TWI668456B - Display panel, testing device and testing method - Google Patents

Display panel, testing device and testing method Download PDF

Info

Publication number
TWI668456B
TWI668456B TW107118547A TW107118547A TWI668456B TW I668456 B TWI668456 B TW I668456B TW 107118547 A TW107118547 A TW 107118547A TW 107118547 A TW107118547 A TW 107118547A TW I668456 B TWI668456 B TW I668456B
Authority
TW
Taiwan
Prior art keywords
test
pad
voltage
electrically connected
switch
Prior art date
Application number
TW107118547A
Other languages
Chinese (zh)
Other versions
TW201903421A (en
Inventor
李少兵
Original Assignee
大陸商友達光電(蘇州)有限公司
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商友達光電(蘇州)有限公司, 友達光電股份有限公司 filed Critical 大陸商友達光電(蘇州)有限公司
Publication of TW201903421A publication Critical patent/TW201903421A/en
Application granted granted Critical
Publication of TWI668456B publication Critical patent/TWI668456B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66Testing of connections, e.g. of plugs or non-disconnectable joints

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)

Abstract

一種顯示面板包括主動區及測試電路。測試電路電性連接主動區。測試電路包括第一主開關、第一測試墊、第二測試墊以及第一操作墊。第一測試墊電性連接第一主開關的第一端。第二測試墊電性連接第一主開關的第二端。第一操作墊電性連接第一主開關的控制端。 A display panel includes an active area and a test circuit. The test circuit is electrically connected to the active area. The test circuit includes a first main switch, a first test pad, a second test pad, and a first operation pad. The first test pad is electrically connected to the first end of the first main switch. The second test pad is electrically connected to the second end of the first main switch. The first operation pad is electrically connected to the control terminal of the first main switch.

Description

顯示面板、測試裝置與測試方法    Display panel, test device and test method   

本案涉及一種電子裝置及方法。具體而言,本案涉及一種顯示面板、測試裝置及測試方法。 This case relates to an electronic device and method. Specifically, this case relates to a display panel, a test device, and a test method.

隨著科技的發展,顯示面板已廣泛地應用在人們的生活當中。 With the development of technology, display panels have been widely used in people's lives.

顯示面板在出廠前需進行測試。一般而言,測試裝置可利用探針提供測試訊號至顯示面板,以進行測試。然而,探針與顯示面板間容易因接觸不良而造成誤判。因此,新的測試方法當被提出。 The display panel needs to be tested before leaving the factory. Generally speaking, a test device can provide a test signal to a display panel using a probe for testing. However, poor contact between the probe and the display panel can easily cause misjudgment. Therefore, new test methods should be proposed.

本案一實施態樣涉及一種顯示面板。根據本案一實施例,顯示面板包括主動區及測試電路。測試電路電性連接主動區。測試電路包括第一主開關、第一測試墊、第二測試墊以及第一操作墊。第一測試墊電性連接第一主開關的第一端。第二測試墊電性連接第一主開關的第二端。第一操作墊電性連接第一主開關的控制端。 An embodiment of the present invention relates to a display panel. According to an embodiment of the present invention, the display panel includes an active area and a test circuit. The test circuit is electrically connected to the active area. The test circuit includes a first main switch, a first test pad, a second test pad, and a first operation pad. The first test pad is electrically connected to the first end of the first main switch. The second test pad is electrically connected to the second end of the first main switch. The first operation pad is electrically connected to the control terminal of the first main switch.

本案另一實施態樣涉及一種測試裝置。根據本案一實施例,測試裝置包括電壓提供電路、反饋比較電路以及警報系統。電壓提供電路用以提供測試電壓至顯示面板的第一測試墊,其中第一測試墊透過第一主開關電性連接第二測試墊。反饋比較電路電性連接電壓提供電路,用以接收來自電壓提供電路的測試電壓,偵測第二測試墊上的偵測測試電壓,並比較測試電壓與偵測測試電壓。警報系統電性連接反饋比較電路,用以在測試電壓及偵測測試電壓不同的情況下,提供第一警報。 Another aspect of the present invention relates to a test device. According to an embodiment of the present invention, the test device includes a voltage providing circuit, a feedback comparison circuit, and an alarm system. The voltage supply circuit is used to provide a test voltage to the first test pad of the display panel, wherein the first test pad is electrically connected to the second test pad through the first main switch. The feedback comparison circuit is electrically connected to the voltage supply circuit for receiving the test voltage from the voltage supply circuit, detecting the detection test voltage on the second test pad, and comparing the test voltage with the detection test voltage. The alarm system is electrically connected with a feedback comparison circuit, and is used for providing a first alarm when the test voltage and the detected test voltage are different.

本案另一實施態樣涉及一種測試方法。根據本案一實施例,測試方法包括:提供測試電壓至顯示面板的第一測試墊,其中第一測試墊透過第一主開關電性連接第二測試墊;偵測第二測試墊上的偵測測試電壓;比較測試電壓與偵測測試電壓;以及在測試電壓及偵測測試電壓不同的情況下,提供第一警報。 Another aspect of this case involves a test method. According to an embodiment of the present invention, the test method includes: providing a test voltage to a first test pad of the display panel, wherein the first test pad is electrically connected to the second test pad through the first main switch; and a detection test on the second test pad Voltage; comparing the test voltage with the detection test voltage; and providing a first alarm if the test voltage and the detection test voltage are different.

透過應用上述一實施例,即可快速判斷測試裝置與顯示面板間是否線路異常(如接觸不良或連接異常等等)。 By applying the above embodiment, it can be quickly judged whether the line between the test device and the display panel is abnormal (such as poor contact or abnormal connection, etc.).

10‧‧‧測試系統 10‧‧‧test system

100‧‧‧顯示面板 100‧‧‧ display panel

110‧‧‧主動區 110‧‧‧active zone

120‧‧‧測試電路 120‧‧‧test circuit

200‧‧‧測試裝置 200‧‧‧test device

210‧‧‧電壓提供電路 210‧‧‧Voltage supply circuit

220‧‧‧反饋比較電路 220‧‧‧Feedback comparison circuit

230‧‧‧警報系統 230‧‧‧Alarm system

PO、PO1、PO2‧‧‧操作墊 PO, PO1, PO2 ‧‧‧ operation pad

P1‧‧‧測試墊 P1‧‧‧test pad

P2‧‧‧測試墊 P2‧‧‧test pad

PR‧‧‧測試墊 PR‧‧‧Test Pad

PG‧‧‧測試墊 PG‧‧‧Test Pad

PB‧‧‧測試墊 PB‧‧‧Test Pad

PM‧‧‧測試墊 PM‧‧‧Test Pad

PD‧‧‧測試墊 PD‧‧‧Test Pad

PE‧‧‧測試墊 PE‧‧‧Test Pad

TR‧‧‧開關 TR‧‧‧Switch

TR0-TR4‧‧‧開關 TR0-TR4‧‧‧Switch

OT1-OT2‧‧‧開關 OT1-OT2‧‧‧Switch

GO‧‧‧電壓提供子電路 GO‧‧‧Voltage supply sub-circuit

GR‧‧‧電壓提供子電路 GR‧‧‧ voltage supply sub-circuit

GB‧‧‧電壓提供子電路 GB‧‧‧ voltage supply sub-circuit

GD‧‧‧電壓提供子電路 GD‧‧‧Voltage supply sub-circuit

GT‧‧‧電壓提供子電路 GT‧‧‧ voltage supply sub-circuit

GE‧‧‧電壓提供子電路 GE‧‧‧ Voltage Supply Sub-Circuit

GO1‧‧‧電壓提供子電路 GO1‧‧‧ voltage supply sub-circuit

GO2‧‧‧電壓提供子電路 GO2‧‧‧ Voltage Supply Sub-Circuit

222‧‧‧比較器 222‧‧‧ Comparator

224‧‧‧比較器 224‧‧‧ Comparator

226‧‧‧比較器 226‧‧‧ Comparator

228‧‧‧比較器 228‧‧‧ Comparator

DL‧‧‧資料線 DL‧‧‧Data Line

GL‧‧‧閘極線 GL‧‧‧Gate line

VCOM‧‧‧共同電極 VCOM‧‧‧Common electrode

XR‧‧‧像素電路 XR‧‧‧Pixel Circuit

XG‧‧‧像素電路 XG‧‧‧Pixel Circuit

XB‧‧‧像素電路 XB‧‧‧Pixel Circuit

CMP1-CMP4‧‧‧比較訊號 CMP1-CMP4‧‧‧Comparative signal

VGH‧‧‧高電壓位準 VGH‧‧‧High Voltage Level

VGL‧‧‧高電壓位準 VGL‧‧‧High Voltage Level

PRD1、PRD2‧‧‧期間 During PRD1, PRD2 ‧‧‧

300‧‧‧方法 300‧‧‧ Method

S1-S4‧‧‧操作 S1-S4‧‧‧ Operation

第1圖為根據本案一實施例所繪示的測試系統的示意圖;第2圖為根據本案一實施例所繪示的測試系統的示意圖;第3圖為根據本案另一實施例所繪示的測試系統的示意 圖;第4圖為根據本案另一實施例所繪示的測試系統的示意圖;第5圖為根據本案一實施例所繪示的不同期間的電壓變化圖;以及第6圖為根據本發明一實施例所繪示的測試方法的流程圖。 FIG. 1 is a schematic diagram of a test system according to an embodiment of the case; FIG. 2 is a schematic diagram of a test system according to an embodiment of the case; and FIG. 3 is a schematic diagram of a test system according to another embodiment of the case. A schematic diagram of a test system; FIG. 4 is a schematic diagram of a test system according to another embodiment of the present case; FIG. 5 is a voltage change diagram of different periods according to an embodiment of the present case; and FIG. 6 is based on A flowchart of a test method according to an embodiment of the present invention.

以下將以圖式及詳細敘述清楚說明本揭示內容之精神,任何所屬技術領域中具有通常知識者在瞭解本揭示內容之實施例後,當可由本揭示內容所教示之技術,加以改變及修飾,其並不脫離本揭示內容之精神與範圍。 The following will clearly illustrate the spirit of the present disclosure with diagrams and detailed descriptions. Any person with ordinary knowledge in the technical field who understands the embodiments of the present disclosure can be changed and modified by the techniques taught in the present disclosure. It does not depart from the spirit and scope of this disclosure.

關於本文中所使用之『第一』、『第二』、...等,並非特別指稱次序或順位的意思,亦非用以限定本發明,其僅為了區別以相同技術用語描述的元件或操作。 Regarding the "first", "second", ..., etc. used herein, they do not specifically mean the order or order, nor are they used to limit the present invention. They are only used to distinguish elements described in the same technical terms or operating.

關於本文中所使用之『電性連接』,可指二或多個元件相互直接作實體或電性接觸,或是相互間接作實體或電性接觸,而『電性連接』還可指二或多個元件相互操作或動作。 As used herein, "electrical connection" may refer to two or more components directly making physical or electrical contact with each other, or indirectly making physical or electrical contact with each other, and "electrical connection" may also refer to two or Multiple elements operate or act on each other.

關於本文中所使用之『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。 The terms "including", "including", "having", "containing" and the like used in this article are all open-ended terms, which means including but not limited to.

關於本文中所使用之『及/或』,係包括所述事 物的任一或全部組合。 As used herein, "and / or" includes any or all combinations of the things described.

關於本文中所使用之方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本案。 Regarding the directional terms used in this article, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the case.

關於本文中所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本揭露之描述上額外的引導。 Regarding the terms used in this article, unless otherwise specified, each term usually has the ordinary meaning of being used in this field, the content disclosed here, and the special content. Certain terms used to describe this disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of this disclosure.

第1圖為根據本案一實施例所繪示的測試系統10的示意圖。在本實施例中,測試系統10包括顯示面板100與測試裝置200。 FIG. 1 is a schematic diagram of a test system 10 according to an embodiment of the present invention. In this embodiment, the test system 10 includes a display panel 100 and a test device 200.

在本實施例中,顯示面板100包括主動區110及測試電路120。測試電路120電性連接主動區110(如主動區中的像素電路)。測試電路120包括開關TR、測試墊P1、測試墊P2以及操作墊PO。測試墊P1電性連接開關TR的第一端。測試墊P2電性連接開關TR的第二端。操作墊PO電性連接開關TR的控制端。測試墊P1、P2電性連接主動區110(如主動區中的像素電路)。 In this embodiment, the display panel 100 includes an active area 110 and a test circuit 120. The test circuit 120 is electrically connected to the active area 110 (such as a pixel circuit in the active area). The test circuit 120 includes a switch TR, a test pad P1, a test pad P2, and an operation pad PO. The test pad P1 is electrically connected to the first end of the switch TR. The test pad P2 is electrically connected to the second end of the switch TR. The operation pad PO is electrically connected to the control terminal of the switch TR. The test pads P1 and P2 are electrically connected to the active area 110 (such as a pixel circuit in the active area).

在本實施例中,操作墊PO用以接收來自測試裝置200的操作電壓,開關TR根據操作電壓(例如具高電壓準位)導通。在本實施例中,測試墊P1用以接收來自測試裝置200的測試電壓(例如具有高電壓準位)。當開關TR導通時,測試墊P1可提供測試電壓至測試墊P2。 In this embodiment, the operation pad PO is used to receive an operation voltage from the test device 200, and the switch TR is turned on according to the operation voltage (for example, having a high voltage level). In this embodiment, the test pad P1 is used to receive a test voltage (eg, having a high voltage level) from the test device 200. When the switch TR is turned on, the test pad P1 can provide a test voltage to the test pad P2.

藉此,測試裝置200即可藉由偵測測試墊P2上的電壓(下稱為偵測測試電壓),並將偵測測試電壓與提供至測試墊P1的測試電壓進行比較,以快速判斷測試裝置200與顯示面板100間是否線路異常(如接觸不良或連接異常等等)。例如,在測試裝置200提供操作電壓至操作墊PO,並提供測試電壓至測試墊P1的情況下,當偵測測試電壓與測試電壓不同時,便判斷線路異常;當偵測測試電壓與測試電壓相同時,便判斷線路正常。 In this way, the test device 200 can quickly determine the test by detecting the voltage on the test pad P2 (hereinafter referred to as the detection test voltage), and comparing the detection test voltage with the test voltage provided to the test pad P1. Whether the line between the device 200 and the display panel 100 is abnormal (such as poor contact or abnormal connection, etc.). For example, in a case where the test device 200 provides an operating voltage to the operating pad PO and a test voltage to the testing pad P1, when the detected test voltage is different from the test voltage, it is determined that the line is abnormal; when the detected test voltage and the test voltage are detected When they are the same, the line is judged to be normal.

在一實施例中,測試裝置200包括電壓提供電路210、反饋比較電路220及警報系統230。在一實施例中,反饋比較電路220電性連接電壓提供電路210。在一實施例中,警報系統230電性連接反饋比較電路220。 In one embodiment, the test apparatus 200 includes a voltage providing circuit 210, a feedback comparison circuit 220, and an alarm system 230. In one embodiment, the feedback comparison circuit 220 is electrically connected to the voltage providing circuit 210. In one embodiment, the alarm system 230 is electrically connected to the feedback comparison circuit 220.

在一實施例中,電壓提供電路210用以產生並提供測試電壓至測試墊P1及反饋比較電路220。在一實施例中,電壓提供電路210亦用以產生並提供操作電壓至操作墊PO。在一實施例中,電壓提供電路210例如是透過排針接觸測試墊P1與操作墊PO而與其電性連接,然本案不以此為限。 In one embodiment, the voltage supply circuit 210 is used to generate and provide a test voltage to the test pad P1 and the feedback comparison circuit 220. In one embodiment, the voltage supply circuit 210 is also used to generate and provide an operation voltage to the operation pad PO. In one embodiment, the voltage supply circuit 210 is electrically connected to the test pad P1 and the operation pad PO through a pin contact, for example, but the present invention is not limited thereto.

在一實施例中,反饋比較電路220用以接收來自電壓提供電路210的測試電壓,偵測測試墊P2上的偵測測試電壓,並比較測試電壓及偵測測試電壓。在一實施例中,反饋比較電路220用以根據測試電壓及偵測測試電壓的比較結果,產生並提供比較訊號至警報系統230。在一實施例中,反饋比較電路220例如是透過排針接觸測試墊P2而與測 試墊P2電性連接,但不以此為限。 In one embodiment, the feedback comparison circuit 220 is used to receive the test voltage from the voltage supply circuit 210, detect the detection test voltage on the test pad P2, and compare the test voltage and the detection test voltage. In an embodiment, the feedback comparison circuit 220 is configured to generate and provide a comparison signal to the alarm system 230 according to a comparison result of the test voltage and the detected test voltage. In one embodiment, the feedback comparison circuit 220 is electrically connected to the test pad P2 through a pin contacting the test pad P2, but is not limited thereto.

在一實施例中,警報系統230根據比較訊號提供警報(如亮紅燈)。在一實施例中,警報系統230可在測試電壓與偵測測試電壓不同的情況下提供警報。 In one embodiment, the alarm system 230 provides an alarm (such as a red light) based on the comparison signal. In one embodiment, the alarm system 230 may provide an alarm when the test voltage is different from the detected test voltage.

藉此,即可快速判斷測試裝置200與顯示面板100間是否線路異常。 Thereby, it can be quickly judged whether the line between the test device 200 and the display panel 100 is abnormal.

在本案一實施例中,在進行顯示面板100的功能測試(如點亮測試)前,測試裝置200可先提供操作電壓(如提供高電壓位準)至操作墊PO,以進行線路是否異常的測試。 In an embodiment of the present case, before performing a function test (such as a lighting test) of the display panel 100, the test device 200 may first provide an operating voltage (such as providing a high voltage level) to the operation pad PO to check whether the line is abnormal. test.

若警報系統230未提供警報,則代表測試裝置200與顯示面板100間線路正常,則測試裝置200停止提供操作電壓(如改為提供低電壓位準)至操作墊PO,以關閉開關TR,並接著進行顯示面板100的功能測試(如點亮測試)。 If the alarm system 230 does not provide an alarm, it means that the line between the testing device 200 and the display panel 100 is normal, then the testing device 200 stops supplying the operating voltage (such as providing a low voltage level) to the operating pad PO to turn off the switch TR, and Then, a function test (such as a lighting test) of the display panel 100 is performed.

若警報系統230提供警報,則代表測試裝置200與顯示面板100間可能線路異常,則管理者可進行進一步偵錯。 If the alarm system 230 provides an alarm, it means that the line between the test device 200 and the display panel 100 may be abnormal, and the administrator can perform further debugging.

第2圖為根據本案一實施例所繪示的測試系統10的示意圖。 FIG. 2 is a schematic diagram of a test system 10 according to an embodiment of the present invention.

在本實施例中,主動區110中設置有以矩陣形式排列的像素電路XR、XG、XB、彼此平行的資料線DL、彼此平行的閘極線GL及共同電極VCOM。在一實施例中,像素電路XR例如為紅色像素電路、像素電路XG例如為綠色像素電路、像素電路XB例如為藍色像素電路,然而本案不以 此為限。應注意到,像素電路XR、XG、XB、資料線DL、閘極線GL的數量皆可依實際需要改變,故本案不以此一實施例為限。 In this embodiment, the active region 110 is provided with pixel circuits XR, XG, XB arranged in a matrix form, data lines DL parallel to each other, gate lines GL parallel to each other, and a common electrode VCOM. In one embodiment, the pixel circuit XR is, for example, a red pixel circuit, the pixel circuit XG is, for example, a green pixel circuit, and the pixel circuit XB is, for example, a blue pixel circuit, but the present invention is not limited thereto. It should be noted that the number of the pixel circuits XR, XG, XB, the data lines DL, and the gate lines GL can be changed according to actual needs, so this embodiment is not limited to this embodiment.

在本實施例中,測試電路120包括測試墊PR、測試墊PG、測試墊PB、測試墊PM、測試墊PD、測試墊PE、操作墊PO、開關TR1、開關TR2及開關TR3。 In this embodiment, the test circuit 120 includes a test pad PR, a test pad PG, a test pad PB, a test pad PM, a test pad PD, a test pad PE, an operation pad PO, a switch TR1, a switch TR2, and a switch TR3.

在本實施例中,測試墊PR電性連接開關TR1的第一端,並透過資料線DL電性連接一行像素電路XR。測試墊PG電性連接開關TR1的第二端,並透過資料線DL電性連接一行像素電路XG。開關TR1的控制端電性連接操作墊PO。 In this embodiment, the test pad PR is electrically connected to the first end of the switch TR1, and is electrically connected to a row of pixel circuits XR through the data line DL. The test pad PG is electrically connected to the second end of the switch TR1, and is electrically connected to a row of pixel circuits XG through the data line DL. The control terminal of the switch TR1 is electrically connected to the operation pad PO.

在本實施例中,測試墊PB電性連接開關TR2的第一端,並透過資料線DL電性連接一行像素電路XB。測試墊PM電性連接開關TR2的第二端,並電性連接共同電極VCOM。開關TR2的控制端電性連接操作墊PO。 In this embodiment, the test pad PB is electrically connected to the first end of the switch TR2, and is electrically connected to a row of pixel circuits XB through the data line DL. The test pad PM is electrically connected to the second end of the switch TR2, and is electrically connected to the common electrode VCOM. The control terminal of the switch TR2 is electrically connected to the operation pad PO.

在本實施例中,測試墊PD電性連接開關TR3的第一端,並電性連接奇數列閘極線GL(如第一、第三列閘極線GL)。測試墊PE電性連接開關TR3的第二端,並電性連接偶數列閘極線GL(如第二列閘極線GL)。開關TR3的控制端電性連接操作墊PO。 In this embodiment, the test pad PD is electrically connected to the first end of the switch TR3 and is electrically connected to the odd-numbered column gate lines GL (such as the first and third column gate lines GL). The test pad PE is electrically connected to the second end of the switch TR3, and is electrically connected to the even-numbered gate lines GL (such as the second-row gate lines GL). The control terminal of the switch TR3 is electrically connected to the operation pad PO.

在一些樣態中,第1圖中的測試墊P1可為第2圖中的測試墊PR、第1圖中的測試墊P2可為第2圖中的測試墊PG、第1圖中的開關TR可為第2圖中的開關TR1、且第1圖中的操作墊PO可為第2圖中的操作墊PO。 In some aspects, the test pad P1 in the first diagram may be the test pad PR in the second diagram, the test pad P2 in the first diagram may be the test pad PG in the second diagram, and the switch in the first diagram TR may be the switch TR1 in the second figure, and the operation pad PO in the first figure may be the operation pad PO in the second figure.

在另一些樣態中,第1圖中的測試墊P1可為第2圖中的測試墊PB、第1圖中的測試墊P2可為第2圖中的測試墊PM、第1圖中的開關TR可為第2圖中的開關TR2、且第1圖中的操作墊PO可為第2圖中的操作墊PO。 In other aspects, the test pad P1 in FIG. 1 may be the test pad PB in FIG. 2, and the test pad P2 in FIG. 1 may be the test pad PM in FIG. 2 and the test pad P1 in FIG. 1. The switch TR may be the switch TR2 in the second figure, and the operation pad PO in the first figure may be the operation pad PO in the second figure.

在另一些樣態中,第1圖中的測試墊P1可為第2圖中的測試墊PD、第1圖中的測試墊P2可為第2圖中的測試墊PE、第1圖中的開關TR可為第2圖中的開關TR3、且第1圖中的操作墊PO可為第2圖中的操作墊PO。 In other aspects, the test pad P1 in Fig. 1 may be the test pad PD in Fig. 2 and the test pad P2 in Fig. 1 may be the test pad PE in Fig. 2 and the test pad P1 in Fig. 1 The switch TR may be the switch TR3 in the second figure, and the operation pad PO in the first figure may be the operation pad PO in the second figure.

亦即,利用上述設置,測試裝置200即可藉由偵測測試墊PG、PM、PE上的電壓(即偵測測試電壓),並分別將偵測測試電壓與提供至測試墊PR、PB、PD的測試電壓進行比較,以快速判斷測試裝置200與顯示面板100間是否線路異常。 That is, with the above settings, the test device 200 can detect the voltages on the test pads PG, PM, and PE (that is, detect the test voltages), and respectively provide the detected test voltages and the test pads PR, PB, and The test voltages of the PDs are compared to quickly determine whether the line between the test device 200 and the display panel 100 is abnormal.

在測試裝置200提供操作電壓(如高電壓準位)至操作墊PO,以導通開關TR1-TR3的情況下,當提供至測試墊PR的測試電壓(如高電壓準位)不同於自測試墊PG上偵測到的偵測測試電壓時、當提供至測試墊PB的測試電壓(如高電壓準位)不同於自測試墊PM上偵測到的偵測測試電壓時、或/及當提供至測試墊PD的測試電壓(如高電壓準位)不同於自測試墊PE上偵測到的偵測測試電壓時,測試裝置200判斷測試裝置200與顯示面板100間線路異常。相對地,當提供至測試墊PR的測試電壓相同於自測試墊PG上偵測到的偵測測試電壓時、當提供至測試墊PB的測試電壓相同於自測試墊PM上偵測到的偵測測試電壓時、且當提供至 測試墊PD的測試電壓相同於自測試墊PE上偵測到的偵測測試電壓時,測試裝置200判斷測試裝置200與顯示面板100間線路正常。 When the test device 200 provides an operating voltage (such as a high voltage level) to the operation pad PO to turn on the switches TR1-TR3, when the test voltage (such as a high voltage level) provided to the test pad PR is different from the self-test pad When the detection test voltage detected on the PG, when the test voltage (such as a high voltage level) provided to the test pad PB is different from the detection test voltage detected on the test pad PM, or / and when provided When the test voltage (such as high voltage level) to the test pad PD is different from the detected test voltage detected on the test pad PE, the test device 200 determines that the line between the test device 200 and the display panel 100 is abnormal. In contrast, when the test voltage supplied to the test pad PR is the same as the detection test voltage detected on the self-test pad PG, the test voltage supplied to the test pad PB is the same as the detection voltage detected on the self-test pad PM. When the test voltage is measured, and when the test voltage provided to the test pad PD is the same as the detected test voltage detected on the self-test pad PE, the test device 200 determines that the line between the test device 200 and the display panel 100 is normal.

在本實施例中,電壓提供電路210可包括電壓提供子電路GO、電壓提供子電路GR、電壓提供子電路GB、電壓提供子電路GD。在本實施例中,反饋比較電路220包括比較器222、比較器224及比較器226。 In this embodiment, the voltage supply circuit 210 may include a voltage supply sub-circuit GO, a voltage supply sub-circuit GR, a voltage supply sub-circuit GB, and a voltage supply sub-circuit GD. In this embodiment, the feedback comparison circuit 220 includes a comparator 222, a comparator 224, and a comparator 226.

在本實施例中,電壓提供子電路GO用以產生並提供操作電壓至操作墊PO。在本實施例中,電壓提供子電路GR用以產生並提供測試電壓至測試墊PR及比較器222。在本實施例中,電壓提供子電路GB用以產生並提供測試電壓至測試墊PB及比較器224。在本實施例中,電壓提供子電路GD用以產生並提供測試電壓至測試墊PD及比較器226。在一實施例中,電壓提供子電路GO、GR、GB、GD例如是分別透過排針接觸操作墊PO、測試墊PR、PG、PB而分別與操作墊PO、測試墊PR、PG、PB電性連接,然本案不以此為限。 In this embodiment, the voltage providing sub-circuit GO is used to generate and provide an operating voltage to the operating pad PO. In this embodiment, the voltage supply sub-circuit GR is used to generate and provide a test voltage to the test pad PR and the comparator 222. In this embodiment, the voltage supply sub-circuit GB is used to generate and provide a test voltage to the test pad PB and the comparator 224. In this embodiment, the voltage supply sub-circuit GD is used to generate and provide a test voltage to the test pad PD and the comparator 226. In one embodiment, the voltage supply sub-circuits GO, GR, GB, and GD are electrically connected to the operation pads PO, test pads PR, PG, and PB, respectively, by contacting the operation pads PO, test pads PR, PG, and PB through pin headers. Sexual connection, but this case is not limited to this.

在本實施例中,比較器222用以接收來自電壓提供子電路GR的測試電壓,偵測測試墊PG上的偵測測試電壓,並比較來自電壓提供子電路GR的測試電壓及在測試墊PG上偵測到的偵測測試電壓。而後,比較器222根據比較結果,產生並提供比較訊號CMP1至警報系統230。 In this embodiment, the comparator 222 is configured to receive the test voltage from the voltage supply sub-circuit GR, detect the detection test voltage on the test pad PG, and compare the test voltage from the voltage supply sub-circuit GR with the test pad PG. Detected detection test voltage. Then, the comparator 222 generates and provides a comparison signal CMP1 to the alarm system 230 according to the comparison result.

在本實施例中,比較器224用以接收來自電壓提供子電路GB的測試電壓,偵測測試墊PM上的偵測測試電 壓,並比較來自電壓提供子電路GB的測試電壓及在測試墊PM上偵測到的偵測測試電壓。而後,比較器224根據比較結果,產生並提供比較訊號CMP2至警報系統230。 In this embodiment, the comparator 224 is used to receive the test voltage from the voltage supply sub-circuit GB, detect the detection test voltage on the test pad PM, and compare the test voltage from the voltage supply sub-circuit GB and the test pad PM. Detected detection test voltage. Then, the comparator 224 generates and provides a comparison signal CMP2 to the alarm system 230 according to the comparison result.

在本實施例中,比較器226用以接收來自電壓提供子電路GD的測試電壓,偵測測試墊PE上的偵測測試電壓,並比較來自電壓提供子電路GD的測試電壓及在測試墊PE上偵測到的偵測測試電壓。而後,比較器226根據比較結果,產生並提供比較訊號CMP3至警報系統230。 In this embodiment, the comparator 226 is configured to receive the test voltage from the voltage supply sub-circuit GD, detect the detection test voltage on the test pad PE, and compare the test voltage from the voltage supply sub-circuit GD with the test pad PE. Detected detection test voltage. Then, the comparator 226 generates and provides a comparison signal CMP3 to the alarm system 230 according to the comparison result.

在一實施例中,比較器222、224、226例如是分別透過排針接觸測試墊PG、PM、PE而分別與測試墊PG、PM、PE電性連接,但不以此為限。 In one embodiment, the comparators 222, 224, and 226 are electrically connected to the test pads PG, PM, and PE, respectively, by contacting the test pads PG, PM, and PE through a pin, but are not limited thereto.

在一實施例中,警報系統230根據比較訊號CMP1、CMP2、CMP3提供警報(如亮紅燈)。在一實施例中,警報系統230可在來自電壓提供子電路GR的測試電壓及在測試墊PG上偵測到的偵測測試電壓不同的情況下、來自電壓提供子電路GB的測試電壓及在測試墊PM上偵測到的偵測測試電壓不同的情況下、或/及來自電壓提供子電路GD的測試電壓及在測試墊PE上偵測到的偵測測試電壓不同的情況下提供警報。 In one embodiment, the alarm system 230 provides an alarm (such as a red light) based on the comparison signals CMP1, CMP2, and CMP3. In an embodiment, the alarm system 230 may detect the test voltage from the voltage supply sub-circuit GB and the test voltage when the test voltage from the voltage supply sub-circuit GR and the detected test voltage detected on the test pad PG are different. An alarm is provided when the detection test voltage detected on the test pad PM is different, or when the test voltage from the voltage supply sub-circuit GD and the detection test voltage detected on the test pad PE are different.

藉此,即可快速判斷測試裝置200與顯示面板100間是否線路異常。 Thereby, it can be quickly judged whether the line between the test device 200 and the display panel 100 is abnormal.

在本案一實施例中,在進行顯示面板100的功能測試(如點亮測試)前,測試裝置200可先提供操作電壓(如提供高電壓位準)至操作墊PO,以進行線路是否異常的測 試。 In an embodiment of the present case, before performing a function test (such as a lighting test) of the display panel 100, the test device 200 may first provide an operating voltage (such as providing a high voltage level) to the operation pad PO to check whether the line is abnormal. test.

若警報系統230未提供警報,則代表測試裝置200與顯示面板100間線路正常,則測試裝置200停止提供操作電壓(如改為提供低電壓位準)至操作墊PO,以關閉開關TR1-TR3,並接著進行顯示面板100的功能測試(如點亮測試)。 If the alarm system 230 does not provide an alarm, it means that the line between the test device 200 and the display panel 100 is normal, then the test device 200 stops providing the operating voltage (such as providing a low voltage level) to the operation pad PO to turn off the switches TR1-TR3. Then, a function test (such as a lighting test) of the display panel 100 is performed.

若警報系統230提供警報,則代表測試裝置200與顯示面板100間可能線路異常,則管理者可進行進一步偵錯。 If the alarm system 230 provides an alarm, it means that the line between the test device 200 and the display panel 100 may be abnormal, and the administrator can perform further debugging.

第3圖為根據本案一實施例所繪示的測試系統10的示意圖。本實施例中的測試系統10中的部份元件與第2圖中的測試系統10中的元件相似,故重覆的部份在此不贅述。 FIG. 3 is a schematic diagram of a test system 10 according to an embodiment of the present invention. Some components in the test system 10 in this embodiment are similar to those in the test system 10 in FIG. 2, so the duplicated parts are not repeated here.

在本實施例中,測試電路120包括測試墊PR、測試墊PG、測試墊PB、測試墊PM、測試墊PD、測試墊PE、操作墊T1、操作墊T2、開關TR0、開關TR1、開關TR2及開關TR3。其中,測試墊PR、測試墊PG、測試墊PB、測試墊PM、測試墊PD、測試墊PE、開關TR1、開關TR2及開關TR3的相關細節大致可參照前述段落,故在此不贅述。 In this embodiment, the test circuit 120 includes a test pad PR, a test pad PG, a test pad PB, a test pad PM, a test pad PD, a test pad PE, an operation pad T1, an operation pad T2, a switch TR0, a switch TR1, and a switch TR2. And switch TR3. The details of the test pad PR, the test pad PG, the test pad PB, the test pad PM, the test pad PD, the test pad PE, the switch TR1, the switch TR2, and the switch TR3 can be generally referred to the foregoing paragraphs, and will not be repeated here.

在本實施例中,操作墊T1電性連接開關TR0的第一端及控制端。操作墊T2電性連接開關TR0的第二端及開關TR1-TR3的控制端。在本實施例中,操作墊T1透過開關TR0與操作墊T2,電性連接開關TR1-TR3的控制端。 In this embodiment, the operation pad T1 is electrically connected to the first end and the control end of the switch TR0. The operation pad T2 is electrically connected to the second terminal of the switch TR0 and the control terminals of the switches TR1-TR3. In this embodiment, the operation pad T1 is electrically connected to the control terminals of the switches TR1-TR3 through the switch TR0 and the operation pad T2.

在一些樣態中,第1圖中的測試墊P1可為第3圖中的測試墊PR、第1圖中的測試墊P2可為第3圖中的測試墊 PG、第1圖中的開關TR可為第3圖中的開關TR1、且第1圖中的操作墊PO的功能可類似於第3圖中的操作墊T1。 In some aspects, the test pad P1 in Fig. 1 may be the test pad PR in Fig. 3, the test pad P2 in Fig. 1 may be the test pad PG in Fig. 3, and the switch in Fig. 1 TR may be the switch TR1 in FIG. 3, and the function of the operation pad PO in FIG. 1 may be similar to that of the operation pad T1 in FIG. 3.

在另一些樣態中,第1圖中的測試墊P1可為第3圖中的測試墊PB、第1圖中的測試墊P2可為第3圖中的測試墊PM、第1圖中的開關TR可為第3圖中的開關TR2、且第1圖中的操作墊PO的功能可類似於第3圖中的操作墊T1。 In other aspects, the test pad P1 in Fig. 1 may be the test pad PB in Fig. 3, and the test pad P2 in Fig. 1 may be the test pad PM in Fig. 3, The switch TR may be the switch TR2 in FIG. 3, and the function of the operation pad PO in FIG. 1 may be similar to that of the operation pad T1 in FIG. 3.

在一些樣態中,第1圖中的測試墊P1可為第3圖中的測試墊PD、第1圖中的測試墊P2可為第3圖中的測試墊PE、第1圖中的開關TR可為第3圖中的開關TR3、且第1圖中的操作墊PO的功能可類似於第3圖中的操作墊T1。 In some aspects, the test pad P1 in Fig. 1 may be the test pad PD in Fig. 3, the test pad P2 in Fig. 1 may be the test pad PE in Fig. 3, and the switch in Fig. 1 TR may be the switch TR3 in FIG. 3, and the function of the operation pad PO in FIG. 1 may be similar to that of the operation pad T1 in FIG.

亦即,利用上述設置,測試裝置200即可藉由偵測測試墊PG、PM、PE上的電壓(即偵測測試電壓),並分別將偵測測試電壓與提供至測試墊PR、PB、PD的測試電壓進行比較,以快速判斷測試裝置200與顯示面板100的測試墊PR、PG、PB、PM、PD、PE間是否線路異常。 That is, with the above settings, the test device 200 can detect the voltages on the test pads PG, PM, and PE (that is, detect the test voltages), and respectively provide the detected test voltages and the test pads PR, PB, and The test voltages of the PDs are compared to quickly determine whether the line between the test device 200 and the test pads PR, PG, PB, PM, PD, and PE of the display panel 100 is abnormal.

在測試裝置200提供操作電壓(如高電壓準位)至操作墊T1,以導通開關TR0,並進一步導通開關TR1-TR3的情況下,當提供至測試墊PR的測試電壓(如高電壓準位)不同於自測試墊PG上偵測到的偵測測試電壓時、當提供至測試墊PB的測試電壓(如高電壓準位)不同於自測試墊PM上偵測到的偵測測試電壓時、或/及當提供至測試墊PD的測試電壓(如高電壓準位)不同於自測試墊PE上偵測到的偵測測試電壓時,測試裝置200判斷測試裝置200與顯示面板100的測試墊PR、PG、PB、PM、PD、PE間線路異常。相 對地,當提供至測試墊PR的測試電壓相同於自測試墊PG上偵測到的偵測測試電壓時、當提供至測試墊PB的測試電壓相同於自測試墊PM上偵測到的偵測測試電壓時、且當提供至測試墊PD的測試電壓相同於自測試墊PE上偵測到的偵測測試電壓時,測試裝置200判斷測試裝置200與顯示面板100的測試墊PR、PG、PB、PM、PD、PE間線路正常。 When the test device 200 provides an operating voltage (such as a high voltage level) to the operation pad T1 to turn on the switch TR0 and further turn on the switches TR1-TR3, when the test voltage (such as a high voltage level) is supplied to the test pad PR ) Is different from the detection test voltage detected on the self-test pad PG, when the test voltage (such as high voltage level) provided to the test pad PB is different from the detection test voltage detected on the self-test pad PM And / or when the test voltage (such as high voltage level) provided to the test pad PD is different from the detected test voltage detected on the test pad PE, the test device 200 judges the test of the test device 200 and the display panel 100 Pad PR, PG, PB, PM, PD, PE line abnormal. In contrast, when the test voltage supplied to the test pad PR is the same as the detection test voltage detected on the self-test pad PG, the test voltage supplied to the test pad PB is the same as the detection voltage detected on the self-test pad PM. When the test voltage is measured, and when the test voltage provided to the test pad PD is the same as the detected test voltage detected on the self-test pad PE, the test device 200 determines that the test device 200 and the test pads PR, PG, and The lines between PB, PM, PD, and PE are normal.

另一方面,利用上述設置,測試裝置200亦可藉由偵測操作墊T2上的電壓(下稱偵測操作電壓),並分別將偵測操作電壓與提供至操作墊T1上的操作電壓進行比較,以快速判斷測試裝置200與顯示面板100的操作墊T1、操作墊T2間是否線路異常。 On the other hand, with the above setting, the test device 200 can also detect the voltage on the operation pad T2 (hereinafter referred to as the detection operation voltage), and separately perform the detection operation voltage and the operation voltage provided on the operation pad T1. The comparison is performed to quickly determine whether the wiring between the test device 200 and the operation pad T1 and the operation pad T2 of the display panel 100 is abnormal.

例如,在測試裝置200提供操作電壓(如高電壓準位)至操作墊T1,以導通開關TR0的情況下,當在操作墊T2上偵測到的偵測操作電壓與提供至操作墊T1上的操作電壓不同時,測試裝置200判斷測試裝置200與顯示面板100的操作墊T1、操作墊T2間線路異常。當在操作墊T2上偵測到的偵測操作電壓與提供至操作墊T1上的操作電壓相同時,測試裝置200判斷測試裝置200與顯示面板100的操作墊T1、操作墊T2間線路正常。 For example, when the test device 200 provides an operation voltage (such as a high voltage level) to the operation pad T1 to turn on the switch TR0, the detection operation voltage detected on the operation pad T2 and the operation pad T1 are provided to the operation pad T1. When the operating voltages are different, the test device 200 determines that the line between the test device 200 and the operation pads T1 and T2 of the display panel 100 is abnormal. When the detected operation voltage detected on the operation pad T2 is the same as the operation voltage provided on the operation pad T1, the test device 200 determines that the wiring between the test device 200 and the operation pad T1 and the operation pad T2 of the display panel 100 is normal.

在本實施例中,電壓提供電路210可包括電壓提供子電路GT、電壓提供子電路GR、電壓提供子電路GB、電壓提供子電路GD。在本實施例中,反饋比較電路220包括比較器222、比較器224、比較器226及比較器228。其中,電壓提供子電路GR、電壓提供子電路GB、電壓提供子電路 GD、比較器222、比較器224及比較器226的相關細節大致可參照前述段落,故在此不贅述。 In this embodiment, the voltage supply circuit 210 may include a voltage supply sub-circuit GT, a voltage supply sub-circuit GR, a voltage supply sub-circuit GB, and a voltage supply sub-circuit GD. In this embodiment, the feedback comparison circuit 220 includes a comparator 222, a comparator 224, a comparator 226, and a comparator 228. The details of the voltage supply sub-circuit GR, the voltage supply sub-circuit GB, the voltage supply sub-circuit GD, the comparator 222, the comparator 224, and the comparator 226 can be referred to the foregoing paragraphs, so they will not be repeated here.

在本實施例中,電壓提供子電路GT用以產生並提供操作電壓至操作墊T1及比較器228。在本實施例中,比較器228用以接收來自電壓提供子電路GT的操作電壓,偵測操作墊T2上的偵測操作電壓,並比較來自電壓提供子電路GT的操作電壓及在操作墊T2上偵測到的偵測操作電壓。而後,比較器228根據比較結果,產生並提供比較訊號CMP4至警報系統230。在一實施例中,電壓提供子電路GT及比較器228例如是分別透過排針接觸操作墊T1、T2而分別與操作墊T1、T2電性連接,然本案不以此為限。 In this embodiment, the voltage supply sub-circuit GT is used to generate and provide an operation voltage to the operation pad T1 and the comparator 228. In this embodiment, the comparator 228 is used to receive the operation voltage from the voltage supply sub-circuit GT, detect the detection operation voltage on the operation pad T2, and compare the operation voltage from the voltage supply sub-circuit GT and the operation pad T2. Detected operating voltage. Then, the comparator 228 generates and provides a comparison signal CMP4 to the alarm system 230 according to the comparison result. In one embodiment, the voltage supply sub-circuit GT and the comparator 228 are respectively electrically connected to the operation pads T1 and T2 through the contact pins of the operation pads T1 and T2, but the present invention is not limited thereto.

在本實施例中,警報系統230根據比較訊號CMP1、CMP2、CMP3提供第一警報(如亮紅燈)。在一實施例中,警報系統230可在來自電壓提供子電路GR的測試電壓及在測試墊PG上偵測到的偵測測試電壓不同的情況下、來自電壓提供子電路GB的測試電壓及在測試墊PM上偵測到的偵測測試電壓不同的情況下、或/及來自電壓提供子電路GD的測試電壓及在測試墊PE上偵測到的偵測測試電壓不同的情況下,提供第一警報。 In this embodiment, the alarm system 230 provides a first alarm (such as a bright red light) based on the comparison signals CMP1, CMP2, and CMP3. In an embodiment, the alarm system 230 may detect the test voltage from the voltage supply sub-circuit GB and the test voltage when the test voltage from the voltage supply sub-circuit GR and the detected test voltage detected on the test pad PG are different. In the case where the detection test voltage detected on the test pad PM is different, or when the test voltage from the voltage supply sub-circuit GD and the detection test voltage detected on the test pad PE are different, the first An alert.

此外,在本實施例中,警報系統230根據比較訊號CMP4提供第二警報(如亮黃燈)。在一實施例中,警報系統230可在來自電壓提供子電路GT的操作電壓及在操作墊T2上偵測到的偵測操作電壓不同的情況下提供第二警報,第二警報不同於第一警報。 In addition, in this embodiment, the alarm system 230 provides a second alarm (such as a bright yellow light) according to the comparison signal CMP4. In one embodiment, the alarm system 230 may provide a second alarm when the operating voltage from the voltage supply sub-circuit GT and the detected operating voltage detected on the operation pad T2 are different. The second alarm is different from the first alarm alarm.

藉由第一警報及第二警報,即可快速判斷測試裝置200與操作墊T1、T2間線路是否異常、及測試裝置200與測試墊PR、PG、PB、PM、PD、PE間線路是否異常。 With the first and second alarms, it is possible to quickly determine whether the line between the test device 200 and the operation pads T1 and T2 is abnormal, and whether the line between the test device 200 and the test pads PR, PG, PB, PM, PD, and PE is abnormal. .

下表為一實施例中第一警報及第二警報與測試裝置200與操作墊T1、T2間線路(下稱測試線路)是否異常、及測試裝置200與測試墊PR、PG、PB、PM、PD、PE間線路(下稱數據線路)是否異常的關係。 The following table shows whether the line between the first alarm and the second alarm and test device 200 and the operation pads T1 and T2 (hereinafter referred to as test lines) is abnormal, and the test device 200 and the test pads PR, PG, PB, PM, Whether the line between PD and PE (hereinafter referred to as the data line) is abnormal.

如上所示,在警報系統230沒有提供第一警報及第二警報的情況下,代表數據線路與測試線路皆正常。在警報系統230沒有提供第一警報,而提供第二警報的情況下,代表數據線路正常且測試線路異常。在警報系統230提供第一警報,而沒有提供第二警報的情況下,代表數據線路異常,且測試線路正常。在警報系統230提供第一警報及第二警報的情況下,代表測試線路異常。在此情況下,可能因操作墊T2未接收到來自操作墊T1的操作電壓,而使開關TR1-TR3無法導通,導致警報系統230提供第一警報,故數據線路的正常與否仍待確認。 As shown above, when the alarm system 230 does not provide the first alarm and the second alarm, the representative data line and the test line are normal. When the alarm system 230 does not provide the first alarm and provides the second alarm, it means that the data line is normal and the test line is abnormal. In the case where the alarm system 230 provides the first alarm without providing the second alarm, it means that the data line is abnormal and the test line is normal. When the alarm system 230 provides the first alarm and the second alarm, it means that the test line is abnormal. In this case, because the operation pad T2 does not receive the operation voltage from the operation pad T1, the switches TR1-TR3 cannot be turned on, which causes the alarm system 230 to provide a first alarm, so the normality of the data line remains to be confirmed.

在本案一實施例中,在進行顯示面板100的功能測試(如點亮測試)前,測試裝置200可先提供操作電壓(如提供高電壓位準)至操作墊T1,以進行是否線路異常的測試。 In an embodiment of the present case, before performing a functional test (such as a lighting test) of the display panel 100, the test device 200 may first provide an operating voltage (such as providing a high voltage level) to the operating pad T1 to determine whether the line is abnormal. test.

若警報系統230未提供第一警報也未提供第二警報,則代表測試裝置200與顯示面板100間線路正常,則測試裝置200停止提供操作電壓(如改為提供低電壓位準)至操作墊T1,以關閉開關TR0-TR3,並進行顯示面板100的功能測試(如點亮測試)。 If the alarm system 230 does not provide the first alarm or the second alarm, it means that the line between the test device 200 and the display panel 100 is normal, and the test device 200 stops supplying the operating voltage (such as providing a low voltage level) to the operating pad. T1 to turn off the switches TR0-TR3 and perform a function test (such as a lighting test) of the display panel 100.

若警報系統230提供第一警報或第二警報,則代表測試裝置200與顯示面板100間可能線路異常,則管理者可進行進一步偵錯。 If the alarm system 230 provides the first alarm or the second alarm, it means that the line between the test device 200 and the display panel 100 may be abnormal, and the administrator can perform further debugging.

第4圖為根據本案一實施例所繪示的測試系統10的示意圖。本實施例中的測試系統10中的部份元件與第2圖中的測試系統10中的元件相似,故重覆的部份在此不贅述。 FIG. 4 is a schematic diagram of a test system 10 according to an embodiment of the present invention. Some components in the test system 10 in this embodiment are similar to those in the test system 10 in FIG. 2, so the duplicated parts are not repeated here.

在本實施例中,測試電路120包括測試墊PR、測試墊PG、測試墊PB、測試墊PM、操作墊PO1、操作墊PO2、開關TR1、開關TR2、開關OT1及開關OT2。其中,測試墊PR、測試墊PG、測試墊PB、測試墊PM、開關TR1及開關TR2的相關細節大致可參照前述段落,故在此不贅述。 In this embodiment, the test circuit 120 includes a test pad PR, a test pad PG, a test pad PB, a test pad PM, an operation pad PO1, an operation pad PO2, a switch TR1, a switch TR2, a switch OT1, and a switch OT2. The details of the test pad PR, the test pad PG, the test pad PB, the test pad PM, the switch TR1, and the switch TR2 can be generally referred to the foregoing paragraphs, and will not be repeated here.

在本實施例中,開關OT1的第一端電性連接開關TR1的控制端、開關TR2的控制端及開關OT2的第二端。開關OT1的第二端電性連接操作墊PO2及開關OT2的控制 端。開關OT1的控制端電性連接操作墊PO1及開關OT2的第一端。開關OT2的第一端電性連接操作墊PO1及開關OT1的控制端。開關OT2的第二端電性連接開關OT1的第一端、開關TR1的控制端及開關TR2的控制端。開關OT2的控制端電性連接操作墊PO2及開關OT1的第二端。在本實施例中,操作墊PO1電性連接奇數列閘極線GL(如第一、第三列閘極線GL)。在本實施例中,操作墊PO2電性連接偶數列閘極線GL(如第二列閘極線GL)。 In this embodiment, the first terminal of the switch OT1 is electrically connected to the control terminal of the switch TR1, the control terminal of the switch TR2, and the second terminal of the switch OT2. The second terminal of the switch OT1 is electrically connected to the operation pad PO2 and the control terminal of the switch OT2. The control terminal of the switch OT1 is electrically connected to the operation pad PO1 and the first terminal of the switch OT2. The first terminal of the switch OT2 is electrically connected to the operation pad PO1 and the control terminal of the switch OT1. The second terminal of the switch OT2 is electrically connected to the first terminal of the switch OT1, the control terminal of the switch TR1, and the control terminal of the switch TR2. The control terminal of the switch OT2 is electrically connected to the operation pad PO2 and the second terminal of the switch OT1. In this embodiment, the operation pad PO1 is electrically connected to the odd-numbered column gate lines GL (such as the first and third column gate lines GL). In this embodiment, the operation pad PO2 is electrically connected to the even-numbered gate lines GL (such as the second-row gate lines GL).

在本實施例中,操作墊PO1可透過開關OT2電性連接開關TR1的控制端及開關TR2的控制端。在本實施例中,操作墊PO2可透過開關OT1電性連接開關TR1的控制端及開關TR2的控制端。 In this embodiment, the operation pad PO1 can be electrically connected to the control terminal of the switch TR1 and the control terminal of the switch TR2 through the switch OT2. In this embodiment, the operation pad PO2 can be electrically connected to the control terminal of the switch TR1 and the control terminal of the switch TR2 through the switch OT1.

在一些樣態中,第1圖中的測試墊P1可為第4圖中的測試墊PR、第1圖中的測試墊P2可為第4圖中的測試墊PG、第1圖中的開關TR可為第4圖中的開關TR1、且第1圖中的操作墊PO的功能可類似於第4圖中的操作墊PO1。 In some aspects, the test pad P1 in FIG. 1 may be the test pad PR in FIG. 4, the test pad P2 in FIG. 1 may be the test pad PG in FIG. 4, and the switch in FIG. 1. TR may be the switch TR1 in FIG. 4, and the function of the operation pad PO in FIG. 1 may be similar to that of the operation pad PO1 in FIG. 4.

在另一些樣態中,第1圖中的測試墊P1可為第4圖中的測試墊PB、第1圖中的測試墊P2可為第4圖中的測試墊PM、第1圖中的開關TR可為第4圖中的開關TR2、且第1圖中的操作墊PO的功能可類似於第4圖中的操作墊PO1。 In other aspects, the test pad P1 in FIG. 1 may be the test pad PB in FIG. 4, and the test pad P2 in FIG. 1 may be the test pad PM in FIG. 4 and the test pad P1 in FIG. 1. The switch TR may be the switch TR2 in FIG. 4, and the function of the operation pad PO in FIG. 1 may be similar to that of the operation pad PO1 in FIG. 4.

利用上述設置,測試裝置200即可藉由偵測測試墊PG、PM上的電壓(即偵測測試電壓),並分別將偵測測試電壓與提供至測試墊PR、PB的測試電壓進行比較,以快速判斷測試裝置200與顯示面板100間是否線路異常。 With the above settings, the test device 200 can detect the voltages on the test pads PG and PM (that is, detect the test voltages) and compare the detected test voltages with the test voltages provided to the test pads PR and PB, respectively. To quickly determine whether the line between the test device 200 and the display panel 100 is abnormal.

在測試裝置200提供操作電壓(如高電壓準位)至操作墊PO1及操作墊PO2,以導通開關OT1及OT2,並進一步導通開關TR1、TR2的情況下,當提供至測試墊PR的測試電壓(如高電壓準位)不同於自測試墊PG上偵測到的偵測測試電壓時、或/及當提供至測試墊PB的測試電壓(如高電壓準位)不同於自測試墊PM上偵測到的偵測測試電壓時,測試裝置200判斷測試裝置200與顯示面板100間線路異常。當提供至測試墊PR的測試電壓相同於自測試墊PG上偵測到的偵測測試電壓時、且當提供至測試墊PB的測試電壓相同於自測試墊PM上偵測到的偵測測試電壓時,測試裝置200判斷測試裝置200與顯示面板100間線路正常。 When the test device 200 provides an operating voltage (such as a high voltage level) to the operating pads PO1 and PO2 to turn on the switches OT1 and OT2 and further turn on the switches TR1 and TR2, the test voltage provided to the testing pad PR is provided. (E.g. high voltage level) is different from the detected test voltage detected on the self-test pad PG, or / and when the test voltage (e.g. high-voltage level) provided to the test pad PB is different from the self-test pad PM When the detected test voltage is detected, the test device 200 determines that the line between the test device 200 and the display panel 100 is abnormal. When the test voltage supplied to the test pad PR is the same as the detection test voltage detected on the self-test pad PG, and when the test voltage supplied to the test pad PB is the same as the detection test detected on the self-test pad PM When the voltage is applied, the test device 200 determines that the line between the test device 200 and the display panel 100 is normal.

另一方面,在測試裝置200提供操作電壓(如高電壓準位)至操作墊PO1及操作墊PO2中的至少一者失敗(如因接觸不良或操作電壓異常等等而失敗)時,開關OT1及OT2中的至少一者關閉,導致開關TR1-TR2關閉。如此一來,提供至測試墊PR的測試電壓(如高電壓準位)將不同於自測試墊PG上偵測到的偵測測試電壓(如低電壓準位)、且/或提供至測試墊PB的測試電壓(如高電壓準位)不同於自測試墊PM上偵測到的偵測測試電壓(如低電壓準位),故測試裝置200可判斷測試裝置200與顯示面板100間線路異常。 On the other hand, when the test device 200 fails to provide at least one of the operation pad PO1 and the operation pad PO2 with the operation voltage (such as a high voltage level) (such as failure due to poor contact or abnormal operation voltage, etc.), the switch OT1 is switched. And at least one of OT2 is turned off, which causes switches TR1-TR2 to turn off. As a result, the test voltage (e.g., high voltage level) provided to the test pad PR will be different from the detection test voltage (e.g., low voltage level) detected on the test pad PG, and / or provided to the test pad The test voltage of the PB (such as a high voltage level) is different from the detection test voltage (such as a low voltage level) detected on the self-test pad PM, so the test device 200 can determine that the line between the test device 200 and the display panel 100 is abnormal. .

在本實施例中,電壓提供電路210可包括電壓提供子電路GR、電壓提供子電路GB、電壓提供子電路GO1、電壓提供子電路GO2。在本實施例中,反饋比較電路220包括比較器222及比較器224。其中,電壓提供子電 路GR、電壓提供子電路GB、比較器222及比較器224的相關細節大致可參照前述段落,故在此不贅述。 In this embodiment, the voltage supply circuit 210 may include a voltage supply sub-circuit GR, a voltage supply sub-circuit GB, a voltage supply sub-circuit GO1, and a voltage supply sub-circuit GO2. In this embodiment, the feedback comparison circuit 220 includes a comparator 222 and a comparator 224. The details of the voltage supply sub-circuit GR, the voltage supply sub-circuit GB, the comparator 222, and the comparator 224 can be referred to the foregoing paragraphs, so they will not be repeated here.

在本實施例中,電壓提供子電路GO1用以產生並提供操作電壓至操作墊PO1。在本實施例中,電壓提供子電路GO2用以產生並提供操作電壓至操作墊PO2。在一實施例中,電壓提供子電路GO1及電壓提供子電路GO2例如是分別透過排針接觸操作墊PO1及操作墊PO2而分別與其電性連接,然本案不以此為限。 In this embodiment, the voltage supply sub-circuit GO1 is used to generate and provide an operation voltage to the operation pad PO1. In this embodiment, the voltage providing sub-circuit GO2 is used to generate and provide an operating voltage to the operating pad PO2. In one embodiment, the voltage supply sub-circuit GO1 and the voltage supply sub-circuit GO2 are respectively electrically connected to the operation pad PO1 and the operation pad PO2 through a pin contact, but the present invention is not limited thereto.

在本實施例中,警報系統230根據比較訊號CMP1、CMP2提供警報(如亮紅燈)。在一實施例中,警報系統230可在來自電壓提供子電路GR的測試電壓及在測試墊PG上偵測到的偵測測試電壓不同的情況下、或/及來自電壓提供子電路GB的測試電壓及在測試墊PM上偵測到的偵測測試電壓不同的情況下,提供警報。 In this embodiment, the alarm system 230 provides an alarm (such as a bright red light) based on the comparison signals CMP1 and CMP2. In one embodiment, the alarm system 230 may detect the test voltage from the voltage supply sub-circuit GR and the detection test voltage detected on the test pad PG in different situations, or / and the test from the voltage supply sub-circuit GB. Provides an alarm when the voltage and the detected test voltage detected on the test pad PM are different.

藉此,即可快速判斷測試裝置200與顯示面板100間是否線路異常。 Thereby, it can be quickly judged whether the line between the test device 200 and the display panel 100 is abnormal.

請同時參照第4圖及第5圖,在本實施例中,在進行顯示面板100的功能測試(如點亮測試)前(如期間PRD1),電壓提供子電路GO1與電壓提供子電路GO2可同時提供操作電壓(如具高電壓位準VGH)至操作墊PO1及操作墊PO2,以進行線路是否異常的測試。 Please refer to FIG. 4 and FIG. 5 at the same time. In this embodiment, before performing a functional test (such as a lighting test) of the display panel 100 (such as a period PRD1), the voltage supply sub-circuit GO1 and the voltage supply sub-circuit GO2 may be At the same time, provide the operating voltage (such as with a high voltage level VGH) to the operating pads PO1 and PO2 to test whether the line is abnormal.

若警報系統230提供警報,則代表測試裝置200與顯示面板100間可能線路異常,則管理者可進行進一步偵錯。 If the alarm system 230 provides an alarm, it means that the line between the test device 200 and the display panel 100 may be abnormal, and the administrator can perform further debugging.

若警報系統230未提供警報,則代表測試裝置200與顯示面板100間線路正常,故測試裝置200可進行顯示面板100的功能測試(如點亮測試)。在功能測試(如點亮測試)過程中(如期間PRD2),電壓提供子電路GO1與電壓提供子電路GO2可分別提供彼此反相的功能測試電壓至操作墊PO1及操作墊PO2。例如,當電壓提供子電路GO1提供高電壓位準VGH的功能測試電壓至操作墊PO1時,電壓提供子電路GO2提供低電壓位準VGL的功能測試電壓至操作墊PO2,反之可類推。此時,由於開關OT1、OT2中的一者接收具低電壓位準VGL的功能測試電壓而關閉,故具高電壓位準VGH的功能測試電壓無法提供至開關TR1、TR2的控制端,而使開關TR1、TR2關閉。 If the alarm system 230 does not provide an alarm, it means that the line between the test device 200 and the display panel 100 is normal, so the test device 200 can perform a function test (such as a lighting test) of the display panel 100. During the function test (such as the lighting test) (such as during the period PRD2), the voltage supply sub-circuit GO1 and the voltage supply sub-circuit GO2 can respectively provide function test voltages that are opposite to each other to the operation pads PO1 and PO2. For example, when the voltage supply sub-circuit GO1 provides a function test voltage of a high voltage level VGH to the operation pad PO1, the voltage supply sub-circuit GO2 provides a function test voltage of a low voltage level VGL to the operation pad PO2, and vice versa. At this time, since one of the switches OT1 and OT2 receives the function test voltage with a low voltage level VGL and is turned off, the function test voltage with a high voltage level VGH cannot be provided to the control terminals of the switches TR1 and TR2, so that The switches TR1 and TR2 are closed.

藉由上述的設置,即可在不額外設置接觸墊(如第1、2圖中操作墊PO及第3圖中操作墊T1、T2)的情況下進行測試裝置200與顯示面板100間的線路異常測試。 With the above settings, the wiring between the test device 200 and the display panel 100 can be performed without additional contact pads (such as the operation pads PO in FIGS. 1 and 2 and the operation pads T1 and T2 in FIG. 3). Exception test.

第6圖為根據本發明一實施例所繪示的測試方法300的流程圖。 FIG. 6 is a flowchart of a test method 300 according to an embodiment of the present invention.

應注意到,測試方法300可應用於相同或相似於前述實施例中所示結構之測試裝置。而為使敘述簡單,以下將根據本發明一實施例,以第1圖中的測試裝置200為例進行對測試方法300敘述,然本發明不以此應用為限。 It should be noted that the test method 300 can be applied to a test device having the same or similar structure as that shown in the foregoing embodiment. In order to make the description simple, the test method 300 will be described below by taking the test device 200 in FIG. 1 as an example according to an embodiment of the present invention, but the present invention is not limited to this application.

另外,應瞭解到,在本實施方式中所提及的測試方法300的操作,除特別敘明其順序者外,均可依實際需要調整其前後順序,甚至可同時或部分同時執行。 In addition, it should be understood that the operations of the test method 300 mentioned in this embodiment can be adjusted according to actual needs, except for those specifically described in order, and can even be performed simultaneously or partially simultaneously.

再者,在不同實施例中,此些操作亦可適應性地增加、置換、及/或省略。 Moreover, in different embodiments, these operations may be adaptively added, replaced, and / or omitted.

在本實施例中,測試方法300包括以下操作。 In this embodiment, the test method 300 includes the following operations.

在操作S1中,測試裝置200提供測試電壓至顯示面板100的測試墊P1。在一實施例中,測試墊P1透過開關TR電性連接測試墊P2。 In operation S1, the test apparatus 200 provides a test voltage to the test pad P1 of the display panel 100. In one embodiment, the test pad P1 is electrically connected to the test pad P2 through the switch TR.

在操作S2中,測試裝置200偵測測試墊P2上的偵測測試電壓。 In operation S2, the test device 200 detects a detection test voltage on the test pad P2.

在操作S3中,測試裝置200比較測試電壓與偵測測試電壓。 In operation S3, the test device 200 compares the test voltage with the detected test voltage.

在操作S4中,在測試電壓及偵測測試電壓不同的情況下,測試裝置200提供警報。 In operation S4, when the test voltage and the detected test voltage are different, the test device 200 provides an alarm.

應注意到,上述操作的具體細節皆可參照前述段落,故在此不贅述。 It should be noted that the specific details of the above operations can refer to the foregoing paragraphs, so they will not be repeated here.

藉由上述的操作,即可快速判斷測試裝置200與顯示面板100間是否線路異常。 Through the above operations, it is possible to quickly determine whether the line between the test device 200 and the display panel 100 is abnormal.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above by way of example, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the attached patent application.

Claims (12)

一種顯示面板,包括:一主動區;及一測試電路,電性連接該主動區,該測試電路包括:一第一主開關;一第一測試墊,電性連接該第一主開關的一第一端且電性連接於該主動區以及該第一主開關之間;一第二測試墊,電性連接該第一主開關的一第二端且電性連接於該主動區以及該第一主開關之間;以及一第一操作墊,電性連接該第一主開關的一控制端。A display panel includes: an active area; and a test circuit electrically connected to the active area. The test circuit includes: a first main switch; a first test pad electrically connected to a first main switch; One end is electrically connected between the active area and the first main switch; a second test pad is electrically connected to a second end of the first main switch and electrically connected to the active area and the first Between the main switches; and a first operation pad, which is electrically connected to a control terminal of the first main switch. 如請求項1所述之顯示面板,其中該測試電路更包括:一第二主開關,其中該第二主開關的一控制端電性連接該第一操作墊;一第三測試墊,電性連接該第二主開關的一第一端;以及一第四測試墊,電性連接該第二主開關的一第二端。The display panel according to claim 1, wherein the test circuit further includes: a second main switch, wherein a control terminal of the second main switch is electrically connected to the first operation pad; a third test pad, electrically A first end of the second main switch is connected; and a fourth test pad is electrically connected to a second end of the second main switch. 如請求項2所述之顯示面板,其中該測試電路更包括:一操作主開關,其中該操作主開關的一第一端及一控制端電性連接該第一操作墊;以及一第二操作墊,電性連接該操作主開關的一第二端、該第一主開關的該控制端及該第二主開關的該控制端,其中一操作電壓係被提供至該第一操作墊以導通該操作主開關並進一步導通該第一主開關以及該第二主開關,其中該第一操作墊透過該操作主開關與該第二操作墊電性連接該第一主開關的該控制端及該第二主開關的該控制端。The display panel according to claim 2, wherein the test circuit further includes: an operation main switch, wherein a first end and a control end of the operation main switch are electrically connected to the first operation pad; and a second operation Pad, which is electrically connected to a second end of the operation main switch, the control end of the first main switch and the control end of the second main switch, wherein an operation voltage is provided to the first operation pad to be turned on The operation main switch further turns on the first main switch and the second main switch, wherein the first operation pad is electrically connected with the control end of the first main switch and the second operation pad through the operation main switch and the second operation pad. The control terminal of the second main switch. 如請求項2所述之顯示面板,其中該測試電路更包括:一第一操作開關,其中該第一操作開關的一第一端電性連接該第一主開關的該控制端及該第二主開關的該控制端,且該第一操作開關的一控制端電性連接該第一操作墊;一第二操作墊,電性連接該第一操作開關的一第二端;以及一第二操作開關,其中該第二操作開關的一第一端電性連接該第一操作開關的該控制端,該第二操作開關的一第二端電性連接該第一主開關的該控制端及該第二主開關的該控制端,且該第二操作開關的一控制端電性連接該第一操作開關的該第二端以及該第二操作墊。The display panel according to claim 2, wherein the test circuit further includes: a first operation switch, wherein a first terminal of the first operation switch is electrically connected to the control terminal and the second terminal of the first main switch. The control end of the main switch, and a control end of the first operation switch is electrically connected to the first operation pad; a second operation pad is electrically connected to a second end of the first operation switch; and a second An operation switch, wherein a first terminal of the second operation switch is electrically connected to the control terminal of the first operation switch, and a second terminal of the second operation switch is electrically connected to the control terminal of the first main switch and The control terminal of the second main switch, and a control terminal of the second operation switch is electrically connected to the second terminal of the first operation switch and the second operation pad. 一種測試裝置,包括:一電壓提供電路,用以提供一測試電壓至一顯示面板的一第一測試墊,其中該第一測試墊透過一第一主開關電性連接一第二測試墊,其中該第一測試墊電性連接於該顯示面板的一主動區以及該第一主開關之間,該第二測試墊電性連接於該主動區以及該第一主開關之間;一反饋比較電路,電性連接該電壓提供電路,用以接收來自該電壓提供電路的該測試電壓,偵測該第二測試墊上的一偵測測試電壓,並比較該測試電壓與該偵測測試電壓;以及一警報系統,電性連接該反饋比較電路,用以在該測試電壓及該偵測測試電壓不同的情況下,提供一第一警報。A test device includes: a voltage supply circuit for providing a test voltage to a first test pad of a display panel, wherein the first test pad is electrically connected to a second test pad through a first main switch, wherein The first test pad is electrically connected between an active area of the display panel and the first main switch, and the second test pad is electrically connected between the active area and the first main switch; a feedback comparison circuit Electrically connected to the voltage supply circuit for receiving the test voltage from the voltage supply circuit, detecting a detection test voltage on the second test pad, and comparing the test voltage with the detection test voltage; and The alarm system is electrically connected to the feedback comparison circuit for providing a first alarm when the test voltage and the detected test voltage are different. 如請求項5所述之測試裝置,其中該電壓提供電路更用以提供一操作電壓至該顯示面板的一第一操作墊,其中該第一操作墊電性連接該第一主開關的一控制端。The test device according to claim 5, wherein the voltage supply circuit is further configured to provide an operating voltage to a first operation pad of the display panel, wherein the first operation pad is electrically connected to a control of the first main switch. end. 如請求項6所述之測試裝置,其中該第一操作墊透過一操作主開關電性連接一第二操作墊,且該反饋比較電路更用以接收來自該電壓提供電路的該操作電壓,偵測該第二操作墊上的一偵測操作電壓,並比較該操作電壓與該偵測操作電壓,且其中在該操作電壓及該偵測操作電壓不同的情況下,提供一第二警報,該第二警報不同於該第一警報。The test device according to claim 6, wherein the first operation pad is electrically connected to a second operation pad through an operation main switch, and the feedback comparison circuit is further configured to receive the operation voltage from the voltage supply circuit, and detect Measuring a detection operation voltage on the second operation pad, and comparing the operation voltage with the detection operation voltage, and in the case where the operation voltage and the detection operation voltage are different, a second alarm is provided, the first The second alarm is different from the first alarm. 如請求項6所述之測試裝置,其中該電壓提供電路更用以分別提供一第一操作電壓及一第二操作電壓至該顯示面板的一第一操作墊及一第二操作墊,其中該第一操作墊及該第二操作墊分別透過一第一操作開關及一第二操作開關,電性連接至該第一主開關的一控制端,且其中在該第一操作電壓及該第二操作電壓皆具一第一電壓準位時,該第一主開關係被導通。The test device according to claim 6, wherein the voltage supply circuit is further configured to provide a first operation voltage and a second operation voltage to a first operation pad and a second operation pad of the display panel, respectively, wherein The first operation pad and the second operation pad are electrically connected to a control terminal of the first main switch through a first operation switch and a second operation switch, respectively, and wherein the first operation voltage and the second operation switch are When the operating voltages have a first voltage level, the first main-on relationship is turned on. 一種測試方法,包括:提供一測試電壓至一顯示面板的一第一測試墊,其中該第一測試墊透過一第一主開關電性連接一第二測試墊,其中該第一測試墊電性連接於該顯示面板的一主動區以及該第一主開關之間,該第二測試墊電性連接於該主動區以及該第一主開關之間;偵測該第二測試墊上的一偵測測試電壓;比較該測試電壓與該偵測測試電壓;以及在該測試電壓及該偵測測試電壓不同的情況下,提供一第一警報。A test method includes: providing a test voltage to a first test pad of a display panel, wherein the first test pad is electrically connected to a second test pad through a first main switch, and the first test pad is electrically Connected between an active area of the display panel and the first main switch, and the second test pad is electrically connected between the active area and the first main switch; detecting a detection on the second test pad Test voltage; comparing the test voltage with the detection test voltage; and providing a first alarm if the test voltage and the detection test voltage are different. 如請求項9所述之測試方法,更包括:提供一操作電壓至該顯示面板的一第一操作墊,以導通該第一主開關,其中該第一操作墊電性連接該第一主開關的一控制端。The test method according to claim 9, further comprising: providing an operating voltage to a first operation pad of the display panel to turn on the first main switch, wherein the first operation pad is electrically connected to the first main switch. A control side. 如請求項10所述之測試方法,其中該第一操作墊透過一操作主開關電性連接一第二操作墊,該測試方法更包括:偵測該第二操作墊上的一偵測操作電壓,並比較該操作電壓與該偵測操作電壓;以及在該操作電壓及該偵測操作電壓不同的情況下,提供一第二警報。The test method according to claim 10, wherein the first operation pad is electrically connected to a second operation pad through an operation main switch, and the test method further includes: detecting a detection operation voltage on the second operation pad, And comparing the operation voltage with the detection operation voltage; and providing a second alarm if the operation voltage and the detection operation voltage are different. 如請求項9所述之測試方法,更包括:分別提供一第一操作電壓及一第二操作電壓至該顯示面板的一第一操作墊及一第二操作墊;其中該第一操作墊及該第二操作墊分別透過一第一操作開關及一第二操作開關,電性連接至該第一主開關的一控制端,且其中在該第一操作電壓及該第二操作電壓皆具一第一電壓準位時,該第一主開關導通。The test method according to claim 9, further comprising: providing a first operation voltage and a second operation voltage to a first operation pad and a second operation pad of the display panel, respectively; wherein the first operation pad and The second operation pad is electrically connected to a control terminal of the first main switch through a first operation switch and a second operation switch, respectively, and the first operation voltage and the second operation voltage both have a When the first voltage level is reached, the first main switch is turned on.
TW107118547A 2017-05-31 2018-05-30 Display panel, testing device and testing method TWI668456B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??201710399519.5 2017-05-31
CN201710399519.5A CN106970296B (en) 2017-05-31 2017-05-31 Display panel, test device and test method

Publications (2)

Publication Number Publication Date
TW201903421A TW201903421A (en) 2019-01-16
TWI668456B true TWI668456B (en) 2019-08-11

Family

ID=59326569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107118547A TWI668456B (en) 2017-05-31 2018-05-30 Display panel, testing device and testing method

Country Status (2)

Country Link
CN (1) CN106970296B (en)
TW (1) TWI668456B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101303462A (en) * 2008-07-04 2008-11-12 友达光电股份有限公司 Liquid crystal display panel testing circuit and method
CN101334544A (en) * 2007-06-28 2008-12-31 三星电子株式会社 Display apparatus, method of driving the same, and sensing driver of display apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101299315B (en) * 2008-07-04 2010-10-13 友达光电(苏州)有限公司 Test system for display panel
TWI400442B (en) * 2008-09-01 2013-07-01 Innolux Corp A detection method for a detection device and a panel
CN101441339A (en) * 2008-12-18 2009-05-27 友达光电股份有限公司 LCD module and method for measuring contact electric impedance between circuit boards therein
CN101847357A (en) * 2009-03-23 2010-09-29 友达光电股份有限公司 Display panel, display device and test method thereof
JP5535707B2 (en) * 2010-03-19 2014-07-02 株式会社ジャパンディスプレイ Display device and display device connection status inspection method
TWI480655B (en) * 2011-04-14 2015-04-11 Au Optronics Corp Display panel and testing method thereof
TWI435093B (en) * 2012-08-23 2014-04-21 Au Optronics Corp Detection circuit of display panel
CN103559856B (en) * 2013-10-17 2016-03-30 友达光电(厦门)有限公司 The recognition system of the factory source of display panel and display panel and method
TWI540323B (en) * 2014-09-16 2016-07-01 友達光電股份有限公司 Test cell structure of display panel and related display panel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101334544A (en) * 2007-06-28 2008-12-31 三星电子株式会社 Display apparatus, method of driving the same, and sensing driver of display apparatus
CN101303462A (en) * 2008-07-04 2008-11-12 友达光电股份有限公司 Liquid crystal display panel testing circuit and method

Also Published As

Publication number Publication date
TW201903421A (en) 2019-01-16
CN106970296B (en) 2019-07-19
CN106970296A (en) 2017-07-21

Similar Documents

Publication Publication Date Title
US10670629B2 (en) Display substrate, light-on device and method for testing alignment of light-on testing pin
US20160103172A1 (en) Circuit board testing apparatus and circuit board testing method
TWI435093B (en) Detection circuit of display panel
US10818208B2 (en) Source driver
JP2008002823A (en) Substrate inspecting device and substrate inspection method
TW201527770A (en) Detection device for detedting electronic components and detection method thereof
KR20200021570A (en) Wiring-disconnection detecting circuit and organic light emitting display device including the same
JP2008256632A (en) Testing method and ic tester of semiconductor integrated circuit
CN202119854U (en) Pin welding state detection apparatus
US9442151B2 (en) Methods, systems, and computer readable media for detecting electrical disconnection between integrated circuit chip electrical connections and corresponding electrical contacts on a printed circuit board or chip socket during testing of the chip under environmental conditions
KR102544983B1 (en) Test system and test controller
TWI668456B (en) Display panel, testing device and testing method
KR102168688B1 (en) Driver integrated circuit chip and display device having the same
US20100145672A1 (en) Microcomputer and embedded software development system
CN210465609U (en) Chip testing system
JP2013024724A (en) Circuit board inspection device and circuit board inspection method
US7030794B2 (en) System, method, and software for testing electrical devices
JP4417762B2 (en) Circuit wiring inspection method and apparatus
KR101474740B1 (en) Device for testing connection between PC card and printed cricuit board
TW202018509A (en) Sas connector conduction detection system and method thereof
JP2001165986A (en) Cable inspecting apparatus
TWI673506B (en) Relay test device
JP4876026B2 (en) Board inspection equipment
JPH09211076A (en) Circuit-board inspecting apparatus and semiconductor circuit
CN109143113B (en) Method, device and system for monitoring power supply of PCIE external plug-in card