TWI671663B - 觸控面板用導電性基板、觸控面板用導電性基板之製造方法 - Google Patents

觸控面板用導電性基板、觸控面板用導電性基板之製造方法 Download PDF

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Publication number
TWI671663B
TWI671663B TW104124889A TW104124889A TWI671663B TW I671663 B TWI671663 B TW I671663B TW 104124889 A TW104124889 A TW 104124889A TW 104124889 A TW104124889 A TW 104124889A TW I671663 B TWI671663 B TW I671663B
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TW
Taiwan
Prior art keywords
copper
layer
touch panel
film
conductive substrate
Prior art date
Application number
TW104124889A
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English (en)
Chinese (zh)
Other versions
TW201629725A (zh
Inventor
永田純一
Original Assignee
日商住友金屬礦山股份有限公司
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Publication of TW201629725A publication Critical patent/TW201629725A/zh
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Publication of TWI671663B publication Critical patent/TWI671663B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
TW104124889A 2014-07-31 2015-07-31 觸控面板用導電性基板、觸控面板用導電性基板之製造方法 TWI671663B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014157061 2014-07-31
JPJP2014-157061 2014-07-31

Publications (2)

Publication Number Publication Date
TW201629725A TW201629725A (zh) 2016-08-16
TWI671663B true TWI671663B (zh) 2019-09-11

Family

ID=55217669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104124889A TWI671663B (zh) 2014-07-31 2015-07-31 觸控面板用導電性基板、觸控面板用導電性基板之製造方法

Country Status (5)

Country Link
JP (1) JP6497391B2 (ja)
KR (1) KR102344716B1 (ja)
CN (1) CN106575172B (ja)
TW (1) TWI671663B (ja)
WO (1) WO2016017773A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018139018A (ja) * 2015-07-31 2018-09-06 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP6613995B2 (ja) * 2016-04-05 2019-12-04 住友金属鉱山株式会社 硬化層を備えた基板を有する積層体フィルム
JP6531699B2 (ja) * 2016-04-05 2019-06-19 住友金属鉱山株式会社 導電性基板
JP6597459B2 (ja) * 2016-04-05 2019-10-30 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP6597487B2 (ja) * 2016-06-15 2019-10-30 住友金属鉱山株式会社 電極基板フィルム及びその製造方法
JP7049759B2 (ja) * 2016-07-12 2022-04-07 住友金属鉱山株式会社 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP6848243B2 (ja) * 2016-07-25 2021-03-24 住友金属鉱山株式会社 導電性基板の製造方法
TWI732892B (zh) * 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法
JP7262218B2 (ja) * 2018-12-17 2023-04-21 日東電工株式会社 保護フィルム付き導電性フィルム及び導電性フィルムの製造方法
JP7305342B2 (ja) * 2018-12-17 2023-07-10 日東電工株式会社 導電性フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201224903A (en) * 2010-10-05 2012-06-16 Fujifilm Corp Touch panel
WO2014035197A1 (ko) * 2012-08-31 2014-03-06 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
CN103731974A (zh) * 2012-10-16 2014-04-16 住友金属矿山株式会社 2层挠性基板及以2层挠性基板作为基材的印刷布线板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP4700332B2 (ja) * 2003-12-05 2011-06-15 イビデン株式会社 多層プリント配線板
CN101199247B (zh) * 2005-06-13 2010-09-29 揖斐电株式会社 印刷线路板
CN100588309C (zh) * 2005-10-05 2010-02-03 日矿金属株式会社 两层挠性基板
US20100084275A1 (en) * 2007-03-15 2010-04-08 Mikio Hanafusa Copper electrolytic solution and two-layer flexible substrate obtained using the same
EP2309025B1 (en) * 2008-08-07 2012-09-26 JX Nippon Mining & Metals Corporation Plated object with copper thin film formed by electroless plating
JP5361579B2 (ja) 2009-07-09 2013-12-04 信越ポリマー株式会社 大型ディスプレイ用のセンサパネル及びその製造方法
JP5267403B2 (ja) * 2009-09-29 2013-08-21 大日本印刷株式会社 タッチパネル用電極フィルム、該タッチパネル用電極フィルムの製造方法及びタッチパネル
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
CN102637637B (zh) * 2012-04-28 2014-03-26 深圳市华星光电技术有限公司 一种薄膜晶体管阵列基板及其制作方法
JP5224203B1 (ja) * 2012-07-11 2013-07-03 大日本印刷株式会社 タッチパネルセンサ、タッチパネル装置および表示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201224903A (en) * 2010-10-05 2012-06-16 Fujifilm Corp Touch panel
WO2014035197A1 (ko) * 2012-08-31 2014-03-06 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
TW201423771A (zh) * 2012-08-31 2014-06-16 Lg Chemical Ltd 導電結構體及其製造方法
CN103731974A (zh) * 2012-10-16 2014-04-16 住友金属矿山株式会社 2层挠性基板及以2层挠性基板作为基材的印刷布线板

Also Published As

Publication number Publication date
JPWO2016017773A1 (ja) 2017-05-25
TW201629725A (zh) 2016-08-16
CN106575172A (zh) 2017-04-19
CN106575172B (zh) 2022-04-29
WO2016017773A1 (ja) 2016-02-04
KR102344716B1 (ko) 2021-12-30
KR20170037969A (ko) 2017-04-05
JP6497391B2 (ja) 2019-04-10

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