CN107466366B - 用于光点扫描晶片检验系统的运行时间对准的系统及方法 - Google Patents

用于光点扫描晶片检验系统的运行时间对准的系统及方法 Download PDF

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CN107466366B
CN107466366B CN201680021668.1A CN201680021668A CN107466366B CN 107466366 B CN107466366 B CN 107466366B CN 201680021668 A CN201680021668 A CN 201680021668A CN 107466366 B CN107466366 B CN 107466366B
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sample
sampling
light beam
sampling grid
image
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CN107466366A (zh
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J·沙利文
蔡文建
曹凯
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/0095—Relay lenses or rod lenses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896—Circuits specially adapted for system specific signal conditioning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/106—Acousto-optical scan
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/127—Calibration; base line adjustment; drift compensation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Microscoopes, Condenser (AREA)
  • Nonlinear Science (AREA)
CN201680021668.1A 2015-04-21 2016-04-20 用于光点扫描晶片检验系统的运行时间对准的系统及方法 Active CN107466366B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562150295P 2015-04-21 2015-04-21
US62/150,295 2015-04-21
US15/004,331 2016-01-22
US15/004,331 US9864173B2 (en) 2015-04-21 2016-01-22 Systems and methods for run-time alignment of a spot scanning wafer inspection system
PCT/US2016/028400 WO2016172184A1 (en) 2015-04-21 2016-04-20 Systems and methods for run-time alignment of a spot scanning wafer inspection system

Publications (2)

Publication Number Publication Date
CN107466366A CN107466366A (zh) 2017-12-12
CN107466366B true CN107466366B (zh) 2019-09-10

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Country Status (8)

Country Link
US (1) US9864173B2 (enExample)
EP (1) EP3286780B1 (enExample)
JP (1) JP6550470B2 (enExample)
KR (1) KR102317067B1 (enExample)
CN (1) CN107466366B (enExample)
IL (1) IL254832B (enExample)
TW (1) TWI676022B (enExample)
WO (1) WO2016172184A1 (enExample)

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US10794840B2 (en) 2017-03-17 2020-10-06 Intel Corporation Apparatus for semiconductor package inspection
WO2019238553A1 (en) 2018-06-12 2019-12-19 Asml Netherlands B.V. System and method for scanning a sample using multi-beam inspection apparatus
FR3084768B1 (fr) 2018-07-31 2020-10-16 Commissariat Energie Atomique Procede d'analyse d'au moins un type de defauts parmi une pluralite de types de defauts entre au moins deux echantillons et dispositif associe
US10957571B2 (en) * 2018-08-30 2021-03-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and methods for determining wafer characters
US10923317B2 (en) * 2018-09-19 2021-02-16 KLA Corp. Detecting defects in a logic region on a wafer
US11933717B2 (en) * 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
US11127136B2 (en) * 2019-12-05 2021-09-21 Kla Corporation System and method for defining flexible regions on a sample during inspection
US11187679B1 (en) * 2020-05-20 2021-11-30 The Boeing Company Beam steering for laser ultrasonic inspection systems
EP3933499A1 (en) * 2020-07-03 2022-01-05 Mycronic Ab Device and method for controlling focus of a laser beam
US11748872B2 (en) * 2020-08-31 2023-09-05 KLA Corp. Setting up inspection of a specimen
CN112820682B (zh) * 2021-01-08 2024-06-21 杭州长川科技股份有限公司 晶圆输送机构及晶圆测试设备
CN117012683B (zh) * 2023-10-07 2023-12-22 深圳黑晶光电技术有限公司 一种太阳能电池偏移纠正方法
CN117388274B (zh) * 2023-10-24 2024-05-24 上海感图网络科技有限公司 多自由度相机检测载台
CN119804244B (zh) * 2024-11-20 2025-11-21 苏州镁伽科技有限公司 晶圆测量方法、装置、电子设备和存储介质

Citations (2)

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CN101840025A (zh) * 2010-05-05 2010-09-22 北京大学 一种线性光子晶体器件
CN104501738A (zh) * 2014-12-31 2015-04-08 华中科技大学 纳米尺度下大面积散射场的快速测量方法及装置

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CN104501738A (zh) * 2014-12-31 2015-04-08 华中科技大学 纳米尺度下大面积散射场的快速测量方法及装置

Also Published As

Publication number Publication date
EP3286780A4 (en) 2018-09-26
EP3286780B1 (en) 2024-07-31
US20160313256A1 (en) 2016-10-27
TW201704736A (zh) 2017-02-01
KR20170137181A (ko) 2017-12-12
JP2018516367A (ja) 2018-06-21
US9864173B2 (en) 2018-01-09
TWI676022B (zh) 2019-11-01
KR102317067B1 (ko) 2021-10-22
CN107466366A (zh) 2017-12-12
IL254832A0 (en) 2017-12-31
WO2016172184A1 (en) 2016-10-27
IL254832B (en) 2021-04-29
EP3286780A1 (en) 2018-02-28
JP6550470B2 (ja) 2019-07-24

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