TW201841707A - Laser processing system and laser processing method - Google Patents

Abstract

Provided is a laser processing method and a laser processing system. The laser processing method includes simultaneously performing height measurement of a processing target and laser processing by using a laser radiator and a height measuring unit that are aligned in a processing direction.

Description

Laser processing system and laser processing method

The present invention relates to a laser processing system and a laser processing method capable of adjusting the height according to the bending of an object to be processed.

Laser processing refers to a method of condensing a laser beam into a focal point shape using a condenser lens, and irradiating the focal point onto the surface or the inside of a processing object for processing.

When the laser beam is focused to one focal point for processing, a higher energy density can be obtained. Therefore, the focus of the laser beam can be used to cut the product or perform marking processing on the surface of the product. The size of the focused laser beam changes according to the wavelength of the laser beam, the focal length of the condenser lens, and the diameter of the incident laser beam. The laser beam can be processed more accurately only at the focal position of the focused beam. And stable processing quality.

However, the height of each part of the processing target varies depending on various factors such as the bending of the processing target.

Depth of Focus (DOF) is the height at which processing is performed during laser processing. If the surface of the processed product is out of focus, processing cannot be achieved or it has an adverse effect on processing quality. Therefore, it is important to The distance between the laser irradiation part and the object to be irradiated with the laser beam is maintained.

In order to keep the distance between the laser irradiation part and the processing object fixed, first, after measuring the height of each part of the processing object, the height of the laser irradiation part can be adjusted based on the measured data to irradiate the laser beam.

However, in this method, a data acquisition operation for measuring the height of each part of the processing object and a processing operation for irradiating a laser beam are separately performed. Therefore, the object to be processed needs to pass through the laser head at least twice, which is cumbersome, so there is a limit in reducing the processing time.

[Problems to be Solved by the Invention]

The invention provides a laser processing system and a laser processing method, which simultaneously perform a data acquisition operation for measuring the height of each part of a processing object and a processing operation for irradiating a laser beam, thereby reducing the processing of the processing object time.

[Means for solving problems]

A laser processing method according to an aspect of the present invention is to perform a height measurement and a laser processing on an object to be processed at the same time by using a laser irradiating portion and a height measuring portion arranged along a processing direction, and the method includes the following steps: using the height measuring portion And a step of measuring the height of the first region of the processing object; moving the processing object relative to the laser irradiation section and the height measuring section to position the laser irradiation section to the first position of the processing object; A step of positioning the height measuring unit on a second area different from the first area of the object to be processed in the first area; when the laser irradiation portion reaches the first area, based on the use of the height measuring unit A step of adjusting the heights of the laser irradiation section and the height measurement section by measuring the height of the first region; and the height measurement section measures while the laser irradiation section irradiates the laser beam to the first area The step of the height of the second region; and the step of measuring the height of the second region may be measured by the height measuring unit. It reflects a change in the height of the height measuring unit measuring the information of the second region is calculated height information of the second region.

In one embodiment, when the height of the height measuring unit is increased or decreased, the measurement data of the second area measured by the height measuring unit may be subtracted or added to the height change of the height measuring unit to calculate. Height information for the second area.

In an embodiment, the first region is a region of one end of the object to be processed. After the first region passes the height measuring unit and before reaching the laser irradiation unit, adjustment of the laser irradiation unit can be started. height.

In an embodiment, the height of the laser irradiation unit is changed multiple times until the laser irradiation unit reaches a target height for irradiating a laser beam on a specific part of the first region until the height of the laser irradiation unit reaches The above target height.

In one embodiment, the height of the laser irradiation unit may be changed multiple times, and a specific unit height may be changed each time.

In one embodiment, the height measuring unit may measure the height of the processing object at a measurement interval of a specific distance, and the number of height changes of the laser irradiation unit is less than that between the height measuring unit and the laser irradiation unit. The value obtained by dividing the distance by the above-mentioned measurement interval of the height measurement unit.

In one embodiment, the height information of the object to be processed may be calculated using a moving average of the measurement data measured by the height measurement unit.

A laser processing system according to an aspect of the present invention includes: a work table on which a processing object is mounted; a height measuring unit that measures the height of each region of the processing object; a laser irradiation unit that irradiates a laser beam to the processing object; The head part supports the laser irradiation part and the height measurement part in a manner that the laser irradiation part and the height measurement part are arranged along the processing direction; a lift driving part for adjusting the height of the head part; and a control part, controls The lifting driving unit is driven, and at least one of the worktable and the head is movable in a direction crossing the optical axis direction of the laser beam, and the height measuring unit is changed by a change in the height of the head. For the height, the control unit may calculate the height information of the object to be processed by reflecting the height change of the height measurement unit in the measurement data measured by the height measurement unit, and control the elevation driving unit based on the height information.

In one embodiment, when the height of the height measuring unit is increased or decreased, the control unit may subtract or add the measurement data measured by the height measuring unit to subtract or add the height change of the height measuring unit to calculate the processing. Object height information.

In one embodiment, the processing object moves in a direction crossing the optical axis direction of the laser beam with respect to the laser irradiating portion, and the control unit can control the elevating driving portion as follows: After passing through the height measurement section and before reaching the laser irradiation section, one end of the object starts to adjust the height of the laser irradiation section.

In one embodiment, the control unit can control the lift driving unit in such a manner that the laser is changed multiple times so that the laser irradiation unit can reach a target height that irradiates a laser beam on a specific part of the processing object. The height of the irradiated part reaches the height of the laser irradiated part to the target height.

In one embodiment, the control unit can control the lift driving unit in such a manner that the height of the laser irradiation unit is changed multiple times and a specific unit height is changed each time.

In one embodiment, the height measuring unit may measure the height of the processing object at a measurement interval of a specific distance, and the number of height changes of the laser irradiation unit is less than that between the height measuring unit and the laser irradiation unit. The value obtained by dividing the distance by the above-mentioned measurement interval of the height measurement unit.

In one embodiment, the control unit may calculate the height information of the object to be processed using a moving average of the measurement data measured by the height measurement unit.

[Effect of the invention]

The laser processing system and the laser processing method according to the embodiments of the present invention simultaneously perform a data acquisition operation for measuring the height of each part of the processing object and a processing operation for irradiating a laser beam, thereby reducing the processing of the processing object time.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same constituent elements, and the dimensions or thicknesses of the constituent elements may be enlarged for the sake of clarity.

Terms including ordinal numbers such as "first" and "second" can be used to describe various constituent elements, but the constituent elements are not limited by the terms. The term is used only for the purpose of distinguishing one constituent element from the other constituent elements. For example, the first constituent element may be named as the second constituent element without departing from the scope of the invention application patent of the present invention. Similarly, the second constituent element may be named as the first constituent element. The term "and / or" includes a combination of a plurality of related items or any one of the plurality of related items.

FIG. 1 is a diagram conceptually showing an example of a laser processing system 100 according to the embodiment. FIG. 2 is a diagram for explaining an example of the processing target TA ₀ .

Referring to FIG 1, the laser processing system includes a work table 100 is mounted TA ₀ of the object 10, and the laser irradiation L portion of the object laser beam 20 is irradiated TA _0.

At least one of the worktable 10 and the laser irradiation unit 20 is movable in a direction crossing the optical axis direction of the laser beam L.

As an example, the worktable 10 can move in a direction perpendicular to the optical axis direction of the laser beam L. Therefore, the processing object TA ₀ mounted on the worktable 10 can be moved along with the worktable 10 in a direction perpendicular to the optical axis direction of the laser beam L.

The laser irradiation unit 20 can irradiate a laser beam L to a specific area of the processing object TA ₀ . For example, the laser irradiation part 20 can irradiate the laser beam L so that the focus of the laser beam L may be condensed inside or on the processing object TA ₀ . As an example, the laser beam L can be condensed into the processing object TA ₀ to form a recombination area. As another example, the laser beam L can be condensed to a surface of the object TA ₀ is formed on the groove surface of the object of TA _0.

As the writing table 10 moves, the laser beam L is irradiated to the processing object TA _{0 in a} direction opposite to the moving direction of the work table 10 (that is, the processing direction).

However, the ideal state of the processing object TA ₀ is flat, but the processing object TA is actually uneven due to various reasons such as the bending phenomenon of the processing object TA. Referring to FIG. 2, the processing object TA is bent and the height of the upper surface of the processing object TA is not fixed. Here, the height is defined as the height based on the upper surface of the workbench 10.

When the height of the upper surface of the object to be processed TA is not fixed, the laser beam L irradiated by the laser irradiation unit 20 is condensed to a specific height from the work table 10, the laser beam L is condensed to If the position of the processing object TA is not fixed, or is not condensed in a part of the area of the processing object TA, etc., the processing quality may be significantly reduced.

In consideration of this aspect, the laser processing system 100 may further include: a height measuring section 30 that measures the height of each area of the processing object TA; and a head 40 that is arranged along the processing direction with the height measuring section 30 and the laser irradiation section 20 The method supports the height measuring section and the laser irradiation section; the lifting driving section 50 is used to adjust the height of the head 40 supporting the laser irradiation section 20; and the control section 60 is based on the height measured by the height measurement section 30. The data is measured to control the driving of the lifting drive unit 50.

The height measurement unit 30 measures the height of each area of the processing target TA. The height of each area of the processing object TA may be a height to achieve laser processing, that is, a depth (Depth of Focus: DOF).

As an example, the processing object TA is relatively moved with respect to the height measurement unit 30, and the height measurement unit 30 measures the height of the processing object TA at specific time intervals. Therefore, the height of the object TA is measured by the height measurement unit 30 at a measurement interval every specific distance. The height measurement unit 30 may be disposed downstream of the laser irradiation unit 20 in the processing direction. The height measurement unit 30 may be disposed upstream of the laser irradiation unit 20 in the moving direction of the processing object TA. Therefore, before the laser beam L is irradiated to a part of the area of the processing object by the laser irradiation section 20, the height of a part of the area of the processing object TA can be measured by the height measuring unit 30.

The height measurement unit 30 and the laser irradiation unit 20 may be spaced apart from each other by a specific interval. The interval G between the height measurement section 30 and the laser irradiation section 20 may be 70 mm or more. The interval G between the height measurement section 30 and the laser irradiation section 20 may be 1000 mm or less. Here, the interval G between the height measurement unit 30 and the laser irradiation unit 20 may be a distance from the center of the height measurement unit 30 to the center of the laser irradiation unit 20.

The height measurement unit 30 can measure the height of the processing object TA by a non-contact method. The height measurement unit 30 may be a non-contact displacement sensor. The non-contact displacement sensor can measure the distance from the processing object TA using laser or ultrasonic waves, and measure the height of the processing object TA. Here, the non-contact displacement sensor is a well-known technology that is generally well-known, so detailed description of the non-contact displacement sensor is omitted.

The control unit 60 can adjust the height of the laser irradiation unit 20 based on the measurement data measured by the height measurement unit 30 and control the lift driving unit 50. The lift driving unit 50 can adjust the height of the laser irradiation unit 20 by adjusting the heights of the head 40 supporting the height measurement unit 30 and the laser irradiation unit 20.

However, in order to adjust the height of the laser irradiation unit 20 using such a height measuring unit 30, the following method has been adopted: After measuring the height of each area of the processing object TA by the height measuring unit 30, based on the measured The height of the laser irradiation unit 20 is adjusted based on data, and laser processing is performed.

3a and 3b are diagrams for explaining a laser processing method of a comparative example.

According to the comparative example, as shown in FIG. 3 a, the height of each region of the object TA is first measured by the height measurement unit 30. After the height measurement of each area of the processing object TA is completed, as shown in FIG. 3 b, the height of the head 40 is adjusted based on the data measured by the height measurement unit 30, and the processing object TA is adjusted by the laser irradiation unit 20. The laser beam L is irradiated.

In the laser processing method of the comparative example, when processing the processing target TA, it is necessary to move the processing target TA more than once in order to measure the height of each area of the processing target TA. In order to measure each area of the processing target TA, To irradiate the laser beam L, it is necessary to move the processing object TA once. Therefore, in the laser processing method of the comparative example, it is necessary to move the processing object TA twice or more, and therefore there is a problem that the laser processing time increases.

In consideration of this aspect, in the laser processing system 100 and the laser processing method of the embodiments, it is intended to provide an apparatus and method for simultaneously measuring the height of the processing object TA and laser processing in order to reduce the laser processing time.

As described above, by simultaneously performing the height measurement and the laser processing, the number of movements of the processing target TA can be reduced by more than half, thereby reducing the laser processing time.

FIG. 4 is a diagram conceptually showing the operation of the laser processing system 100 of the embodiment, and FIGS. 5 a to 5 c are diagrams sequentially showing the operation of the laser processing system 100 of FIG. 4. For convenience, illustrations of the elevation driving section 50 and the control section 60 are omitted in FIGS. 4 and 5 a to 5 c.

Referring to FIG. 4, in the laser processing system 100 of the embodiment, the height measurement unit 30 disposed upstream in the moving direction of the processing object TA measures the height of a region of the processing object TA while measuring the height of a region of the processing object TA. The laser irradiation unit 20 disposed downstream in the moving direction can irradiate the laser beam L to other areas of the processing target TA.

5a, the workbench 10 moves in one direction, for example, the left direction. Therefore, the processing object TA mounted on the workbench 10 moves in the left direction.

The height measurement unit 30 disposed upstream in the moving direction of the processing object TA first measures the height of the first area TA1 of the processing object TA. The first region TA1 may be an end region of the object to be processed TA. However, the first area TA1 is not limited to this, and may be an intermediate area other than both end portions of the object to be processed TA.

At this time, since the height H1 of the height measurement section 30 does not change, the height information h1 of the first area TA1 can be calculated based on the measurement data g1 measured by the height measurement section 30. As an example, when the measurement data g1 is the distance g1 between the first area TA1 of the object TA and the height measurement unit 30, the height information h1 of the first area TA1 may be reduced from the height H1 of the height measurement unit 30. The value obtained by removing the above measurement data g1.

5b, the processing object TA moves relative to the laser irradiation section 20 and the height measurement section 30, and the laser irradiation section 20 is located on the first area TA1, and the height measurement section 30 is located on a second area adjacent to the first area TA1. On TA2. The second area TA2 may be located upstream of the first area TA1 in the moving direction of the processing object TA.

The control unit 60 adjusts the height of the head 40 based on the measurement data of the first area TA1 measured by the height measurement unit 30 and controls the lift driving unit 50. For example, the control unit 60 adjusts the height of the head 40 by controlling the lift driving unit 50 based on the height information of the first area TA1. Therefore, even if the height of the processing object TA changes, the laser irradiation unit 20 supported by the head 40 can condense the laser beam L to a specific depth in the first region TA1 of the processing object TA.

However, the height H2 of the height measurement unit 30 is changed together with the laser irradiation unit 20 by adjusting the height of the head 40. Since the measurement data g2 measured by the height measurement unit 30 on the second area TA2 generates an error due to a change in the height H2 of the height measurement unit 30, it becomes difficult to directly use the measurement data g2 on the second area TA2 to calculate the first Height information h2 of area TA2.

For example, as shown in FIG. 5B, the measurement data g2 of the second area TA2 measured while the height measuring unit 30 is rising by a specific height ΔH1 is higher than the measurement of the second area TA2 measured while the height measuring unit 30 is not rising. The data g21 increases by ΔH1.

Taking into account errors or distortions of the measurement data caused by the height change of the height measurement unit 30, the control unit 60 reflects the height change of the height measurement unit 30 in the measurement data of the second area TA2 to calculate the height information of the second area TA2 and Save. For example, when the height of the height measurement unit 30 becomes higher by ΔH1, the control unit 60 may calculate the height information h2 of the second region TA2 based on a value obtained by subtracting the height change amount ΔH1 from the measurement data g2 of the second region TA2. Unlike the drawing, when the height of the height measurement unit 30 decreases by ΔH1, the control unit 60 can calculate the height information h2 of the second area TA2 based on a value obtained by adding the height change amount ΔH1 to the measurement data of the second area TA2.

5c, the object TA moves relative to the laser irradiation section 20 and the height measurement section 30, the laser irradiation section 20 is located on the second area TA2, and the height measurement section 30 is located on the third area TA3 adjacent to the second area TA2. on. The third area TA3 may be located upstream of the second area TA2 in the moving direction of the processing object TA.

The control unit 60 adjusts the height of the head 40 by controlling the lift driving unit 50 based on the height information h2 of the second area TA2. Therefore, even if the height of the processing object TA changes, the laser irradiation section 20 supported by the head 40 can condense the laser beam L to a specific depth in the second area TA2.

The height H3 of the height measurement unit 30 is changed together with the laser irradiation unit 20 by adjusting the height of the head 40. Taking into account the errors or distortions caused by the height change ΔH2 of the height measurement unit 30, the control unit 60 can reflect the height change ΔH2 of the height measurement unit 30 in the measurement data g3 of the third area TA3 to calculate the height information of the third area TA3. h3.

As described above, while the laser irradiating section 20 irradiates the laser beam L to one area, the height measuring section 30 measures the height of other adjacent areas to compensate for the amount of change in height, thereby reducing the processing time, Minimize errors and prevent degradation of processing quality.

6 is a graph showing an example of laser processing time of the laser processing system 100 of the comparative example of FIGS. 3 a and 3 b, and FIG. 7 is an example of laser processing time of the laser processing system 100 of the embodiment of FIG. 4. Chart.

3a, 3b, and 6, before the laser beam L is irradiated, the height of each area of the processing object TA is first measured. At this time, it takes the entire time t ₁ to measure the height of each region.

After the height measurement in each area is completed, the processing object TA is moved to the initial position, and then the height of the laser irradiation unit 20 is adjusted based on the measured measurement data to irradiate the processing object TA with the laser beam L. At this time, it takes the entire time t _{2 to} irradiate the laser beam L to the processing object TA.

As described above, the laser processing system 100 of the comparative example irradiates the laser beam L after all the height measurement of the processing object TA is completed, so the overall laser processing time T1 and the overall time t ₁ for measuring the height are different The total time t ₂ for irradiating the laser beam L is the same as or larger than the above-mentioned sum.

In contrast, referring to FIGS. 4 and 7, in the laser processing system 100 of the embodiment, the processing object TA moves in a specific direction, and the height measurement unit 30 starts measuring the height of each area of the processing object TA.

That is, before the height measurement of each area of the processing object TA is completed, the laser irradiation unit 20 starts to irradiate the laser beam L from the time when the processing object TA passes below the laser irradiation unit 20. At this time, although the height measurement of each area of the object TA by the height measuring unit 30 is completed, the height of the area of the object TA passing through the lower portion of the laser irradiation unit 20 is measured. The end state.

Therefore, in the laser processing system 100 of the embodiment, while the laser irradiation section 20 changes the height to irradiate the laser beam L to the processing target TA, the height measuring section 30 can measure the height of the processing target TA considering the change in height. height.

As described above, the entire laser processing time can be reduced by performing the height measurement step and the laser processing step together. The laser processing system according to the embodiment of 100, the laser processing time T2 is less than the whole of the object to be TA overall height measurement of _a time t t ₂ and L to the irradiation time of the laser beam and integrally.

On the other hand, when the head 40 supporting the height measurement unit 30 and the laser irradiation unit 20 changes positions in the optical axis direction, a load is applied to the elevating driving unit 50. For example, referring to FIGS. 5 a and 5 b, when the processing object TA first reaches the lower portion of the laser irradiation portion 20, the laser irradiation portion 20 can reach the area where one end of the processing object TA is irradiated with the laser beam L. The height of the laser irradiation unit 20 is adjusted in a manner of the target height ΔH1 of a specific depth. At this time, the required amount of change in height ΔH1 of the laser irradiation section 20 is larger than the unit movement amount that the head 40 supporting the laser irradiation section 20 can move within a reference time. Therefore, a load is applied to the elevating drive unit 50 that raises the head 40.

Taking this into consideration, the control unit 60 of the embodiment can control the lift driving unit 50 in such a manner that after the end of the processing object TA passes through the height measuring unit 30 and before reaching the laser irradiation unit 20, the lightning adjustment is started. The height of the irradiation section 20.

That is, the control unit 60 does not adjust the height of the laser irradiation unit 20 at a short moment when the one end region of the processing object TA reaches the laser irradiation unit 20, but reaches the laser irradiation at one end region of the processing object TA. The height adjustment is started in front of the part 20, so that the height of the laser irradiation part 20 can be adjusted in a relatively long time. Therefore, the control part 60 can control the elevation drive part 50 so that the height of the laser irradiation part 20 may be changed multiple times until the height of the laser irradiation part 20 reaches a target height. The control unit 60 can control the elevation driving unit 50 so that the height of the laser irradiation unit 20 is changed multiple times and the unit height is changed every time. The unit height of the laser irradiation unit 20 may be 0.1 μm to 1.0 μm.

The control unit 60 can control the driving of the lift driving unit 50 so that the height of the head 40 supporting the laser irradiation unit 20 is gradually or stepwise changed.

FIG. 8 is a graph showing an example of changing the height of the laser irradiation unit 20 at a specific time point, and FIG. 9 is a graph showing an example of changing the height of the laser irradiation unit 20 before a specific time point.

Referring to FIG. 8, when a change in the height of the laser irradiation unit 20 to ΔH1 is required until a specific time point T ₀ , the laser irradiation unit 20 may be raised by ΔH1 at a time. However, in the case where the height change ΔH1 of the laser irradiation section 20 becomes large, for example, when the height of the laser irradiation section 20 is 10 times or more or 100 times larger than the unit movement amount, the lift The driving unit 50 generates a load. Here, the unit movement amount of the laser irradiation section 20 may be the same as the unit movement amount of the head 40.

In contrast, referring to FIG. 9, in order from a particular point in time before the time point ₀ T control unit _60-0 until the laser irradiation portion 20 will increase many times a particular point in time T, for example, 5 times is controlled drive of the elevation drive unit 50 In such a case, it is possible to prevent or reduce a situation in which a load is generated on the lift driving unit 50.

In the above embodiment, the number of height changes of the laser irradiation section 20 is exemplified as five times, but it is not limited to this, and various modifications are possible. However, the number of height changes of the laser irradiation section 20 may be smaller than a value obtained by dividing the distance between the height measurement section 30 and the laser irradiation section 20 by the measurement interval of the height measurement section 30.

There is a specific interval between the height measurement unit 30 and the laser irradiation unit 20, so there is a time difference from the area of the processing object TA after passing through the height measurement unit 30 to reaching the laser irradiation unit 20. The control unit 60 can raise or lower the head 40 in a stepwise manner using such a time difference.

The measurement data measured by the height measurement unit 30 can be stored in a memory variable at a specific measurement interval and monitored in real time. The position value in the machining direction is divided by the measurement interval and counted. The counted value can be used as the address value of a memory variable that stores measurement data for each area.

The height measurement unit 30 that performs measurement at specific measurement intervals along the processing direction can store initial measurement data values generated when entering the area of the processing object TA that actually performs processing, and a memory variable storing such initial measurement data values. address. When the initial measurement data value is n, the memory variable address where the initial measurement data is stored is m, the initial measurement data value n is a positive value, and the number of steps is set to five steps, respectively, in the memory variable address m-1, m-2, m-3, m-4 store n-{(n / 5) * 1}, n-{(n / 5) * 2}, n-{(n / 5) * 3 The values of}, n-{(n / 5) * 4} are used as the height data values.

If the initial data value n is a negative value, n-{(n / 5) * 1}, n-{(n / can be stored in memory variable address m-1, m-2, m-3, m-4) 5) * 2}, n-{(n / 5) * 3}, n-{(n / 5) * 4}.

The control unit 60 may use a moving average filter to remove noise from the measured data values measured by the height measuring unit 30.

As an example, the height information of the processing object TA can be calculated based on a weighted moving average of the measurement data measured by the height measurement unit 30. For example, the height of the processing object TA can be calculated based on a weighted moving average that gives a weighted value to the past data value measured by the height measuring unit 30 in the past, compared to the current data value measured by the height measuring unit 30 in the past. Information. When the current measured current data value is n _t and the three recently measured past data values are n _t-1 , n _t-2 , n _t-3 , the moving average filter can calculate (n _t-3 * 10 + n _t-2 * 10 + n _t-1 * 10 + n _t ) / 31. When the moving average filter uses the last 4 data values including the current data value, the moving average filter can be applied from the time when the fourth data value is input without applying the first 3 data values.

The control unit 60 can effectively remove noise from the measurement data measured by the height measurement unit 30 by using such a moving average filter.

On the other hand, in the embodiment described above, the example in which the work table 10 moves horizontally and the head 40 moves vertically in the laser processing system 100 has been described as an example, but it is not limited to this. For example, of course, the workbench 10 can also be moved vertically, and the head 40 can be moved horizontally.

The embodiments of the present invention have been described above, but the above embodiments are merely examples. Those having ordinary knowledge in the art should understand that various modifications and other equivalent embodiments can be implemented according to the above embodiments.

10‧‧‧Workbench

20‧‧‧Laser irradiation section

30‧‧‧ Altitude Measurement Department

40‧‧‧Head

50‧‧‧Elevation drive unit

60‧‧‧Control Department

100‧‧‧laser processing system

G‧‧‧ interval

g1, g2, g21, g3‧‧‧ measurement data

H1, H2, H3‧‧‧‧ height

h1, h2, h3‧‧‧ altitude information

L‧‧‧laser beam

T ₀ ‧‧‧ at a specific point in time

T1, T2 ‧‧‧ Overall laser processing time

t ₁ , t ₂ ‧‧‧ overall time

TA ₀ , TA‧‧‧‧Processing object

TA1‧‧‧Area 1

TA2‧‧‧Zone 2

TA3‧‧‧Zone 3

ΔH1‧‧‧height change

ΔH2‧‧‧height change

FIG. 1 is a diagram conceptually showing an example of a laser processing system according to the embodiment. FIG. 2 is a diagram for explaining an example of an object to be processed. 3a and 3b are diagrams for explaining a laser processing method of a comparative example. FIG. 4 is a diagram conceptually showing the operation of the laser processing system of the embodiment. 5a to 5c are diagrams sequentially showing operations of the laser processing system of FIG. 4. FIG. 6 is a graph showing an example of laser processing time of the laser processing system of the comparative example of FIGS. 3 a and 3 b. FIG. 7 is a graph showing an example of laser processing time of the laser processing system of the embodiment in FIG. 4. FIG. 8 is a graph showing an example of changing the height of the laser irradiation section at a specific time point. FIG. 9 is a graph showing an example in which the height of the laser irradiation section is changed before a specific point in time.

Claims (14)

A laser processing method for simultaneously performing height measurement and laser processing on a processing object by using a laser irradiation portion and a height measurement portion arranged along a processing direction, comprising: measuring the processing object by the height measurement portion. A step of the height of the first region; moving the object to be processed relative to the laser irradiation unit and the height measurement unit to position the laser irradiation unit to the object to be processed A step of positioning the height measurement unit on a second area different from the first area of the object to be processed on the first area; when the laser irradiation portion reaches the first area A step of adjusting the heights of the laser irradiation section and the height measurement section based on the height of the first region measured by the height measurement section; and The step of measuring the height of the second region while the laser beam is irradiated in one region, and the step of measuring the height of the second region, the step of measuring the height of the second region, Zone 2 The measurement data reflects the height change of the height measurement unit to calculate the height information of the second area. The laser processing method according to claim 1, wherein when the height of the height measuring section increases or decreases, the measurement data of the second area measured by the height measuring section is measured. The height change of the height measurement unit is subtracted or added to calculate the height information of the second area. The laser processing method according to item 1 of the scope of patent application, wherein the first region is an end region of the object to be processed, and after the first region passes the height measuring unit and reaches the Before the laser irradiation section, the height of the laser irradiation section is adjusted. The laser processing method according to item 3 of the scope of patent application, wherein the laser irradiating section is changed a plurality of times so that a target height at which the laser beam is irradiated to a specific part of the first region is irradiated. The height of the laser irradiation part is up to the height of the laser irradiation part reaching the target height. The laser processing method according to item 4 of the scope of patent application, wherein the height of the laser irradiation section is changed multiple times and a specific unit height is changed each time. The laser processing method according to item 4 of the scope of the patent application, wherein the height measuring section measures the height of the object to be processed at a measurement interval of a specific distance, and the number of height changes of the laser irradiation section is less than A value obtained by dividing a distance between the height measurement section and the laser irradiation section by the measurement interval of the height measurement section. The laser processing method according to claim 1, wherein the height information of the object to be processed is calculated using a moving average of the measurement data measured by the height measurement unit. A laser processing system includes: a work table on which a processing object is mounted; a height measuring unit that measures the height of each region of the processing object; a laser irradiation unit that irradiates a laser beam to the processing object; a head Supporting the laser irradiating portion and the height measuring portion in a manner that the laser irradiating portion and the height measuring portion are arranged along the processing direction; a lifting driving portion for adjusting the height of the head; and control And at least one of the worktable and the head can move in a direction crossing the optical axis direction of the laser beam, and the height measuring unit The height of the head is changed to change the height, and the control unit calculates the height information of the object to be processed by reflecting the height change of the height measurement unit in the measurement data measured by the height measurement unit, based on The height information controls the lift driving unit. The laser processing system according to item 8 of the scope of patent application, wherein when the height of the height measuring unit is increased or decreased, the control unit subtracts or calculates the measurement data measured by the height measuring unit. The height change of the height measurement unit is added to calculate height information of the object to be processed. The laser processing system according to item 8 of the scope of patent application, wherein the processing object moves in a direction crossing the optical axis direction of the laser beam with respect to the laser irradiation section, and the control section The lift driving unit is controlled in such a manner that, after an end region of the object to be processed passes through the height measuring unit and before reaching the laser irradiation unit, adjustment of the height of the laser irradiation unit is started. The laser processing system according to item 10 of the patent application scope, wherein the control unit controls the lifting driving unit in such a manner that the laser irradiation unit can reach a specific portion of the processing object to irradiate the laser The method of radiating the target height of the light beam changes the height of the laser irradiation section multiple times until the height of the laser irradiation section reaches the target height. The laser processing system according to item 11 of the scope of patent application, wherein the control unit controls the elevating driving unit such that the height of the laser irradiation unit is changed a plurality of times and a specific unit height is changed each time. The laser processing system according to item 12 of the scope of the patent application, wherein the height measuring unit measures the height of the object to be measured at a measurement interval of a specific distance, and the number of height changes of the laser irradiation unit is less than A value obtained by dividing a distance between the height measurement section and the laser irradiation section by the measurement interval of the height measurement section. The laser processing system according to item 8 of the scope of patent application, wherein the control unit calculates the height information of the processing object using a moving average of the measurement data measured by the height measurement unit.