TWI677901B - Substrate processing device - Google Patents

Abstract

The present invention provides a position detection device for a cylindrical member, which includes a second cylindrical member 22, which is arranged in a ring shape along the rotation direction of the second cylindrical member 22, and rotates together with the second cylindrical member 22 about a second central axis AX2 for A plurality of scales GP measuring the position change in the circumferential direction of the second cylinder member 22, an encoder read head EN4 that reads the scale GP, and an encoder arranged at a position different from the encoder read head EN4 to read the scale GP Read head EN5. The position detection device of the cylindrical member corrects the error of the scale GP according to the difference between the read value of the encoder read head EN4 and the read value of the encoder read head EN5.

Description

   Substrate processing device   

The present invention relates to a position detecting device for a cylindrical member, a substrate processing device, a method for manufacturing a component, and a conveying device for a sheet substrate.

Among the exposure apparatuses used in the lithography process, there is an exposure apparatus that exposes a substrate using a cylindrical or cylindrical mask as disclosed in the following patent documents (for example, Patent Document 1).

Not only when a plate-shaped mask is used, but also when a cylindrical or cylindrical mask is used to expose a substrate, in order to expose the image of the mask pattern on the substrate in a good projection, Patent Document 1 describes in A predetermined area of the pattern forming surface of the cylindrical mask, and a position information acquisition mark (ruler, alignment mark, etc.) is formed in a predetermined positional relationship with the pattern, and the scale is detected by an encoder system to obtain the pattern on the pattern forming surface Composition of position information in the circumferential direction (or rotation axis direction).

In addition, there is also proposed a method for continuously exposing a flexible long sheet substrate to a flexible long sheet substrate by using a cylindrical photomask, and winding the long sheet substrate on a feed roller to support the cylindrical photomask. An exposure device capable of manufacturing a high-volume element (exposure processing) by rotating the feed roller and the cylindrical mask on the sheet substrate of the feed roller (for example, refer to Patent Document 2).

Advance technical literature

[Patent Document 1] Japanese Unexamined Patent Publication No. 7-153672

[Patent Document 2] Japanese Unexamined Patent Publication No. 8-213305

The above-mentioned processing device for processing an object (sheet substrate) positioned on a curved surface of a cylindrical member such as a feed roller is required to be able to detect the position in the circumferential direction of the cylindrical member with good accuracy. As disclosed in Patent Document 1, even when a position information acquisition mark (ruler) is engraved on the outer peripheral surface of the cylindrical mask, the encoding may be caused by manufacturing errors of the scale of the ruler or expansion and contraction caused by temperature. The result of the device measurement results in an error, which reduces the position detection accuracy of the cylindrical member in the circumferential direction.

An object of the present invention is to correct an error caused by a position detection scale when detecting a position of a cylindrical member in a circumferential direction.

According to a first aspect of the present invention, a position detection device for a cylindrical member is provided, which includes: a cylindrical member having a curved surface bent from a predetermined axis with a certain radius and rotating around the predetermined axis; and a plurality of scales along the circle The direction of rotation of the cylindrical member is arranged in a ring shape, and rotates around the axis together with the cylindrical member to measure the position change at least in the circumferential direction of the curved surface; the first reading section is arranged opposite to the scale, For reading the scale; the second reading section is opposed to the scale and is arranged at a position different from the first reading section in the circumferential direction of the cylindrical member for reading the scale; and The correcting unit corrects the interval between the plural scales obtained from the reading value of the first reading unit and the reading from the first reading unit and the reading value of the second reading unit. 2 At least one of the intervals of the plural scales obtained by the reading value of the reading unit.

According to a second aspect of the present invention, there is provided a substrate processing apparatus including the position detection device of the above-mentioned cylindrical member; the cylindrical member is attached to a part of the curved-surface wound substrate and rotated around the axis to carry the substrate; and There is a processing unit that applies predetermined processing to the substrate in a part of the substrate wound around the curved surface at a specific position in a circumferential direction of the curved surface.

According to a third aspect of the present invention, there is provided a device manufacturing method in which the pattern is formed on the substrate using the substrate processing apparatus described above.

According to the aspect of the present invention, when the position of the cylindrical member in the circumferential direction is detected, the error generated by the position detection scale can be corrected.

9‧‧‧ transport device

11‧‧‧ substrate processing equipment

12‧‧‧Photomask holding device

13‧‧‧light source device

14‧‧‧Control device

21‧‧‧The first cylinder member

22‧‧‧ 2nd cylinder member

23‧‧‧Guide roller

24‧‧‧Drive roller

25‧‧‧The first detector

26‧‧‧1st drive unit

31‧‧‧ the first guide member

33‧‧‧ 2nd guide member

35‧‧‧Second detector

36‧‧‧ 2nd drive unit

41‧‧‧The first optical system

42‧‧‧The second optical system

43‧‧‧ 1st field diaphragm

44‧‧‧ Focus Correction Optics

45‧‧‧Image shift correction optics

46‧‧‧rotation correction mechanism

47‧‧‧Optical member for magnification correction

50‧‧‧The first deflection member

51‧‧‧1st lens group

52‧‧‧1st concave mirror

57‧‧‧The second deflection member

58‧‧‧ 2nd lens group

59‧‧‧ 2nd concave mirror

60‧‧‧ adjustment component

61‧‧‧Screw

62‧‧‧Head

AM1, AM2 ‧‧‧ Observation of bearing line

AMG1, AMG2‧‧‧ aiming microscope

AX1‧‧‧rotation centerline (first center axis)

AX2‧‧‧ rotation centerline (second center axis)

Cs‧‧‧roundness adjustment mechanism

Dc‧‧‧slot

DM‧‧‧Cylinder Mask

EN, EN1, EN2, EN3, EN4, EN5, EH1, EH2, EH3, EH4, EH5‧‧‧ encoder read head

EX, EX1, EX2, EX3, EX4‧‧‧ exposure devices

GP, GPd, GPM, GPm‧‧‧ Ruler (scale)

IA‧‧‧ Sheets enter the area

IL‧‧‧lighting module

IR1 ~ IR6‧‧‧Lighting area

Le1, Le2, Le3, Le4, Le5‧‧‧ Set bearing line

NS‧‧‧Measurement Ruler

OA‧‧‧ Sheet departure area

P‧‧‧ substrate

P3‧‧‧center plane

PA1 ~ PA6‧‧‧‧ projection area

PL‧‧‧ Projection Optics

SB‧‧‧bearing components

Sc‧‧‧ trough

SD‧‧‧ encoder scale disc

SP1, SP2 ‧‧‧ Polarized Beamsplitters

ST‧‧‧Rotary shaft

TBc‧‧‧ Correction chart

FIG. 1 is a schematic diagram showing the overall configuration of a substrate processing apparatus (exposure apparatus) according to the embodiment.

FIG. 2 is a schematic diagram showing the arrangement of the illumination area and the projection area in FIG. 1.

FIG. 3 is a schematic diagram showing a configuration of a projection optical system applied to the substrate processing apparatus (exposure apparatus) of FIG. 1.

FIG. 4 is a perspective view showing a second tube member (rotating tube) applied to the substrate processing apparatus (exposure device) of FIG. 1.

FIG. 5 is a perspective view for explaining the relationship between a detector and a reading device applied to the substrate processing apparatus (exposure apparatus) of FIG. 1. FIG.

FIG. 6 is an explanatory diagram of the positions of the encoder scale disc and the reading device of the embodiment as viewed in a plane orthogonal to the rotation center line.

FIG. 7 is an enlarged view showing the scale of the scale in a schematic manner.

FIG. 8 is a schematic diagram showing the positional relationship between the scale and the read head of the encoder.

FIG. 9 is a flowchart showing a procedure for correcting the scale pitch error of the scale.

FIG. 10 is a diagram showing the relationship between a scale disc with a scale on the outer peripheral surface and an encoder read head.

FIG. 11 is a diagram showing an example of a correction map.

FIG. 12 is a conceptual diagram showing the timing when these read values are obtained from a pair of encoder read heads.

FIG. 13 is a conceptual diagram showing the timing when these read values are obtained from a pair of encoder read heads.

FIG. 14 is a flowchart showing a procedure for correcting a scale error.

FIG. 15 is an explanatory diagram for explaining a true roundness adjusting mechanism for adjusting the true roundness of the encoder scale disc.

FIG. 16 is an explanatory diagram for explaining a true roundness adjusting mechanism for adjusting the true roundness of the encoder scale disc.

FIG. 17 is a schematic diagram showing a first modification of the substrate processing apparatus (exposure apparatus).

FIG. 18 is an explanatory diagram for explaining the position of the reading device when the encoder scale disc of the first modification of the substrate processing apparatus (exposure apparatus) is viewed from the direction of the rotation center line.

FIG. 19 is a schematic diagram showing the overall configuration of a second modification of the substrate processing apparatus (exposure apparatus).

FIG. 20 is a schematic diagram showing the overall configuration of a third modification of the substrate processing apparatus (exposure apparatus).

FIG. 21 is a schematic diagram showing the overall configuration of a first modification of the substrate processing apparatus (exposure apparatus).

FIG. 22 is a signal waveform diagram for briefly explaining the actual reading operation using the scale of the encoder read head shown in each of the previous FIGS. 4 to 6, FIG. 10, and FIGS. 16 to 21. FIG.

FIG. 23 is a view of the configuration when a scale is formed on the side end surface of the scale disc, as seen from the direction of extension of the rotation center line in the same manner as in FIG. 6.

Fig. 24 is a cross-sectional view taken along the line A-A 'of the structure of Fig. 23 taken from a plane including an azimuth line and a rotation center line.

FIG. 25 is a diagram of the arrangement of the scale disc and the encoder read head as seen from the XZ plane, as in the previous FIG. 6.

FIG. 26 is a flowchart showing a procedure of a device manufacturing method for manufacturing a device using the substrate processing apparatus (exposure device) of the embodiment.

The embodiment (embodiment) for implementing the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below. In the following embodiments, a so-called roll-to-roll exposure method in which substrates are continuously carried out will be described with various processes for manufacturing one type of element. In the following, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to the XYZ orthogonal coordinate system. For example, let the predetermined direction in the horizontal plane be the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane be the Y-axis direction, and the directions orthogonal to each of the X-axis direction and the Y-axis direction (that is, vertical Direction) is the Z-axis direction.

FIG. 1 is a schematic diagram showing the overall configuration of a substrate processing apparatus (exposure apparatus) according to the embodiment. FIG. 2 is a schematic diagram showing the arrangement of the illumination area and the projection area of FIG. 1. FIG. 3 is a schematic diagram showing a configuration of a projection optical system applied to the substrate processing apparatus (exposure apparatus) of FIG. 1. As shown in FIG. 1, the substrate processing apparatus 11 includes an exposure apparatus (processing section) EX, and a transport apparatus (hereinafter, appropriately referred to as a transport apparatus) 9 for a sheet substrate. The exposure device EX supplies the substrate P (sheet, film, etc.) by the transfer device 9. For example, there is a flexible long sheet-like substrate P drawn from a supply roll (not shown), which is sequentially processed by a substrate processing device (exposure device) 11 after a substrate processing device used in a previous process. Processing is carried out by the conveying device 9 to a substrate processing device for post-processing, and then it is wound into a component manufacturing system for recycling rolls. As described above, the substrate processing apparatus 11 can be used as a part of a component manufacturing system (a manufacturing line of a flexible display).

The exposure device EX as the substrate processing device 11 is a so-called scanning exposure device that simultaneously drives the rotation of the cylindrical mask DM and the conveyance of the flexible substrate P while transmitting the image of the pattern formed on the cylindrical mask DM. A projection optical system PL (PL1 to PL6) with a projection magnification of equal magnification (× 1) is projected onto the substrate P. The exposure device EX shown in FIG. 1 sets the Y axis of the XYZ orthogonal coordinate system to be parallel to the rotation center line AX1 of the first drum member 21 constituting the cylindrical mask DM. Similarly, the rotation center line AX2 of the second cylindrical member 22, which is a cylindrical member supporting a part of the substrate P in the longitudinal direction, is set to be parallel to the Y axis of the XYZ orthogonal coordinate system.

As shown in FIG. 1, the exposure device EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The exposure device EX rotates (rotates) the cylindrical mask DM held by the mask holding device 12 and transfers the substrate P by the transfer device 9. The illuminating mechanism IU is held in a part of the cylindrical mask DM (illumination area IR) of the mask holding device 12 and is illuminated by the illumination beam EL1 with uniform brightness. The projection optical system PL projects an image of the pattern of the cylindrical mask DM in the illumination area IR onto a part of the substrate P (projection area PA) that is transported by the transport device 9. As the cylindrical mask DM moves, the position on the cylindrical mask DM disposed in the illumination area IR changes. In addition, as the substrate P moves, the location on the substrate P disposed in the projection area PA changes. In this way, an image of a predetermined pattern (mask pattern) formed on the surface of the cylindrical mask DM is projected onto the cylindrical surface of the substrate P through the projection optical system PL (PL1 to PL6). The control device 14 controls each part of the exposure device EX so that each part executes processing. In the present embodiment, the control device 14 controls the conveying device 9.

The control device 14 may be a part or all of the upper-level control devices that collectively control the plurality of substrate processing devices of the component manufacturing system. The control device 14 may be another device controlled by a higher-level control device and different from the higher-level control device. The control device 14 includes, for example, a computer system. The computer system includes, for example, a CPU (Central Processing Unit), various memories, and an OS (Operating System) and peripheral hardware. The operation programs and parameters of the various parts of the substrate processing apparatus 11 are stored in a computer-readable recording medium in the form of a computer program, and the computer system reads out and executes this program to perform various processes.

When the computer system can be connected to the Internet or an intranet system, the homepage environment (or display environment) is also included. In addition, computer-readable recording media include floppy disks, magneto-optical disks, ROMs, CD-ROMs, and other transportable media, and storage devices such as hard disks built into computer systems. The computer-readable recording medium also includes the communication lines used to transmit programs through communication lines such as the Internet and telephone lines, which can dynamically maintain computer programs for a short period of time, servers in this case, and As a volatile memory inside the client's computer system, it can keep the program for a certain period of time. In addition, the computer program may be a person for realizing a part of the functions of the substrate processing apparatus 11, or a person for realizing the functions of the substrate processing apparatus 11 by a combination with a program recorded in a computer system. The high-level control device can be implemented by a computer system similarly to the control device 14.

As shown in FIG. 1, the mask holding device 12 includes a first cylinder member 21 that holds a cylindrical mask DM, a guide roller 23 that supports the first cylinder member 21, and a first driving unit according to a control command from the control device 14. A driving roller 24 that drives the first tube member 21 and a first detector 25 that detects the position of the first tube member 21.

The first cylindrical member 21 is a cylindrical member having a curved surface curved at a certain radius from a rotation center line AX1 (hereinafter, also appropriately referred to as a first center axis AX1) as a predetermined axis, and rotates around the rotation center line AX1. The first cylinder member 21 has a first surface P1 in which the illumination area IR of the cylindrical mask DM is arranged. The first surface P1 is formed by rotating a line component (general line) around a first central axis AX1 parallel to the line component. Cylindrical surface. The cylindrical surface is, for example, a cylindrical outer peripheral surface or a cylindrical outer peripheral surface. The first cylindrical member 21 is a cylindrical shape made of, for example, glass or quartz and has a certain thickness, and its outer peripheral surface (cylindrical surface) is the first surface P1. That is, in this embodiment, the illumination area IR of the cylindrical mask DM is curved into a cylindrical surface shape having a certain radius r1 from the rotation center line AX1. As described above, the first cylindrical member 21 has a curved surface (a cylindrical surface with a predetermined curvature) that is curved with a certain radius from the rotation center line AX1.

The cylindrical photomask DM is, for example, a transmissive planar sheet photomask that is patterned with a light-shielding layer such as chromium on one side of a short strip-shaped ultra-thin glass plate with a high flatness (for example, a thickness of 100 μm to 500 μm). . The photomask holding device 12 bends a cylindrical photomask DM formed of an extremely thin glass plate along a curved surface of the outer surface of the first tube member 21 and is used while being wound (adhered to) this curved surface. The cylindrical photomask DM has a non-patterned non-patterned region, and the non-patterned region is attached to the first cylinder member 21. The cylindrical photomask DM can be attached to or detached from the first cylindrical member 21.

Alternatively, instead of forming the cylindrical mask DM with an extremely thin glass plate and winding the cylindrical mask DM around a first cylindrical member 21 composed of a transparent cylindrical base material, the first cylindrical member 21 may be made of quartz. The transparent cylindrical base material is made by drawing a mask pattern made of a light-shielding layer such as chromium directly on the outer peripheral surface. At this time, the function of the first cylindrical member 21 is also a supporting member of the pattern of the cylindrical mask DM.

The first detector 25 is an object that optically detects the rotational position of the first cylinder member 21, and is configured by, for example, a rotary encoder. The encoder can be an absolute type or an incremental type. The first detector 25 outputs to the control device 14 the detected information indicating the rotation position of the first cylinder member 21, for example, a two-phase signal from an encoder read head described later. The first driving unit 26 including an actuator such as an electric motor adjusts the torque and rotation speed for rotating the driving roller 24 based on a control signal input from the control device 14. The control device 14 controls the first driving unit 26 based on the detection result of the first detector 25, and thereby controls the rotation position of the first cylinder member 21. The control device 14 controls one or both of the rotation position and the rotation speed of the cylindrical mask DM held by the first cylindrical member 21.

The conveying device 9 includes a driving roller DR4, a first guide member 31, a second tube member 22 forming a second surface P2 of the projection area PA of the placement substrate P, a second guide member 33, a driving roller DR4, and a driving roller DR5. A second detector 35 and a second driving unit 36.

In this embodiment, the substrate P transported from the upstream of the substrate P transport path, that is, from the side opposite to the direction in which the substrate P is transported (moved) toward the driving roller DR4 is transported to the first guide member via the driving roller DR4. 31. The substrate P passing through the first guide member 31 is supported on the surface of the cylindrical or cylindrical second cylindrical member 22 having a radius r2 and is carried to the second guide member 33. The substrate P passing through the second guide member 33 is transported downstream of the transport path. The rotation center line AX2 of the second tube member 22 and the rotation center lines of the driving roller DR4 and DR5 are set to be parallel to the Y axis.

For example, the first guide member 31 and the second guide member 33 can be directed to the substrate. P is moved in the conveying direction to adjust the tension and the like in the conveying direction of the substrate P in the conveying path. In addition, the first guide member 31 (and the driving roller DR4) and the second guide member 33 (and the driving roller DR5) can be formed, for example, in the width direction of the substrate P (a direction orthogonal to the substrate P transport direction). Direction, Y direction) to adjust the Y direction position of the substrate P wound around the outer periphery of the second tube member 22, and the like. In addition, the transfer device 9 only needs to be able to transfer the substrate P along the projection area PA of the projection optical system PL, and the configuration of the transfer device 9 can be appropriately changed.

The second cylindrical member 22 is a cylindrical member having a curved surface (a cylindrical surface of a predetermined curvature) bent at a constant radius from a rotation center line AX2 (hereinafter, also appropriately referred to as a second central axis AX2) as a predetermined axis. Rotating barrel that rotates around the second central axis AX2. The second cylindrical member 22 forms a second surface (supporting surface) P2. The second surface P2 is a part of the substrate P on which the imaging beam from the projection optical system PL projects, and supports a portion including the projection area PA in an arc shape (cylindrical shape). In this embodiment, the second tube member 22 also serves as a supporting member (substrate stage) that supports the substrate P to be exposed together with a part of the conveying device 9. That is, the second tube member 22 may be a part of the exposure device EX. As described above, the second cylindrical member 22 can rotate around its rotation center line AX2 (second central axis AX2), and the substrate P is bent into a cylindrical surface along the outer peripheral surface (cylindrical surface) of the second cylindrical member 22. A projection area PA is arranged on a part of the curved substrate P. Therefore, the peripheral surface portion of the substrate P including the projection area PA in the cylindrical surface of the radius r2 is rotationally moved.

In the present embodiment, the second cylinder member 22 is rotated by a torque supplied from a second drive portion 36 including an actuator such as an electric motor. The second detector 35 is configured by, for example, a rotary encoder, and optically detects the rotation position of the second cylinder member 22. The second detector 35 outputs information (for example, two-phase signals from the encoder read heads EN1, EN2, EN3, EN4, and EN5 to be described later) that displays the rotational position of the second cylinder member 22 to the control device 14. The second driving unit 36 adjusts a torque and a rotation speed of the second cylinder member 22 according to a control signal supplied from the control device 14. The control device 14 controls the second driving unit 36 based on the detection result of the second detector 35, and thereby controls the rotation position of the second cylinder member 22, so that the first cylinder member 21 (the cylindrical mask DM) and the second cylinder member 22 synchronous movement (synchronous rotation). The details of the second detector 35 will be described later.

The exposure device EX is intended to be an exposure device equipped with a so-called multi-lens projection optical system PL. The projection optical system PL includes a plurality of projection modules that project an image of a part of the pattern of the cylindrical mask DM. For example, in FIG. 1, the rotation center line AX1 including the cylindrical mask DM and the second center axis AX2 of the second tube member 22 are on the left side (the opposite side to the substrate P transport direction) from the center plane P3 parallel to the YZ plane. ) Three projection modules (projection optics) PL1, PL3, and PL5 are arranged at regular intervals in the Y direction, and three are arranged at regular intervals in the Y direction on the right side of the center plane P3 (the transport direction side of the substrate P). Projection modules (projection optics) PL2, PL4, PL6.

This type of multi-lens exposure device EX scans the ends of the areas (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6 in the Y direction by scanning them so as to overlap each other. The overall image of the pattern. In such an exposure device EX, even if the size of the pattern in the Y direction on the cylindrical mask DM becomes large, and the necessity of processing a substrate P having a large width in the Y direction is inevitably generated, it is only necessary to set a projection mode in the Y direction. The group PL and the IU side of the lighting mechanism corresponding to the projection module PL have the advantage that the size of the display panel (substrate P width) can be easily increased.

Of course, the exposure device EX may not be a multi-lens method. For example, in a case where the width direction dimension of the substrate P is small to some extent, the exposure device EX can project a full-width image of the pattern onto the substrate P with one projection module. In addition, a plurality of projection modules PL1 to PL6 can also respectively project a pattern corresponding to one element. That is, the exposure device EX can project a pattern for a plurality of elements in parallel by a plurality of projection modules.

The lighting mechanism IU includes a light source device 13 and a lighting optical system. The illumination optical system corresponds to each of the plurality of projection modules PL1 to PL6, and includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction. The light source device 13 includes, for example, a lamp light source such as a mercury lamp, a solid-state light source such as a laser diode, a light-emitting diode (LED), or a gas laser light source. Illumination light emitted by the light source device is, for example, far-ultraviolet light (DUV light) such as glow lines (g-line, h-line, i-line), KrF excimer laser light (wavelength 248 nm), and ArF excimer laser light ( Wavelength 193nm) and so on. The illumination light emitted from the light source device 13 is uniformized in its illumination distribution and transmitted through a light guide member such as an optical fiber to be divided into a plurality of illumination modules IL.

Each of the plurality of illumination modules IL includes a plurality of optical components such as a lens. In this embodiment, light emitted from the light source device 13 and passing through any one of the plurality of illumination modules IL is referred to as an illumination beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, etc., and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illuminance distribution. In this embodiment, a plurality of illumination modules IL are arranged inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination region IR of a mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

FIG. 2 is a diagram showing the arrangement of the illumination area IR and the projection area PA in this embodiment. In addition, FIG. 2 shows a plan view of the illumination area IR disposed on the cylindrical mask DM of the first cylinder member 21 as viewed from the −Z side (a diagram on the left in FIG. 2), and an arrangement viewed from the + Z side. A plan view of the projection area PA on the substrate P of the second cylinder member 22 (the right side view in FIG. 2). The symbol Xs in FIG. 2 indicates the rotation direction (moving direction) of the first cylindrical member 21 (cylindrical mask DM) or the second cylindrical member 22.

The plurality of illumination modules IL respectively illuminate the first to sixth illumination areas IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination region IR1, and the second illumination module IL illuminates the second illumination region IR2.

Although the first illumination area IR1 is described in detail as a trapezoidal area elongated in the Y direction, as in the case of a projection optical system (projection module) PL, a projection optical system forming an intermediate image plane may be used in the intermediate image. A field diaphragm with a trapezoidal opening is arranged at the position. Therefore, the first illumination region IR1 may be a rectangular region including the trapezoidal opening. The third illumination region IR3 and the fifth illumination region IR5 are regions having the same shape as the first illumination region IR1, respectively, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR2 is a trapezoidal (or rectangular) region having a symmetrical center plane P3 and the first illumination region IR1. The fourth illumination region IR4 and the sixth illumination region IR6 are regions having the same shape as the second illumination region IR2, respectively, and are arranged at regular intervals in the Y-axis direction.

As shown in FIG. 2, each of the first to sixth illumination areas IR1 to IR6 is arranged so that the triangular portions of the hypotenuse of the trapezoidal illumination area adjacent to each other in the Y-axis direction overlap when viewed in the circumferential direction of the first surface P1. (overlap). Therefore, for example, the first area A1 on the cylindrical mask DM passing through the first illumination area IR1 due to the rotation of the first cylinder member 21 and the circle passing through the second illumination area IR2 due to the rotation of the first cylinder member 21 A part of the second area A2 on the tube mask DM is partially repeated.

In this embodiment, the cylindrical mask DM includes a patterned area A3 in which a pattern is formed, and a patterned non-formation area A4 in which a pattern is not formed. The pattern non-formation area A4 is arranged so as to surround the pattern formation area A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern forming area A3 of the cylindrical mask DM moves in the moving direction Xs with the rotation of the first cylinder member 21, and the partial areas in the Y-axis direction of the pattern forming area A3 pass through the first to sixth illumination areas IR1 to IR6. One of them. That is, the first to sixth illumination regions IR1 to IR6 are arranged so as to cover the full width in the Y-axis direction of the pattern forming region A3.

As shown in FIG. 1, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction corresponds to each of the first to sixth lighting modules IL in a one-to-one correspondence, and will appear in the corresponding lighting module IL. An image of a partial pattern of the cylindrical mask DM in the illuminated illumination area IR is projected onto each projection area PA on the substrate P. For example, the first projection module PL1 corresponds to the first lighting module IL, and projects an image of the pattern of the cylindrical mask DM in the first lighting area IR1 (see FIG. 2) illuminated by the first lighting module IL, and projects. To the first projection area PA1 on the substrate P. The third projection module PL3 and the fifth projection module PL5 correspond to the third to fifth lighting modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are arranged at positions overlapping the first projection module PL1 when viewed from the Y-axis direction.

The second projection module PL2 corresponds to the second lighting module IL, and projects an image of the pattern of the cylindrical mask DM in the second lighting area IR2 (see FIG. 2) illuminated by the second lighting module IL. To the second projection area PA2 on the substrate P. The second projection module PL2 is arranged at a symmetrical position with respect to the first projection module PL1 with the center plane P3 when viewed from the Y-axis direction.

The fourth projection module PL4 and the sixth projection module PL6 are respectively arranged corresponding to the fourth and sixth lighting modules IL. The fourth projection module PL4 and the sixth projection module PL6 are arranged when viewed from the Y-axis direction. At a position overlapping the second projection module PL2. With this arrangement, the odd-numbered first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are shifted from the center plane P3 in the −X direction by a certain amount, and are arranged in a row in the Y-axis direction. The even-numbered second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are staggered from the center plane P3 in the + X direction, and are arranged in a row in the Y-axis direction.

In this embodiment, light from each lighting module IL of the lighting mechanism IU to each of the lighting regions IR1 to IR6 on the cylindrical mask DM is set as the lighting beam EL1. In addition, after the intensity distribution corresponding to the cylindrical mask DM pattern appearing in each of the illumination areas IR1 to IR6 is adjusted, the light entering the projection modules PL1 to PL6 and reaching the projection areas PA1 to PA6 is set as an image. Light beam EL2. Among the imaging beams EL2 reaching the projection areas PA1 to PA6, the principal rays passing through the center points of the projection areas PA1 to PA6, as shown in FIG. 1, when viewed from the second center axis AX2 of the second cylinder member 22, the clip is clamped. The central plane P3 is arranged at a position (specific position) at an angle θ in the circumferential direction.

Each of the first to sixth projection areas PA1 to PA6 is arranged so that the projection areas (odd number and even number) adjacent to each other in the direction parallel to the second central axis AX2 (the triangular part of the trapezoid) are in The second surface P2 overlaps in the circumferential direction. Therefore, for example, the third area A5 on the substrate P passing through the first projection area PA1 due to the rotation of the second cylindrical member 22 and the third area A5 on the substrate P passing through the second projection area PA2 due to the rotation of the second cylindrical member 22 A part of the fourth area A6 is partially repeated. The respective shapes of the first projection area PA1 and the second projection area PA2 are set so that the exposure amounts in areas where the third area A5 and the fourth area A6 overlap are substantially the same as those in the non-repeated areas.

Next, a detailed configuration of the projection optical system PL of this embodiment will be described with reference to FIG. 3. In this embodiment, each of the second projection module PL2 to the fifth projection module PL5 has the same configuration as the first projection module PL1. Therefore, the first projection module PL1 is used to represent the projection optical system PL, and its configuration is described. The description of each of the second projection module PL2 to the fifth projection module PL5 is omitted.

The first projection module PL1 shown in FIG. 3 includes a first optical system 41 for imaging an image of a pattern of a cylindrical mask DM arranged in the first illumination area IR1 on an intermediate image plane P7, and a first optical system 41 At least a part of the formed intermediate image is re-imaged on the second optical system 42 of the first projection area PA1 of the substrate P, and the first field diaphragm 43 disposed on the intermediate image plane P7 forming the intermediate image.

The first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device for finely adjusting a focus state of a pattern image (hereinafter, referred to as a projection image) of a mask formed on the substrate P. The image shift correction optical member 45 is an adjustment device for moving the projected image slightly within the image plane. The magnification correction optical member 47 is an adjustment device for finely correcting the magnification of the projection image. The rotation correction mechanism 46 is an adjustment device for rotating the projection image slightly within the image plane.

The imaging beam EL2 of the pattern from the cylindrical mask DM is emitted from the first illumination area IR1 in the normal direction (D1), and is incident on the image shift correction optical member 45 through the focus correction optical member 44. The imaging light beam EL2 passing through the image shift correction optical member 45 is reflected by the first reflecting surface (planar mirror) p4 of the first deflection member 50 that is an element of the first optical system 41, passes through the first lens group 51, and is disposed on the light The first concave mirror 52 at the pupil position reflects, passes through the first lens group 51 again, reflects on the second reflecting surface (planar mirror) p5 of the first deflection member 50, and enters the first field diaphragm 43. The imaging beam EL2 passing through the first field diaphragm 43 is reflected by the third reflecting surface (planar mirror) p8 of the second deflection member 57 as an element of the second optical system 42, and is disposed on the pupil after passing through the second lens group 58. The second concave mirror 59 at the position reflects, passes through the second lens group 58 on the fourth reflecting surface (planar mirror) p9 of the second deflection member 57 again, and enters the optical element 47 for magnification correction. The imaging beam EL2 emitted from the magnification correction optical member 47 is incident on the first projection area PA1 on the substrate P, and the image of the pattern appearing in the first illumination area IR1 is projected on the first projection at equal magnification (× 1). Area PA1.

When the radius of the cylindrical mask DM shown in FIG. 1 is r1, and the radius of the cylindrical surface of the substrate P wound around the second cylindrical member 22 is r2, and the radius r1 is equal to the radius r2, The main rays of the imaging beam EL2 of the projection modules PL1 to PL6 on the mask side are inclined to pass through the central axis AX1 of the cylindrical mask DM. Its inclination angle is the same as the inclination angle θ of the main ray of the imaging beam EL2 on the substrate P side (± θ relative to the central plane P3).

In order to impart the above-mentioned inclination angle θ, the angle θ1 of the first reflecting surface p4 of the first deflection member 50 with respect to the optical axis AX3 shown in FIG. 3 is set to be smaller than 45 ° Δθ1, and the second deflection relative to the optical axis AX4 The angle θ4 of the fourth reflecting surface p9 of the member 57 is set to be smaller than 45 ° by Δθ4. Δθ1 and Δθ4 relative to the angle θ shown in FIG. 1 are set in a relationship of Δθ1 = Δθ4 = θ / 2.

FIG. 4 is a perspective view of a second tube member 22 (rotating tube) applied to the substrate processing apparatus (exposure device) of FIG. 1. FIG. 5 is a perspective view for explaining the relationship between a detector and a reading device applied to the substrate processing apparatus (exposure apparatus) of FIG. 1. FIG. FIG. 6 is an explanatory diagram of positions of the encoder scale disc and the reading device of the embodiment as viewed in an XZ plane orthogonal to the rotation center line AX2. In FIG. 4, for convenience of explanation, only the second to fourth projection areas PA2 to PA4 are illustrated, and the illustrations of the first, fifth, and sixth projection areas PA1, PA5, and PA6 are omitted.

The second detector 35 shown in FIG. 1 optically detects the position (specifically, the rotation position) of the second cylinder member 22, and as shown in FIGS. 4 to 6, includes a high true circle as a scale member. Degree encoder scale disc (disk) SD and encoder read heads EN1, EN2, EN3, EN4, EN5 as the reading section.

The encoder scale disc SD is fixed to one end of the second cylindrical member 22 which is orthogonal to the rotation axis ST of the second cylindrical member 22. Therefore, the encoder scale disc SD rotates integrally with the rotation axis ST about the rotation center line AX2. The encoder scale disc SD may be fixed to both end portions of the second tube member 22. That is, the encoder scale disc SD may be fixed to at least one end portion of the second cylinder member 22.

On the outer surface of the encoder scale disc SD, a plurality of scales (engraved lines) for detecting the position or position change in the circumferential direction of the second cylinder member 22 (cylindrical member) are engraved. ) GP. Hereinafter, the scale GP is appropriately referred to as a scale GP. The part of the encoder scale disc SD provided with the scale GP is the scale part. The plurality of scales GP are arranged in a ring shape along a direction in which the second cylindrical member 22 rotates, for example, a grid line having a pitch of 20 μm, and rotates together with the second cylindrical member 22 about a rotation axis ST (second central axis AX2).

The encoder read heads EN1, EN2, EN3, EN4, and EN5, when viewed from the rotation axis ST (the second rotation center line AX2), are arranged around the scale GP to maintain a certain distance from the scale GP. Each encoder read head EN1 ~ EN5 is a non-contact sensor that projects the measuring beam on the scale GP and performs photoelectric detection on the light beam (diffracted light) reflected by the scale GP. In addition, each of the encoder read heads EN1 to EN5 is arranged in different directions (angular positions) in the circumferential direction of the scale disc SD when viewed from the rotation axis ST (second rotation center line AX2) of the second cylinder member 22. ).

Each encoder read head EN1 ~ EN5 is a reading device with measurement sensitivity (detection sensitivity) to the change of displacement in the tangential direction (in the XZ plane) of the scale GP. As shown in Fig. 4, when the orientation of the encoder read heads EN1 ~ EN5 (the angular direction in the XZ plane with the rotation center line AX2 as the center) is indicated by the orientation lines Le1, Le2, Le3, Le4, Le5, As shown in FIG. 6, the encoder read heads EN1 and EN2 are arranged in such a manner that the azimuth lines Le1 and Le2 are set at an angle ± θ ° with respect to the center plane P3. In this embodiment, the angle θ is set to, for example, 15 °, but it is not limited to this.

The projection modules PL1 to PL6 shown in FIG. 3 are processing units that use the substrate P as an object to be processed, and irradiate the substrate P with a light beam as a pattern image to perform exposure processing. Therefore, the exposure apparatus EX includes a first processing unit composed of the odd-numbered projection modules PL1, PL3, and PL5, and a second processing unit composed of the even-numbered projection modules PL2, PL4, and PL6. The main ray of the imaging light beam EL2 (for example, the main ray passing through the center point of the projection area PA) of each of the processing unit and the second processing unit enters the substrate P when viewed from the XZ plane. As described above, the position where the main ray enters the substrate P is a specific position where the substrate P is processed (here, the irradiation of the imaging beam).

The specific position, when viewed from the second central axis AX2 of the second cylindrical member 22, is set at a position of the substrate P supported on the outer peripheral surface of the second cylindrical member 22 at an angle ± θ from the central surface P3 in the circumferential direction. As shown in Figures 4 and 6, the azimuth line Le1 of the encoder read head EN1 is arranged so as to be the center point of each projection area (projection field of view) PA1, PA3, PA5 passing through the odd-numbered projection modules PL1, PL3, and PL5. The inclination angle θ of the principal ray of the light with respect to the center plane P3 is the same. Similarly, the azimuth line Le2 of the encoder read head EN2 is also configured to be opposite to the main light passing through the center point of each projection area (projection field of view) PA2, PA4, PA6 of the even-numbered projection modules PL2, PL4, and PL6. The inclination angle θ of the center plane P3 is the same. Therefore, the encoder read heads EN1 and EN2 read the scales on the scales GP connecting the specific positions and the direction of the second central axis AX2.

The encoder read head EN4 is arranged on the upstream side of the substrate P in the conveying direction than the encoder read head EN1, that is, before the exposure position (projection area). And the encoder read head EN4 is arranged on the set azimuth line Le4. The azimuth line Le4 is set at a position where the azimuth line Le1 of the encoder read head EN1 is positioned on the upstream side of the substrate P in the direction of rotation about the axis of the rotation center line AX2 to a rotation of 90 °. In addition, the encoder read head EN5 is arranged on the set azimuth line Le5. The azimuth line Le5 is set at a position where the azimuth line Le2 of the encoder read head EN2 is rotated 90 ° about the axis of the rotation center line AX2 on the upstream side of the substrate P in the conveying direction.

As shown in the previous example, the main rays of the imaging beam EL2 passing through the center of the odd-numbered projection areas PA1, PA3, and PA5 and the main rays of the imaging beam EL2 passing through the center of the even-numbered projection areas PA2, PA4, and PA6 are opposite to the center plane P3. When the inclination angle ± θ is set to 15 °, the expansion angle of the set azimuth line Le1 and the set azimuth line Le2 in the XZ plane is 30 °. Therefore, the deployment angles of the set azimuth line Le4 and the set azimuth line Le5 in the XZ plane are also approximately 30 °.

By arranging the encoder read heads EN4 and EN5 in the above-mentioned manner, the encoder read heads EN4 and EN5 with the reading scale GP are set in the directions of the azimuth lines Le4 and Le5, and when viewed from the XZ plane and the rotation center line AX2, That is, the directions where the main substrate of the opposing substrate P and the main beam of the imaging beam EL2 enter the substrate P are substantially orthogonal. Therefore, even when the second cylinder member 22 is shifted in the Z direction due to a slight gap (about 2 μm to 3 μm) of a bearing that supports the rotating shaft ST, the horizontal movement of the second cylinder member 22 in the projection may be possible. The position error along the direction of the imaging beam EL2 in the areas PA1 to PA6 is measured with high accuracy by the encoder read heads EN1 and EN2.

In addition, the encoder read head EN3 is arranged on the set azimuth line Le3. The setting azimuth line Le3 is set at the encoder reading head EN2. The setting azimuth line Le2 is rotated approximately 120 ° about the axis of the rotation center line AX2, and the setting head Le4 of the encoder read head EN4 is about the axis and setting direction of the rotation center line AX2. The position in which the rotation direction of the line Le2 is opposite is substantially 120 °. That is, when viewed in the XZ plane, the three setting azimuth lines Le2, Le3, and Le4 extending from the rotation center line AX2 are set at intervals of approximately 120 °.

The scale member encoder scale disc SD is made of, for example, a metal, glass or ceramic with a low thermal expansion coefficient as a base material. The encoder scale disc SD is made as large as possible (for example, a diameter of 20 cm or more) in order to improve the resolution of the measurement. In FIG. 4, although the diameter of the encoder scale disc SD is smaller than the diameter of the second cylindrical member 22 as shown in the figure, the diameter of the outer peripheral surface of the second cylindrical member 22 and the outer peripheral surface of the winding substrate P is reduced. It is consistent with the diameter of the encoder scale disc SD scale GP (to make it approximately the same), that is, the so-called measurement Abbe error can be further reduced.

The minimum pitch of the scale GP engraved in the encoder SD disk circumferential direction is limited by the performance of the scale engraving device for processing the encoder scale disk SD. Therefore, if the diameter of the encoder scale disc SD is increased, the angular measurement resolution capability corresponding to the minimum distance can be improved correspondingly. When the directions of the azimuth lines Le1 and Le2 of the encoder heads EN1 and EN2 configured to read the scale GP are observed from the rotation center line AX2, the main rays of the opposing substrate P and the imaging beam EL2 are incident. The direction of the substrate P is the same. For example, even when the second cylinder member 22 is shifted in the X direction due to a slight gap (about 2 μm to 3 μm) of the bearing supporting the rotating shaft ST, Therefore, the position error of the substrate P in the conveying direction (Xs), which may occur in the projection areas PA1 to PA6, is measured with high accuracy by the encoder read heads EN1 and EN2.

As shown in FIG. 5, an image of a part of the mask pattern projected by the projection optical system PL shown in FIG. 1 is opposed to the substrate P on a part of the substrate P supported on the curved surface of the second cylindrical member 22. The positioning (alignment) includes a plurality of alignment microscopes AMG1 and AMG2 that detect alignment marks and the like formed on the substrate P in advance. The alignment microscopes AMG1 and AMG2 are pattern detection devices arranged around the second barrel member 22. The alignment microscopes AMG1 and AMG2 are detectors for detecting discrete or continuously formed specific patterns on the substrate P. The detection area of this detector is arranged on the upstream side of the substrate P in the conveying direction from the specific position.

As shown in FIG. 5, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detectors arranged in a row in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 can observe or detect the alignment marks formed near the two ends in the width direction of the substrate P at any time by means of detectors at both ends in the Y-axis direction of the second barrel member 22. In addition, the alignment microscopes AMG1 and AMG2 can observe or detect, for example, the substrates P formed along the long direction by using detectors other than both ends in the Y-axis direction (the width direction of the substrate P) of the second cylinder member 22. A plurality of alignment marks formed in a margin portion or the like between the pattern forming regions of the display panel.

As shown in FIG. 5, a line perpendicular to the second central axis AX2 to the center of each observation area (detection center) on the substrate P by the alignment microscopes AMG1 and AMG2 is set as the observation azimuth lines AM1 and AM2. In this case, the respective observation azimuth lines AM1 of the four alignment microscopes AMG1 are arranged in parallel in the Y-axis direction. Similarly, the respective observation azimuth lines AM2 of the four alignment microscopes AMG2 are also arranged in parallel in the Y-axis direction.

As shown in FIG. 5 and FIG. 6, when viewed in the XZ plane, the azimuth line Le4 of the encoder read head EN4 is set at the same azimuth with each observation azimuth line AM1 of the four alignment microscopes AMG1. The azimuth line Le5 of the encoder read head EN5 is set to the same azimuth as the observation azimuth lines AM2 of the four alignment microscopes AMG2.

As described above, the detectors of the alignment microscopes AMG1 and AMG2 are arranged around the second cylindrical member 22 when viewed from the second central axis AX2. In addition, the detectors of the alignment microscopes AMG1 and AMG2 are connected to the positions of the encoder read heads EN4 and EN5 and the direction of the second central axis AX2 (the azimuth lines Le4 and Le5 are set) and the second central axis AX2 is aligned with the The directions of the detection centers of the quasi-microscopes AMG1 and AMG2 are arranged in a consistent manner. In addition, encoders EN4 and EN5 corresponding to the respective observation areas (detection centers) of the alignment microscopes AMG1 and AMG2 and encoders EN1 and EN2 corresponding to the projection areas PA1 to PA6 of the projection modules PL1 to PL6 are rotating. The position around the center line AX2, as shown in FIG. 6, is set in the sheet entry area IA where the substrate P starts to contact the second cylinder member 22, and the sheet exit area OA where the substrate P is separated from the second cylinder member 22. between.

The alignment microscopes AMG1 and AMG2 are arranged before the exposure position (projection area PA). The alignment microscopes AMG1 and AMG2 are, for example, images of alignment marks (areas formed within a diagonal of several tens μm to several hundreds μm) formed near the Y-direction end of the substrate P, and the substrate P is imaged at a predetermined speed. Those who carry out high-speed image detection (sampling) with a photographic element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) in the transported state. At the moment when the sampling is performed, the control device 14 latches the rotation angle position of the encoder scale disc SD, which is successively measured by the encoder read head EN4, and thereby obtains the position of the mark on the substrate P and the second cylinder member 22 Correspondence of the rotation angle position.

The marks detected by the alignment microscope AMG1 and the subsequent alignment microscope AMG2 can also be used to measure the expansion and contraction of the substrate P and the slight sliding on the second cylinder member 22. Store the angular position Φa1 measured with the encoder read head EN4 when sampling with the alignment microscope AMG1 for sampling, and the angular position Φa2 measured with the encoder read head EN5 when sampling with the alignment microscope AMG2 for the same mark.

In addition, it is connected to each of the two encoder read heads EN4, EN5 (and EN1, EN2, EN3) to output the measurement of the corresponding angular position is worth a reversible counter (counter), for example, It is at the same time or any time when the origin mark (not shown) engraved on the outer surface of the scale disc SD is detected by a specific encoder read head (any of EN1 ~ EN5) or at any time (zero) reset). The difference between the angular positions Φa1 and Φa2 obtained in this way is compared with the expansion angles Φ0 of the setting azimuth lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2 that have been precisely corrected in advance. When an error occurs between the difference (Φa1-Φa2) and the unrolling angle Φ0, there is a slight sliding of the substrate P on the second cylinder member 22 between the sheet entry area IA and the sheet departure area OA or the conveyance Possibility of expansion and contraction in the direction (circumferential direction).

In general, the positional error during patterning depends on the fineness and overlap accuracy of the element pattern formed on the substrate P. For example, if the bottom pattern layer is to be correctly overlapped and exposed to a line pattern with a width of 10 μm, only the line pattern can be allowed. An error of less than a fraction, that is, the size on the converted substrate P, can only tolerate a position error of about ± 2 μm. In order to achieve this kind of high-precision measurement, it is necessary to make the measurement directions of the mark images (alignment direction of the outer periphery of the second cylinder member 22 in the XZ plane) of each alignment microscope AMG1 and AMG2 and the measurement of the encoders EN4 and EN5. The directions (peripheral tangent directions of the scale GP in the XZ plane) are consistent within the allowable angular error.

As described above, the encoder read heads EN4 and EN5 are arranged to coincide with the measurement directions of the alignment marks AMG1 and AMG2 on the alignment mark on the substrate P (the tangential direction of the circumferential surface of the second cylinder member 22). Therefore, even when the position of the substrate P (marker) is detected by the alignment microscopes AMG1 and AMG2 (at the time of image sampling), the second cylinder member 22 (encoder scale disc SD) is oriented in the XZ plane toward the azimuth line Le4 or In the case where the Le5 orthogonal circumferential direction (tangent direction) is shifted, high-precision position measurement that takes into account the shift of the second cylinder member 22 can also be performed.

In addition, if the scale interval of the scale GP is constant, and there is no speed unevenness in rotation, the change interval of the reading values of the encoder read heads EN1, EN2, EN3, EN4, EN5 (the generation time of the rising and falling pulses of the counter) That is certain. However, in fact, the encoder scale disc SD may be deformed when the encoder scale disc SD is mounted on the second cylinder member 22, and the positions of the encoder read heads EN1, EN2, EN3, EN4, and EN5 may be changed ( The tilt, tilt) error, the accuracy of the encoder scale disc SD during manufacturing, and the eccentricity during installation, etc., have inherent errors in the scale GP (distance unevenness of scale itself due to distance errors, eccentricity, and deformation). In addition, the scale GP may also cause inherent errors due to factors such as the expansion and contraction of the encoder scale disc SD caused by the temperature change of the substrate processing device 11 during operation. In this embodiment, the measurement error caused by the inherent error of the scale GP caused by the above-mentioned reasons is obtained. Based on the obtained measurement errors, a correction chart (map, correction amount data) for correcting the inherent error points of the scale GP is prepared, and the reading values (actual measurement values) of a plurality of encoder read heads EN1 to EN5 are corrected according to the correction chart. In order to cancel or reduce the measurement error points caused by the inherent error of the scale GP.

In this embodiment, the correction chart of measurement error caused by the distance error and uneven distance between the scales of the scale GP is prepared based on the outer circumference of the scale disc SD, which is coaxially mounted with the second cylindrical member 22 which is a cylindrical member. The actual measured values of a plurality of encoder read heads are implemented. Here, a correction chart is created by using the encoder read head EN4 as the first reading section, the encoder read head EN5 as the second reading section, and the control device 14 as a correction section and a chart creation section. In this embodiment, although the encoder read head EN4 is set as the first read section and the encoder read head EN5 is set as the second read section for convenience, the first read section and the second read As long as it is an encoder reading head that knows at least two positions of the mounting angle interval in advance, it is sufficient.

The control device 14 as the correction unit is based on the difference between the reading value of the encoder read head EN4 (the count value of the counter m4) and the reading value of the encoder read head EN5 (the count value of the counter m5) ( m4-m5), or subtract the difference (m4-m5) from the predetermined value of the angular distance between the corresponding encoder read head EN4 and encoder read head EN5 (for example, the value corresponding to the number of ticks between them, set to K45). The difference (K45-m4-m5) will be the scale pitch error generated in one minute of the scale GP, for example, one from the origin of the scale GP to the predetermined angular position. Then, the control device 14 stores the scale pitch error data of one week of the scale GP as a correction chart, and corrects the read value of the encoder read head EN4, the read value of the encoder read head EN5, or other codes according to the correction chart. Each reading value of the reader heads EN1 ~ EN3.

FIG. 7 is an enlarged view showing the scale of the scale GP in a schematic manner. FIG. 8 is a schematic diagram showing the positional relationship between the scale GP and the encoder read heads EN4 and EN5. As shown in FIG. 7, the scale of the scale GP is constituted by, for example, duplication of a convex portion GPt having a rising portion GPa and a falling portion GPb and a concave portion GPU between an adjacent convex portion GPt. In this embodiment, one convex part GPt and one concave part GPU are set as one unit of the scale GP, that is, one pitch of the scale. To simplify the description, each encoder read head EN1 ~ EN5 is set to output an up pulse U when it reads the rising part GPa of the scale, and output a down pulse D when it reads the falling part GPb.

The scale of the scale GP, the distance SS1 from its rising portion GPa to the rising portion GPa of the adjacent scale GP or the distance SS2 from its falling portion GPb to the falling portion GPb of the adjacent scale, is the distance (interval) between the scales. . When setting the scale interval of the encoder scale disk SD to SS, if the scale GP is manufactured correctly, the distance SS1 or SS2 on any part of the scale GP is consistent with the scale interval SS.

Therefore, when the scale GP is moved in the direction indicated by arrow R in FIG. 7 and observed with the pulse output by the encoder read head EN, when two rising pulses U and one falling pulse U are output, or two falling pulses are output When D and one rising pulse U, the outer peripheral surface (scale GP) of the encoder scale disc SD (refer to FIG. 6) is the movement (rotation) of the scale interval SS minutes. If the type of pulses output by the encoder read head EN is not distinguished, every three pulses are detected, that is, the scale interval SS points are moved outside the encoder scale disc SD.

In the actual encoder measurement, a 2-phase signal (sin wave, cos wave) is generated from the encoder read head, and an interpolation signal processing for further subdividing the scale interval SS based on the 2-phase signal is performed. Therefore, the rising pulse U and the falling pulse D actually counted by the digital counter are generated at each position where the scale interval SS is equally divided into a fraction to a tenth.

FIG. 8 schematically shows a case where a plurality of scales of the scales GP provided on the outer periphery of the scale disc SD are arranged in a straight line. In FIG. 8, a scale GP provided on the outer periphery of the encoder scale disc SD is moved in a direction indicated by an arrow R. The encoder read head EN4 as the first reading section and the encoder read head EN5 as the second reading section are arranged in this order toward the moving direction of the scale GP. The two encoder read heads EN4 and EN5, when viewed on the scale GP, move relative to the direction opposite to the movement direction of the scale GP.

As shown in FIG. 6, a pair of encoder read heads EN4 and EN5 are connected to the line between the encoder read head EN4 and the second central axis AX2 (the orientation line Le4 is set), and are connected to the encoder read head EN5 and the second central axis AX2. The center angle (encoder installation angle) of the line (set azimuth line Le5) is θs. As shown in FIG. 8, a pair of encoder read heads EN4 and EN5 read the position of the scale GP on the surface of the encoder scale disc SD, and the linear distance (distance between the read heads) in the circumferential direction of the scale GP is XS. .

When a pair of encoder read heads EN4 and EN5 are mounted on the frame of the substrate processing apparatus 11 or the like, the encoder mounting angle θs and the distance XS between the read heads are constant. As mentioned above, due to the deformation of the encoder scale disc SD, the accuracy of the encoder scale disc SD during manufacture, the eccentricity during installation, the expansion and contraction of the encoder scale disc SD due to temperature changes, etc., the scale interval SS is in the code The circumferential direction of the device scale disc SD is not necessarily constant. For example, in a very schematic way, as shown in FIG. 8, the areas a, c, and d on the scale GP will rise by GPa between an encoder mounting angle θs and a distance XS between the read heads. As a group with the descending portion GPb, there are three scales GP. However, there are 2.5 regions b and 6 scales GP in region e.

In the example shown in FIG. 8, when the scale pitch SS is a design value, for example, there is a predetermined number (three in this example) of scales GP between an encoder mounting angle θs and a distance XS between read heads. In fact, due to the above-mentioned scale GP error, the number of scales GP existing between an encoder installation angle θs and a distance XS between the read heads will be reduced from the aforementioned predetermined number. Although the scale pitch of the area a in FIG. 8 is SSa, the number of scales GP in the area b is smaller than a predetermined number, so the scale pitch SSb of the area b is larger than the scale pitch SSa of the area a. In addition, since the number of scales GP in the area e is larger than a predetermined number, the scale pitch SSe of the area e is smaller than the scale pitch SSa.

For example, suppose that the scale pitch SS in the design is 100 and the distance XS between the read heads in the design is 300. In areas a, c, and d of FIG. 8, the actual distance X between the read heads calculated from the values (counter counts) of the scale GP read by the encoder read heads EN4 and EN5 is 300. This is consistent with the design distance XS between the read heads. In contrast, in the area b in FIG. 8, the actual distance X between the read heads calculated based on the values (counter values) read by the encoder read heads EN4 and EN5 is 250. In the area e, according to the encoder read head The actual distance X between the read values of EN4 and EN5 (counter value) is 600.

As described above, the difference between the distance XS between the read heads in the design and the distance X between the actual read heads is caused by the error in the scale pitch of the scale GP. After fixing a pair of encoder read heads EN4 and EN5 to the device, if the device is set in a certain temperature environment, the distance XS between the read heads will not change. Therefore, for example, using the distance XS between the read heads EN4 and EN5 of the fixed encoder as a reference, a graph of the scale pitch error of the scale GP obtained from the read values of the encoder read heads EN4 and EN5 (every week) 360 ° angular position error amount or error correction amount). After the chart is created, according to the reading value (counter value) of the scale GP of the encoder read heads EN4 and EN5 (or other read heads EN1 ~ EN3), the amount of error or correction corresponding to the angular position is changed from the chart If you call it and correct it one by one, you can immediately correct the moving distance error in the circumferential direction of the scale GP.

When correcting the actual scale pitch error and the scale GP moving distance error, such as the scale pitch SS when the scale GP has no error, the distance XS between the read heads and the distance X between the actual read heads, and then the scale GP The actual scale pitch (actual scale pitch) SSR when an error occurs is obtained by, for example, Equation (1). By using the actual scale interval SSR, the error of the scale GP can be corrected. As a result, the error of the moving distance of the scale GP can also be corrected.

SSr = SS × XS / X ... (1)

In addition, the number of scale GPs (measurement scale lines) between the read head distances XS read by a pair of encoder read heads EN4 and EN5 can be used to correct the error of the scale GP to correct the movement distance of the scale GP. error. The number NS of the scale lines existing between the read head distances XS can be obtained by counting the count values of the rising pulse U and the falling pulse D obtained from a pair of encoder read heads EN4 and EN5. When the measurement scale line NS is used, the actual scale interval SSR can be obtained by the formula (2) including the distance XS between the read heads.

SSr = XS / NS ... (2)

The error of the scale interval and the movement distance of the scale GP can be controlled by the control device 14 of the position detection device of the cylindrical member as a correction unit. For example, by using the calculation of formula (1) or formula (2), Correction of the reading value of a pair of encoder read heads EN4 and EN5. Therefore, the position detection device for the cylindrical member provided with the control device 14 and the substrate processing device 11 can cause an error in the scale pitch SS due to deformation of the encoder scale disc SD provided with the scale GP, so that the error can be corrected or corrected by the error chart. The use of the chart corrects this error almost instantaneously. Therefore, for the encoder scale disc SD and the second cylinder member 22, high-precision position measurement (position measurement in the circumferential direction) can be achieved. Next, the correction of the error of the scale pitch and the error of the moving distance will be explained.

FIG. 9 is a flowchart showing a procedure for correcting the scale pitch error of the scale. FIG. 10 is a diagram showing the relationship between the scale disc SD with scales on the outer peripheral surface and the encoder read heads EN4 and EN5. FIG. 11 is a diagram showing an example of a correction chart. When correcting the scale pitch error of the scale GP, as shown in FIG. 10, the distance XS between the read heads EN4 and EN5 of a pair of encoders is measured in advance and stored in all the memory sections of the control device 14. The distance XS between the read heads is obtained by reading a pair of encoder heads EN4 and EN5 on the outer peripheral surface of the encoder scale disc SD and reading the scale GP. A pair of encoder read heads EN4 and EN5 read the position of the scale GP, which can be set to the position where the encoder scale disc SD is true circle, and the encoder scale disc SD is not eccentric with respect to the rotation center line AX2. In this case, as shown in FIG. 10, on the curved surface Pd (the scale surface of the scale GP) of the curved radius P (the scale surface of the scale GP) from the rotation centerline AX2 to the design value radius of the encoder scale disk SD (ra The distance XS between the read heads EN4 and EN5 of the encoder. In the example shown in FIG. 10, the scale GP of the encoder scale disc SD is rotated (rotated) in the direction shown by arrow R, that is, from the encoder read head EN4 to the encoder read head EN5.

As shown in FIG. 9, in step S101, when the processing of the substrate processing apparatus 11 shown in FIG. 1 has not been started (steps S101 and No), corrections such as the scale GP are not performed. In step S101, when the processing of the substrate processing apparatus 11 is started and the scale disk SD is stably rotated (steps S101 and Yes), in step S102, the control device 14 obtains these from the encoder read heads EN4 and EN5 at a predetermined timing. Read value (count value of the counter). Obtained at a predetermined timing means that, for example, each time the encoder scales SD of the encoder scale GP rotates around the rotation center line AX2 by a predetermined angle α (degrees), the control device 14 obtains each reading of the encoder read heads EN4 and EN5. The value is a matter of latching the count value of each counter to be stored. Hereinafter, the angle α may be appropriately referred to as a rotation angle α. When the encoder scale disc SD rotates at an equal angular velocity (constant peripheral velocity), each reading value of the encoder reading heads EN4 and EN5 of the two sides can also be obtained by the control device 14 at a predetermined time t. In this example, α (degrees) is preferably a factor of 360, but the angle α is not limited to this. The angle α is determined by the tendency of the scale pitch error (the amplitude of the error and the rate of change in the circumferential direction).

In the case where the encoder scale disc SD rotates at an equal angular velocity, the control device 14 obtains these reading values from the two encoder reading heads EN4 and EN5 every time t. When the control device 14 obtains these reading values from the encoder reading heads EN4 and EN5 of the two at each predetermined angle α, for example, a rotation angle detecting means of the encoder scale disc SD is prepared. The control device 14 detects the timing of the rotation angle α of the encoder scale disc SD every time the rotation angle detecting means obtains these read values from the encoder read heads EN4 and EN5 of both sides. In addition, either of the encoder read heads EN4 and EN5 can be used as a rotation angle detection means. For example, when the encoder read head EN4 is used as a rotation angle detection means, the control device 14 detects the timing of the encoder scale disc SD that has been rotated by the encoder read head EN4 each time from the encoder of both sides. The read heads EN4 and EN5 obtain these read values. The encoder scale disc SD has been rotated by an angle α, which represents, for example, that the encoder read head EN4 detects a number corresponding to the scale GP of the rotation angle α, and can be detected by outputting a corresponding number of pulses.

Next, the process proceeds to step S103, and the control device 14 obtains the actual scale pitch SSr as a correction value of the scale GP based on the read value obtained in step S102. For example, when the actual scale pitch SSr is obtained using the above formula (2), the control device 14 obtains the number of measurement scales NS from the reading values of the encoder heads EN4 and EN5. The measurement scale number NS is the difference (NSa-NSb) between the reading value NSa of the scale GP of the encoder read head EN4 and the reading value NSb of the scale GP of the encoder read head EN5. Next, the control device 14 reads the distance XS between the read heads stored in its own memory section, and obtains the actual scale pitch SSr from the formula (2). The actual scale interval SSR is the correction value of the interval of the scale GP in the range of the angle α (degrees). In addition, when using the above formula (2) to find the actual scale pitch SSr, the distance X between the measuring encoders is obtained from the product of the number of measuring scales NS and the scale pitch SS when there is no error in the scale GP, and then the distance between the read heads XS and the scale The distance SS and the distance X between the measuring encoders can be used to obtain the number of measuring scales NS.

The number of scales NS can be obtained, for example, in the following manner. When the encoder read head EN4 reads the position (reference scale position) GPb which is the reference of a plurality of scales GP included in the encoder scale disc SD, the control device 14 resets the encoder read head EN4 (encoder After the zero point of the Z phase of the read head EN4 is reset), the number of the scale GP detected by the encoder read head EN4 is counted. Next, when the encoder read head EN5 reads the scale reference position GPb, the control device 14 resets the encoder read head EN5 (zero point of the Z phase of the encoder read head EN5 is reset). The control device 14 obtains the number of the scale GP of the encoder read head EN4 when the encoder read head EN5 is reset to 0, and obtains the number of the scale GP when the encoder read head EN5 reads the scale reference position GPb, That is the difference from 0. This difference is the number of measuring scales NS. Since then, the control device 14 continuously counts the scale GP of the encoder read heads EN4 and EN5, and obtains the count value of the read values of the encoder read heads EN4 and EN5 for each predetermined angle α or each predetermined time t. (Count value of the scale GP), find the difference, and take this as the measurement scale number NS at a predetermined angle α or a predetermined time t. In this example, the encoder reference position GPb will return to the original position when the encoder scale disk SD is wound once. At this time, the counters connected to the encoder read heads EN4 and EN5 can be reset or not. .

In step S103, after obtaining the actual scale interval SSr (corresponding to the correction value of the scale GP) at a certain angle α, in step S104, the control device 14 records the corresponding angle α as shown in FIG. 11 Fixed chart TBc. For example, in No. 2 of the correction chart TBc, an angle 2 × α and an actual scale pitch SSR2 (= XS / NS2) corresponding thereto are described. The correction chart TBc is stored in the memory section of the control device 14. The control device 14 obtains the actual scale pitch SSR for the entire circumference of the plurality of scales GP (the entire circumference of the encoder scale disc SD). The control device 14, in the processing of the substrate processing device 11, will modify the correction value corresponding to the angle of the encoder scale disc SD detected by at least one of the encoder read head EN4 and the encoder read head EN5, that is, the actual scale pitch. SSr is read from the correction chart TBc to correct the error of the scale GP. As shown in FIG. 6, when the substrate processing device 11 has three or more encoder read heads EN1, EN2, EN3, EN4, and EN5, the control device 14 can use correction charts for encoder read heads other than EN4 and EN5. TBc corrects the error of the scale GP. Next, proceed to step S105. When the processing of the substrate processing apparatus 11 has not ended (steps S105, No), the control device 14 continues from step S102 to step S104, and when the processing of the substrate processing apparatus 11 has ended (step S105, Yes). , The control device 14 ends the correction of the scale GP and the like.

In the above example, during the processing of the substrate processing apparatus 11, that is, when the processing unit applies a predetermined process (for example, an exposure process) to the substrate, the control device 14 corrects the intervals between the plurality of scales GP to make them look constant. By adopting this method, the substrate processing device can be corrected in real time The error of the scale GP generated in the work of 11 is the error of reading the scale interval, so the processing accuracy of the substrate processing device 11 can be improved.

The encoder scale disk SD is wound once, that is, when the scale reference position GPb originally at the position of the encoder read head EN4 returns to the position of the encoder read head EN4, it is used as the correction value of the full-scale GP scale and calculated. Actual scale interval SSR. The control device 14 can then correct the scale GP the same after each revolution of the encoder scale disc SD, or end the correction of the scale GP after the encoder scale disc SD has been rotated once, at a predetermined timing (for example, after After a predetermined time or when there is a change in the temperature, etc.), the calibration of the scale GP is started again. When the former is selected, since the correction chart TBc is updated at any time, it can quickly respond to the encoder scale disc SD and the scale GP's deformation or dimensional changes in a short time. When the latter is selected, since the update frequency of the correction chart TBc can be suppressed, the hardware resources of the control device 14 can be effectively used.

When the control device 14 obtains these read values from the encoder read heads EN4 and EN5, the shorter the acquisition timing or the smaller the interval between the encoder read heads EN4 and EN5, the more the correction accuracy of the scale GP can be improved. The distance between the encoder read heads EN4 and EN5 will be limited to some extent due to the size of the encoder read heads EN4 and EN5 and the balance with other parts. Therefore, shortening the timing when obtaining these read values from the encoder read heads EN4 and EN5 has the advantage of improving the versatility.

Figures 12 and 13 are conceptual diagrams showing the timing when these read values are obtained from a pair of encoder read heads. In the above example, when the plurality of scales GP of the encoder scale disk SD are rotated around the rotation center line AX2 as a predetermined rotation angle α (degrees), the control device 14 obtains these from the encoder read heads EN4 and EN5 Its read value. When the rotation angle α (degrees) at this time is set to a factor of 360, the encoder read heads EN4 and EN5 read the same position every turn during the multiple rotations of the encoder scale disc SD (see Figure 12) ). In this case, in order to improve the correction accuracy of the scale GP, although the predetermined rotation angle α needs to be reduced, the rotation angle α cannot be reduced blindly due to the limitation of the device and the like.

In this embodiment, since the encoder scale disc SD with a plurality of scales GP is a rotating body (continuous body), even if the periodicity of each circle is not guaranteed, the encoder read heads EN4 and EN5 can be used for continuous measurement. . Therefore, for example, by setting the rotation angle α (degrees) to a factor other than 360 degrees, it is possible to destroy the reading positions of the encoder read heads EN4 and EN5 when the encoder scale disc SD rotates a plurality of turns. Periodic. In particular, by setting α (degrees) to a number other than a factor of 360 degrees and a prime number, the periodicity can be more effectively destroyed. As a result, even if the predetermined rotation angle α is large, the offset amount generated by the multiple scales GP (encoder scale disc SD) every time the winding is repeated is very small, so that the encoder read head EN4 can be reduced as a result. The measurement interval of EN5 on the scale GP (refer to Figure 13).

For example, although the angle α may be set to a value other than a factor of 360 degrees between 10 degrees and 35 degrees, the value of 360 / α may be set to about 1 to 4 digits below the decimal point. It is a value that can be divided by 1 to 4 digits below the decimal point. For example, when the angle α is set to a prime number of 11 degrees, 17 degrees, 19 degrees, 23 degrees, etc., 4 displacements from 360 / α to the decimal point cannot be divisible. On the other hand, when the angle α is set to any of 12.5 degrees, 16 degrees, 25 degrees, and 28.8 degrees, 360 / α is divisible by one decimal place. When the angle α is set to 19.2 degrees and 32.0 degrees, 360 / α is divisible by two places below the decimal point. When the angle α is set to 12.8 degrees, 360 / α is divisible by 3 places below the decimal point. When the angle α is set to 25.6 degrees, 360 / α can be divided by 4 digits below the decimal point. In addition, the rotation angle α is between 10 degrees and 35 degrees, and the angle of the factor (360 / α is an integer) is 10 degrees, 12 degrees, 14.4 degrees, 15 degrees, 18 degrees, 20 degrees, 22.5 degrees, 24 degrees, 30 degrees. In addition, although the rotation angle α may be in the range of 1 degree to 10 degrees, in order to prevent 360 / α from being an integer factor, the rotation angle α may be 7 degrees and 9 degrees. In addition, depending on the resolution of the required error correction, the rotation angle α can also be set to 1 degree, for example, the difference between the reading values of the encoder heads EN4 and EN5 can be obtained every 0.5 degrees to make a gap error. The chart.

FIG. 14 is a flowchart showing a procedure for correcting a scale error. The example in FIG. 14 shows that when a plurality of scales GP on the encoder scale disc SD rotate around a rotation center line AX2 for a predetermined angle α (degrees), a pair of encoder read heads EN4 and EN5 read these. In this case, the processing sequence when the rotation angle α is set to a prime number that is not a factor of 360. In this example, the rotation angle α can be set to, for example, 7 degrees, 11 degrees, and the like.

Steps S201 to S204 are the same as steps S101 to S104 in the above example in which α (degrees) is set to a factor of 360, and therefore descriptions thereof are omitted. In step S205, the control device 14 repeats steps S202 to S205 when the encoder scale disc SD has not been rotated to a predetermined number of rotations after the correction value is started (steps S205 and No). In step S205, the control device 14 proceeds to step S206 when the encoder scale disc SD is rotated to a predetermined number of rotations after starting to calculate the correction value (step S205, Yes). Step S206 is the same as step S105 in the above example in which α (degree) is set to a factor of 360, and a description thereof is omitted. Although the number of rotations specified in step S205 may be 2 or more, the larger the number of rotations specified, the smaller the effect of improving the correction accuracy of the scale GP. Therefore, it is desirable to set a predetermined number of rotations in an appropriate range of 2 rotations or more.

Next, the configuration of the encoder read heads EN4 and EN5 will be described. As shown in FIG. 6, the encoder read head EN4 as the first reading section and the encoder read head EN5 as the second reading section are arranged in the same way as the exposure device EX (see FIG. 1) as the processing section. The rotation direction of the second cylindrical member 22 of the cylindrical member is preferably on the opposite side. Specifically, it is preferable that the portion of the substrate P supported by the second tube member 22 to be exposed to the exposure device EX is disposed on the side opposite to the rotation direction of the second tube member 22. In other words, the scale GP is read and the correction value is obtained two places before the portion of the substrate P supported by the second cylinder member 22 that is exposed to the exposure device EX. In the example shown in FIG. 6, the rotation direction of the second cylinder member 22 is a direction from the encoder read head EN4 to the encoder read head EN5. The encoder read heads EN4 and EN5 are configured in this way, and the position information in the circumferential direction of the second cylinder member 22 after being corrected by the scale GP can be fed back to the control of the processing (exposure processing in this example), so the processing accuracy can be improved.

In this embodiment, although the encoder reading heads EN4 and EN5 are disposed on the opposite side of the rotation direction of the second cylinder member 22 from the substrate P exposed by the exposure device EX, one of them may be disposed. In the exposed part. For example, the encoder read head EN5 can be used as the first reading unit and the encoder read head EN1 can be used as the second reading unit, and the correction value of the scale GP can be obtained based on the difference between the read values of the two.

In addition, in this embodiment, the alignment microscopes AMG1 and AMG2 are arranged at positions corresponding to the encoder read heads EN4 and EN5. Therefore, the alignment microscopes AMG1 and AMG2 can be used to measure the changes on the surface of the substrate P, and it is predicted that they will be processed. Changes in the position of the substrate P are corrected during processing. Furthermore, in addition to the encoder read heads EN4 and EN5, at least one of the encoder read heads EN1 and EN2, which are arranged at different positions, for example, at a processing position, may be used to measure the rotation centerline AX2. The deflection (movement in the direction orthogonal to the rotation center line AX2), the roundness (shape deformation), or the eccentricity of the second cylinder member 22 are corrected based on the measured values.

When measuring the deflection of the rotation centerline AX2 or the eccentricity of the second cylinder member 22, it is preferable to use it with the encoder read heads EN4 and EN5. The relative processing position (the position of the exposure process) is arranged in conjunction with the encoder read head EN4, The encoder read head EN3 on the opposite side of EN5 as the third reading section (see FIG. 6). In this way, the measurement results such as the deflection of the rotation centerline AX2 can be compared before and after the processing position, and the intermediate value can be used as a correction value for the deflection of the rotation centerline AX2. In addition, the encoder read heads EN4, EN5 and encoder read head EN3, which are arranged before and after the processing position, are used to measure the deflection of the rotation centerline AX2, etc., and correct it based on the measured values. Time accuracy. When the encoder read head EN3 is used as the third reading part, a straight line connecting the encoder read head EN5 and the rotation center line AX2 (set azimuth line Le5) and a straight line connecting the encoder read head EN3 and the rotation center line AX2 (set The angle included by the azimuth line Le3) is not limited to 210 degrees shown in FIG. 6, and the encoder read head EN3 may be on the processing position side.

In addition to the encoder read head EN4 as the first read section and the encoder read head EN5 as the second read section, plus the encoder read head EN3 as the third read section, the encoder scale is The distance between the encoder read head EN4 and the encoder read head EN5 in the circumferential direction of the disc SD is smaller than the distance between the encoder read head EN5 and the encoder read head EN3. Reducing the gap between the encoder read head EN4 and the encoder read head EN5 can improve the correction accuracy of the scale GP. In addition, increasing the interval between the encoder read head EN5 and the encoder read head EN3 can improve the sensitivity when detecting the eccentricity and the like of the second cylinder member 22.

Next, the distance between the encoder read head EN4 as the first reading section and the encoder read head EN5 as the second reading section will be described. The encoder read head EN4 and the encoder read head EN5 are configured to connect the line between the encoder read head EN4 and the rotation center line AX2 (set the azimuth line Le4) and the line connecting the encoder read head EN5 and the rotation center line AX2 (set The installation angle θs of the center angle encoder sandwiched by the azimuth line Le5) is preferably an angle other than 90 degrees, 180 degrees, and 270 degrees. With this configuration, it is possible to detect the deflection of the rotation centerline AX2 or the eccentricity of the second cylinder member 22 with the two encoder read heads EN4 and EN5. Further, it is preferable that the encoder installation angle θs is within 45 degrees, and angles other than 120 degrees and 240 degrees are preferred. With this arrangement, the correction accuracy of the scale GP can be improved while detecting the deflection of the rotation centerline AX2 or the eccentricity of the second cylinder member 22 with the two encoder read heads EN4 and EN5. Next, a case where the substrate processing apparatus 11 has a mechanism for adjusting the true roundness of the encoder scale disc SD will be described.

15 and 16 are explanatory diagrams for explaining a roundness adjusting mechanism for adjusting the roundness of the encoder scale disc. In the above-mentioned FIGS. 4 and 5, although the diameter of the encoder scale disc SD is smaller than the diameter of the second cylinder member 22, the outer periphery of the second cylinder member 22 and the outer periphery of the winding substrate P are smaller. The diameter is preferably the same as the diameter of the scale GP of the encoder scale disc SD. In this way, the so-called measurement Abbe error can be further reduced. In this case, the exposure device EX is most provided with a perfect circularity adjustment mechanism Cs that adjusts the true circularity of the encoder scale disc SD as shown in FIG. 13.

As a kind of scale member, the encoder scale disc SD is a ring-shaped member. An encoder scale disc SD having a scale GP on the outer peripheral surface is fixed to an end portion of at least one of the second cylindrical members 22 orthogonal to the second central axis AX2 of the second cylindrical members 22. The encoder scale disc SD is such that the groove Sc provided on the encoder scale disc SD along the circumferential direction of the second center axis AX2 is provided at the same radius as the groove Sc and provided along the circumferential direction of the second central axis AX2. The grooves Dc of the two cylinder members 22 face each other. The encoder scale disk SD is provided with a bearing member SB such as a rolling element (for example, a ball) between the groove Sc and the groove Dc.

The roundness adjustment mechanism Cs is mounted on the inner peripheral side of the encoder scale disc SD, and includes an adjustment member 60 and a pressing member PP. In addition, the roundness adjusting mechanism Cs is provided with a plurality of (for example, 8 places) at a predetermined pitch in the circumferential direction centered on the rotation center line AX2. For example, the direction parallel to the installation direction line Le4 can be changed from the second center axis AX2 is a pressing mechanism that presses in the direction of the scale GP. The adjustment member 60 is inserted into the pressing member PP, and includes a nut portion FP3 of the encoder scale disc SD, a screw portion 61 screwed into the nut portion FP4 of the second cylinder member 22, and a head portion 62 that comes into contact with the pressing member PP. The pressing member PP is a ring-shaped fixing plate having a smaller radius in the circumferential direction than the encoder scale disc SD at the end of the encoder scale disc SD. The encoder scale disc SD is fixed to at least one of the second cylinder member 22 by a plurality of solid structural members, namely, an adjustment member 60 including a screw portion 61 and a head portion 62, in the circumferential direction of the second cylinder member 22. Of the end.

A cross section including the second central axis AX2 is formed on the inner peripheral side of the encoder scale disc SD, which is extended to the inner peripheral side of the encoder scale disc SD, and is parallel to the second central axis AX2. With inclined surface FP2. The inclined surface FP2 is an inclined surface that becomes thinner as it approaches the second central axis AX2 and its thickness is parallel to the second central axis AX2. The pressing member PP is formed with an inclined surface FP1 that becomes thicker as it approaches the second central axis AX2, and its thickness is parallel to the second central axis AX2. The pressing member PP is fixed to the encoder scale disc SD by the adjusting member 60 so that the inclined surface FP2 and the inclined surface FP1 face each other.

The roundness adjustment mechanism Cs transmits the pressing force of the inclined surface FP1 of the pressing member PP to the inclined surface FP2 by screwing the screw portion 61 of the adjustment member 60 into the nut portion FP3 of the encoder scale disk SD. The inside of the scale disc SD is slightly elastically deformed toward the outer peripheral side. Conversely, by turning the screw portion 61 to the opposite side, the suppressed pressing force of the inclined surface FP1 of the pressing member PP is transmitted to the inclined surface FP2, and the elastic deformation from the outer peripheral side of the encoder scale disc SD to the inside is slight. .

The roundness adjusting mechanism Cs can adjust the diameter of the scale GP in the circumferential direction by operating the screw portion 61 with a plurality of adjusting members 60 provided at a predetermined pitch in the circumferential direction centered on the rotation center line AX2. In addition, since the roundness adjusting mechanism Cs can slightly deform the scale GP located on the above-mentioned setting azimuth lines Le1 to Le5, the diameter of the scale GP in the circumferential direction can be adjusted with high accuracy. Therefore, the adjustment member 60 at an appropriate position can be operated according to the true roundness of the encoder scale disk SD, so as to improve the true roundness of the scale GP of the encoder scale disk SD, or a slight eccentricity error relative to the rotation centerline AX2, In order to improve the position detection accuracy of the rotation direction of the second cylinder member 22. In addition, the adjustment amount of the roundness adjustment mechanism Cs is different depending on the diameter of the encoder scale disc SD or the radius position of the adjustment member 60, and the maximum is not more than a few μm.

As shown in FIG. 16, the encoder scale disc SD is fixed to the second tube member 22 through eight adjusting members 60. In this case, the encoder read head EN4 as the first reading section and the encoder read head EN5 as the second reading section are preferably arranged as the encoder read head EN4 and the second central axis AX2 and the encoder read head. The encoder installation angle θs of the center angle of EN5 is smaller than the center angle β between the adjacent adjustment member 60 and the second center axis AX2.

The encoder scale disc SD is fixed to the second tube member 22 through the adjustment member 60, and thus may be deformed near the adjustment member 60. As described above, by making θs <β, the encoder read heads EN4 and EN5 can reliably detect errors in the scale GP due to deformation between adjacent adjustment members 60. As a result, the correction accuracy of the scale GP can be improved. Next, a modification of the substrate processing apparatus (exposure apparatus) will be described.

(First modification of substrate processing apparatus (exposure apparatus))

FIG. 17 is a schematic diagram showing a first modification of the substrate processing apparatus (exposure apparatus). FIG. 18 is an explanatory diagram for explaining the position of the reading device when the encoder scale disc of the first modification of the substrate processing apparatus (exposure device) is viewed from the direction of the rotation center line. In the above embodiment, the case where the position in the circumferential direction of the second tube member 22 of the support substrate P is detected is described as an example. However, it is not limited to this. Like the exposure device EX1 of this modification, when detecting the position of the 21st circumferential direction of the first cylinder member holding the cylindrical mask DM, a pair of encoder read heads can be used to correct the situation. An error in the scale GP (scale) at the position in the circumferential direction of the first cylinder member 21.

The encoder scale disc SD included in the exposure device EX1 is fixed to both ends of the second tube member 22 that is orthogonal to the rotation axis AX2 of the second tube member 22. The scale GP is provided on the outer surface of the encoder scale disc SD on both sides. Therefore, the scale GP is arranged on both ends of the second tube member 22. The encoder heads EN1 to EN5 that read each scale GP are disposed on both end portions of the second cylinder member 22.

The first detector 25 (refer to FIG. 1) described in the above embodiment optically detects the rotation position of the first cylinder member 21, and includes an encoder scale disc (scale member) SD with high true roundness, and reading Take the device encoder read heads EH1, EH2, EH3, EH4, EH5. The encoder scale disc SD is fixed to at least one end portion (both end portions in FIG. 16) of the first tube member 21 orthogonal to the rotation axis of the first tube member 21. Therefore, the encoder scale disc SD rotates integrally with the rotation axis ST about the rotation center line AX1. A scale GPM is engraved on the outer surface of the encoder scale disc SD. The encoder read heads EH1, EH2, EH3, EH4, and EH5, as viewed from the rotation axis STM, are arranged around the scale GP. The encoder read heads EH1, EH2, EH3, EH4, and EH5 are opposite to the scale GPM and can read the scale GPM in a non-contact manner. The encoder heads EH1, EH2, EH3, EH4, and EH5 are arranged at different positions in the circumferential direction of the first cylinder member 21. The first cylinder member 21 rotates from the encoder read head EH4 toward the encoder read head EH5.

The encoder read heads EH1, EH2, EH3, EH4, and EH5 are reading devices with measurement sensitivity (detection sensitivity) for changes in displacement in the tangential direction (in the XZ plane) of the scale GPM. As shown in Figure 17, when the orientation of the encoder heads EH1 and EH2 (angle direction in the XZ plane centered on the rotation center line AX1) is indicated by the orientation lines Le11 and Le12, the orientation line is set accordingly. Le11 and Le12 are arranged at an angle of ± θ ° with respect to the central plane P3, and the encoder heads EH1 and EH2 are arranged. In addition, the azimuth lines Le11 and Le12 are set to coincide with the angular directions of the illumination beam EL1 shown in FIG. 1 in the XZ plane centered on the rotation center line AX1. Here, the processing unit illumination mechanism IU performs a process of transmitting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM of the object to be processed. According to this, the projection optical system PL can project the image of the pattern of the illumination area IR on the cylindrical mask DM onto a part of the substrate P (projection area PA) conveyed by the conveying device.

The encoder read head EH4 is set to set the encoder read head EH1 to set the azimuth line Le11 relative to the center plane P3 of the first cylinder member 21 toward the rotation direction, and the side is rotated up to 90 ° around the axis of the rotation center line AX1. Bearing line Le14. In addition, the encoder read head EH5 is set so that the orientation line Le12 of the encoder read head EH2 is oriented toward the rotation direction with respect to the center plane P3 of the first cylinder member 21, and the side is rotated up to 90 ° around the axis of the rotation center line AX1. Set it on the bearing line Le15. Here, approximately 90 ° means that when it is set to 90 ° ± γ, the range of γ is the same as that of the above embodiment.

In addition, the encoder read head EH3 is set to rotate the encoder read head EH2's azimuth line Le12 around the axis of the rotation center line AX1 to 120 °, and the encoder read head EH4 about the axis of the rotation center line AX1. Rotate the bearing line Le13 by 120 °. The arrangement of the encoder read heads EH1, EH2, EH3, EH4, EH5 arranged around the first cylinder member 21 in this embodiment is the same as the encoder read heads EN1, arranged around the second cylinder member 22 in the above embodiment. EN2, EN3, EN4, EN5 are mirror-inverted.

As described above, the exposure device EX1 includes the second cylindrical member 22 which is a cylindrical member, the scale GP, the processing unit projection modules PL1 to PL6 of the exposure device EX1, and the first reading device encoder which reads the scale GP. The heads EN4 and EN5 and the second reading device encoders EN1 and EN2 for reading the scale GP.

The first cylindrical member 21 has a curved surface curved from a first central axis AX1 as a predetermined axis with a constant radius, and rotates about the first central axis AX1. The scale GPM is arranged in a ring shape along the circumferential direction of the first cylindrical member 21 and rotates together with the first cylindrical member 21 about the first central axis AX1. The illumination unit IU of the processing unit of the exposure device EX1 is disposed inside the first cylindrical member 21 when viewed from the second central axis AX2, and is opposed to a curved substrate P (located at a specific position in the circumferential direction of the first cylindrical member 21) The object to be processed) is processed to penetrate the two illumination beams EL1. The encoder read heads EH4 and EH5, when viewed from the first center axis AX1, are arranged around the scale GPM, and are arranged around the first center axis AX1 to rotate the aforementioned specific position approximately 90 degrees around the first center axis AX1. Position, read the scale GPM. The encoder read heads EH1 and EH2 read the scale GPM at the aforementioned specific position. The exposure device EX1 corrects the error (gap error) of the scale GPM provided on the outer periphery of the encoder scale disc SD installed on the first cylinder member 21 according to the reading values of the encoder heads EH4 and EH5. Therefore, the exposure device EX1 can measure the position in the circumferential direction of the first tube member 21 with good accuracy, and process the substrate P that is positioned on the curved surface of the second tube member 22, that is, the substrate P. As described above, in this embodiment, when the error is corrected based on the read values of the encoder read heads EH4 and EH5, specifically, the control device 14 of the exposure device EX is based on the read values and codes of the encoder read head EH4. The difference between the reading values of the reader head EH5 corrects the pitch error. However, when the other encoder read heads are installed at an angle close to any of the encoder read heads EH4 and EH5 around the scale GPM of the first cylinder member 21, the encoder read heads EH4 and EH5 are not limited. The direct difference calculation between the two read values can also be calculated by calculating the read values of the three encoder read heads of the encoder read heads EH4, EH5 and other encoder read heads to calculate the pitch error. The measurement of the distance between the reading heads of the three encoders will be described in detail later.

(Second Modification of Substrate Processing Device (Exposure Device))

FIG. 19 is a schematic diagram showing the overall configuration of a second modification of the substrate processing apparatus (exposure apparatus). The exposure device EX2 emits an illumination light beam EL1 that is illuminated by the cylindrical mask DM from a light source device (not shown). The illumination light beam EL1 emitted from the light source of the light source device is guided to the illumination module IL. When a plurality of illumination optical systems are emitted, the illumination light beam EL1 from the light source is separated into a plurality of tones, and then the plurality of illumination light beams EL1 are directed to a plurality of Lighting module IL.

The illumination light beam EL1 emitted from the light source device enters the polarizing beam splitters SP1 and SP2. In the polarizing beam splitters SP1 and SP2, in order to suppress the energy loss caused by the separation of the illumination light beam EL1, it is preferable to make a beam that completely reflects the incident illumination light beam EL1. Here, the polarizing beam splitters SP1 and SP2 reflect a linearly polarized light beam that is S-polarized light and transmits a linearly polarized light beam that is P-polarized light. Therefore, the light source device emits the illumination light beam EL1 that has entered the polarized beam splitters SP1 and SP2 into a linearly polarized light beam (S-polarized light) toward the first tube member 21. According to this, the light source device emits an illumination light beam EL1 having the same wavelength and phase.

The polarizing beam splitters SP1 and SP2 reflect the illumination beam EL1 from the light source, and on the other hand, transmit the projection beam EL2 reflected by the cylindrical mask DM. In other words, the illumination beam EL1 from the illumination optical module ILM enters the polarizing beam splitter SP1 and SP2 as a reflected beam, and the projection beam EL2 from the cylindrical mask DM enters the polarizing beam splitter SP1 as a transmitted beam. SP2.

As described above, the processing unit illumination module IL performs a process of reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM of the object to be processed. According to this, the projection optical system PL can project an image of the pattern of the illumination region IR on the cylindrical mask DM onto a portion (projection region) of the substrate P that is transported by the transport device.

In the case of setting a predetermined pattern (mask pattern) for reflecting the illumination beam EL1 to the curved surface of the cylindrical mask DM, a scale GPm can be set on the curved surface together with this mask pattern. When this scale GPm is formed simultaneously with the mask pattern, the scale GPm is formed with the same accuracy as the mask pattern. Therefore, the curved surface detectors GS1 and GS2 that detect the scale GPm can sample the image of the mark of the scale GPm at high speed and high accuracy. At the moment when this sampling is performed, the correspondence relationship between the rotation angle position of the first cylinder member 21 and the scale GPm can be obtained, and the rotation angle position of the first cylinder member 21 that is successively measured is stored.

The encoder heads EH4 and EH5 on the DM side of the cylindrical reticle read the scale GPm. The exposure device EX2 corrects the error of the scale Gpm provided on the surface of the cylindrical mask DM according to the difference between the reading values of the encoder heads EH4 and EH5. Therefore, the exposure device EX2 can measure the position in the circumferential direction of the cylindrical mask DM with good accuracy, and can process the substrate P on the curved surface of the second cylindrical member 22.

The encoder read heads EN4 and EN5 on the side of the second cylinder member 22 read the scale GPd of the encoder scale disc SD mounted on the second cylinder member 22. In addition, the exposure device EX2 corrects the error of the scale GPd provided on the surface of the encoder scale disc SD based on the difference between the reading values of the encoder read heads EN4 and EN5. Therefore, the exposure device EX2 can measure the position in the circumferential direction of the second cylindrical member 22 with good accuracy, and process the substrate P on the curved surface of the second cylindrical member 22.

(Third Modification of Substrate Processing Device (Exposure Device))

FIG. 20 is a schematic diagram showing the overall configuration of a third modification of the substrate processing apparatus (exposure apparatus). The exposure device EX3 includes a polygon scanning unit PO1, PO2 from which a light beam for exposure from a light source device (not shown) is incident. The polygon scanning unit PO scans the intensity-adjusted spot light along a one-dimensional scanning line on the substrate P. The exposure device EX3 included in the substrate processing apparatus can irradiate the substrate P at a specific position with exposure light even without a cylindrical mask DM, and can draw a predetermined pattern.

The encoder read heads EN4 and EN5 on the second cylinder member 22 side of the exposure device EX3 read the scale GPd of the encoder scale disc SD mounted on the second cylinder member 22. The exposure device EX2 corrects the error of the scale GPd provided on the surface of the encoder scale disc SD according to the difference between the reading values of the encoder read heads EN4 and EN5. Therefore, the exposure device EX2 can process the substrate P on the curved surface of the second tube member 22 at a position in the circumferential direction of the second tube member 22 with a good accuracy.

As shown in FIG. 20 (and FIG. 19), the encoder read heads EN4 and EN5 on the side of the second cylinder member 22 are arranged corresponding to each of the two rows of alignment microscopes AMG1 and AMG2 in the circumferential direction. However, in the alignment microscopes AMG1 and AMG2, for example, only the alignment microscope AMG2 (and the corresponding encoder read head EN5) may be provided. Even in this case, it is better to set the encoder read head EN4. When only the alignment microscope AMG2 (and the corresponding encoder read head EN5) is configured, and the encoder read head EN4 cannot be set at a rotation angle α near it, the encoder read head EN1 corresponding to the exposure position can also be used , EN2, to make the error chart of the distance error and eccentricity of the scale GPd of the scale disc SD.

Further, compare at least one error chart of the distance between the scale GPd and the eccentricity obtained by using two encoder read heads EN4 and EN5, and the distance between the scales GPd obtained by using two encoder read heads EN1 and EN2. At least one error chart, such as error and eccentricity, to verify whether there is a large difference between the two error charts. When there is a difference greater than the allowable value, by making an error chart again and correcting it, the accuracy and reliability of the error chart can be improved. .

(Fourth modification of substrate processing apparatus (exposure apparatus))

FIG. 21 is a schematic diagram showing the overall configuration of a fourth modification of the substrate processing apparatus (exposure apparatus). The exposure apparatus EX4 is a so-called substrate processing apparatus that applies a near exposure to the substrate P. The exposure device EX4 sets the gap between the cylindrical mask DM and the second cylindrical member 22 to be extremely small, and the illumination mechanism IU directly irradiates the substrate P with the illumination beam EL1 to perform non-contact exposure. In the present embodiment, the second cylinder member 22 is rotated by a torque supplied from a second drive portion 36 including an actuator such as an electric motor. The first cylinder member 21 is driven by a driving roller MGG connected by a magnetic gear so as to rotate in a direction opposite to the rotation direction of the second driving portion 36. The second driving unit 36 rotates the second cylinder member 22 and rotates the driving roller MGG and the first cylinder member 21 so that the first cylinder member 21 (cylindrical mask DM) moves synchronously with the second cylinder member 22 (synchronous rotation) ).

In addition, the exposure device EX4 is provided with an encoder read head EN6 for detecting the position of the main beam of the imaging beam EL2 of the substrate P from the substrate P at the position PX6 of the scale GP at a specific position of the substrate P. Here, the diameter of the outer peripheral surface of the winding substrate P in the outer peripheral surface of the second cylindrical member 22 has been matched with the diameter of the scale GP of the encoder scale disc SD. Therefore, the position PX6 is from the second central axis AX2 Observe the same position as above. The encoder read head EN7 is set on the installation azimuth line Le7 that rotates the installation azimuth line Le6 of the encoder read head EN6 approximately 90 ° around the axis of the rotation center line AX2 toward the rear side of the substrate P in the conveying direction.

The exposure device EX4 has, for example, an encoder read head EN3 as a first reading section and an encoder read head EN7 as a second reading section. The encoder read heads EN3 and EN7 read the scale GPd of the encoder scale disc SD mounted on the second cylinder member 22. The control device 14 corrects the error of the scale GPd provided on the surface of the encoder scale disc SD according to the difference between the read values of the encoder read heads EN3 and EN7. Therefore, the exposure device EX4 can measure the position in the circumferential direction of the second cylindrical member 22 with good accuracy, and can process the substrate P on the curved surface of the second cylindrical member 22. The encoder read heads EN3 and EN7 can connect the line between the encoder read head EN3 and the second central axis AX2 (set the azimuth line Le3) and the line between the encoder read head EN7 and the second central axis AX2 (set the azimuth line Le7). The installation angle θs of the encoder sandwiched by) is set to less than 90 degrees, and preferably set to 45 degrees or less.

In the first embodiment to the fourth modification of the embodiment and the substrate processing apparatus (exposure apparatus), the exposure apparatus is exemplified as the substrate processing apparatus. However, the substrate processing device is not limited to an exposure device, and the processing unit may be a device that prints a pattern on the substrate P, which is an object to be processed, by an ink-jet ink drop device. The processing unit may be an inspection device.

In the previous description of the reading operation of the scale GP using the encoder heads EN4 and EN5 of FIGS. 7 and 8, it is assumed that a rising pulse U is output when the rising portion GPa of one scale of the scale GP is read. The falling pulse D is output when the falling portion GPb is taken, and the interval between two adjacent rising portions GPa or the interval between the adjacent falling portions GPb is set to the scale GP distance SS. However, the actual encoder measurement system, such as disclosed in Japanese Patent Application Laid-Open No. 9-196702, is a 2-phase signal (a sine wave signal with a 90-degree phase difference and a cosine wave) output from a signal generating section (encoder read head) (Signal) Interpolation circuits or comparators are used to generate the rising pulse U and the falling pulse D at intervals of one-tenth to one-tenth the interval between the actual size of the scale GP and SS.

Figure 22 is used to briefly explain the actual use of encoder read heads EN1 ~ EN7, EH1 ~ EH5 to scale GP (GPd, GPM) shown in each of Figures 4 to 6, Figure 10 and Figures 16 to 21. Read the signal waveform of the action. As shown in Figure 22, each of the encoder read heads EN1 ~ EN7, EH1 ~ EH5, has two measurement signals (here shown by rectangular waves) EcA, EcB with a 90-degree phase difference. The measurement signal EcA and EcB correspond to 1 / n of SS between the scale GP and the scale. Although n (integer) varies depending on the optical reading form in the encoder read head, it is set to any value such as a multiple of 1, 2, 4, 8, etc. In the general encoder measurement system, the scale disc SD rotates forward, and during the period when the scale GP is constantly moving in one direction relative to the encoder read head, the interpolation pulse signal EcU is continuously generated based on the measurement signals EcA and EcB. . When the scale disc SD rotates in the reverse direction, that is, from this time point, an interpolated falling pulse signal is continuously generated according to the measurement signals EcA and EcB.

In FIG. 22, a processing circuit that sends a rising pulse signal EcU (or a falling pulse signal EcD) that generates a pulse by dividing one cycle of the measurement signals EcA and EcB by eight divisions is used. As a reversible counter of the counter, when the rising pulse signal EcU is input, the pulse number is counted up one by one, and when the falling pulse signal EcD is input, the pulse number is counted down one by one. Here, for example, when one cycle of the measurement signals EcA and EcB corresponds to 1/8 of the actual size of the scale GP, the reversible counter moves forward on the scale surface of the scale disc SD (scale GP) by 1 pitch SS. During this period, it counts 64 pulse minutes of the rising pulse signal EcU. Therefore, when the distance between the scale GP and the SS is 20 μm, the plus value of the 1-pitch value of the reversible counter is 64, and the measurement resolution of the encoder measurement system (the movement amount of each pulse of the signal EcU) is 0.3125. μm (20 μm / 64). As described above, as the measurement resolution capability of the encoder measurement system, the actual size of the distance between the scale GP and the SS is interpolated and interpolated between the fraction and the tenth of a degree. Therefore, the distance SS The error can be obtained with the accuracy corresponding to the degree of interpolation.

In addition, when the perimeter distance (diameter × π) of the scale surface of the scale disc SD is a value obtained by dividing by a limited number of scales (the number of grids), the actual size of the actual distance between the scales GP and SS, There are also cases where the score is 20 μm. In contrast, the distance SS can be set in such a way that the resolution ability becomes an appropriate value (for example, 0.25 μm), and the scale surface can be divided by the distance SS so that the circumference of the scale surface of the scale disc SD can be divided within a predetermined accuracy. Of its diameter.

In addition, on the scale surface of the scale disc SD, etc., an origin mark is also engraved with the scale GP as the origin of one rotation of the scale disc SD. Each of the encoder read heads EN1 to EN7 should detect the origin. When the point is marked, the origin signal (pulse) EcZ is output at that instant. The reversible counter responds to the origin signal EcZ, resets the count value to 0, and continues to count the pulse number of the rising pulse signal EcU (or falling pulse signal EcD) again. Therefore, each of the reversible counters corresponding to each setting of the encoder read heads EN1 to EN7 is based on the instant of receiving the origin signal EcZ as the reference (0 point), and the number of pulses of the rising pulse signal EcU (or the falling pulse signal EcD) is performed. Addition (or subtraction).

In summary, for example, when the distance error between the scales GP is obtained from the difference between the measured values of the encoder read head EN4 and the encoder read head EN5, the scale disc SD (the second tube member 22) is shown in Figure 11 As illustrated in FIG. 13, at each rotation angle α, the difference between the count value of the reversible counter corresponding to the encoder read head EN4 and the count value of the reversible counter corresponding to the encoder read head EN5 may be calculated digitally. In addition, the angle α can be judged whether the count value of the reversible counter corresponding to any one of the encoder read head EN4 and the encoder read head EN5 (or other encoder read head can also be increased (or decreased) ) Corresponding to a certain value of the angle α to detect.

(Modification 1)

In the above embodiments and modifications, the scale GP constituting the encoder measurement system is engraved on a cylindrical outer peripheral surface of at least one of the scale disc SD as the rotating body and the second cylindrical member 22. However, the scale GP may be formed at a predetermined pitch along the circumferential direction on a side end surface perpendicular to the rotation center line AX2 of at least one of the scale disc SD and the second cylindrical member 22. FIG. 23 is a view of the configuration when a scale GP is formed on the side end surface of the scale disc SD in this manner, and is a view seen from a direction (Y-axis direction) extending from the rotation center line AX2 as in the previous FIG. 6, and FIG. 24 is a drawing The structure of 23 is a cross-sectional view taken along the line AA ′ of the plane including the azimuth line Le4 and the rotation center line AX2.

In FIG. 23, the ring-shaped ruler disc SD is attached with an adjusting member (screw) 60 at eight places on the side surface of the second tube member 22 side. The mounting angle β of the adjusting member (screw) 60 is 45 ° here. On the side parallel to the XZ plane of the scale disc SD, a scale GP with a certain distance SS and an origin mark Zs are formed on the circumference of the radius ra from the rotation center line AX2. The encoder read heads EN4 and EN5, as shown in FIG. 24, are arranged to face the Y-axis direction with a certain gap facing the scale GP. As shown in FIG. 23, the reading position RP4 of the encoder read head EN4 is set on the radius ra and on the azimuth line Le4. The reading position RP5 of the encoder read head EN5 is set on the radius ra and on the azimuth line Le5. The radius ra, as shown in FIG. 24, is the radius of the second cylindrical member 22 in close contact with the outer peripheral surface 22s of the support substrate P. Therefore, the maximum diameter of the ring scale disc SD is set slightly larger than the radius ra. As described above, by configuring the scale disc SD and the encoder read heads EN4 and EN5, the Abbe error during measurement can be minimized. For other encoder read heads (EN1 ~ EN3, EN6 ~ EN7) of the circular scale disc SD of Figs. 23 and 24, they are also configured the same as the read heads EN4 and EN5 to meet the Abbe condition of the measurement.

(Modification 2)

In the above embodiment and modification, in order to measure the distance error between the scales GP, the difference between the measured values of the two encoder reading heads (such as the encoder reading heads EN4 and EN5) arranged close to each other is The scale disc SD (the second tube member 22) is stored each time it rotates by an angle α (α <θs), and a graph is prepared based on the distance error between the entire circumference of the scale disc SD. In this case, in order to improve the accuracy of the chart, it is best to reduce the reading position of each of the two encoder reading heads (such as the encoder reading heads EN4 and EN5) on the scale surface (equivalent to RP4, RP5) The angle θs included is preferred. However, depending on the shape and size of the encoder read heads EN4 and EN5, or the angles between the azimuth lines Le4 and Le5 determined by the alignment of the microscopes AMG1 and AMG2, etc., the angle θs may not be sufficiently small in some cases. situation.

Therefore, in the second modification, for example, together with the two encoder read heads EN4 and EN5 used in the pitch error measurement in the previous embodiment, an encoder read head EN1 (or EN2) provided in the vicinity thereof is used. The measured values of each of the three or more encoder read heads further refine the pitch error graph. Fig. 25 is the same as the previous Fig. 6 and shows the arrangement of the scale disc SD (here a ring) and the encoder read heads EN1, EN2, EN4, and EN5 as seen in the XZ plane. A scale GP and an origin mark Zs are formed along the outer peripheral surface of the scale disc SD. The scale disc SD is fixed at 16 positions in the circumferential direction by an adjustment member (screw) 60 on the side end surface of the second cylindrical member 22. Therefore, the mounting angle β of the adjustment member (screw) 60 is 22.5 °.

As shown in Figure 25, the encoder read head EN1 that sets the reading position on the setting azimuth line Le1 corresponding to the exposure position of the odd number and the encoder reading that sets the reading position on the setting azimuth line Le2 corresponding to the exposure position of the even number The head EN2 is disposed in the XZ plane at an angle ± θ with respect to the center plane P3. In addition, the angle θs between the azimuth lines Le4 and Le5 through the reading positions of the encoder heads EN4 and EN5 is the relationship of θs> β. Furthermore, the angle between the setting azimuth line Le1 of the reading position of the encoder read head EN1 and the setting azimuth line Le4 of the reading position of the encoder read head EN4 is set to θq. In addition, set the count value of the reversible counter corresponding to each of the encoder read heads EN1, EN2, EN4, EN5 as Cm1, Cm2, Cm4, Cm5.

When the scale disc SD (second cylinder member 22) shown in FIG. 25 rotates clockwise in the XZ plane, the origin mark Zs formed on the scale surface of the scale disc SD will be read by the encoders EN4, EN5, and EN1. The sequence of EN2 traverses each reading position. Therefore, the moment the origin mark Zs crosses the reading position of the encoder read head EN4, the corresponding count value Cm4 of the reversible counter is reset to zero, and the moment the origin mark Zs crosses the read position of the encoder read head EN5. When the count value Cm5 corresponding to the reversible counter is reset to zero, the moment when the origin mark Zs crosses the reading position of the encoder read head EN1, the count value Cm1 corresponding to the reversible counter is reset to zero and the origin mark Zs is horizontal. The moment when the reading position of the encoder read head EN2 is passed, the count value Cm2 of the corresponding reversible counter is reset to zero. In the case where the scale disc SD rotates clockwise, all the four reversible counters are reset to zero after each count value Cm1, Cm2, Cm4, Cm5, and the relationship Cm2 <Cm1 <Cm5 <Cm4 is constant.

When using three encoder read heads EN1 (count value Cm1), EN4 (count value Cm4), and EN5 (count value Cm5) to determine the pitch error to create an error chart (correction chart), on the scale disc SD ( When the second cylinder member 22) rotates a certain angle α (α <β <θs), the measured value ΔMs related to the distance error per unit angle α is obtained by the following formula (1). Although this measurement value ΔMs is equivalent to the number NS of the scale GP shown previously in FIG. 11, it is actually a pulse count value of the rising pulse (or falling pulse) EcU shown in FIG. 22.

ΔMs = (Cm4 + Cm1) / 2-Cm5 ... Equation (1)

In this formula (1), the calculated value of (Cm4 + Cm1) / 2, as shown in Figure 25, represents the reading position set at the reading position RP4 of the encoder read head EN4 and the reading position of the encoder read head EN1. The azimuth line Lei of the imaginary angular position of the intermediate point of RP1 is set as the azimuth line Lei, and the count value that is expected to be obtained when the reading position RPi of the encoder read head is set. Therefore, the measured value ΔMs obtained by the formula (1) or the following (2) can be the count value Cmi (calculated value) at the reading position RPi of the imaginary encoder read head, and the encoder read head EN5 The difference between the count value Cm5 of the position RP5 is read. By calculating the measured value ΔMs at a unit angle α of 360 degrees, a distance error chart or a distance error correction chart of a scale (scale GP) such as a scale disk SD can be prepared.

In the configuration shown in FIG. 25, during the period between the origin mark Zs passing through the reading position RP4 of the encoder read head EN4 and the reading position RP1 of the encoder read head EN1, the count value Cm4 and the measured value Cm5 After resetting to zero, the continuity of the three counts Cm1, Cm4, and Cm5 may not be guaranteed. During this period, the magnitude relationship between the count values Cm1, Cm4, and Cm5 (absolute value) is Cm4 <Cm1 <Cm5, or Cm5 <Cm4 <Cm1. Therefore, during the period from reset to zero to the next reset to zero, the maximum count value (fixed value) counted by the reversible counter is set to Cmf, and each angle α is read to correspond to each encoder read head EN1 When the count values Cm1, Cm4, Cm5 of EN4, EN5, the origin mark Zs is located between the reading position RP4 of the encoder read head EN4 and the reading position RP5 of the encoder read head EN5, instead of the formula (1) The count value Cm4 can be used for the count value Cm4 of the up-down counter plus the new count value Cm4 'of the maximum count value Cmf. Similarly, when the origin mark Zs is located between the reading position RP5 of the encoder read head EN5 and the reading position RP1 of the encoder read head EN1, the count values Cm4 and Cm5 in Equation (1) are used instead of the counter value Each of the count values Cm4 and Cm5 is added to the new count values Cm4 'and Cm5' of the maximum count value Cmf.

In the case of the second modification, the first reading section includes two encoder read heads EN1 and EN4 (or one encoder read head EN5, and the second reading section includes one encoder read head EN5 (or two codes). (Read heads EN1 and EN4). In the above configuration, when the angle θs and the angle θq are set to an appropriate relationship, the angle between the imaginary reading position RPi and the reading position RP5 can be set to be a relatively adjusting member (screw) The installation angle β of 60 (22.5 ° in FIG. 25) is small, and the scale surface of the scale disc SD remaining after the adjustment of the true roundness, eccentricity, etc. of the adjustment member 60 is slightly deformed to cause a distance error (uneven spacing) ), And the span is measured in detail below the angle β.

In addition, as described above, in the method of setting the virtual reading position RPi on the scale surface, for example, the reading positions RP4, EN4 and EN1 of the two encoder reading heads EN4 and EN1 shown in FIG. 25 can also be set. The calculated count value obtained at the imaginary first reading position RPi at the intermediate point of RP1 and the imaginary second reading at the intermediate point set at the reading points RP5 and RP2 of the two encoder read heads EN5 and EN2 The difference between the calculated count values obtained at the positions RPi is taken to obtain the pitch error. The measured value ΔMs per unit angle α at this time is calculated by the following formula (2).

ΔMs = (Cm4 + Cm1) / 2- (Cm5 + Cm2) / 2 ... Formula (2)

(Element manufacturing method)

FIG. 26 is a flowchart showing a procedure of a device manufacturing method for manufacturing a device using the substrate processing apparatus (exposure device) of the embodiment. In this element manufacturing method, first, for example, a function and performance design of a display panel using a self-luminous element such as an organic EL is performed, and a required circuit pattern and wiring pattern are designed by CAD or the like (step S201). Next, a cylindrical mask DM of a desired layer is produced based on a pattern of one of various layers designed by CAD or the like (step S202). Further, a supply roll FR1 on which a flexible substrate P (resin film, metal foil film, plastic, etc.) as a base material for a display panel is wound is prepared (step S203). In addition, the roll-shaped substrate P prepared in this step S203 may be one whose surface has been modified as necessary, or which has been previously formed with an undercoat layer (for example, having minute irregularities formed by imprint), or laminated with light in advance. Inductive functional film or transparent film (insulating material).

Next, a backplane layer composed of electrodes and wirings constituting a display panel element, an insulating film, a TFT (thin-film semiconductor), and the like is formed on the substrate P, and self-emission such as an organic EL is formed by laminating the substrate. The light emitting layer (display pixel portion) of the element (step S204). This step S204 includes the conventional lithography process for exposing the photoresist layer using the exposure devices EX, EX2, EX3, and EX4 described in the foregoing embodiments, but it also includes coating the photoresist with a photosensitive silane coupling agent instead. After the substrate P pattern is exposed, a water-repellent pattern is formed on the surface, and a light-sensitive catalyst layer pattern is exposed to form a metal film pattern (wiring, electrode, etc.) by electroless plating. A process such as a printing process for drawing a pattern such as conductive ink of silver nano particles.

Next, each display panel element continuously manufactured on the long substrate P in a roll method is cut on the substrate P, and a protective film (for an environmental barrier layer) or a color filter sheet is bonded to the surface of each display panel element. And so on to assemble the components (step S205). Then, do the display panel components operate normally? Check whether the required performance and characteristics are satisfied (step S206). In the above manner, a display panel (flexible display) can be manufactured.

In the embodiment described above, although a light-transmitting reticle having a predetermined light-shielding pattern (or a phase pattern or a light-reduction pattern) formed on a light-transmitting substrate is used, it may be used instead of this reticle, for example, the United States According to the disclosure of Patent No. 6778257, according to the electronic data of the pattern to be exposed, a variable shaped reticle (also referred to as an electronic reticle, an active reticle, or a reticle) that forms a transmission pattern or a reflection pattern, or a luminescent pattern, or Image generator). In addition, instead of a variable-shaped reticle provided with a non-emission type image display element, a pattern forming device including a self-emission type image display element may be provided.

In addition, the exposure apparatus of the above-mentioned embodiment is assembled and manufactured in such a manner that various sub-systems including the constituent elements listed in the scope of the patent application for this application can maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various precisions, before and after the assembly of the exposure device, adjustments are made to achieve optical accuracy for various optical systems, adjustments are made to achieve mechanical accuracy for various mechanical systems, and electrical is achieved for various electrical systems. Adjustment of accuracy. The steps of assembling various sub-systems and assembling them in an exposure device include mechanical connections of various sub-systems, wiring connections of circuits, and piping connections of pneumatic circuits. Before the assembly of the various sub-systems to the assembly steps of the exposure device, of course, the individual assembly steps of each sub-system are included. After the assembly steps of assembling various sub-systems to the exposure device are completed, comprehensive adjustment is performed to ensure various accuracy of the entire exposure device. Moreover, it is desirable to manufacture the exposure device in a clean room in which temperature and cleanliness are controlled.

In addition, the constituent elements of the above embodiments can be appropriately combined. In addition, there are cases where some components are not used. In addition, substitution or modification of constituent elements may be made without departing from the scope of the present invention. In addition, to the extent permitted by law, all the publications of the exposure apparatus and the like cited in the above-mentioned embodiments and the descriptions of the US patent are referred to as a part of the description in this specification. As described above, other embodiments and application techniques made by the industry and the like based on the above embodiments are included in the scope of the present invention.

Claims (9)

A substrate processing device is used for conveying a long strip-shaped substrate having flexibility in a long direction and subjecting the aforementioned strip-shaped substrate to a predetermined treatment. The substrate processing device includes a rotating cylinder that is bent at a certain radius from a center line. The sheet-shaped substrate is supported on a cylindrical outer peripheral surface, and the sheet-shaped substrate is rotated around the centerline to carry the sheet-shaped substrate in a long direction; and the processing unit is supported on the sheet-shaped substrate by the peripheral surface of the rotating cylinder. The sheet-like substrate is treated at a specific position within the range of the circumferential direction; the scale scale is set in a ring shape along the circumferential direction rotated by the rotating cylinder, and is used to rotate around the centerline together with the rotating cylinder. The encoder measurement is performed on the position change of the sheet substrate in the circumferential direction; the first encoder read head is arranged in a manner to oppose the aforementioned scale in the first orientation in the circumferential direction, and read the aforementioned scale; The 2 encoder read head is arranged so as to be opposite to the scale in a second position rotated at an angle θq in the circumferential direction with respect to the first orientation, and reads the scale; the third encoder The head is arranged so as to be opposed to the scale in a third position which is rotated between the first position and the second position in the circumferential direction by an angle θs relative to the second position in the circumferential direction, and reads And the storage unit, wherein the first reading value based on the first encoder read head is set to Cm1, the second reading value based on the second encoder read head is set to Cm4, and When the third reading value of the third encoder read head is set to Cm5, the measured value ΔMs calculated by ΔMs = (Cm1 + Cm4) / 2-Cm5 is successively stored with each rotation of a certain angle α of the aforementioned scale scale. , And store error information about the distance between the entire circumference of the scale. For example, the substrate processing apparatus of the scope of application for a patent, wherein the second encoder read head, the first encoder 3 encoder read head, the first encoder read head; the first read value Cm1, the second read value Cm4, and the third read value Cm5 are set to a relationship of Cm1 <Cm5 <Cm4. For example, the substrate processing apparatus of the second scope of the patent application, wherein the certain angle α is set to α <θs with respect to the angle θs in the circumferential direction with respect to the second and third orientations. For example, the substrate processing apparatus of the third patent application range, wherein the aforementioned angle θs is set within 45 degrees; the aforementioned certain angle α is set to a value other than a factor of 360 degrees, a prime number relative to 360 degrees, and 360 degrees / α The value is a value that is divisible by 1 to 4 digits below the decimal point. For example, the substrate processing apparatus according to any one of claims 1 to 4, wherein the first position of the first encoder read head is configured to be set in a circumferential direction with the specific position processed by the processing unit. The above orientation is the same; and further includes a correction section that, when the sheet substrate is processed by the processing section, corrects the first section of the first encoder read head based on the error information stored in the storage section. The value after reading 1 is output as the conveying position or conveying amount of the sheet substrate in the long direction. For example, the substrate processing apparatus of the scope of application for patents 1 or 2, wherein the scale scale is fixed coaxially with the center line at the end of at least one of the rotating cylinders extending in the direction of the center line, and is engraved with the The outer periphery of the scale disc that rotates together with the rotating cylinder. For example, the substrate processing apparatus of the sixth scope of the patent application, in order to fix the ruler disc to the end of the rotating cylinder, a plurality of numbers arranged at predetermined installation angles β in the circumferential direction of the ruler disc are provided. A solid structural member; the aforementioned installation angle β, the certain angle α, and the angle θs are set in a relationship of α <β <θs. For example, the substrate processing device according to any one of claims 2 to 4, wherein the aforementioned scale includes an origin mark provided at one point in the entire cycle; and further includes: a first counter for reading the aforementioned first The value Cm1 is output, and the first read value Cm1 is reset to zero at the moment when the first encoder read head detects the origin mark; the second counter outputs the second read value Cm4, and the The moment when the encoder read head detects the origin mark, the second read value Cm4 is reset to zero; and the third counter outputs the third read value Cm5, and is detected by the third encoder read head. At the moment of the origin mark, the third read value Cm5 is reset to zero. For example, the substrate processing apparatus of the eighth patent application range, wherein when the maximum count value of each of the three aforementioned counters is set to Cmf during the rotation of one of the aforementioned ruler scales, the aforementioned origin mark is located at the aforementioned second code When the read position of the encoder read head and the read position of the third encoder read head are used, the count value obtained by adding the aforementioned maximum count value Cmf to the aforementioned second read value Cm4 output by the aforementioned second counter is used. The value Cm4 'is calculated by ΔMs = (Cm1 + Cm4') / 2-Cm5, and the origin mark is located at the reading position of the reading head of the third encoder and the reading of the reading head of the first encoder When taking the position, use the count value Cm5 'and the count value Cm4' after adding the aforementioned maximum count value Cmf to the aforementioned third reading value Cm5 output by the aforementioned third counter, with ΔMs = (Cm1 + Cm4 ') / 2-Cm5' calculates the aforementioned measurement value ΔMs.