TW201604935A - Cylindrical-member-position detection device, substrate processing device, device manufacturing method, and sheet substrate conveying device - Google Patents

Cylindrical-member-position detection device, substrate processing device, device manufacturing method, and sheet substrate conveying device Download PDF

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TW201604935A
TW201604935A TW104123905A TW104123905A TW201604935A TW 201604935 A TW201604935 A TW 201604935A TW 104123905 A TW104123905 A TW 104123905A TW 104123905 A TW104123905 A TW 104123905A TW 201604935 A TW201604935 A TW 201604935A
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Taiwan
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scale
encoder
substrate
reading
cylindrical member
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TW104123905A
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Chinese (zh)
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TWI649784B (en
Inventor
堀正和
鬼頭義昭
鈴木智也
渡邊智行
林田洋祐
加藤正紀
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尼康股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/244Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/36Forming the light into pulses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Advancing Webs (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

A cylindrical-member-position detection device is provided with: a second drum member (22); a plurality of scale increments (GP) that are disposed annularly along the direction of the rotation of the second drum member (22), rotate around a second central axis (AX2) together with the second drum member (22), and are for measuring positional variation of the second drum member (22) in the circumferential direction; an encoder head (EN4), which is for reading the scale increments (GP); and an encoder head (EN5), which is disposed in a different position than encoder head (EN4) and is for reading the scale increments (GP). Further, the cylindrical-member-position detection device corrects error in the scale increments (GP) on the basis of the value read by encoder head (EN4) and the value read by encoder head (EN5).

Description

圓筒構件之位置檢測裝置、基板處理裝置及元件製造方法及片狀基板之搬送裝置 Position detecting device for cylindrical member, substrate processing device, component manufacturing method, and sheet substrate transfer device

本發明係關於圓筒構件之位置檢測裝置、基板處理裝置及元件製造方法及片狀基板之搬送裝置。 The present invention relates to a position detecting device for a cylindrical member, a substrate processing device, a device manufacturing method, and a sheet substrate transfer device.

於微影製程所使用之曝光裝置中,有一種如下述專利文獻所揭露之、使用圓筒狀或圓柱狀光罩使基板曝光之曝光裝置(例如,專利文獻1)。 Among the exposure apparatuses used in the lithography process, there is an exposure apparatus which exposes a substrate using a cylindrical or cylindrical mask as disclosed in the following patent document (for example, Patent Document 1).

不僅是在使用板狀光罩之情形,在使用圓筒狀或圓柱狀光罩使基板曝光之情形時,為了將光罩圖案之像良好的投影曝光於基板,專利文獻1中,記載了於圓筒狀光罩之圖案形成面之既定區域,相對圖案以既定位置關係形成位置資訊取得用標記(標尺、對準標記等),以編碼器系統檢測標尺,據以取得圖案在圖案形成面之周方向(或旋轉軸方向)之位置資訊的構成。 In the case where a plate-shaped reticle is used, when a substrate is exposed by using a cylindrical or cylindrical reticle, in order to expose the image of the reticle pattern to the substrate, Patent Document 1 describes a predetermined area of the pattern forming surface of the cylindrical mask, the position pattern is formed with a position information acquisition mark (scale, alignment mark, etc.) in a predetermined position relationship, and the encoder system detects the scale to obtain a pattern on the pattern forming surface. The composition of the position information in the circumferential direction (or the direction of the rotation axis).

此外,亦提出一種為使用圓筒狀光罩於可撓性之長條片狀基板連續的曝光,而將長條片狀基板捲繞於進料滾筒加以支承,使圓筒光罩接近捲繞在該進料滾筒之片狀基板,並藉由使進料滾筒與圓筒光罩旋轉,而能製造高量產性之元件(曝光處理)的曝光裝置(例如,參照專利文獻2)。 In addition, it is also proposed to continuously expose the long strip-shaped substrate by using a cylindrical mask on a flexible long strip-shaped substrate, and to wind the long sheet-like substrate around the feed roller to make the cylindrical mask close to winding. An exposure apparatus capable of producing a high-productivity element (exposure treatment) by rotating the feed roller and the cylindrical mask on the sheet substrate of the feed roller (for example, see Patent Document 2).

先行技術文獻Advanced technical literature

[專利文獻1]日本特開平7-153672號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 7-153672

[專利文獻2]日本特開平8-213305號公報 [Patent Document 2] Japanese Patent Laid-Open No. Hei 8-213305

上述對位在進料滾筒等圓筒構件之曲面之被處理物體(片狀基板)施以處理的處理裝置,被要求能以良好精度檢測在圓筒構件周方向之位置。如專利文獻1之揭示,即使是在圓筒狀光罩之外周面刻設位置資訊取得用標記(標尺)之情形下,亦有可能因標尺之刻度之製造誤差或温度引起之伸縮等使得編碼器測量之結果產生誤差,使圓筒構件於周方向之位置檢測精度降低。 The processing device for treating the object to be processed (sheet substrate) having a curved surface of a cylindrical member such as a feed roller is required to be able to detect the position in the circumferential direction of the cylindrical member with good precision. As disclosed in Patent Document 1, even in the case where the position information acquisition mark (scale) is engraved on the circumferential surface of the cylindrical mask, there is a possibility that the coding is caused by the manufacturing error of the scale of the scale or the expansion and contraction caused by the temperature. The result of the measurement of the device causes an error, and the position detection accuracy of the cylindrical member in the circumferential direction is lowered.

本發明之目的,係在檢測圓筒構件於周方向之位置時,修正位置檢測用刻度產生之誤差。 An object of the present invention is to correct an error caused by a scale for position detection when detecting a position of a cylindrical member in a circumferential direction.

本發明第1態樣,提供一種圓筒構件之位置檢測裝置,其包含:圓筒構件,具有從既定軸以一定半徑彎曲之曲面,以該既定軸為中心旋轉;複數之刻度,沿該圓筒構件旋轉之方向排列成環狀,且與該圓筒構件一起繞該軸周圍旋轉,用以測量至少於該曲面之周方向之位置變化;第1讀取部,與該刻度對向配置,用以讀取該刻度;第2讀取部,與該刻度對向、且於該圓筒構件之周方向配置在與該第1讀取部相異之位置,用以讀取該刻度;以及修正部,根據該第1讀取部之讀取值與該第2讀取部之讀取值,修正從該第1讀取部之讀取值求出之該複數刻度之間隔與從該第2 讀取部之讀取值求出之該複數刻度之間隔中之至少一方。 According to a first aspect of the present invention, a position detecting device for a cylindrical member includes: a cylindrical member having a curved surface curved at a constant radius from a predetermined axis, rotating about the predetermined axis; a plurality of scales along the circle The tubular member is arranged in a ring shape in a ring shape, and rotates around the shaft together with the cylindrical member to measure a positional change in at least a circumferential direction of the curved surface; the first reading portion is disposed opposite to the scale. The second reading unit is disposed opposite to the scale and disposed at a position different from the first reading unit in a circumferential direction of the cylindrical member for reading the scale; and The correction unit corrects the interval between the complex scale obtained from the read value of the first reading unit based on the read value of the first reading unit and the read value of the second reading unit 2 At least one of the intervals of the complex scale obtained by the read value of the reading unit.

本發明第2態樣,提供一種基板處理裝置,其包含上述圓筒構件之位置檢測裝置;該圓筒構件,係於該曲面捲繞基板之一部分並繞該軸旋轉據以搬送該基板;並具有在卷繞於該曲面之該基板之一部分中、於該曲面之周方向的特定位置對該基板施以既定處理之處理部。 According to a second aspect of the present invention, there is provided a substrate processing apparatus comprising: the position detecting device for the cylindrical member; the cylindrical member being attached to a portion of the curved-wound substrate and rotating around the shaft to carry the substrate; A processing unit that applies a predetermined process to the substrate at a specific position in a circumferential direction of the curved surface in a portion of the substrate wound around the curved surface.

本發明第3態樣,提供一種元件製造方法,係使用上述基板處理裝置於該基板形成該圖案。 According to a third aspect of the present invention, a method of manufacturing a device for forming the pattern on the substrate by using the substrate processing apparatus is provided.

本發明第4態樣,提供一種片狀基板之搬送裝置,係將可撓曲之長條片狀基板在以繞既定旋轉中心軸旋轉之圓筒構件外周面加以支承之同時,往該長條方向搬送,其具備:標尺部,沿該圓筒構件旋轉之方向排列成環狀、且與該圓筒構件一起繞該旋轉中心軸旋轉,於全周刻設有用以至少測量在該外周面周方向之位置變化的複數個刻度;第1讀取部,與該刻度對向配置,用以讀取該刻度;第2讀取部,與該刻度對向、且於該圓筒構件之周方向配置在與該第1讀取部不同之角度位置,用以讀取該刻度;記憶部,將該第1讀取部之該刻度之讀取值與該第2讀取部之該刻度之讀取值的差於該標尺部之每既定旋轉角度予以逐次儲存,根據該差,儲存就該標尺部全周之與該刻度之間距誤差相關之誤差資訊;以及修正部,將根據該誤差資訊修正該第1讀取部之該刻度之讀取值與該第2讀取部之該刻度之讀取值中至少一方之值,作為該片狀基板於該長條方向之搬送位置或搬送量加以輸出。 According to a fourth aspect of the present invention, there is provided a sheet-like substrate conveying apparatus which supports a flexible long sheet-like substrate while supporting an outer peripheral surface of a cylindrical member which is rotated about a predetermined central axis of rotation In the directional direction, the scale portion is arranged in a ring shape along a direction in which the cylindrical member rotates, and rotates around the central axis of rotation together with the cylindrical member, and is provided at all circumferences to at least measure the circumference of the outer peripheral surface a plurality of scales in which the position of the direction changes; the first reading unit is disposed opposite to the scale for reading the scale; and the second reading unit is opposed to the scale and in a circumferential direction of the cylindrical member Arranging at an angular position different from the first reading unit for reading the scale; and the memory unit reading the scale of the first reading unit and the scale of the second reading unit The value difference is successively stored for each predetermined rotation angle of the scale portion, and according to the difference, the error information related to the error between the scale portion and the scale is stored; and the correction portion is corrected according to the error information. The reading value of the scale of the first reading unit The value of at least one of the read values of the scale of the second reading unit is output as the transport position or the transport amount of the sheet substrate in the longitudinal direction.

本發明第5態樣,提供一種片狀基板之搬送裝置,係將具有可撓性之長條片狀基板以繞既定旋轉中心軸旋轉之圓筒構件外周面加以支 承,往該長條方向搬送,其具備:標尺部,具有沿著距該圓筒構件中心軸一定半徑之圓周、於該圓筒構件之旋轉方向以既定間距形成之刻度,與該圓筒構件一起繞該中心軸旋轉;第1讀取部,用以在該標尺部周方向之第1位置讀取該標尺部之刻度隨著該圓筒構件旋轉之位置變化;第2讀取部,用以在該標尺部周方向與該第1位置分離角度θs之第2位置讀取該標尺部之刻度隨著該圓筒構件旋轉之位置變化;以及圖表作成部,係在該圓筒構件每旋轉與該角度θs相異之角度α時,以該第1讀取部與該第2讀取部各個之讀取所測量之該刻度之位置資訊之各個,在使該圓筒構件旋轉1次以上之複數次旋轉之期間逐次的求出,以作成與該標尺部之該刻度之間距誤差相關之圖表。 According to a fifth aspect of the present invention, there is provided a sheet-like substrate conveying apparatus which supports a flexible sheet-like substrate with an outer peripheral surface of a cylindrical member which is rotated about a predetermined central axis of rotation. Carrying, in the direction of the strip, comprising: a scale portion having a scale formed at a predetermined pitch in a rotation direction of the cylindrical member along a circumference of a radius of a central axis of the cylindrical member, and the cylindrical member Rotating around the central axis; the first reading unit is configured to read the scale of the scale portion at a first position in the circumferential direction of the scale portion as the position of the cylindrical member rotates; and the second reading unit The scale of the scale portion is read at a second position separated by the angle θs from the first position in the circumferential direction of the scale portion, and the position of the cylindrical member is rotated; and the chart forming portion is rotated every time the cylindrical member is rotated. When the angle α is different from the angle θs, the cylindrical member is rotated once or more by the position information of the scale measured by the reading of each of the first reading unit and the second reading unit. The period of the plurality of rotations is successively determined to obtain a graph relating to the error between the scales of the scale portion.

根據本發明之態樣,可在檢測圓筒構件於周方向之位置時,修正位置檢測用刻度所產生之誤差。 According to the aspect of the invention, the error generated by the position detecting scale can be corrected when the position of the cylindrical member in the circumferential direction is detected.

9‧‧‧搬送裝置 9‧‧‧Transporting device

11‧‧‧基板處理裝置 11‧‧‧Substrate processing unit

12‧‧‧光罩保持裝置 12‧‧‧Photomask holder

13‧‧‧光源裝置 13‧‧‧Light source device

14‧‧‧控制裝置 14‧‧‧Control device

21‧‧‧第1筒構件 21‧‧‧1st tubular member

22‧‧‧第2筒構件 22‧‧‧2nd tubular member

23‧‧‧導引輥 23‧‧‧ Guide roller

24‧‧‧驅動輥 24‧‧‧Drive roller

25‧‧‧第1檢測器 25‧‧‧1st detector

26‧‧‧第1驅動部 26‧‧‧First Drive Department

31‧‧‧第1導引構件 31‧‧‧1st guiding member

33‧‧‧第2導引構件 33‧‧‧2nd guiding member

35‧‧‧第2檢測器 35‧‧‧2nd detector

36‧‧‧第2驅動部 36‧‧‧2nd drive department

41‧‧‧第1光學系 41‧‧‧1st Optical Department

42‧‧‧第2光學系 42‧‧‧2nd Optical Department

43‧‧‧第1視野光闌 43‧‧‧1st field of view

44‧‧‧焦點修正光學構件 44‧‧‧Focus correction optical components

45‧‧‧像偏移修正光學構件 45‧‧‧Image offset correction optical components

46‧‧‧旋轉修正機構 46‧‧‧Rotary correction mechanism

47‧‧‧倍率修正用光學構件 47‧‧‧ magnification correction optical components

50‧‧‧第1偏向構件 50‧‧‧1st deflecting member

51‧‧‧第1透鏡群 51‧‧‧1st lens group

52‧‧‧第1凹面鏡 52‧‧‧1st concave mirror

57‧‧‧第2偏向構件 57‧‧‧2nd deflecting member

58‧‧‧第2透鏡群 58‧‧‧2nd lens group

59‧‧‧第2凹面鏡 59‧‧‧2nd concave mirror

60‧‧‧調整構件 60‧‧‧Adjustment components

61‧‧‧螺絲部 61‧‧‧ Screw Department

62‧‧‧頭部 62‧‧‧ head

AM1、AM2‧‧‧觀察方位線 AM1, AM2‧‧‧ observation of the bearing line

AMG1、AMG2‧‧‧對準顯微鏡 AMG1, AMG2‧‧‧ alignment microscope

AX1‧‧‧旋轉中心線(第1中心軸) AX1‧‧‧Rotation centerline (1st central axis)

AX2‧‧‧旋轉中心線(第2中心軸) AX2‧‧‧Rotation centerline (2nd central axis)

Cs‧‧‧真圓度調整機構 Cs‧‧‧ roundness adjustment mechanism

Dc‧‧‧槽 Dc‧‧‧ slot

DM‧‧‧圓筒光罩 DM‧‧‧Cylinder reticle

EN、EN1、EN2、EN3、EN4、EN5、EH1、EH2、EH3、EH4、EH5‧‧‧編碼器讀頭 EN, EN1, EN2, EN3, EN4, EN5, EH1, EH2, EH3, EH4, EH5‧‧‧ encoder read head

EX、EX1、EX2、EX3、EX4‧‧‧曝光裝置 EX, EX1, EX2, EX3, EX4‧‧‧ exposure devices

GP、GPd、GPM、GPm‧‧‧標尺 GP, GPd, GPM, GPM‧‧ ‧ ruler

IA‧‧‧片材進入區域 IA‧‧ ‧ sheet entry area

IL‧‧‧照明模組 IL‧‧‧Lighting Module

IR1~IR6‧‧‧照明區域 IR1~IR6‧‧‧Lighting area

Le1、Le2、Le3、Le4、Le5‧‧‧設置方位線 Le1, Le2, Le3, Le4, Le5‧‧‧ set the bearing line

NS‧‧‧測量標尺數 NS‧‧‧Measurement ruler number

OA‧‧‧片材脫離區域 OA‧‧ ‧ sheet detachment area

P‧‧‧基板 P‧‧‧Substrate

P3‧‧‧中心面 P3‧‧‧ center face

PA1~PA6‧‧‧投影區域 PA1~PA6‧‧‧projection area

PL‧‧‧投影光學系 PL‧‧‧Projection Optics

SB‧‧‧軸承構件 SB‧‧‧ bearing components

Sc‧‧‧槽 Sc‧‧ slot

SD‧‧‧編碼器標尺圓盤 SD‧‧‧Encoder scale disc

SP1、SP2‧‧‧偏光分束器 SP1, SP2‧‧‧ polarizing beam splitter

ST‧‧‧旋轉軸 ST‧‧‧Rotary axis

TBc‧‧‧修正圖表 TBc‧‧‧Revision chart

圖1係顯示實施形態之基板處理裝置(曝光裝置)之整體構成的示意圖。 Fig. 1 is a schematic view showing the overall configuration of a substrate processing apparatus (exposure apparatus) according to an embodiment.

圖2係顯示圖1中之照明區域及投影區域之配置的示意圖。 2 is a schematic view showing the arrangement of the illumination area and the projection area in FIG. 1.

圖3係顯示適用於圖1之基板處理裝置(曝光裝置)之投影光學系之構成的示意圖。 Fig. 3 is a schematic view showing the configuration of a projection optical system applied to the substrate processing apparatus (exposure apparatus) of Fig. 1.

圖4係顯示適用於圖1之基板處理裝置(曝光裝置)之第2筒構件(旋轉筒)的立體圖。 4 is a perspective view showing a second tubular member (rotating cylinder) applied to the substrate processing apparatus (exposure apparatus) of FIG. 1.

圖5係用以說明適用於圖1之基板處理裝置(曝光裝置)之檢測器與讀取裝置之關係的立體圖。 Fig. 5 is a perspective view for explaining a relationship between a detector and a reading device which are applied to the substrate processing apparatus (exposure apparatus) of Fig. 1.

圖6係在與旋轉中心線正交之面內所見之實施形態之編碼器標尺圓盤與讀取裝置之位置的說明圖。 Fig. 6 is an explanatory view showing the position of the encoder scale disk and the reading device of the embodiment seen in a plane orthogonal to the rotation center line.

圖7係以示意方式顯示標尺之刻度的放大圖。 Figure 7 is an enlarged view showing the scale of the scale in a schematic manner.

圖8係顯示標尺與編碼器讀頭之位置關係的示意圖。 Figure 8 is a schematic diagram showing the positional relationship between the scale and the encoder read head.

圖9係顯示修正標尺之刻度間距誤差之順序的流程圖。 Figure 9 is a flow chart showing the sequence of correcting the scale pitch error of the scale.

圖10係顯示外周面具有刻度之標尺圓盤與編碼器讀頭之關係的圖。 Fig. 10 is a view showing the relationship between the scale disk having the scale on the outer peripheral surface and the encoder read head.

圖11係顯示修正圖表(map)之一例的圖。 Fig. 11 is a view showing an example of a correction map.

圖12係顯示從一對編碼器讀頭取得此等之讀取值時之時序的概念圖。 Figure 12 is a conceptual diagram showing the timing of obtaining such read values from a pair of encoder read heads.

圖13係顯示從一對編碼器讀頭取得此等之讀取值時之時序的概念圖。 Figure 13 is a conceptual diagram showing the timing of obtaining such read values from a pair of encoder read heads.

圖14係顯示修正標尺誤差之順序的流程圖。 Figure 14 is a flow chart showing the sequence of correcting the scale error.

圖15係用以說明調整編碼器標尺圓盤之真圓度之真圓度調整機構的說明圖。 Fig. 15 is an explanatory view for explaining a true roundness adjustment mechanism for adjusting the roundness of the encoder scale disk.

圖16係用以說明調整編碼器標尺圓盤之真圓度之真圓度調整機構的說明圖。 Fig. 16 is an explanatory view for explaining a true roundness adjustment mechanism for adjusting the roundness of the encoder scale disk.

圖17係顯示基板處理裝置(曝光裝置)之第1變形例的示意圖。 Fig. 17 is a schematic view showing a first modification of the substrate processing apparatus (exposure apparatus).

圖18係基板處理裝置(曝光裝置)之第1變形例之編碼器標尺圓盤從旋轉中心線方向所見之用以說明讀取裝置之位置的說明圖。 Fig. 18 is an explanatory view for explaining the position of the reading device as seen from the direction of the center line of rotation of the encoder scale disk of the first modification of the substrate processing apparatus (exposure apparatus).

圖19係顯示基板處理裝置(曝光裝置)之第2變形例之整體構成的示意圖。 Fig. 19 is a schematic view showing the overall configuration of a second modification of the substrate processing apparatus (exposure apparatus).

圖20係顯示基板處理裝置(曝光裝置)之第3變形例之整體構成的示 意圖。 20 is a view showing the overall configuration of a third modification of the substrate processing apparatus (exposure apparatus). intention.

圖21係顯示基板處理裝置(曝光裝置)之第變形例之整體構成的示意圖。 Fig. 21 is a schematic view showing the overall configuration of a modification of the substrate processing apparatus (exposure apparatus).

圖22係用以簡單說明先前之圖4~6、圖10及圖16~21之各個中所示之使用編碼器讀頭之刻度之實際讀取動作的訊號波形圖。 Fig. 22 is a signal waveform diagram for explaining the actual reading operation using the scale of the encoder read head shown in each of Figs. 4 to 6, 10, and 16 to 21, respectively.

圖23係於標尺圓盤之側端面形成刻度之情形時之構成,與先前之圖6同樣的從旋轉中心線延伸方向所見的圖。 Fig. 23 is a view showing a configuration in which the side end faces of the scale disc are formed with a scale, and the same as Fig. 6 is seen from the direction in which the center line of rotation extends.

圖24係圖23之構成從包含設置方位線與旋轉中心線之面剖開之A-A’線剖面圖。 Figure 24 is a cross-sectional view taken along line A-A' of the configuration of Figure 23 taken along the plane including the orientation line and the center line of rotation.

圖25係與先前之圖6同樣的,從XZ面內所見之標尺圓盤與編碼器讀頭之配置的圖。 Figure 25 is a view similar to the prior Figure 6 showing the arrangement of the scale disc and the encoder read head seen from the XZ plane.

圖26係顯示使用實施形態之基板處理裝置(曝光裝置)製造元件之元件製造方法之順序的流程圖。 Fig. 26 is a flow chart showing the procedure of a method of manufacturing an element using the substrate processing apparatus (exposure apparatus) of the embodiment.

參照圖面詳細說明用以實施本發明之形態(實施形態)。本發明不受以下記載之實施形態之限定。以下實施形態中,係以用來製造一種類之元件之各種處理,對基板連續實施之所謂的卷對卷(Roll to Roll)方式之曝光裝置進行說明。又,以下,係設定一XYZ正交座標系,一邊參照此XYZ正交座標系、一邊說明各部之位置關係。舉一例而言,設水平面內之既定方向為X軸方向、於水平面內與X軸方向正交之方向為Y軸方向、與X軸方向及Y軸方向之各個正交之方向(亦即鉛直方向)為Z軸方向。 The embodiment (embodiment) for carrying out the invention will be described in detail with reference to the drawings. The present invention is not limited by the embodiments described below. In the following embodiments, a so-called roll-to-roll exposure apparatus in which a substrate is continuously manufactured by various processes for manufacturing one type of element will be described. Further, hereinafter, an XYZ orthogonal coordinate system is set, and the positional relationship of each unit will be described with reference to the XYZ orthogonal coordinate system. For example, the predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction (ie, vertical) Direction) is the Z-axis direction.

圖1係顯示實施形態之基板處理裝置(曝光裝置)之整體構 成的示意圖。圖2係顯示圖1之照明區域及投影區域之配置的示意圖。圖3係顯示適用於圖1之基板處理裝置(曝光裝置)之投影光學系之構成的示意圖。如圖1所示,基板處理裝置11,包含曝光裝置(處理部)EX、與片狀基板之搬送裝置(以下,適當的稱搬送裝置)9。曝光裝置EX,係以搬送裝置9供應基板P(片、薄膜等)。例如,有一種從未圖示之供應卷拉出之可撓性(flexible)長條片狀基板P,依序,經前製程用之基板處理裝置後,以基板處理裝置(曝光裝置)11加以處理,藉搬送裝置9送出至後製程用之基板處理裝置後,捲繞至回收卷之元件製造系統。如以上所述,基板處理裝置11可用作為元件製造系統(可撓性顯示器之製造線)之一部分。 1 is a view showing the overall structure of a substrate processing apparatus (exposure apparatus) of an embodiment; A schematic diagram of the formation. 2 is a schematic view showing the arrangement of the illumination area and the projection area of FIG. 1. Fig. 3 is a schematic view showing the configuration of a projection optical system applied to the substrate processing apparatus (exposure apparatus) of Fig. 1. As shown in FIG. 1, the substrate processing apparatus 11 includes an exposure apparatus (processing unit) EX and a sheet-like substrate transport apparatus (hereinafter, referred to as a transport apparatus). In the exposure apparatus EX, the substrate P (sheet, film, or the like) is supplied by the transport device 9. For example, there is a flexible long sheet-like substrate P which is pulled out from a supply roll (not shown), and sequentially subjected to a substrate processing apparatus for a pre-process, and then a substrate processing apparatus (exposure apparatus) 11 The processing is carried out by the transfer device 9 to the substrate processing apparatus for the post-process, and then wound up to the component manufacturing system of the recovery roll. As described above, the substrate processing apparatus 11 can be used as part of a component manufacturing system (manufacturing line of a flexible display).

作為基板處理裝置11之曝光裝置EX,係所謂的掃描曝光裝置,一邊同步驅動圓筒光罩DM之旋轉與可撓性基板P之搬送、一邊將形成在圓筒光罩DM之圖案之像透過投影倍率為等倍(×1)之投影光學系PL(PL1~PL6)投影於基板P。又,圖1所示之曝光裝置EX,係將XYZ正交座標系之Y軸設定為與構成圓筒光罩DM之第1筒(drum)構件21之旋轉中心線AX1平行。同樣的,將基板P之長條方向之一部分支承為圓筒狀之作為圓筒構件之第2筒構件22之旋轉中心線AX2,則係設定為與XYZ正交座標系之Y軸平行。 The exposure apparatus EX of the substrate processing apparatus 11 is a so-called scanning exposure apparatus that transmits the image of the pattern formed in the cylindrical mask DM while synchronously driving the rotation of the cylindrical mask DM and the conveyance of the flexible substrate P. The projection optical system PL (PL1 to PL6) whose projection magnification is equal to (×1) is projected on the substrate P. Further, in the exposure apparatus EX shown in Fig. 1, the Y-axis of the XYZ orthogonal coordinate system is set to be parallel to the rotation center line AX1 of the first drum member 21 constituting the cylindrical mask DM. Similarly, the rotation center line AX2 of the second tubular member 22, which is a cylindrical member of the cylindrical member, is supported in a one-to-one direction in the longitudinal direction of the substrate P, and is set to be parallel to the Y-axis of the XYZ orthogonal coordinate system.

如圖1所示,曝光裝置EX,具備光罩保持裝置12、照明機構IU、投影光學系PL及控制裝置14。曝光裝置EX,使被保持在光罩保持裝置12之圓筒光罩DM旋轉移動(旋動移動)、並以搬送裝置9搬送基板P。照明機構IU,將被保持在光罩保持裝置12之圓筒光罩DM之一部分(照明區域IR),藉照明光束EL1以均一之亮度加以照明。投影光學系PL,將圓 筒光罩DM之在照明區域IR之圖案之像,投影至以搬送裝置9搬送之基板P之一部分(投影區域PA)。隨著圓筒光罩DM之移動,配置於照明區域IR之圓筒光罩DM上之部位變化。此外,隨著基板P之移動,配置於投影區域PA之基板P上之部位變化。藉此方式,形成在圓筒光罩DM表面之既定圖案(光罩圖案)之像即透過投影光學系PL(PL1~PL6)被投影至基板P之圓筒狀表面。控制裝置14控制曝光裝置EX之各部,使各部執行處理。又,本實施形態中,控制裝置14係控制搬送裝置9。 As shown in FIG. 1, the exposure apparatus EX includes a mask holding device 12, an illumination unit IU, a projection optical system PL, and a control device 14. In the exposure device EX, the cylindrical mask DM held by the mask holding device 12 is rotationally moved (swiveled), and the substrate P is transported by the transport device 9. The illumination mechanism IU will be held in a portion (illumination area IR) of the cylindrical mask DM of the mask holding device 12, and illuminated by the illumination beam EL1 with uniform brightness. Projection optics PL, round The image of the pattern of the illumination mask IR in the cylindrical mask DM is projected onto one of the substrates P (projection area PA) transported by the transport device 9. As the cylindrical mask DM moves, the portion disposed on the cylindrical mask DM of the illumination region IR changes. Further, as the substrate P moves, the portion disposed on the substrate P of the projection area PA changes. In this manner, the image of the predetermined pattern (mask pattern) formed on the surface of the cylindrical mask DM is projected onto the cylindrical surface of the substrate P through the projection optical system PL (PL1 to PL6). The control device 14 controls each unit of the exposure device EX so that each unit performs processing. Further, in the present embodiment, the control device 14 controls the transport device 9.

控制裝置14,可以是統籌控制上述元件製造系統之複數個基板處理裝置之上位控制裝置的一部分或全部。又,控制裝置14,亦可以是受上位控制裝置控制、且與上位控制裝置不同之另一裝置。控制裝置14,、例如包含電腦系統。電腦系統,例如包含CPU(Central Processing Unit)、各種記憶體及OS(Operating System)及周邊機器等之硬體。基板處理裝置11之各部之動作程序及參數等,以電腦程式之形式儲存在電腦可讀取之記錄媒體,由電腦系統讀出並執行此程式,據以進行各種處理。 The control device 14 may be a part or all of the plurality of substrate processing device upper control devices that collectively control the component manufacturing system. Further, the control device 14 may be another device that is controlled by the higher-level control device and that is different from the higher-level control device. The control device 14, for example, includes a computer system. The computer system includes hardware such as a CPU (Central Processing Unit), various memories, an OS (Operating System), and peripheral devices. The operation program and parameters of each unit of the substrate processing apparatus 11 are stored in a computer-readable recording medium in the form of a computer program, and the program is read and executed by the computer system to perform various processes.

在電腦系統係可連接於網際網路或企業內部網路系統之情形時,亦包含首頁提供環境(或顯示環境)。又,電腦可讀取之記錄媒體,包含軟碟、光磁碟、ROM、CD-ROM等之可搬送媒體及內建於電腦系統之硬碟等之儲存裝置。電腦可讀取之記錄媒體,亦包含透過網際網路等之網路及電話線等之通訊線路傳送程式時之通訊線等可在短期間動態的保持電腦程式、此種情形下之伺服器及作為客戶之電腦系統內部之揮發性記憶體般,一定時間保持程式者。此外,電腦程式可以是用以實現基板處理裝置11之部分功能者、亦可以是藉由與已記錄在電腦系統之程式之組合來實現 基板處理裝置11之功能者。上位控制裝置,與控制裝置14同樣的可利用電腦系統來實現。 When the computer system can be connected to the Internet or the internal network system of the enterprise, it also includes the environment (or display environment) provided by the home page. Further, the computer readable recording medium includes a storage medium such as a floppy disk, a magneto-optical disk, a ROM, a CD-ROM, and the like, and a storage device built in a hard disk of a computer system. A computer-readable recording medium, which also includes a communication line that transmits a program through a communication line such as the Internet or a telephone line, etc., can dynamically maintain the computer program in a short period of time, and the server in such a situation and As a volatile memory inside the customer's computer system, the programmer is kept for a certain period of time. In addition, the computer program may be implemented to implement part of the functions of the substrate processing apparatus 11, or may be implemented by a combination with a program already recorded in the computer system. The function of the substrate processing apparatus 11. The upper control device can be realized by a computer system similarly to the control device 14.

如圖1所示,光罩保持裝置12,具備保持圓筒光罩DM之第1筒構件21、支承第1筒構件21之導引輥23、依據控制裝置14之控制指令由第1驅動部26驅動第1筒構件21之驅動輥24、及檢測第1筒構件21之位置之第1檢測器25。 As shown in FIG. 1, the mask holding device 12 includes a first tubular member 21 that holds the cylindrical mask DM, a guide roller 23 that supports the first tubular member 21, and a first driving unit according to a control command of the control device 14. The drive roller 24 that drives the first tubular member 21 and the first detector 25 that detects the position of the first tubular member 21 are driven.

第1筒構件21,係具有從作為既定軸之旋轉中心線AX1(以下,適當的亦稱第1中心軸AX1)以一定半徑彎曲之曲面的圓筒構件,繞旋轉中心線AX1旋轉。第1筒構件21具有配置圓筒光罩DM之照明區域IR的第1面P1,該第1面P1係將線分(母線)繞與此線分平行之第1中心軸AX1旋轉所形成之圓筒面。圓筒面,例如係圓筒之外周面或圓柱之外周面等。第1筒構件21,係以例如玻璃或石英等製造、具有一定厚度之圓筒狀,其外周面(圓筒面)為第1面P1。亦即,於本實施形態,圓筒光罩DM之照明區域IR係彎曲成從旋轉中心線AX1起具有一定半徑r1之圓筒面狀。如以上所述,第1筒構件21具有從旋轉中心線AX1起以一定半徑彎曲之曲面(既定曲率之圓筒面)。 The first tubular member 21 has a cylindrical member that is curved from a rotation center line AX1 (hereinafter, also referred to as a first central axis AX1 as appropriate) having a predetermined radius, and is rotated around the rotation center line AX1. The first tubular member 21 has a first surface P1 on which an illumination region IR of the cylindrical mask DM is disposed, and the first surface P1 is formed by rotating a line (busbar) around a first central axis AX1 parallel to the line. Cylinder surface. The cylindrical surface is, for example, a peripheral surface other than the cylinder or a cylindrical outer surface or the like. The first tubular member 21 is made of, for example, glass or quartz, has a cylindrical shape having a constant thickness, and its outer peripheral surface (cylindrical surface) is the first surface P1. That is, in the present embodiment, the illumination region IR of the cylindrical mask DM is curved in a cylindrical shape having a constant radius r1 from the rotation center line AX1. As described above, the first tubular member 21 has a curved surface (a cylindrical surface having a predetermined curvature) curved at a constant radius from the rotation center line AX1.

圓筒光罩DM,係例如於平坦性高之短條狀極薄玻璃板(例如厚度為100μm~500μm)之一面,以鉻等之遮光層形成圖案之穿透型平面狀的片狀光罩。光罩保持裝置12,使極薄玻璃板形成之圓筒光罩DM順著第1筒構件21外周面之曲面彎曲,在捲繞於(貼於)此曲面的狀態下使用。圓筒光罩DM,具有未形成圖案之圖案非形成區域,圖案非形成區域被安裝於第1筒構件21。圓筒光罩DM,可安裝於第1筒構件21、亦可自第1 筒構件21取下。 The cylindrical reticle DM is, for example, a sheet-shaped reticle that is formed by a light-shielding layer of chrome or the like on one side of a short strip-shaped ultra-thin glass plate (for example, a thickness of 100 μm to 500 μm) having a high flatness. . In the mask holding device 12, the cylindrical mask DM formed of the extremely thin glass plate is bent along the curved surface of the outer peripheral surface of the first tubular member 21, and is used in a state of being wound around (attached) the curved surface. The cylindrical mask DM has a pattern non-formation region in which no pattern is formed, and the pattern non-formation region is attached to the first tubular member 21. The cylindrical mask DM can be attached to the first tubular member 21 or from the first The tubular member 21 is removed.

又,亦可取代以極薄玻璃板構成圓筒光罩DM並將該圓筒光罩DM捲繞於以透明圓筒母材構成之第1筒構件21,而將第1筒構件21以石英等之透明圓筒母材製造,於其外周面直接描繪形成以鉻等遮光層構成之光罩圖案。此時,第1筒構件21之功能亦為圓筒光罩DM之圖案之支承構件。 Further, instead of forming the cylindrical mask DM with an extremely thin glass plate, the cylindrical mask DM may be wound around the first tubular member 21 made of a transparent cylindrical base material, and the first tubular member 21 may be made of quartz. In the production of a transparent cylindrical base material, a reticle pattern formed of a light shielding layer such as chrome is directly formed on the outer peripheral surface thereof. At this time, the function of the first tubular member 21 is also a supporting member of the pattern of the cylindrical mask DM.

第1檢測器25,係以光學方式檢測第1筒構件21之旋轉位置之物,例如係以旋轉(rotary)編碼器等構成。編碼器可以是絕對型(absolute)、亦可以式增量型(increment)。第1檢測器25將檢測到之顯示第1筒構件21之旋轉位置的資訊、例如將來自後述編碼器讀頭之2相訊號等輸出至控制裝置14。包含電動馬達等致動器之第1驅動部26,依據從控制裝置14輸入之控制訊號,調整用以使驅動輥24旋轉之力矩及旋轉速度。控制裝置14根據第1檢測器25之檢測結果控制第1驅動部26,據以控制第1筒構件21之旋轉位置。控制裝置14控制被保持在第1筒構件21之圓筒光罩DM之旋轉位置與旋轉速度中之一方或双方。 The first detector 25 optically detects the rotational position of the first tubular member 21, and is configured by, for example, a rotary encoder or the like. The encoder can be either absolute or incremental. The first detector 25 outputs information indicating the rotational position of the first tubular member 21, for example, a 2-phase signal from an encoder read head to be described later, to the control device 14. The first drive unit 26 including an actuator such as an electric motor adjusts a torque and a rotational speed for rotating the drive roller 24 in accordance with a control signal input from the control device 14. The control device 14 controls the first drive unit 26 based on the detection result of the first detector 25 to control the rotational position of the first tubular member 21. The control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first tubular member 21.

搬送裝置9,具備驅動輥DR4、第1導引構件31、形成配置基板P之投影區域PA之第2面P2的第2筒構件22、第2導引構件33、驅動輥DR4、DR5、第2檢測器35及第2驅動部36。 The transport device 9 includes a drive roller DR4, a first guide member 31, a second tubular member 22 that forms a second surface P2 of the projection area PA on which the substrate P is placed, a second guide member 33, drive rollers DR4 and DR5, and a second 2 detector 35 and second drive unit 36.

於本實施形態,從基板P之搬送路徑上游、亦即從與基板P之搬送(移動)方向相反側往驅動輥DR4搬送而來之基板P,經由驅動輥DR4被搬送向第1導引構件31。經過第1導引構件31之基板P被支承在半徑r2之圓筒狀或圓柱狀之第2筒構件22表面,被搬送向第2導引構件33。 經過第2導引構件33之基板P被搬送向搬送路徑之下游。又,第2筒構件22之旋轉中心線AX2與驅動輥DR4、DR5之各旋轉中心線,皆係設定為與Y軸平行。 In the present embodiment, the substrate P transported from the upstream side of the transport path of the substrate P, that is, from the side opposite to the transport (movement) direction of the substrate P, to the drive roller DR4 is transported to the first guide member via the drive roller DR4. 31. The substrate P that has passed through the first guiding member 31 is supported on the surface of the cylindrical or cylindrical second tubular member 22 having a radius r2, and is transported to the second guiding member 33. The substrate P that has passed through the second guiding member 33 is transported to the downstream of the transport path. Further, the rotation center line AX2 of the second tubular member 22 and the respective rotation center lines of the drive rollers DR4 and DR5 are set to be parallel to the Y-axis.

第1導引構件31及第2導引構件33,例如,可藉由往基板P之搬送方向移動,據以調整在搬送路徑作用於基板P之搬送方向之張力等。此外,第1導引構件31(及驅動輥DR4)與第2導引構件33(及驅動輥DR5),可藉由作成例如能往基板P之寬度方向(與基板P之搬送方向正交之方向,Y方向)移動,據以調整捲繞在第2筒構件22外周之基板P之Y方向位置等。又,搬送裝置9只要能沿著投影光學系PL之投影區域PA搬送基板P即可,搬送裝置9之構成可適當的變更。 For example, the first guiding member 31 and the second guiding member 33 can be moved in the conveying direction of the substrate P, thereby adjusting the tension acting on the conveying path of the substrate P in the conveying direction. Further, the first guiding member 31 (and the driving roller DR4) and the second guiding member 33 (and the driving roller DR5) can be formed, for example, in the width direction of the substrate P (orthogonal to the conveying direction of the substrate P). The direction and the Y direction are moved, and the position of the substrate P wound around the outer circumference of the second tubular member 22 in the Y direction is adjusted. Further, the transport device 9 can transport the substrate P along the projection area PA of the projection optical system PL, and the configuration of the transport device 9 can be appropriately changed.

第2筒構件22係具有從作為既定軸之旋轉中心線AX2(以下,亦適當的稱第2中心軸AX2)以一定半徑彎曲之曲面(既定曲率之圓筒面)的圓筒構件,為一繞第2中心軸AX2旋轉之旋轉筒。第2筒構件22形成第2面(支承面)P2。第2面P2係來自投影光學系PL之成像光束投射之基板P之一部分,將包含投影區域PA之部分支承為圓弧狀(圓筒狀)。於本實施形態,第2筒構件22與搬送裝置9之一部分一起兼作為支承曝光對象之基板P的支承構件(基板載台)。亦即,第2筒構件22可以是曝光裝置EX之一部分。如以上所述,第2筒構件22可繞其旋轉中心線AX2(第2中心軸AX2)旋轉,基板P順著第2筒構件22上之外周面(圓筒面)彎曲成圓筒面狀,於彎曲之基板P之一部分配置投影區域PA。因此,基板P在半徑r2之圓筒面中包含投影區域PA之周面部分係旋轉移動。 The second tubular member 22 has a curved surface (a cylindrical surface having a predetermined curvature) which is curved at a constant radius from a rotation center line AX2 (hereinafter, also referred to as a second central axis AX2) which is a predetermined axis, and is a cylindrical member. A rotating cylinder that rotates around the second central axis AX2. The second tubular member 22 forms a second surface (support surface) P2. The second surface P2 is a portion of the substrate P from which the imaging beam of the projection optical system PL is projected, and the portion including the projection area PA is supported in an arc shape (cylindrical shape). In the present embodiment, the second tubular member 22 serves as a supporting member (substrate stage) for supporting the substrate P to be exposed together with one of the conveying devices 9. That is, the second tubular member 22 may be a part of the exposure device EX. As described above, the second tubular member 22 is rotatable about the rotation center line AX2 (second center axis AX2), and the substrate P is curved into a cylindrical shape along the outer circumferential surface (cylindrical surface) of the second tubular member 22. The projection area PA is disposed on one of the curved substrate P. Therefore, the substrate P includes a rotational movement of the peripheral surface portion of the projection area PA in the cylindrical surface of the radius r2.

於本實施形態,第2筒構件22係藉由從包含電動馬達等致 動器之第2驅動部36供應之力矩而旋轉。第2檢測器35係以例如旋轉編碼器等構成,以光學方式檢測第2筒構件22之旋轉位置。第2檢測器35將顯示所檢測之第2筒構件22之旋轉位置的資訊(例如,來自後述編碼器讀頭EN1、EN2、EN3、EN4、EN5之2相訊號等)輸出至控制裝置14。第2驅動部36,依據從控制裝置14供應之控制訊號,調整使第2筒構件22旋轉之力矩及旋轉速度。控制裝置14,根據第2檢測器35之檢測結果控制第2驅動部36,據以控制第2筒構件22之旋轉位置,使第1筒構件21(圓筒光罩DM)與第2筒構件22同步移動(同步旋轉)。第2檢測器35之詳情留待後述。 In the present embodiment, the second tubular member 22 is caused by including an electric motor or the like. The torque supplied by the second drive unit 36 of the actuator rotates. The second detector 35 is configured by, for example, a rotary encoder, and optically detects the rotational position of the second tubular member 22. The second detector 35 outputs information indicating the detected rotational position of the second tubular member 22 (for example, two-phase signals from encoder read heads EN1, EN2, EN3, EN4, and EN5, which will be described later) to the control device 14. The second drive unit 36 adjusts the torque and the rotational speed at which the second tubular member 22 rotates in accordance with the control signal supplied from the control device 14. The control device 14 controls the second drive unit 36 based on the detection result of the second detector 35, and controls the rotational position of the second tubular member 22 to control the first tubular member 21 (cylinder mask DM) and the second tubular member. 22 synchronous movement (synchronous rotation). Details of the second detector 35 will be described later.

曝光裝置EX,係想定一搭載所謂的多透鏡方式之投影光學系PL的曝光裝置。投影光學系PL具備投影圓筒光罩DM之圖案中之一部分之像的複數個投影模組。例如,圖1中,包含圓筒光罩DM之旋轉中心線AX1與第2筒構件22之第2中心軸AX2、相對與YZ平面平行之中心面P3在左側(與基板P之搬送方向相反側)於Y方向以一定間隔配置有3台投影模組(投影光學系)PL1、PL3、PL5,在中心面P3之右側(基板P之搬送方向側)亦於Y方向以一定間隔配置有3台投影模組(投影光學系)PL2、PL4、PL6。 The exposure apparatus EX is an exposure apparatus that mounts a so-called multi-lens projection optical system PL. The projection optical system PL includes a plurality of projection modules that project an image of one of the patterns of the cylindrical mask DM. For example, in FIG. 1, the rotation center line AX1 of the cylindrical mask DM and the second central axis AX2 of the second tubular member 22 and the center plane P3 parallel to the YZ plane are on the left side (the side opposite to the transport direction of the substrate P). Three projection modules (projection optical systems) PL1, PL3, and PL5 are arranged at regular intervals in the Y direction, and three units are arranged at a predetermined interval in the Y direction on the right side of the center plane P3 (the transport direction side of the substrate P). Projection modules (projection optics) PL2, PL4, PL6.

此種多透鏡方式之曝光裝置EX,係將以複數個投影模組PL1~PL6曝光之區域(投影區域PA1~PA6)於Y方向之端部藉由掃描使其彼此重疊,據以投影所欲圖案之整體像。此種曝光裝置EX,即使是在圓筒光罩DM上圖案於Y方向之尺寸變大,而必然的產生處理Y方向寬度大之基板P的必要性時,亦僅需於Y方向増設投影模組PL、與對應投影模組 PL之照明機構IU側之模組,因此具有可容易的因應顯示面板尺寸(基板P寬度)大型化的優點。 In the multi-lens type exposure apparatus EX, the areas (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6 are superimposed on each other in the Y direction by scanning, so as to be projected. The overall image of the pattern. In such an exposure apparatus EX, even if the size of the pattern in the Y direction is large on the cylindrical mask DM, and the necessity of processing the substrate P having a large width in the Y direction is inevitable, it is only necessary to set the projection mode in the Y direction. Group PL, and corresponding projection module Since the module of the illumination mechanism of the PL is on the IU side, there is an advantage that the size of the display panel (the width of the substrate P) can be easily increased.

當然,曝光裝置EX亦可以不是多透鏡方式。例如,在基板P之寬度方向尺寸某種程度較小之情形時等,曝光裝置EX,可以1台投影模組將圖案全寬之像投影至基板P。又,複數個投影模組PL1~PL6,亦可分別投影對應1個元件之圖案。亦即,曝光裝置EX,可藉由複數個投影模組並行複數個元件用圖案之投影。 Of course, the exposure device EX may not be in a multi-lens mode. For example, when the dimension of the substrate P in the width direction is somewhat small, the exposure apparatus EX can project an image of the full width of the pattern onto the substrate P by one projection module. Further, a plurality of projection modules PL1 to PL6 may respectively project a pattern corresponding to one element. That is, the exposure device EX can project a plurality of component pattern projections in parallel by a plurality of projection modules.

照明機構IU具備光源裝置13及照明光學系。照明光學系對應複數個投影模組PL1~PL6之各個,具備排列於Y軸方向之複數個(例如6個)照明模組IL。光源裝置13包含例如水銀燈等之燈光源、雷射二極體、發光二極體(LED)等之固體光源或氣體雷射光源。光源裝置射出之照明光,例如係從燈光源射出之輝線(g線、h線、i線)、KrF準分子雷射光(波長248nm)等遠紫外光(DUV光)、ArF準分子雷射光(波長193nm)等。從光源裝置13射出之照明光,其照度分布被均勻化後透過例如光纖等之導光構件,分至複數個照明模組IL。 The illumination unit IU includes a light source device 13 and an illumination optical system. The illumination optical system corresponds to each of the plurality of projection modules PL1 to PL6, and includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction. The light source device 13 includes a solid light source such as a lamp light source such as a mercury lamp, a laser diode, or a light emitting diode (LED), or a gas laser light source. The illumination light emitted from the light source device is, for example, a bright line (g line, h line, i line) emitted from a light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), or ArF excimer laser light ( Wavelength 193 nm) and the like. The illumination light emitted from the light source device 13 is uniformized and transmitted to a plurality of illumination modules IL through a light guiding member such as an optical fiber.

複數個照明模組IL之各個,包含透鏡等之複數個光學構件。於本實施形態,將從光源裝置13射出後通過複數個照明模組IL之任一者之光稱為照明光束EL1。複數個照明模組IL之各個,包含例如積分器光學系、棒狀透鏡、複眼透鏡等,以均勻照度分布之照明光束EL1照明照明區域IR。於本實施形態,複數個照明模組IL係配置在圓筒光罩DM之內側。複數個照明模組IL之各個,從圓筒光罩DM之內側照明形成在圓筒光罩DM外周面之光罩圖案之各照明區域IR。 Each of the plurality of illumination modules IL includes a plurality of optical members such as lenses. In the present embodiment, the light that is emitted from the light source device 13 and passed through any of the plurality of illumination modules IL is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, etc., and the illumination region IR is illuminated by the illumination beam EL1 having a uniform illumination distribution. In the present embodiment, a plurality of illumination modules IL are disposed inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates the illumination regions IR of the mask pattern formed on the outer circumferential surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

圖2係顯示本實施形態之照明區域IR及投影區域PA之配置的圖。又,圖2中顯示了從-Z側所見之配置在第1筒構件21之圓筒光罩DM上之照明區域IR的俯視圖(圖2中左側之圖)、與從+Z側所見之配置在第2筒構件22之基板P上之投影區域PA的俯視圖(圖2中右側之圖)。圖2中之符號Xs係表示第1筒構件21(圓筒光罩DM)或第2筒構件22之旋轉方向(移動方向)。 Fig. 2 is a view showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. Further, Fig. 2 shows a plan view (left side view in Fig. 2) of the illumination region IR disposed on the cylindrical mask DM of the first tubular member 21 as seen from the -Z side, and the configuration seen from the +Z side. A plan view of the projection area PA on the substrate P of the second tubular member 22 (the right side view in Fig. 2). The symbol Xs in Fig. 2 indicates the rotation direction (moving direction) of the first tubular member 21 (cylindrical mask DM) or the second tubular member 22.

複數個照明模組IL,分別照明圓筒光罩DM上之第1至第6照明區域IR1~IR6。例如,第1照明模組IL照明第1照明區域IR1、第2照明模組IL照明第2照明區域IR2。 A plurality of illumination modules IL respectively illuminate the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination region IR1 and the second illumination module IL illuminates the second illumination region IR2.

第1照明區域IR1,雖細說明為一於Y方向細長之梯形區域,但如投影光學系(投影模組)PL般,係形成中間像面之投影光學系之情形時,可於該中間像之位置配置具有梯形開口之視野光闌板。因此,第1照明區域IR1亦可以是包含該梯形開口之長方形區域。第3照明區域IR3及第5照明區域IR5,分別係與第1照明區域IR1具同樣形狀之區域,於Y軸方向相距一定間隔配置。又,第2照明區域IR2係就中心面P3與第1照明區域IR1呈對稱的梯形(或長方形)區域。第4照明區域IR4及第6照明區域IR6,分別係與第2照明區域IR2具同樣形狀之區域,於Y軸方向相距一定間隔配置。 The first illumination region IR1 is described as a trapezoidal region elongated in the Y direction. However, when the projection optical system (projection module) PL is used to form the projection optical system of the intermediate image plane, the intermediate image can be used. A position diaphragm plate having a trapezoidal opening is disposed at a position. Therefore, the first illumination region IR1 may be a rectangular region including the trapezoidal opening. Each of the third illumination region IR3 and the fifth illumination region IR5 has a region having the same shape as the first illumination region IR1, and is disposed at a constant interval in the Y-axis direction. Further, the second illumination region IR2 is a trapezoidal (or rectangular) region in which the center plane P3 and the first illumination region IR1 are symmetrical. Each of the fourth illumination region IR4 and the sixth illumination region IR6 has a region having the same shape as the second illumination region IR2, and is disposed at a constant interval in the Y-axis direction.

如圖2所示,第1至第6照明區域IR1~IR6之各個,沿第1面P1之周方向觀察時,係配置成於Y軸方向相鄰之梯形照明區域斜邊部之三角部重疊(overlap)。因此,例如因第1筒構件21之旋轉而通過第1照明區域IR1之圓筒光罩DM上之第1區域A1,即與因第1筒構件21之旋轉而 通過第2照明區域IR2之圓筒光罩DM上之第2區域A2之一部分重複。 As shown in FIG. 2, each of the first to sixth illumination regions IR1 to IR6 is arranged such that the triangular portion of the oblique portion of the trapezoidal illumination region adjacent to the Y-axis direction is overlapped when viewed in the circumferential direction of the first surface P1. (overlap). Therefore, for example, the first region A1 on the cylindrical mask DM passing through the first illumination region IR1 due to the rotation of the first tubular member 21, that is, the rotation of the first tubular member 21 One of the second regions A2 on the cylindrical mask DM passing through the second illumination region IR2 is partially overlapped.

於本實施形態,圓筒光罩DM包含形成有圖案之圖案形成區域A3、與未形成有圖案之圖案非形成區域A4。圖案非形成區域A4係配置成配置成以框狀圍繞圖案形成區域A3,具有遮蔽照明光束EL1之特性。圓筒光罩DM之圖案形成區域A3隨著第1筒構件21之旋轉往移動方向Xs移動,圖案形成區域A3中於Y軸方向之各部分區域,通過第1至第6照明區域IR1~IR6中之一者。亦即,第1~第6照明區域IR1~IR6係配置成涵蓋圖案形成區域A3之Y軸方向全寬。 In the present embodiment, the cylindrical mask DM includes a pattern forming region A3 in which a pattern is formed and a pattern non-forming region A4 in which a pattern is not formed. The pattern non-formation region A4 is configured to be disposed to surround the pattern formation region A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern forming region A3 of the cylindrical mask DM moves in the moving direction Xs as the first tubular member 21 rotates, and the first to sixth illumination regions IR1 to IR6 pass through the partial regions in the Y-axis direction in the pattern forming region A3. One of them. In other words, the first to sixth illumination regions IR1 to IR6 are arranged to cover the full width in the Y-axis direction of the pattern forming region A3.

如圖1所示,排列於Y軸方向之複數個投影模組PL1~PL6之各個與第1~第6照明模組IL之各個成1對1對應,將出現在被對應之照明模組IL照明之照明區域IR內之圓筒光罩DM之部分圖案之像,投影至基板P上之各投影區域PA。例如,第1投影模組PL1與第1照明模組IL對應,將在被第1照明模組IL照明之第1照明區域IR1(參照圖2)之圓筒光罩DM之圖案之像,投影至基板P上之第1投影區域PA1。第3投影模組PL3、第5投影模組PL5分別與第3~第5照明模組IL對應。第3投影模組PL3及第5投影模組PL5,從Y軸方向觀察時,係配置在與第1投影模組PL1重疊之位置。 As shown in FIG. 1, each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction corresponds to each of the first to sixth illumination modules IL in a one-to-one correspondence, and will appear in the corresponding illumination module IL. An image of a partial pattern of the cylindrical mask DM in the illumination area IR of the illumination is projected onto each of the projection areas PA on the substrate P. For example, the first projection module PL1 corresponds to the first illumination module IL, and projects the image of the pattern of the cylindrical mask DM in the first illumination region IR1 (see FIG. 2) illuminated by the first illumination module IL. The first projection area PA1 on the substrate P. The third projection module PL3 and the fifth projection module PL5 correspond to the third to fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are disposed at positions overlapping the first projection module PL1 when viewed in the Y-axis direction.

又,第2投影模組PL2與第2照明模組IL對應,將在被第2照明模組IL照明之第2照明區域IR2(參照圖2)之圓筒光罩DM之圖案之像,投影至基板P上之第2投影區域PA2。第2投影模組PL2,從Y軸方向觀察時,係相對第1投影模組PL1夾著中心面P3配置在對稱之位置。 Further, the second projection module PL2 corresponds to the second illumination module IL, and projects the image of the pattern of the cylindrical mask DM in the second illumination region IR2 (see FIG. 2) illuminated by the second illumination module IL. The second projection area PA2 on the substrate P. When viewed from the Y-axis direction, the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 with the center plane P3 interposed therebetween.

第4投影模組PL4、第6投影模組PL6分別與第4、第6照 明模組IL對應配置,第4投影模組PL4及第6投影模組PL6,從Y軸方向觀察時,係配置在與第2投影模組PL2重疊之位置。藉由此種配置,奇數號之第1投影區域PA1、第3投影區域PA3及第5投影區域PA5,從中心面P3往-X方向錯開一定量,於Y軸方向排列配置成一排。偶數號之第2投影區域PA2、第4投影區域PA4及第6投影區域PA6,則從中心面P3往+X方向錯開一定量,於Y軸方向排列配置成一排。 The fourth projection module PL4 and the sixth projection module PL6 are respectively the fourth and sixth photos The Ming module IL is disposed correspondingly, and the fourth projection module PL4 and the sixth projection module PL6 are disposed at positions overlapping the second projection module PL2 when viewed in the Y-axis direction. With this arrangement, the odd-numbered first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are shifted by a constant amount from the center plane P3 in the -X direction, and arranged in a line in the Y-axis direction. The even projection second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are shifted by a constant amount from the center plane P3 in the +X direction, and arranged in a line in the Y-axis direction.

於本實施形態,將從照明機構IU之各照明模組IL到達圓筒光罩DM上各照明區域IR1~IR6之光,設為照明光束EL1。又,將受到對應在各照明區域IR1~IR6中出現之圓筒光罩DM圖案之強度分布調變後射入各投影模組PL1~PL6而到達各投影區域PA1~PA6之光,設為成像光束EL2。到達各投影區域PA1~PA6之成像光束EL2中、通過投影區域PA1~PA6之各中心點的主光線,如圖1所示,從第2筒構件22之第2中心軸AX2觀察時,係夾著中心面P3於周方向分別配置在角度θ之位置(特定位置)。 In the present embodiment, the illumination light beams EL1 are obtained from the illumination modules IL of the illumination unit IU to the illumination areas IR1 to IR6 on the cylindrical mask DM. Further, the intensity distribution of the cylindrical mask DM pattern appearing in each of the illumination regions IR1 to IR6 is modulated, and the light is incident on each of the projection modules PL1 to PL6 to reach the respective projection areas PA1 to PA6, and is imaged. Beam EL2. Among the imaging light beams EL2 reaching the respective projection areas PA1 to PA6, the chief ray passing through the respective center points of the projection areas PA1 to PA6, as shown in FIG. 1, is viewed from the second central axis AX2 of the second cylindrical member 22, and is clipped. The center plane P3 is disposed at a position (specific position) of the angle θ in the circumferential direction.

第1至第6投影區域PA1~PA6之各個,係配置成在與第2中心軸AX2平行之方向相鄰之投影區域(奇數號與偶數號)彼此之端部(梯形之三角部分),於第2面P2之周方向重疊。因此,例如因第2筒構件22之旋轉而通過第1投影區域PA1之基板P上之第3區域A5,會與因第2筒構件22之旋轉而通過第2投影區域PA2之基板P上之第4區域A6之一部分重複。第1投影區域PA1與第2投影區域PA2,其各自之形狀係被設定為在第3區域A5與第4區域A6重複之區域之曝光量,與不重複區域之曝光量實質相同。 Each of the first to sixth projection regions PA1 to PA6 is disposed at an end portion (a triangular portion of a trapezoidal shape) of a projection region (odd number and even number) adjacent to a direction parallel to the second central axis AX2. The circumferential direction of the second surface P2 overlaps. Therefore, for example, the third region A5 on the substrate P that has passed through the first projection region PA1 due to the rotation of the second tubular member 22 is on the substrate P that has passed through the second projection region PA2 due to the rotation of the second tubular member 22. One of the fourth regions A6 is partially repeated. The first projection area PA1 and the second projection area PA2 are each set such that the exposure amount in the area overlapping the third area A5 and the fourth area A6 is substantially the same as the exposure amount of the non-overlapping area.

其次,針對本實施形態之投影光學系PL之詳細構成,參照 圖3加以說明。又,於本實施形態,第2投影模組PL2~第5投影模組PL5之各個與第1投影模組PL1為相同構成。因此,以第1投影模組PL1代表投影光學系PL說明其構成,第2投影模組PL2~第5投影模組PL5之各個之說明予以省略。 Next, the detailed configuration of the projection optical system PL of the present embodiment is referred to Figure 3 illustrates. Further, in the present embodiment, each of the second projection module PL2 to the fifth projection module PL5 has the same configuration as the first projection module PL1. Therefore, the configuration of the first projection module PL1 on behalf of the projection optical system PL will be described, and the description of each of the second projection module PL2 to the fifth projection module PL5 will be omitted.

圖3所示之第1投影模組PL1,具備將配置在第1照明區域IR1之圓筒光罩DM之圖案之像成像於中間像面P7的第1光學系41、將第1光學系41形成之中間像之至少一部分再成像於基板P之第1投影區域PA1的第2光學系42、以及配置在形成中間像之中間像面P7的第1視野光闌43。 The first projection module PL1 shown in FIG. 3 includes a first optical system 41 that images an image of the pattern of the cylindrical mask DM disposed in the first illumination region IR1 on the intermediate image plane P7, and the first optical system 41. At least a part of the formed intermediate image is re-imaged on the second optical system 42 of the first projection area PA1 of the substrate P, and the first field stop 43 disposed on the intermediate image plane P7 of the intermediate image.

又,第1投影模組PL1具備焦點修正光學構件44、像偏移修正光學構件45、旋轉(rotation)修正機構46、以及倍率修正用光學構件47。焦點修正光學構件44係用以對形成在基板P上之光罩之圖案像(以下,稱投影像)之聚焦狀態進行微調之焦點調整裝置。又,像偏移修正光學構件45係用以使投影像在像面內微幅橫移之調整裝置。倍率修正用光學構件47係用以微修正投影像倍率之調整裝置。旋轉修正機構46係用以使投影像在像面內微幅旋轉之調整裝置。 Further, the first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device for finely adjusting the focus state of the pattern image (hereinafter, referred to as projection image) of the photomask formed on the substrate P. Further, the offset correction optical member 45 is an adjustment device for causing the projection image to slightly traverse in the image plane. The magnification correction optical member 47 is an adjustment device for micro-correcting the projection image magnification. The rotation correcting mechanism 46 is an adjusting device for rotating the projected image slightly in the image plane.

來自圓筒光罩DM之圖案之成像光束EL2,從第1照明區域IR1往法線方向(D1)射出,通過焦點修正光學構件44射入像偏移修正光學構件45。穿透過像偏移修正光學構件45之成像光束EL2於作為第1光學系41之要素之第1偏向構件50之第1反射面(平面鏡)p4反射,通過第1透鏡群51後於配置在光瞳位置之第1凹面鏡52反射,再次通過第1透鏡群51後於第1偏向構件50之第2反射面(平面鏡)p5反射,射入第1視野光闌43。通過第1視野光闌43之成像光束EL2,於作為第2光學系42之要素 之第2偏向構件57之第3反射面(平面鏡)p8反射,通過第2透鏡群58後於配置在光瞳位置之第2凹面鏡59反射,再次通過第2透鏡群58於第2偏向構件57之第4反射面(平面鏡)p9反射,射入倍率修正用光學構件47。從倍率修正用光學構件47射出之成像光束EL2,射入基板P上之第1投影區域PA1,出現在第1照明區域IR1內之圖案之像以等倍(×1)被投影於第1投影區域PA1。 The imaging light beam EL2 from the pattern of the cylindrical mask DM is emitted from the first illumination region IR1 in the normal direction (D1), and enters the image shift correction optical member 45 through the focus correction optical member 44. The imaging beam EL2 that has passed through the image-correcting optical member 45 is reflected by the first reflecting surface (planar mirror) p4 of the first deflecting member 50 which is an element of the first optical system 41, and is disposed in the light after passing through the first lens group 51. The first concave mirror 52 is reflected by the first concave group 52, and is again reflected by the second reflecting surface (planar mirror) p5 of the first deflecting member 50, and is incident on the first field stop 43. The imaging light beam EL2 passing through the first field stop 43 is used as an element of the second optical system 42 The third reflecting surface (plane mirror) p8 of the second deflecting member 57 is reflected by the second lens group 58 and then reflected by the second concave mirror 59 disposed at the pupil position, and passes through the second lens group 58 to the second deflecting member 57 again. The fourth reflecting surface (planar mirror) p9 is reflected and incident on the magnification correcting optical member 47. The imaging light beam EL2 emitted from the magnification correction optical member 47 is incident on the first projection area PA1 on the substrate P, and the image of the pattern appearing in the first illumination area IR1 is projected onto the first projection at a magnification (×1). Area PA1.

當設圖1所示之圓筒光罩DM之半徑為r1、捲繞在第2筒構件22之基板P於圓筒狀表面之半徑為r2、半徑r1與半徑r2相等時,各投影模組PL1~PL6於光罩側之成像光束EL2之主光線係傾斜成通過圓筒光罩DM之中心軸AX1。其傾角與在基板P側之成像光束EL2之主光線之傾斜角度θ(相對中心面P3為±θ)相同。 When the radius of the cylindrical mask DM shown in FIG. 1 is r1, the radius of the substrate P wound on the second tubular member 22 on the cylindrical surface is r2, the radius r1 and the radius r2 are equal, each projection module The principal rays of the imaging beam EL2 of PL1 to PL6 on the reticle side are inclined to pass through the central axis AX1 of the cylindrical mask DM. The inclination angle thereof is the same as the inclination angle θ of the chief ray of the imaging light beam EL2 on the substrate P side (±θ with respect to the center plane P3).

為賦予上述傾斜角度θ,將圖3所示之相對光軸AX3之第1偏向構件50之第1反射面p4之角度θ1設定為較45°小△θ1、將相對光軸AX4之第2偏向構件57之第4反射面p9之角度θ4設定為較45°小△θ4。△θ1與△θ4相對圖1中所示之角度θ,係設定為△θ1=△θ4=θ/2之關係。 In order to impart the inclination angle θ, the angle θ1 of the first reflection surface p4 of the first deflection member 50 with respect to the optical axis AX3 shown in FIG. 3 is set to be smaller than 45° Δθ1 and to be biased to the second relative to the optical axis AX4. The angle θ4 of the fourth reflecting surface p9 of the member 57 is set to be smaller than 45° by Δθ4. Δθ1 and Δθ4 are set to an angle Δθ1=Δθ4=θ/2 with respect to the angle θ shown in Fig. 1 .

圖4係適用於圖1之基板處理裝置(曝光裝置)之第2筒構件22(旋轉筒)的立體圖。圖5係用以說明適用於圖1之基板處理裝置(曝光裝置)之檢測器與讀取裝置之關係的立體圖。圖6係在與旋轉中心線AX2正交之XZ面內所見之實施形態之編碼器標尺圓盤與讀取裝置之位置的說明圖。又,圖4中,為便於說明,僅圖示第2至第4投影區域PA2~PA4,省略了第1、第5、第6投影區域PA1、PA5、PA6之圖示。 4 is a perspective view of a second tubular member 22 (rotary cylinder) applied to the substrate processing apparatus (exposure apparatus) of FIG. 1. Fig. 5 is a perspective view for explaining a relationship between a detector and a reading device which are applied to the substrate processing apparatus (exposure apparatus) of Fig. 1. Fig. 6 is an explanatory view showing the position of the encoder scale disk and the reading device of the embodiment seen in the XZ plane orthogonal to the rotation center line AX2. In FIG. 4, for convenience of explanation, only the second to fourth projection areas PA2 to PA4 are illustrated, and illustration of the first, fifth, and sixth projection areas PA1, PA5, and PA6 is omitted.

圖1所示之第2檢測器35係以光學方式檢測第2筒構件22之位置(具體而言,係旋轉位置)者,如圖4至圖6所示,包含作為標尺構件之高真圓度編碼器標尺圓盤(圓盤)SD與作為讀取部之編碼器讀頭EN1、EN2、EN3、EN4、EN5。 The second detector 35 shown in FIG. 1 optically detects the position of the second tubular member 22 (specifically, the rotational position), and as shown in FIGS. 4 to 6, includes a high true circle as a scale member. The encoder encoder disc (disc) SD and the encoder read heads EN1, EN2, EN3, EN4, EN5 as reading units.

編碼器標尺圓盤SD固定在與第2筒構件22之旋轉軸ST正交之第2筒構件22之一端部。因此,編碼器標尺圓盤SD會繞旋轉中心線AX2與旋轉軸ST一體旋轉。編碼器標尺圓盤SD亦可是固定在第2筒構件22之兩端部。亦即,編碼器標尺圓盤SD只要是固定在第2筒構件22之至少一端部即可。 The encoder scale disk SD is fixed to one end of the second tubular member 22 that is orthogonal to the rotation axis ST of the second tubular member 22. Therefore, the encoder scale disk SD rotates integrally with the rotation axis ST about the rotation center line AX2. The encoder scale disc SD may be fixed to both end portions of the second tubular member 22. In other words, the encoder scale disk SD may be fixed to at least one end of the second tubular member 22.

於編碼器標尺圓盤SD之外周面,刻設複數有複數個用以檢測在第2筒構件22(圓筒構件)周方向之位置或位置變化量、作為位置檢測用刻度之標尺(刻線)GP。以下,將標尺GP適當的稱為刻度GP。編碼器標尺圓盤SD之刻設有標尺GP之部分為標尺部。複數個刻度GP沿第2筒構件22旋轉之方向、例如20μm間距之格子線排列成環狀,且與第2筒構件22一起繞旋轉軸ST(第2中心軸AX2)旋轉。 On the outer peripheral surface of the encoder scale disc SD, a plurality of plural gauges for detecting the position or positional change in the circumferential direction of the second tubular member 22 (cylindrical member) as the scale for position detection are engraved (the score line) ) GP. Hereinafter, the scale GP is appropriately referred to as a scale GP. The portion of the scale GP at the encoder scale disc SD is the scale portion. The plurality of scales GP are arranged in a ring shape along the direction in which the second tubular member 22 rotates, for example, a lattice line having a pitch of 20 μm, and rotate together with the second tubular member 22 around the rotation axis ST (the second central axis AX2).

編碼器讀頭EN1、EN2、EN3、EN4、EN5,從旋轉軸ST(第2旋轉中心線AX2)觀察時,係於刻度GP周圍與刻度GP保持一定間距對向配置。各編碼器讀頭EN1~EN5係對刻度GP投射測量光束、並對於刻度GP反射之光束(繞射光)進行光電檢測之非接觸式感測器。又,各編碼器讀頭EN1~EN5,從第2筒構件22之旋轉軸ST(第2旋轉中心線AX2)觀察時,係於標尺圓盤SD之周方向配置在互異之方位(角度位置)。 When viewed from the rotation axis ST (second rotation center line AX2), the encoder heads EN1, EN2, EN3, EN4, and EN5 are arranged at a predetermined pitch around the scale GP at a predetermined pitch. Each of the encoder read heads EN1 to EN5 is a non-contact type sensor that projects a measuring beam on the scale GP and photoelectrically detects a beam (diffracted light) reflected by the scale GP. Further, when the encoder heads EN1 to EN5 are viewed from the rotation axis ST (second rotation center line AX2) of the second tubular member 22, they are arranged in mutually different directions (angular positions) in the circumferential direction of the scale disk SD. ).

各編碼器讀頭EN1~EN5係對在刻度GP之切線方向(XZ 面內)之變位的變動具有測量感度(檢測感度)之讀取裝置。如圖4所示,將各編碼器讀頭EN1~EN5之設置方位(以旋轉中心線AX2為中心在XZ面內之角度方向)以設置方位線Le1、Le2、Le3、Le4、Le5表示時,如圖6所示,係以設置方位線Le1、Le2相對中心面P3為角度±θ°之方式配置編碼器讀頭EN1、EN2。又,本實施形態中,雖係將角度θ設為例如15°,但不限定於此。 Each encoder read head EN1~EN5 is in the tangential direction of the scale GP (XZ The variation of the displacement of the in-plane has a reading device for measuring the sensitivity (detection sensitivity). As shown in FIG. 4, when the set orientation of each of the encoder heads EN1 to EN5 (the angular direction in the XZ plane centered on the rotation center line AX2) is represented by the set orientation lines Le1, Le2, Le3, Le4, and Le5, As shown in Fig. 6, the encoder read heads EN1, EN2 are arranged such that the orientation lines Le1, Le2 are set at an angle ± θ° with respect to the center plane P3. Further, in the present embodiment, the angle θ is set to, for example, 15°, but is not limited thereto.

圖3所示之投影模組PL1~PL6係以基板P為被處理物體,對基板P照射作為圖案像之光束以實施曝光處理之處理部。因此,曝光裝置EX具備由奇數號投影模組PL1、PL3、PL5構成之第1處理部、與由偶數號投影模組PL2、PL4、PL6構成之第2處理部,針對基板P將來自第1處理部與第2處理部各個之成像光束EL2之主光線(例如通過投影區域PA之中心點的主光線),從XZ面內觀察時,垂直射入基板P。如以上所述,將主光線射入基板P之位置,設為對基板P施以處理(此處,係成像光束之照射)的特定位置。 In the projection modules PL1 to PL6 shown in FIG. 3, the substrate P is a processed object, and the substrate P is irradiated with a light beam as a pattern image to perform exposure processing. Therefore, the exposure apparatus EX includes the first processing unit including the odd-numbered projection modules PL1, PL3, and PL5 and the second processing unit including the even-numbered projection modules PL2, PL4, and PL6, and the substrate P is from the first processing unit. The chief ray of the imaging beam EL2 of each of the processing unit and the second processing unit (for example, the chief ray passing through the center point of the projection area PA) is incident on the substrate P perpendicularly when viewed from the XZ plane. As described above, the principal ray is incident on the substrate P at a specific position where the substrate P is subjected to processing (here, irradiation of the imaging beam).

特定位置,從第2筒構件22之第2中心軸AX2觀察時,係設定於被支承在第2筒構件22外周面之基板P中,從中心面P3往周方向之角度±θ的位置。如圖4及圖6所示,編碼器讀頭EN1之設置方位線Le1係配置成與通過奇數號投影模組PL1、PL3、PL5之各投影區域(投影視野)PA1、PA3、PA5之中心點的主光線相對中心面P3之傾斜角度θ一致。同樣的,編碼器讀頭EN2之設置方位線Le2,亦係配置成與通過偶數號投影模組PL2、PL4、PL6之各投影區域(投影視野)PA2、PA4、PA6之中心點的主光線相對中心面P3之傾斜角度θ一致。因此,編碼器讀頭EN1、EN2即 係讀取位在連結各特定位置與第2中心軸AX2之方向之刻度GP上的刻度。 When viewed from the second central axis AX2 of the second tubular member 22, the specific position is set at a position ±1 from the center plane P3 in the circumferential direction of the substrate P supported by the outer peripheral surface of the second tubular member 22. As shown in FIG. 4 and FIG. 6, the set azimuth line Le1 of the encoder read head EN1 is arranged to be the center point of each of the projection areas (projection fields) PA1, PA3, PA5 passing through the odd-numbered projection modules PL1, PL3, and PL5. The chief ray has the same inclination angle θ with respect to the center plane P3. Similarly, the set orientation line Le2 of the encoder read head EN2 is also configured to be opposite to the chief ray passing through the center points of the projection areas (projection fields) PA2, PA4, and PA6 of the even number projection modules PL2, PL4, and PL6. The inclination angle θ of the center plane P3 is uniform. Therefore, the encoder read heads EN1, EN2 The reading bit is on the scale GP connecting the specific position and the direction of the second central axis AX2.

編碼器讀頭EN4較編碼器讀頭EN1配置在基板P之搬送方向上游側、亦即配置在曝光位置(投影區域)之前。且編碼器讀頭EN4配置在設置方位線Le4上。設置方位線Le4,係位在將編碼器讀頭EN1之設置方位線Le1朝向基板P之搬送方向上游側繞旋轉中心線AX2之軸大至旋轉90°之位置。又,編碼器讀頭EN5係配置在設置方位線Le5上。設置方位線Le5,係位在將編碼器讀頭EN2之設置方位線Le2朝向基板P之搬送方向上游側繞旋轉中心線AX2之軸置旋轉90°之位置。 The encoder read head EN4 is disposed on the upstream side in the transport direction of the substrate P, that is, before the exposure position (projection area), than the encoder read head EN1. And the encoder read head EN4 is arranged on the set orientation line Le4. The orientation line Le4 is set at a position where the set azimuth line Le1 of the encoder read head EN1 is directed to the upstream side of the transfer direction of the substrate P around the axis of the rotation center line AX2 to a position rotated by 90°. Further, the encoder read head EN5 is disposed on the set azimuth line Le5. The azimuth line Le5 is set at a position where the set azimuth line Le2 of the encoder read head EN2 is rotated by 90° about the axis of the rotation center line AX2 toward the upstream side in the transport direction of the substrate P.

如先前所示之例,將通過奇數號投影區域PA1、PA3、PA5中心之成像光束EL2之主光線與通過偶數號投影區域PA2、PA4、PA6中心之成像光束EL2之主光線相對中心面P3之傾斜角度±θ設為15°時,設置方位線Le1與設置方位線Le2在XZ面內之展開角為30°。因此,設置方位線Le4與設置方位線Le5在XZ面內之展開角亦大致為30°。 As in the example previously shown, the chief ray of the imaging beam EL2 passing through the center of the odd-numbered projection areas PA1, PA3, PA5 and the principal ray of the imaging beam EL2 passing through the center of the even-numbered projection areas PA2, PA4, PA6 are opposite to the center plane P3. When the inclination angle ±θ is set to 15°, the deployment angle of the orientation line Le1 and the set orientation line Le2 in the XZ plane is set to 30°. Therefore, the deployment angle of the orientation line Le4 and the set orientation line Le5 in the XZ plane is also approximately 30°.

藉由將編碼器讀頭EN4及EN5以上述方式配置,配置讀取刻度GP之編碼器讀頭EN4、EN5之設置方位線Le4、Le5之方向,從XZ面內且旋轉中心線AX2觀察時,即成為相對基板P與成像光束EL2之主光線射入基板P之特定位置之方向大致正交。因此,即使是在因支承旋轉軸ST之軸承(bearing)之些微的間隙(2μm~3μm程度)導致第2筒構件22往Z方向偏移之情形時,亦能將因此橫移而可能在投影區域PA1~PA6內發生之沿成像光束EL2之方向之位置誤差,藉由編碼器讀頭EN1、EN2高精度的測量出。 By arranging the encoder read heads EN4 and EN5 in the above manner, the direction of the set orientation lines Le4 and Le5 of the encoder read heads EN4 and EN5 of the read scale GP is arranged, and when viewed from the XZ plane and the rotation center line AX2, That is, the direction in which the principal ray of the counter substrate P and the imaging light beam EL2 enters the specific position of the substrate P is substantially orthogonal. Therefore, even when the second tubular member 22 is displaced in the Z direction due to a slight gap (about 2 μm to 3 μm) of the bearing supporting the rotating shaft ST, the second tubular member 22 can be traversed and possibly projected. The positional error in the direction of the imaging beam EL2 occurring in the regions PA1 to PA6 is measured with high precision by the encoder read heads EN1 and EN2.

又,編碼器讀頭EN3配置在設置方位線Le3上。設置方位 線Le3係設定在編碼器讀頭EN2之設置方位線Le2繞旋轉中心線AX2之軸大致旋轉120°、且編碼器讀頭EN4之設置方位線Le4繞旋轉中心線AX2之軸與設置方位線Le2之旋轉方向相反之方向大致旋轉120°之位置。亦即,在XZ面內觀察時,從旋轉中心線AX2延伸之3條設置方位線Le2、Le3、Le4係以大致120°之間隔設定。 Further, the encoder read head EN3 is disposed on the set azimuth line Le3. Set orientation The line Le3 is set to be rotated by 120° around the axis of the rotation center line AX2 at the set orientation line Le2 of the encoder read head EN2, and the set orientation line Le4 of the encoder read head EN4 is arranged around the axis of the rotation center line AX2 and the set orientation line Le2. The direction in which the direction of rotation is opposite is approximately 120°. That is, when viewed in the XZ plane, the three sets of orientation lines Le2, Le3, and Le4 extending from the rotation center line AX2 are set at intervals of approximately 120 degrees.

標尺構件編碼器標尺圓盤SD,係以例如低熱膨脹率之金屬、玻璃或陶瓷等為母材。編碼器標尺圓盤SD,為提高測量之分解能力,係盡可能做成大直徑(例如直徑20cm以上)。圖4中,雖然編碼器標尺圓盤SD之直徑相對第2筒構件22之直徑圖示的較小,但藉由使第2筒構件22之外周面中、捲繞基板P之外周面之直徑與編碼器標尺圓盤SD刻度GP之直徑一致(使大致一致),即能進一步縮小所謂的測量阿貝誤差。 The scale member encoder scale disc SD is made of, for example, a metal having a low thermal expansion rate, glass, or ceramic as a base material. The encoder scale disc SD is made to have a large diameter (for example, a diameter of 20 cm or more) in order to improve the decomposition ability of the measurement. In FIG. 4, although the diameter of the encoder scale disk SD is smaller than the diameter of the second cylindrical member 22, the diameter of the outer peripheral surface of the substrate P is wound by the outer peripheral surface of the second cylindrical member 22. Consistent with the diameter of the SD scale GP of the encoder scale disc (to make it substantially uniform), the so-called measurement Abbe error can be further reduced.

刻設在編碼器標尺圓盤SD周方向之刻度GP之最小間距,受對編碼器標尺圓盤SD進行加工之刻度刻線裝置等之性能限制。因此,若加大編碼器標尺圓盤SD之直徑的話,即能對應於此而提高對應最小間距之角度測量分解能力。將配置用以讀取刻度GP之編碼器讀頭EN1、EN2之設置方位線Le1、Le2之方向,從旋轉中心線AX2觀察時,藉由做成相對基板P與成像光束EL2之主光線射入基板P之方向相同,例如,即使是在因支成旋轉軸ST之軸承(bearing)之些微的間隙(2μm~3μm程度)導致第2筒構件22往X方向偏移之情形時,即能將因此偏移而可能在投影區域PA1~PA6內發生之基板P於搬送方向(Xs)之位置誤差,藉由編碼器讀頭EN1、EN2高精度的測量出。 The minimum pitch of the scale GP engraved in the SD circumferential direction of the encoder scale disc is limited by the performance of the scale engraving device for processing the encoder scale disc SD. Therefore, if the diameter of the encoder scale disc SD is increased, the angle measurement decomposition capability corresponding to the minimum pitch can be improved accordingly. The direction of the set azimuth lines Le1, Le2 of the encoder read heads EN1, EN2 for reading the scale GP is configured to be incident on the principal axis of the opposite substrate P and the imaging beam EL2 when viewed from the rotation center line AX2. The direction of the substrate P is the same. For example, even when the second tubular member 22 is displaced in the X direction due to a slight gap (about 2 μm to 3 μm) of the bearing that is supported by the rotating shaft ST, the second tubular member 22 can be displaced in the X direction. Therefore, the positional error of the substrate P in the transport direction (Xs) which may occur in the projection areas PA1 to PA6 due to the offset is accurately measured by the encoder read heads EN1 and EN2.

如圖5所示,為了在被支承於第2筒構件22之曲面之基板 P之一部分,將以圖1所示之投影光學系PL投影之光罩圖案之一部分之像與基板P加以相對的定位(對準),設有檢測預先形成在基板P之對準標記等的複數個對準顯微鏡AMG1、AMG2。對準顯微鏡AMG1、AMG2係配置在第2筒構件22周圍之圖案檢測裝置。對準顯微鏡AMG1、AMG2係用以檢測基板P上離散的或連續形成之特定圖案的檢測器。此檢測器之檢測區域,較上述特定位置配置在基板P之搬送方向上游側。 As shown in FIG. 5, in order to be supported on the curved surface of the second tubular member 22 In one of the parts P, the image of one portion of the mask pattern projected by the projection optical system PL shown in FIG. 1 is positioned (aligned) with respect to the substrate P, and the alignment mark or the like which is formed in advance on the substrate P is provided. A plurality of alignment microscopes AMG1, AMG2. The alignment microscopes AMG1 and AMG2 are pattern detecting devices arranged around the second tubular member 22. The alignment microscopes AMG1, AMG2 are detectors for detecting discrete or continuously formed specific patterns on the substrate P. The detection area of the detector is disposed on the upstream side in the transport direction of the substrate P from the specific position.

如圖5所示,對準顯微鏡AMG1、AMG2具有於Y軸方向(基板P之寬度方向)排列成一排之複數個(例如4個)檢測器。對準顯微鏡AMG1、AMG2,可藉由在第2筒構件22之Y軸方向兩側端之檢測器,隨時觀察或檢測形成在基板P之寬度方向兩端附近之對準標記。此外,對準顯微鏡AMG1、AMG2,可藉由在第2筒構件22之Y軸方向(基板P之寬度方向)兩側端以外之檢測器,觀察或檢測例如基板P上沿長條方向形成之複數個在顯示面板之圖案形成區域間之余白部等形成之對準標記。 As shown in FIG. 5, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detectors arranged in a row in the Y-axis direction (the width direction of the substrate P). By aligning the microscopes AMG1 and AMG2, the alignment marks formed in the vicinity of both ends in the width direction of the substrate P can be observed or detected at any time by the detectors at the opposite ends of the second cylindrical member 22 in the Y-axis direction. Further, the alignment microscopes AMG1 and AMG2 can be observed or detected by, for example, a detector other than the both side ends of the second tubular member 22 in the Y-axis direction (the width direction of the substrate P) in the longitudinal direction. A plurality of alignment marks formed by a white portion or the like between the pattern forming regions of the display panel.

如圖5所示,將通過對準顯微鏡AMG1、AMG2對基板P上之各觀察區域中心(檢測中心)、與第2中心軸AX2正交之線設為觀察方位線AM1、AM2。此場合,4個對準顯微鏡AMG1之各觀察方位線AM1係於Y軸方向平行排列,同樣的,4個對準顯微鏡AMG2之各觀察方位線AM2亦於Y軸方向平行排列。 As shown in FIG. 5, the center of each observation region (detection center) on the substrate P and the line orthogonal to the second central axis AX2 by the alignment microscopes AMG1 and AMG2 are the observation azimuth lines AM1 and AM2. In this case, the observation direction lines AM1 of the four alignment microscopes AMG1 are arranged in parallel in the Y-axis direction. Similarly, the observation direction lines AM2 of the four alignment microscopes AMG2 are also arranged in parallel in the Y-axis direction.

如圖5及圖6所示,於XZ面內觀察時,編碼器讀頭EN4之設置方位線Le4係與4個對準顯微鏡AMG1之各觀察方位線AM1設定在相同方位。又,編碼器讀頭EN5之設置方位線Le5則與4個對準顯微鏡AMG2之各觀察方位線AM2設定在相同方位。 As shown in FIGS. 5 and 6, when viewed in the XZ plane, the set azimuth line Le4 of the encoder read head EN4 is set in the same orientation as the respective observation direction lines AM1 of the four alignment microscopes AMG1. Further, the set azimuth line Le5 of the encoder read head EN5 is set in the same orientation as each of the observation azimuth lines AM2 of the four alignment microscopes AMG2.

如以上所述,對準顯微鏡AMG1、AMG2之各檢測器,從第2中心軸AX2觀察時,係配置在第2筒構件22之周圍。此外,對準顯微鏡AMG1、AMG2之檢測器,係以連結編碼器讀頭EN4、EN5之配置位置與第2中心軸AX2之方向(設置方位線Le4、Le5)與連結第2中心軸AX2與對準顯微鏡AMG1、AMG2之檢測中心之方向一致的方式配置。又,配置對應對準顯微鏡AMG1、AMG2之各觀察區域(檢測中心)的編碼器讀頭EN4、EN5、及對應投影模組PL1~PL6之各投影區域PA1~PA6的編碼器EN1、EN2在旋轉中心線AX2周圍方向之位置,如圖6所示,係設定在基板P開始接觸第2筒構件22之片材進入區域IA、與基板P從第2筒構件22脫離之片材脫離區域OA之間。 As described above, each of the detectors of the alignment microscopes AMG1 and AMG2 is disposed around the second tubular member 22 when viewed from the second central axis AX2. Further, the detectors for the alignment microscopes AMG1 and AMG2 are connected to the arrangement positions of the encoder heads EN4 and EN5 and the direction of the second central axis AX2 (the installation direction lines Le4 and Le5) and the second central axis AX2 and the pair. The directions of the detection centers of the quasi-microscopes AMG1 and AMG2 are arranged in a same manner. Further, the encoders EN1 and EN5 corresponding to the respective observation areas (detection centers) of the alignment microscopes AMG1 and AMG2 are arranged, and the encoders EN1 and EN2 corresponding to the projection areas PA1 to PA6 of the corresponding projection modules PL1 to PL6 are rotated. As shown in FIG. 6, the position in the direction around the center line AX2 is set to the sheet detachment area OA where the substrate P starts to contact the sheet entry region IA of the second cylinder member 22 and the substrate P is detached from the second cylinder member 22. between.

對準顯微鏡AMG1、AMG2配置在曝光位置(投影區域PA)之前。對準顯微鏡AMG1、AMG2,例如係將形成在板P之Y方向端部附近之對準標記(形成在數十μm~數百μm對角內之區域)之像,在基板P被以既定速度搬送之狀態下,以CCD(Charge Coupled Device)或CMOS(Complementary Metal Oxide Semiconductor)等之攝影元件等高速的進行影像檢測(取樣sampling)者。在進行該取樣之瞬間,控制裝置14儲存(latch)以編碼器讀頭EN4逐次測量之編碼器標尺圓盤SD之旋轉角度位置,據以求出基板P上之標記位置與第2筒構件22之旋轉角度位置的對應關係。 The alignment microscopes AMG1, AMG2 are placed before the exposure position (projection area PA). The alignment microscopes AMG1 and AMG2 are formed, for example, by forming an image of an alignment mark (a region formed in a diagonal of several tens of μm to several hundreds μm) in the vicinity of the end portion of the sheet P in the Y direction, at a predetermined speed on the substrate P. In the state of being transported, image detection (sampling sampling) is performed at a high speed such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). At the instant of the sampling, the control device 14 latches the rotational angular position of the encoder scale disk SD successively measured by the encoder read head EN4, thereby determining the marked position on the substrate P and the second tubular member 22 Correspondence of the position of the rotation angle.

將以對準顯微鏡AMG1檢測之標記,亦以後續之對準顯微鏡AMG2檢測時,亦能測量基板P之伸縮及在第2筒構件22上之些微的滑動。儲存對準顯微鏡AMG1進行標記之取樣時以編碼器讀頭EN4測量之角 度位置Φa1、與對準顯微鏡AMG2進行同一標記之取樣時以編碼器讀頭EN5測量之角度位置Φa2。 When the mark detected by the alignment microscope AMG1 is also detected by the subsequent alignment microscope AMG2, the expansion and contraction of the substrate P and the slight sliding on the second cylindrical member 22 can also be measured. Storing the angle of the encoder reading head EN4 when storing the alignment microscope AMG1 for sampling The angular position Φa1 measured by the encoder read head EN5 when the same position is sampled with the alignment microscope AMG2.

又,連接在2個編碼器讀頭EN4、EN5(及EN1、EN2、EN3)之各個,用以輸出對應角度位置之測量值得可逆計數器(計數器),例如,係在刻設於標尺圓盤SD外周面之原點標記(未圖示)被特定之編碼器讀頭(EN1~EN5中之任一個)檢測到之瞬間或任意時間,被同時歸零(zero reset)。將以此方式求出之角度位置Φa1與Φa2之差值,與預先經精密校正之2個對準顯微鏡AMG1、AMG2之設置方位線Le4、Le5之展開角Φ0加以比較。在差值(Φa1-Φa2)與展開角Φ0之間產生誤差時,即有在片材進入區域IA與片材脫離區域OA之間產生基板P於第2筒構件22上些微的滑動或於搬送方向(周方向)伸縮的可能性。 Further, it is connected to each of the two encoder heads EN4, EN5 (and EN1, EN2, EN3) for outputting a corresponding angle position measurement worthy of a reversible counter (counter), for example, engraved on the scale disc SD The origin mark (not shown) of the outer peripheral surface is zero reset at the instant or any time detected by the specific encoder read head (any one of EN1 to EN5). The difference between the angular positions Φa1 and Φa2 obtained in this way is compared with the developed angle Φ0 of the set orientation lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2 which have been precisely corrected in advance. When an error occurs between the difference (Φa1 - Φa2) and the unfolding angle Φ0, there is a slight slip or transfer of the substrate P between the sheet entry region IA and the sheet detachment region OA on the second tubular member 22. The possibility of stretching in the direction (circumferential direction).

一般而言,圖案化時之位置誤差係視形成在基板P上之元件圖案之微細度及重疊精度而定,例如,欲對底圖案層正確的重疊曝光10μm寬度之線條圖案,僅能容許其數分之一以下之誤差、亦即換算基板P上之尺寸,僅能容許±2μm程度之位置誤差。為實現此種高精度測量,必須使各對準顯微鏡AMG1、AMG2對標記影像之測量方向(在XZ面內之第2筒構件22之外周切線方向)與各編碼器讀頭EN4、EN5之測量方向(在XZ面內之刻度GP之外周切線方向),在容許角度誤差內一致。 In general, the positional error during patterning depends on the fineness of the element pattern formed on the substrate P and the accuracy of the overlap. For example, a line pattern of 10 μm width is to be accurately overlapped with the bottom pattern layer, and only the line pattern can be allowed. The error of one-third or less, that is, the size on the conversion substrate P, can only allow positional errors of about ±2 μm. In order to achieve such high-precision measurement, it is necessary to measure the measurement direction of the mark image (the tangential direction of the outer circumference of the second cylindrical member 22 in the XZ plane) of each alignment microscope AMG1, AMG2, and the measurement of each encoder read head EN4, EN5. The direction (the tangential direction outside the scale GP in the XZ plane) is consistent within the allowable angle error.

如上所述,編碼器讀頭EN4、EN5係配置成與對準顯微鏡AMG1、AMG2對基板P上之對準標記之測量方向(第2筒構件22之圓周面之切線方向)一致。因此,即使在對準顯微鏡AMG1、AMG2對基板P(標記)之位置檢測時(影像取樣時),第2筒構件22(編碼器標尺圓盤SD) 於XZ面內往與設置方位線Le4或Le5正交之周方向(切線方向)偏移之情形時,亦能進行考慮了第2筒構件22之偏移的高精度位置測量。 As described above, the encoder read heads EN4 and EN5 are arranged to coincide with the alignment directions of the alignment marks on the substrate P (the tangential direction of the circumferential surface of the second cylindrical member 22) with the alignment microscopes AMG1 and AMG2. Therefore, even when the position of the substrate P (mark) is detected by the alignment microscopes AMG1 and AMG2 (during image sampling), the second cylinder member 22 (encoder scale disc SD) When the XZ plane is shifted to the circumferential direction (tangential direction) orthogonal to the set orientation line Le4 or Le5, high-precision position measurement in consideration of the offset of the second tubular member 22 can be performed.

又,若刻度GP之刻度間距恆一定,設旋轉沒有速度不均,則編碼器讀頭EN1、EN2、EN3、EN4、EN5之各讀取值之變化間隔(對計數器之升降脈衝之產生時間)即一定。然而,事實上,有可能因將編碼器標尺圓盤SD安裝於第2筒構件22時編碼器標尺圓盤SD之變形、安裝編碼器讀頭EN1、EN2、EN3、EN4、EN5時之位置(傾斜、tilt)誤差、編碼器標尺圓盤SD製造時之精度、安裝時之偏心等的影響等,於刻度GP產生固有誤差(刻度本身之間距誤差、偏心及變形等導致之間距不均等)。此外,於刻度GP亦可能產生因基板處理裝置11於運轉中等之温度變化引起之編碼器標尺圓盤SD之伸縮等,因隨時變動之要素造成之固有誤差。於本實施形態,係求出伴隨上述原因產生之刻度GP之固有誤差而產生之測量誤差。並根據所得之測量誤差作成用以修正刻度GP之固有誤差分的修正圖表(map,修正量資料),根據修正圖表修正複數個編碼器讀頭EN1~EN5之各讀取值(實測量值),以進行抵消或降低刻度GP之固有誤差導致之測量誤差分的測量。 Moreover, if the scale interval of the scale GP is constant, and there is no speed unevenness in the rotation, the interval between the read values of the encoder read heads EN1, EN2, EN3, EN4, and EN5 (the generation time of the rising and falling pulses of the counter) That is to be sure. However, in fact, there is a possibility that the encoder scale disk SD is deformed when the encoder scale disk SD is mounted on the second cylinder member 22, and the position of the encoder read heads EN1, EN2, EN3, EN4, EN5 is mounted ( The tilt, tilt error, the accuracy of the encoder scale disc SD, the eccentricity during installation, etc., cause an inherent error in the scale GP (the distance between the scale itself is uneven, eccentricity and deformation, etc.). Further, in the scale GP, there is a possibility that the encoder scale disk SD is stretched and contracted due to a temperature change of the substrate processing apparatus 11 during the operation, and the inherent error caused by the element that changes at any time. In the present embodiment, the measurement error caused by the inherent error of the scale GP caused by the above-described cause is obtained. And according to the obtained measurement error, a correction chart (map, correction amount data) for correcting the inherent error component of the scale GP is prepared, and each of the reading values (actual measurement values) of the plurality of encoder read heads EN1 to EN5 is corrected according to the correction chart. To perform a measurement that offsets or reduces the measurement error score caused by the inherent error of the scale GP.

於本實施形態,因刻度GP之刻度之間距誤差及間距不均等引起之測量誤差之修正圖表作成,係根據與作為圓筒構件之第2筒構件22同軸安裝狀態之標尺圓盤SD外周所配置之複數個編碼器讀頭之實測量值來實施。此處,係以作為第1讀取部之編碼器讀頭EN4、作為第2讀取部之編碼器讀頭EN5、以及作為修正部及圖表作成部之控制裝置14,作成修正圖表。本實施形態中,雖為方便起見,將編碼器讀頭EN4設為第1讀取 部、將編碼器讀頭EN5設為第2讀取部,但第1讀取部及第2讀取部只要是預先知道安裝角度間隔之至少2處的編碼器讀頭即可。 In the present embodiment, the correction chart of the measurement error caused by the difference in the pitch between the scales of the scale GP and the unevenness of the pitch is formed by the outer circumference of the scale disc SD coaxially mounted with the second tubular member 22 as the cylindrical member. The actual measured values of the plurality of encoder read heads are implemented. Here, the correction chart is created by the encoder read head EN4 as the first reading unit, the encoder read head EN5 as the second reading unit, and the control unit 14 as the correction unit and the chart forming unit. In the present embodiment, the encoder read head EN4 is set to the first reading for the sake of convenience. The encoder read head EN5 is the second reading unit, but the first reading unit and the second reading unit may be any encoder read head that knows at least two positions of the mounting angle in advance.

作為修正部之控制裝置14,根據編碼器讀頭EN4之讀取值(設係計數器之計數值m4)與編碼器讀頭EN5之讀取值(設係計數器之計數值m5)之差值(m4-m5)、或從對應編碼器讀頭EN4與編碼器讀頭EN5之角度間隔的既定值(例如與其間之刻度數對應之值,設係K45)減去差值(m4-m5)之差值(K45-m4-m5),將在刻度GP一周分產生之刻度間距誤差,例如就從刻度GP之原點位置到既定角度位置之毎一個加以求出。接著,控制裝置14將刻度GP之一周分之刻度間距誤差資料作為修正圖表加以儲存,並根據該修正圖表修正編碼器讀頭EN4之讀取值、編碼器讀頭EN5之讀取值或其他編碼器讀頭EN1~EN3之各讀取值。 As the control unit 14 of the correction unit, the difference between the read value of the encoder read head EN4 (the count value m4 of the set counter) and the read value of the encoder read head EN5 (the count value m5 of the set counter) is M4-m5), or from the predetermined value of the angular interval of the corresponding encoder read head EN4 and the encoder read head EN5 (for example, the value corresponding to the number of scales between them, set K45) minus the difference (m4-m5) The difference (K45-m4-m5) is the difference in the scale pitch generated in one minute of the scale GP, for example, from the origin position of the scale GP to the position of the predetermined angle. Next, the control device 14 stores the scale pitch error data of one of the scales GP as a correction chart, and corrects the read value of the encoder read head EN4, the read value of the encoder read head EN5 or other code according to the correction chart. The read values of the read heads EN1~EN3.

圖7係以示意方式顯示刻度GP之刻度的放大圖。圖8係顯示刻度GP與編碼器讀頭EN4、EN5之位置關係的示意圖。如圖7所示,刻度GP之刻度,例如係由具上升部GPa與下降部GPb之凸部GPt、與相鄰凸部GPt間之凹部GPU的重複所構成。本實施形態中,係設1個凸部GPt與1個凹部GPU為刻度GP之一單位、亦即刻度之1間距。為簡化說明,各編碼器讀頭EN1~EN5,係設讀取到刻度之上升部GPa時輸出上升脈衝(up pulse)U,讀取到下降部GPb時輸出下降脈衝(down pulse)D。 Fig. 7 is an enlarged view showing the scale of the scale GP in a schematic manner. Fig. 8 is a view showing the positional relationship between the scale GP and the encoder read heads EN4 and EN5. As shown in FIG. 7, the scale of the scale GP is constituted by, for example, a repetition of the convex portion GPt having the rising portion GPa and the descending portion GPb and the concave portion GPU between the adjacent convex portions GPT. In the present embodiment, one convex portion GPt and one concave portion GPU are one unit of the scale GP, that is, one pitch of the scale. For simplification of explanation, each of the encoder heads EN1 to EN5 outputs an up pulse U when reading the rising portion GPa of the scale, and outputs a down pulse D when reading the falling portion GPb.

刻度GP之刻度,從其上升部GPa至相鄰刻度GP之上升部GPa為止之距離SS1或從其下降部GPb至相鄰刻度之下降部GPb為止之距離SS2,為刻度彼此之間距(間隔)。當將編碼器標尺圓盤SD之設計時所定之刻度間距設為SS,若刻度GP是正確無誤製造出的話,則在刻度GP上 之任一部分,距離SS1或SS2皆與刻度間距SS一致。 The scale of the scale GP, the distance SS1 from the rising portion GPa to the rising portion GPa of the adjacent scale GP or the distance SS2 from the falling portion GPb to the descending portion GPb of the adjacent scale is the distance between the scales (interval) . When the designation of the encoder scale disc SD is set to the SS pitch, if the scale GP is correctly manufactured, it is on the scale GP. In either part, the distance SS1 or SS2 is consistent with the scale spacing SS.

從而,在刻度GP往圖7之箭頭R所示方向移動時,以編碼器讀頭EN輸出之脈衝觀察的話,在輸出2個上升脈衝U與1個下降脈衝U時、或輸出2個下降脈衝D與1個上升脈衝U時,編碼器標尺圓盤SD(參照圖6)之外周面(刻度GP)即係移動(旋轉)刻度間距SS分。若不區分編碼器讀頭EN輸出之脈衝種類的話,每檢測到3個脈衝時,即係編碼器標尺圓盤SD之外周部移動了刻度間距SS分。 Therefore, when the scale GP moves in the direction indicated by the arrow R of FIG. 7, when the pulse of the output of the encoder read head EN is observed, when two rising pulses U and one falling pulse U are output, or two falling pulses are output. When D and one rising pulse U, the outer circumference (scale GP) of the encoder scale disk SD (refer to FIG. 6) is a moving (rotation) scale pitch SS. If the pulse type of the encoder read head EN output is not distinguished, each time three pulses are detected, the outer circumference of the encoder scale disc SD is shifted by the scale interval SS.

又,於實際之編碼器測量,係從編碼器讀頭產生2相訊號(sin波、cos波),依據此2相訊號進行將刻度間距SS進一步細分化之內插訊號處理。因此,以數位計數器實際計數之上升脈衝U及下降脈衝D,係在將刻度間距SS等分為數分之一~數十分之一的每一位置產生。 Moreover, in the actual encoder measurement, a 2-phase signal (sin wave, cos wave) is generated from the encoder read head, and the interpolated signal processing for further subdividing the scale interval SS is performed based on the 2-phase signal. Therefore, the rising pulse U and the falling pulse D actually counted by the digital counter are generated at each position where the scale pitch SS is equally divided by one-tenth to one-tenth.

圖8係以示意方式顯示將設在標尺圓盤SD外周部之刻度GP之複數個刻度排列成直線者。圖8中,係設設在編碼器標尺圓盤SD之外周部之刻度GP往箭頭R所示方向移動。作為第1讀取部之編碼器讀頭EN4與作為第2讀取部之編碼器讀頭EN5,係朝向刻度GP之移動方向以此順序配置。2個編碼器讀頭EN4、EN5,就刻度GP觀察時,係相對的往與刻度GP之移動方向相反之方向移動。 Fig. 8 is a schematic diagram showing that a plurality of scales of the scale GP provided on the outer peripheral portion of the scale disc SD are arranged in a straight line. In Fig. 8, the scale GP provided on the outer circumference of the encoder scale disk SD is moved in the direction indicated by the arrow R. The encoder read head EN4 as the first reading unit and the encoder read head EN5 as the second reading unit are arranged in this order toward the moving direction of the scale GP. The two encoder heads EN4 and EN5 move relative to the direction in which the scale GP moves in the case of the scale GP.

如圖6所示,一對編碼器讀頭EN4、EN5,連結編碼器讀頭EN4與第2中心軸AX2之線(設置方位線Le4)、與連結編碼器讀頭EN5與第2中心軸AX2之線(設置方位線Le5)所夾之中心角(編碼器安裝角度)為θs。又,如圖8所示,一對編碼器讀頭EN4、EN5在編碼器標尺圓盤SD表面讀取刻度GP之位置、於刻度GP之周長方向的直線距離(讀頭間距離) 為XS。 As shown in Fig. 6, a pair of encoder read heads EN4 and EN5 connect the line between the encoder read head EN4 and the second central axis AX2 (set the azimuth line Le4), and the coupled encoder read head EN5 and the second central axis AX2. The center angle (encoder mounting angle) sandwiched by the line (set the azimuth line Le5) is θs. Further, as shown in Fig. 8, a pair of encoder read heads EN4 and EN5 read the position of the scale GP on the surface of the encoder scale disk SD, and the linear distance in the circumferential direction of the scale GP (distance between the read heads) For XS.

一對編碼器讀頭EN4、EN5,當被安裝於基板處理裝置11之框架等時,編碼器安裝角度θs及讀頭間距離XS即一定。如上所述,因編碼器標尺圓盤SD之變形、編碼器標尺圓盤SD之製造時精度、安裝時之偏心、因温度變化引起之編碼器標尺圓盤SD之伸縮等,刻度間距SS於編碼器標尺圓盤SD之周方向,並不一定是一定的。例如,以極為示意之方式說明的話,如圖8所示,於刻度GP上之區域a、c、d,在1個編碼器安裝角度θs及1個讀頭間距離XS之間將上升部GPa與下降部GPb設為一組,則存在3個刻度GP。然而,區域b存在2.5個、區域e則存在6個刻度GP。 When the pair of encoder heads EN4 and EN5 are mounted on the frame of the substrate processing apparatus 11, etc., the encoder mounting angle θs and the head-to-read distance XS are constant. As described above, the scale spacing SS is encoded due to the deformation of the encoder scale disc SD, the manufacturing accuracy of the encoder scale disc SD, the eccentricity during installation, the expansion and contraction of the encoder scale disc SD due to temperature changes, and the like. The circumferential direction of the gauge disc SD is not necessarily constant. For example, as illustrated in a very schematic manner, as shown in FIG. 8, the areas a, c, and d on the scale GP will have a rising portion GPa between one encoder mounting angle θs and one inter-header distance XS. When the descending portion GPb is set to one set, there are three scales GP. However, there are 2.5 regions b, and there are 6 scale GPs for region e.

圖8所示例中,刻度間距SS為設計值時,例如,在1個編碼器安裝角度θs及1個讀頭間距離XS之間,存在規定數(此例中為3個)之刻度GP。實際上,因上述刻度GP之誤差原因,1個編碼器安裝角度θs及1個讀頭間距離XS之間存在之刻度GP之數,會與前述規定數有所増減。圖8中之區域a,刻度間距雖為SSa,但於區域b因刻度GP之數較規定數少,因此區域b之刻度間距SSb會較區域a之刻度間距SSa大。此外,由於區域e之刻度GP之數較規定數多,因此區域e之刻度間距SSe會較刻度間距SSa小。 In the example shown in Fig. 8, when the scale pitch SS is a design value, for example, between one encoder mounting angle θs and one inter-header distance XS, there is a predetermined number GP (three in this example). Actually, due to the error of the above-mentioned scale GP, the number of scales GP existing between one encoder mounting angle θs and one head-to-head distance XS is reduced by the aforementioned number. In the area a in Fig. 8, although the scale pitch is SSa, the number of scales GP in the region b is smaller than the predetermined number, so the scale pitch SSb of the region b is larger than the scale pitch SSa of the region a. Further, since the number of scales GP of the region e is larger than the prescribed number, the scale pitch SSe of the region e is smaller than the scale pitch SSa.

例如,假設設計上之刻度間距SS為100、設計上之讀頭間距離XS為300。於圖8之區域a、c、d,根據編碼器讀頭EN4、EN5讀取刻度GP之各值(計數器之計數)算出之實際讀頭間距離X為300。此與設計上之讀頭間距離XS一致。相對於此,於圖8之區域b,根據編碼器讀頭EN4、EN5讀取之各值(計數器之計數值)算出之實際讀頭間距離X為250,於區 域e,根據編碼器讀頭EN4、EN5之讀取值(計數器之計數值)的實際讀頭間距離X則為600。 For example, suppose the design has a scale spacing SS of 100 and a design readhead distance XS of 300. In the areas a, c, and d of Fig. 8, the actual inter-header distance X calculated by reading the values of the scale GP (the counter count) by the encoder read heads EN4 and EN5 is 300. This is consistent with the distance XS between the read heads on the design. On the other hand, in the region b of FIG. 8, the actual read head distance X calculated based on the values read by the encoder read heads EN4 and EN5 (the count value of the counter) is 250. The actual inter-header distance X of the domain e, according to the read value of the encoder read heads EN4, EN5 (the counter value of the counter) is 600.

如以上所述,設計上之讀頭間距離XS與實際讀頭間距離X間之差異,係因刻度GP之刻度間距誤差所引起。將一對編碼器讀頭EN4、EN5固定於裝置後,若將裝置設置在一定温度之環境中的話,讀頭間距離XS不會變化。因此,例如將編碼器讀頭EN4、EN5固定後之讀頭間距離XS作為基準,作成從編碼器讀頭EN4、EN5之讀取值求出之刻度GP之刻度間距誤差的圖表(每1周360°之角度位置之誤差量或誤差之修正量)。該圖表之作成後,根據編碼器讀頭EN4、EN5(或其他讀頭EN1~EN3)之標尺GP之讀取值(計數器之計數值),將對應該角度位置之誤差量或修正量從圖表中叫出並逐次修正的話,即能即時修正標尺GP之周長方向之移動距離誤差。 As described above, the difference between the design read head distance XS and the actual read head distance X is caused by the scale pitch error of the scale GP. After the pair of encoder read heads EN4 and EN5 are fixed to the device, the distance XS between the read heads does not change if the device is placed in a certain temperature environment. Therefore, for example, a graph of the scale pitch error of the scale GP obtained from the read values of the encoder heads EN4 and EN5 is made based on the inter-head reading distance XS after the encoder heads EN4 and EN5 are fixed (every week). The amount of error in the angular position of 360° or the correction amount of the error). After the chart is created, according to the reading value of the scale GP (counter value of the counter) of the encoder read head EN4, EN5 (or other read heads EN1~EN3), the error amount or correction amount corresponding to the angular position is taken from the chart. If it is called out and corrected one by one, it can instantly correct the moving distance error of the circumference of the scale GP.

修正實際之刻度間距誤差及刻度GP之移動距離誤差之情形時,例如使用於刻度GP無誤差時之刻度間距SS、設計上之讀頭間距離XS及實讀頭間距離X,進而在刻度GP產生誤差時之實際之刻度間距(實際刻度間距)SSr,例如以式(1)求出。藉由實際刻度間距SSr之使用,修正刻度GP之誤差,其結果,亦能修正刻度GP之移動距離之誤差。 When correcting the actual scale spacing error and the moving distance error of the scale GP, for example, the scale spacing SS when the scale GP has no error, the distance XS between the read heads and the distance X between the real heads, and thus the scale GP The actual scale pitch (actual scale pitch) SSr at the time of the error is obtained, for example, by the equation (1). The error of the scale GP is corrected by the use of the actual scale pitch SSr, and as a result, the error of the moving distance of the scale GP can also be corrected.

SSr=SS×XS/X…(1) SSr=SS×XS/X...(1)

又,亦可根據一對編碼器讀頭EN4、EN5所讀取之在讀頭間距離XS之間存在之刻度GP之數(測量刻度線)NS修正刻度GP之誤差,以修正刻度GP之移動距離誤差。讀頭間距離XS間存在之刻度線之數NS,以可透過從一對編碼器讀頭EN4、EN5所得之上升脈衝U及下降脈衝D之 計數器的計數值加以求出。使用測量刻度線NS時,實際刻度間距SSr可以包含讀頭間距離XS之式(2)求出。 Moreover, the error of the scale GP can be corrected according to the number of scales GP (measured scale line) NS existing between the read heads XS read by the pair of encoder read heads EN4 and EN5 to correct the moving distance of the scale GP. error. The number of scale lines NS existing between the read heads and the XS is such that the rising pulse U and the falling pulse D obtained from the pair of encoder read heads EN4 and EN5 are transmitted. The count value of the counter is found. When the measurement scale line NS is used, the actual scale pitch SSr can be obtained by the equation (2) of the distance XS between the read heads.

SSr=XS/NS…(2) SSr=XS/NS...(2)

刻度間距之誤差及刻度GP之移動距離之誤差,可由圓筒構件之位置檢測裝置所具有之作為修正部之控制裝置14,例如藉由使用式(1)或式(2)之運算,適用對一對編碼器讀頭EN4、EN5之讀取值的修正量。因此,具備控制裝置14之圓筒構件之位置檢測裝置及基板處理裝置11,即使因設置刻度GP之編碼器標尺圓盤SD之變形等使刻度間距SS產生誤差,以能藉由誤差圖表或修正圖表之使用,近乎即時修正該誤差,因此針對編碼器標尺圓盤SD及第2筒構件22,可實現高精度之位置測量(於周方向之位置測量)。其次,說明刻度間距之誤差及移動距離之誤差之修正。 The error of the scale pitch and the error of the moving distance of the scale GP may be applied to the control device 14 as the correction unit of the position detecting device of the cylindrical member, for example, by using the operation of the formula (1) or (2). The correction amount of the read value of a pair of encoder read heads EN4 and EN5. Therefore, the position detecting device and the substrate processing device 11 including the cylindrical member of the control device 14 can cause an error in the scale pitch SS by the deformation of the encoder scale disk SD on which the scale GP is provided, so that the error chart or the correction can be used. Since the use of the graph corrects the error almost instantaneously, it is possible to realize high-accuracy position measurement (position measurement in the circumferential direction) for the encoder scale disc SD and the second cylinder member 22. Next, the correction of the error of the scale pitch and the error of the moving distance will be described.

圖9係顯示修正標尺之刻度間距誤差之順序的流程圖。圖10係顯示外周面具有刻度之標尺圓盤SD與編碼器讀頭EN4、EN5間之關係的圖。圖11係顯示修正圖表之一例的圖。修正刻度GP之刻度間距誤差時,如圖10所示,預先測量一對編碼器讀頭EN4、EN5之讀頭間距離XS,將之儲存於控制裝置14所有之記憶部。讀頭間距離XS係以一對編碼器讀頭EN4、EN5於編碼器標尺圓盤SD之外周面讀取刻度GP之位置加以求出。一對編碼器讀頭EN4、EN5讀取刻度GP之位置,可設為編碼器標尺圓盤SD為真圓,且編碼器標尺圓盤SD相對旋轉中心線AX2無偏心之狀態下的位置。此場合,如圖10所示,在從旋轉中心線AX2至編碼器標尺圓盤SD之設計值半徑(中心至外周面之距離)ra彎曲之曲面Pd(刻度GP之刻度面)上,測量一對編碼器讀頭EN4、EN5之讀頭間距離XS。圖10所示例中, 編碼器標尺圓盤SD之刻度GP,係往箭頭R所示方向、亦即從編碼器讀頭EN4往編碼器讀頭EN5旋轉(旋回)。 Figure 9 is a flow chart showing the sequence of correcting the scale pitch error of the scale. Fig. 10 is a view showing the relationship between the scale disk SD having the scale on the outer peripheral surface and the encoder read heads EN4 and EN5. Fig. 11 is a view showing an example of a correction chart. When the scale pitch error of the scale GP is corrected, as shown in FIG. 10, the inter-reader distance XS of a pair of encoder read heads EN4 and EN5 is measured in advance and stored in all the memory sections of the control device 14. The head-to-head distance XS is obtained by reading the scale GP on the outer peripheral surface of the encoder scale disk SD by a pair of encoder heads EN4 and EN5. The position of the pair of encoder read heads EN4 and EN5 reading the scale GP can be set to a position in which the encoder scale disk SD is a true circle and the encoder scale disk SD is not eccentric with respect to the rotation center line AX2. In this case, as shown in FIG. 10, on the curved surface Pd (the scale surface of the scale GP) curved from the rotation center line AX2 to the design value radius (the distance from the center to the outer peripheral surface) of the encoder scale disk SD, one is measured. The read head distance XS of the encoder read heads EN4 and EN5. In the example shown in Figure 10, The scale GP of the encoder scale disc SD is rotated (rotated back) from the encoder read head EN4 to the encoder read head EN5 in the direction indicated by the arrow R.

如圖9所示,於步驟S101中,在尚未開始圖1所示之基板處理裝置11之處理時(步驟S101、No),不實施刻度GP等之修正。於步驟S101中,在基板處理裝置11之處理開始,標尺圓盤SD安定旋轉時(步驟S101、Yes),於步驟S102中,控制裝置14以既定時序從編碼器讀頭EN4、EN5取得此等之讀取值(計數器之計數值)。以既定時序取得,係指例如在編碼器標尺圓盤SD之刻度GP以旋轉中心線AX2為中心每旋轉既定角度α(度)時,由控制裝置14取得編碼器讀頭EN4、EN5之各讀取值,亦即鎖住(latch)各計數器之計數值加以儲存之事。以下,亦有將角度α、適當的稱為旋轉角度α之情形。在編碼器標尺圓盤SD以等角速度(等周速度)旋轉時,亦可在每既定時間t由控制裝置14取得兩方之編碼器讀頭EN4、EN5之各讀取值。此例中,α(度)以360之約數較佳,但角度α並不限定於此。角度α,可視刻度間距誤差之傾向(誤差之振幅及周方向之變化率)決定。 As shown in FIG. 9, in step S101, when the processing of the substrate processing apparatus 11 shown in FIG. 1 has not been started (steps S101 and No), the correction of the scale GP or the like is not performed. In step S101, when the processing of the substrate processing apparatus 11 is started and the scale disk SD is stably rotated (steps S101 and Yes), in step S102, the control device 14 acquires these from the encoder heads EN4 and EN5 at a predetermined timing. The read value (count value of the counter). Obtaining at a predetermined timing means that, for example, when the scale GP of the encoder scale disk SD is rotated by a predetermined angle α (degrees) around the rotation center line AX2, the control device 14 acquires the readings of the encoder read heads EN4 and EN5. The value, that is, the count value of each counter is stored and stored. Hereinafter, the angle α and the appropriate rotation angle α are also referred to. When the encoder scale disk SD is rotated at an equal angular velocity (equal velocity), the read values of the encoder read heads EN4 and EN5 of both of the encoders can be obtained by the control device 14 every predetermined time t. In this example, α (degree) is preferably about 360, but the angle α is not limited thereto. The angle α is determined by the tendency of the scale pitch error (the amplitude of the error and the rate of change in the circumferential direction).

在編碼器標尺圓盤SD以等角速度旋轉之情形時,控制裝置14於每時間t從兩方之編碼器讀頭EN4、EN5取得此等之讀取值。在控制裝置14於每既定角度α從兩方之編碼器讀頭EN4、EN5取得此等之讀取值時,例如準備編碼器標尺圓盤SD之旋轉角度檢測手段。控制裝置14,於旋轉角度檢測手段每次檢測出編碼器標尺圓盤SD已旋轉角度α之時序,從兩方之編碼器讀頭EN4、EN5取得此等之讀取值。又,可將兩方之編碼器讀頭EN4、EN5中之任一方作為旋轉角度檢測手段。例如,當將編碼器讀頭 EN4用作為旋轉角度檢測手段時,控制裝置14,於編碼器讀頭EN4每次檢測出編碼器標尺圓盤SD已旋轉角度α之時序,從兩方之編碼器讀頭EN4、EN5取得此等之讀取值。編碼器標尺圓盤SD已旋轉角度α,係代表例如編碼器讀頭EN4檢測相當於旋轉角度α之刻度GP之數,可藉由輸出與此對應之脈衝數進行檢測。 In the case where the encoder scale disc SD is rotated at an equal angular velocity, the control unit 14 obtains the read values from the encoder read heads EN4, EN5 of both sides every time t. When the control device 14 obtains the read values from the encoder read heads EN4 and EN5 at both of the predetermined angles α, for example, the rotation angle detecting means of the encoder scale disk SD is prepared. The control device 14 acquires the read values of the encoder heads SD4 from the encoder heads EN4 and EN5 at the timing when the rotation angle detecting means detects the rotation angle α of the encoder scale disk SD. Further, either one of the encoder read heads EN4 and EN5 can be used as the rotation angle detecting means. For example, when the encoder is read When EN4 is used as the rotation angle detecting means, the control device 14 acquires the timing of the encoder scale disk SD having the rotation angle α every time the encoder head EN4 is obtained, and obtains these from the encoder heads EN4 and EN5 of both sides. Read the value. The encoder scale disc SD has a rotation angle α, which means that, for example, the encoder read head EN4 detects the number of scales GP corresponding to the rotation angle α, and can detect by outputting the number of pulses corresponding thereto.

其次,進到步驟S103,控制裝置14根據於步驟S102取得之讀取值,求出作為刻度GP之修正值的實際刻度間距SSr。例如,使用上述式(2)求出實際刻度間距SSr時,控制裝置14從編碼器讀頭EN4、EN5之讀取值求出測量標尺數NS。測量標尺數NS,係編碼器讀頭EN4之刻度GP之數之讀取值NSa、與編碼器讀頭EN5之刻度GP之數之讀取值NSb的差(NSa-NSb)。接著,控制裝置14讀出儲存在本身之記憶部之讀頭間距離XS,從式(2)求出實際刻度間距SSr。實際刻度間距SSr,即係在角度α(度)之範圍中刻度GP之間隔之修正值。又,使用上述式(2)求實際刻度間距SSr時,從測量標尺數NS與刻度GP無誤差時之刻度間距SS之積求出測量編碼器間距離X,再從讀頭間距離XS、刻度間距SS及測量編碼器間距離X求出測量標尺數NS即可。 Next, the process proceeds to step S103, and the control device 14 obtains the actual scale pitch SSr which is the correction value of the scale GP based on the read value obtained in step S102. For example, when the actual scale pitch SSr is obtained using the above equation (2), the control device 14 obtains the number of measurement scales NS from the read values of the encoder heads EN4 and EN5. The number of measurement scales NS is the difference (NSa-NSb) between the read value NSa of the number GP of the encoder read head EN4 and the read value NSb of the number GP of the encoder read head EN5. Next, the control device 14 reads the inter-header distance XS stored in its own memory unit, and obtains the actual scale pitch SSr from the equation (2). The actual scale spacing SSr is the correction value of the interval of the scale GP in the range of the angle α (degrees). Further, when the actual scale pitch SSr is obtained by the above equation (2), the distance between the measurement encoders X is obtained from the product of the measurement scale number NS and the scale interval SS when the scale GP has no error, and the distance between the read heads XS and the scale is obtained. The distance SS and the distance between the measurement encoders X can be obtained by determining the number of measurement scales NS.

測量標尺數NS,例如可以下述方式求出。在編碼器讀頭EN4讀取到作為編碼器標尺圓盤SD所具有之複數個刻度GP之基準的位置(標尺基準位置)GPb時,控制裝置14在將編碼器讀頭EN4重置(編碼器讀頭EN4之Z相之0點重置)後,進行編碼器讀頭EN4檢測之刻度GP數之計數。其次,編碼器讀頭EN5讀取到標尺基準位置GPb時,控制裝置14將編碼器讀頭EN5重置(編碼器讀頭EN5之Z相之0點重置)。控制裝置14並 取得編碼器讀頭EN5被重置為0時之編碼器讀頭EN4之刻度GP之數,求出與編碼器讀頭EN5讀取到標尺基準位置GPb時之刻度GP之數、亦即與0之差。此差,即係測量標尺數NS。自此之後,控制裝置14持續編碼器讀頭EN4、EN5之刻度GP之計數,並取得每既定角度α或每既定時間t之兩方之編碼器讀頭EN4、EN5之讀取值之計數值(刻度GP之計數值),求出其差,將此作為在既定角度α或既定時間t之測量標尺數NS。此例中,當編碼器標尺圓盤SD繞一圈時,標尺基準位置GPb雖會回到原來位置,此時,連接於編碼器讀頭EN4、EN5各個之計數器可重置、亦可不重置。 The number of measurement scales NS can be obtained, for example, in the following manner. When the encoder read head EN4 reads the position (scale reference position) GPb which is the reference of the plurality of scales GP of the encoder scale disk SD, the control device 14 resets the encoder read head EN4 (encoder) After the zero point of the Z phase of the read head EN4 is reset, the count of the number of scale GPs detected by the encoder read head EN4 is counted. Next, when the encoder read head EN5 reads the scale reference position GPb, the control device 14 resets the encoder read head EN5 (the zero point of the Z phase of the encoder read head EN5 is reset). Control device 14 The number of scales GP of the encoder read head EN4 when the encoder read head EN5 is reset to 0 is obtained, and the number of scales GP when the encoder read head EN5 is read to the scale reference position GPb, that is, 0 is obtained. Difference. This difference is the number of measurement scales NS. After that, the control device 14 continues the counting of the scale GP of the encoder read heads EN4, EN5, and obtains the count value of the read values of the encoder read heads EN4, EN5 for each of the predetermined angles α or every predetermined time t. (The count value of the scale GP), and the difference is obtained, and this is taken as the measurement scale number NS at the predetermined angle α or the predetermined time t. In this example, when the encoder scale disc SD is wound one turn, the scale reference position GPb will return to the original position. At this time, the counters connected to the encoder read heads EN4 and EN5 can be reset or not reset. .

於步驟S103,當求出在某一角度α之實際刻度間距SSr(相當於刻度GP之修正值)後,於步驟S104中,控制裝置14於該角度α對應的將其記入圖11所示之修正圖表TBc。例如於修正圖表TBc之No.2中,記載有角度2×α、及與其對應之實際刻度間距SSr2(=XS/NS2)。修正圖表TBc儲存在控制裝置14之記憶部。控制裝置14,就複數個刻度GP之全周(編碼器標尺圓盤SD之全周)求出實際刻度間距SSr。控制裝置14,於基板處理裝置11之處理中,將與編碼器讀頭EN4及編碼器讀頭EN5中之至少一方檢測之編碼器標尺圓盤SD之角度對應之修正值、亦即將實際刻度間距SSr從修正圖表TBc讀出,以修正刻度GP之誤差。如圖6所示,在基板處理裝置11具有3個以上之編碼器讀頭EN1、EN2、EN3、EN4、EN5時,控制裝置14,針對編碼器讀頭EN4、EN5以外,亦可使用修正圖表TBc修正刻度GP之誤差。其次進到步驟S105,在基板處理裝置11之處理尚未結束時(步驟S105、No),控制裝置14即持續步驟S102~步驟S104,在基板處理裝置11之處理已結束時(步驟S105、Yes),控制裝置14即結束刻度GP 等之修正。 In step S103, when the actual scale interval SSr (corresponding to the correction value of the scale GP) at a certain angle α is obtained, in step S104, the control device 14 records the corresponding angle α in FIG. Correct the chart TBc. For example, in No. 2 of the correction chart TBc, the angle 2×α and the actual scale interval SSr2 (=XS/NS2) corresponding thereto are described. The correction chart TBc is stored in the memory of the control device 14. The control device 14 obtains the actual scale pitch SSr for the entire circumference of the plurality of scales GP (the entire circumference of the encoder scale disk SD). In the processing of the substrate processing apparatus 11, the control device 14 corrects the angle corresponding to the angle of the encoder scale disk SD detected by at least one of the encoder read head EN4 and the encoder read head EN5, that is, the actual scale pitch. SSr is read from the correction chart TBc to correct the error of the scale GP. As shown in FIG. 6, when the substrate processing apparatus 11 has three or more encoder heads EN1, EN2, EN3, EN4, and EN5, the control unit 14 can also use a correction chart for the encoder heads EN4 and EN5. TBc corrects the error of the scale GP. Next, the process proceeds to step S105, and when the processing of the substrate processing apparatus 11 has not been completed (steps S105 and No), the control device 14 continues to steps S102 to S104, and the processing of the substrate processing apparatus 11 is completed (step S105, Yes). , the control device 14 ends the scale GP Correction.

上述例中,在基板處理裝置11之處理中、亦即處理部對基板施以既定處理(例如曝光處理)時,控制裝置14修正複數個刻度GP之間隔使其看起來一定。藉由此種方式之採用,即能即時修正基板處理裝置11之作働中產生之刻度GP之誤差、亦即讀取標尺間隔之誤差,因此能提升基板處理裝置11之處理精度。 In the above example, in the processing of the substrate processing apparatus 11, that is, when the processing unit applies a predetermined process (for example, exposure processing) to the substrate, the control device 14 corrects the interval between the plurality of scales GP so as to be constant. By adopting such a method, the error of the scale GP generated in the operation of the substrate processing apparatus 11 can be corrected, that is, the error of the scale interval can be read, so that the processing precision of the substrate processing apparatus 11 can be improved.

圓盤SD繞一圈,亦即原本在編碼器讀頭EN4之位置之標尺基準位置GPb回到編碼器讀頭EN4之位置時,作為全周分之刻度GP之修正值,求出實際刻度間距SSr。控制裝置14,之後可在圓盤SD每繞一圈後同樣的修正刻度GP,亦可在圓盤SD繞一圈後結束刻度GP之修正,以既定時序(例如,經過既定時間後或有既定温度變化之情形時等)再開始刻度GP之修正。當選擇前者時,由於係隨時更新修正圖表TBc,因此能迅速的因應編碼器標尺圓盤SD及刻度GP於短時間內之變形或尺寸變化等。選擇後者時,由於能抑制修正圖表TBc之更新頻度,因此能有效的利用控制裝置14之硬體資源。 When the disc SD is wound one turn, that is, when the scale reference position GPb originally at the position of the encoder read head EN4 is returned to the position of the encoder read head EN4, the correction value of the scale GP of the full circumference is obtained, and the actual scale pitch is obtained. SSr. The control device 14 can then correct the scale GP after each round of the disc SD, or end the correction of the scale GP after the disc SD is wound one turn, at a predetermined timing (for example, after a predetermined time or a predetermined time) When the temperature changes, etc.) restart the correction of the scale GP. When the former is selected, since the correction chart TBc is updated at any time, it is possible to quickly respond to deformation or dimensional change of the encoder scale disk SD and the scale GP in a short time. When the latter is selected, since the update frequency of the correction map TBc can be suppressed, the hardware resources of the control device 14 can be effectively utilized.

在控制裝置14從編碼器讀頭EN4、EN5取得此等之讀取值時,取得時序越短或編碼器讀頭EN4、EN5之間隔越小,即越能提升刻度GP之修正精度。編碼器讀頭EN4、EN5之間隔,因編碼器讀頭EN4、EN5之大小及與其他零件配置之平衡等,會受到某種程度之限制。因此,縮短從編碼器讀頭EN4、EN5取得此等之讀取值時之時序,具有可提高泛用性之優點。 When the control device 14 obtains the read values from the encoder heads EN4 and EN5, the shorter the acquisition timing is, or the smaller the interval between the encoder heads EN4 and EN5 is, the higher the correction accuracy of the scale GP can be improved. The interval between the encoder read heads EN4 and EN5 is limited to some extent due to the size of the encoder read heads EN4 and EN5 and the balance with other parts. Therefore, shortening the timing at which the read values are obtained from the encoder read heads EN4 and EN5 has the advantage of improving versatility.

圖12、圖13係顯示從一對編碼器讀頭取得此等之讀取值時 之時序的概念圖。上述例中,係在編碼器標尺圓盤SD之複數個刻度GP以旋轉中心線AX2為中心每旋轉既定旋轉角度α(度)時,由控制裝置14從編碼器讀頭EN4、EN5取得此等之讀取值。將此時之旋轉角度α(度)設為360之約數時,在編碼器標尺圓盤SD旋轉複數圈之期間,編碼器讀頭EN4、EN5係每一圈皆讀取相同位置(參照圖12)。此場合,為提升刻度GP之修正精度,雖需縮小既定旋轉角度α,但由於裝置之限制等並無法一味的縮小旋轉角度α。 Figure 12 and Figure 13 show the reading of these values from a pair of encoder readers. Conceptual diagram of the timing. In the above example, when the plurality of scales GP of the encoder scale disk SD are rotated by a predetermined rotation angle α (degrees) around the rotation center line AX2, the control device 14 obtains these from the encoder heads EN4 and EN5. Read the value. When the rotation angle α (degree) at this time is set to a divisor of 360, the encoder read heads EN4 and EN5 read the same position every revolution while the encoder scale disk SD is rotated by a plurality of turns (refer to FIG. 12). ). In this case, in order to improve the correction accuracy of the scale GP, it is necessary to reduce the predetermined rotation angle α, but the rotation angle α cannot be uniformly reduced due to limitations of the device.

於本實施形態,由於具有複數個刻度GP之編碼器標尺圓盤SD為旋轉體(連續體),即使不擔保每一圈之週期性,亦能使用編碼器讀頭EN4、EN5連續的進行測定。因此,例如可藉由將旋轉角度α(度)設定為不是360度之約數之數,即能破壞在編碼器標尺圓盤SD旋轉複數圈時之編碼器讀頭EN4、EN5之讀取位置的週期性。尤其是藉由將α(度)設定為不是360度之約數之數、且為質數,能更有效的破壞前述週期性。其結果,即使既定旋轉角度α大,但由於複數個刻度GP(編碼器標尺圓盤SD)在每次重複繞圈時產生之偏移量非常小,因此,其結果可縮小編碼器讀頭EN4、EN5對刻度GP之測定間隔(參照圖13)。 In the present embodiment, since the encoder scale disk SD having a plurality of scales GP is a rotating body (continuous body), the encoder read heads EN4 and EN5 can be continuously measured without guaranteeing the periodicity of each turn. . Therefore, for example, by setting the rotation angle α (degree) to a number that is not a divisor of 360 degrees, it is possible to destroy the reading positions of the encoder read heads EN4 and EN5 when the encoder scale disk SD is rotated by a plurality of turns. Periodic. In particular, by setting α (degree) to a number that is not a divisor of 360 degrees and is a prime number, the periodicity can be more effectively broken. As a result, even if the predetermined rotation angle α is large, since the offset of the plurality of scale GPs (encoder scale disc SD) is extremely small each time the winding is repeated, the result can be reduced by the encoder read head EN4. , EN5 measurement interval of the scale GP (refer to Figure 13).

例如,雖將角度α在10度~35度程度之間設定為不是360度之約數之值即可,但亦可將360/α之值設為小數點以下1位~4位程度、較佳的是能以小數點以下1位~4位整除之值。例如,將角度α設為11度、17度、19度、23度等之質數時,360/α到小數點以下4位移無法整除。另一方面,將角度α設為12.5度、16度、25度、28.8度之任一者時,360/α可在小數點以下1位整除。將角度α設為19.2度、32.0度時,360/α 可在小數點以下2位整除。將角度α設為12.8度時,360/α可在小數點以下3位整除。進一部將角度α設為25.6度時,360/α可在小數點以下4位整除。此外,旋轉角度α在10度~35度之間,成約數(360/α為整數)之角度為10度、12度、14.4度、15度、18度、20度、22.5度、24度、30度。又,旋轉角度α雖可以是1度~10度之範圍,但為避免360/α成為整數之約數時,旋轉角度α可以是7度、9度。此外,視所需之誤差修正之分解能力,亦可將旋轉角度α設為1度未滿、例如每0.5度即求出編碼器讀頭EN4、EN5各個之讀取值之差,以作成間距誤差之圖表。 For example, although the angle α is set to be not a value of about 360 degrees between 10 degrees and 35 degrees, the value of 360/α may be set to be 1 to 4 decimal places, preferably. It is a value that can be divisible by 1 to 4 digits below the decimal point. For example, when the angle α is a prime number of 11 degrees, 17 degrees, 19 degrees, 23 degrees, or the like, 360/α to 4 points below the decimal point cannot be divisible. On the other hand, when the angle α is set to any of 12.5 degrees, 16 degrees, 25 degrees, and 28.8 degrees, 360/α can be divided by one point below the decimal point. When the angle α is set to 19.2 degrees and 32.0 degrees, 360/α It can be divisible by 2 digits below the decimal point. When the angle α is set to 12.8 degrees, 360/α can be divisible by 3 digits below the decimal point. When the angle α is set to 25.6 degrees, 360/α can be divisible by 4 digits below the decimal point. In addition, the rotation angle α is between 10 degrees and 35 degrees, and the angles (360/α is an integer) are 10 degrees, 12 degrees, 14.4 degrees, 15 degrees, 18 degrees, 20 degrees, 22.5 degrees, 24 degrees, 30 degrees. Further, although the rotation angle α may be in the range of 1 to 10 degrees, the rotation angle α may be 7 degrees or 9 degrees in order to avoid 360/α becoming an integer number. In addition, depending on the required resolution of the error correction, the rotation angle α may be set to 1 degree or less, for example, every 0.5 degrees, the difference between the read values of the encoder read heads EN4 and EN5 may be obtained to make a pitch. A chart of the error.

圖14係顯示修正標尺誤差之順序的流程圖。圖14之例,係顯示在編碼器標尺圓盤SD之複數個刻度GP以旋轉中心線AX2為中心每旋轉既定角度α(度)時,一對編碼器讀頭EN4、EN5讀取此等之情形時,將旋轉角度α設為不是360之約數之質數時的處理順序。此例中,旋轉角度α可設為例如7度、11度等。 Figure 14 is a flow chart showing the sequence of correcting the scale error. In the example of Fig. 14, when a plurality of scales GP of the encoder scale disk SD are rotated by a predetermined angle α (degrees) around the rotation center line AX2, a pair of encoder read heads EN4 and EN5 read these. In the case, the rotation angle α is set to a processing order when the prime number is not a divisor of 360. In this example, the rotation angle α can be set to, for example, 7 degrees, 11 degrees, or the like.

步驟S201~步驟S204,因與將α(度)設為360之約數之上述例中的步驟S101~步驟S104相同,因此省略其說明。於步驟S205中,控制裝置14,在開始求修正值後編碼器標尺圓盤SD尚未旋轉至規定之旋轉數之情形時(步驟S205、No),重複步驟S202~步驟S205。於步驟S205中,控制裝置14,在開始求修正值後編碼器標尺圓盤SD旋轉至規定之旋轉數之情形時(步驟S205、Yes),即進到步驟S206。步驟S206,因與將α(度)設為360之約數之上述例中的步驟S105相同,因此省略其說明。雖然步驟S205中之規定之旋轉數只要是2旋轉以上即可,但隨者規定之旋轉數越大、使刻度GP之修正精度提升之效果越小。因此,最好是能在2旋轉以上之適 當範圍設定規定之旋轉數。 Steps S201 to S204 are the same as steps S101 to S104 in the above-described example in which α (degree) is set to about 360, and therefore the description thereof will be omitted. In step S205, the control device 14 repeats steps S202 to S205 when the encoder scale disk SD has not been rotated to a predetermined number of rotations after starting the correction value (steps S205 and No). In step S205, when the encoder scale disc SD is rotated to the predetermined number of rotations after starting the correction value (step S205, Yes), the control device 14 proceeds to step S206. Step S206 is the same as step S105 in the above-described example in which α (degree) is set to about 360, and therefore the description thereof will be omitted. The number of rotations specified in step S205 may be two or more rotations. However, the larger the number of rotations as specified, the smaller the effect of improving the correction accuracy of the scale GP. Therefore, it is best to be able to rotate above 2 When the range is set, the specified number of rotations.

其次,說明編碼器讀頭EN4、EN5之配置。如圖6所示,作為第1讀取部之編碼器讀頭EN4及作為第2讀取部之編碼器讀頭EN5,以較作為處理部之曝光裝置EX(參照圖1)配置在與作為圓筒構件之第2筒構件22之旋轉方向相反側較佳。具體而言,以較被支承在第2筒構件22之基板P被曝光裝置EX曝光處理之部分,配置在與第2筒構件22之旋轉方向相反側較佳。亦即,較被支承在第2筒構件22之基板P被曝光裝置EX曝光處理之部分前之二處,讀取刻度GP、求出修正值。圖6所示例中,第2筒構件22之旋轉方向係從編碼器讀頭EN4朝向編碼器讀頭EN5之方向。以此方式配置編碼器讀頭EN4、EN5,能使用刻度GP修正後在第2筒構件22之周方向之位置資訊反饋至處理(此例中為曝光處理)之控制,因此能提升處理精度。 Next, the configuration of the encoder read heads EN4 and EN5 will be described. As shown in FIG. 6, the encoder read head EN4 as the first reading unit and the encoder read head EN5 as the second reading unit are disposed in comparison with the exposure apparatus EX (see FIG. 1) as the processing unit. It is preferable that the second tubular member 22 of the cylindrical member has the opposite rotation direction. Specifically, it is preferable that the portion of the substrate P supported by the second tubular member 22 exposed to the exposure apparatus EX is disposed on the side opposite to the rotation direction of the second tubular member 22. In other words, the scale GP is read and the correction value is obtained, two points before the substrate P supported by the second tubular member 22 is exposed by the exposure apparatus EX. In the example shown in Fig. 6, the rotation direction of the second tubular member 22 is from the encoder head EN4 toward the encoder read head EN5. By arranging the encoder heads EN4 and EN5 in this manner, the position information in the circumferential direction of the second tubular member 22 can be fed back to the control (in this example, the exposure processing) by the scale GP correction, so that the processing accuracy can be improved.

本實施形態中,雖係將編碼器讀頭EN4、EN5之兩方較基板P被曝光裝置EX曝光處理之部分,配置在與第2筒構件22之旋轉方向相反側,但亦可將一方配置在被曝光處理之部分。例如,可將編碼器讀頭EN5作為第1讀取部、編碼器讀頭EN1設為第2讀取部,根據兩者之讀取值之差求出刻度GP之修正值。 In the present embodiment, the two portions of the encoder read heads EN4 and EN5 are exposed to the exposure unit EX by the exposure device EX, and are disposed on the opposite side to the rotation direction of the second tubular member 22. In the part that is exposed to exposure. For example, the encoder read head EN5 can be used as the first reading unit and the encoder read head EN1 as the second reading unit, and the correction value of the scale GP can be obtained from the difference between the read values of the two.

又,本實施形態中,由於對準顯微鏡AMG1、AMG2係配置在對應編碼器讀頭EN4、EN5之位置,因此可藉由以對準顯微鏡AMG1、AMG2測量在基板P表面之變化,預測在處理位置之基板P之變化,於處理時進行修正。再者,除編碼器讀頭EN4、EN5外,亦可再加上使用在與此等相異之位置、例如配置在處理位置之編碼器讀頭EN1、EN2之至少一 方,測量旋轉中心線AX2之偏轉(在與旋轉中心線AX2正交之方向之動作)、真圓度(形狀變形)或第2筒構件22之偏心等,根據該測量值進行處理之修正。 Further, in the present embodiment, since the alignment microscopes AMG1 and AMG2 are disposed at positions corresponding to the encoder heads EN4 and EN5, it is possible to predict the processing on the surface of the substrate P by the alignment microscopes AMG1 and AMG2. The change of the substrate P at the position is corrected at the time of processing. Furthermore, in addition to the encoder read heads EN4, EN5, at least one of the encoder read heads EN1, EN2 disposed at a different position, for example, disposed at the processing position, may be added. Then, the deflection of the rotation center line AX2 (the operation in the direction orthogonal to the rotation center line AX2), the roundness (shape deformation), or the eccentricity of the second tubular member 22 are measured, and the correction of the processing is performed based on the measured value.

測量旋轉中心線AX2之偏轉或第2筒構件22之偏心等時,最好是能與編碼器讀頭EN4、EN5一起使用相對處理位置(曝光處理之位置)配置在與編碼器讀頭EN4、EN5相反側之作為第3讀取部之編碼器讀頭EN3(參照圖6)。如此,即能在處理位置之前後,比較旋轉中心線AX2之偏轉等之測量結果,將中間值作為針對旋轉中心線AX2之偏轉的修正值。又,使用夾著處理位置前後配置之編碼器讀頭EN4、EN5與編碼器讀頭EN3測量旋轉中心線AX2之偏轉等,根據其測量值進行修正,即能提升修正旋轉中心線AX2之偏轉等時的精度。將編碼器讀頭EN3作為第3讀取部使用時,連結編碼器讀頭EN5與旋轉中心線AX2之直線(設置方位線Le5)與連結編碼器讀頭EN3與旋轉中心線AX2之直線(設置方位線Le3)所夾角度,不限於圖6所示之210度,亦可以是編碼器讀頭EN3在處理位置側。 When measuring the deflection of the rotation center line AX2 or the eccentricity of the second tubular member 22, it is preferable to use the relative processing position (position of the exposure processing) together with the encoder read heads EN4 and EN5 in the encoder read head EN4, The encoder read head EN3 (see Fig. 6) serving as the third reading unit on the opposite side of EN5. In this way, the measurement result of the deflection or the like of the rotation center line AX2 can be compared after the processing position, and the intermediate value is used as the correction value for the deflection of the rotation center line AX2. Further, by using the encoder read heads EN4 and EN5 disposed before and after the processing position, and the encoder read head EN3, the deflection of the rotation center line AX2 is measured, and the correction is performed based on the measured value, thereby improving the deflection of the corrected rotation center line AX2, and the like. The precision of time. When the encoder read head EN3 is used as the third reading unit, a line connecting the encoder read head EN5 and the rotation center line AX2 (setting the bearing line Le5) and a line connecting the encoder head EN3 and the rotation center line AX2 (setting) The angle of the orientation line Le3) is not limited to 210 degrees as shown in FIG. 6, and the encoder read head EN3 may be on the processing position side.

除作為第1讀取部之編碼器讀頭EN4及作為第2讀取部之編碼器讀頭EN5外,再加上使用作為第3讀取部之編碼器讀頭EN3時,在編碼器標尺圓盤SD之周方向之編碼器讀頭EN4與編碼器讀頭EN5之間隔,以較編碼器讀頭EN5與編碼器讀頭EN3之間隔小較佳。縮小編碼器讀頭EN4與編碼器讀頭EN5之間隔,可提升刻度GP之修正精度。又,加大編碼器讀頭EN5與編碼器讀頭EN3之間隔,能提升檢測第2筒構件22之偏心等時之靈敏度。 In addition to the encoder read head EN4 as the first reading unit and the encoder read head EN5 as the second reading unit, and the encoder read head EN3 as the third reading unit, the encoder scale is used. The interval between the encoder read head EN4 and the encoder read head EN5 in the circumferential direction of the disc SD is preferably smaller than the interval between the encoder read head EN5 and the encoder read head EN3. Reducing the interval between the encoder read head EN4 and the encoder read head EN5 improves the correction accuracy of the scale GP. Further, by increasing the interval between the encoder read head EN5 and the encoder read head EN3, the sensitivity of detecting the eccentricity of the second tubular member 22 can be improved.

其次,說明配置作為第1讀取部之編碼器讀頭EN4與作為 第2讀取部之編碼器讀頭EN5之間隔。編碼器讀頭EN4與編碼器讀頭EN5,以配置成連結編碼器讀頭EN4與旋轉中心線AX2之線(設置方位線Le4)與連結編碼器讀頭EN5與旋轉中心線AX2之線(設置方位線Le5)所夾之中心角編碼器安裝角度θs,為90度、180度及270度以外之角度較佳。藉由此種配置,能以2個編碼器讀頭EN4、EN5檢測旋轉中心線AX2之偏轉或第2筒構件22之偏心等。進一步的,編碼器安裝角度θs以45度以內較佳、且為120度、240度以外之角度較佳。藉由此種配置,能在以2個編碼器讀頭EN4、EN5檢測旋轉中心線AX2之偏轉或第2筒構件22之偏心等之同時,提升刻度GP之修正精度。其次,針對基板處理裝置11具有調整編碼器標尺圓盤SD之真圓度之機構之情形,進行說明。 Next, the description will be made of the encoder read head EN4 and the configuration as the first reading unit. The interval between the encoder read heads EN5 of the second reading unit. The encoder read head EN4 and the encoder read head EN5 are configured to connect the line between the encoder read head EN4 and the rotation center line AX2 (set the orientation line Le4) and the line connecting the encoder read head EN5 and the rotation center line AX2 (setting The central angle encoder mounting angle θs sandwiched by the bearing line Le5) is preferably an angle other than 90 degrees, 180 degrees, and 270 degrees. With this configuration, the deflection of the rotation center line AX2 or the eccentricity of the second tubular member 22 can be detected by the two encoder heads EN4 and EN5. Further, the encoder mounting angle θs is preferably 45 degrees or less, and is preferably an angle other than 120 degrees and 240 degrees. With this arrangement, the correction accuracy of the scale GP can be improved while detecting the deflection of the rotation center line AX2 or the eccentricity of the second barrel member 22 by the two encoder heads EN4 and EN5. Next, a description will be given of a case where the substrate processing apparatus 11 has a mechanism for adjusting the true roundness of the encoder scale disk SD.

圖15及圖16係用以說明調整編碼器標尺圓盤之真圓度之真圓度調整機構的說明圖。上述圖4及圖5中,雖相對第2筒構件22之直徑將編碼器標尺圓盤SD之直徑圖示的較小,但第2筒構件22之外周面中、捲繞基板P之外周面之直徑與編碼器標尺圓盤SD之刻度GP之直徑最好是一致。如此,即能進一步縮小所謂的測量阿貝誤差。此場合,曝光裝置EX,最設具備如圖13所示之調整編碼器標尺圓盤SD之真圓度的真圓度調整機構Cs。 15 and 16 are explanatory views for explaining a true roundness adjustment mechanism for adjusting the roundness of the encoder scale disk. In the above-described FIGS. 4 and 5, the diameter of the encoder scale disk SD is smaller than the diameter of the second tubular member 22, but the outer peripheral surface of the second tubular member 22 is wound around the outer surface of the substrate P. The diameter is preferably the same as the diameter of the scale GP of the encoder scale disc SD. In this way, the so-called measurement Abbe error can be further reduced. In this case, the exposure apparatus EX is provided with a roundness adjustment mechanism Cs having the roundness of the encoder scale disk SD as shown in FIG.

作為一種標尺構件之編碼器標尺圓盤SD係圓環狀構件。在外周面具有刻度GP之編碼器標尺圓盤SD,係固定在與第2筒構件22之第2中心軸AX2正交之第2筒構件22之至少一方之端部。編碼器標尺圓盤SD,係使沿著第2中心軸AX2之周方向設於編碼器標尺圓盤SD之槽Sc,與和槽Sc同半徑且沿第2中心軸AX2之周方向設於第2筒構件22之槽Dc 對向。編碼器標尺圓盤SD,並在槽Sc與槽Dc之間設有滾動體(例如球)等之軸承構件SB。 An encoder scale disc SD-based annular member as a scale member. The encoder scale disk SD having the scale GP on the outer peripheral surface is fixed to an end portion of at least one of the second tubular members 22 that is orthogonal to the second central axis AX2 of the second tubular member 22. The encoder scale disk SD is provided in the groove Sc of the encoder scale disk SD along the circumferential direction of the second central axis AX2, and is provided in the same radius as the groove Sc and along the circumferential direction of the second central axis AX2. Slot Dc of 2 cylinder member 22 Opposite. The encoder scale disk SD is provided with a bearing member SB such as a rolling element (for example, a ball) between the groove Sc and the groove Dc.

真圓度調整機構Cs裝在編碼器標尺圓盤SD之內周側,包含調整構件60與按壓構件PP。此外,真圓度調整機構Cs,在以旋轉中心線AX2為中心之周方向以既定間距具備複數個(例如,8處),例如可改變與設置方位線Le4平行之方向、從第2中心軸AX2朝向刻度GP之方向之按壓力的按壓機構。調整構件60插通於按壓構件PP,具備編碼器標尺圓盤SD之螺母部FP3及螺入第2筒構件22之螺母部FP4的螺絲部61、以及與按壓構件PP接觸之頭部62。按壓構件PP,係在編碼器標尺圓盤SD之端部沿周方向半徑較編碼器標尺圓盤SD小的圓環狀固定板。編碼器標尺圓盤SD,朝第2筒構件22之周方向,藉由複數個固結構件、亦即包含螺絲部61及頭部62之調整構件60,固定在第2筒構件22之至少一方的端部。 The roundness adjustment mechanism Cs is mounted on the inner peripheral side of the encoder scale disk SD, and includes an adjustment member 60 and a pressing member PP. Further, the roundness adjustment mechanism Cs has a plurality of (for example, eight places) at a predetermined pitch in the circumferential direction around the rotation center line AX2, and for example, the direction parallel to the installation direction line Le4 can be changed from the second center axis. A pressing mechanism for pressing the AX2 toward the direction of the scale GP. The adjustment member 60 is inserted into the pressing member PP, and includes a nut portion FP3 of the encoder scale disk SD, a screw portion 61 screwed into the nut portion FP4 of the second tubular member 22, and a head portion 62 that is in contact with the pressing member PP. The pressing member PP is an annular fixing plate having a smaller radius in the circumferential direction than the encoder scale disk SD at the end of the encoder scale disk SD. The encoder scale disk SD is fixed to at least one of the second tubular members 22 by a plurality of solid structural members, that is, the adjusting members 60 including the screw portions 61 and the head portions 62 in the circumferential direction of the second tubular member 22. The end.

在將設置方位線Le4延長至編碼器標尺圓盤SD之內周側前端,於編碼器標尺圓盤SD之內周側、且與第2中心軸AX2平行且包含第2中心軸AX2之剖面形成有傾斜面FP2。傾斜面FP2,係隨著接近第2中心軸AX2、其與第2中心軸AX2平行之方向之厚度變薄的傾斜面。於按壓構件PP,形成有隨著接近第2中心軸AX2、其與第2中心軸AX2平行之方向之厚度變厚的傾斜面FP1。按壓構件PP,對編碼器標尺圓盤SD,以傾斜面FP2與傾斜面FP1對向之方式藉由調整構件60固定。 The set orientation line Le4 is extended to the inner peripheral side end of the encoder scale disk SD, and is formed on the inner peripheral side of the encoder scale disk SD and parallel to the second central axis AX2 and including the second central axis AX2. There is a sloped surface FP2. The inclined surface FP2 is an inclined surface that is thinner in thickness in a direction parallel to the second central axis AX2 and parallel to the second central axis AX2. The pressing member PP is formed with an inclined surface FP1 which is thicker in thickness in a direction parallel to the second central axis AX2 and parallel to the second central axis AX2. The pressing member PP fixes the encoder scale disk SD by the adjusting member 60 such that the inclined surface FP2 faces the inclined surface FP1.

真圓度調整機構Cs,藉由將調整構件60之螺絲部61螺入編碼器標尺圓盤SD之螺母部FP3,將按壓構件PP之傾斜面FP1之按壓力傳至傾斜面FP2,從編碼器標尺圓盤SD之內側朝向外周側微量彈性變形。 相反的,藉由將螺絲部61往相反側旋轉,將按壓構件PP之傾斜面FP1受抑制之按壓力即被傳至傾斜面FP2,從編碼器標尺圓盤SD之外周側朝向內側微量彈性變形。 The roundness adjustment mechanism Cs transmits the pressing force of the inclined surface FP1 of the pressing member PP to the inclined surface FP2 by screwing the screw portion 61 of the adjusting member 60 into the nut portion FP3 of the encoder scale disk SD, from the encoder The inner side of the scale disc SD is slightly elastically deformed toward the outer peripheral side. On the other hand, by rotating the screw portion 61 to the opposite side, the pressing surface FP1 of the pressing member PP is suppressed from being pressed to the inclined surface FP2, and is slightly elastically deformed from the outer peripheral side toward the inner side of the encoder scale disk SD. .

真圓度調整機構Cs,藉由在以旋轉中心線AX2為中心之周方向以既定間距具備之複數個調整構件60操作螺絲部61,能微量調整刻度GP之周方向之直徑。又,真圓度調整機構Cs,由於能使位在上述設置方位線Le1~Le5上之刻度GP微小變形,因此能高精度調整刻度GP之周方向之直徑。從而,能視編碼器標尺圓盤SD之真圓度操作適當位置之調整構件60,具以提升編碼器標尺圓盤SD之刻度GP之真圓度、或相對旋轉中心線AX2之微小偏心誤差,以提升對第2筒構件22之旋轉方向之位置檢測精度。此外,真圓度調整機構Cs進行調整之調整量,雖視編碼器標尺圓盤SD之直徑或調整構件60之半徑位置而有所不同,最大亦不過數μm程度。 In the roundness adjustment mechanism Cs, the diameter of the circumferential direction of the scale GP can be minutely adjusted by operating the screw portion 61 at a plurality of adjustment members 60 provided at a predetermined pitch in the circumferential direction around the rotation center line AX2. Further, since the roundness adjusting mechanism Cs can slightly deform the scale GP positioned on the above-described set azimuth lines Le1 to Le5, the diameter of the circumferential direction of the scale GP can be adjusted with high precision. Therefore, the adjustment member 60 can be operated at an appropriate position depending on the true roundness of the encoder scale disc SD, with the roundness of the scale GP of the encoder scale disc SD or the slight eccentricity error of the relative rotation center line AX2. The position detection accuracy of the rotation direction of the second tubular member 22 is improved. Further, the adjustment amount by which the roundness adjustment mechanism Cs is adjusted differs depending on the diameter of the encoder scale disk SD or the radial position of the adjustment member 60, and is not so much as large as several μm.

如圖16所示,編碼器標尺圓盤SD係透過8個調整構件60固定在第2筒構件22。此場合,作為第1讀取部之編碼器讀頭EN4與作為第2讀取部之編碼器讀頭EN5,最好是配置成編碼器讀頭EN4與第2中心軸AX2與編碼器讀頭EN5之中心角的編碼器安裝角度θs,較相鄰調整構件60與第2中心軸AX2所夾中心角β小。 As shown in FIG. 16, the encoder scale disk SD is fixed to the second tubular member 22 through the eight adjustment members 60. In this case, the encoder read head EN4 as the first reading unit and the encoder read head EN5 as the second reading unit are preferably arranged as the encoder read head EN4 and the second central axis AX2 and the encoder read head. The encoder mounting angle θs of the central angle of EN5 is smaller than the central angle β between the adjacent adjustment member 60 and the second central axis AX2.

編碼器標尺圓盤SD,由於係透過調整構件60固定於第2筒構件22,因此在調整構件60之近旁有可能產生變形。如上所述,藉由作成θs<β,編碼器讀頭EN4、EN5能確實的檢測因相鄰調整構件60間之變形引起之刻度GP之誤差。其結果,能提升刻度GP之修正精度。其次,說明基板處理裝置(曝光裝置)之變形例。 Since the encoder scale disc SD is fixed to the second tubular member 22 through the adjustment member 60, deformation may occur in the vicinity of the adjustment member 60. As described above, by making θs < β, the encoder read heads EN4 and EN5 can surely detect the error of the scale GP due to the deformation between the adjacent adjustment members 60. As a result, the correction accuracy of the scale GP can be improved. Next, a modification of the substrate processing apparatus (exposure apparatus) will be described.

(基板處理裝置(曝光裝置)之第1變形例) (First Modification of Substrate Processing Apparatus (Exposure Apparatus))

圖17係顯示基板處理裝置(曝光裝置)之第1變形例的示意圖。圖18係用以說明將基板處理裝置(曝光裝置)之第1變形例之編碼器標尺圓盤從旋轉中心線方向所見之讀取裝置之位置的說明圖。上述實施形態中,係以檢測在支承基板P之第2筒構件22周方向之位置的情形為例作了說明。但不限定於此,如本變形例之曝光裝置EX1般,在檢測保持圓筒光罩DM之第1筒構件21周方向之位置的情形時,可使用一對編碼器讀頭修正用以檢測在第1筒構件21周方向之位置的刻度GP(刻度)之誤差。 Fig. 17 is a schematic view showing a first modification of the substrate processing apparatus (exposure apparatus). FIG. 18 is an explanatory view for explaining the position of the reading device of the encoder scale disk according to the first modification of the substrate processing apparatus (exposure device) from the direction of the rotation center line. In the above embodiment, the case where the position of the second cylindrical member 22 in the circumferential direction of the support substrate P is detected is described as an example. However, the present invention is not limited to this. When the position of the first tubular member 21 in the circumferential direction of the cylindrical mask DM is detected as in the exposure apparatus EX1 of the present modification, a pair of encoder read head corrections can be used for detection. The error of the scale GP (scale) at the position in the circumferential direction of the first tubular member 21.

曝光裝置EX1所具有之編碼器標尺圓盤SD,係固定在與第2筒構件22之旋轉軸AX2正交之第2筒構件22之兩端部。刻度GP係設在兩方之編碼器標尺圓盤SD之外周面。因此,刻度GP係配置在第2筒構件22之兩端部。讀取各刻度GP之編碼器讀頭EN1~EN5分別配置在第2筒構件22之兩端部側。 The encoder scale disk SD included in the exposure device EX1 is fixed to both end portions of the second tubular member 22 that is orthogonal to the rotation axis AX2 of the second tubular member 22. The scale GP is provided on the outer circumference of the encoder disc SD of both sides. Therefore, the scale GP is disposed at both end portions of the second tubular member 22. The encoder read heads EN1 to EN5 for reading the respective scales GP are disposed on the both end sides of the second tubular member 22, respectively.

於上述實施形態說明之第1檢測器25(參照圖1),係以光學方式檢測第1筒構件21之旋轉位置,包含高真圓度之編碼器標尺圓盤(標尺構件)SD、與讀取裝置編碼器讀頭EH1、EH2、EH3、EH4、EH5。編碼器標尺圓盤SD係固定在與第1筒構件21之旋轉軸正交之第1筒構件21之至少1個端部(圖16中為兩端部)。因此,編碼器標尺圓盤SD繞旋轉中心線AX1與旋轉軸ST一體的旋轉。於編碼器標尺圓盤SD之外周面刻設有刻度GPM。編碼器讀頭EH1、EH2、EH3、EH4、EH5,從旋轉軸STM觀察,係配置在刻度GP之周圍。編碼器讀頭EH1、EH2、EH3、EH4、EH5與刻度GPM對向配置,能以非接觸方式讀取刻度GPM。又,編碼器讀頭EH1、EH2、 EH3、EH4、EH5係配置在第1筒構件21之周方向之不同位置。第1筒構件21從編碼器讀頭EH4朝向編碼器讀頭EH5旋轉。 The first detector 25 (see FIG. 1) described in the above embodiment optically detects the rotational position of the first tubular member 21, and includes an encoder scale disc (scale member) SD having high roundness and reading. Take the device encoder read heads EH1, EH2, EH3, EH4, EH5. The encoder scale disc SD is fixed to at least one end portion (both end portions in FIG. 16) of the first tubular member 21 that is orthogonal to the rotation axis of the first tubular member 21. Therefore, the encoder scale disk SD rotates integrally with the rotation axis ST about the rotation center line AX1. A scale GPM is engraved on the outer circumference of the encoder scale disc SD. The encoder heads EH1, EH2, EH3, EH4, and EH5 are arranged around the scale GP as viewed from the rotation axis STM. The encoder read heads EH1, EH2, EH3, EH4, and EH5 are arranged opposite to the scale GPM, and the scale GPM can be read in a non-contact manner. Also, the encoder read heads EH1, EH2 EH3, EH4, and EH5 are disposed at different positions in the circumferential direction of the first tubular member 21. The first tubular member 21 is rotated from the encoder read head EH4 toward the encoder read head EH5.

編碼器讀頭EH1、EH2、EH3、EH4、EH5係對在刻度GPM之切線方向(XZ面內)之變位之變動具有測量感度(檢測感度)的讀取裝置。如圖17所示,將編碼器讀頭EH1、EH2之設置方位(在以旋轉中心線AX1為中心之XZ面內的角度方向)以設置方位線Le11、Le12表示時,係以此設置方位線Le11、Le12相對中心面P3成角度±θ°之方式,配置各編碼器讀頭EH1、EH2。此外,設置方位線Le11、Le12與圖1所示之照明光束EL1在以旋轉中心線AX1為中心之XZ面內的角度方向一致。此處,處理部照明機構IU係進行對被處理物體圓筒光罩DM上之既定圖案(光罩圖案)使照明光束EL1穿透之處理。據此,投影光學系PL即能將在圓筒光罩DM上之照明區域IR之圖案之像,投影至被搬送裝置搬送之基板P之一部分(投影區域PA)。 The encoder heads EH1, EH2, EH3, EH4, and EH5 have reading means for measuring the sensitivity (detection sensitivity) in the variation of the displacement in the tangential direction (in the XZ plane) of the scale GPM. As shown in FIG. 17, when the set orientations of the encoder read heads EH1, EH2 (the angular directions in the XZ plane centered on the rotation center line AX1) are indicated by the set orientation lines Le11, Le12, the orientation lines are set by this. Each of the encoder read heads EH1 and EH2 is disposed such that Le11 and Le12 are at an angle of ±θ° with respect to the center plane P3. Further, the orientation lines Le11 and Le12 are arranged to coincide with the angular direction of the illumination light beam EL1 shown in FIG. 1 in the XZ plane centered on the rotation center line AX1. Here, the processing unit illumination unit IU performs a process of penetrating the illumination light beam EL1 to a predetermined pattern (a mask pattern) on the cylindrical mask DM of the object to be processed. According to this, the projection optical system PL can project the image of the pattern of the illumination region IR on the cylindrical mask DM to a portion (projection area PA) of the substrate P transported by the transport device.

編碼器讀頭EH4,係設定在將編碼器讀頭EH1之設置方位線Le11相對第1筒構件21之中心面P3朝向旋轉方向之後方側繞旋轉中心線AX1之軸大至旋轉90°之設置方位線Le14上。又,編碼器讀頭EH5,係設定在將編碼器讀頭EH2之設置方位線Le12相對第1筒構件21之中心面P3朝向旋轉方向之後方側繞旋轉中心線AX1之軸大至旋轉90°之設置方位線Le15上。此處,大致90°,係指設為90°±γ時,γ之範圍與上述實施形態相同。 The encoder read head EH4 is set to be rotated about 90° from the axis of the rotation center line AX1 to the side after the center line P3 of the first cylinder member 21 is oriented in the rotation direction with respect to the center plane P3 of the first head member 21; The bearing line is on Le14. Further, the encoder read head EH5 is set such that the set azimuth line Le12 of the encoder read head EH2 is rotated by 90° about the axis of the rotation center line AX1 with respect to the center plane P3 of the first tubular member 21 toward the rotational direction. Set the bearing line Le15. Here, when it is approximately 90 degrees, when it is 90 degrees ± γ, the range of γ is the same as that of the above embodiment.

又,編碼器讀頭EH3,係設定在將編碼器讀頭EH2之設置方位線Le12繞旋轉中心線AX1之軸大至旋轉120°、且將編碼器讀頭EH4 繞旋轉中心線AX1之軸大致旋轉120°之設置方位線Le13上。本實施形態中配置在第1筒構件21周圍之編碼器讀頭EH1、EH2、EH3、EH4、EH5之配置,係與上述實施形態中配置在第2筒構件22周圍之編碼器讀頭EN1、EN2、EN3、EN4、EN5成鏡像反轉之關係。 Moreover, the encoder read head EH3 is set to rotate the set azimuth line Le12 of the encoder read head EH2 around the axis of the rotation center line AX1 by 120°, and the encoder read head EH4 The azimuth line Le13 is rotated approximately 120° about the axis of the rotation center line AX1. In the present embodiment, the arrangement of the encoder heads EH1, EH2, EH3, EH4, and EH5 disposed around the first tubular member 21 is the encoder read head EN1 disposed around the second tubular member 22 in the above embodiment. EN2, EN3, EN4, and EN5 are in the form of mirror inversion.

如以上所述,曝光裝置EX1,具備係圓筒構件之第2筒構件22、刻度GP、曝光裝置EX1之處理部投影模組PL1~PL6、讀取刻度GP之第1讀取裝置編碼器讀頭EN4、EN5、以及讀取刻度GP之第2讀取裝置編碼器讀頭EN1、EN2。 As described above, the exposure apparatus EX1 includes the second cylindrical member 22 of the cylindrical member, the scale GP, the processing unit projection modules PL1 to PL6 of the exposure apparatus EX1, and the first reading apparatus encoder reading of the reading scale GP. The heads EN4, EN5, and the second reading device encoder reading heads EN1, EN2 of the reading scale GP.

第1筒構件21具有從作為既定軸之第1中心軸AX1以一定半徑彎曲之曲面,且繞第1中心軸AX1旋轉。刻度GPM沿第1筒構件21之周方向排列成環狀、且與第1筒構件21一起繞第1中心軸AX1旋轉。曝光裝置EX1之處理部照明機構IU,從第2中心軸AX2觀察時,係配置在第1筒構件21之內部,對位在第1筒構件21之周方向中特定位置之曲面的基板P(被處理物體)進行使2個照明光束EL1穿透之處理。編碼器讀頭EH4、EH5,從第1中心軸AX1觀察時,係配置在刻度GPM之周圍、且配置以第1中心軸AX1為中心將前述特定位置繞第1中心軸AX1大致旋轉90度之位置,讀取刻度GPM。編碼器讀頭EH1、EH2讀取前述特定位置之刻度GPM。曝光裝置EX1根據編碼器讀頭EH4、EH5之讀取值,修正設在安裝於第1筒構件21之編碼器標尺圓盤SD外周部之刻度GPM之誤差(間距誤差)。因此,曝光裝置EX1能以良好精度測量在第1筒構件21之周方向之位置,對位在第2筒構件22之曲面之被處理物體、亦即基板P施以處理。如以上所述,於本實施形態,根據編碼器讀頭EH4、EH5之讀取值修正誤差時, 具體而言,曝光裝置EX之控制裝置14係根據編碼器讀頭EH4之讀取值與編碼器讀頭EH5之讀取值之差,修正間距誤差。然而,在第1筒構件21之刻度GPM之周圍,以和編碼器讀頭EH4、EH5之任一者以接近的設置角度設有其他編碼器讀頭時,不限於編碼器讀頭EH4、EH5之兩讀取值之直接的差分計算,亦可藉由依據編碼器讀頭EH4、EH5與其他編碼器讀頭之3個編碼器讀頭之各讀取值的運算,求出間距誤差。使用3個編碼器讀頭之間距誤差之測量,留待後詳細說明。 The first tubular member 21 has a curved surface curved at a constant radius from the first central axis AX1 which is a predetermined axis, and is rotated around the first central axis AX1. The scale GPM is arranged in a ring shape in the circumferential direction of the first tubular member 21 and rotates around the first central axis AX1 together with the first tubular member 21 . When the processing unit illumination unit IU of the exposure apparatus EX1 is viewed from the second central axis AX2, the substrate P is placed inside the first tubular member 21 and aligned on a curved surface at a specific position in the circumferential direction of the first tubular member 21 ( The object to be processed is subjected to a process of penetrating the two illumination light beams EL1. When viewed from the first central axis AX1, the encoder heads EH4 and EH5 are disposed around the scale GPM and are arranged to rotate the specific position about the first central axis AX1 by approximately 90 degrees around the first central axis AX1. Position, read the scale GPM. The encoder read heads EH1, EH2 read the scale GPM of the aforementioned specific position. The exposure device EX1 corrects the error (pitch error) of the scale GPM provided on the outer peripheral portion of the encoder scale disk SD attached to the first tubular member 21 based on the read values of the encoder read heads EH4 and EH5. Therefore, the exposure apparatus EX1 can measure the position in the circumferential direction of the first tubular member 21 with good precision, and can perform processing for the object to be processed, that is, the substrate P, which is positioned on the curved surface of the second tubular member 22. As described above, in the present embodiment, when the error is corrected based on the read values of the encoder read heads EH4 and EH5, Specifically, the control device 14 of the exposure device EX corrects the pitch error based on the difference between the read value of the encoder read head EH4 and the read value of the encoder read head EH5. However, when another encoder read head is provided around the scale GPM of the first tubular member 21 at a set angle close to either of the encoder read heads EH4 and EH5, it is not limited to the encoder read heads EH4 and EH5. The direct difference calculation between the two read values can also be performed by calculating the read values of the encoder read heads EH4, EH5 and the three encoder read heads of the other encoder read heads. The measurement of the error between the heads of the three encoders is used, and will be described in detail later.

(基板處理裝置(曝光裝置)之第2變形例) (Second Modification of Substrate Processing Apparatus (Exposure Apparatus))

圖19係顯示基板處理裝置(曝光裝置)之第2變形例之整體構成的示意圖。曝光裝置EX2,係由未圖示之光源裝置射出照明於圓筒光罩DM之照明光束EL1。將從光源裝置之光源射出之照明光束EL1導向照明模組IL,在射有複數個照明光學系時,則將來自光源之照明光束EL1分離為複數調後,將複數條照明光束EL1導向複數個照明模組IL。 Fig. 19 is a schematic view showing the overall configuration of a second modification of the substrate processing apparatus (exposure apparatus). The exposure device EX2 emits an illumination light beam EL1 that is illuminated by the cylindrical mask DM by a light source device (not shown). The illumination light beam EL1 emitted from the light source of the light source device is guided to the illumination module IL. When a plurality of illumination optical systems are emitted, the illumination light beam EL1 from the light source is separated into a plurality of adjustments, and the plurality of illumination light beams EL1 are guided to a plurality of Lighting module IL.

從光源裝置射出之照明光束EL1射入偏光分束器SP1、SP2。於偏光分束器SP1、SP2,為抑制因照明光束EL1之分離導致的能量損失,最好是能作成將射入之照明光束EL1完全反射之光束。此處,偏光分束器SP1、SP2係使為S偏光之直線偏光的光束反射、為P偏光之直線偏光的光束穿透。因此,光源裝置係將射入偏光分束器SP1、SP2之照明光束EL1為直線偏光(S偏光)之光束的照明光束EL1,向第1筒構件21射出。據此,光源裝置係射出波長及相位一致的照明光束EL1。 The illumination light beam EL1 emitted from the light source device is incident on the polarization beam splitters SP1, SP2. In order to suppress the energy loss due to the separation of the illumination light beam EL1, the polarization beam splitters SP1 and SP2 are preferably formed to completely reflect the incident illumination light beam EL1. Here, the polarization beam splitters SP1 and SP2 transmit a light beam that is a linearly polarized light that is S-polarized light and a light beam that is a linearly polarized light that is P-polarized. Therefore, the light source device emits the illumination light beam EL1 that is incident on the illumination beam EL1 of the polarization beam splitters SP1 and SP2 into a linearly polarized (S-polarized) light beam, and is emitted to the first tubular member 21. Accordingly, the light source device emits the illumination light beam EL1 having the same wavelength and phase.

偏光分束器SP1、SP2反射來自光源之照明光束EL1,另一方面,使被圓筒光罩DM反射之投影光束EL2穿透。換言之,來自照明光 學模組ILM之照明光束EL1,作為反射光束射入偏光分束器SP1、SP2,來自圓筒光罩DM之投影光束EL2,則作為穿透光束射入偏光分束器SP1、SP2。 The polarization beam splitters SP1, SP2 reflect the illumination light beam EL1 from the light source, and on the other hand, the projection light beam EL2 reflected by the cylindrical mask DM is penetrated. In other words, from the illumination The illumination beam EL1 of the module ILM is incident on the polarization beam splitters SP1, SP2 as a reflected beam, and the projection beam EL2 from the cylindrical mask DM is incident on the polarization beam splitters SP1, SP2 as a penetrating beam.

如上所述,處理部照明模組IL係進行使照明光束EL1反射至被處理物體圓筒光罩DM上之既定圖案(光罩圖案)的處理。據此,投影光學系PL能將在圓筒光罩DM上之照明區域IR之圖案之像,投影至以搬送裝置搬送之基板P之一部分(投影區域)。 As described above, the processing unit illumination module IL performs processing for reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM of the object to be processed. According to this, the projection optical system PL can project an image of the pattern of the illumination region IR on the cylindrical mask DM to a portion (projection region) of the substrate P transported by the transport device.

在設置此種使照明光束EL1反射至圓筒光罩DM之曲面表面之既定圖案(光罩圖案)的情形時,可與此光罩圖案一起於曲面設置刻度GPm。在將此刻度GPm與光罩圖案同時形成之情形時,以和光罩圖案相同精度形成刻度GPm。因此,能以檢測刻度GPm之曲面檢測器GS1、GS2高速高精度的進行刻度GPm之標記之像的取樣。在進行此取樣之瞬間,可求出第1筒構件21之旋轉角度位置與刻度GPm間之對應關係,儲存逐次測量之第1筒構件21之旋轉角度位置。 In the case where such a predetermined pattern (mask pattern) for reflecting the illumination light beam EL1 to the curved surface of the cylindrical mask DM is provided, the scale GPm may be provided on the curved surface together with the mask pattern. When the scale GPM is formed simultaneously with the mask pattern, the scale GPm is formed with the same precision as the mask pattern. Therefore, it is possible to perform sampling of the image of the mark of the scale GPM with high speed and high precision with the curved surface detectors GS1, GS2 of the detection scale GPM. At the moment of sampling, the correspondence relationship between the rotational angular position of the first tubular member 21 and the scale GPM can be obtained, and the rotational angular position of the first tubular member 21 measured successively can be stored.

圓筒光罩DM側之編碼器讀頭EH4、EH5讀取刻度GPm。曝光裝置EX2根據編碼器讀頭EH4、EH5之讀取值之差,修正設在圓筒光罩DM表面之刻度GPm之誤差。因此,曝光裝置EX2,能以良好精度測量在圓筒光罩DM之周方向之位置,對在第2筒構件22之曲面之基板P施以處理。 The encoder read heads EH4 and EH5 on the cylindrical mask DM side read the scale GPm. The exposure device EX2 corrects the error of the scale GPm provided on the surface of the cylindrical mask DM based on the difference between the reading values of the encoder heads EH4 and EH5. Therefore, the exposure apparatus EX2 can measure the position in the circumferential direction of the cylindrical mask DM with good precision, and treat the substrate P on the curved surface of the second tubular member 22.

第2筒構件22側之碼器讀頭EN4、EN5,讀取安裝在第2筒構件22之編碼器標尺圓盤SD之刻度GPd。此外,曝光裝置EX2根據編碼器讀頭EN4、EN5之讀取值之差,修正設在編碼器標尺圓盤SD表面之刻度GPd之誤差。因此,曝光裝置EX2,能以良好精度測量在第2筒構件22 之周方向之位置,對在第2筒構件22之曲面之基板P施以處理。 The encoder reading heads EN4 and EN5 on the second tubular member 22 side read the scale GPd of the encoder scale disk SD attached to the second tubular member 22. Further, the exposure device EX2 corrects the error of the scale GPd provided on the surface of the encoder scale disk SD based on the difference between the read values of the encoder read heads EN4 and EN5. Therefore, the exposure device EX2 can be measured at the second cylinder member 22 with good precision. The substrate P on the curved surface of the second tubular member 22 is treated at a position in the circumferential direction.

(基板處理裝置(曝光裝置)之第3變形例) (Third Modification of Substrate Processing Apparatus (Exposure Apparatus))

圖20係顯示基板處理裝置(曝光裝置)之第3變形例之整體構成的示意圖。曝光裝置EX3,具備來自未圖示之光源裝置之曝光用光束射入的多邊掃描單元PO1、PO2,多邊掃描單元PO沿基板P上之1維掃描線掃描經強度調變之點光。基板處理裝置所具有之曝光裝置EX3,即使沒有圓筒光罩DM亦對在特定位置之基板P照射曝光用光,而能進行既定圖案之描繪。 Fig. 20 is a schematic view showing the overall configuration of a third modification of the substrate processing apparatus (exposure apparatus). The exposure device EX3 includes the polygon scanning units PO1 and PO2 that are incident on the exposure light beam from a light source device (not shown), and the polygon scanning unit PO scans the intensity-modulated spot light along the one-dimensional scanning line on the substrate P. The exposure apparatus EX3 included in the substrate processing apparatus can irradiate the exposure light to the substrate P at a specific position without the cylindrical mask DM, and can draw a predetermined pattern.

曝光裝置EX3之第2筒構件22側之編碼器讀頭EN4、EN5,讀取安裝在第2筒構件22之編碼器標尺圓盤SD之刻度GPd。曝光裝置EX2根據編碼器讀頭EN4、EN5之讀取值之差,修正設在編碼器標尺圓盤SD表面之刻度GPd之誤差。因此,曝光裝置EX2,能以良好精度側量在第2筒構件22之周方向之位置,對在第2筒構件22之曲面之基板P施以處理。 The encoder heads EN4 and EN5 on the second tubular member 22 side of the exposure device EX3 read the scale GPd attached to the encoder scale disk SD of the second tubular member 22. The exposure device EX2 corrects the error of the scale GPd provided on the surface of the encoder scale disk SD based on the difference between the read values of the encoder read heads EN4 and EN5. Therefore, the exposure apparatus EX2 can process the substrate P on the curved surface of the second tubular member 22 at a position in the circumferential direction of the second tubular member 22 with good precision.

如圖20(及圖19)般,第2筒構件22側之編碼器讀頭EN4、EN5,由於在周方向配置有2排對準顯微鏡AMG1、AMG2,因此與其各個對應配置。然而,對準顯微鏡AMG1、AMG2中、亦有例如僅配置對準顯微鏡AMG2(及對應之編碼器讀頭EN5)的情形。即使在此種情形下,亦以設置編碼器讀頭EN4較佳。僅配置對準顯微鏡AMG2(及對應之編碼器讀頭EN5),而無法在其近旁以旋轉角度α設置編碼器讀頭EN4之情形時,亦可使用與曝光位置對應配置之編碼器讀頭EN1、EN2,來作成標尺圓盤SD之標尺GPd之間距誤差及偏心等之誤差圖表。 As shown in FIG. 20 (and FIG. 19), the encoder read heads EN4 and EN5 on the second tubular member 22 side are arranged in the circumferential direction so as to arrange the alignment microscopes AMG1 and AMG2 in the circumferential direction. However, in the alignment microscopes AMG1 and AMG2, for example, only the alignment microscope AMG2 (and the corresponding encoder read head EN5) are disposed. Even in this case, it is preferable to set the encoder read head EN4. Only when the alignment microscope AMG2 (and the corresponding encoder read head EN5) is configured, and the encoder read head EN4 cannot be set at a rotation angle α in the vicinity thereof, the encoder read head EN1 corresponding to the exposure position can also be used. , EN2, to make the error chart of the error and eccentricity between the scale GPd of the scale disc SD.

進一步的,比較使用2個編碼器讀頭EN4、EN5求出之標尺GPd之間距誤差及偏心等的至少1個誤差圖表、與使用2個編碼器讀頭 EN1、EN2求出之標尺GPd之間距誤差及偏心等的至少一個誤差圖表,驗證兩誤差圖表是否存在大的差異,在產生有容許值以上之差異時,藉由再度作成誤差圖表並加以修正,即能提升誤差圖表之精度及可靠性。 Further, at least one error chart such as the error between the scale GPd and the eccentricity obtained by using the two encoder heads EN4 and EN5 is compared, and two encoder read heads are used. At least one error graph such as the error between the scale and the eccentricity of the scale GPd obtained by EN1 and EN2, verify whether there is a large difference between the two error graphs, and when the difference between the allowable values is generated, by re-writing the error graph and correcting it, That is to improve the accuracy and reliability of the error chart.

(基板處理裝置(曝光裝置)之第4變形例) (Fourth Modification of Substrate Processing Apparatus (Exposure Apparatus))

圖21係顯示基板處理裝置(曝光裝置)之第4變形例之整體構成的示意圖。曝光裝置EX4,係所謂的對基板P施以近接曝光的基板處理裝置。曝光裝置EX4,將圓筒光罩DM與第2筒構件22之間隙設定的極小,照明機構IU直接對基板P照射照明光束EL1,以進行非接觸曝光。於本實施形態,第2筒構件22係藉由從包含電動馬達等致動器之第2驅動部36供應之力矩而旋轉。以和第2驅動部36之旋轉方向相反旋轉之方式,例如由以磁性齒輪連結之驅動輥MGG驅動第1筒構件21。第2驅動部36旋轉第2筒構件22,並使驅動輥MGG與第1筒構件21旋轉,以使第1筒構件21(圓筒光罩DM)與第2筒構件22同步移動(同步旋轉)。 Fig. 21 is a schematic view showing the overall configuration of a fourth modification of the substrate processing apparatus (exposure apparatus). The exposure apparatus EX4 is a so-called substrate processing apparatus that applies proximity exposure to the substrate P. In the exposure apparatus EX4, the gap between the cylindrical mask DM and the second tubular member 22 is set to be extremely small, and the illumination mechanism IU directly irradiates the substrate P with the illumination light beam EL1 to perform non-contact exposure. In the present embodiment, the second tubular member 22 is rotated by a torque supplied from the second driving portion 36 including an actuator such as an electric motor. The first tubular member 21 is driven by, for example, a driving roller MMG coupled by a magnetic gear so as to rotate in the opposite direction to the rotational direction of the second driving portion 36. The second driving unit 36 rotates the second tubular member 22 and rotates the driving roller MGG and the first tubular member 21 to move the first tubular member 21 (the cylindrical mask DM) synchronously with the second tubular member 22 (synchronous rotation) ).

此外,曝光裝置EX4,具備對基板P檢測成像光束EL2之主光線射入基板P之特定位置之刻度GP之位置PX6的編碼器讀頭EN6。此處,由於已使第2筒構件22之外周面中捲繞基板P之外周面之直徑、與編碼器標尺圓盤SD之刻度GP之直徑一致,因此,位置PX6,從第2中心軸AX2觀察時,與上述特定位置一致。編碼器讀頭EN7,係設定在朝向基板P之搬送方向後方側將編碼器讀頭EN6之設置方位線Le6繞旋轉中心線AX2之軸大致旋轉90°之設置方位線Le7上。 Further, the exposure device EX4 includes an encoder read head EN6 that detects that the principal ray of the imaging light beam EL2 is incident on the substrate P at the position PX6 of the scale GP at a specific position of the substrate P. Here, since the diameter of the outer peripheral surface of the outer peripheral surface of the second tubular member 22 wound around the substrate P coincides with the diameter of the scale GP of the encoder scale disk SD, the position PX6 is from the second central axis AX2. When observed, it is consistent with the above specific position. The encoder read head EN7 is set on the set azimuth line Le7 in which the set azimuth line Le6 of the encoder head EN6 is rotated substantially by 90 degrees about the axis of the rotation center line AX2 toward the rear side in the conveyance direction of the substrate P.

曝光裝置EX4,例如以編碼器讀頭EN3為第1讀取部、以編碼器讀頭EN7為第2讀取部。編碼器讀頭EN3、EN7,讀取安裝在第2 筒構件22之編碼器標尺圓盤SD之刻度GPd。控制裝置14,根據編碼器讀頭EN3、EN7之讀取值之差,修正設在編碼器標尺圓盤SD表面之刻度GPd之誤差。因此,曝光裝置EX4,能以良好精度測量在第2筒構件22之周方向之位置,對在第2筒構件22之曲面之基板P施以處理。編碼器讀頭EN3、EN7,可將連結編碼器讀頭EN3與第2中心軸AX2之線(設置方位線Le3)與連結編碼器讀頭EN7與第2中心軸AX2之線(設置方位線Le7)所夾之編碼器安裝角度θs設為不滿90度、較佳是設為45度以下。 In the exposure apparatus EX4, for example, the encoder read head EN3 is the first reading unit, and the encoder head EN7 is the second reading unit. Encoder read head EN3, EN7, read and installed in the second The scale GPd of the encoder scale disc SD of the barrel member 22. The control unit 14 corrects the error of the scale GPd provided on the surface of the encoder scale disk SD based on the difference between the read values of the encoder heads EN3 and EN7. Therefore, the exposure apparatus EX4 can measure the position in the circumferential direction of the second tubular member 22 with good precision, and applies the treatment to the substrate P of the curved surface of the second tubular member 22. The encoder read heads EN3 and EN7 can connect the line between the encoder read head EN3 and the second central axis AX2 (set the bearing line Le3) and the line connecting the encoder read head EN7 and the second central axis AX2 (set the bearing line Le7). The encoder mounting angle θs is set to be less than 90 degrees, preferably 45 degrees or less.

上述實施形態及基板處理裝置(曝光裝置)之第1變形例~第4變形例,作為基板處理裝置係例舉了曝光裝置。但作為基板處理裝置,不限於曝光裝置,處理部亦可以是以噴墨之墨滴下裝置於作為被處理物體之基板P印刷圖案之裝置。此外,處理部亦可以是檢查裝置。 In the first to fourth modifications of the above-described embodiment and the substrate processing apparatus (exposure apparatus), an exposure apparatus is exemplified as the substrate processing apparatus. However, the substrate processing apparatus is not limited to the exposure apparatus, and the processing unit may be a device that prints a pattern on the substrate P as an object to be processed by an inkjet ink dropping device. Further, the processing unit may be an inspection device.

又,在之前使用圖7、圖8之編碼器讀頭EN4、EN5對刻度GP之讀取動作之說明中,係假設讀取刻度GP之1個刻度之上升部GPa時輸出上升脈衝U,讀取下降部GPb時輸出下降脈衝D,將相鄰2個上升部GPa間之間隔、或相鄰下降部GPb間之間隔設為刻度GP之間距SS。然而,實際之編碼器測量系統,例如特開平9-196702號公報所揭示,係將從訊號產生部(編碼器讀頭)輸出之2相訊號(具90度相位差之正弦波訊號及餘弦波訊號)藉由內插電路或比較器等,以將刻度GP之實際尺寸之間距SS細分為數分之一~數十分之一之間隔產生上升脈衝U及下降脈衝D。 Further, in the above description of the reading operation of the scale GP using the encoder heads EN4 and EN5 of FIGS. 7 and 8, it is assumed that the rising pulse U is output when the rising portion GPa of one scale of the scale GP is read, and reading is performed. When the falling portion GPb is taken, the falling pulse D is output, and the interval between the adjacent two rising portions GPa or the interval between the adjacent falling portions GPb is defined as the interval GP between the scales GP. However, the actual encoder measuring system, as disclosed in Japanese Laid-Open Patent Publication No. Hei 9-196702, is a 2-phase signal (a sine wave signal and a cosine wave having a phase difference of 90 degrees) output from a signal generating portion (encoder head). The signal is generated by interpolating the circuit or the comparator to generate the rising pulse U and the falling pulse D at intervals of one to one tenth of the distance between the actual dimensions of the scale GP.

圖22係用以簡單說明於之前之圖4~6、圖10及圖16~21之各個中所示之以編碼器讀頭EN1~EN7、EH1~EH5對刻度GP(GPd、GPM)之實際讀取動作的訊號波形圖。如圖22所示,編碼器讀頭EN1~EN7、EH1 ~EH5之各個,出具有90度相位差之2個測量訊號(此處以矩形波顯示)EcA、EcB。測量訊號EcA、EcB之1週期與刻度GP之間距SS之1/n對應。n(整數)雖會因編碼器讀頭內之光學讀取形態而不同,但係設定為例如1、2、4、8、…等倍數系列之任一值。於一般之編碼器測量系統,標尺圓盤SD往順向旋轉,在刻度GP相對編碼器讀頭恆往一方向移動之期間,根據測量訊號EcA、EcB持續生成經內插化之上升脈衝訊號EcU。標尺圓盤SD反向旋轉時,即從該時間點起,根據測量訊號EcA、EcB持續生成經內插化之下降脈衝訊號。 Figure 22 is a brief description of the actual reading of the encoder heads EN1~EN7, EH1~EH5 to the scale GP (GPd, GPM) shown in each of Figures 4-6, 10 and 16-21. Read the signal waveform of the action. As shown in Figure 22, the encoder read heads EN1~EN7, EH1 Each of ~EH5 has two measurement signals (here shown by rectangular waves) having a phase difference of 90 degrees, EcA, EcB. One cycle of the measurement signals EcA, EcB corresponds to 1/n of the distance between the scales GP and SS. Although n (integer) differs depending on the optical reading form in the encoder read head, it is set to any value of a multiple of a series such as 1, 2, 4, 8, or . In the general encoder measuring system, the scale disc SD rotates in the forward direction, and the interpolated rising pulse signal EcU is continuously generated according to the measurement signals EcA, EcB while the scale GP is moving in one direction with respect to the encoder head. . When the scale disc SD is rotated in the reverse direction, from this point of time, the interpolated falling pulse signal is continuously generated according to the measurement signals EcA, EcB.

圖22中,係使用送出將測量訊號EcA、EcB之1週期加以8分割之間隔產生脈衝之上升脈衝訊號EcU(或下降脈衝訊號EcD)的處理電路。作為計數器之可逆計數器,在輸入上升脈衝訊號EcU時將該脈衝數逐次加總(count up),在輸入下降脈衝訊號EcD時則逐次倒數(count down)該脈衝數。此處,例如當將測量訊號EcA、EcB之1週期係對應刻度GP實際尺寸之間距SS之1/8時,可逆計數器在標尺圓盤SD(刻度GP)之標尺面往順向移動1間距SS之期間,即係計數上升脈衝訊號EcU之64脈衝分。因此,在刻度GP之間距SS為20μm時,可逆計數器之1間距分計數值之増加分即為64,作為編碼器測量系統之測量分解能力(訊號EcU之每1脈衝的移動量)即為0.3125μm(20μm/64)。如以上所述,作為編碼器測量系統之測量分解能力,由於係將刻度GP之間距SS之實際尺寸在數分之一~數十分之一程度予以內插補間而微細化,因此,間距SS之誤差即能以對應該內插補間程度之精度求出。 In Fig. 22, a processing circuit for generating a pulsed rising pulse signal EcU (or a falling pulse signal EcD) at intervals of eight divisions of one cycle of the measurement signals EcA and EcB is used. As the reversible counter of the counter, the number of pulses is counted up successively when the rising pulse signal EcU is input, and the number of pulses is counted down successively when the falling pulse signal EcD is input. Here, for example, when one cycle of the measurement signals EcA, EcB corresponds to 1/8 of the SS between the actual dimensions of the scale GP, the reversible counter moves in the direction of the scale surface of the scale disk SD (scale GP) by 1 pitch SS. During this period, it is counted as 64 pulses of the rising pulse signal EcU. Therefore, when the distance between the scales GP is 20 μm, the increment of the 1st pitch of the up/down counter is 64, which is the measurement decomposition capability of the encoder measurement system (the amount of movement per pulse of the signal EcU) is 0.3125. Μm (20 μm/64). As described above, as the measurement resolution capability of the encoder measurement system, since the actual size of the SS between the scales GP is interpolated and quantized by a fraction of a tenth to a few tenths, the pitch SS is The error can be obtained with the accuracy corresponding to the degree of interpolation.

又,在將標尺圓盤SD之標尺面之周長距離(直徑×π)設 為以有限之刻度數(格子條數)加以除後之值時,實際之刻度GP之間距SS之實際尺寸,亦有對20μm伴隨分數之情形。相對於此,可以測量分解能力成為適當值(例如0.25μm)之方式設定間距SS,以該間距SS使標尺圓盤SD之標尺面之周長距離在既定精度內可整除之方式,設定標尺面之直徑。 Moreover, the circumferential distance (diameter × π) of the scale surface of the scale disc SD is set. In order to divide the value by a finite number of scales (the number of grids), the actual size of the SS between the actual scales GP also has a companion score of 20 μm. On the other hand, the pitch SS can be set so that the decomposition ability becomes an appropriate value (for example, 0.25 μm), and the ruler surface can be set such that the circumferential distance of the scale surface of the scale disk SD can be divisible within a predetermined accuracy. The diameter.

又,於標尺圓盤SD等之標尺面,與刻度GP一起亦刻設有作為標尺圓盤SD之1旋轉之原點的原點標記,編碼器讀頭EN1~EN7之各個當檢測出該原點標記時,即於該瞬間輸出原點訊號(脈衝)EcZ。可逆計數器回應原點訊號EcZ,將到此為止之計數值重置為0後,再次持續上升脈衝訊號EcU(或下降脈衝訊號EcD)之脈衝數之計數。因此,對應編碼器讀頭EN1~EN7之各個設置之可逆計數器之各個,係以接收原點訊號EcZ之瞬間為基準(0點),進行上升脈衝訊號EcU(或下降脈衝訊號EcD)之脈衝數之加算(或減算)。 Further, on the scale surface of the scale disc SD or the like, an origin mark which is the origin of the rotation of the scale disc SD is also provided together with the scale GP, and each of the encoder read heads EN1 to EN7 is detected. When the marker is clicked, the origin signal (pulse) EcZ is output at this moment. The reversible counter responds to the origin signal EcZ, and after resetting the count value up to this point, continues counting the number of pulses of the rising pulse signal EcU (or the falling pulse signal EcD). Therefore, each of the reversible counters corresponding to the respective settings of the encoder read heads EN1 to EN7 is based on the instant of receiving the origin signal EcZ (0 point), and the number of pulses of the rising pulse signal EcU (or the falling pulse signal EcD) is performed. Add (or subtract).

綜上所述,例如,在以編碼器讀頭EN4與編碼器讀頭EN5各個之測量值之差求出刻度GP之間距誤差時,在標尺圓盤SD(第2筒構件22)如圖11~圖13所說明般,每旋轉角度α時,以數位方式運算對應編碼器讀頭EN4之可逆計數器之計數值、與對應編碼器讀頭EN5之可逆計數器之計數值之差即可。又,角度α,可透過判斷與編碼器讀頭EN4及編碼器讀頭EN5中之任一方(或其他之1個編碼器讀頭亦可)對應之可逆計數器之計數值,是否増加(或減少)對應角度α分之一定值來加以檢測。 In summary, for example, when the difference between the scales GP is obtained by the difference between the measured values of the encoder read head EN4 and the encoder read head EN5, the scale disc SD (the second cylinder member 22) is as shown in FIG. As described with reference to Fig. 13, the difference between the count value of the up/down counter corresponding to the encoder read head EN4 and the count value of the up/down counter corresponding to the encoder read head EN5 can be calculated digitally every rotation angle α. Further, the angle α can be determined by adding or subtracting the count value of the reversible counter corresponding to either one of the encoder read head EN4 and the encoder read head EN5 (or one of the other encoder read heads). It is detected by a certain value corresponding to the angle α.

(變形例1) (Modification 1)

以上之實施形態及變形例中,構成編碼器測量系統之刻度GP係刻設在 作為旋轉體之標尺圓盤SD及第2筒構件22中至少一方之圓筒狀外周面。然而,亦可在與標尺圓盤SD及第2筒構件22中至少一方之旋轉中心線AX2垂直的側端面,沿圓周方向以既定間距形成刻度GP。圖23係以此方式在標尺圓盤SD之側端面形成刻度GP時之構成,與先前之圖6同樣的從旋轉中心線AX2延伸之方向(Y軸方向)所見的圖,圖24係將圖23之構成於包含設置方位線Le4與旋轉中心線AX2之面加以剖開的A-A’線剖面圖。 In the above embodiments and modifications, the scale GP constituting the encoder measuring system is engraved on The cylindrical outer peripheral surface of at least one of the scale disk SD and the second tubular member 22 of the rotating body. However, the scale GP may be formed at a predetermined pitch in the circumferential direction on the side end surface perpendicular to the rotation center line AX2 of at least one of the scale disk SD and the second tubular member 22. Fig. 23 is a view showing a configuration in which the scale GP is formed on the side end surface of the scale disk SD in this manner, and the same direction as the previous FIG. 6 is extended from the rotation center line AX2 (Y-axis direction), and Fig. 24 is a view. The configuration of 23 is a cross-sectional view taken along line A-A' of the plane including the orientation line Le4 and the rotation center line AX2.

圖23中,環狀的標尺圓盤SD係以調整構件(螺絲)60安裝在第2筒構件22側端面之8處。調整構件(螺絲)60之安裝角度β,此處係45°。在與標尺圓盤SD之XZ面平行之側面,從旋轉中心線AX2沿著半徑ra之圓周上形成有一定間距SS之刻度GP與原點標記Zs。編碼器讀頭EN4、EN5,如圖24所示,係以和刻度GP隔著一定間隙對向之方式朝向Y軸方向配置。如圖23所示,編碼器讀頭EN4之讀取位置RP4係設定在半徑ra上、且設置方位線Le4上。編碼器讀頭EN5之讀取位置RP5設定在半徑ra上、且設置方位線Le5上。半徑ra,如圖24所示,係第2筒構件22緊貼支承基板P之外周面22s的半徑。因此,環狀標尺圓盤SD之最大直徑係設定的較半徑ra略大。如以上所述,藉由配置標尺圓盤SD與編碼器讀頭EN4、EN5,可將測量時之阿貝誤差壓至最小。針對圖23及圖24之環狀標尺圓盤SD之其他編碼器讀頭(EN1~EN3、EN6~EN7),亦係與讀頭EN4、EN5同樣的配置成滿足測量之阿貝條件。 In Fig. 23, the annular scale disk SD is attached to the end surface of the second tubular member 22 side by an adjusting member (screw) 60. The mounting angle β of the adjustment member (screw) 60 is 45° here. On the side parallel to the XZ plane of the scale disc SD, a scale GP of a certain distance SS and an origin mark Zs are formed on the circumference of the radius ra from the rotation center line AX2. As shown in FIG. 24, the encoder read heads EN4 and EN5 are arranged to face the Y-axis direction so as to face the scale GP with a certain gap therebetween. As shown in Fig. 23, the reading position RP4 of the encoder read head EN4 is set at the radius ra and is set on the bearing line Le4. The reading position RP5 of the encoder read head EN5 is set at the radius ra and is set on the bearing line Le5. The radius ra is as shown in Fig. 24, and the second tubular member 22 is in contact with the radius of the outer peripheral surface 22s of the support substrate P. Therefore, the maximum diameter of the annular scale disc SD is set to be slightly larger than the radius ra. As described above, by configuring the scale disc SD and the encoder heads EN4, EN5, the Abbe error at the time of measurement can be minimized. The other encoder read heads (EN1~EN3, EN6~EN7) for the ring scale disc SD of Figs. 23 and 24 are also configured similarly to the read heads EN4 and EN5 to satisfy the measured Abbe conditions.

(變形例2) (Modification 2)

於以上之實施形態及變形例中,為測量刻度GP之間距誤差,將彼此配置在近處之2個編碼器讀頭(例如編碼器讀頭EN4、EN5)各個之測量值之 差值,於標尺圓盤SD(第2筒構件22)每次旋轉角度α(α<θs)時加以儲存,據以做成關於標尺圓盤SD全周分之間距誤差的圖表。此場合,為提高圖表之精度,最好是盡可能縮小2個編碼器讀頭(例如編碼器讀頭EN4、EN5)之各個在標尺面上之讀取位置(相當於圖23中之RP4、RP5)所夾之角度θs較佳。然而,由於以編碼器讀頭EN4、EN5之外形及尺寸、或對準顯微鏡AMG1、AMG2之配置所決定之設置方位線Le4、Le5間之角度等,有時會有無法使角度θs充分小的情形。 In the above embodiments and modifications, in order to measure the error between the scales GP, the measurement values of the two encoder read heads (for example, the encoder read heads EN4 and EN5) are placed in the vicinity. The difference is stored when the scale disk SD (the second tubular member 22) is rotated by the angle α (α < θs), so as to be a graph about the error between the full circumferences of the scale disk SD. In this case, in order to improve the accuracy of the graph, it is preferable to reduce the reading position of each of the two encoder read heads (for example, the encoder read heads EN4 and EN5) on the scale surface (corresponding to RP4 in FIG. 23, The angle θs sandwiched by RP5) is preferred. However, the angle θs may not be sufficiently small due to the shape and size of the encoder heads EN4 and EN5 or the angle between the orientation lines Le4 and Le5 determined by the arrangement of the microscopes AMG1 and AMG2. situation.

因此,於變形例2中,例如與先前之實施形態中使用於間距誤差測量之2個編碼器讀頭EN4、EN5一起,使用加上配置在其附近之編碼器讀頭EN1(或EN2)之3個以上編碼器讀頭之各個的測量值,進一步的將間距誤差圖表予以微細化。圖25,與之前之圖6同樣的,係在XZ面內所見之標尺圓盤SD(此處為環狀)與編碼器讀頭EN1、EN2、EN4、EN5之配置的圖,此處,係沿標尺圓盤SD之外周面形成有刻度GP與原點標記Zs。又,標尺圓盤SD係於周方向之16處以調整構件(螺絲)60固定在第2筒構件22之側端面。因此,調整構件(螺絲)60之安裝角度β為22.5°。 Therefore, in the second modification, for example, together with the two encoder read heads EN4 and EN5 used for the pitch error measurement in the previous embodiment, the encoder read head EN1 (or EN2) disposed in the vicinity thereof is used. The measured values of each of the three or more encoder read heads further refine the pitch error map. Figure 25 is a view similar to Figure 6 above, showing the arrangement of the scale disc SD (here ring) and the encoder heads EN1, EN2, EN4, EN5 seen in the XZ plane, here, A scale GP and an origin mark Zs are formed along the outer peripheral surface of the scale disc SD. Further, the scale disk SD is fixed to the side end surface of the second tubular member 22 by an adjusting member (screw) 60 at 16 in the circumferential direction. Therefore, the mounting angle β of the adjusting member (screw) 60 is 22.5°.

如圖25所示,在對應奇數號曝光位置之設置方位線Le1上設定讀取位置之編碼器讀頭EN1、與在對應偶數號曝光位置之設置方位線Le2上設定讀取位置之編碼器讀頭EN2,於XZ面內,係相對中心面P3以角度±θ配置。又,通過編碼器讀頭EN4、EN5各個之讀取位置之設置方位線Le4、Le5所夾角度θs為θs>β之關係。再者,通過編碼器讀頭EN1之讀取位置之設置方位線Le1、與通過編碼器讀頭EN4之讀取位置之設置方位線Le4所夾角度設為θq。此外,將與編碼器讀頭EN1、EN2、EN4、EN5 之各個對應設置之可逆計數器之計數值,分別設為Cm1、Cm2、Cm4、Cm5。 As shown in FIG. 25, the encoder read head EN1 of the read position is set on the set orientation line Le1 corresponding to the odd-numbered exposure position, and the encoder read of the read position is set on the set orientation line Le2 of the corresponding even-numbered exposure position. The head EN2, in the XZ plane, is arranged at an angle ±θ with respect to the center plane P3. Further, the angle θs between the set azimuth lines Le4 and Le5 of the reading positions of the encoder heads EN4 and EN5 is θs>β. Further, the angle between the set azimuth line Le1 of the reading position of the encoder read head EN1 and the set azimuth line Le4 of the reading position by the encoder read head EN4 is set to θq. In addition, it will be with the encoder read heads EN1, EN2, EN4, EN5 The count values of the reversible counters corresponding to each of the settings are set to Cm1, Cm2, Cm4, and Cm5, respectively.

圖25所示之標尺圓盤SD(第2筒構件22)在XZ面內順時鐘旋轉時,形成在標尺圓盤SD之標尺面之原點標記Zs會以編碼器讀頭EN4、EN5、EN1、EN2之順序橫越過各讀取位置。因此,原點標記Zs橫越過編碼器讀頭EN4之讀取位置之瞬間,對應可逆計數器之計數值Cm4被重置為零,原點標記Zs橫越過編碼器讀頭EN5之讀取位置之瞬間,對應可逆計數器之計數值Cm5被重置為零,原點標記Zs橫越過編碼器讀頭EN1之讀取位置之瞬間,對應可逆計數器之計數值Cm1被重置為零,原點標記Zs橫越過編碼器讀頭EN2之讀取位置之瞬間,對應可逆計數器之計數值Cm2被重置為零。在標尺圓盤SD順時鐘旋轉之情形時,4個可逆計數器之全部被重置為零後之各計數值Cm1、Cm2、Cm4、Cm5,恆為Cm2<Cm1<Cm5<Cm4之關係。 When the scale disc SD (the second cylinder member 22) shown in Fig. 25 rotates clockwise in the XZ plane, the origin mark Zs formed on the scale surface of the scale disc SD will be the encoder read heads EN4, EN5, EN1. The sequence of EN2 traverses each reading position. Therefore, the moment when the origin mark Zs traverses the reading position of the encoder read head EN4, the count value Cm4 corresponding to the up/down counter is reset to zero, and the origin mark Zs traverses the reading position of the encoder read head EN5. The count value Cm5 corresponding to the reversible counter is reset to zero, and the origin mark Zs crosses the reading position of the encoder read head EN1, and the count value Cm1 corresponding to the reversible counter is reset to zero, and the origin mark Zs is horizontally The count value Cm2 corresponding to the up/down counter is reset to zero at the instant of the reading position of the encoder read head EN2. When the scale disc SD rotates clockwise, the count values Cm1, Cm2, Cm4, and Cm5 after all the four reversible counters are reset to zero are constant in the relationship of Cm2 < Cm1 < Cm5 < Cm4.

使用3個編碼器讀頭EN1(計數值Cm1)、EN4(計數值Cm4)、及EN5(計數值Cm5)求出間距誤差,以作成誤差圖表(修正圖表)之場合,在標尺圓盤SD(第2筒構件22)每旋轉一定角度α(α<β<θs)時,藉由下式(1),求出與每單位角度α之間距誤差相關聯之測量值△Ms。此測量值△Ms,雖係相當於先前圖11中所示之刻度GP之數量NS,但實際上係圖22所示之上升脈衝(或下降脈衝)EcU之脈衝計數值。 The pitch error is obtained by using three encoder read heads EN1 (count value Cm1), EN4 (count value Cm4), and EN5 (count value Cm5) to create an error chart (correction chart) on the scale disc SD ( When the second tubular member 22) is rotated by a predetermined angle α (α<β<θs), the measured value ΔMs associated with the error between the unit angles α is obtained by the following formula (1). This measured value ΔMs is equivalent to the number NS of the scale GP shown in Fig. 11 previously, but is actually the pulse count value of the rising pulse (or falling pulse) EcU shown in Fig. 22.

△Ms=(Cm4+Cm1)/2-Cm5…式(1) △Ms=(Cm4+Cm1)/2-Cm5...(1)

此式(1)中,(Cm4+Cm1)/2之計算值,如圖25所示,係代表在設定於作為編碼器讀頭EN4之讀取位置RP4與編碼器讀頭EN1之讀取位置RP1之中間點之角度位置的假想設置方位線Lei,設定編碼器讀頭 之讀取位置RPi時預想可得之計數值。因此,可以式(1)或後述(2)所得之測量值△Ms,係在假想的編碼器讀頭之讀取位置RPi的計數值Cmi(計算上之值)、與在編碼器讀頭EN5之讀取位置RP5的計數值Cm5之差。藉由將該測量值△Ms於每單位角度α、就360度分求出,即能據以作成標尺圓盤SD等之標尺(刻度GP)之間距誤差圖表、或間距誤差修正圖表。 In the equation (1), the calculated value of (Cm4 + Cm1)/2, as shown in Fig. 25, represents the reading position set at the reading position RP4 as the encoder read head EN4 and the encoder read head EN1. Imagine setting the bearing line Lei at the angular position of the middle point of RP1, setting the encoder read head The count value that is expected when reading the position RPi. Therefore, the measured value ΔMs obtained by the equation (1) or the following (2) is the count value Cmi (calculated value) of the reading position RPi of the imaginary encoder read head, and the encoder read head EN5. The difference between the count value Cm5 of the reading position RP5. By obtaining the measured value ΔMs at 360 degrees per unit angle α, it is possible to create an error map or a pitch error correction map between the scale (scale GP) of the scale disc SD or the like.

在圖25所示之配置的場合,在原點標記Zs通過編碼器讀頭EN4之讀取位置RP4與編碼器讀頭EN1之讀取位置RP1之間的期間,由於係計數值Cm4及測量值Cm5被重置為零之後,因此有可能無法擔保3個計數值Cm1、Cm4、Cm5之連續性。於該期間,計數值Cm1、Cm4、Cm5(絶對值)之大小關係,為Cm4<Cm1<Cm5、或Cm5<Cm4<Cm1。因此,在重置為零時至下一個重置為零時為止之期間將以可逆計數器計數之最大計數值(固定值)設為Cmf,就每角度α,讀取對應各編碼器讀頭EN1、EN4、EN5之計數值Cm1、Cm4、Cm5時,原點標記Zs位於編碼器讀頭EN4之讀取位置RP4與編碼器讀頭EN5之讀取位置RP5之間時,取代式(1)中之計數值Cm4,使用於可逆計數器之計數值Cm4加上最大計數值Cmf之新的計數值Cm4’即可。同樣的,原點標記Zs位於編碼器讀頭EN5之讀取位置RP5與編碼器讀頭EN1之讀取位置RP1之間時,取代式(1)中之計數值Cm4、Cm5,使用於可逆計數器之計數值Cm4、Cm5之各個加上最大計數值Cmf之新的計數值Cm4’、Cm5’即可。 In the case of the configuration shown in Fig. 25, the period between the reading position RP4 of the encoder read head EN4 and the reading position RP1 of the encoder head EN1 is due to the count value Cm4 and the measured value Cm5. After being reset to zero, there is a possibility that the continuity of the three count values Cm1, Cm4, Cm5 cannot be guaranteed. During this period, the magnitude relationship of the count values Cm1, Cm4, and Cm5 (absolute value) is Cm4 < Cm1 < Cm5, or Cm5 < Cm4 < Cm1. Therefore, during the period from reset to zero until the next reset to zero, the maximum count value (fixed value) counted by the up/down counter is set to Cmf, and for each angle α, the corresponding encoder read head EN1 is read. When the count values Cm1, Cm4, and Cm5 of EN4 and EN5 are between the reading position RP4 of the encoder read head EN4 and the reading position RP5 of the encoder read head EN5, instead of the equation (1) The count value Cm4 may be used for the count value Cm4 of the up/down counter plus the new count value Cm4' of the maximum count value Cmf. Similarly, when the origin mark Zs is located between the reading position RP5 of the encoder read head EN5 and the reading position RP1 of the encoder read head EN1, the count values Cm4 and Cm5 in the equation (1) are used for the up/down counter. The count values Cm4 and Cm5 may be added to the new count values Cm4' and Cm5' of the maximum count value Cmf.

變形例2之場合,第1讀取部包含2個編碼器讀頭EN1、EN4(或1個編碼器讀頭EN5構成,第2讀取部包含1個編碼器讀頭EN5(或2個編碼器讀頭EN1、EN4)構成。以上構成中,當將角度θs與角度θq設 定為適當關係時,可將假想的讀取位置RPi與讀取位置RP5所夾角度設定為較調整構件(螺絲)60之安裝角度β(圖25中為22.5°)小,而能將調整構件60之真圓度、偏心等之調整後殘留之標尺圓盤SD之標尺面些微變形導致之間距誤差(間距不均),以角度β以下之寬度(span)詳細的加以測量。 In the second modification, the first reading unit includes two encoder read heads EN1 and EN4 (or one encoder read head EN5, and the second read unit includes one encoder read head EN5 (or two codes). The heads EN1, EN4) are constructed. In the above configuration, when the angle θs and the angle θq are set When it is determined to be an appropriate relationship, the angle between the imaginary reading position RPi and the reading position RP5 can be set smaller than the mounting angle β (22.5° in FIG. 25) of the adjusting member (screw) 60, and the adjusting member can be adjusted. After the adjustment of the roundness, eccentricity, etc. of the 60, the scale surface of the scale disc SD is slightly deformed to cause an error in the distance (uneven pitch), and is measured in detail by the width of the angle β or less.

又,如以上所述,於標尺面上設定假想讀取位置RPi之方法中,例如,亦可藉由於設定在圖25所示之2個編碼器讀頭EN4、EN1之各讀取位置RP4、RP1之中間點的假想第1讀取位置RPi求出之計算上的計數值、與於設定在2個編碼器讀頭EN5、EN2之各讀取位置RP5、RP2之中間點之假想第2讀取位置RPi求出之計算上的計數值之差,求出間距誤差。此時之每單位角度α之測量值△Ms,以下式(2)計算。 Further, as described above, in the method of setting the virtual reading position RPi on the scale surface, for example, by setting the reading positions RP4 of the two encoder reading heads EN4 and EN1 shown in FIG. 25, The calculated count value obtained by the virtual first reading position RPi at the intermediate point of RP1 and the hypothetical second reading set at the intermediate point between the reading positions RP5 and RP2 of the two encoder heads EN5 and EN2 The difference between the calculated count values obtained by the position RPi is taken, and the pitch error is obtained. The measured value ΔMs per unit angle α at this time is calculated by the following formula (2).

△Ms=(Cm4+Cm1)/2-(Cm5+Cm2)/2…式(2) △Ms=(Cm4+Cm1)/2-(Cm5+Cm2)/2...(2)

(元件製造方法) (Component manufacturing method)

圖26係顯示使用實施形態之基板處理裝置(曝光裝置)製造元件之元件製造方法之順序的流程圖。於此元件製造方法中,首先,進行例如使用有機EL等自發光元件之顯示面板之功能、性能設計,以CAD等設計所需之電路圖案及配線圖案(步驟S201)。接著,根據以CAD等設計之各種層之毎一個的圖案製作所需層分之圓筒光罩DM(步驟S202)。又,準備捲繞有作為顯示面板之基材之可撓性基板P(樹脂薄膜、金屬箔膜、塑膠等)的供應用卷FR1(步驟S203)。又,於此步驟S203中準備之捲筒狀基板P,可以是視需要將其表面改質者、或事先形成有底塗層(例如以imprint方式形成有微小凹凸)者、或事先積層有光感應性之機能膜或透明膜(絶緣材料) 者。 Fig. 26 is a flow chart showing the procedure of a method of manufacturing an element using the substrate processing apparatus (exposure apparatus) of the embodiment. In the device manufacturing method, for example, the function and performance design of a display panel using a self-luminous element such as an organic EL are designed, and a desired circuit pattern and wiring pattern are designed by CAD or the like (step S201). Next, the cylindrical mask DM of the desired layer is produced in accordance with one of the various layers designed by CAD or the like (step S202). Moreover, the supply roll FR1 of the flexible substrate P (resin film, metal foil film, plastic, etc.) which is a base material of a display panel is prepared (step S203). Further, the roll substrate P prepared in the step S203 may be a surface-modified one if necessary, or may have an undercoat layer formed in advance (for example, a micro unevenness is formed by an imprint method), or a layer of light may be laminated in advance. Inductive functional film or transparent film (insulating material) By.

接著,於基板P上形成由構成顯示面板元件之電極及配線、絶緣膜、TFT(薄膜半導體)等所構成之底板(backplane)層,並以積層於該底板之方式,形成有機EL等自發光元件之發光層(顯示像素部)(步驟S204)。此步驟S204中,雖包含使用前述各實施形態所說明之曝光裝置EX、EX2、EX3、EX4使光阻層曝光之習知微影製程,但亦包含將取代光阻塗有感光性矽烷耦合劑之基板P圖案曝光後於表面形成親撥水性之圖案的曝光製程、將光感應性之觸媒層圖案曝光後以無電電鍍法形成金屬膜圖案(配線、電極等)之濕式製程或以含有銀奈米粒子之導電性墨水等描繪圖案之印刷製程等的處理。 Then, a backplane layer composed of an electrode and a wiring constituting the display panel element, an insulating film, a TFT (thin film semiconductor), or the like is formed on the substrate P, and a self-luminous layer such as an organic EL is formed so as to be laminated on the substrate. The light-emitting layer (display pixel portion) of the element (step S204). In the step S204, the conventional lithography process for exposing the photoresist layer by using the exposure devices EX, EX2, EX3, and EX4 described in the above embodiments includes a photosensitive decane coupling agent. After the substrate P pattern is exposed, an exposure process for patterning the water-repellent pattern is formed on the surface, and the photo-sensitive catalyst layer pattern is exposed, and a metal film pattern (wiring, electrode, etc.) is formed by electroless plating. A process such as a printing process for drawing a pattern such as a conductive ink of silver nanoparticles.

接著,對以卷筒方式在長條基板P上連續製造之各顯示面板元件,進行基板P之切割,於各顯示面板元件表面貼合保護薄膜(對環境阻障層)或彩色濾光片材等,以組裝元件(步驟S205)。接接,進行顯示面板元件是否正常作動?是否滿足所欲性能及特性等之檢查製程(步驟S206)。採以上方式,即能製造顯示面板(可撓性顯示器)。 Next, the substrate P is cut by each of the display panel elements continuously formed on the long substrate P by a roll, and a protective film (for an environmental barrier layer) or a color filter sheet is bonded to the surface of each display panel element. Etc. to assemble the component (step S205). Connect, do the display panel components operate normally? Whether or not the inspection process of the desired performance and characteristics is satisfied (step S206). In the above manner, a display panel (flexible display) can be manufactured.

上述實施形態中,雖係使用在光穿透性基板上形成有既定遮光圖案(或相位圖案、減光圖案)之光穿透型標線片,但亦可取代此標線片,使用例如美國專利第6778257號說明書所揭露之根據待曝光之圖案之電子資料,形成穿透圖案或反射圖案、或發光圖案之可變成形標線片(亦稱電子標線片、主動型標線片、或影像產生器)。又,亦可取代具備非發光型影像顯示元件之可變成形標線片,而具備包含自發光型影像顯示元件之圖案形成裝置。 In the above embodiment, a light-transmitting type reticle in which a predetermined light-shielding pattern (or a phase pattern or a light-reducing pattern) is formed on a light-transmitting substrate is used, but instead of the reticle, for example, the United States may be used. a variable forming reticle (also referred to as an electronic reticle, an active reticle, or an illuminating pattern) that forms a transmissive pattern or a reflective pattern, or a luminescent pattern, according to the electronic data of the pattern to be exposed disclosed in the specification No. 6778257 Image generator). Further, instead of a variable-shaped reticle having a non-light-emitting image display element, a pattern forming device including a self-luminous image display element may be provided.

又,上述實施形態之曝光裝置,係將包含本申請案申請專利範圍所列舉之各構成要素的各種次系統,以能保持既定機械精度、電氣精度及光學精度之方式,加以組裝製造。為確保此等之各種精度,於曝光裝置之組裝前後,針對各種光學系進行用以達成光學精度之調整、針對各種機械系進行用以達成機械精度之調整、針對各種電氣系進行用以達成電氣精度之調整。組合各種次系統後組裝於曝光裝置之步驟,包含各種次系統彼此之機械連接、電路之配線連接及氣壓迴路之配管連接等。在此各種次系統組裝至曝光裝置之組裝步驟前,當然包含各次系統個別之組裝步驟。各種次系統組裝至曝光裝置之組裝步驟結束後,進行綜合調整,以確保曝光裝置整體之各種精度。又,曝光裝置之製造最好能在温度及潔淨度等受到管理之無塵室進行。 Further, in the exposure apparatus of the above-described embodiment, various sub-systems including the respective constituent elements exemplified in the scope of the application of the present application are assembled and manufactured so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to ensure the accuracy of these, before and after the assembly of the exposure apparatus, various optical systems are used to adjust the optical precision, to adjust the mechanical precision for various mechanical systems, and to achieve electrical for various electrical systems. Adjustment of accuracy. The steps of assembling the various sub-systems and assembling them in the exposure apparatus include mechanical connection of various sub-systems, wiring connection of circuits, and piping connection of pneumatic circuits. Before the various sub-systems are assembled to the assembly step of the exposure apparatus, of course, the individual assembly steps of each system are included. After the assembly steps of the various subsystems assembled to the exposure apparatus are completed, comprehensive adjustment is performed to ensure various precisions of the entire exposure apparatus. Further, the exposure apparatus can be preferably manufactured in a clean room in which temperature and cleanliness are managed.

又,上述實施形態之構成要素可適當的加以組合。此外,亦有部分構成要素不使用之情形。再者,在不脫離本發明要旨範圍內可進行構成要素之置換或變更。又,在法令容許範圍內,援用上述實施形態引用之關於曝光裝置等之所有公開公報及美國專利之記載作為本說明書記載之一部分。如以上所述,當業者等根據上述實施形態所為之其他實施形態及運用技術等,皆包含於本發明之範圍內。 Further, the constituent elements of the above embodiments can be combined as appropriate. In addition, some components are not used. Further, the substitution or alteration of the constituent elements can be made without departing from the spirit and scope of the invention. Further, all the publications of the exposure apparatus and the like, which are cited in the above-mentioned embodiments, and the description of the U.S. Patent are incorporated herein by reference. As described above, other embodiments, operational techniques, and the like according to the above embodiments are included in the scope of the present invention.

22‧‧‧第2筒構件 22‧‧‧2nd tubular member

AX2‧‧‧旋轉中心線(第2中心軸) AX2‧‧‧Rotation centerline (2nd central axis)

EL2‧‧‧成像光束 EL2‧‧‧ imaging beam

EN、EN1、EN2、EN3、EN4、EN5‧‧‧編碼器讀頭 EN, EN1, EN2, EN3, EN4, EN5‧‧‧ encoder read head

GP‧‧‧標尺 GP‧‧‧ ruler

Le1、Le2、Le3、Le4、Le5‧‧‧設置方位線 Le1, Le2, Le3, Le4, Le5‧‧‧ set the bearing line

P‧‧‧基板 P‧‧‧Substrate

P3‧‧‧中心面 P3‧‧‧ center face

PA2、PA3、PA4‧‧‧投影區域 PA2, PA3, PA4‧‧‧ projection area

SD‧‧‧編碼器標尺圓盤 SD‧‧‧Encoder scale disc

ST‧‧‧旋轉軸 ST‧‧‧Rotary axis

Claims (23)

一種圓筒構件之位置檢測裝置,其包含:圓筒構件,具有從既定軸以一定半徑彎曲之曲面,以該既定軸為中心旋轉;複數個刻度,沿該圓筒構件旋轉之方向排列成環狀,且與該圓筒構件一起繞該軸周圍旋轉,用以測量至少於該曲面之周方向之位置變化;第1讀取部,與該刻度對向配置,用以讀取該刻度;第2讀取部,與該刻度對向、且於該圓筒構件之周方向配置在與該第1讀取部相異之位置,用以讀取該刻度;以及修正部,根據該第1讀取部之讀取值與該第2讀取部之讀取值,修正從該第1讀取部之讀取值求出之該複數個刻度之間隔與從該第2讀取部之讀取值求出之該複數個刻度之間隔中之至少一方。 A position detecting device for a cylindrical member, comprising: a cylindrical member having a curved surface curved from a predetermined axis with a certain radius, rotating around the predetermined axis; and a plurality of scales arranged in a ring along the direction of rotation of the cylindrical member And rotating around the shaft together with the cylindrical member for measuring a position change at least in a circumferential direction of the curved surface; the first reading portion is disposed opposite to the scale for reading the scale; a reading unit that faces the scale and is disposed at a position different from the first reading unit in a circumferential direction of the cylindrical member for reading the scale, and a correction unit according to the first reading The read value of the pickup unit and the read value of the second read unit correct the interval between the plurality of scales obtained from the read value of the first read unit and the read from the second read unit The value is obtained by at least one of the intervals of the plurality of scales. 如申請專利範圍第1項之圓筒構件之位置檢測裝置,其中,該修正部,係於該複數個刻度之全周,修正從該第1讀取部之讀取值求出之該複數個刻度之間隔與從該第2讀取部之讀取值求出之該複數個刻度之間隔中之至少一方。 The position detecting device for a cylindrical member according to the first aspect of the invention, wherein the correction unit corrects the plurality of the plurality of scales and corrects the plurality of readings from the read value of the first reading unit At least one of the interval between the scale and the plurality of scales obtained from the read value of the second reading unit. 如申請專利範圍第1或2項之圓筒構件之位置檢測裝置,其中,該修正部係在該複數個刻度繞該軸每旋轉角度α度時,取得該第1讀取部之讀取值與該第2讀取部之讀取值以進行該修正。 The position detecting device for a cylindrical member according to the first or second aspect of the invention, wherein the correction portion acquires a reading value of the first reading portion when the plurality of scales are rotated by an angle of a degree about the axis The correction is performed with the read value of the second reading unit. 如申請專利範圍第3項之圓筒構件之位置檢測裝置,其中,該角度α之值係不為360之約數之數。 The position detecting device for a cylindrical member according to claim 3, wherein the value of the angle α is not a divisor of 360. 如申請專利範圍第4項之圓筒構件之位置檢測裝置,其中,該角度 α之值係質數。 a position detecting device for a cylindrical member according to claim 4, wherein the angle The value of α is the prime number. 如申請專利範圍第1至4項中任一項之圓筒構件之位置檢測裝置,其中,該第1讀取部與該第2讀取部係配置成連結該第1讀取部與該軸之線、與連結該第2讀取部與該軸之線所夾之中心角,為90度、180度及270度以外之角度。 The position detecting device for a cylindrical member according to any one of claims 1 to 4, wherein the first reading unit and the second reading unit are arranged to connect the first reading unit and the shaft The line and the central angle between the line connecting the second reading unit and the axis are angles other than 90 degrees, 180 degrees, and 270 degrees. 如申請專利範圍第1至6項中任一項之圓筒構件之位置檢測裝置,其中,該複數個刻度係設於該圓筒構件之外周部。 The position detecting device for a cylindrical member according to any one of claims 1 to 6, wherein the plurality of scales are provided on an outer peripheral portion of the cylindrical member. 如申請專利範圍第1至6項中任一項之圓筒構件之位置檢測裝置,其中,該複數個刻度係設於固定在該圓筒構件之至少一方端部之圓盤之外周部。 The position detecting device for a cylindrical member according to any one of claims 1 to 6, wherein the plurality of scales are provided on an outer peripheral portion of the disk fixed to at least one end of the cylindrical member. 如申請專利範圍第8項之圓筒構件之位置檢測裝置,其中,該圓盤係朝向該圓筒構件之周方向以複數個固結構件加以固定;該第1讀取部與該第2讀取部係配置成該第1讀取部與該軸與該第2讀取部所夾之中心角,較相鄰該固結構件與該軸所夾之中心角小。 The position detecting device for a cylindrical member according to the eighth aspect of the invention, wherein the disk is fixed to the circumferential direction of the cylindrical member by a plurality of solid structural members; the first reading portion and the second reading The taking portion is disposed such that a central angle between the first reading portion and the axis and the second reading portion is smaller than a central angle of the adjacent solid member and the shaft. 如申請專利範圍第1至9項中任一項之圓筒構件之位置檢測裝置,其具有與該刻度對向、且於該圓筒構件之周方向配置在與該第1讀取部及該第2讀取部相異之位置,用以讀取該刻度之第3讀取部;在該圓筒構件周方向之該第1讀取部與該第2讀取部之間隔,較在該圓筒構件周方向之該第2讀取部與該第3讀取部之間隔小。 The position detecting device for a cylindrical member according to any one of claims 1 to 9, which has a direction opposite to the scale, and is disposed in the circumferential direction of the cylindrical member and the first reading unit a position at which the second reading unit is different, and a third reading unit for reading the scale; and a distance between the first reading unit and the second reading unit in the circumferential direction of the cylindrical member The interval between the second reading portion and the third reading portion in the circumferential direction of the cylindrical member is small. 一種基板處理裝置,其包含申請專利範圍第1至10項中任一項之圓筒構件之位置檢測裝置;該圓筒構件,係於該曲面捲繞基板之一部分並繞該軸旋轉據以搬送該 基板;並具有在卷繞於該曲面之該基板之一部分中、於該曲面之周方向的特定位置對該基板施以既定處理之處理部。 A substrate processing apparatus comprising: a position detecting device for a cylindrical member according to any one of claims 1 to 10; wherein the cylindrical member is attached to a portion of the curved-wound substrate and is rotated around the shaft for transporting The And a processing unit that applies a predetermined process to the substrate at a specific position in a circumferential direction of the curved surface in a portion of the substrate wound around the curved surface. 如申請專利範圍第11項之基板處理裝置,其中,該第1讀取部及該第2讀取部較該處理部配置在與該圓筒構件之旋轉方向之相反側。 The substrate processing apparatus according to claim 11, wherein the first reading unit and the second reading unit are disposed on a side opposite to a rotation direction of the cylindrical member. 如申請專利範圍第11或12項之基板處理裝置,其中,該修正部係在該處理部對該基板施以該既定處理時,進行該複數個刻度之間隔成一定之修正。 The substrate processing apparatus according to claim 11 or 12, wherein the correction unit performs the predetermined correction between the plurality of scales when the processing unit applies the predetermined processing to the substrate. 如申請專利範圍第11至13項中任一項之基板處理裝置,其中,該處理部係對該基板照射曝光用光,以將形成在光罩之圖案之像投影曝光至該基板。 The substrate processing apparatus according to any one of claims 11 to 13, wherein the processing unit irradiates the substrate with exposure light to project an exposure image of the pattern formed on the photomask to the substrate. 一種元件製造方法,係使用申請專利範圍第14項之基板處理裝置於該基板形成該圖案。 A device manufacturing method for forming a pattern on a substrate using the substrate processing apparatus of claim 14. 一種片狀基板之搬送裝置,係將可撓曲之長條片狀基板在以繞既定旋轉中心軸旋轉之圓筒構件外周面加以支承之同時,往該長條方向搬送,其具備:標尺部,沿該圓筒構件旋轉之方向排列成環狀、且與該圓筒構件一起繞該旋轉中心軸旋轉,於全周刻設有用以至少測量在該外周面周方向之位置變化的複數個刻度;第1讀取部,與該刻度對向配置,用以讀取該刻度;第2讀取部,與該刻度對向、且於該圓筒構件之周方向配置在與該第1讀取部不同之角度位置,用以讀取該刻度; 記憶部,將該第1讀取部之該刻度之讀取值與該第2讀取部之該刻度之讀取值的差於該標尺部之每既定旋轉角度予以逐次儲存,根據該差分,儲存就該標尺部全周之與該刻度之間距誤差相關之誤差資訊;以及修正部,將根據該誤差資訊修正該第1讀取部之該刻度之讀取值與該第2讀取部之該刻度之讀取值中至少一方之值,作為該片狀基板於該長條方向之搬送位置或搬送量加以輸出。 A sheet-like substrate conveying apparatus is configured to support a flexible sheet-like substrate that is supported by an outer peripheral surface of a cylindrical member that rotates about a predetermined central axis of rotation, and that is provided in the longitudinal direction, and includes a scale portion Arranging in a ring shape along the direction in which the cylindrical member rotates, and rotating around the central axis of rotation together with the cylindrical member, and providing a plurality of scales for measuring at least the positional change in the circumferential direction of the outer peripheral surface a first reading unit disposed opposite the scale for reading the scale; the second reading unit facing the scale and disposed in the circumferential direction of the cylindrical member and the first reading a different angular position for reading the scale; The memory unit stores the difference between the read value of the scale of the first reading unit and the read value of the scale of the second reading unit for each predetermined rotation angle of the scale portion, and according to the difference, And storing correction information related to an error between the scales of the scale portion and the scale; and the correction unit correcting the read value of the scale of the first reading unit and the second reading unit according to the error information The value of at least one of the read values of the scale is output as the transport position or the transport amount of the sheet substrate in the longitudinal direction. 如申請專利範圍第16項之片狀基板之搬送裝置,其中,該既定旋轉角度係設定為不會成為360度之約數的角度。 The carrier apparatus for a sheet substrate according to claim 16, wherein the predetermined rotation angle is set to an angle that does not become a divisor of 360 degrees. 一種片狀基板之搬送裝置,係將具有可撓性之長條片狀基板以繞既定旋轉中心軸旋轉之圓筒構件外周面加以支承,往該長條方向搬送,其具備:標尺部,具有沿著距該圓筒構件中心軸一定半徑之圓周、於該圓筒構件之旋轉方向以既定間距形成之刻度,與該圓筒構件一起繞該中心軸旋轉;第1讀取部,用以在該標尺部周方向之第1位置讀取該標尺部之刻度隨著該圓筒構件旋轉之位置變化;第2讀取部,用以在該標尺部周方向與該第1位置分離角度θs之第2位置讀取該標尺部之刻度隨著該圓筒構件旋轉之位置變化;以及圖表作成部,係在該圓筒構件每旋轉與該角度θs相異之角度α時,以該第1讀取部與該第2讀取部各個之讀取所測量之該刻度之位置資訊之各個,在使該圓筒構件旋轉1次以上之複數次旋轉之期間逐次的求出,以作成與該標尺部之該刻度之間距誤差相關之圖表。 A sheet-like substrate conveying apparatus is configured to support a flexible sheet-like substrate that is supported by an outer peripheral surface of a cylindrical member that rotates around a predetermined central axis of rotation, and that is conveyed in the longitudinal direction, and includes a scale portion having a scale formed at a predetermined pitch in a rotation direction of the cylindrical member along a circumference of a radius of the central axis of the cylindrical member, and rotating around the central axis together with the cylindrical member; the first reading portion is configured to The first position in the circumferential direction of the scale portion reads the scale of the scale portion to change in accordance with the position at which the cylindrical member rotates, and the second reading portion separates the angle θs from the first position in the circumferential direction of the scale portion. The second position reads the scale of the scale portion as the position of the cylindrical member rotates, and the graph creation portion is the first read when the cylindrical member rotates at an angle α different from the angle θs Each of the position information of the scale measured by the reading of each of the pickup portion and the second reading portion is sequentially determined during a plurality of rotations of the cylindrical member by one or more rotations to create the scale. Error interval between the scales Close the chart. 如申請專利範圍第18項之片狀基板之搬送裝置,其中,該角度θs 係設定為90度以外,該角度α係設定為較該角度θs小、且為360度之約數以外之值、或對360度為質數之值。 The conveying device of the sheet substrate of claim 18, wherein the angle θs The angle α is set to be smaller than the angle θs and is a value other than the approximate number of 360 degrees or a value of 360 degrees. 如申請專利範圍第18項之片狀基板之搬送裝置,其中,該角度θs係設定為90度以外,該角度α係設定為較該角度θs小、且360/α之值為以小數點以下1位~4位數可整除之值。 The apparatus for conveying a sheet-like substrate according to claim 18, wherein the angle θs is set to be 90 degrees or less, the angle α is set to be smaller than the angle θs, and the value of 360/α is equal to or less than a decimal point. The value of 1 bit to 4 digits can be divisible. 如申請專利範圍第19或20項之片狀基板之搬送裝置,其中,該標尺部係形成於在該圓筒構件之該中心軸方向之端部與該中心軸同軸安裝之標尺圓盤的外周面、或側端面。 The sheet-like substrate conveying apparatus according to claim 19, wherein the scale portion is formed on an outer circumference of a scale disc that is coaxially mounted to the central axis at an end portion of the cylindrical member in the central axis direction. Face, or side end face. 如申請專利範圍第21項之片狀基板之搬送裝置,其中,為將該標尺圓盤固定於該圓筒構件之端部,具有於該中心軸周圍以角度β之間隔配置之複數個固結構件。 The sheet-like substrate conveying apparatus according to claim 21, wherein the scale disc is fixed to an end portion of the cylindrical member, and has a plurality of solid structures arranged at intervals of an angle β around the central axis. Pieces. 如申請專利範圍第22項之片狀基板之搬送裝置,其中,係將該複數個固結構件之配置間隔之角度β與該角度θs,設定為β>θs之關係。 The apparatus for conveying a sheet-like substrate according to claim 22, wherein the angle β between the arrangement intervals of the plurality of solid structural members and the angle θs is set to a relationship of β>θs.
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