JP2018516367A5 - - Google Patents

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Publication number
JP2018516367A5
JP2018516367A5 JP2017554832A JP2017554832A JP2018516367A5 JP 2018516367 A5 JP2018516367 A5 JP 2018516367A5 JP 2017554832 A JP2017554832 A JP 2017554832A JP 2017554832 A JP2017554832 A JP 2017554832A JP 2018516367 A5 JP2018516367 A5 JP 2018516367A5
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JP
Japan
Prior art keywords
sampling
drive signal
sampling grid
sample
scanning
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JP2017554832A
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English (en)
Japanese (ja)
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JP2018516367A (ja
JP6550470B2 (ja
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Priority claimed from US15/004,331 external-priority patent/US9864173B2/en
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Publication of JP2018516367A5 publication Critical patent/JP2018516367A5/ja
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JP2017554832A 2015-04-21 2016-04-20 スポット走査型ウェハ検査システムのランタイムアライメントシステム及び方法 Active JP6550470B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562150295P 2015-04-21 2015-04-21
US62/150,295 2015-04-21
US15/004,331 2016-01-22
US15/004,331 US9864173B2 (en) 2015-04-21 2016-01-22 Systems and methods for run-time alignment of a spot scanning wafer inspection system
PCT/US2016/028400 WO2016172184A1 (en) 2015-04-21 2016-04-20 Systems and methods for run-time alignment of a spot scanning wafer inspection system

Publications (3)

Publication Number Publication Date
JP2018516367A JP2018516367A (ja) 2018-06-21
JP2018516367A5 true JP2018516367A5 (enExample) 2019-05-30
JP6550470B2 JP6550470B2 (ja) 2019-07-24

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JP2017554832A Active JP6550470B2 (ja) 2015-04-21 2016-04-20 スポット走査型ウェハ検査システムのランタイムアライメントシステム及び方法

Country Status (8)

Country Link
US (1) US9864173B2 (enExample)
EP (1) EP3286780B1 (enExample)
JP (1) JP6550470B2 (enExample)
KR (1) KR102317067B1 (enExample)
CN (1) CN107466366B (enExample)
IL (1) IL254832B (enExample)
TW (1) TWI676022B (enExample)
WO (1) WO2016172184A1 (enExample)

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US10794840B2 (en) 2017-03-17 2020-10-06 Intel Corporation Apparatus for semiconductor package inspection
WO2019238553A1 (en) 2018-06-12 2019-12-19 Asml Netherlands B.V. System and method for scanning a sample using multi-beam inspection apparatus
FR3084768B1 (fr) 2018-07-31 2020-10-16 Commissariat Energie Atomique Procede d'analyse d'au moins un type de defauts parmi une pluralite de types de defauts entre au moins deux echantillons et dispositif associe
US10957571B2 (en) * 2018-08-30 2021-03-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and methods for determining wafer characters
US10923317B2 (en) * 2018-09-19 2021-02-16 KLA Corp. Detecting defects in a logic region on a wafer
US11933717B2 (en) * 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
US11127136B2 (en) * 2019-12-05 2021-09-21 Kla Corporation System and method for defining flexible regions on a sample during inspection
US11187679B1 (en) * 2020-05-20 2021-11-30 The Boeing Company Beam steering for laser ultrasonic inspection systems
EP3933499A1 (en) * 2020-07-03 2022-01-05 Mycronic Ab Device and method for controlling focus of a laser beam
US11748872B2 (en) * 2020-08-31 2023-09-05 KLA Corp. Setting up inspection of a specimen
CN112820682B (zh) * 2021-01-08 2024-06-21 杭州长川科技股份有限公司 晶圆输送机构及晶圆测试设备
CN117012683B (zh) * 2023-10-07 2023-12-22 深圳黑晶光电技术有限公司 一种太阳能电池偏移纠正方法
CN117388274B (zh) * 2023-10-24 2024-05-24 上海感图网络科技有限公司 多自由度相机检测载台
CN119804244B (zh) * 2024-11-20 2025-11-21 苏州镁伽科技有限公司 晶圆测量方法、装置、电子设备和存储介质

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US3851951A (en) * 1974-01-16 1974-12-03 Isomet Corp High resolution laser beam recorder with self-focusing acousto-optic scanner
US4926489A (en) * 1983-03-11 1990-05-15 Kla Instruments Corporation Reticle inspection system
US4805123B1 (en) * 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5825482A (en) * 1995-09-29 1998-10-20 Kla-Tencor Corporation Surface inspection system with misregistration error correction and adaptive illumination
WO1997013370A1 (en) 1995-10-02 1997-04-10 Kla Instruments Corporation Alignment correction prior to image sampling in inspection systems
US6236454B1 (en) * 1997-12-15 2001-05-22 Applied Materials, Inc. Multiple beam scanner for an inspection system
ATE535834T1 (de) 2001-05-03 2011-12-15 Kla Tencor Tech Corp Systeme und verfahren zum scannen einer probe mit einem lichtstrahl
US6755051B2 (en) 2002-10-07 2004-06-29 Delta Galil Industries, Ltd. Knitted garments and methods of fabrication thereof
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JP4812484B2 (ja) 2006-03-24 2011-11-09 株式会社日立ハイテクノロジーズ ボルテージコントラストを伴った欠陥をレビューする方法およびその装置
JP2009071136A (ja) 2007-09-14 2009-04-02 Hitachi High-Technologies Corp データ管理装置、検査システムおよび欠陥レビュー装置
CN101840025B (zh) * 2010-05-05 2011-11-09 北京大学 一种线性光子晶体器件
US10354405B2 (en) 2010-05-17 2019-07-16 Kla-Tencor Corporation Run-time correction of defect locations during defect review
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9255891B2 (en) * 2012-11-20 2016-02-09 Kla-Tencor Corporation Inspection beam shaping for improved detection sensitivity
US9182358B2 (en) * 2013-03-15 2015-11-10 Kla-Tencor Corporation Multi-spot defect inspection system
US8995746B2 (en) * 2013-03-15 2015-03-31 KLA—Tencor Corporation Image synchronization of scanning wafer inspection system
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