TWI678261B - 基板硏磨期間之硏磨速率的限制性調整 - Google Patents

基板硏磨期間之硏磨速率的限制性調整 Download PDF

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Publication number
TWI678261B
TWI678261B TW103139799A TW103139799A TWI678261B TW I678261 B TWI678261 B TW I678261B TW 103139799 A TW103139799 A TW 103139799A TW 103139799 A TW103139799 A TW 103139799A TW I678261 B TWI678261 B TW I678261B
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TW
Taiwan
Prior art keywords
adjustment
grinding
rate
time
polishing
Prior art date
Application number
TW103139799A
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English (en)
Chinese (zh)
Other versions
TW201524682A (zh
Inventor
班維紐多明尼克Ｊ
Dominic J. Benvegnu
傑瑞安班傑明
Benjamin Cherian
迪漢達潘尼席維庫瑪
Sivakumar Dhandapani
李哈利Ｑ
Harry Q. Lee
Original Assignee
美商應用材料股份有限公司
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 美商應用材料股份有限公司, Applied Materials, Inc. filed Critical 美商應用材料股份有限公司
Publication of TW201524682A publication Critical patent/TW201524682A/zh
Application granted granted Critical
Publication of TWI678261B publication Critical patent/TWI678261B/zh

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Classifications

    • H10P52/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H10P52/402—
    • H10P74/203—
    • H10P74/238—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
TW103139799A 2013-11-27 2014-11-17 基板硏磨期間之硏磨速率的限制性調整 TWI678261B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/092,429 2013-11-27
US14/092,429 US9490186B2 (en) 2013-11-27 2013-11-27 Limiting adjustment of polishing rates during substrate polishing

Publications (2)

Publication Number Publication Date
TW201524682A TW201524682A (zh) 2015-07-01
TWI678261B true TWI678261B (zh) 2019-12-01

Family

ID=53182996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103139799A TWI678261B (zh) 2013-11-27 2014-11-17 基板硏磨期間之硏磨速率的限制性調整

Country Status (6)

Country Link
US (2) US9490186B2 (enExample)
JP (2) JP6580042B2 (enExample)
KR (1) KR102290965B1 (enExample)
CN (1) CN105745743B (enExample)
TW (1) TWI678261B (enExample)
WO (1) WO2015080864A1 (enExample)

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CN109844923B (zh) * 2016-10-10 2023-07-11 应用材料公司 用于化学机械抛光的实时轮廓控制
KR102525737B1 (ko) * 2016-11-16 2023-04-26 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
TWI789385B (zh) 2017-04-21 2023-01-11 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
JP7023062B2 (ja) * 2017-07-24 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP7023063B2 (ja) * 2017-08-08 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP6860451B2 (ja) * 2017-09-05 2021-04-14 株式会社荏原製作所 機能性チップを備える基板を研磨する方法
KR102491575B1 (ko) * 2017-09-28 2023-01-25 삼성전자주식회사 반도체 기판을 검사하는 방법 및 이를 이용하여 반도체 소자를 제조 하는 방법
CN111132802B (zh) * 2017-11-16 2025-10-10 应用材料公司 用于抛光垫磨损率监测的预测滤波器
CN110071041B (zh) * 2018-01-22 2021-04-27 长鑫存储技术有限公司 浅沟槽隔离结构的制备方法、化学机械研磨方法及系统
US11446783B2 (en) 2018-03-12 2022-09-20 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
CN108527144B (zh) * 2018-03-28 2019-11-15 昆山国显光电有限公司 基板研磨装置及其研磨方法
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
KR102631891B1 (ko) 2018-09-26 2024-02-01 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링에 대한 가장자리 재구성에서의 기판 도핑에 대한 보상
JP2020053550A (ja) * 2018-09-27 2020-04-02 株式会社荏原製作所 研磨装置、研磨方法、及び機械学習装置
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
CN111863613A (zh) * 2019-04-08 2020-10-30 清华大学 一种化学机械抛光方法、装置、系统及控制设备
JP7460411B2 (ja) * 2020-03-24 2024-04-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
TWI809389B (zh) * 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
JP7637482B2 (ja) * 2020-08-11 2025-02-28 株式会社荏原製作所 基板処理装置及び研磨部材のドレッシング制御方法
JP7504713B2 (ja) 2020-08-19 2024-06-24 キオクシア株式会社 半導体製造装置及び半導体製造方法
CN111993265B (zh) * 2020-08-28 2021-11-26 上海华力微电子有限公司 判断研磨头的胶膜是否扭曲的方法
JP7684058B2 (ja) * 2021-03-01 2025-05-27 株式会社荏原製作所 研磨装置および研磨方法
JP7592364B2 (ja) * 2021-03-01 2024-12-02 株式会社ディスコ 研削装置
US11969854B2 (en) 2021-03-05 2024-04-30 Applied Materials, Inc. Control of processing parameters during substrate polishing using expected future parameter changes
WO2022187105A1 (en) * 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
US11969140B2 (en) * 2021-06-22 2024-04-30 Micron Technology, Inc. Surface cleaning
JP2024526637A (ja) * 2021-07-06 2024-07-19 アプライド マテリアルズ インコーポレイテッド 光学センサを用いた化学機械研磨振動測定

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Also Published As

Publication number Publication date
JP6580042B2 (ja) 2019-09-25
US20160372388A1 (en) 2016-12-22
US9490186B2 (en) 2016-11-08
JP2016538728A (ja) 2016-12-08
WO2015080864A1 (en) 2015-06-04
TW201524682A (zh) 2015-07-01
JP2020010048A (ja) 2020-01-16
CN105745743A (zh) 2016-07-06
US20150147829A1 (en) 2015-05-28
KR102290965B1 (ko) 2021-08-17
KR20160089517A (ko) 2016-07-27
CN105745743B (zh) 2019-10-11
US9607910B2 (en) 2017-03-28

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