TWI668078B - 用於選擇研磨參數以產生移除輪廓的電腦程式產品 - Google Patents

用於選擇研磨參數以產生移除輪廓的電腦程式產品 Download PDF

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Publication number
TWI668078B
TWI668078B TW106120666A TW106120666A TWI668078B TW I668078 B TWI668078 B TW I668078B TW 106120666 A TW106120666 A TW 106120666A TW 106120666 A TW106120666 A TW 106120666A TW I668078 B TWI668078 B TW I668078B
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TW
Taiwan
Prior art keywords
chamber
pressure
substrate
profile
computer program
Prior art date
Application number
TW106120666A
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English (en)
Chinese (zh)
Other versions
TW201736043A (zh
Inventor
張煥波
辛格瑞特浩宜
張靜宜
伯翰寧奈森
張清
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201736043A publication Critical patent/TW201736043A/zh
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Publication of TWI668078B publication Critical patent/TWI668078B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW106120666A 2011-04-29 2012-04-24 用於選擇研磨參數以產生移除輪廓的電腦程式產品 TWI668078B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/098,257 US8774958B2 (en) 2011-04-29 2011-04-29 Selection of polishing parameters to generate removal profile
US13/098,257 2011-04-29

Publications (2)

Publication Number Publication Date
TW201736043A TW201736043A (zh) 2017-10-16
TWI668078B true TWI668078B (zh) 2019-08-11

Family

ID=47068573

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106120666A TWI668078B (zh) 2011-04-29 2012-04-24 用於選擇研磨參數以產生移除輪廓的電腦程式產品
TW101114548A TWI637813B (zh) 2011-04-29 2012-04-24 選擇研磨參數以產生移除輪廓

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101114548A TWI637813B (zh) 2011-04-29 2012-04-24 選擇研磨參數以產生移除輪廓

Country Status (5)

Country Link
US (3) US8774958B2 (enExample)
JP (1) JP2014513434A (enExample)
KR (2) KR101831309B1 (enExample)
TW (2) TWI668078B (enExample)
WO (1) WO2012148859A2 (enExample)

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RU2611096C2 (ru) * 2012-07-10 2017-02-21 Статойл Петролеум Ас Расчет параметра анизотропии
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102276869B1 (ko) * 2016-06-30 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 자동화된 레시피 생성
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
TWI794293B (zh) * 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP6983306B2 (ja) * 2018-03-12 2021-12-17 東京エレクトロン株式会社 基板の反り修正方法、コンピュータ記憶媒体及び基板反り修正装置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US12017322B2 (en) 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
US12447578B2 (en) 2018-09-26 2025-10-21 Applied Materials, Inc. Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
WO2021061477A1 (en) * 2019-09-27 2021-04-01 Corning Incorporated Devices, systems, and methods of generating and providing a target topographic map for finishing a photomask blank subject to functional requirements on flatness
US12311494B2 (en) 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
US11931853B2 (en) * 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function
US11969854B2 (en) 2021-03-05 2024-04-30 Applied Materials, Inc. Control of processing parameters during substrate polishing using expected future parameter changes
CN113159121B (zh) * 2021-03-16 2022-07-19 华中科技大学 基于先验知识模型的机器人磨抛去除量预测方法及设备
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
US20250114896A1 (en) * 2023-10-05 2025-04-10 Applied Materials, Inc. Individually rotatable platens and control of carrier head sweep

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US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
CN1554118A (zh) * 2001-06-19 2004-12-08 Ӧ�ò��Ϲ�˾ 提供去除速率曲线处理的化学机械抛光设备的反馈控制
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
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TW200822204A (en) * 2006-09-12 2008-05-16 Ebara Corp Polishing apparatus and polishing method

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Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
US6544103B1 (en) * 2000-11-28 2003-04-08 Speedfam-Ipec Corporation Method to determine optimum geometry of a multizone carrier
CN1554118A (zh) * 2001-06-19 2004-12-08 Ӧ�ò��Ϲ�˾ 提供去除速率曲线处理的化学机械抛光设备的反馈控制
US20070102116A1 (en) * 2001-06-19 2007-05-10 Applied Materials, Inc. Feedback control of chemical mechanical polishing device providing manipulation of removal rate profiles
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
TW200607604A (en) * 2004-06-21 2006-03-01 Ebara Corp Polishing apparatus and polishing method
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
TW200822204A (en) * 2006-09-12 2008-05-16 Ebara Corp Polishing apparatus and polishing method

Also Published As

Publication number Publication date
TW201736043A (zh) 2017-10-16
TWI637813B (zh) 2018-10-11
WO2012148859A3 (en) 2013-03-21
US9213340B2 (en) 2015-12-15
US8774958B2 (en) 2014-07-08
TW201313392A (zh) 2013-04-01
WO2012148859A2 (en) 2012-11-01
KR101831309B1 (ko) 2018-02-22
US20120277897A1 (en) 2012-11-01
JP2014513434A (ja) 2014-05-29
US20160096251A1 (en) 2016-04-07
US10493590B2 (en) 2019-12-03
KR101834711B1 (ko) 2018-03-05
KR20140028045A (ko) 2014-03-07
US20140277670A1 (en) 2014-09-18
KR20170071609A (ko) 2017-06-23

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