TWI676022B - 用於一光點掃描晶圓檢測系統之運行時間對準之系統及方法 - Google Patents
用於一光點掃描晶圓檢測系統之運行時間對準之系統及方法 Download PDFInfo
- Publication number
- TWI676022B TWI676022B TW105112527A TW105112527A TWI676022B TW I676022 B TWI676022 B TW I676022B TW 105112527 A TW105112527 A TW 105112527A TW 105112527 A TW105112527 A TW 105112527A TW I676022 B TWI676022 B TW I676022B
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- Taiwan
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- sampling
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- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 23
- 238000007689 inspection Methods 0.000 title description 18
- 238000005070 sampling Methods 0.000 claims abstract description 158
- 238000005286 illumination Methods 0.000 claims abstract description 39
- 238000003384 imaging method Methods 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims description 44
- 230000003287 optical effect Effects 0.000 claims description 26
- 238000001514 detection method Methods 0.000 claims description 10
- 230000007547 defect Effects 0.000 claims description 3
- 230000003111 delayed effect Effects 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 74
- 238000005259 measurement Methods 0.000 description 44
- 238000010586 diagram Methods 0.000 description 22
- 238000012937 correction Methods 0.000 description 19
- 239000007787 solid Substances 0.000 description 14
- 241000143252 Idaea infirmaria Species 0.000 description 6
- 230000004075 alteration Effects 0.000 description 6
- 230000001902 propagating effect Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 241000226585 Antennaria plantaginifolia Species 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000001934 delay Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- JTJMJGYZQZDUJJ-UHFFFAOYSA-N phencyclidine Chemical class C1CCCCN1C1(C=2C=CC=CC=2)CCCCC1 JTJMJGYZQZDUJJ-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/0095—Relay lenses or rod lenses
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8896—Circuits specially adapted for system specific signal conditioning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/106—Acousto-optical scan
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/127—Calibration; base line adjustment; drift compensation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Microscoopes, Condenser (AREA)
- Nonlinear Science (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562150295P | 2015-04-21 | 2015-04-21 | |
| US62/150,295 | 2015-04-21 | ||
| US15/004,331 US9864173B2 (en) | 2015-04-21 | 2016-01-22 | Systems and methods for run-time alignment of a spot scanning wafer inspection system |
| US15/004,331 | 2016-01-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201704736A TW201704736A (zh) | 2017-02-01 |
| TWI676022B true TWI676022B (zh) | 2019-11-01 |
Family
ID=57144276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105112527A TWI676022B (zh) | 2015-04-21 | 2016-04-21 | 用於一光點掃描晶圓檢測系統之運行時間對準之系統及方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9864173B2 (enExample) |
| EP (1) | EP3286780B1 (enExample) |
| JP (1) | JP6550470B2 (enExample) |
| KR (1) | KR102317067B1 (enExample) |
| CN (1) | CN107466366B (enExample) |
| IL (1) | IL254832B (enExample) |
| TW (1) | TWI676022B (enExample) |
| WO (1) | WO2016172184A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10794840B2 (en) | 2017-03-17 | 2020-10-06 | Intel Corporation | Apparatus for semiconductor package inspection |
| KR102582089B1 (ko) * | 2018-06-12 | 2023-09-22 | 에이에스엠엘 네델란즈 비.브이. | 다중 빔 검사 장치를 사용하여 샘플을 스캐닝하기 위한 시스템 및 방법 |
| FR3084768B1 (fr) | 2018-07-31 | 2020-10-16 | Commissariat Energie Atomique | Procede d'analyse d'au moins un type de defauts parmi une pluralite de types de defauts entre au moins deux echantillons et dispositif associe |
| US10957571B2 (en) * | 2018-08-30 | 2021-03-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and methods for determining wafer characters |
| US10923317B2 (en) * | 2018-09-19 | 2021-02-16 | KLA Corp. | Detecting defects in a logic region on a wafer |
| US11933717B2 (en) * | 2019-09-27 | 2024-03-19 | Kla Corporation | Sensitive optical metrology in scanning and static modes |
| US11127136B2 (en) * | 2019-12-05 | 2021-09-21 | Kla Corporation | System and method for defining flexible regions on a sample during inspection |
| US11187679B1 (en) * | 2020-05-20 | 2021-11-30 | The Boeing Company | Beam steering for laser ultrasonic inspection systems |
| EP3933499A1 (en) * | 2020-07-03 | 2022-01-05 | Mycronic Ab | Device and method for controlling focus of a laser beam |
| US11748872B2 (en) * | 2020-08-31 | 2023-09-05 | KLA Corp. | Setting up inspection of a specimen |
| CN112820682B (zh) * | 2021-01-08 | 2024-06-21 | 杭州长川科技股份有限公司 | 晶圆输送机构及晶圆测试设备 |
| CN117012683B (zh) * | 2023-10-07 | 2023-12-22 | 深圳黑晶光电技术有限公司 | 一种太阳能电池偏移纠正方法 |
| CN117388274B (zh) * | 2023-10-24 | 2024-05-24 | 上海感图网络科技有限公司 | 多自由度相机检测载台 |
| CN119804244B (zh) * | 2024-11-20 | 2025-11-21 | 苏州镁伽科技有限公司 | 晶圆测量方法、装置、电子设备和存储介质 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6141038A (en) * | 1995-10-02 | 2000-10-31 | Kla Instruments Corporation | Alignment correction prior to image sampling in inspection systems |
| TW201312098A (zh) * | 2011-07-12 | 2013-03-16 | 克萊譚克公司 | 晶圓檢測 |
| TW201428280A (zh) * | 2012-11-20 | 2014-07-16 | Kla Tencor Corp | 用於改良的偵測敏感度之檢驗波束塑型 |
| TW201447284A (zh) * | 2013-03-15 | 2014-12-16 | Kla Tencor Corp | 多點缺陷檢查系統 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3851951A (en) * | 1974-01-16 | 1974-12-03 | Isomet Corp | High resolution laser beam recorder with self-focusing acousto-optic scanner |
| US4926489A (en) * | 1983-03-11 | 1990-05-15 | Kla Instruments Corporation | Reticle inspection system |
| US4805123B1 (en) * | 1986-07-14 | 1998-10-13 | Kla Instr Corp | Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems |
| US5864394A (en) * | 1994-06-20 | 1999-01-26 | Kla-Tencor Corporation | Surface inspection system |
| US5825482A (en) * | 1995-09-29 | 1998-10-20 | Kla-Tencor Corporation | Surface inspection system with misregistration error correction and adaptive illumination |
| US6236454B1 (en) * | 1997-12-15 | 2001-05-22 | Applied Materials, Inc. | Multiple beam scanner for an inspection system |
| WO2002091057A1 (en) | 2001-05-03 | 2002-11-14 | Kla-Tencor Technologies Corporation | Systems and methods for scanning a beam of light across a specimen |
| US6755051B2 (en) | 2002-10-07 | 2004-06-29 | Delta Galil Industries, Ltd. | Knitted garments and methods of fabrication thereof |
| US7208328B2 (en) | 2004-03-16 | 2007-04-24 | Macronix International Co., Ltd. | Method and system for analyzing defects of an integrated circuit wafer |
| JP4812484B2 (ja) | 2006-03-24 | 2011-11-09 | 株式会社日立ハイテクノロジーズ | ボルテージコントラストを伴った欠陥をレビューする方法およびその装置 |
| JP2009071136A (ja) | 2007-09-14 | 2009-04-02 | Hitachi High-Technologies Corp | データ管理装置、検査システムおよび欠陥レビュー装置 |
| CN101840025B (zh) * | 2010-05-05 | 2011-11-09 | 北京大学 | 一种线性光子晶体器件 |
| US10354405B2 (en) | 2010-05-17 | 2019-07-16 | Kla-Tencor Corporation | Run-time correction of defect locations during defect review |
| US9395340B2 (en) * | 2013-03-15 | 2016-07-19 | Kla-Tencor Corporation | Interleaved acousto-optical device scanning for suppression of optical crosstalk |
| US8995746B2 (en) * | 2013-03-15 | 2015-03-31 | KLA—Tencor Corporation | Image synchronization of scanning wafer inspection system |
| CN104501738B (zh) * | 2014-12-31 | 2017-08-11 | 华中科技大学 | 纳米尺度下大面积散射场的快速测量方法及装置 |
-
2016
- 2016-01-22 US US15/004,331 patent/US9864173B2/en active Active
- 2016-04-20 JP JP2017554832A patent/JP6550470B2/ja active Active
- 2016-04-20 KR KR1020177032833A patent/KR102317067B1/ko active Active
- 2016-04-20 CN CN201680021668.1A patent/CN107466366B/zh active Active
- 2016-04-20 WO PCT/US2016/028400 patent/WO2016172184A1/en not_active Ceased
- 2016-04-20 EP EP16783746.7A patent/EP3286780B1/en active Active
- 2016-04-21 TW TW105112527A patent/TWI676022B/zh active
-
2017
- 2017-10-02 IL IL254832A patent/IL254832B/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6141038A (en) * | 1995-10-02 | 2000-10-31 | Kla Instruments Corporation | Alignment correction prior to image sampling in inspection systems |
| TW201312098A (zh) * | 2011-07-12 | 2013-03-16 | 克萊譚克公司 | 晶圓檢測 |
| TW201428280A (zh) * | 2012-11-20 | 2014-07-16 | Kla Tencor Corp | 用於改良的偵測敏感度之檢驗波束塑型 |
| TW201447284A (zh) * | 2013-03-15 | 2014-12-16 | Kla Tencor Corp | 多點缺陷檢查系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| IL254832B (en) | 2021-04-29 |
| CN107466366A (zh) | 2017-12-12 |
| KR102317067B1 (ko) | 2021-10-22 |
| KR20170137181A (ko) | 2017-12-12 |
| EP3286780A4 (en) | 2018-09-26 |
| WO2016172184A1 (en) | 2016-10-27 |
| US20160313256A1 (en) | 2016-10-27 |
| CN107466366B (zh) | 2019-09-10 |
| JP6550470B2 (ja) | 2019-07-24 |
| TW201704736A (zh) | 2017-02-01 |
| EP3286780B1 (en) | 2024-07-31 |
| IL254832A0 (en) | 2017-12-31 |
| US9864173B2 (en) | 2018-01-09 |
| JP2018516367A (ja) | 2018-06-21 |
| EP3286780A1 (en) | 2018-02-28 |
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