TWI672568B - 曝光裝置 - Google Patents

曝光裝置 Download PDF

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Publication number
TWI672568B
TWI672568B TW107130374A TW107130374A TWI672568B TW I672568 B TWI672568 B TW I672568B TW 107130374 A TW107130374 A TW 107130374A TW 107130374 A TW107130374 A TW 107130374A TW I672568 B TWI672568 B TW I672568B
Authority
TW
Taiwan
Prior art keywords
mask
substrate
exposure
projection
illumination
Prior art date
Application number
TW107130374A
Other languages
English (en)
Chinese (zh)
Other versions
TW201901309A (zh
Inventor
加藤正紀
鈴木智也
鬼頭義昭
堀正和
林田洋祐
木內徹
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW201901309A publication Critical patent/TW201901309A/zh
Application granted granted Critical
Publication of TWI672568B publication Critical patent/TWI672568B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW107130374A 2013-04-18 2014-03-31 曝光裝置 TWI672568B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013087650 2013-04-18
JPJP2013-087650 2013-04-18
JPJP2013-154965 2013-07-25
JP2013154965 2013-07-25

Publications (2)

Publication Number Publication Date
TW201901309A TW201901309A (zh) 2019-01-01
TWI672568B true TWI672568B (zh) 2019-09-21

Family

ID=51731223

Family Applications (4)

Application Number Title Priority Date Filing Date
TW106134986A TWI640841B (zh) 2013-04-18 2014-03-31 掃描曝光方法、曝光裝置、元件製造系統及元件製造方法
TW107130374A TWI672568B (zh) 2013-04-18 2014-03-31 曝光裝置
TW103111893A TWI610142B (zh) 2013-04-18 2014-03-31 基板處理裝置及元件製造方法
TW108131088A TWI707211B (zh) 2013-04-18 2014-03-31 圖案曝光裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW106134986A TWI640841B (zh) 2013-04-18 2014-03-31 掃描曝光方法、曝光裝置、元件製造系統及元件製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW103111893A TWI610142B (zh) 2013-04-18 2014-03-31 基板處理裝置及元件製造方法
TW108131088A TWI707211B (zh) 2013-04-18 2014-03-31 圖案曝光裝置

Country Status (6)

Country Link
JP (4) JP6269658B2 (ja)
KR (5) KR102062509B1 (ja)
CN (4) CN108710263B (ja)
HK (2) HK1215307A1 (ja)
TW (4) TWI640841B (ja)
WO (1) WO2014171270A1 (ja)

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CN111781807B (zh) * 2015-10-30 2024-01-12 株式会社尼康 基板处理装置及元件制造方法
US10983389B2 (en) 2016-03-04 2021-04-20 Applied Materials, Inc. Wire grid polarizer manufacturing method
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN106950801A (zh) * 2017-04-16 2017-07-14 合肥芯碁微电子装备有限公司 一种无掩膜激光直写光刻设备的快速边缘曝光方法
CN111566559B (zh) * 2018-01-10 2023-12-12 凸版印刷株式会社 光掩模
JP7232586B2 (ja) * 2018-07-31 2023-03-03 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7358970B2 (ja) * 2018-12-26 2023-10-11 株式会社デンソーウェーブ 光学的情報読取装置
CN109760407A (zh) * 2019-03-09 2019-05-17 深圳市正鑫源实业有限公司 智能凸版印刷压印力的控制方法及其凸版印刷系统
US10880528B1 (en) * 2019-10-31 2020-12-29 Christie Digital Systems Usa, Inc. Device, system and method for modulating light using a phase light modulator and a spatial light modulator
TWI724867B (zh) * 2020-04-16 2021-04-11 光群雷射科技股份有限公司 轉印式滾輪的製造方法及轉印式滾輪
CN111510141B (zh) * 2020-06-03 2023-09-15 江苏集萃微纳自动化系统与装备技术研究所有限公司 微型原子钟物理封装及微型原子钟
CN111965954B (zh) * 2020-09-09 2022-12-30 中国科学院光电技术研究所 一种掩模与基底相对同轴旋转的曝光装置

Citations (4)

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TW200830057A (en) * 2006-09-08 2008-07-16 Nikon Corp Mask, exposure apparatus and device manufacturing method
JP2011033907A (ja) * 2009-08-04 2011-02-17 Nikon Corp 照明装置、露光装置、照明方法、露光方法及びデバイス製造方法
JP2011221538A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法
TW201312295A (zh) * 2011-09-07 2013-03-16 尼康股份有限公司 基板處理裝置

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TW200830057A (en) * 2006-09-08 2008-07-16 Nikon Corp Mask, exposure apparatus and device manufacturing method
JP2011033907A (ja) * 2009-08-04 2011-02-17 Nikon Corp 照明装置、露光装置、照明方法、露光方法及びデバイス製造方法
JP2011221538A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法
TW201312295A (zh) * 2011-09-07 2013-03-16 尼康股份有限公司 基板處理裝置

Also Published As

Publication number Publication date
KR102204689B1 (ko) 2021-01-19
HK1215307A1 (zh) 2016-08-19
HK1255723A1 (zh) 2019-08-23
TW201901309A (zh) 2019-01-01
KR102062509B1 (ko) 2020-01-03
KR20190021483A (ko) 2019-03-05
KR20200078679A (ko) 2020-07-01
CN106933066A (zh) 2017-07-07
TW201945865A (zh) 2019-12-01
CN106933066B (zh) 2018-10-23
KR102126981B1 (ko) 2020-06-25
JP2019135554A (ja) 2019-08-15
JP2017102489A (ja) 2017-06-08
CN108710263A (zh) 2018-10-26
KR20190089237A (ko) 2019-07-30
CN107908083B (zh) 2020-09-18
JPWO2014171270A1 (ja) 2017-02-23
JP6773168B2 (ja) 2020-10-21
KR20150143741A (ko) 2015-12-23
TW201447501A (zh) 2014-12-16
TWI610142B (zh) 2018-01-01
KR101956973B1 (ko) 2019-06-24
JP2018081321A (ja) 2018-05-24
CN105339846A (zh) 2016-02-17
CN107908083A (zh) 2018-04-13
JP6515993B2 (ja) 2019-05-22
KR102005701B1 (ko) 2019-07-30
TWI707211B (zh) 2020-10-11
TWI640841B (zh) 2018-11-11
JP6380583B2 (ja) 2018-08-29
JP6269658B2 (ja) 2018-01-31
CN105339846B (zh) 2018-06-12
TW201804264A (zh) 2018-02-01
KR20190133074A (ko) 2019-11-29
CN108710263B (zh) 2021-01-26
WO2014171270A1 (ja) 2014-10-23

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