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 2, the processing method is completed by using a marking machine, the marking machine includes: the frame 10 is provided with a processing area 101, and the marking objects are placed in the processing area 101. Be equipped with laser head 20 on the frame 10, laser head 20 includes casing 21, casing 21 is inside to be followed the length direction of laser head has connected gradually laser generator 22, light path adjustment mechanism and scanning head 24, and laser generator 22 is connected with the laser instrument. The outer surface of the shell 21 is provided with a laser displacement sensor 30, the laser displacement sensor 30 is positioned beside the scanning head 24, and a reflecting lens mechanism is arranged in the scanning head 24.
The optical path adjusting mechanism comprises a bracket (not shown), a head swinging motor 231, a cam 232, a connecting band 233 and an optical path component, wherein the optical path component comprises a lens mounting frame 234 provided with a lens, and the lens mounting frame 234 comprises at least 1 fixed convex lens and at least 1 movable concave lens. The bracket is arranged in the shell 21; the head swinging motor 231 is mounted on the bracket; the cam 232 is disposed on an output shaft of the swing motor 231, and the swing motor 231 drives the cam 232 to rotate. The lens mounting bracket 234 slides and sets up in the support, the connecting band 233 is connected the cam 232 with the lens mounting bracket 234, the cam 232 drives the connecting band 233 removes, the lens mounting bracket 234 follows the connecting band 233 in reciprocating sliding on the support to adjust the focus distance. The lens mounting frame 234 can only slide linearly and reciprocally, and the cam 232 drives the lens mounting frame 234 through the connecting band 233, so that the formation of a hinge point is avoided, the transmission precision is higher, and the corresponding speed is higher.
The first embodiment:
the application provides a processing method of a dynamic focusing laser marking machine, which comprises the following steps:
the marking object is placed on the processing zone 101 and below the scanning head 24.
Setting process parameters on a controller, wherein the process parameters comprise marking patterns, preheating areas (marking positions and surrounding areas), preheating temperature, laser spot size, laser density and laser scanning speed, and the process parameters can also comprise laser switch intermittent time, laser power and the like; and starting up the machine, and starting the marking machine.
The laser displacement sensor 30 obtains the distance information between the marking surface of the marking object and the scanning head 24 according to the laser triangulation technology; the laser triangulation technique is prior art and will not be described in detail here.
The temperature sensor 40 senses the temperature of the surface of the marking object to obtain the temperature information of the marking surface of the marking object, and the temperature sensor 40 is positioned beside the scanning head 24 and far away from one side of the laser displacement sensor 30.
Entering a preheating mode: the controller controls the swing motor 231 to drive the light path component to move according to the distance information and the temperature information, so that the laser spot emitted by the scanning head 24 is enlarged to a preset spot size, the energy density of the laser spot is low at the moment, namely, the temperature of the laser spot is low, the irradiation area is large, a wider preheating area can be irradiated, and the preheating time is saved. The laser spot irradiates the preheating area to start heating and preheating, the temperature sensor monitors the temperature information of the marking surface in real time, and the controller gradually increases the laser power according to the temperature information monitored in real time, so that the temperature of the laser spot irradiating the preheating area is gradually increased from low to high until the preheating temperature is reached. The preheating area (the marking position and the periphery of the marking position) is preheated at low temperature by the laser spot with larger area, the controller gradually increases the laser power according to the temperature information monitored by the temperature sensor in real time, so that the temperature of the laser spot irradiating the preheating area is gradually increased from low to relatively soften the structural strength of the preheating area, thereby effectively avoiding the problem of explosive cracking caused by large internal force due to the fact that the marking position receives high-density and high-temperature laser beams for a long time from the beginning to the end of marking or the problem of explosive cracking caused by overlarge temperature difference of the marking object, effectively avoiding the problem of cracking or explosive cracking caused by uneven heating of the periphery of the marking position, ensuring the processing safety and reducing the production cost.
Entering a marking mode: when the temperature sensor 40 senses that the temperature of the marking surface reaches the preheating temperature, the marking mode is entered, the controller controls the swing motor 231 again to drive the light path component to move according to the distance information until the marking focal distance is basically equal to the distance between the scanning head 24 and the surface of the marking object; the laser emitter 22 emits marking laser beams, and the marking laser beams sequentially pass through the light path assembly and the scanning head 24 and then are printed on the preheating area; the scanning head 24 is used for controlling the marking laser beam to sequentially mark on the marking surface in a scanning mode to mark; the light path component is used for changing the marking focal length of the marking laser beam, and the controller controls the swing motor 231 to drive the light path component to move and adjust according to the distance information monitored in real time so as to adapt to the fluctuation of different positions on the surface of the marking object.
Optionally, a mirror is disposed in the scanning head 24, and the angle of the mirror is adjustable, so as to achieve the emission of the laser beam at different angles.
In the preheating mode, after the laser light spot is enlarged to the maximum laser light spot, the maximum laser light spot continuously heats and preheats the preheating area until the preheating temperature is reached. In the preheating mode, after the power of the laser beam is increased to the maximum power value, the laser beam with the maximum power continuously heats and preheats the preheating area until the preheating temperature is reached.
When the preset light spot can not completely cover the preheating area, the preheating area is divided into n sub-areas, n is larger than 1, and after the laser beam preheats and marks the first sub-area, the laser beam preheats and marks the second sub-area, and the preheating and marking are sequentially carried out until the nth sub-area finishes marking.
In the marking mode, a laser beam is perpendicular to the marking surface of the marking object to carry out laser marking; or the laser beam is not perpendicular to the marking surface of the marking object to carry out laser marking, at the moment, the marking surface is a reflecting surface, or a reflecting material is coated on the marking surface, the anti-counterfeiting mark is marked on the reflecting surface, and when the viewing angle is changed, the obvious change trend of the definition of the anti-counterfeiting mark can be observed by naked eyes, so that the anti-counterfeiting effect is further improved.
The temperature sensor is a non-contact radiation temperature sensor. Of course, the temperature sensor may also be other non-contact temperature sensors or other contact temperature sensors, without limitation.
In the marking mode, the measured distance is compensated by using a compensation formula to obtain a compensation distance, wherein the compensation formula is as follows:
wherein, a and b are coefficient parameters of the linear regression model respectively, L is a compensation value of the linear regression model, R is the reflectivity of the marking surface, X1 is a distance compensated according to the internal temperature of the laser head, and X0 is a compensation distance. The optical reflectivity of the surface of the marking object and the internal temperature of the laser head 20 are important factors influencing the distance measuring information, and the distance measuring error generated by the two factors is compensated, so that the distance measuring information is more accurate.
Optionally, an internal temperature sensor is provided inside the laser head for detecting the internal temperature of the laser head 20, and in particular, the internal temperature sensor is located beside the photosensitive area of the photosensitive element of the laser displacement sensor 30.
The compensation formula of the X1 is as follows:
k represents the temperature slope, T represents the internal temperature of the laser head, and x2 represents the initial distance after fitting; wherein, the calculation mode of K is as follows:
c. d and e are coefficient parameters of the linear regression model respectively, and X is the measuring distance of the laser displacement sensor. The influence of temperature-induced measurement errors of the laser displacement sensor is considered from the system perspective, and a temperature drift influence factor is improved from the system perspective. And a temperature compensation algorithm is provided, so that the measurement error caused by temperature is further reduced.
The second embodiment:
the application also provides a processing method of the dynamic focusing laser marking machine, which comprises the steps of using double laser heads for processing, and using the double laser heads for processing, wherein a temperature sensor is not required to be arranged on the second laser head. The first laser head preheats the preheating area, the second laser head located beside the first laser head carries out laser marking on the preheating area, and the distance between the first laser head and the second laser head is adjusted in real time through different servo motors.
Optionally, the distance between the first laser head and the second laser head comprises: the distance between the first laser head and the second laser head on the X axis and the distance between the first laser head and the second laser head on the Y axis are different, and the first laser head and the second laser head move in different directions under the control of the servo motors.
When a plurality of preheating regions or sub-regions are provided, the distance between the preheating regions or sub-regions is set on the controller. After the equipment is started, the first laser head preheats the first preheating area or the first sub-area, after preheating is completed, the marking object is moved or the first laser head and the second laser head are controlled to move, so that the first laser head preheats the second preheating area or the second sub-area, meanwhile, the second laser head marks the first preheating area, and marking is sequentially performed until marking of all preheating areas or all sub-areas is completed.
The second embodiment compares first embodiment, uses two laser heads to process, has shortened process time greatly, has promoted production efficiency.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A processing method of a dynamic focusing laser marking machine is characterized by comprising the following steps:
placing a marking object on the processing area and below the scanning head;
setting technological parameters on a controller, wherein the technological parameters comprise marking patterns, preheating areas, preheating temperature, laser spot size, laser density and laser scanning speed; starting up the machine, and starting the marking machine;
the laser displacement sensor obtains the distance information between the marking surface of the marked object and the scanning head according to the laser triangulation technology;
the temperature sensor senses the temperature of the marking surface to obtain the temperature information of the marking surface;
entering a preheating mode: the controller controls the swing motor to drive the light path component to move according to the distance information and the temperature information, so that the laser spot emitted by the scanning head is enlarged to a preset spot size, the energy density of the laser spot is low, and the irradiation area is large; the laser spot irradiates a preheating area on the marking surface to start heating and preheating, the temperature sensor monitors the temperature information of the marking surface in real time, and the controller gradually increases the laser power according to the temperature information monitored in real time, so that the temperature of the laser spot irradiating the preheating area is gradually increased from low to high until the preheating temperature is reached;
entering a marking mode: when the temperature sensor senses that the temperature of the marking surface reaches the preheating temperature, the marking mode is entered, the controller controls the swing motor to drive the light path component to move again according to the distance information until the marking focal distance is basically equal to the distance between the scanning head and the marking surface; the laser emitter emits a laser beam, and the laser beam sequentially passes through the light path component and the scanning head and then strikes the preheating area; the scanning head is used for controlling the laser beams to sequentially mark in the preheating area in a scanning mode to mark; the controller controls the swing motor to drive the light path component to move and adjust according to the distance information monitored in real time so as to adapt to the fluctuation of different positions on the surface of the marking object.
2. The method of processing a dynamic focusing laser marking machine according to claim 1, characterized in that: in the preheating mode, after the laser light spot is enlarged to the maximum laser light spot, the maximum laser light spot continuously heats and preheats the preheating area until the preheating temperature is reached.
3. The method of processing a dynamic focusing laser marking machine according to claim 2, characterized in that: in the preheating mode, after the power of the laser beam is increased to the maximum power value, the laser beam with the maximum power continuously heats and preheats the preheating area until the preheating temperature is reached.
4. The method of processing a dynamic focusing laser marking machine according to claim 1, characterized in that: when the preset light spot cannot completely cover the preheating area, the preheating area is divided into n sub-areas, wherein n is larger than 1, and after the laser beam preheats and marks the first sub-area, the laser beam preheats and marks the second sub-area, and the preheating and marking are sequentially carried out until the nth sub-area finishes marking.
5. The method of claim 1, wherein the method comprises the steps of: in the marking mode, laser marking is carried out by a laser beam which is vertical to the marking surface; or the laser beam is not vertical to the marking surface to carry out laser marking, at the moment, the marking surface is a reflecting surface, and the anti-counterfeiting mark is marked on the reflecting surface.
6. The method of claim 1, wherein the method comprises the steps of: the temperature sensor is a non-contact radiation temperature sensor.
7. The method of claim 1, wherein the method comprises the steps of: in the marking mode, the measured distance is compensated by using a compensation formula to obtain a compensation distance, wherein the compensation formula is as follows:
wherein, a and b are coefficient parameters of the linear regression model respectively, L is a compensation value of the linear regression model, R is the reflectivity of the marking surface, X1 is a distance compensated according to the internal temperature of the laser head, and X0 is a compensation distance.
8. The method of processing a dynamic focusing laser marking machine according to claim 7, characterized in that: the compensation formula of X1 is as follows:
k represents the temperature slope, T represents the internal temperature of the laser head, and x2 represents the initial distance after fitting; wherein, the calculation mode of K is as follows:
c. d and e are coefficient parameters of the linear regression model respectively, and X is the measuring distance of the laser displacement sensor.
9. A processing method of a dynamic focusing laser marking machine is characterized by comprising the steps of processing by using double laser heads, preheating a preheating area by a first laser head, carrying out laser marking on the preheated area by a second laser head positioned beside the first laser head, and adjusting the distance between the first laser head and the second laser head through different servo motors;
when a plurality of preheating areas or sub-areas are provided, firstly, setting the distance between the preheating areas or the sub-areas on a controller; after the equipment is started, the first laser head preheats the first preheating area or the first sub-area, after preheating is completed, the marking object is moved or the first laser head and the second laser head are controlled to move, so that the first laser head preheats the second preheating area or the second sub-area, meanwhile, the second laser head marks the first preheating area, and marking is sequentially performed until marking of all preheating areas or all sub-areas is completed.
10. The method of processing a dynamic focus laser marker as claimed in claim 9, wherein: the distance between first laser head and second laser head includes: the distance between the first laser head and the second laser head on the X axis and the distance between the first laser head and the second laser head on the Y axis are different, and the first laser head and the second laser head move in different directions under the control of the servo motors.
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| CN202211030447.4A CN115351427A (en) | 2022-08-26 | 2022-08-26 | Processing method of dynamic focusing laser marking machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116786984A (en) * | 2023-08-16 | 2023-09-22 | 湖南中南智能激光科技有限公司 | Method for processing color marks on metal surface |
| CN118123241A (en) * | 2024-04-30 | 2024-06-04 | 迈为技术(珠海)有限公司 | Array laser welding device, method and storage medium |
-
2022
- 2022-08-26 CN CN202211030447.4A patent/CN115351427A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116786984A (en) * | 2023-08-16 | 2023-09-22 | 湖南中南智能激光科技有限公司 | Method for processing color marks on metal surface |
| CN118123241A (en) * | 2024-04-30 | 2024-06-04 | 迈为技术(珠海)有限公司 | Array laser welding device, method and storage medium |
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