TWI668494B - 顯示面板 - Google Patents

顯示面板 Download PDF

Info

Publication number
TWI668494B
TWI668494B TW107115468A TW107115468A TWI668494B TW I668494 B TWI668494 B TW I668494B TW 107115468 A TW107115468 A TW 107115468A TW 107115468 A TW107115468 A TW 107115468A TW I668494 B TWI668494 B TW I668494B
Authority
TW
Taiwan
Prior art keywords
transistor
data line
row
column
coupled
Prior art date
Application number
TW107115468A
Other languages
English (en)
Other versions
TW201947288A (zh
Inventor
陳銘耀
黃國有
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW107115468A priority Critical patent/TWI668494B/zh
Priority to CN201810597481.7A priority patent/CN108761943B/zh
Priority to US16/398,485 priority patent/US11175555B2/en
Application granted granted Critical
Publication of TWI668494B publication Critical patent/TWI668494B/zh
Publication of TW201947288A publication Critical patent/TW201947288A/zh

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553Reflecting elements
    • G02F1/133555Transflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553Reflecting elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • H01L27/1225Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/24Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78672Polycrystalline or microcrystalline silicon transistor
    • H01L29/78675Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/134309Electrodes characterised by their geometrical arrangement
    • G02F1/134345Subdivided pixels, e.g. for grey scale or redundancy
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/12Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
    • G02F2201/123Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode pixel
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00Function characteristic
    • G02F2203/09Function characteristic transflective

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thin Film Transistor (AREA)

Abstract

一種顯示面板,包括一基板、至少一第一電晶體以及至少一第二電晶體。基板包括至少一反射區及至少一穿透區。第一電晶體配置於基板之上,且位於對應之反射區,各個第一電晶體包括一第一主動層。第二電晶體配置於基板之上,且位於對應之穿透區,各個第二電晶體包括一第二主動層。其中,第一主動層的材料不同於第二主動層的材料。

Description

顯示面板
本發明是有關於一種顯示面板,且特別是有關於一種包括反射區及穿透區的顯示面板。
近來,隨著可攜式電子產品的普及,對於能夠適用於室外環境及室內環境之顯示裝置的需求亦與日俱增。其中,由於半穿透半反射式液晶顯示器(TRLCD)兼具穿透式及反射式液晶顯示器的優點,可同時利用來自背光模組的穿透光,以及來自環境光源的反射光,使液晶顯示器可在戶外強烈的光線下仍可維持一定可視性,並在背光模組電源關閉時,還可藉由環境光反射顯示資訊,節省面板之耗電量,故已成為備受歡迎的液晶顯示器之類型。
然而,由於現代人對於顯示品質愈趨重視,期望面板在播放動態畫面時能夠更加清晰,而若顧及畫面之清晰程度恐需耗費相當多的電力。因此,目前的半穿透半反射式液晶顯示器仍未能達成兼顧畫面品質及節省電力的需求。
本揭露係有關於一種顯示面板。本揭露之顯示面板包括反射區與穿透區,且在反射區與穿透區選用不同類型的第一電晶體及第二電晶體,藉由第一電晶體與第二電晶體之不同材料的特性,在反射區與穿透區能分別發揮省電及顯示品質清晰之功效。
根據本揭露之一方面,提出一種顯示面板。顯示面板包括一基板、至少一第一電晶體以及至少一第二電晶體。基板包括至少一反射區及至少一穿透區。第一電晶體配置於基板之上,且位於對應之反射區,各個第一電晶體包括一第一主動層。第二電晶體配置於基板之上,且位於對應之穿透區,各個第二電晶體包括一第二主動層。其中,第一主動層的材料不同於第二主動層的材料。
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:
10、20、30、40、50、60、70、80、90、100‧‧‧顯示面板
101、201、301、401‧‧‧基板
101a‧‧‧表面
110、210、310、410‧‧‧緩衝層
120、220、320、420‧‧‧第一絕緣層
130、230、330、430‧‧‧第二絕緣層
150、250、350、450‧‧‧第一保護層
160、260、360、460‧‧‧第二保護層
170、270、370、470‧‧‧反射層
180a、181、281、381、481‧‧‧第一畫素電極
180b、182、282、382、482‧‧‧第二畫素電極
191、192、291、292、391、392、491、492‧‧‧通孔
1411、2411、3411、4411‧‧‧第一主動層
1412、2412、3412、4412‧‧‧第一源極
1413、2413、3413、4413‧‧‧第一汲極
1414、2414、3414、4414‧‧‧第一閘極
1421、2421、3421、4421‧‧‧第二主動層
1422、2422、3422、4422‧‧‧第二源極
1423、2423、3423、4423‧‧‧第二汲極
1424、2424、3424、4424‧‧‧第二閘極
AA‧‧‧可視區
AB‧‧‧週邊電路區
AC‧‧‧驅動電路區
AAi‧‧‧方塊
D1、D2、D3、D4、D5、D6、D7‧‧‧資料線
G1、G2、G3、G4‧‧‧掃描線
I2,1、I4,1、I6,1、I2,2、I2,3...、I141、I241、I341、I441‧‧‧第一電晶體
L1,1、L3,1、L5,1、L1,2、L1,3...、L142、L242、L342、L442‧‧‧第二電晶體
M1、M2、M3、M4、M5、M6‧‧‧行數
N1、N2、N3‧‧‧列數
Rr‧‧‧反射區
Tr‧‧‧穿透區
第1圖繪示根據本揭露之一實施例之顯示面板的上視圖。
第2圖繪示根據本揭露之一實施例之顯示面板的畫素布局示意圖。
第3圖繪示根據本揭露之又一實施例之顯示面板的畫素布局示意圖。
第4圖繪示根據本揭露之又一實施例之顯示面板的畫素布局示意圖。
第5圖繪示根據本揭露之又一實施例之顯示面板的畫素布局示意圖。
第6圖繪示根據本揭露之又一實施例之顯示面板的畫素布局示意圖。
第7圖繪示根據本揭露之又一實施例之顯示面板的畫素布局示意圖。
第8圖繪示根據本揭露一實施例之顯示面板的局部剖面圖。
第9圖繪示根據本揭露又一實施例之顯示面板的局部剖面圖。
第10圖繪示根據本揭露又一實施例之顯示面板的局部剖面圖。
第11圖繪示根據本揭露又一實施例之顯示面板的局部剖面圖。
本揭露係有關於一種顯示面板。本揭露之顯示面板包括反射區與穿透區,且在反射區與穿透區選用不同類型的第一電晶體及第二電晶體,由於第一電晶體所使用的材料能夠降低顯示面板的漏電量,第二電晶體所使用的材料能夠提高顯示面板之畫面的更新速率,故能達到兼具省電及提升畫質之效果。
第1圖繪示根據本揭露之一實施例之顯示面板10的上視圖。
請參照第1圖,顯示面板10包括一基板101,基板101的一表面101a上具有可視區AA,週邊電路區AB以及驅動 電路區AC。基板101可與另一基板(未繪示)對組,且基板101與另一基板之間可具有一液晶層(未繪示)。表面101a為面向液晶層及另一基板的表面,亦即是基板101的內側。基板101的可視區AA中包括反射區Rr及穿透區Tr,如第2圖之一部分可視區AA的方塊AAi所示。
第2圖繪示根據本揭露之一實施例之顯示面板10的畫素布局示意圖。
請參照第2圖,顯示面板10包括第一電晶體I(例如是I2,1、I4,1、I6,1…I2,2、I4,2、I6,2…、I2,3、I4,3、I6,3…)以及第二電晶體L(例如是L1,1、L3,1、L5,1…L1,2、L3,2、L5,2…L1,3、L3,3、L5,3)。第一電晶體I配置於基板101的表面101a上,且位於對應之反射區Rr。第二電晶體L配置於基板101的表面101a上,且位於對應之穿透區Tr。第一電晶體I包括第一主動層;第二電晶體L包括第二主動層,其中第一主動層的材料可不同於第二主動層的材料。在一實施例中,第一主動層的材料包括氧化物半導體,此氧化物半導體可以是元素週期表中第2到4族之元素的氧化物的混合物,例如是氧化銦鎵鋅(IGZO)、氧化銦鋅錫(IZTO)、氧化銦鎵錫(IGTO)、氧化銦鋅(IZO)、氧化銦鎵(IGO)、氧化鋅錫(ZTO)及氧化錫(SnO)。第二主動層的材料包括多晶矽。換言之,第一電晶體I可以是氧化物半導體電晶體,而第二電晶體L可以是多晶矽電晶體。
多晶矽電晶體相較於氧化物半導體電晶體以及非晶矽電晶體而言,具備較高的充電速率,可提供顯示面板較佳之畫面更新率(frame rate),可改善殘影(motion blur)的現象,呈現動態畫面時的畫素品質相當優異。氧化物半導體電晶體相較於多晶矽半導體電晶體以及非晶矽電晶體而言,具備更低之漏電流,在降低畫面更新率之操作之下仍可維持靜態畫面,達到節省顯示面板之耗電量的目的。在本揭露中,由於對應於反射區的第一電晶體I是選用氧化物半導體電晶體,對應於穿透區的第二電晶體L是選用多晶矽電晶體,使得氧化物半導體電晶體能夠藉由其低漏電的特性,在需要呈現靜態畫面時維持低畫面更新率之操作,達到省電的需求,多晶矽電晶體則能夠藉由其高充電能力的特性,在需要呈現動態畫面時進行高畫面更新率之操作,達成提升動畫的畫質的目的,故可提供兼具優異之畫質及省電效能的顯示面板。
請參照第2圖,顯示面板10上包括相交錯之多條資料線D1、D2、D3、D4、D5、D6、D7…以及多條掃描線G1、G2、G3、G4…,將基板101區劃分成多個畫素組,各個畫素組包括多個畫素(例如是包括紅色畫素R、綠色畫素G及藍色畫素B(未繪示))。資料線D1、D2、D3、D4、D5、D6、D7…例如是沿著Y方向延伸,且沿著X方向依序排列設置。掃描線G1、G2、G3、G4…例如是沿著X方向延伸,且沿著Y方向依序排列設置。X方向可垂直於Y方向。各個第一電晶體I2,1、I4,1、I6,1…I2,2、I4,2、 I6,2…、I2,3、I4,3、I6,3…與各個第二電晶體L1,1、L3,1、L5,1…L1,2、L3,2、L5,2…L1,3、L3,3、L5,3與對應之資料線D1、D2、D3、D4、D5、D6、D7…、掃描線G1、G2、G3、G4…以及畫素耦接。反射區Rr以及穿透區Tr係排列成具有複數行(columns)和複數列(rows)之一矩陣且對應於畫素。每個畫素依據位於反射區Rr及穿透區Tr之不同,分別對應於第一畫素電極180a及第二畫素電極180b。矩陣例如是具有第M1行、第M2行、第M3行…第Mm行、第Mm+1…行,以及第N1列、第N2列、第N3列…第Nn行、第Nn+1…行。m與n為正整數。其中,每一資料線D1、D2、D3、D4、D5、D6、D7…僅耦接於第一電晶體I2,1、I4,1、I6,1…I2,2、I4,2、I6,2…、I2,3、I4,3、I6,3…或第二電晶體L1,1、L3,1、L5,1…L1,2、L3,2、L5,2…L1,3、L3,3、L5,3。例如,資料線D1僅耦接於第二電晶體L1,1、L1,2、L1,3…,並不會耦接於任何的第一電晶體I。資料線D2僅耦接於第一電晶體I2,1、I2,2、I2,3…,並不會耦接於任何的第二電晶體L。每一掃瞄線G1、G2、G3…可耦接於第一電晶體及第二電晶體。例如,掃描線G1耦接第一電晶體I2,1、I4,1、I6,1…及第二電晶體L1,1、L3,1、L5,1…。
在本揭露中,資料線D1、D2、D3、D4…之間可具有順序關係。例如,在一實施例中,資料線D1可表示第x條資料線,資料線D2可表示第x+1條資料線,資料線D3可表示第x+2條資料線,資料線D4可表示第x+3條資料線,以此類推。在另一實施例中,資料線D1可表示第x-1條資料線,資料線D2可表示第 x條資料線,資料線D3可表示第x+1條資料線,資料線D4可表示第x+2條資料線,以此類推。然本揭露並不以此為限。其中,x可為任何正整數。
在本實施例中,其中1個第一電晶體I2,1位於資料線D2與資料線D3之間且耦接於資料線D2。其中1個第二電晶體L3,1位於資料線D3與資料線D4之間且耦接於資料線D3。另外,第一電晶體I2,1位與第二電晶體L3,1均耦接於掃描線G1。
第3圖繪示根據本揭露之又一實施例之顯示面板20的畫素布局示意圖,類似於第2圖之部分可視區AA的方塊AAi之區域,與第2圖之實施例的不同之處在於,同一行的畫素可交替設置反射區Rr及穿透區Tr。
請參照第3圖,1個第M1行第N1列之第一電晶體I1,1以及1個第M1行第N2列之第二電晶體L1,2位於資料線D1與資料線D2之間,第M1行第N1列之第一電晶體I1,1耦接於資料線D2,第M1行第N2列之第二電晶體L1,2耦接於資料線D1。1個第M2行第N1列之第二電晶體L2,1以及1個第M2行第N2列之第一電晶體I2,2位於資料線D2與資料線D3之間,第M2行第N1列之第二電晶體L2,1耦接於資料線D3,第M2行第N2列之第一電晶體I2,2耦接於資料線D2。資料線D1僅耦接於第二電晶體L1,2…,並不會耦接於任何的第一電晶體I。資料線D2僅耦接於第一電晶體I1,1、I2,2、及I1,3…,並不會耦接於任何的第二電晶體L。相較於第2圖之顯示面板10的畫素布局而言,由於第3圖之顯示面板20的畫素布局 中,同一行的畫素並非皆對應於同一類型的電晶體,而是以兩種不同類型的電晶體(第一電晶體及第二電晶體)相隔設置,能夠具有較均勻的顯示效果。
在本實施例中,每一掃瞄線G1、G2、G3…可耦接於第一電晶體及第二電晶體。例如,掃描線G1耦接第一電晶體I1,1、I3,1、I5,1…及第二電晶體L2,1、L4,1、L6,1…。
第4圖繪示根據本揭露之又一實施例之顯示面板30的畫素布局示意圖,類似於第2圖之部分可視區AA的方塊AAi之區域,與第2圖之實施例的不同之處在於,同一行的畫素可交替設置反射區Rr及穿透區Tr,每一資料線在同一列畫素中可耦接於2個電晶體。
請參照第4圖,第M1行第N1列之第二電晶體L1,1、第M2行第N1列之第二電晶體L2,1、第M1行第N2列之第一電晶體I1,2、及第M2行第N2列之第一電晶體I2,2位於資料線D1與資料線D2之間。第二電晶體L2,1是通過第二電晶體L1,1耦接於資料線D1。第一電晶體I1,2是通過第一電晶體I2,2耦接於資料線D2。第M3行第N1列之第一電晶體I3,1、第M4行第N1列之第一電晶體I4,1、第M3行第N2列之第二電晶體L3,2、及第M4行第N2列之第二電晶體L4,2,位於資料線D2與資料線D3之間。第一電晶體I4,1係通過第一電晶體I3,1耦接於資料線D2。第二電晶體L3,2係通過第二電晶體L4,2耦接於資料線D3。資料線D1僅耦接於第二電晶體L1,1、L2,1、L1,3、L2,3…,並不會耦接於任何的第一電晶體I。 資料線D2僅耦接於第一電晶體I3,1、I4,1、I1,2、I2,2…,並不會耦接於任何的第二電晶體L。
在一實施例中,每一掃瞄線G1、G2、G3…可耦接於第一電晶體及第二電晶體。例如,掃描線G1耦接第一電晶體I4,1…及第二電晶體L2,1…。第一電晶體I4,1與第二電晶體L2,1之間可間隔一畫素。掃描線G2耦接第一電晶體I1,2、I3,1…及第二電晶體L1,1、L3,2…,掃描線G2位於第二電晶體L1,1與第一電晶體I1,2之間,並位於第一電晶體I3,1與第二電晶體L3,2之間。
本實施例之顯示面板30是採用半源極線驅動型(half source line driving,HSD)的畫素布局,相較於顯示面板10及20之實施例而言,具備較少的資料線的數量,如此可降低積體電路之腳位(pin)及接墊(pad)之用量,讓顯示面板的邊框可具有較小的面積,更能節省成本。
第5圖繪示根據本揭露之又一實施例之顯示面板40的畫素布局示意圖,類似於第2圖之部分可視區AA的方塊AAi之區域,與第2圖之實施例的不同之處在於,每一行畫素中具有2個不同種類電晶體(第一電晶體I及第二電晶體L),每一資料線在相鄰2列的畫素中可耦接於2個電晶體。
請參照第5圖,1個第M2行第N2列之第一電晶體I2,2以及1個第M3行第N1列之第一電晶體I3,1,位於資料線D2與資料線D4之間,亦即,1個第M2行第N2列之第一電晶體I2,2,位於資料線D2與資料線D3之間,1個第M3行第N1列之第一電晶體 I3,1,位於資料線D3與資料線D4之間,第M3行第N1列之第一電晶體I3,1係通過第M2行第N2列之第一電晶體I2,2耦接於資料線D2。1個第M3行第N2列之第二電晶體L3,2以及1個第M4行第N1列之第二電晶體L4,1,位於資料線D3與資料線D5之間,亦即,1個第M3行第N2列之第二電晶體L3,2,位於資料線D3與資料線D4之間,以及1個第M4行第N1列之第二電晶體L4,1,位於資料線D4與資料線D5之間,第M4行第N1列之第二電晶體L4,1係通過第M3行第N2列之第二電晶體L3,2耦接於資料線D3。
在本實施例中,每一掃瞄線G1、G2、G3…可耦接於第一電晶體及第二電晶體。例如,掃描線G1耦接第一電晶體I1,1、I3,1、I5,1…及第二電晶體L2,1、L4,1、L6,1…。掃描線G2耦接第N2列的第一電晶體I2,2、I4,2…及第二電晶體L1,2、L3,2…,且耦接第N3列的第一電晶體I2,3…及第二電晶體L1,3
第6圖繪示根據本揭露之又一實施例之顯示面板50的畫素布局示意圖,類似於第2圖之部分可視區AA的方塊AAi之區域,與第2圖之實施例的不同之處在於,每一行畫素只具有一種電晶體,例如,第M1行畫素中具有第二電晶體L,第M2行畫素中具有第一電晶體I…,每一資料線在同一列畫素中可耦接於2個電晶體。
請參照第6圖,1個第M3行第N1列之第一電晶體I3,1以及1個第M6行第N1列之第一電晶體I6,1,位於資料線D2與資料線D4之間,第M6行第N1列之第一電晶體I6,1係通過第M3行 第N1列之第一電晶體I3,1耦接於資料線D2。1個第M5行第N1列之第二電晶體L5,1以及1個第M8行第N1列之第二電晶體L8,1,位於資料線D3與資料線D5之間,第M8行第N1列之第二電晶體L8,1係通過第M5行第N1列之第二電晶體L5,1耦接於資料線D3。
在一實施例中,每一掃瞄線G1、G2、G3…可耦接於第一電晶體及第二電晶體。例如,掃描線G1耦接第一電晶體I2,1、I6,1…及第二電晶體L4,1、L8,1…。掃描線G2耦接第N1列的第一電晶體I3,1、I7,1…及第二電晶體L1,1、L5,1…,且耦接第N2列的第一電晶體I3,2…及第二電晶體L1,2
由於本實施例之顯示面板50在1個畫素中同時具有反射區Rr及穿透區Tr,相較於1個畫素區中僅有反射區Rr或僅有穿透區Tr之顯示面板10、20與30之實施例而言,具有較佳之解析度。
第7圖繪示根據本揭露之又一實施例之顯示面板60的畫素布局示意圖,類似於第2圖之部分可視區AA的方塊AAi之區域,與第2圖之實施例的不同之處在於,同一行的畫素可交替設置反射區Rr及穿透區Tr,每一資料線可耦接連續3個不同列畫素的電晶體。其中,每條資料線D1、D2、D3、D4…中有一部分沿著X方向延伸,一部分沿著Y方向沿伸,具有蜿蜒的外型。
請參照第7圖,第M8行第N2列之第一電晶體I8,2位於資料線D2與資料線D3之間,第M7行第N3列之第一電晶體I7,3及第M9行第N1列之第一電晶體I9,1位於資料線D3與資料線D4之 間,第一電晶體I9,1係通過第一電晶體I7,3及第一電晶體I8,2耦接資料線D3。第M5行第N2列之第二電晶體L5,2位於資料線D1與資料線D2之間,第M4行第N3列之第二電晶體L4,3及第M6行第N1列之第二電晶體L6,1位於資料線D2與資料線D3之間,第二電晶體L6,1係通過第二電晶體L4,3及第二電晶體L5,2耦接資料線D2。
在一實施例中,每一掃瞄線G1、G2、G3…可耦接於第一電晶體及第二電晶體。例如,掃描線G2耦接第一電晶體I1,1、I3,1、I5,1…及第二電晶體L2,1、L4,1、L6,1…。
本實施例之顯示面板60是採用三分之一源極線驅動型(one third source line driving,OTSD)的畫素布局,相較於顯示面板10、20及30之實施例而言,具備較少的資料線的數量,如此可降低積體電路之腳位及接墊之用量,讓顯示面板的邊框可具有較小的面積,更能大幅節省成本。
第8圖繪示根據本揭露一實施例之顯示面板70的局部剖面圖。
請參照第8圖,其繪示顯示面板70中對應於第一電晶體I141及第二電晶體L142的局部剖面圖。顯示面板70包括基板101,緩衝層110,第一絕緣層120,第二絕緣層130,第一電晶體I141,第二電晶體L142,第一保護層150,第二保護層160,反射層170,第一畫素電極181及第二畫素電極182。基板101包括反射區Rr及穿透區Tr。緩衝層110形成於基板101上。第一絕緣層120形成於緩衝層110上。第二絕緣層130形成於第一絕緣層120上。第一保護層150形成於第二絕緣層130 上。第一電晶體I141與第二電晶體L142配置於基板101之上,形成於緩衝層110與第一保護層150之間,且分別位於對應之反射區Rr穿透區Tr。第二保護層160形成於第一保護層150上,反射層170形成於反射區Rr的第二保護層160上,第一畫素電極181形成於反射層170上。
第一電晶體I141包括第一主動層1411,第一源極1412,第一汲極1413及第一閘極1414。第一閘極1414位於第一主動層1411的下方,第一電晶體I141又稱作底閘極電晶體。第二電晶體L142包括第二主動層1421,第二源極1422,第二汲極1423及第二閘極1424。第二閘極1424位於第二主動層1421的上方,第二電晶體L142又稱作頂閘極電晶體。第一畫素電極181及第二畫素電極182分別透過通孔191及192耦接於第一汲極1413及第二汲極1423。
第一主動層1411的材料包括氧化物半導體,此氧化物半導體可以是元素週期表中第2到4族之元素的氧化物的混合物,例如是氧化銦鎵鋅(IGZO)、氧化銦鋅錫(IZTO)、氧化銦鎵錫(IGTO)、氧化銦鋅(IZO)、氧化銦鎵(IGO)、氧化鋅錫(ZTO)及氧化錫(SnO)。第二主動層1421的材料包括多晶矽。因此,本實施例的顯示面板70在可視區AA使用底閘極之氧化物半導體電晶體搭配頂閘極之多晶矽電晶體。
在本實施例中,基板101可由玻璃所製成。緩衝層110可由無機介電材料所製成。第一絕緣層120可由氧化物所製成,例如是 氧化矽。第一源極1412、第一汲極1413、第一閘極1414、第二源極1422、第二汲極1423及第二閘極1424可由金屬所製成。
第9圖繪示根據本揭露又一實施例之顯示面板80的局部剖面圖,與第8圖顯示面板70之實施例的不同之處可在於第一電晶體I241的結構。
請參照第9圖,第一電晶體I241包括第一主動層2411,第一源極2412,第一汲極2413及第一閘極2414。第一閘極2414位於第一主動層2411的上方,第一電晶體I241又稱作頂閘極電晶體。第二電晶體L242包括第二主動層2421,第二源極2422,第二汲極2423及第二閘極2424。第二閘極2424位於第二主動層2421的上方,第二電晶體L242又稱作頂閘極電晶體。因此,本實施例的顯示面板80在可視區AA使用頂閘極之氧化物半導體電晶體搭配頂閘極之多晶矽電晶體。
第9圖之基板201、緩衝層210、第一絕緣層220、第二絕緣層230、第一保護層250、第二保護層260、反射層270、第一畫素電極281及第二畫素電極282分別是類似於第8圖之基板101、緩衝層110、第一絕緣層120、第二絕緣層130、第一保護層150、第二保護層160、反射層170、第一畫素電極181及第二畫素電極182。第一畫素電極281及第二畫素電極282分別透過通孔291及292耦接於第一汲極2413及第二汲極2423。
第10圖繪示根據本揭露又一實施例之顯示面板90的局部剖面圖,與第8圖顯示面板70之實施例的不同之處在於第二電晶體I342的結構。
請參照第10圖,第一電晶體I341包括第一主動層3411,第一源極3412,第一汲極3413及第一閘極3414。第一閘極3414位於第一主動層3411的下方,第一電晶體I341又稱作底閘極電晶體。第二電晶體I342包括第二主動層3421,第二源極3422,第二汲極3423及第二閘極3424。第二閘極3424位於第二主動層3421的下方,第二電晶體I242又稱作底閘極電晶體。因此,本實施例的顯示面板90在可視區AA使用底閘極之氧化物半導體電晶體搭配底閘極之多晶矽電晶體。
第10圖之基板301、緩衝層310、第一絕緣層320、第二絕緣層330、第一保護層350、第二保護層360、反射層370、第一畫素電極381及第二畫素電極382分別是類似於第8圖之基板101、緩衝層110、第一絕緣層120、第二絕緣層130、第一保護層150、第二保護層160、反射層170、第一畫素電極181及第二畫素電極182。第一畫素電極381及第二畫素電極382分別透過通孔391及392耦接於第一汲極3413及第二汲極3423。
第11圖繪示根據本揭露又一實施例之顯示面板100的局部剖面圖,與第8圖顯示面板70之實施例的不同之處在於第一電晶體I441與第二電晶體L441的結構。
請參照第11圖,第一電晶體I441包括第一主動層4411,第一源極4412,第一汲極4413及第一閘極4414。第一閘極4414位於第一主動層4411的上方,第一電晶體I441又稱作頂閘極電晶體。第二電晶體I442包括第二主動層4421,第二源極4422,第二汲極4423及第二閘極4424。第二閘極4424位於第二主動層4421的下方,第二電晶體L442又稱作底閘極電晶體。因此,本實施例的顯示面板100在可視區AA使用頂閘極之氧化物半導體電晶體搭配底閘極之多晶矽電晶體。
第11圖之基板401、緩衝層410、第一絕緣層420、第二絕緣層430、第一保護層450、第二保護層460、反射層470、第一畫素電極481及第二畫素電極482分別是類似於第8圖之基板101、緩衝層110、第一絕緣層120、第二絕緣層130、第一保護層150、第二保護層160、反射層170、第一畫素電極181及第二畫素電極182。第一畫素電極481及第二畫素電極482分別透過通孔491及492耦接於第一汲極4413及第二汲極4423。
本揭露提供一種顯示面板。由於本揭露之顯示面板包括反射區及穿透區,在對應於反射區的第一電晶體I是選用氧化物半導體電晶體,在對應於穿透區的第二電晶體L是選用多晶矽電晶體,使得氧化物半導體電晶體能夠藉由其低漏電的特性,在需要呈現靜態畫面時維持低畫面更新率之操作,達到省電的需求,多晶矽電晶體則能夠藉由其高充電能力的特性,在需要呈現動態 畫面時進行高畫面更新率之操作,達成提升動畫的畫質的目的,故可提供兼具優異之畫質及省電效能的顯示面板。
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。

Claims (10)

  1. 一種顯示面板,包括:一基板,包括位於可視區中的至少一反射區及至少一穿透區;至少一第一電晶體,配置於該基板之上,且位於對應之該反射區,各該第一電晶體包括一第一主動層;以及至少一第二電晶體,配置於該基板之上,且位於對應之該穿透區,各該第二電晶體包括一第二主動層;其中該第一主動層的材料不同於該第二主動層的材料。
  2. 如申請專利範圍第1項所述之顯示面板,其中該第一主動層包括氧化物半導體,該第二主動層包括多晶矽。
  3. 如申請專利範圍第1項所述之顯示面板,其上更包括相交錯之複數條資料線以及複數條掃描線,將該基板區劃分成複數個畫素組,各該畫素組包括複數個畫素,各該第一電晶體與各該第二電晶體與對應之該資料線、該掃描線以及該畫素耦接,該至少一反射區及該至少一穿透區之數目均為複數個,且該些反射區以及該些穿透區係排列成具有複數行(columns)和複數列(rows)之一矩陣且對應於該些畫素,其中每一該資料線僅耦接於該第一電晶體或該第二電晶體。
  4. 如申請專利範圍第3項所述之顯示面板,其中每一該畫素組更包括:沿一第一方向依序設置之一第x條資料線、一第x+1條資料線以及一第x+2條資料線,其中x為正整數;1個該第一電晶體,位於該第x條資料線與該第x+1條資料線之間且耦接於該第x條資料線;以及1個該第二電晶體,位於該第x+1條資料線與該第x+2條資料線之間且耦接於該第x+1條資料線。
  5. 如申請專利範圍第3項所述之顯示面板,其中每一該畫素組包括:沿一第一方向依序設置之一第x條資料線、一第x+1條資料線以及一第x+2條資料線;1個第m行第n列之該第一電晶體以及1個第m行第n+1列之該第二電晶體,位於該第x條資料線與該第x+1條資料線之間,第m行第n列之該第一電晶體耦接於該第x+1條資料線,第m行第n+1列之該第二電晶體耦接於該第x條資料線;以及1個第m+1行第n列之該第二電晶體以及1個第m+1行第n+1列之該第一電晶體,位於該第x+1條資料線與該第x+2條資料線之間,第m+1行第n列之該第二電晶體耦接於該第x+2條資料線,第m+1行第n+1列之該第一電晶體耦接於該第x+1條資料線,其中x、m、n為正整數。
  6. 如申請專利範圍第3項所述之顯示面板,其中每一該畫素組包括:沿一第一方向依序設置之一第x條資料線、一第x+1條資料線以及一第x+2條資料線;1個第m行第n列之該第二電晶體、1個第m+1行第n列之該第二電晶體、1個第m行第n+1列之該第一電晶體、以及1個第m+1行第n+1列之該第一電晶體,位於該第x條資料線與該第x+1條資料線之間,第m+1行第n列之該第二電晶體係通過第m行第n列之該第二電晶體耦接於該第x條資料線,第m行第n+1列之該第一電晶體係通過第m+1行第n+1列之該第一電晶體耦接於該第x+1條資料線;以及1個第m+2行第n列之該第一電晶體、1個第m+3行第n列之該第一電晶體、1個第m+2行第n+1列之該第二電晶體、以及1個第m+3行第n+1列之該第二電晶體,位於該第x+1條資料線與該第x+2條資料線之間,第m+3行第n列之該第一電晶體係通過第m+2行第n列之該第一電晶體耦接於該第x+1條資料線,第m+2行第n+1列之該第二電晶體係通過第m+3行第n+1列之該第二電晶體耦接於該第x+2條資料線,其中x、m、n為正整數。
  7. 如申請專利範圍第3項所述之顯示面板,其中每一該畫素組包括:沿一第一方向依序設置之一第x條資料線、一第x+1條資料線、一第x+2條資料線以及一第x+3條資料線;1個第m行第n+1列之該第一電晶體以及1個第m+1行第n列之該第一電晶體,位於該第x條資料線與該第x+2條資料線之間,第m+1行第n列之該第一電晶體係通過第m行第n+1列之該第一電晶體耦接於該第x條資料線;以及1個第m+1行第n+1列之第二電晶體以及1個第m+2行第n列之第二電晶體,位於該第x+1條資料線與該第x+3條資料線之間,第m+2行第n列之該第二電晶體係通過第m+1行第n+1列之該第二電晶體耦接於該第x+1條資料線,其中x、m、n為正整數。
  8. 如申請專利範圍第3項所述之顯示面板,其中每一該畫素組包括:沿一第一方向依序設置之一第x條資料線、一第x+1條資料線、一第x+2條資料線以及一第x+3條資料線;1個第m行第n列之該第一電晶體以及1個第m+3行第n列之該第一電晶體,位於該第x條資料線與該第x+2條資料線之間,第m+3行第n列之該第一電晶體係通過第m行第n列之該第一電晶體耦接於該第x條資料線;以及1個第m+2行第n列之該第二電晶體以及1個第m+5行第n列之該第二電晶體,位於該第x+1條資料線與該第x+3條資料線之間,第m+5行第n列之該第二電晶體係通過第m+2行第n列之該第二電晶體耦接於該第x+1條資料線,其中x、m、n為正整數。
  9. 如申請專利範圍第3項所述之顯示面板,其中每一該畫素組包括:沿一第一方向依序設置之一第x條資料線、一第x+1條資料線、一第x+2條資料線及一第x+3條資料線,其中該第x條資料線、該第x+1條資料線、該第x+2條資料線及該第x+3條資料線之延伸方向部分平行於該第一方向,部分平行於與該第一方向大致垂直的一第二方向;第m+5行第n+1列之該第一電晶體位於該第x+1條資料線與該第x+2條資料線之間,第m+4行第n+2列之該第一電晶體及第m+6行第n列之該第一電晶體位於該第x+2條資料線與該第x+3條資料線之間,第m+6行第n列之該第一電晶體係通過第m+4行第n+2列之該第一電晶體及第m+5行第n+1列之該第一電晶體耦接該第x+2條資料線;第m+2行第n+1列之該第二電晶體位於該第x條資料線與該第x+1條資料線之間,第m+1行第n+2列之該第二電晶體及第m+3行第n列之該第二電晶體位於該第x+1條資料線與該第x+2條資料線之間,第m+3行第n列之該第二電晶體係通過第m+1行第n+2列之該第二電晶體及第m+2行第n+1列之該第二電晶體耦接該第x+1條資料線,其中x、m、n為正整數。
  10. 如申請專利範圍第1項所述之顯示面板,更包括:一反射層,位於該反射區;一第一畫素電極,位於該反射區,並與該第一電晶體耦接;以及一第二畫素電極,位於該穿透區,並與該第二電晶體耦接。
TW107115468A 2018-05-07 2018-05-07 顯示面板 TWI668494B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW107115468A TWI668494B (zh) 2018-05-07 2018-05-07 顯示面板
CN201810597481.7A CN108761943B (zh) 2018-05-07 2018-06-11 显示面板
US16/398,485 US11175555B2 (en) 2018-05-07 2019-04-30 Display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107115468A TWI668494B (zh) 2018-05-07 2018-05-07 顯示面板

Publications (2)

Publication Number Publication Date
TWI668494B true TWI668494B (zh) 2019-08-11
TW201947288A TW201947288A (zh) 2019-12-16

Family

ID=64021288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107115468A TWI668494B (zh) 2018-05-07 2018-05-07 顯示面板

Country Status (3)

Country Link
US (1) US11175555B2 (zh)
CN (1) CN108761943B (zh)
TW (1) TWI668494B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112445038B (zh) * 2020-11-30 2022-07-26 厦门天马微电子有限公司 显示面板和显示装置
CN115735427A (zh) * 2021-06-23 2023-03-03 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201251026A (en) * 2011-06-02 2012-12-16 Au Optronics Corp Hybrid thin film transistor and manufacturing method thereof and display panel
TWI608610B (zh) * 2015-12-03 2017-12-11 群創光電股份有限公司 顯示裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4269702B2 (ja) * 2003-01-24 2009-05-27 セイコーエプソン株式会社 液晶表示装置、その製造方法、及び電子機器
KR101218311B1 (ko) * 2006-03-31 2013-01-04 삼성디스플레이 주식회사 표시 기판과 이의 제조 방법, 이를 구비한 표시 장치 및구동 방법
JP2009042759A (ja) * 2007-08-07 2009-02-26 Samsung Electronics Co Ltd 液晶表示装置
CN101458429B (zh) * 2007-12-12 2011-12-21 群康科技(深圳)有限公司 液晶显示器及其驱动方法
KR101872678B1 (ko) * 2009-12-28 2018-07-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 표시 장치 및 전자 기기
US9336739B2 (en) * 2010-07-02 2016-05-10 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
KR101502118B1 (ko) * 2010-11-01 2015-03-12 삼성디스플레이 주식회사 표시 장치
TWI471946B (zh) 2010-11-17 2015-02-01 Innolux Corp 薄膜電晶體
CN102566132A (zh) * 2010-12-08 2012-07-11 上海天马微电子有限公司 一种半反半透式薄膜晶体管液晶显示器
US9818765B2 (en) 2013-08-26 2017-11-14 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US10186528B2 (en) * 2014-02-24 2019-01-22 Lg Display Co., Ltd. Thin film transistor substrate and display using the same
TWI554808B (zh) * 2015-04-13 2016-10-21 友達光電股份有限公司 液晶顯示面板及液晶顯示器
US9911762B2 (en) * 2015-12-03 2018-03-06 Innolux Corporation Display device
US10180605B2 (en) * 2016-07-27 2019-01-15 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201251026A (en) * 2011-06-02 2012-12-16 Au Optronics Corp Hybrid thin film transistor and manufacturing method thereof and display panel
TWI608610B (zh) * 2015-12-03 2017-12-11 群創光電股份有限公司 顯示裝置

Also Published As

Publication number Publication date
US20190339554A1 (en) 2019-11-07
CN108761943A (zh) 2018-11-06
TW201947288A (zh) 2019-12-16
US11175555B2 (en) 2021-11-16
CN108761943B (zh) 2023-09-19

Similar Documents

Publication Publication Date Title
KR101204365B1 (ko) 액정 표시 패널 및 그 제조 방법
JP5414974B2 (ja) 液晶表示装置
TWI326776B (en) Liquid crystal panel and liquid crystal display device
JP3321807B2 (ja) 液晶パネル用基板,液晶パネル及びそれを用いた電子機器並びに液晶パネル用基板の製造方法
JP4583922B2 (ja) 液晶表示装置及びその製造方法
US20160342042A1 (en) Pixel structure and liquid crystal display panel comprising same
JP2007193334A5 (zh)
JP2005208580A (ja) 表示装置
KR101319331B1 (ko) 액티브 매트릭스 표시장치
CN109728005B (zh) 一种阵列基板、显示面板以及显示装置
JP2009075547A (ja) 電気光学装置および電子機器
US8466862B2 (en) Liquid crystal display device
US9093043B2 (en) Display device and electronic apparatus
TWI668494B (zh) 顯示面板
JP2001264818A (ja) 液晶装置
TWI432861B (zh) 液晶顯示面板
US9134565B2 (en) Pixel unit and display panel having the same
JP2007093847A (ja) 電気光学装置、および電子機器
CN100373221C (zh) 显示面板以及电子装置
CN109061973B (zh) 像素结构、显示面板及显示装置
KR20070121220A (ko) 액정표시장치의 게이트 라인 및 데이터 라인 공유 회로 및이의 구동방법
WO2024000478A1 (zh) 显示面板及显示装置
KR20060028879A (ko) 액정표시장치
KR101110056B1 (ko) 액정표시장치 및 디스플레이장치
JP2005195641A (ja) 表示装置