JP2006218482A5 - - Google Patents
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- JP2006218482A5 JP2006218482A5 JP2005031673A JP2005031673A JP2006218482A5 JP 2006218482 A5 JP2006218482 A5 JP 2006218482A5 JP 2005031673 A JP2005031673 A JP 2005031673A JP 2005031673 A JP2005031673 A JP 2005031673A JP 2006218482 A5 JP2006218482 A5 JP 2006218482A5
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- irradiation
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- laser beam
- processing apparatus
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Claims (11)
レーザ光の照射手段と、Laser light irradiation means;
前記照射手段に対して照射対象物を相対的に走査させる走査手段と、Scanning means for scanning the irradiation object relative to the irradiation means;
前記照射手段と前記走査手段とを制御して、前記レーザ光で前記照射対象物を相対的に走査しつつ、前記レーザ光を前記照射対象物に照射することによって、前記照射対象物にライン状の調整用加工痕を形成させる調整用加工痕作成制御手段と、By irradiating the irradiation object with the laser light while controlling the irradiation means and the scanning means and relatively scanning the irradiation object with the laser light, the irradiation object is line-shaped. An adjustment processing trace creation control means for forming an adjustment processing trace of
前記調整用加工痕を撮像する撮像手段と、An imaging means for imaging the adjustment processing trace;
を備えることを特徴とするレーザ加工装置。A laser processing apparatus comprising:
前記調整用加工痕作成制御手段が、The adjustment processing trace creation control means,
前記照射手段と前記走査手段とを制御して、前記レーザ光で前記照射対象物を相対的に走査しつつ、前記レーザ光を前記照射対象物に照射することを、前記照射手段と前記照射対象物との離間距離を変化させつつ実行させることにより、前記照射対象物にライン状の複数の調整用加工痕を形成させる、The irradiation unit and the irradiation target are controlled by controlling the irradiation unit and the scanning unit to relatively scan the irradiation target with the laser beam and irradiate the irradiation target with the laser beam. By performing while changing the separation distance from the object, to form a plurality of adjustment traces in the form of a line on the irradiation object,
ことを特徴とするレーザ加工装置。The laser processing apparatus characterized by the above-mentioned.
前記撮像手段により得られた撮像結果を用いて、前記複数の調整用加工痕の鮮鋭度比較を行い、当該比較結果に基づいて前記レーザ光の合焦状態が実現される前記照射手段の配置位置を特定する配置位置特定手段、Using the imaging result obtained by the imaging means, the sharpness comparison of the plurality of adjustment processing marks is performed, and the arrangement position of the irradiation means where the focused state of the laser beam is realized based on the comparison result An arrangement position specifying means for specifying
をさらに備えることを特徴とするレーザ加工装置。A laser processing apparatus, further comprising:
前記撮像手段により得られた撮像結果を用いて、前記レーザ光の走査方向に直角な方向についての前記複数の調整用加工痕の位置比較を行い、当該比較結果に基づいて前記レーザ光の光軸の傾き度合を特定する光軸傾き特定手段、Using the imaging result obtained by the imaging means, position comparison of the plurality of adjustment processing traces in a direction perpendicular to the scanning direction of the laser beam is performed, and the optical axis of the laser beam is based on the comparison result Optical axis inclination specifying means for specifying the inclination degree of
をさらに備えることを特徴とするレーザ加工装置。A laser processing apparatus, further comprising:
前記撮像手段により得られた撮像結果を用いて、前記照射対象物の前記撮像手段の視野中に前記レーザ光の走査方向に沿って設定された所定の基準線分と前記調整用加工痕との間で前記レーザ光の走査方向に直角な方向についての位置比較を行い、当該比較結果に基づいて当該方向についての前記レーザ光の光軸のずれ度合を特定する光軸ずれ特定手段、Using the imaging result obtained by the imaging unit, a predetermined reference line segment set along the scanning direction of the laser beam in the field of view of the imaging unit of the irradiation object and the adjustment processing trace Optical axis deviation specifying means for performing position comparison in a direction perpendicular to the scanning direction of the laser light between them and specifying the degree of deviation of the optical axis of the laser light in the direction based on the comparison result,
をさらに備えることを特徴とするレーザ加工装置。A laser processing apparatus, further comprising:
前記レーザ光で照射対象物を相対的に走査することによってライン状の調整用加工痕を形成し、前記ライン状の調整用加工痕を観察して、前記レーザ光の照射手段の調整のための情報を得ることを特徴とするレーザ光の調整方法。A line-shaped adjustment processing trace is formed by relatively scanning the irradiation object with the laser light, and the line-shaped adjustment processing trace is observed to adjust the laser light irradiation means. A method for adjusting laser light, characterized by obtaining information.
所定の照射手段からのレーザ光によって照射対象物を相対的に走査するプロセスを、前記照射手段と前記照射対象物との幾何学的関係を変化させつつ実行することにより、前記照射対象物にライン状の複数の調整用加工痕を形成する加工痕形成工程と、
前記複数の調整用加工痕の幾何学的状態について相対的な比較を行い、当該比較結果に基づいて前記照射手段の光学的状況を判断する判断工程と、
を備えることを特徴とするレーザ光の調整方法。 A laser beam adjusting method in a laser processing apparatus for processing a workpiece by condensing and irradiating a laser beam on an irradiation site of the workpiece,
By executing a process of relatively scanning the irradiation object with laser light from a predetermined irradiation means while changing the geometric relationship between the irradiation means and the irradiation object, a line is formed on the irradiation object. A machining trace forming step for forming a plurality of adjustment machining traces,
Performing a relative comparison on the geometric state of the plurality of adjustment processing traces, and determining the optical state of the irradiation means based on the comparison result; and
A method for adjusting a laser beam, comprising:
前記幾何学的関係は、前記照射対象物と前記照射手段との離間距離であり、
前記相対的な比較は、前記複数の加工痕の幅の比較であって、
前記光学的状況が、前記照射対象物への合焦状況であることを特徴とするレーザ光の調整方法。 In the laser beam adjustment method according to claim 7 ,
The geometric relationship is a separation distance between the irradiation object and the irradiation unit,
The relative comparison is a comparison of widths of the plurality of processing marks,
The method of adjusting laser light, wherein the optical state is a state of focusing on the irradiation object.
前記幾何学的関係は、前記照射対象物と前記照射手段との離間距離であり、
前記相対的な比較は、前記レーザ光の走査方向に直角な方向についての前記複数の調整用加工痕の位置比較であって、
前記光学的状況が、前記レーザ光の光軸の傾き状況であることを特徴とするレーザ光の調整方法。 In the laser beam adjustment method according to claim 7 ,
The geometric relationship is a separation distance between the irradiation object and the irradiation unit,
The relative comparison is a position comparison of the plurality of adjustment processing traces in a direction perpendicular to the scanning direction of the laser beam,
The method for adjusting laser light, wherein the optical state is an inclination state of an optical axis of the laser light.
所定の照射手段からのレーザ光によって照射対象物を相対的に走査するプロセスを実行することにより、前記照射対象物にライン状の調整用加工痕を形成する加工痕形成工程と、
前記調整用加工痕の幾何学的状態について所定の基準状態との間で比較を行い、当該比較結果に基づいて前記照射手段の状況を判断する判断工程と、
を備えることを特徴とするレーザ光の調整方法。 A laser beam adjusting method in a laser processing apparatus for processing a workpiece by condensing and irradiating a laser beam on an irradiation site of the workpiece,
By performing a process of relatively scanning the irradiation object with a laser beam from a predetermined irradiation means, a processing mark forming step of forming a line-shaped adjustment processing mark on the irradiation object;
A determination step for comparing the geometric state of the adjustment processing trace with a predetermined reference state, and determining the state of the irradiation unit based on the comparison result;
A method for adjusting a laser beam, comprising:
前記所定の基準状態が、前記照射対象物の光学的観察手段の視野中に前記レーザ光の走査方向に沿って設定された所定の基準線分によって表現されており、
前記比較は、前記走査の方向に直角な方向についての前記調整用加工痕と前記基準線分との位置比較であって、
前記光学的状況が、前記走査に直角な方向についての前記レーザ光の光軸のずれ状況であることを特徴とするレーザ光の調整方法。 The method of adjusting a laser beam according to claim 10 ,
The predetermined reference state is represented by a predetermined reference line segment set along the scanning direction of the laser beam in the field of view of the optical observation means of the irradiation object,
The comparison is a position comparison between the adjustment processing trace and the reference line segment in a direction perpendicular to the scanning direction,
The laser light adjusting method, wherein the optical state is a state of deviation of an optical axis of the laser light in a direction perpendicular to the scanning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005031673A JP4583955B2 (en) | 2005-02-08 | 2005-02-08 | Laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005031673A JP4583955B2 (en) | 2005-02-08 | 2005-02-08 | Laser processing equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006218482A JP2006218482A (en) | 2006-08-24 |
| JP2006218482A5 true JP2006218482A5 (en) | 2008-06-19 |
| JP4583955B2 JP4583955B2 (en) | 2010-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005031673A Expired - Fee Related JP4583955B2 (en) | 2005-02-08 | 2005-02-08 | Laser processing equipment |
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| Country | Link |
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| JP (1) | JP4583955B2 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013078785A (en) * | 2011-10-04 | 2013-05-02 | Disco Corp | Method of detecting condensing spot position in laser beam processing apparatus |
| JP6000551B2 (en) * | 2012-01-10 | 2016-09-28 | 株式会社ディスコ | Focusing spot position detection method of laser processing equipment |
| JP6241174B2 (en) * | 2013-09-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | Laser processing apparatus and processing condition setting method for patterned substrate |
| JP6715118B2 (en) * | 2016-07-14 | 2020-07-01 | 株式会社アマダ | Jig for optical system adjustment |
| DE102016219928A1 (en) * | 2016-10-13 | 2018-04-19 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method and device for determining and controlling a focus position of a machining beam |
| JP6760044B2 (en) * | 2016-12-21 | 2020-09-23 | トヨタ自動車株式会社 | Optical axis adjustment device |
| JP6932437B2 (en) * | 2017-06-02 | 2021-09-08 | 株式会社ディスコ | How to check the optical axis of the laser processing equipment |
| JP7292797B2 (en) * | 2019-06-05 | 2023-06-19 | 株式会社ディスコ | How to check the tilt |
| JP7292798B2 (en) * | 2019-06-05 | 2023-06-19 | 株式会社ディスコ | How to check the tilt |
| JP7237432B2 (en) * | 2019-07-26 | 2023-03-13 | 株式会社ディスコ | Comparison method and laser processing device |
| JP7305271B2 (en) * | 2019-08-08 | 2023-07-10 | 株式会社ディスコ | Confirmation method of processing performance of laser processing equipment |
| JP7547166B2 (en) | 2020-10-29 | 2024-09-09 | 株式会社ディスコ | Laser processing equipment |
| CN113059188B (en) * | 2021-06-03 | 2021-10-01 | 中国航发上海商用航空发动机制造有限责任公司 | Method for processing parts by using laser melting forming device |
| JP7340064B1 (en) | 2022-05-16 | 2023-09-06 | 株式会社牧野フライス製作所 | Method for adjusting focus position of laser processing machine and laser processing machine |
| CN115674203B (en) * | 2022-11-02 | 2024-09-10 | 中联重科股份有限公司 | Tool control method, device, processor and storage medium |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2637523B2 (en) * | 1988-12-13 | 1997-08-06 | 株式会社アマダ | Laser processing equipment |
| JPH07177414A (en) * | 1993-12-20 | 1995-07-14 | Canon Inc | Focusing detector |
| JP3204141B2 (en) * | 1997-01-06 | 2001-09-04 | 住友金属工業株式会社 | Method and apparatus for measuring displacement in welding and method and apparatus for controlling seam copying |
| JP2001321974A (en) * | 2000-05-12 | 2001-11-20 | Sumitomo Metal Ind Ltd | Method of monitoring and controlling for deviation of position irradiated with energy beam on welded pipe |
| JP2004158569A (en) * | 2002-11-05 | 2004-06-03 | Sony Corp | Irradiator and irradiation method, annealer and annealing method |
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- 2005-02-08 JP JP2005031673A patent/JP4583955B2/en not_active Expired - Fee Related
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